US3855108A - Continuous strip electroplating apparatus - Google Patents

Continuous strip electroplating apparatus Download PDF

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Publication number
US3855108A
US3855108A US00436116A US43611674A US3855108A US 3855108 A US3855108 A US 3855108A US 00436116 A US00436116 A US 00436116A US 43611674 A US43611674 A US 43611674A US 3855108 A US3855108 A US 3855108A
Authority
US
United States
Prior art keywords
strip
wheel
masking
band
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US00436116A
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English (en)
Inventor
W Bolz
H Herzog
A Herzog
H Neese
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Doduco Solutions GmbH
Original Assignee
Doduco GmbH and Co KG Dr Eugen Duerrwaechter
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Doduco GmbH and Co KG Dr Eugen Duerrwaechter filed Critical Doduco GmbH and Co KG Dr Eugen Duerrwaechter
Priority to ES426420A priority Critical patent/ES426420A1/es
Application granted granted Critical
Publication of US3855108A publication Critical patent/US3855108A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0671—Selective plating
    • C25D7/0678—Selective plating using masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S204/00—Chemistry: electrical and wave energy
    • Y10S204/07—Current distribution within the bath

Definitions

  • One of the objects of this invention is the provision of continuous strip electroplating apparatus which is simpler to build and capable of operating over extended periods with the insulating face of the wheel over an arc whose length is predetermined by the configuration of the guiding device, and is preferably 180 or more.
  • a tubular anode carrier mounted on the stationary support of the apparatus extends about the wheel and the engaged strip approximately in the afore-mentioned arc.
  • a conductive anode member is mounted on the carrier spacedly opposite the circumferential face of the wheel, and aligned discharge orifices in the carrier and the anode member are directed toward the axis of rotation of the wheel.
  • Conductors connect the strip to the negative terminal of a source of electroplating current, and connect the anode member to the positive terminal.
  • a conduit communicating with the interior of the anode carrier supplies electrolyte for discharge from the orifices of the carrier and of the anode member.
  • FIG. 1 shows a strip plating installation of the invention in side elevation
  • FIG. 2 illustrates the plating unit in the installation of FIG. 1 in side-elevational section on a scale larger than that of FIG. 1, and partly in a conventional manner;
  • FIG. 3 shows the apparatus of FIG. 2 in section on the line III-III;
  • FIG. 4 shows a portion of the apparatus of FIG. 3 on a greatly enlarged scale
  • FIG. 5 illustrates a modified detail for the apparatus of FIG. 3 in a view corresponding to that of FIG. 4;
  • FIG. 5A shows a masking band for use in the device of FIG. 5 in fragmentary, plan view
  • FIG. 6 is an axially sectional, enlarged view of a guide pulley for the strip to be plated in the apparatus of FIG. 3;
  • FIG. 7 similarly shows a guide pulley arrangement for masking bands in the same apparatus.
  • FIG. 1 there is shown a strip electroplating installation according to the invention on a scale too small to permit a detailed representation of the inventive features.
  • the bare strip 2 to be plated is drawn from arotatably mounted supply reel 1 andthrough a pretreating unit 3 by a first set of motor-driven pinch rolls 4.
  • the pretreating unit conventional in itself, sequentially sprays an alkaline detergent solution, rinse water, pickling acid, rinse water, a neutralizing solution, and again rinse water against the traveling strip, and the liquid is blown from the strip as far as possible by air jets before it enters the plating unit 50 with which this invention is more particularly concerned.
  • the pre-treatment described is based on the assumption that the strip will be plated in the unit 50 from a cyanide bath, and obvious modifications in the pre-treatment are necessary if nickel plating from an acid plating bath is contemplated.
  • the electroplated strip 2' is drawn from the platingunit through an after-treatment unit 5 by a 'second set of pinch rolls 6 which is coupled with the rolls 4 to maintain constant tension in the strip 2, 2' while it passes the plating unit.
  • the after-treatment unit includes rinsing and drying devices conventional in themselves.
