US3522039A - Copper base alloy - Google Patents

Copper base alloy Download PDF

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Publication number
US3522039A
US3522039A US648996A US3522039DA US3522039A US 3522039 A US3522039 A US 3522039A US 648996 A US648996 A US 648996A US 3522039D A US3522039D A US 3522039DA US 3522039 A US3522039 A US 3522039A
Authority
US
United States
Prior art keywords
base alloy
copper base
alloys
present
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US648996A
Other languages
English (en)
Inventor
Charles D Mclain
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olin Corp
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Application granted granted Critical
Publication of US3522039A publication Critical patent/US3522039A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
US648996A 1967-06-26 1967-06-26 Copper base alloy Expired - Lifetime US3522039A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US64899667A 1967-06-26 1967-06-26

Publications (1)

Publication Number Publication Date
US3522039A true US3522039A (en) 1970-07-28

Family

ID=24603061

Family Applications (1)

Application Number Title Priority Date Filing Date
US648996A Expired - Lifetime US3522039A (en) 1967-06-26 1967-06-26 Copper base alloy

Country Status (7)

Country Link
US (1) US3522039A (xx)
BE (1) BE717175A (xx)
CH (1) CH513983A (xx)
DE (1) DE1758123B1 (xx)
FR (1) FR1578133A (xx)
GB (1) GB1186285A (xx)
SE (1) SE340890B (xx)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3661568A (en) * 1970-06-29 1972-05-09 Olin Corp Copper base alloy
US4269623A (en) * 1978-09-19 1981-05-26 Furukawa Metals Company, Ltd. Copper alloy for reliable electrical connection
US4605532A (en) * 1984-08-31 1986-08-12 Olin Corporation Copper alloys having an improved combination of strength and conductivity
DE3613594A1 (de) * 1985-05-08 1986-11-13 Tamagawa Kikai Kinzoku K.K., Tokio/Tokyo Kupferlegierungs-leitermaterial fuer anschluesse von halbleitervorrichtungen
US4952531A (en) * 1988-03-17 1990-08-28 Olin Corporation Sealing glass for matched sealing of copper and copper alloys
US5026433A (en) * 1990-01-02 1991-06-25 Olin Corporation Grain refinement of a copper base alloy
US5043222A (en) * 1988-03-17 1991-08-27 Olin Corporation Metal sealing glass composite with matched coefficients of thermal expansion
US5047371A (en) * 1988-09-02 1991-09-10 Olin Corporation Glass/ceramic sealing system
US5120612A (en) * 1990-09-04 1992-06-09 Olin Corporation Incorporation of ceramic particles into a copper base matrix to form a composite material
US5334346A (en) * 1992-09-24 1994-08-02 Poongsan Corporation Copper alloys for electrical and electronic parts
EP0995808A1 (en) * 1998-03-10 2000-04-26 Mitsubishi Shindoh Corporation Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold
US20030121573A1 (en) * 2000-04-28 2003-07-03 Takashi Miyoshi Copper alloy suitable for an IC lead pin for a pin grid array provided on a plastic substrate
US6632300B2 (en) 2000-06-26 2003-10-14 Olin Corporation Copper alloy having improved stress relaxation resistance

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2155406A (en) * 1938-04-28 1939-04-25 Chase Brass & Copper Co Electrical conductor

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE891747C (de) * 1942-05-12 1954-03-25 Carl Dr Schaarwaechter Bronzedraht und Verfahren zu seiner Herstellung
US3039867A (en) * 1960-03-24 1962-06-19 Olin Mathieson Copper-base alloys

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2155406A (en) * 1938-04-28 1939-04-25 Chase Brass & Copper Co Electrical conductor

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3661568A (en) * 1970-06-29 1972-05-09 Olin Corp Copper base alloy
US4269623A (en) * 1978-09-19 1981-05-26 Furukawa Metals Company, Ltd. Copper alloy for reliable electrical connection
US4605532A (en) * 1984-08-31 1986-08-12 Olin Corporation Copper alloys having an improved combination of strength and conductivity
DE3613594A1 (de) * 1985-05-08 1986-11-13 Tamagawa Kikai Kinzoku K.K., Tokio/Tokyo Kupferlegierungs-leitermaterial fuer anschluesse von halbleitervorrichtungen
US5043222A (en) * 1988-03-17 1991-08-27 Olin Corporation Metal sealing glass composite with matched coefficients of thermal expansion
US4952531A (en) * 1988-03-17 1990-08-28 Olin Corporation Sealing glass for matched sealing of copper and copper alloys
US5047371A (en) * 1988-09-02 1991-09-10 Olin Corporation Glass/ceramic sealing system
US5026433A (en) * 1990-01-02 1991-06-25 Olin Corporation Grain refinement of a copper base alloy
US5120612A (en) * 1990-09-04 1992-06-09 Olin Corporation Incorporation of ceramic particles into a copper base matrix to form a composite material
US5334346A (en) * 1992-09-24 1994-08-02 Poongsan Corporation Copper alloys for electrical and electronic parts
EP0995808A1 (en) * 1998-03-10 2000-04-26 Mitsubishi Shindoh Corporation Copper alloy and copper alloy thin sheet exhibiting improved wear of blanking metal mold
EP0995808A4 (en) * 1998-03-10 2006-04-12 Mitsubishi Shindoh Corp COPPER ALLOY AND THIN SHEET WITH COPPER ALLOY HAVING IMPROVED WEAR RESISTANCE AS A METAL STAMPING MOLD
US20030121573A1 (en) * 2000-04-28 2003-07-03 Takashi Miyoshi Copper alloy suitable for an IC lead pin for a pin grid array provided on a plastic substrate
US7727344B2 (en) * 2000-04-28 2010-06-01 The Furukawa Electric Co., Ltd. Copper alloy suitable for an IC lead pin for a pin grid array provided on a plastic substrate
US6632300B2 (en) 2000-06-26 2003-10-14 Olin Corporation Copper alloy having improved stress relaxation resistance

Also Published As

Publication number Publication date
GB1186285A (en) 1970-04-02
SE340890B (xx) 1971-12-06
BE717175A (xx) 1968-12-27
DE1758123B1 (de) 1972-10-19
CH513983A (de) 1971-10-15
FR1578133A (xx) 1969-08-14

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