US3749649A - Bright tin-lead alloy plating - Google Patents
Bright tin-lead alloy plating Download PDFInfo
- Publication number
- US3749649A US3749649A US00208885A US3749649DA US3749649A US 3749649 A US3749649 A US 3749649A US 00208885 A US00208885 A US 00208885A US 3749649D A US3749649D A US 3749649DA US 3749649 A US3749649 A US 3749649A
- Authority
- US
- United States
- Prior art keywords
- tin
- lead
- exhibiting
- aromatic aldehyde
- bath
- Prior art date
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- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 title abstract description 34
- 229910001174 tin-lead alloy Inorganic materials 0.000 title abstract description 26
- 150000001875 compounds Chemical class 0.000 abstract description 50
- 239000000203 mixture Substances 0.000 abstract description 35
- 150000003934 aromatic aldehydes Chemical class 0.000 abstract description 33
- 230000001747 exhibiting effect Effects 0.000 abstract description 32
- 229920000570 polyether Polymers 0.000 abstract description 31
- 239000004094 surface-active agent Substances 0.000 abstract description 30
- 238000000034 method Methods 0.000 abstract description 29
- 239000004721 Polyphenylene oxide Substances 0.000 abstract description 28
- 125000001309 chloro group Chemical group Cl* 0.000 abstract description 28
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 abstract description 24
- 239000003963 antioxidant agent Substances 0.000 abstract description 20
- 235000006708 antioxidants Nutrition 0.000 abstract description 20
- 230000003078 antioxidant effect Effects 0.000 abstract description 19
- 238000004070 electrodeposition Methods 0.000 abstract description 10
- 229910045601 alloy Inorganic materials 0.000 abstract description 8
- 239000000956 alloy Substances 0.000 abstract description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 8
- 239000001301 oxygen Substances 0.000 abstract description 8
- 229910052760 oxygen Inorganic materials 0.000 abstract description 8
- 239000011133 lead Substances 0.000 description 48
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 29
- 125000004432 carbon atom Chemical group C* 0.000 description 27
- 239000001257 hydrogen Substances 0.000 description 27
- 229910052739 hydrogen Inorganic materials 0.000 description 27
- 239000011135 tin Substances 0.000 description 25
- 229910052718 tin Inorganic materials 0.000 description 22
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 19
- 150000003839 salts Chemical class 0.000 description 17
- 239000000654 additive Substances 0.000 description 16
- 238000012360 testing method Methods 0.000 description 14
- 150000001768 cations Chemical class 0.000 description 13
- 229910052700 potassium Inorganic materials 0.000 description 13
- 229910052708 sodium Inorganic materials 0.000 description 13
- 239000011734 sodium Substances 0.000 description 13
- 125000003118 aryl group Chemical group 0.000 description 12
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical class OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 11
- 125000000217 alkyl group Polymers 0.000 description 11
- 229910052792 caesium Inorganic materials 0.000 description 11
- 229910000978 Pb alloy Inorganic materials 0.000 description 10
- 229910001128 Sn alloy Inorganic materials 0.000 description 10
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 10
- 230000002378 acidificating effect Effects 0.000 description 8
- 125000001931 aliphatic group Chemical group 0.000 description 8
- 239000002659 electrodeposit Substances 0.000 description 8
- 239000000370 acceptor Substances 0.000 description 7
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 7
- 239000004327 boric acid Substances 0.000 description 7
- 238000005868 electrolysis reaction Methods 0.000 description 7
- 229960004337 hydroquinone Drugs 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- -1 alkyl phenol Chemical compound 0.000 description 6
- 150000002431 hydrogen Chemical group 0.000 description 6
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical class OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 6
- FPYUJUBAXZAQNL-UHFFFAOYSA-N 2-chlorobenzaldehyde Chemical compound ClC1=CC=CC=C1C=O FPYUJUBAXZAQNL-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 239000002932 luster Substances 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 239000011550 stock solution Substances 0.000 description 5
- LCALOJSQZMSPHJ-QMMMGPOBSA-N (2s)-2-amino-3-cyclohexa-1,5-dien-1-ylpropanoic acid Chemical compound OC(=O)[C@@H](N)CC1=CCCC=C1 LCALOJSQZMSPHJ-QMMMGPOBSA-N 0.000 description 4
- 238000007792 addition Methods 0.000 description 4
- 238000013019 agitation Methods 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 4
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- DOUHZFSGSXMPIE-UHFFFAOYSA-N hydroxidooxidosulfur(.) Chemical compound [O]SO DOUHZFSGSXMPIE-UHFFFAOYSA-N 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- CHLCPTJLUJHDBO-UHFFFAOYSA-M sodium;benzenesulfinate Chemical compound [Na+].[O-]S(=O)C1=CC=CC=C1 CHLCPTJLUJHDBO-UHFFFAOYSA-M 0.000 description 4
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical group C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 3
