US2153786A - Process and apparatus for thermal deposition of metals - Google Patents

Process and apparatus for thermal deposition of metals Download PDF

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Publication number
US2153786A
US2153786A US153548A US15354837A US2153786A US 2153786 A US2153786 A US 2153786A US 153548 A US153548 A US 153548A US 15354837 A US15354837 A US 15354837A US 2153786 A US2153786 A US 2153786A
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United States
Prior art keywords
heater
evaporated
metal
vacuum
evaporation
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Expired - Lifetime
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US153548A
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English (en)
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Alexander Paul
Dani Andor De
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material

Definitions

  • This invention relates to a process and apparatus for depositing a film of metal or other material on a support by its evaporation in a vacuum.
  • the metal to be evaporated is contained in a vessel of a metal of high melting point.
  • the heat capacity of the vessel causes serious delay in operation
  • the metal to be evaporated is liable to combine with the metal of the vessel to form an alloy.
  • the use of a vessel has been avoided by coating a spiral or a wire or a strip of tungsten or molybdenum with the metal to be evaporated, and heating the spiral or the like electrically.
  • the coating of metal is first melted go and then evaporated. While the large heat capacity of the vessel is, by this means, avoided, the
  • spiral or the like has only a short life, owing to formation of alloys, and the need for coating it at each operation causes loss of time.
  • both these processes have a serious disadvan tage of requiring a high vacuum of 10- mm. Hg or less, in order to obtain a film of good quality.
  • the vacuum must be such that the free path of the a; metal atoms is at least of the order of the distance between the point of evaporation and the support. If the free path is less, the metal atoms collide with one another and with the cold molecules of the residual gas. As a result of colliding with the cold gas molecules, the metal atoms lose kinetic energy and then, in colliding with other metal atoms, build up particles which form an imperfect film.
  • the material to be a evaporated is fed towards a heater at a rate so low, whilethe temperature oftheheater is so much above the evaporation temperature of the material at the vacuum employed, that the material is evaporated substantially as soon as it 45 comes into contact with the heater.
  • the material is in the form of a wire or strip, it is fed so that its end contacts with the heater, the area in contact being so small having regard to the mass and size of the heater, that the material so is evaporated substantially as soonas it 'comes into contact with the heater.
  • the heater is brought to a temperature above the evaporation temperature of the material at the vacuum employed before the material is brought ll into contact with the heater.
  • the residual gas in the chamber is preferably inert to the material to be evaporated and is preferably ionised.
  • Figure 1 is a diagrammatic section of an apparatus for evaporating metalfrom a wire or 5 strip;
  • Figure 2 shows a device for evaporating metal in granular form
  • Figure 3 shows a device for depositing a film on a large surface
  • r I0 Figures'4 and 5 are side and end views respectively of a heating device.
  • the vacuum chamber with upper part II sealed to the base l3 by the packing I2, is evacuated through the pipe l4.
  • the heater l6, held in supports I5, is a strip of refractory metal such as tungsten or molybdenum which can be heated by current through the conductors IT.
  • the metal to be evaporated is in the form of a wire or strip [8 contained on a spool I9 and fed downwards by rolls 20 on to the heater l6. Both wire and strip are to be deemed to be included in the term wire of any convenient form of cross-section used in the appended claims.
  • , such as a clockwork, may be employed, means being provided operable from outside the chamber, for starting and stopping it.
  • the supports on which films are to be deposited are shown at 22 and 23, held in frames 25 and 24 respectively.
  • Two electrodes 26 and 21 are connected' witha source 30 of high potential, and serve to ionise the residual gas in the chamber. These electrodes are not essential, but are of advantage when the vacuum is low.
  • the pipe 32 35 with valve 3i serves to introduce gas into the chamber when it is desired that the residual gas should be other than air. The gas is introduced before or during evacuation and is then evacuated to the desired vacuum.
