US3543839A - Multi-chamber controllable heat pipe - Google Patents

Multi-chamber controllable heat pipe Download PDF

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Publication number
US3543839A
US3543839A US824628A US3543839DA US3543839A US 3543839 A US3543839 A US 3543839A US 824628 A US824628 A US 824628A US 3543839D A US3543839D A US 3543839DA US 3543839 A US3543839 A US 3543839A
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United States
Prior art keywords
heat
vapor
chambers
chamber
conduit
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US824628A
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English (en)
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Arnold P Shlosinger
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Northrop Grumman Space and Mission Systems Corp
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TRW Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
    • B64G6/00—Space suits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0241—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the tubes being flexible
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/008—Variable conductance materials; Thermal switches

Definitions

  • a temperature controllable heat pipe switching device includes separate evaporating and condensing chambers interconnected by separate vapor flow and liquid return conduits.
  • the vapor flow conduit can be opened or closed to the flow of vapor, whereas the liquid return conduit blocks vapor flow at all times. When the vapor flow path is open, the device has high thermal conductivity, and when the vapor flow path is blocked the device has low thermal conductivity.
  • Heat pipes or heat pipe-type devices operate on closed evaporating-condensing cycles for transporting heat from a lo cale of heat generation to a locale of heat rejection, using a capillary structure or wick for return of the condensate.
  • Such devices generally consist of a closed container which may be of any shape or geometry. Early forms of these devices had the shape of a pipe or tube closed on both ends and the term heat pipe was derived from such devices.
  • the vapor that is formed being at a higher pressure, will flow towards the colder regions of the container cavity and will condense on the cooler surfaces of the wick on the inside of the container wall. Capillary effects will return the liquid condensate to the areas of heat addition. Because the heat of evaporation is absorbed by the phase change from liquid to vapor and released when condensation of the vapor takes place, large amounts of heat can be transported with very small temperature gradients from areas of heat addition to areas of heat removal. All the foregoing is well-known, and heat pipes have been recognized for several years as very effective heat transport devices. They will transport large amounts of heatwith small temperature gradients independent of gravity effects, which makes these devices suitable for applications in space.
  • a relatively large, flat surface which is used as a mounting plate for electronic equipment whose temperature is to be controlled, constitutes the face of a hollow panel forming one chamber of a two'chamber heat pipe.
  • This first chamber is connected by two, small cross section tubular conduits with another hollow, flat panel of extended surface area.
  • the second panel forms a second heat pipe chamber.
  • One of the connecting conduits serves to transfer the vapor of the working fluid from the first or heat input chamber to the second or heat rejection chamber.
  • both chambers are lined with a capillary structure such as a wick and the two wicks are interconnected by a wick completely filling the cross section of the second conduit.
  • the device operates in a manner similar to a single chamber heat pipe, with the difference that the vapor passage and the wick-filled condensate passage are separated from each other, and that instead of one essentially open cavity of a container, two relatively large containers are interconnected by two small cross section conduits.
  • An arrangement of this type has practical value for application to temperature control of spacecraft equipment. In modified forms it serves other useful purposes.
  • the separation of the vapor conduit and the wick-filled condensate return conduit provides a means for controlling the rate of heat transferred from the heat input to the heat rejection chamber by control of the vapor flow in the vapor conduit.
  • a valve is placed in the vapor conduit to provide control of heat flow from the heat input chamber to the heat rejection chamber. Complete closing of the valve will effectively interfere with heat transfer from the heat input to the heat rejection chamber. Heat transport in a heat pipe is dependent upon vapor mass transfer. If this mass transfer of vapor is stopped, heat pipe action will also stop.
  • Throttling of the valve will result in a pressure differential between the heat input and the heat rejection chamber. Since the temperature in the two chambers is the temperature at which evaporation and condensation takes place, and since these temperatures are functions of pressure, throttling of the valve will result in increased temperature difference between the two chambers and thereby permit temperature control of the equipment located at the heat input chamber.
  • thermal switching devices on spacecraft has been recognized for a long time. Devices serving the same purpose have been applied to a number of operational unmanned spacecraft.
  • the design of the electronic equipment temperature system on the surveyor spacecraft used a thermal switching device consisting of plates which, by an automatic control system, were either contacting each other or taken out of contact. Because of the relatively low thermal conductivity and the difficulties in predictability and repeatability of the heat transfer across contacting surfaces, this device had severe limitations in heat transport rate.