- 150000005208 1,4-dihydroxybenzenes Chemical class 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical group OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229940079877 pyrogallol Drugs 0.000 description 3
- 238000010186 staining Methods 0.000 description 3
- DYBIGIADVHIODH-UHFFFAOYSA-N 2-nonylphenol;oxirane Chemical group C1CO1.CCCCCCCCCC1=CC=CC=C1O DYBIGIADVHIODH-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 229910003202 NH4 Inorganic materials 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- 150000001447 alkali salts Chemical class 0.000 description 2
- 239000003125 aqueous solvent Substances 0.000 description 2
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 230000010494 opalescence Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 229910052701 rubidium Inorganic materials 0.000 description 2
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 2
- 239000010802 sludge Substances 0.000 description 2
- GPRLSGONYQIRFK-MNYXATJNSA-N triton Chemical compound [3H+] GPRLSGONYQIRFK-MNYXATJNSA-N 0.000 description 2
- DMIYKWPEFRFTPY-UHFFFAOYSA-N 2,6-dichlorobenzaldehyde Chemical compound ClC1=CC=CC(Cl)=C1C=O DMIYKWPEFRFTPY-UHFFFAOYSA-N 0.000 description 1
- SRWILAKSARHZPR-UHFFFAOYSA-N 3-chlorobenzaldehyde Chemical class ClC1=CC=CC(C=O)=C1 SRWILAKSARHZPR-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- 241000300062 Monsoma Species 0.000 description 1
- 239000001888 Peptone Substances 0.000 description 1
- 108010080698 Peptones Proteins 0.000 description 1
- 229920005372 Plexiglas® Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- AIUDWMLXCFRVDR-UHFFFAOYSA-N dimethyl 2-(3-ethyl-3-methylpentyl)propanedioate Chemical class CCC(C)(CC)CCC(C(=O)OC)C(=O)OC AIUDWMLXCFRVDR-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- RVPVRDXYQKGNMQ-UHFFFAOYSA-N lead(2+) Chemical compound [Pb+2] RVPVRDXYQKGNMQ-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 235000019319 peptone Nutrition 0.000 description 1
- 229940066779 peptones Drugs 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 230000003381 solubilizing effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Definitions
- a preferred aspect of this invention lies in the electrodeposition of tin-lead alloys in the presence of a combination of:
- This invention relates to the electrodeposition of an alloy of tin and lead; plating compositions; plating baths for the electrodeposition of an alloy of tin and lead, and to processes for the electrodeposition of an alloy of tin and lead in the presence of a specific combination of additives. More specifically this invention provides as a novel combination of additives for electrodepositing an alloy having about 60% tin and about 40% lead from baths containing a water soluble stannous salt and a water soluble lead salt, at least one polyether surfactant, and at least one aromatic aldehyde exhibiting at least one chloro substituent or at least one compound producing an aromatic aldehyde exhibiting at least one chloro substituent.
- solder-plate tin-lead alloy containing about 60% tin and about 40% lead by weight, commonly known as solder-plate, obtained by electrodeposition from a stannous fluoboratelead fluoborate system, has had extensive application for many years. Some of its applications have been the following:
- the alloy has been generally plated from a fiuoborate system utilizing certain additives, usually of organic nature such as peptones and animal glue, to give continuity of deposit, to refine the crystalline structure, and to eliminate the tendency toward loosely adherent, dendritic deposit growth.
- certain additives usually of organic nature such as peptones and animal glue
- the prior art deposits have been generally dull with a dark cast.
- the low current density coverage and throwing power also have been Patented July 31, 1973 generally poor which may be a serious disadvantage particularly in printed circuitry through-hole plating.
- Another disadvantage of prior art deposits has been tendency toward staining, finger-marking on handling, and decreased solderability on storage.
- This invention relates to a process of producing lustrous, continuous, ductile, fine-grained tin-lead alloy electrodeposits which comprises passing current from an anode to a metal cathode through an aqueous bath composition containing at least one water soluble stannous salt, at least one water soluble lead salt, fiuo'boric acid, boric acid, at least one polyether surfactant, and at least one aromatic aldehyde exhibiting at least one chloro substituent or at least one compound producing an aromatic aldehyde exhibiting at least one chloro substituent.
- compositions and methods herein are applicable to barrel, rack and wire electroplating processes.
- concentrations of tin and lead may be varied generally within the limits conventional in this art.
- baths with a stannous tin ion content of 5 to 55 g./l. and a lead ion content of 20 to 30 g./l. may be utilized with the additives of the invention herein.
- Type A polyether surfactants operable in the practice of this invention are polyether surfactants which may include aromatic polyethers and aliphatic polyethers.
- the wetting agent is a polyalkoxylated alkyl phenol.
