US20230312900A1 - Foamable resin composition, molded resin foam, and production method therefor - Google Patents

Foamable resin composition, molded resin foam, and production method therefor Download PDF

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US20230312900A1
US20230312900A1 US18/183,420 US202318183420A US2023312900A1 US 20230312900 A1 US20230312900 A1 US 20230312900A1 US 202318183420 A US202318183420 A US 202318183420A US 2023312900 A1 US2023312900 A1 US 2023312900A1
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expandable microcapsules
temperature
low
mass
parts
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Koki Tanaka
Yasushi Nimi
Kazuyoshi Fujimoto
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Toyoda Gosei Co Ltd
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Toyoda Gosei Co Ltd
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Assigned to TOYODA GOSEI CO., LTD. reassignment TOYODA GOSEI CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUJIMOTO, KAZUYOSHI, NIMI, YASUSHI, TANAKA, KOKI
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/0061Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof characterized by the use of several polymeric components
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02Homopolymers or copolymers of hydrocarbons
    • C08L25/04Homopolymers or copolymers of styrene
    • C08L25/06Polystyrene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/22After-treatment of expandable particles; Forming foamed products
    • C08J9/228Forming foamed products
    • C08J9/232Forming foamed products by sintering expandable particles
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/32Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C08L53/025Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2201/00Foams characterised by the foaming process
    • C08J2201/02Foams characterised by the foaming process characterised by mechanical pre- or post-treatments
    • C08J2201/026Crosslinking before of after foaming
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2203/00Foams characterized by the expanding agent
    • C08J2203/18Binary blends of expanding agents
    • C08J2203/182Binary blends of expanding agents of physical blowing agents, e.g. acetone and butane
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2203/00Foams characterized by the expanding agent
    • C08J2203/22Expandable microspheres, e.g. Expancel®
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2325/00Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Derivatives of such polymers
    • C08J2325/02Homopolymers or copolymers of hydrocarbons
    • C08J2325/04Homopolymers or copolymers of styrene
    • C08J2325/08Copolymers of styrene
    • C08J2325/10Copolymers of styrene with conjugated dienes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2353/00Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
    • C08J2353/02Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2423/00Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2423/02Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2423/16Ethene-propene or ethene-propene-diene copolymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2453/00Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers

Definitions

  • the present invention relates to a foamable resin composition, a molded resin foam, and a production method therefor.
  • Molded urethane foam is used as the cushioning material of a console lid used in vehicles. Since urethane foam is expensive, attempts have been made to replace urethane foam with foamed thermoplastic resin for cost reduction.
  • Patent Document 1 discloses a method involving kneading a composition containing an olefinic thermoplastic resin and thermally expandable microcapsules, adding a thermoplastic resin (e.g., a styrenic elastomer) to the composition, and molding a foam from the resultant mixture.
  • a thermoplastic resin e.g., a styrenic elastomer
  • Patent Document 2 discloses a foamable thermoplastic elastomer composition containing an olefinic resin or rubber, thermally expandable microcapsules, a volatile composition (e.g., heptane, silica sol), and a thermoplastic resin (e.g., a styrenic elastomer).
  • a volatile composition e.g., heptane, silica sol
  • a thermoplastic resin e.g., a styrenic elastomer
  • Patent Document 3 discloses a molded foam produced by foaming of a foamable thermoplastic elastomer composition containing an olefinic resin or rubber, thermally expandable microcapsules, a silica sol, and a thermoplastic resin (e.g., a styrenic elastomer).
  • a foamable thermoplastic elastomer composition containing an olefinic resin or rubber, thermally expandable microcapsules, a silica sol, and a thermoplastic resin (e.g., a styrenic elastomer).
  • thermoplastic resin is disadvantageous in terms of compression set properties under compression at a high temperature.
  • an object of the present invention is to produce a molded resin foam that has thermoplasticity, low specific gravity, low hardness, and low compression set, and can serve as a substitute for urethane foam.
  • a foamable resin composition containing a styrenic thermoplastic elastomer and a dynamically crosslinked thermoplastic elastomer in a total amount of 100 parts by mass, wherein an amount of the dynamically crosslinked thermoplastic elastomer is 10 to 40 parts by mass, the composition further contains high-temperature expandable microcapsules and low-temperature expandable microcapsules in a total amount of 25 to 50 parts by mass relative to 100 parts by mass of the elastomers, and an amount of the low-temperature expandable microcapsules is 17 to 67% by mass relative to the total amount of the two types of microcapsules.
  • high-temperature expandable microcapsules and “low-temperature expandable microcapsules” respectively refer to microcapsules having a relatively high maximum expansion temperature and microcapsules having a relatively low maximum expansion temperature.
  • the maximum expansion temperature refers to the temperature above which the shells burst, the foaming component escapes, and the microcapsules shrink.
  • a method for producing a molded resin foam including molding a foamable resin composition containing a styrenic thermoplastic elastomer, a dynamically crosslinked thermoplastic elastomer, high-temperature expandable microcapsules, and low-temperature expandable microcapsules at a temperature at which the high-temperature expandable microcapsules do not burst, but the low-temperature expandable microcapsules burst at least partially.
  • the crosslinked rubber elasticity of the dynamically crosslinked thermoplastic elastomer mixed with the styrenic thermoplastic elastomer provides a modified resin that is resistant to crushing at high temperature, resulting in low compression set and a reduction in sink marks (i.e., collapse due to shrinkage after foammolding), which tend to occur due to high-degree foaming and open cell formation during foam molding.
  • the amount of the dynamically crosslinked thermoplastic elastomer is adjusted to 10 to 40 parts by mass relative to 100 parts by mass of the elastomers, in order to achieve low compression set and low hardness.
  • An amount of less than 10 parts by mass causes an increase in compression set, whereas an amount of more than 40 parts by mass may cause difficulty in achieving low hardness.
  • the process of foaming with thermally expandable microcapsules involves the use of only microcapsules that do not burst during molding, and thus may cause formation of closed cells, resulting in a hard molded foam.
  • the present invention involves the use of high-temperature expandable microcapsules that do not burst during molding in combination with low-temperature expandable microcapsules that burst at least partially during molding.
  • the high-temperature expandable microcapsules form closed cells
  • the burst low-temperature expandable microcapsules are connected together to form open cells, resulting in low hardness.