  • the electroplated, dry strip 2 is wound on a take-up reel 7 which is rotated by an electric motor through a slipping clutch in a manner well known and not illustrated.
  • the electroplating unit 50 is better seen in FIGS. 2 and 3. Only'as much of the stationary supporting struc ture of the unit has been shown as is needed for an understanding of its operation .without crowding the drawing.
  • Conductive pulleys 8, 8' guide the bare strip 2 toward a plastic wheel 9 and the plated strip 2 away from the wheel.
  • the strips are freely rotatable on respective shafts parallel to the horizontal shaft 11 on which the wheel 9 is fastened by means of a locknut 12.
  • the shaft 11 is joumaled in a bearing 13 of the stationary supporting structure.
  • the pulleys 8, 8' are mounted above the wheel 9 on opposite sides of a vertical plane of symmetry through the axis of rotation of the wheel 9 in such a manner that the strip 2, 2' is trained over the circumferential face of the wheel 9 in an arc of approximately 200 enveloping slightly more than the lower half of the wheel.
  • eachband 14 remote from the wheel 9 sequentially passes through rinsing water on pairs of pulleys 17 in troughs 16, 16 and over a tensioning pulley 17' between the rinsing troughs, the shaft of the pulley 17' being mounted on slides 17a,
  • Adhering rinse water is blown from the bands 14 by hot-air jets 18 before the bands return to the wheel 9.
  • the wheel 9, pulleys 8, 8, pulley arrangements 15, 15', and pulleys 17, 17 are freely rotatable on the supporting structure and are rotated by the strip 2, 2' in response to the action of the driven pinch rolls 4, 6.
  • the direction of rotation of the wheel 9 is counterclockwise, as viewed in FIG. 2. There is no relative movement between the wheel 9 and the engaged portions of the strip 2, 25 or the bands 14.
  • Respective branches of the conduit 21 are connected to the two ends of a tubular anode carrier 22' which is elongated in a circular arc of about 180 about the axis of rotation of the wheel 9 closely adjacent the circumferential face of the wheel and the portions of the strip 2, 2' and masking bands 14 which engage the wheel face.
  • the lower half of the wheel 9 and associated elements are received in a vessel 27 fixedly mounted on the supporting structure of the plating unit. 50 and equipped with two overflow chutes 28-approximately diametrically opposite each other relative to the shaft 11. They lead to a return conduit 28' and the sump 19.
  • a draincock 32 connecting the lowermost portion of the vessel with the return conduit 28' permits the vessel to be emptied of liquid by gravity, but is closed during normal operation of the plating unit.
  • a shallow groove in the circumferential face of the wheel 9 receives an annular rubber cushion 10 of rectangular cross section as an insert. lts outer face is approximately flush with the lands of the circumferential wheel face on either side of the groove when in the relaxed condition.
  • the cushion 10 is compressed slightly by the strip 2 whose width is smaller than that of the cushion-receiving groove by a minimal clearance not capable of being shown in the drawing.
  • the strip 2, 2 thus is guided by the radial side walls of the wheel 9 in the circumferential groove.
  • The'two masking bands 14 are guided about the wheel 9 in such a manner that they are superimposed partly on the lands of the wheel 9 and partly on the edge portions of the strip 2, 2.
  • the anode carrier 22 consists of two semi-circular, flat pieces of plastic which are mirror images of each other and are tightly assembled by means of bolts 22 so that grooves in the carrier pieces jointly define the bore or cavity 23 of the carrier which connects the two branches of the conduit 21.
  • the convex face of the carrier 22 is recessed and holds an elongated piece 25 of sheet platinum constituting the anode of the plating unit and connected to the rectifier 29. as described above and not shown in detail, conductors leading from both longitudinal ends of the anode 25 to the positive terminal of the rectifier.
  • the anode 25 is flanked axially by integral ribs 22" of the carrier 22 which define the effective width of the anode and are separated from respective masking bands 14 by narrow, radial gaps 26" leading axially outward of a chamber 26 which extends in an are about the wheel 9, is open at its circumferential ends, but is otherwise sealed, except for the gaps 26, by respective face portions of the cathodic strip 2, 2, the bands 14, the ribs 22", and the anode 25.
