Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B19/00—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica
  • B32B19/06—Layered products comprising a layer of natural mineral fibres or particles, e.g. asbestos, mica next to a fibrous or filamentary layer
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
  • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
  • H01B3/04—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances mica
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
  • B32B7/04—Interconnection of layers
  • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
  • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
  • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
  • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
  • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
  • H01B3/48—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials
  • H01B3/50—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials fabric
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
  • B32B2262/10—Inorganic fibres
  • B32B2262/101—Glass fibres
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2305/00—Condition, form or state of the layers or laminate
  • B32B2305/02—Cellular or porous
  • B32B2305/026—Porous
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2307/00—Properties of the layers or laminate
  • B32B2307/30—Properties of the layers or laminate having particular thermal properties
  • B32B2307/304—Insulating
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
  • B32B2315/10—Mica
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
  • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
  • Y10T442/3927—Including a paper or wood pulp layer
  • Y10T442/3935—Mica paper layer
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
  • Y10T442/50—FELT FABRIC
  • Y10T442/56—From synthetic organic fiber
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
  • Y10T442/50—FELT FABRIC
  • Y10T442/59—At least three layers

Definitions

• ABSTRACT The present invention relates to a lapping tape for insulating electrical machinery by impregnation comprising a porous substrate material, mica paper, and an adhesive, characterized in that the combined adhesive and curing accelerator for the subsequently added impregnating resin is an oxyamino resin having the formula:
• Lapping tapes comprise a substrate, e.g. a glass silk fabric having adensity of approximately 25 glm or a mattof glass-orsynthetic fibres, and Mayer of mica.
• the .purposeof'the substrate is to provide the composite materialwiththe necessary mechanical strengthhTo enable the material to be handled, however, the substrate and the mica must be stuck together by an adhesive. For thisprocedure tobe satisfactory, the starting materials must meet the following requirements.
• the tapemust be mechanically strong and able to withstand mechanical lapping, yet it must be substantially adhesive free so that the-resincan impregnate the lapping thoroughly.
• these two requirements are contradictory, for the mechanical strength of a lapping 'tape is greatr in proportion as the bond provided between the substrateand the mica by a flexibleadhesive is greater, yet'the adhesive is'a hindrance to subsequent impregnation.
• Endeavorsrare thereforernade for the sticking of the substrate to themica to be as faras possible on a spot basis.
• mica paper because of the poor tensile strength of the mica paper, are a composite product consisting of mica paper and a high tensile heat-resistantfabric (glass fabric or synthetic fibres) must meetzthe following requirements:
• the adhesive mustbe compatible with the impregnating resin which will-be used subsequently.
• the impregnating resin must meet a number of requirements:
• the resin must wet the mica insulation satisfactorily: 2. the viscosity must be low and, if at all possible, be less than 300 cP at the impregnating temperature;
• the resin must be sufficiently heat-resistant for the lapping to be used at the usual operating temperatures (class F, 155 C). The resin must therefore not soften appreciably at such temperature and it must lose little, if any, weight at this temperature in continuous operation.
• accelerator for systems of this kind there can be considered metal naphth-enates and octoates, e.g. cobalt or zinc naphthenate or octoate, tertiary amines, such as e.g. benzyldimethylamine, dimethylaminomethylphenol 2, 4, 6-tri (dimethylaminoethyl) phenol or tri (methoxycarbonylethyl) amine, and boron fluorideamine complexes, e.g. boron fluoride ethylamine or piperidine or pyridine.
• metal naphth-enates and octoates e.g. cobalt or zinc naphthenate or octoate
• tertiary amines such as e.g. benzyldimethylamine, dimethylaminomethylphenol 2, 4, 6-tri (dimethylaminoethyl) phenol or tri (methoxycarbonylethyl) amine
• 1,162,898 and 1,219,554 disclose a 6
• the impregnating resin .besideshaving all the required insulating properties, must have a low enough viscosity to 'enter'the porous insulation and stick it to process for dipping the rolls of tape before lapping into accelerator solution and drying them.
• the impregnating resin in the tape contacts theaccelerator and it is considered thatreaction acceleration occurs substantially locallyin the lapping; Since the substances concerned are low-molecular substances, some of them are dissolved out of the impregnating resin and therefore reach the resin supply. Consequently, the acceleration acts in the supply too, more particularly because the resin is at a temperature of from about 50 to 60 C during impregnation.
• the novel adhesive comprises an oxyamino resin which has the formula and which is prepared by quantitively reacting an epoxy resin having the formula 11, a melting point above 50 C (to ASTM E 28) and at least two ethylene oxide groups per molecule, with a secondary amine having the formula 111:
• R, and R each denote a straight-chain alkyl group having up to four carbon atoms or together denote a lower alkylene group which can be interrupted by a heteroatom.
