US4312023A - Ceramic power capacitor - Google Patents

Ceramic power capacitor Download PDF

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Publication number
US4312023A
US4312023A US06/133,269 US13326980A US4312023A US 4312023 A US4312023 A US 4312023A US 13326980 A US13326980 A US 13326980A US 4312023 A US4312023 A US 4312023A
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United States
Prior art keywords
capacitor
foils
dielectric
power capacitor
connections
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Expired - Lifetime
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US06/133,269
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English (en)
Inventor
Pierre Frappart
Serge Guichard
Roland Saint Marcoux
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CC-CICE EUROPEENNE DE COMPOSANTS ELECTRONIQUES Cie
Compagnie Europeenne de Composants Electroniques LCC CICE
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Compagnie Europeenne de Composants Electroniques LCC CICE
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Assigned to C.C.-C.I.C.E. COMPAGNIE EUROPEENNE DE COMPOSANTS ELECTRONIQUES reassignment C.C.-C.I.C.E. COMPAGNIE EUROPEENNE DE COMPOSANTS ELECTRONIQUES ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: FRAPPART PIERRE, GUICHARD SERGE, SAINT MARCOUX ROLAND
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Definitions

  • the present invention relates to power capacitors, more particularly to those operating at voltages of several thousand volts supplying an intensity which can reach several dozen amperes, such as those used in high frequency professional equipment.
  • the ceramic dielectric capacitors presently used for high energy levels all have a common characteristic, namely that of having for each element only two electrodes, which, depending on the particular model, are either planar when the capacitors are shaped like discs or plates, or cylindrical which gives tubular capacitors. In its definitive form the dielectric is obtained by compressing and then baking or firing a powder. Therefore it is monolithic.
  • the invention is therefore directed at optimising a ceramic dielectric power capacitor in which the armatures or foils, the dielectric and the connections have been designed in order to obtain characteristics making it possible to increase the voltages and intensities per unit of volume and consequently reduce the total volume of the capacitor, the heat exchanges being facilitated by a large number of means which will be described hereinafter.
  • the present invention relates to a ceramic power capacitor wherein it comprises a multilayer body constituted by a stack of very thin ceramic dielectric films separating thick metal foils arranged in two alternating series, the dielectric films having larger dimensions than the foil forming on two opposite faces of the capacitor body, a protective volume in which a rounded groove is formed giving an anti-corona effect, as well as two external electrical connections, each connected to a series of foils by means of a metal coating made in the protective groove.
  • FIG. 1 the operating characteristic curves of power capacitors.
  • FIG. 2 a prior art power capacitor of the monolithic "disc” type
  • FIG. 3 another prior art power capacitor of the monolithic "plate” type
  • FIG. 4 a third prior art power capacitor of the monolithic tubular types
  • FIG. 5 a sectional view of a multilayer capacitor according to the invention
  • FIG. 6 a plan view of the capacitor according to the invention.
  • the operating frequency is plotted on the abscissa, three curves being superimposed on the same graph, curve 1 corresponding to the voltage, curve 2 to the intensity, and curve 3 to the reactive power, whilst the units of voltage U, intensity I and reactive power P r are plotted on the ordinate in a linear scale.
  • the d.c. voltage, plus the superimposed high frequency peak voltage which can be withstood by a capacitor must be below the nominal voltage U n .
  • the dielectric strength of a capacitor i.e. its capacity to withstand puncturing under voltage is linked with the nature of the dielectric but also with the nature of its profile. In the present case the dielectric can be considered as a constant, because the invention relates to ceramic dielectric capacitors. However, the profile of the dielectric and the production process for the ceramic influence the voltage behaviour.
  • the nominal voltage U n can reach 22 kV peak in presently used ceramic capacitors.
  • the operating voltage of a capacitor decreases as from a certain threshold, when the frequency increases (curve 1 of FIG. 1).
  • the intensity of the current passing through the capacitor must be below the maximum effective intensity eye fixed by the designer as a function of several parameters, such as the thickness of the foils or the diameter of the connections.
  • the effective intensity increases up to the limit threshold, when the frequency increases (curve 2).
  • the reactive power of a capacitor is expressed by the formula