- Typical polyalkoxylated alkyl phenols include polyethoxylated alkyl phenols having the formulae:
- R represents an alkyl group of from 4 to 18 carbon atoms
- R is an aliphatic radical containing 8 to 20 carbon atoms
- m is an integer of at least 4 and no more than 100
- X is selected from the group consisting of hydrogen, $0 M, and PO M where M is selected from the group consisting of sodium, potassium, ammonium, magnesium, lead, tin, calcium, rubidium, cesium, or any other bath-compatible cation.
- R R R and R represent a straight or branched chain alkyl group exhibiting 8 to 18 carbon atoms
- n is an integer of at least 4 and no more than 100
- X is selected from the group consisting of hydrogen, $0 M, P0 M where M is selected from the group consisting of sodium, potassium, ammonium, magnesium, lead, tin, calcium, rubidium, cesium, or any other bath-compatible cation.
- Polyether surfactants are employed singly in amounts of about 1 g./l. to 10 g./l., and in combination from 10 g./l. to 20 g./l.
- Typical specific compounds are the following with their concentration ranges varying singly from 1 g./l. to 10 g./l. and in combination from 10 g./l. to 20 g./l.:
- Nonyl O (CHzCH2 )l5H (sold as Tergitol Non-Ionic NP-35) l i R:
- CHO o-Chlorobenzaldehyda (a preferred compound because of its cost being relatively low and its easy availability) CHO Cl- 01 2,d-diehlorobenzaldehyde CHO -Cl 2,4-diel1lorobenzaldehyde 01 3,4-dlchlorobenzaldehydo C1 m-Chlorobenzaldehyde
- Compounds which are effective due to the release of a chlorinated aromatic aldehyde on being added to the plating bath are the following structural configurations:
- R is an aromatic moiety such as phenyl containing 1 or 2 chloro groups directly bonded to the aromatic ring.
- Compounds of Type B may be used in the form of stock solutions in appropriate organic solvents (methanol, ethanol, isopropanol, acetone, etc.) or in mixtures of organic solvents (such as methanol plus water plus compounds of Type A, the latter imparting appreciable solubilizing action).
- appropriate organic solvents methanol, ethanol, isopropanol, acetone, etc.
- mixtures of organic solvents such as methanol plus water plus compounds of Type A, the latter imparting appreciable solubilizing action.
- this invention relates to an electroplating bath for the electrodeposition of an alloy of tin and lead containing a water soluble stannous salt, a water soluble lead salt, and containing as cooperating additives:
- At least one aliphatic amine or a compound producing an aliphatic amine At least one aliphatic amine or a compound producing an aliphatic amine.
- Type C compounds which are aliphatic amines or compounds which liberate aliphatic amines on addition to the electroplating bath are of the formulae:
- the aliphatic amine or aliphatic amine producing compounds are used in concentrations ranging from 0.25 g./l. to 5 g./l. depending on their degree of bath solubility. They may be used in the form of aqueous or organic solvent stock solutions or in mixtures of water and organic solvents.
- a plating bath of the fluoborate type which may be used in the practice of this invention may consist of the following basic ingredients:
- stannous fluoborate Sn(BF lead fluoborate [Pb(BF fluoboric acid [HBF boric acid [H BO
- the stannous fluoborate is usually added as an aqueous concentrate containing typically 49.6% by weight of Sn(BF having a specific gravity of 1.60.
- the lead fluoborate is usually added as an aqueous concentrate containing typically 50% by weight of Pb(BF having a Range, g./l. Preferred, g./l.
- Anodes generally consist of a cast or extruded tinlead alloy containing 60% tin and 40% lead. In order to more consistently obtain an alloy composition at the cathode close to 6040, the following operating conditions are generally used:
- Increasing the cathode current density over 3.0 a.s.d. will tend to increase the tin content of the deposit while decreasing the cathode current density below 3.0 a.s.d. will tend to decrease the tin content of the deposit.
- a tin content of 60:10% by weight and a lead content of 40- :10% by weight are generally acceptable and this means that some variation in tin and lead concentrations and in cathode current density may be tolerated.
- This invention also lies in the adddition of an anti oxidant or oxygen acceptor for substantially decreased tendency toward formation of precipitates of stannic basic salts.
- Operable anti-oxidants or oxygen acceptors include hydroquinone or substituted hydroquinone, pyrocatechol, pyrogallol, catechol, and aromatic sulfinates such as sodium benzene monosulfinate.
- These compounds may be used singly or in combination in concentrations of about 0.5 g./l. to 5 g./l. depending on their bath solubility. They may be used in the form of aqueous or organic solvent stock solutions or they may be added directly to the plating bath with stirring to facilitate solution.
