US3827398A - Apparatus for tinning electrical circuit wires and the like - Google Patents

Apparatus for tinning electrical circuit wires and the like Download PDF

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Publication number
US3827398A
US3827398A US00331851A US33185173A US3827398A US 3827398 A US3827398 A US 3827398A US 00331851 A US00331851 A US 00331851A US 33185173 A US33185173 A US 33185173A US 3827398 A US3827398 A US 3827398A
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United States
Prior art keywords
bath
wire
insert
tin
tinning
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Expired - Lifetime
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US00331851A
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English (en)
Inventor
H Trattner
H Raab
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Siemens AG
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Siemens AG
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon

Definitions

  • ABSTRACT An apparatus for tinning electrical circuits wires with a solder layer of tin or a tin alloy in which the wire is fed through a solder bath of tinning metal with the wire emerging upwardly therefrom in a substantially vertical direction, the exit point of the wire from the bath being encircled by va non-metallic tubular member, for example of quartz or quartz glass, with the casing having its adjacent end immersed in the bath.
  • the upper end of the member is closed by a nonmetallic insert which is spaced above the surface of the bath and is provided with an orifice through which the wire passes, the space between the insert and the surface of the bath being adapted, in use, to receive an agent which will inhibit, i.e., dissolve or prevent the formation of tin oxide, for example, an inert gas or zinc chloride.
  • the insert may be provided with a supply passageway for the inhibiting material and may be provided with an annular shaped flange which may be positioned concentrically with respect to the exiting wire and disposed below said supply passageway, whereby material, such as zinc chloride, may be received on said flange and distributed around the exiting point of the wire from the tinning metal.
  • the invention is directed to an apparatus for tinning electrical circuit wires, particularly copper wires, with a relatively thick layer or coating of tin or a tin alloy.
  • connection with the coating of steel ribbons and wires with molten metals or alloys in particular with coatings containing zinc, antimony, bismuth or the like, in conjunction with exit or squeeze rollers in the molten bath, to provide a casing around the ribbon or wire at its point of exit from the metal melt, which may contain an agent (usually zinc chloride) which dissolves the oxide of the molten metal, to which agent ammonium bromide has been added.
  • an agent usually zinc chloride
  • the wire is moved substantially vertically upwards through a solder bath and thereafter through a member having an annular clearance with respect to the wire which determines the coating thickness.
  • Such device has been found to be well suited to the thick-tinning or hot tin plating of a copper wire.
  • the solder layer tends to become irregular.
  • Such exit cone must not experience any disturbance during the passing of the wire at constant speed through the tin bath, as it is only by means of such cone that it is ultimately possible to achieve a really uniform tin coating on the surface of the wire.
  • an apparatus for tinning electrical circuits wires with a solder layer of tin or a tin alloy in which a solder bath of the tinning metal is provided, through which the wire is fed, with the wire emerging upwardly from the bath in a substantially vertical direction.
  • a non-metallic tubular member or casing which has its adjacent end immersed in the bath is constructed to surround the wire at its point of exit from the metallic bath. The upper part of the member is closed by a nonmetallic insert the lower inner end of which is spaced from the surface of the bath with the insert being provided with a passageway therein through which the exiting wire passes.
  • the space between the insert and the surface of the bath, in use, is adapted to contain an agent which will dissolve or prevent the formation of tin oxide, i.e., an inhibiting agent.
  • the insert may be provided with a passage connecting the space within the casing above the surface of the bath, with a reservoir containing such an inhibiting agent.
  • a uniform exit cone of solder surrounding the wire is obtained.