  • the heater I6 is heated to a temperature substantially above the vaporisation temperature of the metal I8 at the vacuum empolyed.
  • a temperature substantially above the vaporisation temperature of the metal I8 at the vacuum empolyed For example, if the metal to beevaporated is aluminium, and the vacuum 10" mm. Hg the heater is heated to about 1500 C.
  • the rolls 20 are started to feed the wire l8 against the heater i6, and, as soon as the wire touches the heater, its point is immediately vaporised and the vapour is deposited on the supports 22 and 23.
  • the device may be employed which is shown in Figure 2, wherein only the material feeding device and the heater 38 in supports 31 are shown.
  • the granular material is fed from the container 14 by the conveyor 35 to the funnel 36, by which it is directed on to the heater 38.
  • This is preferably in U-form, so that grains shot off on contact with the-bottom of the heater may strike the legs of the U.
  • Figure 3 shows a device for depositing a thin film on a large surface, to form, for instance, a mirror (the vacuum chamber and other accessories being omitted).
  • a plurality wire-feeding devices, with heaters 39, are mounted on a bar 40 attached to sleeves 4
  • Figures 4 and 5 show an alternative form of heater, composed of a cylinder 44 of gauze of wire of a refractory metal, provided with terminal blocks 45.
  • the wire or strip 41 of metal to be evaporated supported in the guide 46 is passed through a hole or slit in the gauze cylinder 44, and is evaporated within the cylinder.
  • This form of heater has the advantage that the metal atoms are distributed over a large area without becoming cooled, because they are heated in passing outwards through the meshes of the gauze.
  • Equivalents to a gauze may be used, such as a wire cage, or a perforated metal cylinder.
  • the vacuum may be substantially less than is necessary with processes hitherto used to produce a film of good quality.
  • a further advantage or the process is that, if the metal to be evaporated is brought into contact with the heater only after this has been raised to a temperature above the evaporation point of the metal, no alloy is formed, and the heater therefore has a long life.
  • an inert gas such as hydrogen
  • a still lower vacuum may be employed if the gas is ionised by means of the electrodes 20, 21.
  • Apparatus for the deposition of a film on a support by evaporation in a vacu in a chamber comprising means for supporting wire of any convenient form of cross-section of the material to be evaporated, a heater, means for heating the heater to a temperature above the evaporation point of the material at the vacuum employed, and means for feeding the wire towards the heater so that its end contacts with the heater.
  • Apparatus for the deposition of a film on a support by evaporation in a vacuum in a chamber comprising a container for granular material to be evaporated, a heater, means for heating the heater to a temperature above the evaporation point of the material at the vacuum employed, and means for dropping the granular material gradually on to the heater at a predetermined rate.
  • Apparatus for the deposition of a film on a support by evaporation in a vacuum in a chamber comprising a heater in the form of a hollow perforated body, means for heating the heater to a temperature above the evaporation temperature of the material to be evaporated, an opening in the heater body, and means for feeding the material to be evaporated at a predetermined rate through the opening into the interior of the heater body.
  • Apparatus for the deposition of a film on a support by evaporation in a vacuum in a chamber comprising a heater having a substantially horizontal heating surface, a straight wire of the material to be evaporated of any convenient form or cross section, and a guide adapted to retain the wire in a substantially vertical position so that its lower end rests on the heater while leaving it free to feed itself onto the heater by its own weight.
  • Apparatus for the deposition of a film on a support byevaporation in a vacuum comprising guides parallel to one dimension of the support, a frame slidably mounted on said guides, and a plurality of evaporating devices mounted on the frame close to the support so as to extend linearly across the other dimension of the support, each evaporating device consisting of a heater and a means for feeding the material to be evaporated towards the heater.
  • PAUL ALEXANDER ANDOR or DANI.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
US153548A 1936-07-17 1937-07-14 Process and apparatus for thermal deposition of metals Expired - Lifetime US2153786A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DED0073135 1936-07-17

