US2722508A - Electrodeposition of alloys containing copper and tin - Google Patents

Electrodeposition of alloys containing copper and tin Download PDF

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Publication number
US2722508A
US2722508A US320617A US32061752A US2722508A US 2722508 A US2722508 A US 2722508A US 320617 A US320617 A US 320617A US 32061752 A US32061752 A US 32061752A US 2722508 A US2722508 A US 2722508A
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US
United States
Prior art keywords
copper
tin
alloy
sodium
aluminum
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Expired - Lifetime
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US320617A
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English (en)
Inventor
Heymann Erich
Schmerling Grigory
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Individual
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Individual
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper

Definitions

  • the present invention relates to improvements in electroplating and is more particularly concerned with the electrodeposition of alloys containing copper and tin as the main constituents.
  • the object of the present invention is to provide a process whereby an alloy containing copper and tin as the main constituents may be deposited on a cathode with no more difficulty than is encountered in the electrodeposition of nickel or pure copper with substantially the same equipment.
  • the difficulties hitherto encountered in electro-depositing an alloy containing copper and tin as the main constituents, using anodes of the alloy in question are overcome by including in the aqueous electrolyte an organic hydroxy acid, preferably citric acid, or a suitable salt thereof.
  • an organic hydroxy acid preferably citric acid, or a suitable salt thereof.
  • the alloy anodes dissolve in the bath in a steady and regular manner without any tendency to polarization or other disturbances.
  • the presence of citric acid or its compounds leads to a marked improvement in the appearance and texture of the deposited alloy.
  • Example 1 Gm./1. Copper cyanide 40 Sodium stannate 20 Sodium cyanide (total) 65 Sodium hydroxide 7 /2 Sodium citrate 50 This gives a rather weak electrolyte and in circumstances in which the use of a more concentrated electrolyte is preferable, the following composition might be used:
  • electrolyte compositions are as follows:
  • Example 3 Preferred Percent- Concept Qon em e fi ion tration, Range, Range, g./1. percent g./l.
  • Example 5 Preferred Percent- Concen- Concenage tration tration, Range, Range, g./l. percent g./l.
  • copper sulphitel 50 7-50 20-80 sodium cyanide (total)... 50 7-50 20-80 sodium stannate 60 3-40 10-50 potassium hydroxide 50 10-40 20-100 citric acid 50 10-40 20-100 The various components may be added to the aqueous bath separately or they may be mixed in suitable proportions beforehand and subsequently dissolved in the appropriate amount of water.
  • composition of the anodes which primarily controls the nature of the deposit, may be -95% copper and 520% tin and very good results have been obtained with copper and 10% tin. It has also been found advantageous to include a small proportion of aluminum or aluminum alloy, for instance up to 2.5% of aluminum or up to 3% of an alloy of aluminum and magnesium.
  • a process for the electrodeposition of a copper-tin alloy selected from the group consisting of an alloy of copper and tin, an alloy of copper, tin and up to 2.5 aluminum, and an alloy of copper, tin and up to 3% of an aluminum'and magnesium alloy on a cathode comprising passing an electric current through an aqueous electrolyte composed of water, 5-25 of a copper compound, 10-50% of an alkali-metal stannate, 10-35% of an alkali-metal cyanide and 1050% of a compound having the citric acid radical selected from the group consisting of citric acid and an alkali-metal salt of citric acid,
  • composition of the anode is 80-95% copper, 520% tin, 0-2.5% aluminum and 0-2% magnesium.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
US320617A 1951-11-27 1952-11-14 Electrodeposition of alloys containing copper and tin Expired - Lifetime US2722508A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB307011X 1951-11-27

Publications (1)

Publication Number Publication Date
US2722508A true US2722508A (en) 1955-11-01

Family

ID=10311766

Family Applications (1)

Application Number Title Priority Date Filing Date
US320617A Expired - Lifetime US2722508A (en) 1951-11-27 1952-11-14 Electrodeposition of alloys containing copper and tin

Country Status (6)

Country Link
US (1) US2722508A (fr)
BE (1) BE515745A (fr)
CH (1) CH307011A (fr)
DE (1) DE1059737B (fr)
FR (1) FR1066712A (fr)
GB (1) GB732538A (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2244017B1 (fr) * 1973-09-14 1977-09-23 Stephanois Rech

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1073432A (en) * 1912-10-29 1913-09-16 Pascal Marino Process of preparing electrolytes for use in the deposition of a metal or metallic alloy.
US1863869A (en) * 1929-10-07 1932-06-21 Ternstedt Mfg Co Electroplating bath
US2198365A (en) * 1938-06-29 1940-04-23 Special Chemicals Corp Electroplating
US2397522A (en) * 1939-10-25 1946-04-02 City Auto Stamping Co Process for the electrodeposition of tin alloys

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR863312A (fr) * 1939-02-20 1941-03-29 Procédé et appareil pour le dépôt électrolytique d'alliages d'étain
NL64052C (fr) * 1942-09-15

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1073432A (en) * 1912-10-29 1913-09-16 Pascal Marino Process of preparing electrolytes for use in the deposition of a metal or metallic alloy.
US1863869A (en) * 1929-10-07 1932-06-21 Ternstedt Mfg Co Electroplating bath
US2198365A (en) * 1938-06-29 1940-04-23 Special Chemicals Corp Electroplating
US2397522A (en) * 1939-10-25 1946-04-02 City Auto Stamping Co Process for the electrodeposition of tin alloys

Also Published As

Publication number Publication date
CH307011A (fr) 1955-05-15
DE1059737B (de) 1959-06-18
BE515745A (fr)
FR1066712A (fr) 1954-06-09
GB732538A (en) 1955-06-29

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