US4152616A - Piezoelectric crystal mounting - Google Patents

Piezoelectric crystal mounting Download PDF

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Publication number
US4152616A
US4152616A US05/595,373 US59537375A US4152616A US 4152616 A US4152616 A US 4152616A US 59537375 A US59537375 A US 59537375A US 4152616 A US4152616 A US 4152616A
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US
United States
Prior art keywords
base
crystal
lead wires
holes
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US05/595,373
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English (en)
Inventor
Willie P. Ozbirn
Jack A. English
James N. Hufford
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CTS Corp
Original Assignee
CTS Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CTS Corp filed Critical CTS Corp
Priority to US05/595,373 priority Critical patent/US4152616A/en
Priority to CA256,063A priority patent/CA1069610A/en
Priority to DE2631074A priority patent/DE2631074C3/de
Priority to CH896976A priority patent/CH607335A5/xx
Priority to BR7604556A priority patent/BR7604556A/pt
Priority to FR7621456A priority patent/FR2318506A1/fr
Priority to IT68752/76A priority patent/IT1064937B/it
Priority to JP51083922A priority patent/JPS5211889A/ja
Priority to GB29308/76A priority patent/GB1506830A/en
Application granted granted Critical
Publication of US4152616A publication Critical patent/US4152616A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings

Definitions

  • This invention relates generally to piezoelectric devices and, more particularly, to a piezoelectric crystal assembly commonly used in electronic circuits.
  • a piezoelectric crystal assembly in which a pair of lead wires are attached orthogonally to nodal points on one surface of a crystal of x-y cut, the lead wires extend through and are soldered to a pair of thin tubular and parallel disposed fittings in a base, a cover is attached to the base to enclose the crystal, and the portion of the lead wires intermediate the tubular fittings and the crystal are proportioned in length and diameter to return to the crystal a maximum percentage of the vibrational energy imparted to the lead wires by the crystal, so that the energy of the crystal is not dissipated by the mounting thereof. It would, therefore, be preferable to improve upon the device shown in the aforementioned patent by reducing the required length of lead wire between the crystal and the base and achieving a smaller size package or assembly.
  • the metal does not flow up the tubulations to the desired point of securement of the lead wires at one-quarter wave length.
  • Securing the lead wires other than at the desired point equal to one-quarter wave length permits vibrational energy imparted to the lead wires from the crystal to be partially dissipated instead of returned to the crystal; therefore, more energy is required to drive the crystal. It would, therefore, be preferable to control more precisely and effectively, the free vibrational length of the lead wire between the crystal and the point of securement to the base.
  • an object of the present invention is to provide an improved crystal package.
  • Another object of the present invention is to reduce the size of the crystal package to allow its use in small electronic watches.
  • a further object of the present invention is to provide an improved crystal package wherein the effective length of the lead wires supporting the crystal is more precisely controlled.
  • Still another object of the present invention is to provide an improved crystal package by minimizing the transmission of vibrational energy from the crystal to the supporting structure.
  • Yet another object of the present invention is to provide an improved crystal package having lead wires connected to a crystal and secured to the base distal of the crystal.
  • Still another object of the present invention is to provide a crystal package employing a ceramic base having spaced electrically isolated conical holes receiving the lead wires connected to the crystal.
  • a piezoelectric crystal assembly comprising a piezoelectric crystal having a pair of electrodes secured to the crystal.
  • a pair of lead wires are fastened to respective ones of the electrodes.
  • a base of dielectrical material has an inner surface in spaced relationship to the lower surface of the crystal.
  • the base is also provided with a pair of conical holes extending through the base in spaced electrically isolated relationship to each other and orthogonal to the inner surface of the base with the larger diameter end of each hole opening into the inner surface of the base and receiving the lead wires.
  • the lead wires are attached to the base and hermetically sealed therewith distal from the crystal thereby allowing the lead wires to freely vibrate inside the conically shaped holes as well as between the inner surface of the base and the lower surface of the crystal.
  • a cover assembled over the crystal engages the base and cooperates with the base enclosing the crystal. The cover extends orthogonally beyond the distal or outer surface of the base and cooperates therewith to provide an encapsulating well.
  • the encapsulating well is filled with a sealing material, e.g., epoxy, and provides a hermetic seal between the base and the cover and also further hermetically seals the openings between the lead wires and the conical holes.
  • FIG. 1 is an isometric view of the crystal assembly of the present invention
  • FIG. 2 is an enlarged longitudinal cross-sectional view of the crystal assembly taken substantially along section line II--II of FIG. 1;
  • FIG. 3 is a cross-sectional view taken substantially as shown along line III--III of FIG. 2, assuming FIG. 2 is shown in full;
  • FIG. 4 is an exploded plan view of the crystal assembly as shown in FIG. 1;
