US3668756A - Method for making fluid channels - Google Patents

Method for making fluid channels Download PDF

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Publication number
US3668756A
US3668756A US817431A US3668756DA US3668756A US 3668756 A US3668756 A US 3668756A US 817431 A US817431 A US 817431A US 3668756D A US3668756D A US 3668756DA US 3668756 A US3668756 A US 3668756A
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United States
Prior art keywords
wire
plate
fluid
passageway
plate member
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Expired - Lifetime
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US817431A
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English (en)
Inventor
Andre A Wieme
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Bekaert NV SA
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Bekaert NV SA
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F15—FLUID-PRESSURE ACTUATORS; HYDRAULICS OR PNEUMATICS IN GENERAL
    • F15C—FLUID-CIRCUIT ELEMENTS PREDOMINANTLY USED FOR COMPUTING OR CONTROL PURPOSES
    • F15C5/00—Manufacture of fluid circuit elements; Manufacture of assemblages of such elements integrated circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49069—Data storage inductor or core
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/494—Fluidic or fluid actuated device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4981—Utilizing transitory attached element or associated separate material
    • Y10T29/49812—Temporary protective coating, impregnation, or cast layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49833—Punching, piercing or reaming part by surface of second part

Definitions

  • the present invention relates to fluid control and logic devices, and has particular relation to a method for making a unit of the sandwich-type structure comprising a channel configuration at the contact surface between two bodies. More particularly, the present invention resides in the fact that the flow channels are obtained by coining in the contact surface of at least one of the bodies a wire which has been prepared by the wire-drawing process and which has been bent in appropriate form.
  • Fluid control and logic systems are more and more used, instead of electronic systems, for the control and command of fluid operated machines, in order to avoid the need of signal transformers, such as electric or electromagnetic relay control valves, which must translate the electronic output command signal to a fluid pressure signal for the operation of the machine.
  • the complete machine, control and logic system included can then be supplied with fluid pressure power only and does not need any additional electrical power supply.
  • fluid elements have an almost infinite lifetime and do not break down when wrongly interconnected.
  • Logic elements perform the elementary logic functions (AND-function, OR-function, bistable memory function) in an interaction chamber according to, for example, either the principle of the exchange of kinetic energy between two or more fluid jets or the principle of the boundary layer effect. Amplification can be achieved for example, by a laminar high energy flow which can be made turbulent by a low energy impinging jet in an interaction chamber.
  • the circuit diagrams of fluid logic and control systems are analogous to the electrical circuit diagrams, and not only fluid interaction chambers were to be developed, but it was also necessary to provide for the interconnection between the different interaction chambers by means of a number of channels through which the fluid can pass from one chamber to the other.
  • fluid channel configuration including interaction chambers and interconnection channels
  • fluid channel configuration can be formed by a plurality of flat plates, either two or three plates, the plates being sandwiched together and sealed fluid-tight one to the other by adhesives, machine screws, clamps or other suitable means.
  • one plate is molded, etched or cut in order to contain the channel configuration on its surface, and this plate is covered by another flat plate, so that the flow in the unit is confined by the plates, and that the channel configuration is realized at the contact surface between the two plates. In this way, it is possible to realize at least a part of a circuit in a bidimentional arrangement.
  • the interconnections between the electronic logic components are made by metallic conductors, either wired or printed, of practical zero resistance, and eventually in series with resistances of which the resistance value can be held between very narrow limits if necessary.
  • the interconnection channels present more than one problem. Firstly, an interconnection channel always acts partly like a fluid integrator, as a result of the volume of the channel itself. Consequently, high frequency signals are strongly attenuated, sharp impulses are not transmitted, and the possible operating speed of the system is reduced. Secondly, an interconnection channel has always a flow resistance which cannot be neglected by the designer of the circuit. It is mostly desired to reduce that resistance to a minimum.
  • the wiring of flow channels can be realized as grooves in the surface of a flat plate, but the present methods for cutting, molding or etching the grooves are not very flexible. Those methods are only more economical with respect to the wiring with rubber tubes between separate interaction elements, when great quantities of the same circuit must be made.