  • FIG. 1 is a diagrammatic view of a heat pipe device functioning as a thermal switch according to the invention
  • FIG. 2 is a cross-sectional view of a thermal switch in panel form
  • FIG. 3 is a fragmentary perspective view of a spacecraft incorporating thermal switches for cooling electronic equipment
  • FIG. 4 is a plan view of a space suit incorporating variable thermal conductance means according to the invention.
  • FIG. 5 is a sectional view of a portion of the space suit of FIG. 4 in combination with an undergarment to be worn by an astronaut.
  • FIG. 1 there is shown in diagrammatic form a heat pipe device which functions as a thermal switch in the sense that heat flow is controlled by controlling the flow of vapor.
  • the heat pipe device 10 includes a first enclosure 12, the interior of which defines an evaporating chamber 14.
  • the interior walls of the evaporating chamber 14 are lined with capillary material or a wick 16. a
  • a second enclosure 18 spaced from the first enclosure 12 and similar thereto has its interior walls also lined with a wick forming a condensing chamber 22.
  • a first conduit 24 is connected between the two enclosures l2 and 18 at upper portions thereof to provide a first path of communication between the two chambers 14 and 22.
  • a valve 26 provided in the first conduit 24 is operable to open or close the flow of working fluid vapor between the two chambers 14 and 22.
  • a second conduit 28 is connected between the two enclosures 12 and 18 at lower portions thereof to provide a second path of communication between the two chambers 14 and 22.
  • the second conduit 28 is filled with a wick connecting the wicks 16 and 20 of the two chambers 14 and 22 respectively.
  • the relative positions of the conduits 24 and 28 may of course be reversed.
  • a sufficient quantity of working fluid is provided to saturate the wicks 16, 20 and 30.
  • a working fluid is selected that will be in the liquid phase at the lowest desired temperature of operation and has a thermodynamic critical temperature well above the highest temperature of operation anticipated.
  • the control valve 26 In order for the heat pipe device 10 to function as a means for transferring heat from the evaporating chamber 14 to the condensing chamber 22, the control valve 26 is placed in the open position, as illustrated in solid lines. The application of heat to the evaporating chamber 14 will cause the working fluid vapor to flow through the first conduit 24 into the condensing chamber 22. Because the second conduit 28 is filled with a wick 30 that is saturated with working fluid liquid, no vapor flow can take place through the second conduit 28. Vapor flow will occur only through the first conduit 24 when the control valve 26 is open. The vapor condenses in the condensing chamber 22 where it gives up its latent heat of vaporization to the walls of the condensing chamber 22. The walls of the condensing chamber 22 in turn radiate: this transported heat to its surroundings. The condensed liquid returns to the evaporating chamber 14 through the second or wick filled conduit 28.
  • the device 10 is provided with separate evaporating and condensing chambers 14 and 22 respectively, and that these chambers are connected by separate vapor and liquid flow paths. Vapor flow can occur only through the first or vapor flow conduit 24, and liquid return flow can occur only through the second or liquid flow conduit 28.
  • the control valve 26 When it is desired to cut off heat pipe action, or to stop the transport of heat between the evaporating chamber 14 and the condensing chamber 22, the control valve 26 is placed in the closed position, as indicated in phantom. The flow of vapor is blocked in the vapor flow conduit 24. A pressure differential is established between the two chambers 14 and 22, the pressure being higher in the evaporating chamber 14. Since the temperature in the chambers 14 and 22 is a function of pressure, the temperature will build up in the evaporating chamber 14 and there will be a temperature gradient between the two chambers 14 and 22. there is no way to transport the excess of heat from the evaporating chamber 14 to the condensing chamber 22 because there is no way for the vapor to flow between the two chambers 14 and 22.
  • the pressure in the evaporating chamber 14 eventually builds up to the point where it drives the working fluid liquid out of the wick 16 in the evaporating chamber 14 and through wick 30 into the condensing chamber 22.
  • the removal of working fluid from the evaporating chamber 14 hastens or contributes to the stoppage of heat flow.
  • the control valve 26 When it is desired to resume heat pipe action, the control valve 26 is opened to equalize the pressure in both chambers 14 and 22.
  • the working fluid is pumped back into the evaporating chamber 14 through capillary action in the wicks 30 and 16. Evaporation of the working fluid in the evaporating chamber 14 resumes aiong with transport of the vapor through the vapor flow conduit 24 and condensation of the working fluid vapor in the condensing chamber 22, followed by capillary return of the condensate to the evaporating chamber 14.