  • FIG. 5 is a bottom plan view of the crystal shown in FIG. 2 showing by phantom lines, the oscillation of the crystal about the nodal points thereof.
  • a piezoelectric crystal assembly generally indicated at 10, includes an elongated bar-shaped quartz crystal 12 of x-y cut having an upper surface 14, a lower surface 16 parallel to the upper surface 14, a pair of wrap-around electrodes 18a, 18b encompassing respective ones of a pair of nodal points 20a, 20b (FIG. 5) on the lower surface 16.
  • the crystal assembly 10 also includes a pair of lead wires 22a, 22b having straight portions 24a, 24b.
  • the upper ends 26a, 26b of the lead wires are solder attached respectively to the nodal points 20a, 20b orthogonally to the lower surface 16 so that the straight portions 24a, 24b are disposed in parallel relationship to each other.
  • the crystal assembly 10 also includes an elongated and substantially bar-shaped base 28 having a planar inner surface 30, a planar outer surface 32 in spaced parallel relationship to the planar inner surface 30, a pair of long side surfaces 34a, 34b interconnecting the inner and outer surfaces 30, 32 and orthogonally disposed thereto and a pair of short side surfaces 36a, 36b disposed substantially orthogonally to the long side surfaces 34a, 34b.
  • the base is also provided with a pair of conical holes 38a, 38b disposed orthogonally to the inner surface 30 with the larger ends 40a, 40b of the holes opening into the inner surface 30.
  • Metallized surface portions or pads 42a, 42b on the outer surface 32 encompass the openings of the holes 38a, 38b.
  • the piezoelectric crystal assembly 10 as shown in FIGS. 2-4, further includes an enclosing cover 44 having a substantially elongated and planar cover portion 46, a pair of long wall portions 48a, 48b, a pair of short wall portions 50a, 50b, a pair of base locating stops 52a, 52b on the long wall portions 48a, 48b, and a pair of base locating stops 54a, 54b on the short wall portions 50a, 50b.
  • the wrap-around electrodes 18a, 18b are metallized to portions of the crystal 12, the ends 26a, 26b of the lead wires 22a, 22b are secured with metal deposits, e.g., solder fillets 56a, 56b, to the electrodes 18a, 18b at the nodal points 20a, 20b, and the lead wires 22a, 22b are inserted through the conical holes 38a, 38b in the base 28.
  • the lower surface 16 of the crystal 12 is positioned in spaced parallel relationship to the inner surface 30 of the base 28 and the lead wires are connected at a point equal to one-quarter wave length to the metallized portions 42a, 42b of the base 28 by solder joints 58a, 58b.
  • the vibrational lengths of the straight portions 24a, 24b of the lead wires 22a, 22b are precisely controlled.
  • the base 28, with the lead wires 22a, 22b secured thereto and the crystal 12 soldered to the ends 26a, 26b of the lead wires 22a, 22b, is inserted into the upper portion of the cover 44 until the inner surface 30 of the base 28 abuts the base locating stops 52a, 52b, 54a, 54b.
  • a well 60 defined by the outer surface 32 of the base 28 and the overhanging portions 62a, 62b, 64a, 64b of the enclosing cover 44 is filled with a suitable encapsulant 66, e.g., an epoxy material.
  • the encapsulant 66 is effectively attached and hermetically seals the base 28 to the lower portion of the cover 44 and also additionally attaches and hermetically seals the lead wires 22a, 22b to the base 28.
  • solder joints 58a, 58b are omitted and only the epoxy material is used to seal the lead wires 22a, 22b to the base 28.
  • two epoxy operations are required; one to fix the crystal position relative to the base, and the other to attach and hermetically seal the cover to the base.
  • the base 28 is of a dielectric material, generally a ceramic, e.g., alumina, and the material for the cover 44 and the encapsulant 66 is preferably selected to provide substantially the same linear coefficient of expansion as that of the base. This prevents undue thermal stresses for damaging the bond and/or imparting stresses due to differences in thermal expansions between the epoxy material 66 and the enclosing cover 44 or between the epoxy material 66 and the base 28.
  • KOVAR an alloy consisting of iron, cobalt, and nickel and having a linear coefficient of expansion of approximately 6.2 ⁇ 10 -6 , is compatible with the alumina useable for the base.
  • the vibrational mode of the crystal 12 is shown by phantom lines 68a, 68b. It can readily be seen that even though the vibration of the crystal 12 is about the nodal points 20a, 20b, the lead wires 22a, 22b will be subjected to both torsional and bending vibrations from the oscillations of the crystal. The application of torsional vibrations to the lead wires 22a, 22b is apparent from the curvature of the phantom lines 68a, 68b. In like manner, it can be seen by inspection of FIG.
  • the present invention is particularly effective in reducing the overall size of the crystal assembly 10 in that the straight portions 24a, 24b of the lead wires 22a, 22b are attached to the outer surface 32 of the bar-shaped base 28 thereby leaving the straight portions 24a, 24b free to vibrate in any direction within the conical holes 38a, 38b as well as between the crystal 12 and the base 28.
  • the distance between the crystal 12 and the surface 30 of the base 28 is reduced by the thickness of base 28 and the overall size of the assembly is also reduced accordingly, while still maintaining the lead wires at one-quarter wave length.
  • the lead wires are 0.005 inches in diameter and are terminated to the outer surface of the base to provide a free vibratory length of approximately 0.065 inches, the free vibratory length being determined empirically as one-quarter wave length.
  • the base has a thickness of 0.046 inches.
  • cone denotes any substantially conical or tapered shape wherein the cross section of the cone intermediate the apex and the base is oval, circular or multisided.