  • Elongated radial bores 24 in the two pieces of the anode carrier 22 communicate with the longitudinal bore 23 and with aligned discharge orifices in the anode 25.
  • the anode carrier 22 portion 37 axially adjustable on the'body portion 36 andprovided with a set screw 37'- for securing the ferred to replace the wheel 9 by one equipped with a l cover portion 37 in 'a selected axial position.
  • the guide pulley arrangement 15 is shown in detail in FIG. 7, and the pulley arrangement 15' is identical.
  • Two pulleys 39, 40 are mounted on a common shaft 41, and may be adjusted axially on the shaft when set screws 40 are released.
  • Circumferential grooves 42 conformingly receive the two masking bands 14 respectively during operation of the plating unit, and the axial spacing of the two bands on the strip 2 may be varied by shifting the pulleys 39, 40, thereby modifying the width of the edge portions of the strip which are masked by the bands 14.
  • strips 2 is uncoiled fromv the supply reel 1, prepared for plating in the pretreatment unit 3, and pulled under moderate tension through the plating unit 50.
  • Electrolyte is pumped from the sump 19'into the anode carrier 22 I and discharged under pressure through the orifices in the anode 25 radially inward into the plating chamber 26 and toward the exposed-central portion of the strip 2. Electric current passing through the electrolyte in the chamber 26 from the anode 25 to the strip 2 causes metal deposition on the strip.
  • the chamber 26 and the vessel 27 are filled with electrolyte somewhat beyond the level of the overflow chutes 28, and the electrolyte partly stripped of its metal content returns to the sump 19. It may be replenished in the sump in any conventional manner.
  • F IG. 4 represents actual dimensional relationships in sity.
  • the flow section of the gaps 26' is somewhat greater than the combined flow section of the bores 24.
  • Electrolyte flow into the chamber 26 is radial, and flow outward of the chamber is predominantly axial, very little electrolyte being discharged circumferentially from the longitudinal ends of the chamber 26.
  • the flow 15 rate of the electrolyte is readily chosen to replace the electrolyte in the chamber 26 more than once a second.
  • the change in the direction of flow through the chamber 26 and the high pumping rate cause intensive turbulence in all parts of the chamber 26, and extremely high current densities (about 40 amps/dm and deposition rates are readily accomplished with suitable electrolytes, known themselves.
  • the voltage drop across the chamber 26 due to the ohmic resistance of the electrolyte is minimal because the spacing of the parallel cathode and anode surfaces is not significantly greater than one half the width of the exposed cathode surface, and of the order of 5 millimeters. Electrode polarization is low because of the intensive agitation provided.
  • the length of the chamber 26 is many times greater than any other dimension of the chamber so that the dwell time of the strip 2 in the effective plating zone is relatively long, a feature essential for adequate'thickness of electrodeposit at high traveling speeds of the strip.
  • the low electrode potentials required to produce the large current flow favor deposition of ductile deposits of silver and other metals from known high- Speed Plating electrolytes-
  • the deposits formed are of Q with the electrolyte, and trained over the wheel 9 in a manner obvious from FlGS. 2'and 3, the apparatus shown in FIG. 5 being identical with the first-described uniform thickness over the entire exposed width of the cathode because of the much wider anode.
  • the opposite edges of the masking bands 14 are beveled, as is seen in FIG. 4, so that the body of electrolyte flares from the strip 2 toward the anode 25, and thinner deposits adjacent the masked, bare parts of the platedstrip 2' are avoided.
  • the discharge of hydrogen at the cathode cannot be avoided entirely in any electroplating arrangement operating under production conditions, and co-deposited hydrogen causes embrittlement in many electrodeposited metals, particularly silver.
  • the cathode efficiency is high in the apparatus of the invention up to high cathode current densities because of the configuration of the chamber 26 and of the severely turbulent liquid flow through the chamber.
  • the oxygen unavoidably deposited on the platinum electrode 25 is carried away before it can reach the strip 2, 2' and afiect the quality of the cathodically deposited metal.