  • the heat pipe device 10 functions as a thermal switch whereby the flow of heat between the evaporating and condensing chambers 14 and 22 can be controlled by opening or closing the control valve 26.
  • the thermal switch 32 comprises a thermal insulating member 34, which may be circular or rectangular in form, and of broad area relative to its thickness.
  • the insulating member 34 includes an outer flange portion 36 and an inner web portion 38.
  • Two thermally conducting plates 40 and 42 are securely mounted on opposite sides of the flange portion 36, as by cementing, so as to form an evaporating chamber 44 bounded by the top plate 40 and the upper side of the web portion 38, and a condensing chamber 46 bounded by the bottom plate 42 and the lower side of the web portion 38.
  • the walls of the chambers 44 and 46 are lined with adherent wicks 48 and 50 respectively.
  • the web portion 38 is provided with two openings 52 and '54.
  • One of the openings 52 is fitted with a short tube 56 that is filled with a wick 58 interconnecting the other two wicks 48 and 50.
  • the tube 56 and wick 58 constitutes a liquid flow conduit for transporting condensate from the condensing chamber 46 to the evaporating chamber 44. Sufficient working fluid is provided to saturate the wicks 48, 50 and 58.
  • the other opening 54 in the web portion 38 serves as a vapor flow conduit, which can be opened or closed to control the flow of vapor from the evaporating chamber 44 to the condensing chamber 46.
  • a pneumatically actuated valve 60 is provided to open or close the opening 54.
  • the valve 60 includes a housing 62 hermetically sealed on the upper plate 40 and provided with an inlet orifice 64 for introducing air under pressure.
  • Within the housing 62 is mounted a resilient bellows 66.
  • the lower end of the bellows 66 is rigidly mounted on an annular plate 68.
  • the annular plate 68 is integrally united with a cylindrical sleeve 70, the lower end of which is sealed in an opening 72 in the upper thermally conducting plate 40.
  • the upper or movable end of the bellows 66 is closed by a diaphragm 74.
  • a valve stem 76 which extends through the sleeve and into the evaporating chamber 44.
  • valve stem 76 terminates in a valve disk 78.
  • An annular valve seat is mounted on the upper surface of the web portion 38 surrounding the opening 54 between the two chambers 44 and 46. When the valve disk 78 contacts the valve seat 80, it closes the opening 54 between the two chambers 44 and 46.
  • valve disk 78 With no air pressure applied through the orifice 64, the valve disk 78 is retracted from the valve seat 80 by the spring force of the bellows 66 to provide a vapor flow path from the evaporating chamber 44 to the condensing chamber 46 through the opening 54.
  • the diaphragm 74 When air pressure is applied through the orifice 64', the diaphragm 74 is urged towards the annular plate 68, compressing the bellows 66 and moving the valve disk 78 against the valve seat 80, thereby closing the opening 54 and cutting off vapor flow between the two chambers 44 and 46.
  • the bellows 66 springs back, moving the diaphragm 74 away from the annular plate 68 and moving the valve disk 78 away from the valve seat 80 to clear the opening 54.
  • the insulating member 34 was made of acrylic plastic, the thermally conducting plates 40 and 42 were made of copper, and the wicks 48, 50 and 58 were made of quartz fiber cloth.
  • the working fluid was water.
  • thermal switch 32 The operation of the thermal switch 32 is similar to that already described in connection with the heat pipe device of FIG. 1. it will suffice to say that in the absence of a pneumatic signal, the opening 54 is unblocked. Accordingly, any heat applied to the outer surface of the upper thermally conducting plate 40 will be transported to the lower conducting plate 42 and, for example, radiated from the latter. When a pneumatic signal is applied to the control valve 60, the vapor flow opening 54 is blocked and heat pipe action is stopped. Stated another way, the thermal resistance between the conducting plates 40 and 42 is high and the flow of heat between the plates is obstructed.
  • FIG. 3 there is shown an application of a thermal switch to control the temperature of electronic equipment aboard a spacecraft such as a satellite.
  • thermal switches 32a, 32b, 320 On the internal skin surface 82 of the spacecraft, a fragmentary portion of which is shown, there are mounted a number of thermal switches 32a, 32b, 320, similar to the switch 32 of FIG. 2.