Publications (1)

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US2153786A true US2153786A (en) 1939-04-11

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US153548A Expired - Lifetime US2153786A (en) 1936-07-17 1937-07-14 Process and apparatus for thermal deposition of metals

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US (1) US2153786A (xx)
BE (1) BE422666A (xx)
FR (1) FR824423A (xx)
GB (1) GB485965A (xx)
NL (1) NL51379C (xx)

Cited By (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2423729A (en) * 1939-02-22 1947-07-08 Ruhle Rudolf Vaporization of substances in a vacuum
US2435273A (en) * 1941-07-31 1948-02-03 Hatfield Henry Stafford Method of coating with tungsten carbide
US2508500A (en) * 1942-05-23 1950-05-23 Hartford Nat Bank & Trust Co Apparatus for applying metal coatings on insulators
US2621625A (en) * 1948-03-25 1952-12-16 Nat Res Corp Vapor coating device
US2635579A (en) * 1949-12-01 1953-04-21 Nat Res Corp Coating by evaporating metal under vacuum
US2665224A (en) * 1950-03-07 1954-01-05 Nat Res Corp Process for vapor coating
US2665225A (en) * 1950-04-27 1954-01-05 Nat Res Corp Apparatus and process for coating by vapor deposition
US2665227A (en) * 1950-06-30 1954-01-05 Nat Res Corp Apparatus and method of coating by vapor deposition
US2664853A (en) * 1952-05-12 1954-01-05 Nat Res Corp Apparatus for vapor coating
US2665229A (en) * 1951-11-05 1954-01-05 Nat Res Corp Method of coating by vapor deposition
US2665228A (en) * 1950-07-19 1954-01-05 Nat Res Corp Apparatus and process for vapor coating
US2665320A (en) * 1949-09-22 1954-01-05 Nat Res Corp Metal vaporizing crucible
US2664852A (en) * 1950-04-27 1954-01-05 Nat Res Corp Vapor coating apparatus
US2665223A (en) * 1949-12-31 1954-01-05 Nat Res Corp Process for depositing an aluminum film on a substrate by thermal vaporization
US2753800A (en) * 1952-03-24 1956-07-10 Ohio Commw Eng Co Production of printing plates
US2840494A (en) * 1952-12-31 1958-06-24 Henry W Parker Manufacture of transistors
US2850225A (en) * 1955-11-10 1958-09-02 Wisconsin Alumni Res Found Pump
US2894679A (en) * 1953-11-23 1959-07-14 Wisconsin Alumni Res Found Pump
US2899528A (en) * 1959-08-11 Method and apparatus for supplying
US2960457A (en) * 1956-02-28 1960-11-15 Servomechanisms Inc Apparatus for vaporizing coating materials
US2967223A (en) * 1958-11-26 1961-01-03 Wisconsin Alumni Res Found Feeder mechanism
US2978364A (en) * 1956-03-05 1961-04-04 Fairchild Camera Instr Co Automatic control system for precision resistor manufacture
US3117210A (en) * 1959-07-13 1964-01-07 Wisconsin Alumni Res Found Apparatus for evaporating materials
US3167451A (en) * 1959-08-26 1965-01-26 Sprague Electric Co Method of resistor production
US3690291A (en) * 1971-04-28 1972-09-12 Nasa Deposition apparatus
US3750623A (en) * 1972-02-11 1973-08-07 Mc Donnell Douglas Corp Glow discharge coating apparatus
US3826226A (en) * 1972-12-12 1974-07-30 R Clark Apparatus for coating particulate material
US3860444A (en) * 1972-02-08 1975-01-14 Cockerill Coating of workpieces by vapor deposition
US5366764A (en) * 1992-06-15 1994-11-22 Sunthankar Mandar B Environmentally safe methods and apparatus for depositing and/or reclaiming a metal or semi-conductor material using sublimation
EP1865089A2 (de) * 2006-06-06 2007-12-12 Berkenhoff GmbH Verfahren zum Aufdampfen dünner Schichten im Vakuum und Draht zu seiner Ausführung
US20100159132A1 (en) * 2008-12-18 2010-06-24 Veeco Instruments, Inc. Linear Deposition Source
US20100285218A1 (en) * 2008-12-18 2010-11-11 Veeco Instruments Inc. Linear Deposition Source
US20100282167A1 (en) * 2008-12-18 2010-11-11 Veeco Instruments Inc. Linear Deposition Source
US20110003072A1 (en) * 2009-07-03 2011-01-06 Applied Materials, Inc. Bending fixture for homogenous and smooth operation of an evaporation source
US20140334125A1 (en) * 2013-05-10 2014-11-13 Darfon Electronics (Suzhou) Co., Ltd. Backlit Keyboard and Light Guide Module and Manufacture Method Thereof
CN108103445A (zh) * 2017-12-14 2018-06-01 内蒙古科技大学 一种特殊结构合金的原位制备方法
WO2020104054A1 (en) * 2018-11-20 2020-05-28 Bobst Manchester Limited Evaporator boat control system, pvd machine and method of operating the pvd machine

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2440135A (en) * 1944-08-04 1948-04-20 Alexander Paul Method of and apparatus for depositing substances by thermal evaporation in vacuum chambers
US2703772A (en) * 1952-09-12 1955-03-08 Minnesota Mining & Mfg Transfer method for manufacturing infrared reflecting fabric
US2820722A (en) * 1953-09-04 1958-01-21 Richard J Fletcher Method of preparing titanium, zirconium and tantalum
US3488214A (en) * 1967-03-15 1970-01-06 Sperry Rand Corp Evaporant material control for vapor deposition apparatus
GB2217349B (en) * 1988-03-29 1992-06-24 Univ Hull Vapour deposited self-sealing ceramic coatings