  • a desired layer of thickness can then be regulated by suitable section of the speed of passage of the wire through the solder bath.
  • the layer thickness can be effectively and controllably varied from a few microns up to few hundredths of a mm.
  • the operation of the apparatus should be such that the speed of wire movement, as well as the temperature of the solder bath, be, as far as possible, maintained constant.
  • Zinc chloride forms a very effective inhibiting agent as it will dissolve tin oxide and, surprisingly, it has been determined that zinc chloride is particularly suitable as an agent for reducing the surface tension of tin at the surface of the solder bath.
  • the surface tension of the tin may be substantially reduced in the area of the exit point of the wire, resulting in the production of a highly uniform exit cone surrounding the wire.
  • the dissolved oxide residues collecting in the neighborhood of the enclosed space can, if required, be mechanically removed after a predetermined time.
  • the insert may consist of a plug of synthetic resinous material, and the passage for the introduction of the inhibiting agent which dissolves or prevents the formation of tin oxide, is laterally offset or eccentric with respect to the guide passageway for the wire.
  • the inhibiting agent As the insert is heated by radiated heat from the solder bath, the inhibiting agent, also introduced through the insert, is likewise heated before it reaches the surface of the solder bath.
  • the plug of synthetic resinous material also may be provided with a laterally extending flange adjacent its lower or inner end, facing the bath surface, with the upper face of the flange, i.e., the face remote from the tin bath, being disposed directly below the point at which the supply passage for the inhibiting agent enters the enclosed space, with such flange being suitably shaped to form a trough or channel.
  • the inhibiting agent thus may collect in such chan nel and overflow the peripheral edge of the flange onto the surface of the tin bath and by utilizing an annular shaped flange, substantially concentric with the exit point of the wire, a very effective and uniform distribution of the inhibiting agent may be achieved in the area at and surrounding the point of exit of the wire from the solder bath.
  • an inert gas can be fed through the supply passage to the tin bath, and as the tubular casing extends into the tin bath, an excessive loss of inert gas is avoided.
  • FIG. 1 is a schematic sectional view through an embodiment of the invention.
  • FIG. 2 is a similar view of a portion of a second embodiment of the invention.
  • a solder bath 1 is provided, contained within a suitable receptacle, adapted to be heated by a controllable, electrical heating arrangement 2, with the copper wire 3 to be tinned, being guided around a feed roller 4 and guide rollers 5 to a tinning device, indicated generally by the numeral 6.
  • the copper wire will have already been pretreated i.e., rendered metallically clean and coated with a suitable flux.
  • the device 6 is operative to maintain the surface tension of the solder bath constant, particularly in the area 7 of the point of exit of the wire and to facilitate the formation of a uniform exit cone 7 thereat.
  • the device 6 comprises a tubular member or casing 8, preferably made of a transparent material such as quartz glass.
  • the adjacent end of the member 8 is immersed in the solder bath to a depth of approximately 10 mm. while the upper end of the tubular member is closed by means of an insert 9, formed of synthetic resinous material, having therein a passageway 9 through which the wire may be conducted to the exterior.
  • the insert 9 also has a supply passage 10, disposed in offset or eccentric relation with respect to the passageway 9', which supply passage terminates at its inner end in a flange 12 with the latter being disposed in spaced relation above the surface 11 of the solder bath, enclosed by the device 6.
  • the outer peripheral edge 13 of the upper face 13 of the flange 12 is disposed above the corresponding inner peripheral edge of the face, a trough or channellike structure is formed in which ihibiting material discharged from the passageway 13 may accumulate.
  • the upper face 13 of the flange 12 is of annular configuration and substantially concentric with the passageway 9 through which the wire passes, whereby inhibiting material may be uniformly distributed completely therearound.