  • tg ⁇ is the loss angle in the dielectric is integrally transformed into heat in the dielectric and is removed by the foils and connections to the surface of the dielectric.
  • FIG. 2 shows a "disc” capacitor formed by two metal foils 4,5 separated by one another by a monolithic dielectric 6.
  • the electrical connection 7 on the two foils are generally provided by nuts, which are in themselves fixed to fixing clips in such a way that to distribute and disperse the high current density.
  • Such disc capacitors are limited as regards voltage and therefore power by their very simple design, but more particularly by the poor heat exchanges to the outside, due to the relatively thick plastic protection 8. Heat is only substantially removed by the connections.
  • FIG. 3 shows another prior art power capacitor of the "plate” type.
  • the same reference numerals designate the same components as in FIG. 2 and this type of capacitor has two foils 4 and 5 deposited on a monolithic dielectric 6, the connections at 7 generally being provided by nuts. However, on each foil the plate-type capacitor have a groove 9 whose only function is to curve back the electric stray field. Dielectric 6 is adapted to the shape of the electrodes and externally covers the groove 9. A plastic protection 8 covers the entire capacitor, with the exception of the connection which are welded.
  • This type of capacitor is often adopted for more powerful models than those of the disc type, because it offers guarantees of completely satisfactory operation at high voltages, but still has the same disadvantages of a power limited by an inadequate removal of heat.
  • FIG. 4 shows a prior art tubular capacitor consists of giving the power capacitor a shape such that it becomes possible to circulate a cooling fluid in a sealed enclosure which is the actual capacitor.
  • This type of capacitor has two foils 4 and 5 deposited on the inner and outer surfaces of a dielectric 6 which is frequently cylindrical. Two flanges form the ends of the tube permitting the internal circulation of a cooling fluid which enters via a pipe 10 and is discharged via another pipe 11.
  • Tubular capacitors are used for higher power levels than the models described hereinbefore.
  • they have a number of disadvantages and the most serious of these are very large overall dimensions, delicate problems linked with the fact that the cooling fluid and its entire associated system is at the potential of the inner foil, so that it must be kept at 0 potential, liquid leaks are always possible and at high voltages these can have serious consequences on the surrounding equipment and the monolithic ceramic block can be cracked due to thermal shocks.
  • the solution used for the capacitor according to the present invention aims at increasing the stored power per unit of volume by making it independent of an internal cooling system.
  • the invention relates to a power capacitor having an excellent reactive power/volume ratio obtained by the alternate stacking of very thin dielectric layers and thick foils, the thin film dielectric having a dielectric strength higher than that of the same dielectric in a thicker form in monolithic blocks, which contributes to reducing the dimensions of the capacitor and thus aids the removal of the heat produced.
  • the active energy produced within the capacitor is removed by thermal conduction by means of metal strips serving as foils or armatures whereby the large number of said strips and the thickness given to them aid the thermal conduction and render uniform the temperature within the dielectric.
  • a better shape of the dielectric and the armatures make it possible to reach very high voltages and consequently to obtain higher powers.
  • a capacitor according to the invention corresponds to a miniaturization of the order of 5 to 10 compared with "plate" capacitor of the same capacitance or, for the same volume corresponds to an increase in the reactive power of an order of magnetude of 5 to 10.
  • FIG. 5 shows in sectional form in a plane perpendicular to that of the armatures a multilayer power capacitor according to the invention.
  • the capacitor according to the invention has two series of armatures 12 and 13, stacked to form a multilayer device.
  • the stack alternately contains an armature of series 12 and then an armature of series 13, separated by a very thin ceramic dielectric film.
  • the two series of armatures which have the same shape and surface area are slightly staggered with respect to one another in one direction to permit electrical contacting at the exposed end of the armatures.
  • the series of armatures 12 is joined by a metal coating 14 in accordance with which armatures 12 are mounted in parallel.
  • the series of armatures 13 is joined by a metal coating 15.
  • the stack is completed at both ends by two floating armatures 16,17, i.e. two armatures which are not connected to an electrical connection, their function being to close again the external stray field and thus minimise leaks by a better distribution of the potential gradient.