- this invention is an aqueous solution for electrodepositing a bright, sound, smooth ductile alloy of tin and lead having about 60% tin and 40% lead comprising: 110 g./l. to 135 g./l. of stannous fluoborate; 37 g./l. to 55 g./l. of lead fluoborate; 100' g./l. to 200 g./l. of fluoboric acid; 10 g./l. to 40 g./l. of boric acid; and as a novel additive system:
- R is an aliphatic alcohol moiety R'O-- where R is an aliphatic radical containing 4 to 18 carbon atoms or an aromatic alcohol moiety where R" is an aliphatic radical containing 8 to 20 carbon atoms;
- R is a branched or straight chain aliphatic group having 8 to 18 carbon atoms
- n is an integer of 4 to 100
- X is hydrogen, $0 M, or PO M
- M is hydrogen or a bath-compatible cation such as Na, K, N-H Mg, Pb Sn Ca Cs, or Rb;
- the preferred operating conditions such as pH, temperature, and current density may vary depending upon the particular bath composition and the nature of the article receiving the layer of tin-lead alloy electrodeposit. In general, good tin-lead alloy electrodeposits may be obtained within a specific range of operating conditions.
- the tin-lead alloy electroplating processes using the compositions of the invention may be carried out at temperatures of about 10 C.-60 C. (preferably 15 C.-20 C.) either with or without agitation.
- the temperature of the plating solution is usually the ambient temperature, say 35 C. or below, with lower temperatures giving optimum results, such as 15 C.20 C.
- tin-lead alloy electrodeposits having average thicknesses of 0.25-25 microns may be obtained using plating times which may average 0.1- minutes.
- the parts may be plated on racks, i.e. on fixtures holding single or multiple parts which may all be the same or which may be different in size, geometrical configuration, etc.
- Parts may also be plated in bulk in rotating barrels and in this type of plating, usually used for plating of smaller parts which lend themselves to tumbling action, the barrel loads usually consist of the same part although mixed loads are sometimes plated.
- the plating bath be so formulated as to provide the widest possible bright plate current density range.
- the limiting current density i.e. the current density at which the deposit ceases to be sound in structure and appearance, be as high as possible to allow for the wide variations in cathode current density which may be encountered due to the size and shape complexity of parts.
- Anode slab of Sn-Pb alloy (60% Sn and 40% Pb by weight)
- Cathode polished brass 10 cm. x 7.5 cm. x 1 mm. with 5 cm. immersed Cell current: 1 ampere (0 to 7 a.s.d. range)
- Anode slab of Sn-Pb cast alloy (60% Sn and 40% 'Pb by weight) 9 cm. wide, 1 cm. thick, 20.5 cm. immersed in plating bath
- Cathode polished brass 20.4 cm. long, 2.54 cm. wide, 0.5 mm. thick immersed to depth of 18 cm.maintained parallel to the anode at a distance of about 10 cm.- bottom of cathode bent to give an internal angle of 45 facing anode Agitation: moving cathode bar-length of stroke 8 cm.
- Solution volume 4 liters-cooled to compensate for heating effects of current by immersing in solution plastic cooling coils through which cold water circulated to maintain temperature at about 25 C.
- Cell polyethylene plastic Load: steel nails about 5 cm. long with a total load area of about 930 square cm.
- G./l. Stannous tin 52 Lead 30 Free fiuoboric acid 100 Boric acid 25 To 267 ml. of the above stock solution, there were added the equivalent of G./l. Tergitol Non-Ionic NP-35 l0 Triton QS-IS l0 o-Chlorbenzaldehyde 0.4
- Example 1 was repeated using 0.4 g./l. of 2,6-dichlorobenzaldehyde in place of the o-chlorobenzaldehyde with essentially the same results obtained.
- Example 1 was repeated using 0.4 g./l. of mi-chlorobenzaldehyde in place of the o-chlorobenzaldehyde with essentially the same results obtained.
- EXAMPLE 4 A barrel plating test was run using the barrel plating conditions outlined in the above and using a cell current of amperes for 30 minutes to give an average cathode current density of about 2 a.s.d. After plating the load of nails was rinsed and dried, and they had a beautifully lustrous and uniform appearance. On testing representative nails from the load the deposit ductility and adhesion to the basis metal was excellent. Because of the tumbling and some burnishing action no indication was 0btained of any of the striation or ribbing effect indicated by the Hull Cell tests of Examples 1 to 3, inclusive.
- the life test was continued for a total electrolysis time of about 300 ampere-hours with variations of current from 5 to 25 amperes per load and with times ranging from 15 minutes to 1 hour. Periodic replenishment of o-chlorobenzaldehyde easily maintained deposit luster with replenishment additions made on the basis of deposit appearance. Solderability tests were made on representative samples from a number of loads and the Solderability was found to be excellent.
- Example 5 was repeated using 2 g./l. octylamine in place of the laurylamine, with the same results obtained.
- a brass cathode was plated for 15 minutes at 3 amperes to give an average cathode current density of about 3 a.s.d.
- the deposit was uniformly lustrous, ductile, and free of striations or ribbing.
- the deposit also exhibited a remarkable degree of leveling as evidenced by the degree of obliteration of basis metal defects (pits, minor scratches, etc.) and the extraordinary smoothening of the rough sheared edges of the cathode.
