US3573126A - Methods of manufacturing electrical circuits - Google Patents

Methods of manufacturing electrical circuits Download PDF

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Publication number
US3573126A
US3573126A US735427A US3573126DA US3573126A US 3573126 A US3573126 A US 3573126A US 735427 A US735427 A US 735427A US 3573126D A US3573126D A US 3573126DA US 3573126 A US3573126 A US 3573126A
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US
United States
Prior art keywords
pressure
temperature
strip
foil
press
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US735427A
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English (en)
Inventor
Jack I Kougel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GTI Corp
Original Assignee
GTI Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GTI Corp filed Critical GTI Corp
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Publication of US3573126A publication Critical patent/US3573126A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1054—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing and simultaneously bonding [e.g., cut-seaming]

Definitions

  • a method of manufacturing current conducting circuitry on a non-conductive base includes the steps of applying heated cutting edges of a selected configuration to a metal foil superimposed over an insulating backing strip to shear a circuit and press the sheared edge against the strip adhering the edge to the strip, transferring the assembly to a press, subjecting the assembly to a first temperature and pressure to remove gases from between the foil and strip, to a second higher temperature and pressure to adhere the foil to the backing strip, and finally to a third temperature and pressure substantially equal to the first followed by cooling under said third pressure.
  • This invention relates to methods of manufacturing electrical circuits and particularly to die cut circuits in which an electrical circuit is cut by stamping from a sheet of metal or metal foil and applied to an insulative backing with an adhesive.
  • I apply heated cutting edges of a selected configuration to a metal foil superimposed over an insulating backing strip to shear a circuit of said selected configuration and to press the sheared edge against said insulative backing strip, adhering said sheared edge to the backing strip, transferring said backing strip to a press, subjecting said strip and foil to a first temperature and pressure suflicient to cause all volatile material to flow from beneath the metal foil and permit the foil and backing to reach equilibrium and then to a second temperature and pressure sufficient to adhere the foil to the backing strip and finally to a third temperature and pressure substantially equal to said first temperature and pressure and thereafter cooling the adhered strip and foil under said third pressure to below 100 and removing the completed circuit from said press.
  • a substantially non-flowing adhesive such as an epoxy resin is placed between the metal foil and backing strip before the cutting operation.
  • This is preferably accomplished by 3,573,126 Patented Mar. 30, 1971 coating one side of the metal foil with adhesive.
  • the assemblies of cut foil and backing strip are preferably assembled in books, separated by laminating pads, such as 50 lb. paper, and placed between platens which are free to move within the press to balance the load.
  • I use a first temperature of 280 F. and a first pressure of 500 lbs./in. a second temperature of 320 F. and second pressure of 1450 lbs./in. and a third temperature and pressure identical to the first.
  • I bump the press at the first temperature and pressure that is to say I cyclically increase and decrease: the pressure slightly above and below the normal pressure several times.
  • This practice although not essential, helps to eliminate bubbles of gas between the metal foil and backing strip.
  • FIG. 1 is a fragmentary section through a die and metal foil and backing strip according to my invention
  • FIG. 2 is a side elevation of a press and load according to my invention
  • FIG. 3 is a flow sheet of the process.
  • the assembly 14 of cut foil 11 and backing strip 12 is stacked as books of assemblies separated by laminating pads 15 in the form of 50 lb. paper thickness) between platens 16 of a slab side press 17.
  • the assemblies are heated in the press to approximately 280 F. and pressure at 500 lbs/in. is applied for about 20 minutes.
  • the temperature is raised to 320 F. and the pressure to 1450 lbs/in. for about 12 minutes.
  • the pressure is then lowered to 500 lbs/in.
  • the adhesive may be any substantially non-flowing adhesive which will not bleed beyond about 0.010 inch at any point on the cut edge.
  • the method of manufacturing an assembly of current conducting circuitry on a non-conductive base comprising the steps of applying heated cutting edges of a selected configuration defining a current conducting circuit to a metal foil superimposed over an insulating backing strip with a thermo-responsive adhesive therebetween to shear a circuit of said selected configuration from said foil and to press the sheared edge defining said circuit against said insulating backing strip, adhering said sheared edge to the backing strip, transferring said assembly to a press, subjecting said assembly to a first temperature and pressure suflicient to cause substantially all gaseous material to flow from beneath the metal foil and then to a second temperature and pressure suflicient to firmly adhere the foil to the backing strip and finally to a third temperature and pressure substantially equal to the first temperature and pressure and thereafter cooling the assembly under said third pressure to below 100 F. and 2,969,300 removing the completed assembly from the press. 3,305,416 2.
  • hesive is an epoxy resin.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
US735427A 1968-06-07 1968-06-07 Methods of manufacturing electrical circuits Expired - Lifetime US3573126A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US73542768A 1968-06-07 1968-06-07

