US4595822A - Thermal head and producing process thereof - Google Patents

Thermal head and producing process thereof Download PDF

Info

Publication number
US4595822A
US4595822A US06/620,067 US62006784A US4595822A US 4595822 A US4595822 A US 4595822A US 62006784 A US62006784 A US 62006784A US 4595822 A US4595822 A US 4595822A
Authority
US
United States
Prior art keywords
resistive film
thermal head
electrode
substrate
electron beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US06/620,067
Other languages
English (en)
Inventor
Yasuo Nishiguchi
Keijiro Minami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Assigned to KYOCERA CORPORATION 5-22 KITA INOUE-CHO, HIGASHINO, YAMASHINA-KU, KYOTO 607 JAPAN A CORP. OF JAPAN reassignment KYOCERA CORPORATION 5-22 KITA INOUE-CHO, HIGASHINO, YAMASHINA-KU, KYOTO 607 JAPAN A CORP. OF JAPAN ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: MINAMI, KEIJIRO, NISHIGUCHI, YASUO
Application granted granted Critical
Publication of US4595822A publication Critical patent/US4595822A/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/3351—Electrode layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/33515—Heater layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/3355—Structure of thermal heads characterised by materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33555—Structure of thermal heads characterised by type
    • B41J2/3357—Surface type resistors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/3359—Manufacturing processes