- EXAMPLE 8 The Life Test of Example 7 was repeated using a freshly prepared bath but in addition adding as an anti-oxidant 1.5 g./l. hydroquinone. Excellent results were obtained as in Example 7 but after an electrolysis time of well over ampere-hours the solution remained perfectly clear and free of any opalescence or any precipitate.
- Example 9 The Life Test of Example 7 was repeated using a freshly prepared bath but in addition adding as an antioxidant 0.2 g./l. of sodium benzene monosulfinate. Excellent results were obtained as in Example 7 but after an electrolysis time of well over 100 ampere-hours the solution remained perfectly clear and free of any opalescence or any precipitate.
- a process for electrodepositing a bright, sound, smooth, ductile alloy of tin and lead which comprises passing current from an anode to a cathode through an aqueous acidic bath containing at least one water soluble stannous tin salt, at least one water soluble lead salt, and as cooperating additives:
- a process for electrodepositing a bright, sound, smooth, ductile alloy of tin and lead which comprises passing current from an anode to a cathode through an aqueous acidic bath containing at least one Water soluble stannous tin salt, at least one water soluble lead salt, and as cooperating additives:
- a process for electrodepositing a bright, sound, smooth, ductile alloy of tin and lead which comprises passing current from an anode to a cathode through an aqueous acidic bath containing at least one water soluble stannous tin salt, at least one water soluble lead salt, and as cooperating additives:
- At least one polyether surfactant is of the formula where R is an alkyl group of 8 to 20 carbon atoms, n is an integer 4 to 100, and X is selected from the group 10 consisting of hydrogen, $0 M, and PO M where M is hydrogen or a bath-compatible cation comprising Na, K, NH4, Mg, Pbz, S112, C32, CS, 01' Rb.
- At least one surfactant is a nonylphenol-ethylene oxide condensate exhibiting about 15 ethylene oxide groups per molecule.
- At least one polyether surfactant is of the formula wherein R is a branched or straight chain aliphatic radical containing 4 to 18 carbon atoms, n is an integer 4 to 100, and X is selected from the group consisting of hydrogen, $0 M, and PO M where M is hydrogen or a bath-compatible cation comprising Na, K, NH Mg, Pbg, Sn Ca Cs, or Rb.
- At least one polyether surfactant is of the formula where R" is a branched or straight chain aliphatic group of 8 to 18 carbon atoms, n is an integer 4 to 100, and X is selected from the group consisting of hydrogen, SO M, and PO M where M is hydrogen or a bath-compatible cation comprising Na, K, NH Mg, Pb Sn Ca Cs, or Rb.
- said polyether surfactant is of the formula R1 Rro-Nmo monsoma 1' where R R and R each exhibit 12 to 14 carbon atoms and n is about 15.
- a process for electrodepositing a bright, sound, smooth, ductile alloy of tin and lead which comprises passing current from an anode to a cathode through an aqueous acidic bath containing at least one water soluble stannous tin salt, at least one Water soluble lead salt, and as cooperating additives:
- a process for electrodepositing a bright, sound, smooth, ductile alloy of tin and lead having about 60% tin and about 40% lead comprising passing current from an anode to a cathode through an aqueous acidic bath containing 110 g./l. to 135 g./l. of stannous fiuoborate; 37 g./l. to 55 g./l. of lead fiuoborate; 100 g,/l. to 290 g./l. of fluoboric acid; 10 g./l. to 40 g./l. of boric acid; and as a novel additive system:
- NH(CH2CHZO)n X where R is a branched or straight chain aliphatic group having 8 to 18 carbon atoms, n is an integer of 4 to 100, and X is hydrogen, M, or PO M where M is hydrogen or a bath-compatible cation comprising Na, K, NH Mg, Pb Sn Ca Cs, or Rb;
- n 1 or 2;
- a composition for producing bright, sound, smooth, ductile tin-lead alloy electrodeposits which comprises an aqueous acidic bath composition containing at least one water soluble stannous tin salt, at least one water soluble lead salt, and as cooperating additives:
- ductile tin-lead alloy electrodeposits which comprises an aqueous acidic bath composition containing at least one water soluble stannous tin salt, at least one water soluble lead salt, and as cooperating additives:
- a composition for producing bright, sound, smooth, ductile tin-lead alloy electrodeposits which comprises an aqueous plating bath containing at least one water soluble stannous tin salt, at least one water soluble lead salt, and as cooperating additives:
- composition of claim 25 wherein said aromatic aldehyde produced is of the formula CHO where n is l to 2.
- composition of claim 26 wherein at least one surfactant is a nonylphenol-ethylene oxide condensate exhibiting about 15 ethylene oxide groups per molecule.
- composition of claim 28 wherein said polyether surfactant is of the formula R1 Rg+NH(CgH40), S OaNa Rs wherein R R and R each exhibit 12 to 14 carbon atoms and n is about 15.