  • the operation of the plating unit '50 has been ver from an alkaline, more specifically, a cyanide plating bath, other metals obviously may be electroplated to equal advantage by means of the same equipment,- and changes, if any, will readily be made in details, as in the nature of the insoluble anode 25 to fit the electrolyte.
  • the circulating electrolyte may be described with reference to the electrodeposition of sil- I filtered, cooled, or heated in a manner not requiring explicit description, and the replenishment of the electrolyte with metal lost by deposition is well known and not part of this invention.
  • Strips of bronze, brass, nickelsilver, and laminar strips consisting of two metals having dissimilar coefficients of thermal expansion which are coated with silver, gold, nickel, or other metals along their centers while the edge portions are bare, are staple articles of commerce and are employed widely for manufacturing electrical contacts.
  • the apparatus of the in-' vention is capable of producing strips selectively electroplated over parts of one surface in patterns other than that inherent in the locationof the masking bands 14 shown in FIG. 4. I
  • One of the bands 14 may be omitted if it is desired to keep only one longitudinal edge. bare of electrodeposited metal.
  • a further modified masking arrangement isillustrated in FIG; 5 and is suitable for producing blanks for lead frames in semi-conductor devices.
  • the wheel 9 differs from the afore-described wheel 9 by a somewhat deeper circumferential groove whose bottom is provided with a rubber cushion 10 forfthe purpose described above.
  • Registration pins 33 project from axial bores of the wheel 9' into the circumferential groove in circumferentially uniformly spaced relationship.
  • the strip 2" to be plated is partly covered with a single masking band 34 having the same width as the strip.
  • the band 34 consists of a thin stainless steel strip having uniformly spaced registration notches 35 in its two edges and square apertures 35', each aligned with two notches transversely of the direction of band movement.
  • the band after being provided with the notches 35 and apertures 35' on a punch press, and being welded into a closed loop, is coated with a layer of synthetic rubber to protect the stainless steel from contact points of the pins 33 simultaneously engaging the lateral notches in the band and strip.
  • Plastics such as rigid polyvinyl chloride, are the preferred materials of construction for the apparatus of the invention to prevent stray currents from building deposits on'the plating unit where none are wanted, but
  • Apparatus for continuously electroplating a longitudinally moving elongated strip having a conductive surface comprising, in combination:
  • a wheel mounted on said support for rotation about an axis and having a circumferential face of insulating material
  • a tubular anode carrier mounted on said support and extending about said wheel and said strip substantially in said arc;
  • said carrier and said anode member being formed with respective aligned discharge orifices communicating with the interior of said carrier and directed toward said axis;
  • Apparatus as set forth in claim 1 further comprising an endless masking band of flexible, electrically insulating material, said guide means including means for 4.
  • Apparatus as set forth in claim 2 further comprising washing means for washing electrolyte from said masking band, and drying means for drying the washed masking band, said guiding means including means for guiding said band in a closed loop sequentially over said are, said washing means, said drying means, and back to said wheel.
  • said guide means include a row of circumferentially spaced registration pins on said wheel, each pin having an axially directed point, said band being formed with a plurality of lateral notches, said points engaging said notches in the portion of said band in masking engagement with said strip.
US00436116A 1973-05-17 1974-01-24 Continuous strip electroplating apparatus Expired - Lifetime US3855108A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ES426420A ES426420A1 (es) 1973-05-17 1974-05-17 Aparato para chapar electroliticamente de modo continuo unatira alargada.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2324834A DE2324834C2 (de) 1973-05-17 1973-05-17 Vorrichtung zum kontinuierlichen selektiven Bandgalvanisieren