  • the conducting plate 42 of FIG. 2 may be mounted on the surface 82.
  • a number of electronic modules 84a, 84b and 840 are mounted on the thermal switches 32a,
  • each module may be mounted on a conducting plate 40 of F IG. 2.
  • the thermal switches 32a, 32b, 32c operate to control the temperature of the electronic modules 84a, 84b, 840 by controlling the thermal energy conducted from the modules to the internal skin surface 82 and then radiated from the external skin surface 86.
  • the thermal switches 32a, 32b, 320 may be actuated by control signals that are derived from sensing the temperature of the electronic modules.
  • the temperature of the modules may be subject to change depending upon the position and distance of the spacecraft from the sun, or radiations in power input, for example. If the temperature of the modules tends to increase above a predetermined control temperature, the thermal switches are switched to a high conductivity state to carry away the excess heat. If the temperature of the modules tends to decrease below the control temperature, the thermal switches are switched to a low conductivity state to prevent heat loss from the modules.
  • variable thermal conductance means can be used to regulate the transmission of heat from the body of an astronaut to the external radiating surface of the space suit according to thermal conditions in the space environment and the activity level of the astronaut.
  • the thermal control means will be illustrated as applied to what is known as a hard space suit.
  • F IG. 4 is a plan view of the space suit shell 88 in its entirety, with various layers thereof peeled away, and
  • FIG. 5 is a cross section of a unit area representing about one square foot of the space suit shell 88.
  • Each unit area of the space suit shell 88 includes an evaporating chamber 90 spaced from a condensing chamber 92 by thermal insulation 94. Since the space suit shell 88 is preferably of rigid nonflexible construction, it is necessary to provide a soft undergarment 96 of resilient construction which cushions the astronauts body from the space suit shell 88 so as to permit body expansion resulting from breathing or muscular activities. The undergarment 96 is worn in thermal contact with the inner side of the space suit shell 88, or next to the evaporating chamber 90.
  • the evaporating chamber 90 is formed by two thermally conducting plates 98 and 100 spaced by a plurality of wick elements 102 which in turn are mutually spaced laterally and longitudinally in two dimensions.
  • the inner surfaces of the plates 90 and 100 are covered with wick lining 104 bonded thereto and to the wick elements 102.
  • the condensing chamber 92 is formed by two thermally conducting plates 106 and 108 spaced by wick elements 110 that are also spaced laterally in two dimensions.
  • the inner surfaces of the plates 106, 108 are covered with wick lining 112 bonded thereto and to the wick elements 110.
  • the thermal insulation 94 is preferably made up of a plurali ty of layers of plastic film, such as polyethylene terephthalate, that is metallized on both sides to provide radiation reflective surfaces for insulation.
  • The-spaces between the layers also contribute to the insulation qualities.
  • a first conduit 114 such as a tubular sleeve, extends through the insulation 94 and the conducting plates 100 and 108 on both sides thereof so as to provide communication between the chambers and 92.
  • the conduit 114 is filled with a wick 116 so as to provide the liquid condensate return flow path.
  • a second conduit 118 extending through the insulation 94 and the conducting plates and 108 supports a pneumatic valve 120 which receives a temperature control signal in the form of gas flowing through a pipe 122.
  • the valve 120 opens the vapor flow path between the chambers 90 and 92.
  • a gas pressure signal is applied to the valve 120, it closes an opening in the conduit ll8 adjacent to the evaporating chamber 90 and thereby blocks the vapor flow path from the evaporating chamber 90 to the condensing chamber 92.
  • the portion of the space suit shell 88 described above represents a cross-sectional length of about one foot in either the longitudinal or lateral direction.
  • the same pattern is repeated over the entire shell 88 as in FIG. 4 to provide a multiplicity of conduits 114 and 118 to provide many vapor and liquid flow paths. If desired there may be provided a number of liquid flow conduits 114 for each vapor flow conduit 118.
  • the flexible, resilient undergarment 96 will now be described in more detail. Essentially, it consists of a maze of heat pipes so that heat may be readily conducted from the body of the astronaut to the evaporator side of the space suit shell 88.
  • the undergarment 96 includes a central layer 124 of soft, resilient, flexible material, such as foam rubber.
  • the foam rubber layer 124 is provided with a multiplicity of holes piercing the entire layer thickness and carrying a corrugated flexible hollow insert 126 made of synthetic rubber, for example.