- composition of claim 25 wherein at least one polyether surfactant is of the formula wherein R is a branched or straight chain aliphatic radical containing 4 to 1-8 carbon atoms, n is an integer 4 to 100, and X is selected from the group consisting of hydrogen, $0 M, and PO M where M is hydrogen or a bath-compatible cation comprising Na, K, NH Mg, Pb ,Sn Ca Cs, or Rb.
- composition of claim 25 wherein at least one polyether surfactant is of the formula wherein R is an alkyl group of 8 to 20 carbon atoms, n is an integer 4 to 100, and X is selected from the 3 group consisting of hydrogen, 80 M, and P M where M is hydrogen or a bath-compatible cation comprising Na, K, NH4, Mg, Pbg, Sbg, C32, CS, or Rb.
- composition of claim 26 wherein at least one polyether surfactant is of the formula where R is a branched or straight chain aliphatic group of 8 to 18 carbon atoms, n is an integer 4 to 100, and X is selected from the group consisting of hydrogen, $0 M, and PO M where M is hydrogen or a bath-compatible cation comprising Na, K, NH Mg, Pb Sn Ca Cs, or Rb.
- composition of claim 25 wherein said tin-lead alloy is about 60% tin and about 40% lead.
- composition of claim 25 wherein said aliphatic amine is laurylamine.
- composition of claim 25 wherein said aliphatic amine is octylamine.
- a composition for producing bright, sound, smooth, ductile tin-lead alloy electrodeposits which comprises an aqueous acidic plating bath containing at least one water soluble stannous tin salt, at least one water soluble lead salt, and as cooperating additives:
- composition of claim 37 wherein said antioxidant compound is an aromatic sulfinate.
- composition of claim 38 wherein said aromatic sulfinate is sodium benzene monosulfinate.
- composition of claim 37 wherein said antioxidant compound is hydroquinone or substituted hydroquinone.
- composition of claim 37 wherein said antioxidant compound is pyrocatechol.
- composition of claim 37 wherein said antioxidant compound is catechol.
- composition of claim 37 wherein said antioxidant compound is pyrogallol.
- R is an aliphatic alcohol moiety R'O- where R is an aliphatic radical containing 4 to 18 carbon atoms or an aromatic alcohol moiety where R" is an aliphatic radical containing 8 to 20 carbon atoms;
- R is a branched or straight chain aliphatic group having 8 to 18 carbon atoms, n is an integer of 4 to 100, and X is hydrogen, $0 M, or PO M where M is hydrogen or a bath compatible cation comprising Na, K, NH Mg, Pb Sn Ca Cs, or Rb;
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US20888571A | 1971-12-16 | 1971-12-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
US3749649A true US3749649A (en) | 1973-07-31 |
Family
ID=22776434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US00208885A Expired - Lifetime US3749649A (en) | 1971-12-16 | 1971-12-16 | Bright tin-lead alloy plating |
Country Status (8)
Country | Link |
---|---|
US (1) | US3749649A (enrdf_load_stackoverflow) |
JP (1) | JPS5629758B2 (enrdf_load_stackoverflow) |
CA (1) | CA1115654A (enrdf_load_stackoverflow) |
DE (1) | DE2256845A1 (enrdf_load_stackoverflow) |
FR (1) | FR2163453B1 (enrdf_load_stackoverflow) |
GB (1) | GB1408148A (enrdf_load_stackoverflow) |
IT (1) | IT970627B (enrdf_load_stackoverflow) |
NL (1) | NL7217115A (enrdf_load_stackoverflow) |
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3850765A (en) * | 1973-05-21 | 1974-11-26 | Oxy Metal Finishing Corp | Bright solder plating |
US3954573A (en) * | 1973-10-18 | 1976-05-04 | Berol Kemi Ab | Compositions and process for the electroplating of metal or metal alloy coatings of high brightness on a base surface |
US4135991A (en) * | 1977-08-12 | 1979-01-23 | R. O. Hull & Company, Inc. | Bath and method for electroplating tin and/or lead |
US4263106A (en) * | 1979-12-31 | 1981-04-21 | Bell Telephone Laboratories, Incorporated | Solder plating process |
US4347107A (en) * | 1981-04-02 | 1982-08-31 | Hooker Chemicals & Plastics Corp. | Electroplating tin and tin alloys and baths therefor |
US4376018A (en) * | 1979-12-31 | 1983-03-08 | Bell Telephone Laboratories, Incorporated | Electrodeposition of nickel |
US4377448A (en) * | 1979-12-31 | 1983-03-22 | Bell Telephone Laboratories, Incorporated | Electrolytic gold plating |