Publications (1)

Publication Number Publication Date
US3573126A true US3573126A (en) 1971-03-30

Family

ID=24955753

Family Applications (1)

Application Number Title Priority Date Filing Date
US735427A Expired - Lifetime US3573126A (en) 1968-06-07 1968-06-07 Methods of manufacturing electrical circuits

Country Status (5)

Country Link
US (1) US3573126A (de)
JP (1) JPS4939935B1 (de)
DE (1) DE1928190A1 (de)
FR (1) FR2010376A1 (de)
GB (1) GB1212967A (de)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3960635A (en) * 1971-06-07 1976-06-01 N.V. Hollandse Signaalapparaten Method for the fabrication of printed circuits
US3969177A (en) * 1974-06-24 1976-07-13 International Business Machines Corporation Laminating method
US4065340A (en) * 1977-04-28 1977-12-27 The United States Of America As Represented By The National Aeronautics And Space Administration Composite lamination method
US4290838A (en) * 1978-12-04 1981-09-22 General Dynamics, Pomona Division Method for vacuum lamination of flex circuits
US4666551A (en) * 1985-06-17 1987-05-19 Thaddeus Soberay Vacuum press
US5160567A (en) * 1991-04-15 1992-11-03 Allied-Signal Inc. System and method for manufacturing copper clad glass epoxy laminates
US5622587A (en) * 1991-12-19 1997-04-22 Barthelman; Kenneth L. Method for producing a three-dimensional laminated decal composite
US20050064652A1 (en) * 2003-08-08 2005-03-24 Shmuel Shapira Circuit forming system and method
US20070214637A1 (en) * 2004-04-28 2007-09-20 Yuki Nakanishi Conductive Member for Non-Contact Type Data Carrier and Method and Device for Manufacturing the Same

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3960635A (en) * 1971-06-07 1976-06-01 N.V. Hollandse Signaalapparaten Method for the fabrication of printed circuits
US3969177A (en) * 1974-06-24 1976-07-13 International Business Machines Corporation Laminating method
US4065340A (en) * 1977-04-28 1977-12-27 The United States Of America As Represented By The National Aeronautics And Space Administration Composite lamination method
US4290838A (en) * 1978-12-04 1981-09-22 General Dynamics, Pomona Division Method for vacuum lamination of flex circuits
US4666551A (en) * 1985-06-17 1987-05-19 Thaddeus Soberay Vacuum press
US5160567A (en) * 1991-04-15 1992-11-03 Allied-Signal Inc. System and method for manufacturing copper clad glass epoxy laminates
US5622587A (en) * 1991-12-19 1997-04-22 Barthelman; Kenneth L. Method for producing a three-dimensional laminated decal composite
US20050064652A1 (en) * 2003-08-08 2005-03-24 Shmuel Shapira Circuit forming system and method
US7152317B2 (en) 2003-08-08 2006-12-26 Shmuel Shapira Circuit forming method
US20070214637A1 (en) * 2004-04-28 2007-09-20 Yuki Nakanishi Conductive Member for Non-Contact Type Data Carrier and Method and Device for Manufacturing the Same
US7930822B2 (en) * 2004-04-28 2011-04-26 Dai Nippon Printing Co., Ltd. Method and device for manufacturing a conductive member for non-contact type data carrier

Also Published As

Publication number Publication date
FR2010376A1 (de) 1970-02-13
GB1212967A (en) 1970-11-18
JPS4939935B1 (de) 1974-10-30
DE1928190A1 (de) 1969-12-11

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