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US3855108A true US3855108A (en) 1974-12-17

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US (1) US3855108A (de)
JP (1) JPS559072B2 (de)
AU (1) AU461716B2 (de)
BE (1) BE813121A (de)
BR (1) BR7403932D0 (de)
CA (1) CA1020495A (de)
DE (1) DE2324834C2 (de)
FR (1) FR2229780B1 (de)
GB (1) GB1458922A (de)
IT (1) IT1012345B (de)
LU (1) LU70089A1 (de)
NL (1) NL159441B (de)
SE (1) SE408562B (de)
YU (1) YU39208B (de)

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3986945A (en) * 1974-01-21 1976-10-19 Galentan Ag Device for the continuous application of strip-, ribbon- or spot-shaped coatings
US4030999A (en) * 1975-10-06 1977-06-21 National Semiconductor Corporation Stripe on strip plating apparatus
US4036725A (en) * 1975-11-21 1977-07-19 National Semiconductor Corporation Wheel selective jet plating system
US4132617A (en) * 1973-10-04 1979-01-02 Galentan, A.G. Apparatus for continuous application of strip-, ribbon- or patch-shaped coatings to a metal tape
US4388157A (en) * 1981-03-07 1983-06-14 Galentan Ag Method of applying coverings in the form of completely or not completely closed loops
US4431500A (en) * 1981-12-15 1984-02-14 Vanguard Research Associates, Inc. Selective electroplating apparatus
US4500400A (en) * 1983-10-07 1985-02-19 Kawasaki Steel Corporation Counter flow device for electroplating apparatus
DE3708779A1 (de) * 1986-11-22 1988-06-01 Schempp & Decker Maschinenbau Vorrichtung zum galvanischen beschichten eines elektrisch leitenden gegenstandes
US5069762A (en) * 1991-01-18 1991-12-03 Usx Corporation Appartaus for improved current transfer in radial cell electroplating
US5242562A (en) * 1992-05-27 1993-09-07 Gould Inc. Method and apparatus for forming printed circuits
US5512154A (en) * 1993-01-28 1996-04-30 Meco Equipment Engineers B.V. Apparatus for selectively electroplating apertured metal or metallized products
US5721007A (en) * 1994-09-08 1998-02-24 The Whitaker Corporation Process for low density additive flexible circuits and harnesses
US6129820A (en) * 1997-12-03 2000-10-10 Sollac Electroplating installation, electrode and support device for this installation and electroplating process
US20040074776A1 (en) * 2000-04-28 2004-04-22 Van Der Weijde Dammes Hans Method and device for the electrolytic coating of a metal strip
US20090057158A1 (en) * 2007-09-05 2009-03-05 Leviton Manufacturing Co., Inc. Plating systems and methods
US20090242412A1 (en) * 2005-04-06 2009-10-01 Leviton Manufacturing Co., Inc. Continuous plating system and method with mask registration
US20090255821A1 (en) * 2005-04-06 2009-10-15 Leviton Manufacturing Company, Inc. Continuous plating system and method with mask registration
US20110073481A1 (en) * 2009-09-30 2011-03-31 National Semiconductor Corporation Foil plating for semiconductor packaging
EP3015573A1 (de) * 2014-10-31 2016-05-04 Falko Eidner Anlage zum galvanisieren eines bandes

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51137629A (en) * 1975-05-23 1976-11-27 Nippon Electro Plating Highhspeed continuous plating method
DE2705158C2 (de) 1977-02-04 1986-02-27 Schering AG, 1000 Berlin und 4709 Bergkamen Verfahren zum Teilgalvanisieren
EP0052125A4 (de) * 1980-05-07 1982-09-03 Kontakta Alkatreszgyar Vorrichtung zum plattieren von bandmaterial.
DE3212152C2 (de) * 1982-04-01 1985-01-17 Doduco KG Dr. Eugen Dürrwächter, 7530 Pforzheim Vorrichtung zum selektiven galvanischen Beschichten eines Bandes
GB2127853B (en) * 1982-10-05 1985-11-13 Owen S G Ltd Selective plating
DE3343978A1 (de) * 1983-12-06 1985-06-20 Hoesch Ag, 4600 Dortmund Verfahren zum kontinuierlichen elektrolytischen abscheiden von metallen
DE3441593A1 (de) * 1984-11-14 1986-05-22 Ferd. Rüesch AG, St. Gallen Verfahren und vorrichtung zum herstellen von siebdruckgeweben fuer siebdruckzylinder
GB2214930A (en) * 1988-02-11 1989-09-13 Twickenham Plating & Enamellin Mask for use in electriplating on elongate substrate
US5393396A (en) * 1990-10-30 1995-02-28 Gould Inc. Apparatus for electrodepositing metal
US5228965A (en) * 1990-10-30 1993-07-20 Gould Inc. Method and apparatus for applying surface treatment to metal foil

Citations (5)

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US2052962A (en) * 1934-12-31 1936-09-01 Mallory & Co Inc P R Process of etching
US2174071A (en) * 1937-04-29 1939-09-26 Chambon Corp Can blank and method of producing same
US2177086A (en) * 1936-02-15 1939-10-24 Mallory & Co Inc P R Etching process
US3483113A (en) * 1966-02-11 1969-12-09 United States Steel Corp Apparatus for continuously electroplating a metallic strip
US3819502A (en) * 1971-05-25 1974-06-25 Meco Metal Finishing Eng Nv Line- and spotplating machine

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2052962A (en) * 1934-12-31 1936-09-01 Mallory & Co Inc P R Process of etching
US2177086A (en) * 1936-02-15 1939-10-24 Mallory & Co Inc P R Etching process
US2174071A (en) * 1937-04-29 1939-09-26 Chambon Corp Can blank and method of producing same
US3483113A (en) * 1966-02-11 1969-12-09 United States Steel Corp Apparatus for continuously electroplating a metallic strip
US3819502A (en) * 1971-05-25 1974-06-25 Meco Metal Finishing Eng Nv Line- and spotplating machine