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
US05/595,373 1975-07-14 1975-07-14 Piezoelectric crystal mounting Expired - Lifetime US4152616A (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
US05/595,373 US4152616A (en) 1975-07-14 1975-07-14 Piezoelectric crystal mounting
CA256,063A CA1069610A (en) 1975-07-14 1976-06-30 Piezoelectric crystal
DE2631074A DE2631074C3 (de) 1975-07-14 1976-07-09 Piezoelektrische Kristallbaugruppe
BR7604556A BR7604556A (pt) 1975-07-14 1976-07-13 Montagem de cristal pizoeletrico
CH896976A CH607335A5 (it) 1975-07-14 1976-07-13
FR7621456A FR2318506A1 (fr) 1975-07-14 1976-07-13 Ensemble a cristal piezoelectrique
IT68752/76A IT1064937B (it) 1975-07-14 1976-07-13 Cristallo piezoelettrico
JP51083922A JPS5211889A (en) 1975-07-14 1976-07-14 Piezooelectric crystal assembly
GB29308/76A GB1506830A (en) 1975-07-14 1976-07-14 Piezoelectric crystal assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/595,373 US4152616A (en) 1975-07-14 1975-07-14 Piezoelectric crystal mounting

Publications (1)

Publication Number Publication Date
US4152616A true US4152616A (en) 1979-05-01

Family

ID=24382992

Family Applications (1)

Application Number Title Priority Date Filing Date
US05/595,373 Expired - Lifetime US4152616A (en) 1975-07-14 1975-07-14 Piezoelectric crystal mounting