US4377449A (en) * | 1979-12-31 | 1983-03-22 | Bell Telephone Laboratories, Incorporated | Electrolytic silver plating |
DE3228911A1 (de) * | 1981-09-08 | 1983-03-24 | Occidental Chemical Corp., 48089 Warren, Mich. | Bad fuer die galvanische abscheidung einer zinn-blei-legierung |
US4379738A (en) * | 1979-12-31 | 1983-04-12 | Bell Telephone Laboratories, Incorporated | Electroplating zinc |
US4701244A (en) * | 1983-12-22 | 1987-10-20 | Learonal, Inc. | Bath and process for electroplating tin, lead and tin/alloys |
US4717460A (en) * | 1983-12-22 | 1988-01-05 | Learonal, Inc. | Tin lead electroplating solutions |
US4832460A (en) * | 1984-07-27 | 1989-05-23 | Casio Computer Co., Ltd. | Liquid crystal apparatus having pressure absorbing means |
US4871429A (en) * | 1981-09-11 | 1989-10-03 | Learonal, Inc | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
US4880507A (en) * | 1987-12-10 | 1989-11-14 | Learonal, Inc. | Tin, lead or tin/lead alloy electrolytes for high speed electroplating |
US5066367A (en) * | 1981-09-11 | 1991-11-19 | Learonal Inc. | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
US5094726A (en) * | 1981-09-11 | 1992-03-10 | Learonal, Inc. | Limiting tin sludge formation in tin or tin-lead electroplating solutions |
US5118394A (en) * | 1989-12-05 | 1992-06-02 | Murata Manufacturing Co., Ltd. | Electroplating bath containing citric acid or citrate for tin or tin alloy plating |
US5174887A (en) * | 1987-12-10 | 1992-12-29 | Learonal, Inc. | High speed electroplating of tinplate |
US5190486A (en) * | 1991-07-22 | 1993-03-02 | Northern Telecom Limited | Selectively plating electrically conductive pin |
US6562221B2 (en) | 2001-09-28 | 2003-05-13 | David Crotty | Process and composition for high speed plating of tin and tin alloys |
US20030226759A1 (en) * | 2002-03-05 | 2003-12-11 | Shipley Company, L.L.C. | Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions |
US20040137246A1 (en) * | 2003-01-10 | 2004-07-15 | Henkel Kommanditgesellschaft Auf Aktien | Coating composition |
US20060172064A1 (en) * | 2003-01-10 | 2006-08-03 | Henkel Kommanditgesellschaft Auf Aktien | Process of coating metals prior to cold forming |
EP1696052A2 (en) | 2005-02-28 | 2006-08-30 | Rohm and Haas Electronic Materials, L.L.C. | Improved acid electrolytes |
US20080057304A1 (en) * | 2003-01-10 | 2008-03-06 | Henkel Kommanditgesellschaft Auf Aktien | Coating composition |
US10273591B2 (en) | 2012-01-20 | 2019-04-30 | Rohm And Haas Electronic Materials Llc | Flux method for tin and tin alloys |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NZ190645A (en) * | 1978-06-16 | 1980-11-14 | M & T Chemicals Inc | Aqueous acid tin plating bath containing 2,5-dimethoxy-benzaldehyde as brightening agent |
JPS61117297A (ja) * | 1984-11-13 | 1986-06-04 | Ebara Yuujiraito Kk | スズ属金属めつき液 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1141284A (en) * | 1965-02-13 | 1969-01-29 | Philips Electronic Associated | Improvements in acid tin electroplating solutions |
FR1539596A (fr) * | 1967-10-06 | 1968-09-13 | Hyogo Prefectural Government | Procédé de revêtement électrolytique par un alliage brillant étain-plomb et nouveaux produits ainsi obtenus |
US3785939A (en) * | 1970-10-22 | 1974-01-15 | Conversion Chem Corp | Tin/lead plating bath and method |
-
1971
- 1971-12-16 US US00208885A patent/US3749649A/en not_active Expired - Lifetime
-
1972
- 1972-11-20 DE DE2256845A patent/DE2256845A1/de not_active Ceased
- 1972-11-22 CA CA157,164A patent/CA1115654A/en not_active Expired
- 1972-11-27 FR FR7242053A patent/FR2163453B1/fr not_active Expired
- 1972-12-11 GB GB5712372A patent/GB1408148A/en not_active Expired
- 1972-12-15 IT IT9792/72A patent/IT970627B/it active
- 1972-12-15 NL NL7217115A patent/NL7217115A/xx not_active Application Discontinuation
- 1972-12-16 JP JP12667572A patent/JPS5629758B2/ja not_active Expired
Cited By (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3850765A (en) * | 1973-05-21 | 1974-11-26 | Oxy Metal Finishing Corp | Bright solder plating |
US3954573A (en) * | 1973-10-18 | 1976-05-04 | Berol Kemi Ab | Compositions and process for the electroplating of metal or metal alloy coatings of high brightness on a base surface |
