JPS5629758B2 - - Google Patents

Info

Publication number
JPS5629758B2
JPS5629758B2 JP12667572A JP12667572A JPS5629758B2 JP S5629758 B2 JPS5629758 B2 JP S5629758B2 JP 12667572 A JP12667572 A JP 12667572A JP 12667572 A JP12667572 A JP 12667572A JP S5629758 B2 JPS5629758 B2 JP S5629758B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12667572A
Other languages
Japanese (ja)
Other versions
JPS4866537A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4866537A publication Critical patent/JPS4866537A/ja
Publication of JPS5629758B2 publication Critical patent/JPS5629758B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP12667572A 1971-12-16 1972-12-16 Expired JPS5629758B2 (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20888571A 1971-12-16 1971-12-16

Publications (2)

Publication Number Publication Date
JPS4866537A JPS4866537A (enrdf_load_stackoverflow) 1973-09-12
JPS5629758B2 true JPS5629758B2 (enrdf_load_stackoverflow) 1981-07-10

Family

ID=22776434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12667572A Expired JPS5629758B2 (enrdf_load_stackoverflow) 1971-12-16 1972-12-16

Country Status (8)

Country Link
US (1) US3749649A (enrdf_load_stackoverflow)
JP (1) JPS5629758B2 (enrdf_load_stackoverflow)
CA (1) CA1115654A (enrdf_load_stackoverflow)
DE (1) DE2256845A1 (enrdf_load_stackoverflow)
FR (1) FR2163453B1 (enrdf_load_stackoverflow)
GB (1) GB1408148A (enrdf_load_stackoverflow)
IT (1) IT970627B (enrdf_load_stackoverflow)
NL (1) NL7217115A (enrdf_load_stackoverflow)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3850765A (en) * 1973-05-21 1974-11-26 Oxy Metal Finishing Corp Bright solder plating
SE390986B (sv) * 1973-10-18 1977-01-31 Modo Kemi Ab Forfarande for elektropletering aw beleggningar av tenn eller tenn- blylegerinh ur ett surt elektrolytbad
US4135991A (en) * 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
NZ190645A (en) * 1978-06-16 1980-11-14 M & T Chemicals Inc Aqueous acid tin plating bath containing 2,5-dimethoxy-benzaldehyde as brightening agent
US4377448A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic gold plating
US4377449A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic silver plating
US4379738A (en) * 1979-12-31 1983-04-12 Bell Telephone Laboratories, Incorporated Electroplating zinc
US4263106A (en) * 1979-12-31 1981-04-21 Bell Telephone Laboratories, Incorporated Solder plating process
US4376018A (en) * 1979-12-31 1983-03-08 Bell Telephone Laboratories, Incorporated Electrodeposition of nickel
US4347107A (en) * 1981-04-02 1982-08-31 Hooker Chemicals & Plastics Corp. Electroplating tin and tin alloys and baths therefor
SE8204505L (sv) * 1981-09-08 1983-03-09 Occidental Chem Co Elektropletering for avsettning av tenn-blylegeringar pa olika underlag
US5094726B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5066367B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4871429A (en) * 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
US4701244A (en) * 1983-12-22 1987-10-20 Learonal, Inc. Bath and process for electroplating tin, lead and tin/alloys
US4688899A (en) * 1984-07-27 1987-08-25 Casio Computer Co., Ltd. Dual-frequency, dielectric anisotropy liquid crystal display
JPS61117297A (ja) * 1984-11-13 1986-06-04 Ebara Yuujiraito Kk スズ属金属めつき液
DE3856429T2 (de) * 1987-12-10 2001-03-08 Learonal, Inc. Zinn, Blei- oder Zinn-Blei-Legierungselektrolyten für Elektroplattieren bei hoher Geschwindigkeit
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
JP2752046B2 (ja) * 1989-12-05 1998-05-18 株式会社村田製作所 クエン酸系錫または錫合金系めっき浴
CA2047502C (en) * 1991-07-22 1995-05-09 Peter Tsuk Selectively plating electrically conductive pin
US6562221B2 (en) 2001-09-28 2003-05-13 David Crotty Process and composition for high speed plating of tin and tin alloys
EP1342817A3 (en) * 2002-03-05 2006-05-24 Shipley Co. L.L.C. Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions
AU2003300475B2 (en) * 2003-01-10 2009-07-16 Henkel Ag & Co. Kgaa A coating composition
US20060172064A1 (en) * 2003-01-10 2006-08-03 Henkel Kommanditgesellschaft Auf Aktien Process of coating metals prior to cold forming
US7063735B2 (en) * 2003-01-10 2006-06-20 Henkel Kommanditgesellschaft Auf Aktien Coating composition
ES2354045T3 (es) 2005-02-28 2011-03-09 Rohm And Haas Electronic Materials, Llc Procedimientos con fundente mejorados.
EP2617859B1 (en) 2012-01-20 2016-11-30 Rohm and Haas Electronic Materials LLC Improved flux method for tin and tin alloys

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1141284A (en) * 1965-02-13 1969-01-29 Philips Electronic Associated Improvements in acid tin electroplating solutions
FR1539596A (fr) * 1967-10-06 1968-09-13 Hyogo Prefectural Government Procédé de revêtement électrolytique par un alliage brillant étain-plomb et nouveaux produits ainsi obtenus
US3785939A (en) * 1970-10-22 1974-01-15 Conversion Chem Corp Tin/lead plating bath and method

Also Published As

Publication number Publication date
FR2163453B1 (enrdf_load_stackoverflow) 1977-01-14
GB1408148A (en) 1975-10-01
NL7217115A (enrdf_load_stackoverflow) 1973-06-19
IT970627B (it) 1974-04-20
FR2163453A1 (enrdf_load_stackoverflow) 1973-07-27
JPS4866537A (enrdf_load_stackoverflow) 1973-09-12
US3749649A (en) 1973-07-31
CA1115654A (en) 1982-01-05
AU4828472A (en) 1974-05-02
DE2256845A1 (de) 1973-06-20

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