  • the inhibiting agent in this case a tin oxide dissolving agent, preferably zinc chloride, is supplied from a reservoir 14 through a control unit 15, equipped with an electromagnetic metering valve (not shown), which unit feeds the oxide dissolving agent continuously or batchwise through a pipe 16 into the passage 10.
  • a control unit 15 equipped with an electromagnetic metering valve (not shown), which unit feeds the oxide dissolving agent continuously or batchwise through a pipe 16 into the passage 10.
  • the oxide dissolving agent flowing from the line 16 to the passageway 10 will be preheated in the insert and in the neighborhood of the trough or channel formed by the upper face 13 of the flange 12 whereby such inhibiting agents will drip over the edge 13' thereof in the manner illustrated in FIG. 1, onto the surface 11 of the solder bath.
  • the surface tension of tin bath is maintained relatively closely constant in the neighborhood of the exit area 7 of the wire 3.
  • a venting bore 22 through which vapors arising from the tin oxide dissolving agent can be unimpededly bled off.
  • the layer thickness of the tin coating is dependent to a great extent on the feed rate v of the wire and the thickness of such coating is usually held between 5 and 15 microns.
  • the tinning device 6 maybe supported in operation position with respect to the solder bath by suitable means, for example a cross beam 17.
  • FIG. 2 illustrates a tinning device for a copper wire 3 in accordance with further features of the invention, in which the surface tension of the bath 1 is maintained constant by an inert gas supplied to the enclosed space within the device 6.
  • the adjacent end of the tubular member 8 is immersed in the solder bath 1, thus enclosing the surface area or zone immediately surrounding the exit point 7' of the wire from the bath.
  • the insert 9 is provided with a feed passage 10 offset or eccentrically disposed with respect to the wire guide passageway 9'.
  • the passage 10 is employed for the introduction of an inert gas, such as nitrogen, into the enclosed space 18, which is substantially closed at the insert 9 disposed above the surface 11 of the solder bath.
  • the inert gas may be supplied from a pressure cylinder 19 and after passing through a reducing valve 20 and pipe 21, discharged through the passage 10 into the space 18, the gas being so regulated, in terms of quantity and/or pressure, that the space 18 over the surface 11 of the solder bath will be at a pressure slightly above atmospheric, which thus serves to insure that no air will reach the bath surface through the wirefeed passage 9'.
  • a small quantity of inert gas will continuously escape through the narrow annular gap between the surface of the wire 3 and the wall of the nozzle passage 9, as the width of such annular gap is very small, not exceeding 0.2 mm.
  • the surface 11 of the bath within the member 8 will be slightly lower than the external bath surface 11 surrounding such member.
  • the latter is constructed of a non-metallic material preferably of quartz, and preferably is transparent so that it is possible to directly observe the tinning operation within the member 8.
  • An apparatus for tinning electrical circuit wires with a solder layer of tin or tin alloy comprising a solder bath of tinning metal, means for feeding a wire through said bath, with the wire emerging upwardly therefrom in a substantially vertical direction, and a non-metallic tubular member having one end immersed in the bath and arranged to surround said wire at its point of exit from said bath, a non-metallic insert closing the upper part of said member with said insert spaced above the surface of the bath and having a passageway therein through which the exiting wire passes, the space between said insert and the surface of the bath being adapted in use to receive an agent which will inhibit the formation of tin oxide a second passageway extending through said insert and communicating a source of said agent with said space, and a flange extending radially from the insert end which is adjacent to the surface of said bath, the upper face of said flange being spaced from and beneath the end of said second passageway.
  • tubular member is constructed of quartz or quartz glass.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)
  • Molten Solder (AREA)
US00331851A 1972-02-18 1973-02-12 Apparatus for tinning electrical circuit wires and the like Expired - Lifetime US3827398A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2207719A DE2207719C3 (de) 1972-02-18 1972-02-18 Vorrichtung zum Feuerverzinnen von elektrischen Schaltungsdrähten