US4135991A (en) * | 1977-08-12 | 1979-01-23 | R. O. Hull & Company, Inc. | Bath and method for electroplating tin and/or lead |
US4263106A (en) * | 1979-12-31 | 1981-04-21 | Bell Telephone Laboratories, Incorporated | Solder plating process |
US4376018A (en) * | 1979-12-31 | 1983-03-08 | Bell Telephone Laboratories, Incorporated | Electrodeposition of nickel |
US4377448A (en) * | 1979-12-31 | 1983-03-22 | Bell Telephone Laboratories, Incorporated | Electrolytic gold plating |
US4377449A (en) * | 1979-12-31 | 1983-03-22 | Bell Telephone Laboratories, Incorporated | Electrolytic silver plating |
US4379738A (en) * | 1979-12-31 | 1983-04-12 | Bell Telephone Laboratories, Incorporated | Electroplating zinc |
US4347107A (en) * | 1981-04-02 | 1982-08-31 | Hooker Chemicals & Plastics Corp. | Electroplating tin and tin alloys and baths therefor |
DE3228911A1 (de) * | 1981-09-08 | 1983-03-24 | Occidental Chemical Corp., 48089 Warren, Mich. | Bad fuer die galvanische abscheidung einer zinn-blei-legierung |
US5094726A (en) * | 1981-09-11 | 1992-03-10 | Learonal, Inc. | Limiting tin sludge formation in tin or tin-lead electroplating solutions |
US4871429A (en) * | 1981-09-11 | 1989-10-03 | Learonal, Inc | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
US5066367A (en) * | 1981-09-11 | 1991-11-19 | Learonal Inc. | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
US4717460A (en) * | 1983-12-22 | 1988-01-05 | Learonal, Inc. | Tin lead electroplating solutions |
US4701244A (en) * | 1983-12-22 | 1987-10-20 | Learonal, Inc. | Bath and process for electroplating tin, lead and tin/alloys |
US4832460A (en) * | 1984-07-27 | 1989-05-23 | Casio Computer Co., Ltd. | Liquid crystal apparatus having pressure absorbing means |
US4880507A (en) * | 1987-12-10 | 1989-11-14 | Learonal, Inc. | Tin, lead or tin/lead alloy electrolytes for high speed electroplating |
US5174887A (en) * | 1987-12-10 | 1992-12-29 | Learonal, Inc. | High speed electroplating of tinplate |
US5118394A (en) * | 1989-12-05 | 1992-06-02 | Murata Manufacturing Co., Ltd. | Electroplating bath containing citric acid or citrate for tin or tin alloy plating |
US5190486A (en) * | 1991-07-22 | 1993-03-02 | Northern Telecom Limited | Selectively plating electrically conductive pin |
US6562221B2 (en) | 2001-09-28 | 2003-05-13 | David Crotty | Process and composition for high speed plating of tin and tin alloys |
US20030226759A1 (en) * | 2002-03-05 | 2003-12-11 | Shipley Company, L.L.C. | Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions |
US6923899B2 (en) | 2002-03-05 | 2005-08-02 | Shipley Company, L.L.C. | Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions |
US20040137246A1 (en) * | 2003-01-10 | 2004-07-15 | Henkel Kommanditgesellschaft Auf Aktien | Coating composition |
US20050020746A1 (en) * | 2003-01-10 | 2005-01-27 | Fristad William E. | Coating composition |
US7063735B2 (en) * | 2003-01-10 | 2006-06-20 | Henkel Kommanditgesellschaft Auf Aktien | Coating composition |
US20060172064A1 (en) * | 2003-01-10 | 2006-08-03 | Henkel Kommanditgesellschaft Auf Aktien | Process of coating metals prior to cold forming |
US7332021B2 (en) | 2003-01-10 | 2008-02-19 | Henkel Kommanditgesellschaft Auf Aktien | Coating composition |
US20080057304A1 (en) * | 2003-01-10 | 2008-03-06 | Henkel Kommanditgesellschaft Auf Aktien | Coating composition |
US7887938B2 (en) | 2003-01-10 | 2011-02-15 | Henkel Ag & Co. Kgaa | Coating composition |
EP1696052A2 (en) | 2005-02-28 | 2006-08-30 | Rohm and Haas Electronic Materials, L.L.C. | Improved acid electrolytes |
US10273591B2 (en) | 2012-01-20 | 2019-04-30 | Rohm And Haas Electronic Materials Llc | Flux method for tin and tin alloys |
Also Published As
Publication number | Publication date |
---|---|
AU4828472A (en) | 1974-05-02 |
NL7217115A (enrdf_load_stackoverflow) | 1973-06-19 |
IT970627B (it) | 1974-04-20 |
GB1408148A (en) | 1975-10-01 |
JPS5629758B2 (enrdf_load_stackoverflow) | 1981-07-10 |
DE2256845A1 (de) | 1973-06-20 |
FR2163453A1 (enrdf_load_stackoverflow) | 1973-07-27 |
CA1115654A (en) | 1982-01-05 |
FR2163453B1 (enrdf_load_stackoverflow) | 1977-01-14 |
JPS4866537A (enrdf_load_stackoverflow) | 1973-09-12 |
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