  • Both sides of the foam rubber layer 124 carry an adherent plastic laminate 128 covering only the surfaces but not the holes provided with inserts 126.
  • Spaced from each laminate 128 by a plurality of wick elements 130 is another plastic laminate, the latter including a first plastic laminate 132 which contacts the conducting plate 98 of the space suit shell 88, and a second plastic laminate 134 which contacts the body of the astronaut.
  • the internal surfaces of the plastic laminates 128, 132 and 134 are covered with wick linings 136.
  • the wick linings 136 on the outermost plastic laminates 132 and 134 are connected by elongated wicks 138 that extend through the inserts 126.
  • the elongated wicks 138 are smaller in cross-sectional thickness than the diameter of the inserts 126 and are centrally located to provide space for the passage of vapor along the interior of the inserts 126.
  • the wick elements 130, wick linings 136 and elongate wicks 1 38 are saturated with a liquid, such as water, methyl alcoho] or'a refrigerant.
  • a liquid such as water, methyl alcoho] or'a refrigerant.
  • a thermal switching device comprising:
  • a first conduit communicating between said chambers and having capillary means interconnecting the capillary means of said chambers and provided with means permitting liquid flow but not vapor flow between said chambers;
  • a second conduit communicating between said chambers and provided with means operable to open said conduit to vapor flow between said chambers or to close said conduit to vapor flow between said chambers, thereby to control said devicebetween high and low thermal conductivity states, respectively.
  • a temperature controllable heat pipe device comprising:
  • first heat pipe means provided with a wick and forming an evaporating chamber having an outer face extended area for receiving thermal energy from an external source;
  • second heat pipe means provided with a wick and forming a condensing chamber having an outer face of extended area for removal of thermal energy
  • a first conduit communicating between said chambers and filled with a wick that interconnects the wicks in said chambers, whereby when said interconnecting wick is saturated with working fluid in the liquid phase, it blocks the flow of working fluid in the vapor phase between said chambers;
  • valve means in said second conduit and operable between an open position to permit working fluid vapor to flow between said chambers and a closed position to prevent working fluid vapor from flowing between said chambers.
  • a thermal switching device comprising:
  • a member of thermal insulation material disposed between said panels and forming a common wall that divides the member and filled with a second capillary means connected with said first capillary means; means forming a second opening in said the member;
  • rmal insulation valve means associated with said second opening and operable to open or close the same to vapor flow paths between said chambers.
  • a space suit comprising: I
  • capillary means filling said liquid flow conduit to permit liquid flow between said chambers and to block vapor flow therebetween;
  • valve means in said vapor flow conduit and operable between an open position to permit vapor flow between said chambers and a closed position to block vapor'flow between said chambers.
  • said mounting means includes a member of thermal insulation material.
  • said space suit comprising
  • capillary means filling said liquid flow conduit to permit liquid flow between said chambers and to block vapor flow therebetween;
  • valve means in said vapor flow conduit and operable between an open position to permit vapor flow between said chambers and a closed position to block vapor flow between said chambers;
  • said undergarment comprising a main body portion of soft
  • plastic sheets mounted in spaced apart parallel relationship forming a closed cavity
  • capillary means lining the interior surfaces of each of said plastic sheets