Definitions

  • This invention relates to an improvement of thermal head used in thermal recording, and more particularly, to a composition of an electrically energized resistive film.
  • such a thermal head in the prior art for instance as shown in FIG. 1, comprises a substrate 1 made of electrically insulative material such as alumina, a resistive film 2 made of tantalum nitride (Ta 2 N), and an electrode 3 made of gold (Au), aluminum (Al), copper (Cu) or other metal, which are sequentially laminated, wherein a certain voltage is applied to the resistive film 2 through the electrode 3 to generate Joule heat in the film 2 to function as thermal head.
  • a protective film 21 is formed on the electrode 3.
  • the resistive film composed of TiO x (0 ⁇ 2) generates a Joule heat of a desired temperature, and TiOx (0 ⁇ 2) has an intensified affinity for the metal of the electrode such as Au, Al, or Cu.
  • the thermal head comprises a substrate composed of an electrically insulative material, a resistive film comprising TiO x (0 ⁇ 2) and formed on the substrate, and an electrode on the resistive film.
  • the electrode is composed of a metal selected from the group consisting of Au, Al, and Cu.
  • a protective film is formed on the electrode and on the exposed area of the resistive film.
  • the resistive film has a specific electric resistivity within 100 to 850 ⁇ .cm.
  • a process for producing a thermal head comprises the steps of preparing an electrically insulative substrate, forming a resistive film comprising TiO x (0 ⁇ 2) on the electrically insulative substrate, and forming an electrode on the resistive film.
  • the step of forming the resistive film on the electrically insulative substrate is accomplished by an electron beam vapor deposition method.
  • the electron beam vapor deposition method comprises (a) preparing an apparatus comprising a vacuum chamber for containing a cathode, an anode, an evaporation source composed of Ti and a substrate holder having a substrate disposed thereon, (b) irradiating the evaporation source composed of Ti with an electron beam to evaporate Ti in the vacuum chamber, and (c) causing evaporated Ti to be bonded with the oxygen remaining in the vacuum container to thereby deposit TiO x on the substrate.
  • the vacuum chamber has the vacuum degree within 2 ⁇ 10 -5 to 5 ⁇ 10 -6 torr.
  • the electron beam is emitted by applying a voltage of about 20 kV between the cathode and the anode in the vacuum container.
  • the TiO x is deposited on the substrate at the rate of about 20 to 100 ⁇ /min.
  • the step of forming the electrode on the resistive film is accomplished by preparing a metal selected from the group consisting of Au, Al, and Cu as a material of the electrode and utilizing a vapor deposition method and etching process.
  • the resistive film generates a Joule heat of a specified temperature
  • TiO x (where x is smaller than 2.0) has a intensified affinity for the metal of the electrode, the resistive film and the electrode can be thereby joined together firmly. Accordingly, if an external force is applied during operation, the electrode will never be separated from the resistive film, and a defined voltage may be always applied to the resistive film, and Joule heat may be generated to reach a specified temperature, so that a stable printing may be realized for a long period of time.
  • the thermal head of this invention since the resistive film and electrode may be joined together firmly without interposition of adhesive layer, the step of forming adhesive layer is not necessary, and the manufacturing process of thermal head is extremely simple. Hence, the productivity is extremely good, and the manufacturing cost of thermal head may be notably reduced.
  • FIG. 1 is a sectional view showing a thermal head in the prior art
  • FIG. 2 is a sectional view showing another thermal head in the prior art
  • FIG. 3 is a sectional view showing a thermal head according to one of the embodiments of the present invention.
  • FIG. 4 is a structural drawing of an electron beam vapor deposition apparatus for forming a resistive film on the substrate in the thermal head of this invention.
  • FIG. 3 shows one embodiment of the thermal head of this invention, in which numeral 11 indicates substrate made of an electrically insulative material such as alumina. A resistive film 12 is formed on this substrate 11, and an electrode 13 is formed on this resistive film 12, and a protective film 14 is formed on the electrode 13 so as to prevent abrasion due to contact of thermal sensitive paper.
  • the resistive film 12 is made of TiO x , where x is smaller than 2.0, so that the electric resistively may be controlled within 100 to 850 microhm-centimeter. Since the resistive film 12 possesses a specified electric resistivity, Joule heat is generated when a specified voltage is applied, thereby causing the resistive film 12 to reach a temperature necessary for printing, such as somewhere between 100° and 150° C.
  • the electric resistivity of this resistive film 12 may be freely adjusted by varying the value of x in TiO x , so that the temperature of the resistive film 12 may be adjusted to be raised to a desired temperature, thereby allowing enlargement of the application range of the thermal head.
  • the electrode 13 on this resistive film 12 is composed of at least one of Au, Al and Cu, and is responsible for applying a voltage for creating Joule heat in the resistive film 12.
  • the resistive film 12 is formed on the substrate 11 by an electron beam vapor deposition method which is described later, and the electrode 13 is formed on the resistive film 12 by employing a conventionally known deposition method and etching process.
  • TiO x the material of the resistive film 12
  • the resistive film 12 in this thermal head is formed by electron beam vapor deposition method, more practically, by use of an electron beam vapor deposition apparatus as shown in FIG. 4.
  • This electron beam vapor deposition apparatus comprises a cathode 16, an anode 17, a substrate holder 18 and a evaporation source 19, which are all contained in a vacuum chamber 15.
  • a substrate 11 is placed on a substrate holder 18, and titanium (Ti) is disposed on the evaporation source 19.
  • a high voltage about 20 kV
  • the evaporation source (Ti) is irradiated with this electron beam 20 to heat and melt the source (Ti) in order to cause it to evaporate at a uniform density within the chamber 15.
  • the evaporated Ti is bonded with the oxygen remaining in the chamber 15 so that TiO x is deposited on the substrate 11.
  • the resistive film 12 is formed on the substrate 11.
  • the value of x of TiO x to compose the resistive film 12 is controlled by the concentration of residual oxygen in the electron beam vapor deposition apparatus, temperature, and rate of vapor deposition. Meanwhile, the rate of vapor deposition of resistive film 12 is about 20 to 100 ⁇ /min.
  • the resistive film may be formed on the entire surface of the substrate at a uniform density. Therefore, when operated as thermal head, the heat generation of the resistive film is uniform over the entire surface, so that an extremely favorable printing may be realized.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electronic Switches (AREA)
US06/620,067 1983-06-14 1984-06-13 Thermal head and producing process thereof Expired - Fee Related US4595822A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP58106918A JPS59230773A (ja) 1983-06-14 1983-06-14 サ−マルヘツド
JP58-106918 1983-06-14

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US06/787,726 Division US4617088A (en) 1983-06-14 1985-10-15 Thermal head producing process

Publications (1)