  • the ceramic dielectric 18 separates the armatures or foils in the stack. However, in addition, its external dimensions on the faces of the capacitors carrying the metal coatings 14 and 15 are such that the dielectric envelops the metal coatings and part of the electrical connections 19, 20 forming two grooves 21, 22, whose function will be described hereinafter.
  • the electrical connections 19, 20 are in the form of a silver strip, whose very good electrical and thermal conductivity is well known. These connections are joined to the metal coatings 14, 15 either by a tin-lead-based brazed joint which melts at approximately 300° C., or by a silver alloy-based brazed joint or by fritting.
  • the later process is new in this application to capacitor connections and consists of fritting the connecting strip to the metal coating by means of an enamel formed from glass powder and silver powder. The glass particles aid the engagement of the surfaces and the silver particles reduce the resistance of the contact and limit heating. The operating temperature of a thus fritted connection reaches 700° C.
  • FIG. 6 shows the same capacitor according to the invention in a plan view displaced by 90° with respect to the section of FIG. 5.
  • FIG. 6 shows a foil 13, in the plane of the drawing staggered with respect to a foil 12, from which it is separated from a dielectric layer.
  • the other parts of the capacitor, except for the connection strips 19 and 20, are identical to those of FIG. 5, because grooves 21 and 22 are symmetrical and oblong.
  • the intrinsic dielectric strength of ceramic dielectrics reaches 250 to 200 kV/mm.
  • the practical values in prior art capacitors, such as the "disc" models having a monolithic dielectric block do not exceed 2 to 4 kV/mm, i.e. approximately 1/100th of the theoretical value.
  • multilayer power capacitors consists of making very thin ceramic films with a thickness between 20 and 200 microns, but more commonly between 40 and 100 microns, whose true dielectric strength is approximately 20 kV/mm, i.e. five times higher than that of monolithic blocks.
  • the shape of the foils is modified to prevent the point effect.
  • There general shape is rectangular with pronounced rounding of angles which contributes to reducing the losses by point effect and permits a higher voltage without causing the puncturing of the dielectric layers.
  • Floating armatures 16, 17 have a shielding action and also make the stray field more uniform due to a better distribution of the potential gradient. They cooperate with metallized grooves 21, 22 enclosing the stray field on itself.
  • the dielectric projects over the faces of the capacitor carrying the connections and forms two grooves 21, 22.
  • the foils are suffiently retracted with respect to outer edges of the capacitor to ensure a good insulator relative to earth, the retraction being 1 mm/5 KV i.e. in practice a groove of depth 2 to 3 mm.
  • the grooves 21, 22 are peripherally rounded, so that the contacting metal coating 14, 15 are themselves rounded which has the effect of curving the stray field back on itself by lengthening the leakage paths and preventing point effects.
  • the metal coatings 14, 15 stop in a retracted position from the inner angle of the outlet groove.
  • grooves 21, 22 are filled with an electrically insulating solid polymer, which cooperates in insulating the metal coating relative to earth and considerably improve the resistance to tearing away of connections 19 and 20.
  • the construction of the capacity according to the invention takes account of the intensity which must pass through it.
  • the thickness of the foils is between 2 and 10 microns, as compared with 1 or 2 microns in the case of the prior art capacitors.
  • the foils are made from alloys such as Ag/Pt, Ag/Pd, Au/Pt/Pd or purer metals such as Pt, Pd etc.
  • a capacitor according to the invention replaces a plate-type capacitor in a volume 5 to 10 times smaller and for an identical function.
  • the parallelepipedic shape of the capacitor according to the invention facilitates its stacking for installation in series or in parallel.
  • the operating temperature can reach 700° C. without damaging the capacitor, due to the silver fritting of the connection to the foil.
  • the capacitor according to the invention is also automatically protected as a function of its geometry according to which the foils are located within a ceramic block and the outer connections are connected to metal coatings arranged within the grooves. There is no need for an external protective covering a coating of identification paint or enamel being sufficient.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
US06/133,269 1979-03-23 1980-03-24 Ceramic power capacitor Expired - Lifetime US4312023A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR7907388 1979-03-23
FR7907388A FR2452169A1 (fr) 1979-03-23 1979-03-23 Condensateur ceramique de puissance