• the reaction must be quantitative; if it is not, the tertiary amine groups involved initiate the reaction of the ethylene oxide groups remaining in the molecule and the adhesive is unstable.
• the novolak kinds of epoxy resin are very suitable, as are the kinds on a base of bisphenol or heterocyclene; cycloaliphatic resins, however are less satisfactory.
• Epoxy novolaks have the following basic structure:
• a glass-silk fabric or a felt of glass fibers or synthetic fibers makes a particularly good porous substrate material.
• the adhesive and accelerator can be prepared e.g. as
• the starting resins used are those having a relatively high melting point.
• appropriate amines having straight-chain alkyl groups and of appropriate cyclic amines are dimethylamine, diethylamine, di-nproplyamine, pyrrolidine, piperidine, morpholine, thiomorpholine and so on.
• steric effects preclude or limit the accelerator effect. For practical reasons the reaction with diethylarnine is preferred.
• the reaction with the amine proceeds in a solvent, the amine being introduced in a melting point of 70 C and an epoxy equivalent of 580 are dissolved in 500 g of toluene at 100 C.
• 102 g of diethylamine are added and the solution is reacted for 3 hours with reflux and without heating, whereafter a distillation top is connected and the temperature is increased slowly to C, surplus diethylamine and toluene being removed by distillation, whereafter the mixture is maintained in vacuo at the same temperature until distillation ceases.
• No epoxy products can be detected in the resulting product, whose melting point is 70 C.
• the resin is dissolved in p y ,3; a an" an appropriate solvent, e.g. a ketone or an aromatic hyor 2h. 0 24 h. 3 y drocarbon or mixtures thereof, and applied to the sub- Comm] (a) 323%; is f 8852; strate material, e.g. a thin glass cloth.
• the concentra- With tape tion of the solution is so adjusted in dependence upon 3 930 cps 022 cps rm cps 960 cps the particular applicator device used that approxiwith tape mately'. from 2 to 20 g of resin per square metre of sur- P y face are applied.
• the Same can be Stored in the impregnating tank with that the adhesive contained in the tape according to the out accelerator and therefore has a much longer life 'hvehtloh greatly reduces the gelhhg thhe of the Same than previously yet the impregnated cures very resin/Curing agent mixture as was used in the previous rapidly in the oven due to the action of the accelerator experiments at elevated temperathi'e, the Selling time present in the adhesive in the tapev Since the accelerabelhg determined at C and C in a thermostatt t i i lik it i t h d out d i i The term gelling time" is to be understood as denoting nation even at temperatures as high as from 50 to 60 the period between the instant of time at which the C, whereas metal salts enter the impregnating resin in 40 resin curing agent accelerator mixture Comes to the resimilar conditions and shorten its durability.
• accelerator amine (min.) 0.25% 0.5% 1% 0.25% 0.5% 1% 0.25% 0.5% 1% 0.25% 0.5% 1% Not measurable 60 46 2s 18 54 35 28 3 3 3 4to5hours 35 16 9 5 17% 11% 7% 2 7 2 2
• Table II shows, the accleration provided by the new adhesive is even more striking than an accelerator frequently recommended in practical use for resin/curing agent systems of the kind specified.
• statically controlled temperature of 50 C and over. a period of time samples were taken and its viscosity at 20C checked.
• the invention therefore provides a considerable technical advance:
• the new lapping tape enables the impregnating process to be carried out without the tape having to be given further treatment for the provision of an accelerator, for the adhesive and the accelerator a the a P es"? in this ivvsm smym V.
• the adhesive used for the tape greatly accelerates the curing of the solvent-free resin used for impregnation.
• the impregnating resins used can be slow-curing resin systems which can be stored cold substantially without change and whose viscosity rises little even at the impregnating temperature.
• a lapping tape for use in insulating electrical machinery after impregnation comprising a porous substrate material, mica paper and an adhesive to bind the mica to the porous substrate, characterized in the use of a material which serves as a combined adhesive and a curing accelerator for a subsequently added impregnating resin, said material being an oxyamino resin having the formula:
• a tape according to claim 1 characterised in that the porous substrate is a glass silk fabric or a felt of glass or synthetic fibres.
• a tape according to claim 1 characterised in that the oxyamino resin used as a combinedadhesive and accelerator is derived from an epoxy resin of the novolak kind or from an epoxy resin on a bisphenol or heterocyclene base.
• a tape according to claim 1 characterised in that R and R each denote an ethyl group in the formula for the oxyamino resin.
• a process for preparing a lapping tape for use in insulating electrical machinery after impregnation comprising a porous substrate material, mica paper and an adhesive to bind the mica to the porous substrate; characterized in the use of a material which serves as a combined adhesive and a curing accelerator for a subsequently added impregnating resin, said material being an oxyamino resin having the formula:
• the oxyamino resin being prepared by quantitative reaction of an epoxy resin having a melting point above 50 C (to ASTM E 28) and having at least two ethylene oxidegroups per molecule with a secondary amine having the formula:
• said lapping tape being prepared by dissolving the oxyamino resin in an organic solvent at a concentration which allows forthe application of approximately 2 to 20 grams of resin per square meter of surface of the porous substrate, applying the resin to the porous substrate material, sticking the so treated porous substrate nica paper and cutting the resulting material into tape or strip form.