  • FIG. 1 is a perspective view of the contact surface of a plate of a fluid device having a plurality of fluid channels
  • FIG. 2 is a view of the same surface comprising a number of hard drawn wires ready to be coined in the surface
  • FIG. 3 is a press matrix obtained by coining hard drawn wires for a part of their thickness in the surface of the matrix.
  • the device comprises a first plate I with a configuration of channels, such as channel 2, formed in its surface.
  • a second flat plate (not shown) is laid upon the first plate and clamped, sealed or otherwise fastened by screws, clamps or adhesives to this plate.
  • the connection between the plates should be made fluid-tight, so that the fluid flow in the resulting unit is confined by the plates, and that the fluid is only enabled to flow through the defined openings, passages and cavities between the two plates.
  • the channels 2 serve to interconnect the different fluid interaction chambers of a pure fluid logic system, such as chamber 3 or 4.
  • channels can serve for interconnection of fluid logic devices with moving parts, analog elements instead of digital devices, and other fluid control systems in which interconnection is needed between different function devices.
  • the channels serve partly also to connect the functional devices, such as the pure fluid logic interaction chambers of this example, to the input and output orifices 5.
  • the interaction chambers may have been formed in the plate 1 itself, such like chamber 3, but may also be a part of a separate fluid flow device, such like chamber 4, which is connected to the channel configuration in any suitable manner by which the fluid flow is enabled to pass from the separate device to the channel configuration of the plate.
  • the separate device is formed by a plate 6, which cornprises an interaction chamber 4 and the necessary input, output and exhaust channels.
  • This plate 6 is fixed on the back sides of plate 1 in the same way as the cover plate (not shown) of plate 1, in order to define a fluid-tight configuration of passages and cavities which is connected to the configuration on the top side of plate 1 by means of holes 8 in this plate.
  • the configuration between plate 1 and its cover plate may only be a part of a complete system, where several analogous plates are, for example, stacked on top of each other.
  • the plate 1 may only serve to interconnect several functional standard plates to each other, and consequently contain the interconnection wiring," but, as will be explained later, can also contain the necessary resistances, capacitances and even passive or active elements.
  • the orifices to the other devices of the system can be made in the plane of the configuration, such as orifice 5, or perpendicular to that plane, such as orifice 8.
  • the fluid interaction chambers 3 may have been made in the plate 1 by any suitable method, such like cutting, etching or molding, before, after or during the operation by which the channels are formed, the invention being confined as to the method by which the channels are obtained. Those channels are obtained by coining pieces of hard drawn wire into the sur face of the plate.
  • the hardness of the wire in relation to the hardness of the plate depends on the desired degree of accuracy.
  • a hard steel wire is consequently meant a wire the hardness of which is sufficiently high in relation to the hardness of theplate in order to reach the desired degree of accuracy.
  • Aluminum can be used successfully in connection with hard drawn steel wire ends.
  • Aluminum has a Brinell BHN hardness of 50 to 100 which corresponds to a tensile force of maximum 45 kilograms per square millimeter, and a steel wire of carbon content of, for example, 0.85 percent, drawn to 20 percent of its original section gives excellent results.
  • plate material may also-be used soft iron, tin, copper, stainless steel or plastic material, such like polyethylene polyvinyl chloride polypropylene ABS.
  • Aluminum however has the advantage to be a light-weight, not easily deformable material and soft enough to be used with steel wires.
  • Drawn wires of any material, hardness and diameter are available on the market in great quantities. Especially steel wires can be found in any combination of diameter and hardness from 0.05 mm on with tolerances of 0.005 mm, and
  • the smoothness can be increased when the reduction of the wire cross-sectional area per drawing die is diminished, and also when at least the last reduction steps are obtained by a wet drawing process as explained forexample in Trefilage de IAcier of M. Bonzel.
  • Such smooth shining steel wires are also obtainable in the market in any combination of diameter and hardness.
  • aluminum plates are used with hard steel wire, it has also been observed that the grain structure isrefined in the regions undergoing the plastic deformation during the coining process. Consequently, very' smooth channel surfaces are obtained.
  • Smooth channel surfaces are advantageous because of the resulting small flow resistance.
  • For the same desired or max-' imum allowed resistance value it is possible to design channels of smaller sections, so that the channel volume is diminished and consequently the working speed of the system can be increased.