Publications (1)

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US4312023A true US4312023A (en) 1982-01-19

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US06/133,269 Expired - Lifetime US4312023A (en) 1979-03-23 1980-03-24 Ceramic power capacitor

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US (1) US4312023A (de)
EP (1) EP0017529B1 (de)
JP (1) JPS55128815A (de)
DE (1) DE3064727D1 (de)
FR (1) FR2452169A1 (de)
PL (1) PL222924A1 (de)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4447853A (en) * 1982-08-25 1984-05-08 Mitsubishi Mining & Cement Company, Ltd. Ceramic capacitor
US6081415A (en) * 1998-10-28 2000-06-27 Agilent Technologies, Inc. Apparatus for a crater-style capacitor for high-voltage
US20050071970A1 (en) * 2003-10-02 2005-04-07 Wei-Hou Chang Manufacturing method for electrodes that inhibit corona effect on ceramic capacitor
US20070195484A1 (en) * 2006-02-22 2007-08-23 Vishay Vitramon Inc. High voltage capacitors
US20100220426A1 (en) * 2007-11-22 2010-09-02 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component
US20130250473A1 (en) * 2012-03-26 2013-09-26 Kemet Electronics Corporation Asymmetric High Voltage Capacitor
US8547677B2 (en) 2005-03-01 2013-10-01 X2Y Attenuators, Llc Method for making internally overlapped conditioners
CN103383894A (zh) * 2012-05-03 2013-11-06 三星电机株式会社 多层陶瓷电子元件及其制造方法
US8587915B2 (en) 1997-04-08 2013-11-19 X2Y Attenuators, Llc Arrangement for energy conditioning
US20140092526A1 (en) * 2011-06-02 2014-04-03 Murata Manufacturing Co.,Ltd. Dielectric ceramic and single-plate capacitor
US9036319B2 (en) 1997-04-08 2015-05-19 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US20150200162A1 (en) * 2014-01-10 2015-07-16 Fairchild Semiconductor Corporation Isolation between semiconductor components
US9478519B2 (en) 2013-04-18 2016-10-25 Fairchild Semiconductor Corporation Package including a semiconductor die and a capacitive component
US10032561B2 (en) 2015-06-11 2018-07-24 Electronic Concepts Inc. Thermal control for capacitor
US10930604B2 (en) 2018-03-29 2021-02-23 Semiconductor Components Industries, Llc Ultra-thin multichip power devices

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2536901A1 (fr) * 1982-11-26 1984-06-01 Europ Composants Electron Condensateur multi-couches de puissance
FR2583213A1 (fr) * 1985-06-06 1986-12-12 Europ Composants Electron Condensateur a fort courant
US4931899A (en) * 1989-01-17 1990-06-05 Sierra Aerospace Technology, Inc. Ceramic cased capacitor

Citations (7)

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Publication number Priority date Publication date Assignee Title
US1391672A (en) * 1918-08-01 1921-09-27 Dubilier William Electrical condenser
US2315199A (en) * 1938-02-12 1943-03-30 Gonningen Hermann Condenser device
US3256471A (en) * 1963-10-11 1966-06-14 Quality Components Inc Ceramic capacitor
US3260907A (en) * 1962-06-19 1966-07-12 Vitramon Inc Electrical unit and terminal lead connection therefor
US3437736A (en) * 1967-09-01 1969-04-08 Corning Glass Works Terminal assembly for encapsulated electrical devices
US3452257A (en) * 1968-03-28 1969-06-24 Vitramon Inc Electrical capacitor
US3496434A (en) * 1968-11-22 1970-02-17 Sprague Electric Co High voltage ceramic capacitor

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3784887A (en) * 1973-04-26 1974-01-08 Du Pont Process for making capacitors and capacitors made thereby
FR2363876A1 (fr) * 1976-08-31 1978-03-31 Ceraver Condensateur ceramique de puissance pour courants a haute frequence

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1391672A (en) * 1918-08-01 1921-09-27 Dubilier William Electrical condenser
US2315199A (en) * 1938-02-12 1943-03-30 Gonningen Hermann Condenser device
US3260907A (en) * 1962-06-19 1966-07-12 Vitramon Inc Electrical unit and terminal lead connection therefor
US3256471A (en) * 1963-10-11 1966-06-14 Quality Components Inc Ceramic capacitor
US3437736A (en) * 1967-09-01 1969-04-08 Corning Glass Works Terminal assembly for encapsulated electrical devices
US3452257A (en) * 1968-03-28 1969-06-24 Vitramon Inc Electrical capacitor
US3496434A (en) * 1968-11-22 1970-02-17 Sprague Electric Co High voltage ceramic capacitor