Country Status (9)

Country Link
US (1) US4152616A (it)
JP (1) JPS5211889A (it)
BR (1) BR7604556A (it)
CA (1) CA1069610A (it)
CH (1) CH607335A5 (it)
DE (1) DE2631074C3 (it)
FR (1) FR2318506A1 (it)
GB (1) GB1506830A (it)
IT (1) IT1064937B (it)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5017823A (en) * 1988-09-19 1991-05-21 Canon Kabushiki Kaisha Vibration wave driven actuator
US5206460A (en) * 1991-07-24 1993-04-27 Yang Mu K Oscillator package
US5765046A (en) * 1994-08-31 1998-06-09 Nikon Corporation Piezoelectric vibration angular velocity meter and camera using the same
US20090252983A1 (en) * 2008-04-02 2009-10-08 Nihon Dempa Kogyo Co., Ltd. Crystal unit
US20100181872A1 (en) * 2009-01-20 2010-07-22 Kazuyoshi Sugama Piezoelectric vibrator
US20150130040A1 (en) * 2011-04-01 2015-05-14 Schlumberger Technology Corporation High Density Microelectronics Packaging

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2513870A (en) * 1948-01-23 1950-07-04 Reeves Hoffman Corp Hermetically sealed crystal
US2546321A (en) * 1949-02-12 1951-03-27 Bell Telephone Labor Inc Piezoelectric crystal apparatus
US3073975A (en) * 1958-12-23 1963-01-15 Rca Corp Crystal unit
US3735166A (en) * 1971-10-06 1973-05-22 Cts Corp Piezoelectric crystal assembly
US3913195A (en) * 1974-05-28 1975-10-21 William D Beaver Method of making piezoelectric devices

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2513870A (en) * 1948-01-23 1950-07-04 Reeves Hoffman Corp Hermetically sealed crystal
US2546321A (en) * 1949-02-12 1951-03-27 Bell Telephone Labor Inc Piezoelectric crystal apparatus
US3073975A (en) * 1958-12-23 1963-01-15 Rca Corp Crystal unit
US3735166A (en) * 1971-10-06 1973-05-22 Cts Corp Piezoelectric crystal assembly
US3913195A (en) * 1974-05-28 1975-10-21 William D Beaver Method of making piezoelectric devices

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5017823A (en) * 1988-09-19 1991-05-21 Canon Kabushiki Kaisha Vibration wave driven actuator
US5206460A (en) * 1991-07-24 1993-04-27 Yang Mu K Oscillator package
US5765046A (en) * 1994-08-31 1998-06-09 Nikon Corporation Piezoelectric vibration angular velocity meter and camera using the same
US20090252983A1 (en) * 2008-04-02 2009-10-08 Nihon Dempa Kogyo Co., Ltd. Crystal unit
US7939768B2 (en) * 2008-04-02 2011-05-10 Nihon Dempa Kogyo Co., Ltd. Crystal unit
US20100181872A1 (en) * 2009-01-20 2010-07-22 Kazuyoshi Sugama Piezoelectric vibrator
US8207654B2 (en) * 2009-01-20 2012-06-26 Seiko Instruments Inc. Piezoelectric vibrator
US20150130040A1 (en) * 2011-04-01 2015-05-14 Schlumberger Technology Corporation High Density Microelectronics Packaging
US9431375B2 (en) * 2011-04-01 2016-08-30 Schlumberger Technology Corporation High density microelectronics packaging

Also Published As

Publication number Publication date
FR2318506B3 (it) 1979-04-06
DE2631074B2 (de) 1978-05-03
IT1064937B (it) 1985-02-25
CH607335A5 (it) 1978-12-15
CA1069610A (en) 1980-01-08
DE2631074A1 (de) 1977-02-03
DE2631074C3 (de) 1978-12-21
FR2318506A1 (fr) 1977-02-11
GB1506830A (en) 1978-04-12
BR7604556A (pt) 1977-08-02
JPS5211889A (en) 1977-01-29

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