Publications (1)

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US3827398A true US3827398A (en) 1974-08-06

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Family Applications (1)

Application Number Title Priority Date Filing Date
US00331851A Expired - Lifetime US3827398A (en) 1972-02-18 1973-02-12 Apparatus for tinning electrical circuit wires and the like

Country Status (13)

Country Link
US (1) US3827398A (de)
JP (1) JPS5216698B2 (de)
AR (1) AR193687A1 (de)
BE (1) BE795558A (de)
BR (1) BR7301188D0 (de)
CH (1) CH590337A5 (de)
DE (1) DE2207719C3 (de)
FR (1) FR2172177B1 (de)
GB (1) GB1394484A (de)
IT (1) IT979049B (de)
LU (1) LU67051A1 (de)
NL (1) NL7301662A (de)
SE (1) SE391953B (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112318237A (zh) * 2020-10-29 2021-02-05 盐城市科瑞达科技咨询服务有限公司 一种铜线表面防腐处理加工装置
CN115011903A (zh) * 2022-08-09 2022-09-06 苏州科思拓机械科技有限公司 针对光伏焊带生产的智能型镀锡设备

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54184291U (de) * 1978-04-27 1979-12-27
DE2842201C2 (de) * 1978-09-28 1981-12-03 Felten & Guilleaume Carlswerk AG, 5000 Köln Vorrichtung zum Herstellen verzinnter Kupferdrähte
NZ192668A (en) * 1980-01-22 1984-12-14 N Z Wire Ind Ltd Apparatus for wiping wire or strip emerging vertically from molten metal bath
JPH0569347A (ja) * 1991-09-02 1993-03-23 Kaneko Seisakusho:Kk 工具握柄
JP6062221B2 (ja) * 2012-11-21 2017-01-18 高周波熱錬株式会社 加工装置用ガス封入機構及び加工装置
CN113106369A (zh) * 2021-04-15 2021-07-13 江西富鸿金属有限公司 一种超细铜线的热镀锡工艺

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1930601A (en) * 1931-02-12 1933-10-17 Frank P Townsend Metal coating apparatus
US2237315A (en) * 1938-08-24 1941-04-08 Dow Chemical Co Coating filamentous articles with vinylidene chloride compositions
US2341450A (en) * 1941-12-30 1944-02-08 Western Electric Co Strand treating apparatus
US2914423A (en) * 1955-05-12 1959-11-24 Armco Steel Corp Method and apparatus for metallic coating of metallic strands
US3060054A (en) * 1960-09-12 1962-10-23 Gen Electric Method and apparatus for accreting molten material on a moving member
US3082119A (en) * 1960-02-24 1963-03-19 United States Steel Corp Method of and apparatus for hot-dip coating strands
US3167403A (en) * 1960-06-09 1965-01-26 Nat Steel Corp Base materials coated with an alloy of aluminum and manganese
US3561399A (en) * 1964-07-02 1971-02-09 Homer W Giles Metal coating apparatus
US3565677A (en) * 1969-12-17 1971-02-23 Texas Instruments Inc Process of controlling the thickness of aluminum deposited on steel wire by controlling the depth of the bath of molten aluminum
US3707400A (en) * 1970-12-28 1972-12-26 United States Steel Corp Method of gas wiping wire emerging from a hot-dip coating bath

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1930601A (en) * 1931-02-12 1933-10-17 Frank P Townsend Metal coating apparatus
US2237315A (en) * 1938-08-24 1941-04-08 Dow Chemical Co Coating filamentous articles with vinylidene chloride compositions
US2341450A (en) * 1941-12-30 1944-02-08 Western Electric Co Strand treating apparatus
US2914423A (en) * 1955-05-12 1959-11-24 Armco Steel Corp Method and apparatus for metallic coating of metallic strands
US3082119A (en) * 1960-02-24 1963-03-19 United States Steel Corp Method of and apparatus for hot-dip coating strands
US3167403A (en) * 1960-06-09 1965-01-26 Nat Steel Corp Base materials coated with an alloy of aluminum and manganese
US3060054A (en) * 1960-09-12 1962-10-23 Gen Electric Method and apparatus for accreting molten material on a moving member
US3561399A (en) * 1964-07-02 1971-02-09 Homer W Giles Metal coating apparatus
US3565677A (en) * 1969-12-17 1971-02-23 Texas Instruments Inc Process of controlling the thickness of aluminum deposited on steel wire by controlling the depth of the bath of molten aluminum
US3707400A (en) * 1970-12-28 1972-12-26 United States Steel Corp Method of gas wiping wire emerging from a hot-dip coating bath

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112318237A (zh) * 2020-10-29 2021-02-05 盐城市科瑞达科技咨询服务有限公司 一种铜线表面防腐处理加工装置
CN115011903A (zh) * 2022-08-09 2022-09-06 苏州科思拓机械科技有限公司 针对光伏焊带生产的智能型镀锡设备

Also Published As

Publication number Publication date
BR7301188D0 (pt) 1973-09-27
FR2172177B1 (de) 1977-02-04
LU67051A1 (de) 1973-08-31
NL7301662A (de) 1973-08-21
GB1394484A (en) 1975-05-14
JPS4893546A (de) 1973-12-04
DE2207719C3 (de) 1974-06-27
SE391953B (sv) 1977-03-07
AR193687A1 (es) 1973-05-11
JPS5216698B2 (de) 1977-05-11
DE2207719B2 (de) 1973-11-22
BE795558A (fr) 1973-08-16
FR2172177A1 (de) 1973-09-28
CH590337A5 (de) 1977-08-15
IT979049B (it) 1974-09-30
DE2207719A1 (de) 1972-08-30

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