Cited By (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2899528A (en) * 1959-08-11 Method and apparatus for supplying
US2423729A (en) * 1939-02-22 1947-07-08 Ruhle Rudolf Vaporization of substances in a vacuum
US2435273A (en) * 1941-07-31 1948-02-03 Hatfield Henry Stafford Method of coating with tungsten carbide
US2508500A (en) * 1942-05-23 1950-05-23 Hartford Nat Bank & Trust Co Apparatus for applying metal coatings on insulators
US2621625A (en) * 1948-03-25 1952-12-16 Nat Res Corp Vapor coating device
US2665320A (en) * 1949-09-22 1954-01-05 Nat Res Corp Metal vaporizing crucible
US2635579A (en) * 1949-12-01 1953-04-21 Nat Res Corp Coating by evaporating metal under vacuum
US2665223A (en) * 1949-12-31 1954-01-05 Nat Res Corp Process for depositing an aluminum film on a substrate by thermal vaporization
US2665224A (en) * 1950-03-07 1954-01-05 Nat Res Corp Process for vapor coating
US2665225A (en) * 1950-04-27 1954-01-05 Nat Res Corp Apparatus and process for coating by vapor deposition
US2664852A (en) * 1950-04-27 1954-01-05 Nat Res Corp Vapor coating apparatus
US2665227A (en) * 1950-06-30 1954-01-05 Nat Res Corp Apparatus and method of coating by vapor deposition
US2665228A (en) * 1950-07-19 1954-01-05 Nat Res Corp Apparatus and process for vapor coating
US2665229A (en) * 1951-11-05 1954-01-05 Nat Res Corp Method of coating by vapor deposition
US2753800A (en) * 1952-03-24 1956-07-10 Ohio Commw Eng Co Production of printing plates
US2664853A (en) * 1952-05-12 1954-01-05 Nat Res Corp Apparatus for vapor coating
US2840494A (en) * 1952-12-31 1958-06-24 Henry W Parker Manufacture of transistors
US2894679A (en) * 1953-11-23 1959-07-14 Wisconsin Alumni Res Found Pump
US2850225A (en) * 1955-11-10 1958-09-02 Wisconsin Alumni Res Found Pump
US2960457A (en) * 1956-02-28 1960-11-15 Servomechanisms Inc Apparatus for vaporizing coating materials
US2978364A (en) * 1956-03-05 1961-04-04 Fairchild Camera Instr Co Automatic control system for precision resistor manufacture
US2967223A (en) * 1958-11-26 1961-01-03 Wisconsin Alumni Res Found Feeder mechanism
US3117210A (en) * 1959-07-13 1964-01-07 Wisconsin Alumni Res Found Apparatus for evaporating materials
US3167451A (en) * 1959-08-26 1965-01-26 Sprague Electric Co Method of resistor production
US3690291A (en) * 1971-04-28 1972-09-12 Nasa Deposition apparatus
US3860444A (en) * 1972-02-08 1975-01-14 Cockerill Coating of workpieces by vapor deposition
US3750623A (en) * 1972-02-11 1973-08-07 Mc Donnell Douglas Corp Glow discharge coating apparatus
US3826226A (en) * 1972-12-12 1974-07-30 R Clark Apparatus for coating particulate material
US5366764A (en) * 1992-06-15 1994-11-22 Sunthankar Mandar B Environmentally safe methods and apparatus for depositing and/or reclaiming a metal or semi-conductor material using sublimation
EP1865089A2 (de) * 2006-06-06 2007-12-12 Berkenhoff GmbH Verfahren zum Aufdampfen dünner Schichten im Vakuum und Draht zu seiner Ausführung
EP1865089A3 (de) * 2006-06-06 2008-08-06 Berkenhoff GmbH Verfahren zum Aufdampfen dünner Schichten im Vakuum und Draht zu seiner Ausführung
US20100159132A1 (en) * 2008-12-18 2010-06-24 Veeco Instruments, Inc. Linear Deposition Source
US20100285218A1 (en) * 2008-12-18 2010-11-11 Veeco Instruments Inc. Linear Deposition Source
US20100282167A1 (en) * 2008-12-18 2010-11-11 Veeco Instruments Inc. Linear Deposition Source
US20110003072A1 (en) * 2009-07-03 2011-01-06 Applied Materials, Inc. Bending fixture for homogenous and smooth operation of an evaporation source
US20140334125A1 (en) * 2013-05-10 2014-11-13 Darfon Electronics (Suzhou) Co., Ltd. Backlit Keyboard and Light Guide Module and Manufacture Method Thereof
US9383504B2 (en) * 2013-05-10 2016-07-05 Darfon Electronics (Suzhou) Co., Ltd. Backlit keyboard and light guide module and manufacture method thereof
CN108103445A (zh) * 2017-12-14 2018-06-01 内蒙古科技大学 一种特殊结构合金的原位制备方法
WO2020104054A1 (en) * 2018-11-20 2020-05-28 Bobst Manchester Limited Evaporator boat control system, pvd machine and method of operating the pvd machine

Also Published As

Publication number Publication date
NL51379C (xx) 1941-11-15
FR824423A (fr) 1938-02-08
BE422666A (xx) 1937-08-31
GB485965A (en) 1938-05-27

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