  • capillary elements mutually spaced apart and connecting the capillary means of opposing ones of said plastic sheets;
  • each of said conduits including an open path for transmit ting working fluid vapor between said cavities and a capillary path interconnecting the capillary means of one cavity with the capillary means of the other cavity for v transmitting working fluid liquid between said cavities;
  • said undergarment also serving to fill the space between the body of an astronaut and the space suit while cushioning the effects of breathing and muscular activity.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Remote Sensing (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Professional, Industrial, Or Sporting Protective Garments (AREA)
US824628A 1969-05-14 1969-05-14 Multi-chamber controllable heat pipe Expired - Lifetime US3543839A (en)

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US82462869A 1969-05-14 1969-05-14

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JP (1) JPS4917505B1 (enExample)
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Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3818980A (en) * 1971-06-11 1974-06-25 R Moore Heatronic valves
US3837394A (en) * 1973-11-09 1974-09-24 Bell Telephone Labor Inc Thermal transfer apparatus providing transfer control
JPS5042451A (enExample) * 1973-08-17 1975-04-17
JPS50124660U (enExample) * 1974-03-27 1975-10-13
JPS51116447A (en) * 1975-04-07 1976-10-13 Hitachi Ltd A heat conducting device
US3986550A (en) * 1973-10-11 1976-10-19 Mitsubishi Denki Kabushiki Kaisha Heat transferring apparatus
US4040478A (en) * 1973-10-01 1977-08-09 The Boeing Company External tube artery flexible heat pipe
DE3237118A1 (de) * 1982-10-07 1984-04-12 Otdel fiziko-techničeskich problem energetiki Ural'skogo naučnogo centra Akademii Nauk Waermeuebertragereinheit
US4494595A (en) * 1983-11-30 1985-01-22 Schmid Lawrence A Temperature-controllable heat valve
US4941527A (en) * 1989-04-26 1990-07-17 Thermacore, Inc. Heat pipe with temperature gradient
US5695004A (en) * 1992-07-10 1997-12-09 Beckwith; William R. Air conditioning waste heat/reheat method and apparatus
US20040163796A1 (en) * 2003-02-20 2004-08-26 Wu Wei-Fang Circulative cooling apparatus
US20040256094A1 (en) * 2003-04-08 2004-12-23 Samsung Electronics Co., Ltd. Baking system having a heat pipe
US20050067155A1 (en) * 2003-09-02 2005-03-31 Thayer John Gilbert Heat pipe evaporator with porous valve
US20050067146A1 (en) * 2003-09-02 2005-03-31 Thayer John Gilbert Two phase cooling system method for burn-in testing
US20050252643A1 (en) * 2000-05-16 2005-11-17 Swales & Associates, Inc. A Delaware Corporation Wick having liquid superheat tolerance and being resistant to back-conduction, evaporator employing a liquid superheat tolerant wick, and loop heat pipe incorporating same
US20070235161A1 (en) * 2006-03-27 2007-10-11 Eric Barger Refrigerant based heat exchange system with compensating heat pipe technology
US20080276605A1 (en) * 2007-05-09 2008-11-13 Denso Corporation Exhaust heat recovery device
US20080283223A1 (en) * 2007-05-16 2008-11-20 Industrial Technology Research Institute Heat Dissipation System With A Plate Evaporator
US20100326629A1 (en) * 2009-06-26 2010-12-30 Meyer Iv George Anthony Vapor chamber with separator
US20110146956A1 (en) * 2008-05-05 2011-06-23 Stroock Abraham D High performance wick
US20110192575A1 (en) * 2007-08-08 2011-08-11 Astrium Sas Passive Device with Micro Capillary Pumped Fluid Loop
US20110304981A1 (en) * 2010-06-15 2011-12-15 Hon Hai Precision Industry Co., Ltd. Computer server system and computer server thereof
US20130306278A1 (en) * 2012-05-16 2013-11-21 Triem T. Hoang Temperature Actuated Capillary Valve for Loop Heat Pipe System
CN106288541A (zh) * 2015-05-28 2017-01-04 光宇清源（香港）有限公司 热虹吸系统及流体单向控制器
US20190154352A1 (en) * 2017-11-22 2019-05-23 Asia Vital Components (China) Co., Ltd. Loop heat pipe structure
TWI665422B (zh) * 2017-08-16 2019-07-11 大陸商鵬鼎控股（深圳）股份有限公司 散熱板及其製造方法
JP2019194514A (ja) * 2018-05-04 2019-11-07 泰碩電子股▲分▼有限公司 気液分離型還流ベイパーチャンバー
JP2019194512A (ja) * 2018-05-04 2019-11-07 泰碩電子股▲分▼有限公司 延伸毛細管層で複数のベイパーチャンバーを連絡する統合型ベイパーチャンバーモジュール