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4132617A (en) * 1973-10-04 1979-01-02 Galentan, A.G. Apparatus for continuous application of strip-, ribbon- or patch-shaped coatings to a metal tape
US3986945A (en) * 1974-01-21 1976-10-19 Galentan Ag Device for the continuous application of strip-, ribbon- or spot-shaped coatings
US4030999A (en) * 1975-10-06 1977-06-21 National Semiconductor Corporation Stripe on strip plating apparatus
US4036725A (en) * 1975-11-21 1977-07-19 National Semiconductor Corporation Wheel selective jet plating system
US4388157A (en) * 1981-03-07 1983-06-14 Galentan Ag Method of applying coverings in the form of completely or not completely closed loops
US4431500A (en) * 1981-12-15 1984-02-14 Vanguard Research Associates, Inc. Selective electroplating apparatus
US4500400A (en) * 1983-10-07 1985-02-19 Kawasaki Steel Corporation Counter flow device for electroplating apparatus
DE3708779A1 (de) * 1986-11-22 1988-06-01 Schempp & Decker Maschinenbau Vorrichtung zum galvanischen beschichten eines elektrisch leitenden gegenstandes
US5069762A (en) * 1991-01-18 1991-12-03 Usx Corporation Appartaus for improved current transfer in radial cell electroplating
US5242562A (en) * 1992-05-27 1993-09-07 Gould Inc. Method and apparatus for forming printed circuits
US5429738A (en) * 1992-05-27 1995-07-04 Gould Inc. Method for forming printed circuits by elctroplating
US5512154A (en) * 1993-01-28 1996-04-30 Meco Equipment Engineers B.V. Apparatus for selectively electroplating apertured metal or metallized products
US5721007A (en) * 1994-09-08 1998-02-24 The Whitaker Corporation Process for low density additive flexible circuits and harnesses
US6129820A (en) * 1997-12-03 2000-10-10 Sollac Electroplating installation, electrode and support device for this installation and electroplating process
US6334943B1 (en) * 1997-12-03 2002-01-01 Sollac Electroplating installation, electrode and support device for this installation and electroplating process
US20040074776A1 (en) * 2000-04-28 2004-04-22 Van Der Weijde Dammes Hans Method and device for the electrolytic coating of a metal strip
US6911137B2 (en) * 2000-04-28 2005-06-28 Corus Technology Bv Method and device for the electrolytic coating of a metal strip
US20090255821A1 (en) * 2005-04-06 2009-10-15 Leviton Manufacturing Company, Inc. Continuous plating system and method with mask registration
US20090242412A1 (en) * 2005-04-06 2009-10-01 Leviton Manufacturing Co., Inc. Continuous plating system and method with mask registration
US8277629B2 (en) * 2005-04-06 2012-10-02 Leviton Manufacturing Co., Inc. Continuous plating system and method with mask registration
US8287714B2 (en) * 2005-04-06 2012-10-16 Leviton Manufacturing Co., Inc. Continuous plating system and method with mask registration
US20090057158A1 (en) * 2007-09-05 2009-03-05 Leviton Manufacturing Co., Inc. Plating systems and methods
US8182655B2 (en) * 2007-09-05 2012-05-22 Leviton Manufacturing Co., Inc. Plating systems and methods
US20110073481A1 (en) * 2009-09-30 2011-03-31 National Semiconductor Corporation Foil plating for semiconductor packaging
US8377267B2 (en) * 2009-09-30 2013-02-19 National Semiconductor Corporation Foil plating for semiconductor packaging
EP3015573A1 (de) * 2014-10-31 2016-05-04 Falko Eidner Anlage zum galvanisieren eines bandes

Also Published As

Publication number Publication date
AU461716B2 (en) 1975-06-05
AU6898174A (en) 1975-06-05
DE2324834C2 (de) 1978-09-07
NL7406700A (de) 1974-11-19
YU134474A (en) 1982-06-30
DE2324834B1 (de) 1974-09-19
CA1020495A (en) 1977-11-08
YU39208B (en) 1984-08-31
LU70089A1 (de) 1974-10-09
JPS559072B2 (de) 1980-03-07
SE408562B (sv) 1979-06-18
GB1458922A (en) 1976-12-15
IT1012345B (it) 1977-03-10
BE813121A (fr) 1974-07-31
FR2229780A1 (de) 1974-12-13
FR2229780B1 (de) 1978-03-24
NL159441B (nl) 1979-02-15
BR7403932D0 (pt) 1974-12-03
JPS5053241A (de) 1975-05-12

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