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4447853A (en) * 1982-08-25 1984-05-08 Mitsubishi Mining & Cement Company, Ltd. Ceramic capacitor
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US9019679B2 (en) 1997-04-08 2015-04-28 X2Y Attenuators, Llc Arrangement for energy conditioning
US8587915B2 (en) 1997-04-08 2013-11-19 X2Y Attenuators, Llc Arrangement for energy conditioning
US9036319B2 (en) 1997-04-08 2015-05-19 X2Y Attenuators, Llc Arrangement for energy conditioning
US9373592B2 (en) 1997-04-08 2016-06-21 X2Y Attenuators, Llc Arrangement for energy conditioning
US6081415A (en) * 1998-10-28 2000-06-27 Agilent Technologies, Inc. Apparatus for a crater-style capacitor for high-voltage
US6546607B1 (en) * 1998-10-28 2003-04-15 Agilent Technologies, Inc. Method of manufacturing a crater-style capacitor for high-voltage radio-frequency applications
US20050071970A1 (en) * 2003-10-02 2005-04-07 Wei-Hou Chang Manufacturing method for electrodes that inhibit corona effect on ceramic capacitor
US9001486B2 (en) 2005-03-01 2015-04-07 X2Y Attenuators, Llc Internally overlapped conditioners
US8547677B2 (en) 2005-03-01 2013-10-01 X2Y Attenuators, Llc Method for making internally overlapped conditioners
US20070195484A1 (en) * 2006-02-22 2007-08-23 Vishay Vitramon Inc. High voltage capacitors
CN101523528B (zh) * 2006-02-22 2011-12-07 维莎斯普拉格公司 多层陶瓷电容器和制造多层陶瓷电容器的方法
US7336475B2 (en) * 2006-02-22 2008-02-26 Vishay Vitramon, Inc. High voltage capacitors
US7859821B2 (en) * 2007-11-22 2010-12-28 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component
US20100220426A1 (en) * 2007-11-22 2010-09-02 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component
US20140092526A1 (en) * 2011-06-02 2014-04-03 Murata Manufacturing Co.,Ltd. Dielectric ceramic and single-plate capacitor
US9001494B2 (en) * 2011-06-02 2015-04-07 Murata Manufacturing Co., Ltd. Dielectric ceramic and single-plate capacitor
US20130250473A1 (en) * 2012-03-26 2013-09-26 Kemet Electronics Corporation Asymmetric High Voltage Capacitor
US9087648B2 (en) * 2012-03-26 2015-07-21 Kemet Electronics Corporation Asymmetric high voltage capacitor
US20130294010A1 (en) * 2012-05-03 2013-11-07 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic electronic component and method of manufacturing the same
CN103383894A (zh) * 2012-05-03 2013-11-06 三星电机株式会社 多层陶瓷电子元件及其制造方法
US9478519B2 (en) 2013-04-18 2016-10-25 Fairchild Semiconductor Corporation Package including a semiconductor die and a capacitive component
US20150200162A1 (en) * 2014-01-10 2015-07-16 Fairchild Semiconductor Corporation Isolation between semiconductor components
CN105047634A (zh) * 2014-01-10 2015-11-11 飞兆半导体公司 半导体部件之间的隔离
US9735112B2 (en) * 2014-01-10 2017-08-15 Fairchild Semiconductor Corporation Isolation between semiconductor components
US10446498B2 (en) 2014-01-10 2019-10-15 Fairchild Semiconductor Corporation Isolation between semiconductor components
US10032561B2 (en) 2015-06-11 2018-07-24 Electronic Concepts Inc. Thermal control for capacitor
US10930604B2 (en) 2018-03-29 2021-02-23 Semiconductor Components Industries, Llc Ultra-thin multichip power devices
US11721654B2 (en) 2018-03-29 2023-08-08 Semiconductor Components Industries, Llc Ultra-thin multichip power devices

Also Published As

Publication number Publication date
FR2452169A1 (fr) 1980-10-17
FR2452169B1 (de) 1981-10-02
EP0017529B1 (de) 1983-09-07
EP0017529A1 (de) 1980-10-15
JPS55128815A (en) 1980-10-06
DE3064727D1 (en) 1983-10-13
PL222924A1 (de) 1981-01-30

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