US10542641B2 (en) * 2014-09-23 2020-01-21 Google Llc Cooling electronic devices in a data center
US20210080198A1 (en) * 2019-09-12 2021-03-18 Honeywell International Inc. Sensor thermal management and stabilization utilizing variable conductance
US20240200880A1 (en) * 2022-12-16 2024-06-20 Raytheon Company Tunable thermal transfer within an oscillating heat pipe
US20240280209A1 (en) * 2023-02-17 2024-08-22 Collins Engine Nozzles, Inc. Variable thermal insulation
US20250027726A1 (en) * 2023-07-20 2025-01-23 Asustek Computer Inc. Loop type heat dissipation structure

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2753660A1 (de) * 1977-12-02 1979-06-07 Philips Patentverwaltung Waermetransportsystem mit einer vorrichtung zur unterbrechung des waermetransportmittelrueckflusses
US4282926A (en) 1978-02-24 1981-08-11 James Howden And Company Australia Pty. Limited Cooling of fluid streams
DE2834838A1 (de) * 1978-08-09 1980-02-21 Daimler Benz Ag Waermeuebertragung nach dem prinzip des waermerohres
EP0059581A3 (en) * 1981-03-04 1983-03-16 National Research Development Corporation Improvements in heat pipes
EP0076077A3 (en) * 1981-09-25 1983-08-10 The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and Improvements in or relating to heat exchangers
EP0076078A3 (en) * 1981-09-25 1983-08-10 The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and Improvements in heat pipes
EP0076079A3 (en) * 1981-09-25 1983-08-10 The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and Improvements in or relating to heat pipes
EP0076081A3 (en) * 1981-09-25 1983-08-17 The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and Improvements in or relating to heat pipes
GB2121158B (en) * 1981-09-25 1985-06-26 Secr Defence Heat pipe assemblies
EP0076080A3 (en) * 1981-09-25 1983-08-10 The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and Apparatus for cooling a scalp

Cited By (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3818980A (en) * 1971-06-11 1974-06-25 R Moore Heatronic valves
JPS5042451A (enExample) * 1973-08-17 1975-04-17
US4040478A (en) * 1973-10-01 1977-08-09 The Boeing Company External tube artery flexible heat pipe
US3986550A (en) * 1973-10-11 1976-10-19 Mitsubishi Denki Kabushiki Kaisha Heat transferring apparatus
US3837394A (en) * 1973-11-09 1974-09-24 Bell Telephone Labor Inc Thermal transfer apparatus providing transfer control
JPS50124660U (enExample) * 1974-03-27 1975-10-13
JPS51116447A (en) * 1975-04-07 1976-10-13 Hitachi Ltd A heat conducting device
DE3237118C2 (de) * 1982-10-07 1986-10-16 Otdel fiziko-techničeskich problem energetiki Ural'skogo naučnogo centra Akademii Nauk Wärmeübertragereinheit
DE3237118A1 (de) * 1982-10-07 1984-04-12 Otdel fiziko-techničeskich problem energetiki Ural'skogo naučnogo centra Akademii Nauk Waermeuebertragereinheit
US4494595A (en) * 1983-11-30 1985-01-22 Schmid Lawrence A Temperature-controllable heat valve
US4941527A (en) * 1989-04-26 1990-07-17 Thermacore, Inc. Heat pipe with temperature gradient
US5695004A (en) * 1992-07-10 1997-12-09 Beckwith; William R. Air conditioning waste heat/reheat method and apparatus
US8397798B2 (en) * 2000-05-16 2013-03-19 Alliant Techsystems Inc. Evaporators including a capillary wick and a plurality of vapor grooves and two-phase heat transfer systems including such evaporators
US9103602B2 (en) * 2000-05-16 2015-08-11 Orbital Atk, Inc. Evaporators including a capillary wick and a plurality of vapor grooves and two-phase heat transfer systems including such evaporators
US20050252643A1 (en) * 2000-05-16 2005-11-17 Swales & Associates, Inc. A Delaware Corporation Wick having liquid superheat tolerance and being resistant to back-conduction, evaporator employing a liquid superheat tolerant wick, and loop heat pipe incorporating same
US20130220580A1 (en) * 2000-05-16 2013-08-29 Alliant Techsystems Inc. Evaporators including a capillary wick and a plurality of vapor grooves and two-phase heat transfer systems including such evaporators
US20040163796A1 (en) * 2003-02-20 2004-08-26 Wu Wei-Fang Circulative cooling apparatus