  • the total amount of the high-temperature expandable microcapsules and the low-temperature expandable microcapsules is adjusted to 25 to 50 parts by mass relative to 100 parts by mass of the elastomers, and the amount of the low-temperature expandable microcapsules is adjusted to 17 to 67% by mass relative to the total amount of these two types of microcapsules, in order to achieve low specific gravity and low hardness.
  • thermoplasticity low specific gravity, low hardness, and low compression set, and can serve as a substitute for urethane foam.
  • FIG. 1 is a micrograph of a cross-section of the molded resin foam of Example 3.
  • FIG. 2 is a micrograph of a cross-section of the molded resin foam of Comparative Example 5.
  • TPS Thermoplastic Styrenic Elastomer
  • TPS styrene-butadiene-styrene block copolymer
  • SBS styrene-butadiene-styrene block copolymer
  • SIS styrene-isoprene-styrene block copolymer
  • SEBS styrene-ethylene-butylene-styrene block copolymer
  • SEPS styrene-ethylene-propylene-styrene block copolymer
  • TPV TPV
  • the hard segment is a polyolefin (e.g., polypropylene)
  • the soft segment is an olefinic crosslinked rubber (e.g., EPDM).
  • Dynamic crosslinking is a process wherein a thermoplastic resin and a rubber are melt-kneaded in parallel with crosslinking of the rubber under shearing, and is in contrast to a common process wherein a rubber is statically crosslinked.
  • Each of high-temperature expandable microcapsules and low-temperature expandable microcapsules, which serve as a foaming agent, is formed by enclosing a foaming component in a shell.
  • a foaming component e.g., an acrylic resin
  • examples thereof include a liquid hydrocarbon.
  • Each of the foamable resin composition and molded resin foam of the present invention may further contain an additional component.
  • the additional component include a filler, a colorant, and an antioxidant.
  • molded resin foam No particular limitation is imposed on the application of the molded resin foam.
  • suitable applications of the molded resin foam include cushioning materials for automobile interior parts (e.g., a console lid, an armrest, and a seat), and cushioning materials for furniture (e.g., a chair).
  • Samples 1 to 7 correspond to a group wherein a selected foaming agent was mixed with TPS.
  • Samples 8 to 13 correspond to a group wherein the proportions of TPS and TPV were varied, and the proportions of high-temperature expandable microcapsules and low-temperature expandable microcapsules were maintained constant.
  • Sample 14 corresponds to a group wherein high-temperature expandable microcapsules were mixed with TPV.
  • Samples 15 to 31 correspond to a group wherein the proportions of TPS and TPV were maintained constant, and the proportions of high-temperature expandable microcapsules and low-temperature expandable microcapsules were varied.
  • Example 6 Formu- TPS 100 100 100 lation TPV (parts by Chemical Foaming mass) Agent Low-temperature 5 Expandable Microcapsules (a) High-temperature 20 30 10 Expandable Microcapsules (b) Note a + b 20 30 15 a/(a + b) 0% 0% 33% Property Specific Gravity 0.20 0.19 0.26 Asker C Hardness 48 47 46 Compression Set 38% 37% 38% (CS) Sample No.
  • Example 7 Comparative 8 9 Example 7 Example 1 Example 2 Formu- TPS 100 90 85 lation TPV 10 15 (parts by Chemical Foaming mass) Agent Low-temperature 10 10 10 Expandable Microcapsules (a) High-temperature 20 20 20 Expandable Microcapsules (b) Note a + b 30 30 30 a/(a + b) 33% 33% 33% Property Specific Gravity 0.22 0.18 0.20 Asker C Hardness 44 41 39 Compression Set 40% 34% 34% (CS) Sample No.
  • Example 3 Example 4 Example 5 Formu- TPS 80 70 60 lation TPV 20 30 40 (parts by Chemical Foaming mass) Agent Low-temperature 10 10 10 Expandable Microcapsules (a) High-temperature 20 20 20 Expandable Microcapsules (b) Note a + b 30 30 30 a/(a + b) 33% 33% 33% Property Specific Gravity 0.20 0.25 0.26 Asker C Hardness 38 42 44 Compression Set 31% 30% 29% (CS) Sample No.
  • Example 6 Example 7
  • Example 8 Formu- TPS 80 80 80 lation TPV 20 20 20 (parts by Low-temperature 7.5 10 15 mass) Expandable Microcapsules (a) High-temperature 17.5 15 10 Expandable Microcapsules (b) Note a + b 25 25 25 a/(a + b) 30% 40% 60% Property Specific Gravity 0.20 0.18 0.29 Asker C Hardness 44 38 45 Compression Set 31% 31% 31% (CS) Sample No.
  • Example 10 Formu- TPS 80 80 80 lation TPV 20 20 20 (parts by Low-temperature 2.5 5 10 mass) Expandable Microcapsules (a) High-temperature 27.5 25 20 Expandable Microcapsules (b) Note a + b 30 30 30 a/(a + b) 8% 17% 33% Property Specific Gravity 0.19 0.20 0.20 Asker C Hardness 49 45 38 Compression Set 30% 32% 31% (CS) Sample No.
  • Example 14 Formu- TPS 80 80 80 lation TPV 20 20 20 (parts by Low-temperature 15 20 22.5 mass) Expandable Microcapsules (a) High-temperature 15 10 7.5 Expandable Microcapsules (b) Note a + b 30 30 30 a/(a + b) 50% 67% 75% Property Specific Gravity 0.22 0.26 0.41 Asker C Hardness 42 43 51 Compression Set 31% 31% 31% (CS) Sample No.
  • Example 15 Example 13