  • Laminar flow in the channels is desirable because it preserves the signal strength and decreases internal heating. As a result, the devices with narrow-smooth channels can work at higher signal pressures without entering in turbulence.
  • Resistance-elements are sometimes needed in a flow circuit for purposes of feedback, time delaying with a resistance-capacitance element, such as resistance 9 and capacitance 10 or resistance 11 and capacitance 12 in the example of FIG. 1.
  • a resistance-capacitance element such as resistance 9 and capacitance 10 or resistance 11 and capacitance 12 in the example of FIG. 1.
  • Resistance 13 is a simple straight channel resistance.
  • Resistance 9 is made by two parallel straight channels.
  • the I/d-ratio of each channel is greater than the ratio of a single channel with the same total resistance value. In that way higher pressures can be used with less possibility of turbulence. Consequently, for low resistance values it can be preferable to use several parallel channels, which may not necessarilyv have the same cross-section.
  • the laminar flow is not disturbed in the bendings of the channel and cannot turn into turbulent flow.
  • a large laminar channel of high resistance value can 'be formed in a small area of the surface of the plate.
  • Plate 1 also comprises, as a way of example, two passive AND-circuits, of which one has been indicated by the numeral 14.
  • This circuits comprise two inlet channels 15 and 16 for the input signal flow jets and two output channels "and 18, which are in the prolongation of channels. 15 and 16 respectively and which lead to the exhaust orifices 22 and 23.
  • At the intersection of input and output channels there is a flow jet interaction chamber 3.
  • An output-signal channel 20 starts from this chamber to another functional element. In operation, when only one of the input channels 15 or 16 deliver a flow jet, this jet flows directly from the input channel in the opposed output channel to the corresponding exhaust-orifice and no output signal appears in channel 20.
  • FIG. 2 illustrates a way for coining the wire into the surface of plate 1.
  • the same plate has been shown, without cover plate and without the active elements fixed on the back, ready to undergo the last operation of coining wires 24, 25, 26 and 27 into the surface.
  • the other orifices, cavities and channels are supposed to be made in a preceding operation.
  • Four pieces of hard wire are cut at length, properly bent and laid on the surface in coincidence with the place where the channel is to be coined.
  • a plate of hard steel 28 shown in dotted lines in FIG. 2 is pressed against plate 1, in the direction of the arrow, and the wires enter into the material of plate 1.
  • the illustrated method of laying the wires separately on the surface and coining the unit is not the only one which can give satisfying results.
  • the wires may be firstly bent in proper form and laid upon a hard flat steel surface in the same configuration of the channels. Subsequently a plate of soft iron is pressed upon the wires, which penetrate into this soft iron plate. But the plate is not pressed until it comes in contact with the hard steel surface.
  • the wires are only partly impressed in the soft iron. After that, the wires are glued in the channels which have been formed in the soft iron plate, and a press matrix is obtained in that way, as shown on FIG. 3.
  • the plate has then on its surface a number of projecting ribs 31.
  • Such a press matrix plate can then be turned'upside down and pressed upon for example an aluminum plate or a plate of plastic material. Wires of different thickness will have to be impressed in the soft iron plate at different moments.
  • a resistance has been made in this way, by pressing two flat aluminum plates together, with anoil-tempered steel wire (0.65 percent carbon, diameter 0.5 mm, length 42 mm) between them.
  • the resistance value varied from 22.7 gr-sec/cm 5% to 27.80 gr-sec/cm i- 5% for a pressure difference between input and output varying from 600 gr/cm 'to 1,000 gr/cm
  • the coining may give irregularities on the surface of the soft plate, in the vicinity of the coined channels and the material tends to be pushed upwards. These irregularities can be lapped away in order to secure fluid tightness.
  • the lapping operation can be controlled very accurately, and the lapping does notaffect the internal surface of the channel, this operation does not present any problem.
  • a method for making a fluid control device having a tubular fluid passageway therein comprising:
  • a method for making a fluid control device having a tubular fluid passageway therein comprising:
  • a method for making a fluid control device having a tubular fluid passageway therein comprising:
  • the plate member is aluminum, and the hard drawn wire is a steel wire.
  • the plate member is aluminum, and the hard drawn wire is a steel wire.
  • the plate member is aluminum, and the hard drawn wire is a steel wire.
  • the plate member is aluminum, and the hard drawn wire is a steel wire.
  • the plate member is aluminum, and the hard drawn wire is a steel wire.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Metal By Deep-Drawing, Or The Like (AREA)
US817431A 1968-04-23 1969-04-18 Method for making fluid channels Expired - Lifetime US3668756A (en)