US7007746B2 (en) * 2003-02-20 2006-03-07 Delta Electronics, Inc. Circulative cooling apparatus
US20040256094A1 (en) * 2003-04-08 2004-12-23 Samsung Electronics Co., Ltd. Baking system having a heat pipe
US20050067155A1 (en) * 2003-09-02 2005-03-31 Thayer John Gilbert Heat pipe evaporator with porous valve
US7143818B2 (en) * 2003-09-02 2006-12-05 Thermal Corp. Heat pipe evaporator with porous valve
US20060144564A1 (en) * 2003-09-02 2006-07-06 Thayer John G Heat pipe evaporator with porous valve
US7013956B2 (en) * 2003-09-02 2006-03-21 Thermal Corp. Heat pipe evaporator with porous valve
US20050067146A1 (en) * 2003-09-02 2005-03-31 Thayer John Gilbert Two phase cooling system method for burn-in testing
US20070235161A1 (en) * 2006-03-27 2007-10-11 Eric Barger Refrigerant based heat exchange system with compensating heat pipe technology
US20080276605A1 (en) * 2007-05-09 2008-11-13 Denso Corporation Exhaust heat recovery device
US7877991B2 (en) * 2007-05-09 2011-02-01 Denso Corporation Exhaust heat recovery device
US20080283223A1 (en) * 2007-05-16 2008-11-20 Industrial Technology Research Institute Heat Dissipation System With A Plate Evaporator
US8333235B2 (en) * 2007-05-16 2012-12-18 Industrial Technology Research Institute Heat dissipation system with a plate evaporator
US20110192575A1 (en) * 2007-08-08 2011-08-11 Astrium Sas Passive Device with Micro Capillary Pumped Fluid Loop
US8584740B2 (en) * 2007-08-08 2013-11-19 Astrium Sas Passive device with micro capillary pumped fluid loop
US20110146956A1 (en) * 2008-05-05 2011-06-23 Stroock Abraham D High performance wick
US9702636B2 (en) * 2008-05-05 2017-07-11 Cornell University High performance wick
US20100326629A1 (en) * 2009-06-26 2010-12-30 Meyer Iv George Anthony Vapor chamber with separator
US20110304981A1 (en) * 2010-06-15 2011-12-15 Hon Hai Precision Industry Co., Ltd. Computer server system and computer server thereof
US20130306278A1 (en) * 2012-05-16 2013-11-21 Triem T. Hoang Temperature Actuated Capillary Valve for Loop Heat Pipe System
US9146059B2 (en) * 2012-05-16 2015-09-29 The United States Of America, As Represented By The Secretary Of The Navy Temperature actuated capillary valve for loop heat pipe system
US20150345872A1 (en) * 2012-05-16 2015-12-03 The Government Of The Us, As Represented By The Secretary Of The Navy Temperature Actuated Capillary Valve for Loop Heat Pipe System
US10704839B2 (en) * 2012-05-16 2020-07-07 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Temperature actuated capillary valve for loop heat pipe system
US10030914B2 (en) * 2012-05-16 2018-07-24 The United States Of America, As Represented By The Secretary Of The Navy Temperature actuated capillary valve for loop heat pipe system
US10542641B2 (en) * 2014-09-23 2020-01-21 Google Llc Cooling electronic devices in a data center
CN106288541B (zh) * 2015-05-28 2019-10-22 光宇清源（香港）有限公司 热虹吸系统及流体单向控制器
CN106288541A (zh) * 2015-05-28 2017-01-04 光宇清源（香港）有限公司 热虹吸系统及流体单向控制器
TWI665422B (zh) * 2017-08-16 2019-07-11 大陸商鵬鼎控股（深圳）股份有限公司 散熱板及其製造方法
US20190154352A1 (en) * 2017-11-22 2019-05-23 Asia Vital Components (China) Co., Ltd. Loop heat pipe structure
JP2019194514A (ja) * 2018-05-04 2019-11-07 泰碩電子股▲分▼有限公司 気液分離型還流ベイパーチャンバー
JP2019194512A (ja) * 2018-05-04 2019-11-07 泰碩電子股▲分▼有限公司 延伸毛細管層で複数のベイパーチャンバーを連絡する統合型ベイパーチャンバーモジュール
US20210080198A1 (en) * 2019-09-12 2021-03-18 Honeywell International Inc. Sensor thermal management and stabilization utilizing variable conductance
US11754351B2 (en) * 2019-09-12 2023-09-12 Honeywell International Inc. Sensor thermal management and stabilization utilizing variable conductance
US20240200880A1 (en) * 2022-12-16 2024-06-20 Raytheon Company Tunable thermal transfer within an oscillating heat pipe
US20240280209A1 (en) * 2023-02-17 2024-08-22 Collins Engine Nozzles, Inc. Variable thermal insulation
US20250027726A1 (en) * 2023-07-20 2025-01-23 Asustek Computer Inc. Loop type heat dissipation structure

Also Published As

Publication number Publication date
JPS4917505B1 (enExample) 1974-05-01
GB1222310A (en) 1971-02-10
FR2047731A5 (enExample) 1971-03-12

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