  • Example 14 Formu- TPS 80 80 80 lation TPV 20 20 20 (parts by Low-temperature 25 13 17 mass) Expandable Microcapsules (a) High-temperature 5 27 33 Expandable Microcapsules (b) Note a + b 30 40 50 a/(a + b) 83% 33% 34% Property Specific Gravity 0.61 0.17 0.18 Asker C Hardness 58 38 40 Compression Set 31% 32% 32% (CS) Sample No.
  • Example 16 Formu- TPS 80 80 lation TPV 20 20 (parts by Low-temperature 33 20 mass) Expandable Microcapsules (a) High-temperature 17 40 Expandable Microcapsules (b) Note a + b 50 60 a/(a + b) 66% 33% Property Specific Gravity 0.23 0.21 Asker C Hardness 43 47 Compression Set 31% 36% (CS)
  • TPS used is trade name “Tefabloc T3779B” available from Mitsubishi Chemical Corporation.
  • This product is an elastomer containing a styrenic rubber (styrene-butadiene copolymer (SBC)) as a base polymer.
  • SBC styrene-butadiene copolymer
  • the TPV used is trade name “Santoprene 8211-45” available from Exxon Mobil Corporation. This product is an elastomer containing vulcanized EPDM as a polyolefin base.
  • the chemical foaming agent used (in only samples 1 and 2) is trade name “Polythlene EV306G” available from EIWA CHEMICAL IND. CO., LTD.
  • This product is an azodicarbonamide (ADCA)-based chemical foaming agent, and is in the form of a master batch composed of ethylene-vinyl acetate (EVA).
  • ADCA azodicarbonamide
  • the low-temperature expandable microcapsules used are trade name “Microsphere F185EVA” available from Matsumoto Yushi-Seiyaku Co., Ltd.
  • This product contains a shell formed of an acrylic resin, a hydrocarbon as a foaming component, and EVA as a master batch (foaming initiation temperature: 145 to 155° C., maximum expansion temperature: 190 to 200° C.)
  • the high-temperature expandable microcapsules used are trade name “Microsphere F190EVA” available from Matsumoto Yushi-Seiyaku Co., Ltd.
  • This product contains a shell formed of an acrylic resin, a hydrocarbon (different from the aforementioned one) as a foaming component, and EVA as a master batch (foaming initiation temperature: 160 to 170° C., maximum expansion temperature: 210 to 220° C.)
  • Tables 1 and 2 include the total amount (parts by mass) of two foaming agents: low-temperature expandable microcapsules (a) and high-temperature expandable microcapsules (b); i.e., a+b, and the ratio of the amount of low-temperature expandable microcapsules to the total amount of the two foaming agents; i.e., a/(a+b) (% by mass) (see “Note” in the tables).
  • each of the above-prepared foamable resin compositions (samples 1 to 31) (composition temperature: 230° C.) was injected into a mold (temperature: 60° C.) at an injection speed of 120 mm/second (mold condition: short shot method), to thereby form (foam-mold) a molded resin foam (test piece) having a size of 60 mm ⁇ 200 mm and a thickness of 6 mm.
  • the foam molding of the foamable resin compositions each containing the low-temperature expandable microcapsules and the high-temperature expandable microcapsules was performed at a temperature at which the high-temperature expandable microcapsules do not burst, but the low-temperature expandable microcapsules burst at least partially.
  • each of the resultant molded resin foams was analyzed for the following properties.
  • the specific gravity was measured according to JIS K 7222.
  • the hardness was measured with an Asker C hardness meter according to JIS K 7312.
  • the sample was compressed to 50% of its original thickness by method A (compression at 70° C.) and allowed to stand for 22 hours, and then decompressed and restored for 30 minutes, followed by measurement of the thickness and calculation of the compression set (CS).
  • the molded resin foams (samples 8 to 12, 18 to 20, 22 to 25, and 28 to 30), which exhibited a specific gravity of 0.3 or less, an Asker C hardness of 45 or less, and a compression set of 35% or less, and the foamable resin compositions used for these samples were regarded as Examples. Meanwhile, the molded resin foams (the samples other than the aforementioned ones) and the foamable resin compositions used for these samples were regarded as Comparative Examples.
  • the molded resin foam (sample 5) of Comparative Example 5 had only closed cells (about 0.2 to 0.4 mm) formed of high-temperature expandable microcapsules, as shown in FIG. 2 (cross-section micrograph).
  • each Example e.g., sample 10 of Example 3
  • closed cells about 0.2 to 0.4 mm
  • open cells about 0.6 to 1.0 mm
  • burst low-temperature expandable microcapsules as shown in FIG. 1 (cross-section micrograph).

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
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US18/183,420 2022-03-29 2023-03-14 Foamable resin composition, molded resin foam, and production method therefor Pending US20230312900A1 (en)

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JP2022-053737 2022-03-29
JP2022053737A JP2023146523A (ja) 2022-03-29 2022-03-29 発泡性樹脂組成物、発泡樹脂成形体及びその製造方法

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