Publication Number Publication Date
US4595822A true US4595822A (en) 1986-06-17

Family

ID=14445801

Family Applications (2)

Application Number Title Priority Date Filing Date
US06/620,067 Expired - Fee Related US4595822A (en) 1983-06-14 1984-06-13 Thermal head and producing process thereof
US06/787,726 Expired - Fee Related US4617088A (en) 1983-06-14 1985-10-15 Thermal head producing process

Family Applications After (1)

Application Number Title Priority Date Filing Date
US06/787,726 Expired - Fee Related US4617088A (en) 1983-06-14 1985-10-15 Thermal head producing process

Country Status (2)

Country Link
US (2) US4595822A (enExample)
JP (1) JPS59230773A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4804974A (en) * 1985-03-23 1989-02-14 Canon Kabushiki Kaisha Thermal recording head
US4845339A (en) * 1985-12-25 1989-07-04 Alps Electric Co., Ltd. Thermal head containing an insulating, heat conductive layer
EP0438839A1 (en) * 1988-08-16 1991-07-31 Atraverda Limited Electrical conductors formed of sub-oxides of titanium
GB2309230A (en) * 1996-01-22 1997-07-23 Atraverda Ltd Conductive coating of titanium suboxide

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6260662A (ja) * 1985-09-11 1987-03-17 Alps Electric Co Ltd サ−マルヘツドの製造方法
US4832677A (en) * 1986-02-14 1989-05-23 Ami, Inc. Method and apparatus for producing draw tape bags
JP2594646B2 (ja) * 1989-08-17 1997-03-26 シャープ株式会社 サーマルヘッドの製造方法
US5290358A (en) * 1992-09-30 1994-03-01 International Business Machines Corporation Apparatus for directional low pressure chemical vapor deposition (DLPCVD)
CN109348550B (zh) * 2018-10-31 2021-08-13 宁波石墨烯创新中心有限公司 一种电热膜、其制备方法及电热产品

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US30313A (en) * 1860-10-09 Improvement in cotton-seed planters
US2683673A (en) * 1952-03-10 1954-07-13 Electrofilm Corp Film-type heating element
US2920005A (en) * 1955-12-09 1960-01-05 Welwyn Electrical Lab Ltd Electrical resistors
US2961352A (en) * 1957-01-02 1960-11-22 Gen Electric Resistance films and method of making
US3112222A (en) * 1960-09-12 1963-11-26 Acton Lab Inc Precision electrical resistors
US3218194A (en) * 1962-04-19 1965-11-16 Gold loaded tantalum film
US3301707A (en) * 1962-12-27 1967-01-31 Union Carbide Corp Thin film resistors and methods of making thereof
US3973106A (en) * 1974-11-15 1976-08-03 Hewlett-Packard Company Thin film thermal print head
US4136274A (en) * 1976-04-05 1979-01-23 Oki Electric Industry Co., Ltd. Thermal head for a printer
US4209764A (en) * 1978-11-20 1980-06-24 Trw, Inc. Resistor material, resistor made therefrom and method of making the same
USRE30313E (en) 1974-03-27 1980-06-24 E. I. Du Pont De Nemours And Company Resistors and compositions therefor
US4232213A (en) * 1979-01-15 1980-11-04 Matsushita Electric Industrial Co., Ltd. Thermal head
US4296309A (en) * 1977-05-19 1981-10-20 Canon Kabushiki Kaisha Thermal head

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5433737A (en) * 1977-08-19 1979-03-12 Hitachi Ltd Thermal head for thermal printer of thick type
US4206541A (en) * 1978-06-26 1980-06-10 Extel Corporation Method of manufacturing thin film thermal print heads
FI62448C (fi) * 1981-04-22 1982-12-10 Lohja Ab Oy Elektroluminensstruktur
JPS57208105A (en) * 1981-06-17 1982-12-21 Hitachi Ltd Thick film temperature sensitive composition