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FR149016 1968-04-23

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US (1) US3668756A (enrdf_load_stackoverflow)
BE (1) BE731907A (enrdf_load_stackoverflow)
FR (1) FR1569990A (enrdf_load_stackoverflow)
LU (1) LU57881A1 (enrdf_load_stackoverflow)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3798727A (en) * 1973-05-18 1974-03-26 Honeywell Inc Method of making a fluidic device
US4875956A (en) * 1987-10-06 1989-10-24 Integrated Fluidics, Inc. Method of bonding plastics
US4999069A (en) * 1987-10-06 1991-03-12 Integrated Fluidics, Inc. Method of bonding plastics
US5041181A (en) * 1987-10-06 1991-08-20 Integrated Fluidics Company Method of bonding plastics
US5788927A (en) * 1996-07-30 1998-08-04 Bayer Corporation Unified fluid circuit assembly for a clinical hematology instrument
US5934885A (en) * 1994-10-07 1999-08-10 Bayer Corporation Reagent pump assembly
US6317977B1 (en) 1998-10-26 2001-11-20 Smc Kabushiki Kaisha Manufacturing method for fluid passage forming member made of synthetic resin
US20020117330A1 (en) * 1993-11-16 2002-08-29 Formfactor, Inc. Resilient contact structures formed and then attached to a substrate
US6799735B2 (en) * 2000-06-22 2004-10-05 Furukawa-Sky Aluminum Corp. Nozzle plate member for supplying fluids in dispersed manner and manufacturing method of the same
US20060286828A1 (en) * 1993-11-16 2006-12-21 Formfactor, Inc. Contact Structures Comprising A Core Structure And An Overcoat
US20070228110A1 (en) * 1993-11-16 2007-10-04 Formfactor, Inc. Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
US20070240496A1 (en) * 1999-02-20 2007-10-18 Bayer Healthcare Llc Variable Rate Particle Counter and Method of Use
US20110057018A1 (en) * 1995-05-26 2011-03-10 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1654936A (en) * 1926-03-23 1928-01-03 Baker & Co Inc Method of making spinnerets
US2083865A (en) * 1935-07-22 1937-06-15 George C Rensink Method of making filter elements
US3079672A (en) * 1956-08-17 1963-03-05 Western Electric Co Methods of making electrical circuit boards
US3183567A (en) * 1961-03-31 1965-05-18 Ibm Manufacturing magnetic storage matrices
US3325881A (en) * 1963-01-08 1967-06-20 Sperry Rand Corp Electrical circuit board fabrication
US3392053A (en) * 1962-09-10 1968-07-09 Sperry Rand Corp Memory fabrication method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1654936A (en) * 1926-03-23 1928-01-03 Baker & Co Inc Method of making spinnerets
US2083865A (en) * 1935-07-22 1937-06-15 George C Rensink Method of making filter elements
US3079672A (en) * 1956-08-17 1963-03-05 Western Electric Co Methods of making electrical circuit boards
US3183567A (en) * 1961-03-31 1965-05-18 Ibm Manufacturing magnetic storage matrices
US3392053A (en) * 1962-09-10 1968-07-09 Sperry Rand Corp Memory fabrication method
US3325881A (en) * 1963-01-08 1967-06-20 Sperry Rand Corp Electrical circuit board fabrication

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3798727A (en) * 1973-05-18 1974-03-26 Honeywell Inc Method of making a fluidic device
US4875956A (en) * 1987-10-06 1989-10-24 Integrated Fluidics, Inc. Method of bonding plastics
US4999069A (en) * 1987-10-06 1991-03-12 Integrated Fluidics, Inc. Method of bonding plastics
US5041181A (en) * 1987-10-06 1991-08-20 Integrated Fluidics Company Method of bonding plastics
US20060286828A1 (en) * 1993-11-16 2006-12-21 Formfactor, Inc. Contact Structures Comprising A Core Structure And An Overcoat
US20020117330A1 (en) * 1993-11-16 2002-08-29 Formfactor, Inc. Resilient contact structures formed and then attached to a substrate
US20070228110A1 (en) * 1993-11-16 2007-10-04 Formfactor, Inc. Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
US7225538B2 (en) 1993-11-16 2007-06-05 Formfactor, Inc. Resilient contact structures formed and then attached to a substrate
US5934885A (en) * 1994-10-07 1999-08-10 Bayer Corporation Reagent pump assembly
US8485418B2 (en) 1995-05-26 2013-07-16 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
US20110057018A1 (en) * 1995-05-26 2011-03-10 Formfactor, Inc. Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
US5788927A (en) * 1996-07-30 1998-08-04 Bayer Corporation Unified fluid circuit assembly for a clinical hematology instrument
US6317977B1 (en) 1998-10-26 2001-11-20 Smc Kabushiki Kaisha Manufacturing method for fluid passage forming member made of synthetic resin
US20070240496A1 (en) * 1999-02-20 2007-10-18 Bayer Healthcare Llc Variable Rate Particle Counter and Method of Use
US7150418B2 (en) 2000-06-22 2006-12-19 Furukawa-Sky Aluminum Corp. Nozzle plate member for supplying fluids in dispersed manner and manufacturing method of the same
US20050017100A1 (en) * 2000-06-22 2005-01-27 Katsumi Watanabe Nozzle plate member for supplying fluids in dispersed manner and manufacturing method of the same
US6799735B2 (en) * 2000-06-22 2004-10-05 Furukawa-Sky Aluminum Corp. Nozzle plate member for supplying fluids in dispersed manner and manufacturing method of the same

Also Published As

Publication number Publication date
LU57881A1 (enrdf_load_stackoverflow) 1970-08-04
BE731907A (enrdf_load_stackoverflow) 1969-10-01
FR1569990A (enrdf_load_stackoverflow) 1969-06-06

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