Landscapes

• Physics & Mathematics (AREA)
• Spectroscopy & Molecular Physics (AREA)
• Chemical & Material Sciences (AREA)
• Inorganic Chemistry (AREA)
• Reinforced Plastic Materials (AREA)
• Insulating Bodies (AREA)
• Insulation, Fastening Of Motor, Generator Windings (AREA)
• Organic Insulating Materials (AREA)
• Epoxy Resins (AREA)

Applications Claiming Priority (1)

Publications (1)

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Family Applications (1)

Country Status (19)

Cited By (6)

Families Citing this family (8)

Citations (3)

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• 1971
  • 1971-04-08 CH CH547001D patent/CH547001A/xx not_active IP Right Cessation
• 1972
  • 1972-03-28 NO NO107672A patent/NO130522C/no unknown
  • 1972-03-29 DE DE19722215206 patent/DE2215206B2/de active Granted
  • 1972-04-04 ZA ZA722241A patent/ZA722241B/xx unknown
  • 1972-04-05 GB GB1569872A patent/GB1383191A/en not_active Expired
  • 1972-04-05 FR FR7211882A patent/FR2132688B1/fr not_active Expired
  • 1972-04-05 HU HUHE000384 patent/HU166501B/hu unknown
  • 1972-04-06 YU YU93372A patent/YU34782B/xx unknown
  • 1972-04-06 CA CA139,041A patent/CA966017A/en not_active Expired
  • 1972-04-07 BE BE781814A patent/BE781814A/fr not_active IP Right Cessation
  • 1972-04-07 IT IT6808072A patent/IT954621B/it active
  • 1972-04-07 CS CS233772A patent/CS174831B2/cs unknown
  • 1972-04-07 NL NL7204712A patent/NL154858B/xx not_active IP Right Cessation
  • 1972-04-07 US US24222972 patent/US3808086A/en not_active Expired - Lifetime
  • 1972-04-07 DD DD16213772A patent/DD97085A5/xx unknown
  • 1972-04-07 SE SE452872A patent/SE389757B/xx unknown
  • 1972-04-07 FI FI979/72A patent/FI58227C/fi active
  • 1972-04-08 ES ES401619A patent/ES401619A1/es not_active Expired
  • 1972-04-08 JP JP3567472A patent/JPS5524213B1/ja active Pending

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