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US30313A (en) * 1860-10-09 Improvement in cotton-seed planters
US2683673A (en) * 1952-03-10 1954-07-13 Electrofilm Corp Film-type heating element
US2920005A (en) * 1955-12-09 1960-01-05 Welwyn Electrical Lab Ltd Electrical resistors
US2961352A (en) * 1957-01-02 1960-11-22 Gen Electric Resistance films and method of making
US3112222A (en) * 1960-09-12 1963-11-26 Acton Lab Inc Precision electrical resistors
US3218194A (en) * 1962-04-19 1965-11-16 Gold loaded tantalum film
US3301707A (en) * 1962-12-27 1967-01-31 Union Carbide Corp Thin film resistors and methods of making thereof
USRE30313E (en) 1974-03-27 1980-06-24 E. I. Du Pont De Nemours And Company Resistors and compositions therefor
US3973106A (en) * 1974-11-15 1976-08-03 Hewlett-Packard Company Thin film thermal print head
US4136274A (en) * 1976-04-05 1979-01-23 Oki Electric Industry Co., Ltd. Thermal head for a printer
US4296309A (en) * 1977-05-19 1981-10-20 Canon Kabushiki Kaisha Thermal head
US4209764A (en) * 1978-11-20 1980-06-24 Trw, Inc. Resistor material, resistor made therefrom and method of making the same
US4232213A (en) * 1979-01-15 1980-11-04 Matsushita Electric Industrial Co., Ltd. Thermal head

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4804974A (en) * 1985-03-23 1989-02-14 Canon Kabushiki Kaisha Thermal recording head
US4845339A (en) * 1985-12-25 1989-07-04 Alps Electric Co., Ltd. Thermal head containing an insulating, heat conductive layer
EP0438839A1 (en) * 1988-08-16 1991-07-31 Atraverda Limited Electrical conductors formed of sub-oxides of titanium
GB2309230A (en) * 1996-01-22 1997-07-23 Atraverda Ltd Conductive coating of titanium suboxide

Also Published As

Publication number Publication date
JPS59230773A (ja) 1984-12-25
JPH0579507B2 (enExample) 1993-11-02
US4617088A (en) 1986-10-14

Similar Documents

Publication Publication Date Title
US4595822A (en) Thermal head and producing process thereof
US4705697A (en) Electron beam formation of a thermal head using titanium silicide
JPS6220653B2 (enExample)
JPS6135401A (ja) 反射鏡
JPH0719530B2 (ja) 陰極線管
US4708915A (en) Thermal head for thermal recording
US4537794A (en) Method of coating ceramics
JPH0712689B2 (ja) サ−マルヘツド
JPS6038006B2 (ja) サ−マルヘツド
JP3176096B2 (ja) セラミック表面への金属膜形成方法
JP2713290B2 (ja) 受像管
JP2790654B2 (ja) プラスチックレンズ基板への二酸化チタン膜の形成方法
JP2650638B2 (ja) 陰極線管
JPS6364236A (ja) 含浸形陰極の製造方法
JPS6016084B2 (ja) サーマルヘツド
JPS62255137A (ja) フイルムキヤリヤ形基板とその製造方法
JPH0770371B2 (ja) サ−マルヘツド
JPH02234402A (ja) 抵抗体の製造方法
JP2530694B2 (ja) 光学記録ディスク用反射膜の製造方法
JPH05279870A (ja) メタライジングフィルム及びメタライジングフィルムの製造方法
JPH0640525B2 (ja) サ−マルヘツド
JPH0193023A (ja) 含浸形カソード
JP2000133448A (ja) 有機電気発光素子の製造方法
CN85104881B (zh) 浸渍阴极
JPS6046029B2 (ja) サ−マルヘツド

Legal Events

Date Code Title Description
AS Assignment

Owner name: KYOCERA CORPORATION 5-22 KITA INOUE-CHO, HIGASHINO

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:NISHIGUCHI, YASUO;MINAMI, KEIJIRO;REEL/FRAME:004273/0565

Effective date: 19840531

FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

FPAY Fee payment

Year of fee payment: 4

FPAY Fee payment

Year of fee payment: 8

REMI Maintenance fee reminder mailed
LAPS Lapse for failure to pay maintenance fees
FP Lapsed due to failure to pay maintenance fee

Effective date: 19980617

STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362