US20230035864A1 - Lead-free and antimony-free brass alloy - Google Patents

Lead-free and antimony-free brass alloy Download PDF

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Publication number
US20230035864A1
US20230035864A1 US17/874,712 US202217874712A US2023035864A1 US 20230035864 A1 US20230035864 A1 US 20230035864A1 US 202217874712 A US202217874712 A US 202217874712A US 2023035864 A1 US2023035864 A1 US 2023035864A1
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Prior art keywords
free
lead
alloy
antimony
brass alloy
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Abandoned
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US17/874,712
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English (en)
Inventor
Florian Seuss
Patrick Feldner
Hartmut Ricken
Alexander Dehnelt
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Diehl Brass Solutions Stiftung and Co KG
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Diehl Brass Solutions Stiftung and Co KG
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Assigned to DIEHL BRASS SOLUTIONS STIFTUNG & CO. KG reassignment DIEHL BRASS SOLUTIONS STIFTUNG & CO. KG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DEHNELT, ALEXANDER, Feldner, Patrick, RICKEN, HARTMUT, Seuss, Florian
Publication of US20230035864A1 publication Critical patent/US20230035864A1/en
Priority to US19/183,024 priority Critical patent/US20250270677A1/en
Abandoned legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Definitions

  • the invention relates to a lead-free and antimony-free brass alloy.
  • European Patent EP 3 320 122 B1 discloses a brass alloy admixed with neither Pb nor Bi. For improving machinability, it is proposed that 0.005 to 1.0 wt% In be added to the brass alloy. While the proposed addition of In does improve the machinability, machining is nevertheless accompanied by formation of relatively long spiral chips, which can lead to blockages as they are transported away, and to tool breakage.
  • European Patent Application EP 2 913 415 A1 corresponding to U.S. Pat. Application Publication No. 2016/0362767, discloses a further lead-free and bismuth-free brass alloy which, moreover, contains no Si.
  • the known alloy contains 60 to 65 wt% Cu and also 0.01 to 0.15 wt% Sb.
  • European Patent EP 2 467 507 B1 corresponding to U.S. Pat. Application Publication No. 2012/0207642, discloses a lead-free brass alloy which contains Fe, Ni and Sn.
  • European Patent EP 2 133 437 B1 corresponding to U.S. Pat. No. 8,425,697 and U.S. Pat. Application Publication Nos. 2010/0080731, 2009/0311127 and 2009/0311130, discloses a lead-free free-cutting brass alloy which contains 0.6 to 2.5 wt% Mg and also 0.15 to 0.4 wt% P. The addition of P makes processing by continuous casting more difficult.
  • the brass alloy is to exhibit little hot embrittlement, allowing it to be processed by hot forming.
  • [%] is understood to be per cent by weight.
  • the Pb content can be established at less than 0.1% without undesirable formation of long spiral chips during machining.
  • the proposed brass alloy is notable not only for improved chip breaking but also for little hot embrittlement. It may be processed by hot forming.
  • a “lead-free and antimony-free brass alloy” is understood to be an alloy which contains less than 0.1% Pb and less than 0.001% Sb.
  • the alloy may contain less than 0.15% As and/or less than 0.15% P and/or less than 0.1% Al and/or less than 0.1% Sn. Sn stabilizes the ⁇ solid solution. As leads to improved corrosion resistance of the alloy, with As in particular counteracting removal of zinc. The addition of P improves the machinability of the alloy.
  • from 57 to less than 60%, preferably from 57.5 to 58.5% of Cu is present.
  • the proposed alloy is more cost-efficient because of the relatively lower Cu contents.
  • Mg there is more than 0.5% Mg.
  • the proposed Mg content contributes to improved machinability.
  • the Pb content is suitably in the range from 0.05 to 0.09%.
  • the In content is less than 0.005%.
  • the Zn content be 40 to 42.5%.
  • An alloy having the proposed Zn content displays good machining properties.
  • the proposed lead-free and antimony-free brass alloy additionally enables good processing qualities in the continuous casting process.
  • FIG. 1 shows a chip depiction after longitudinal turning of a first example alloy
  • FIG. 2 shows a chip depiction after longitudinal turning of a second example alloy
  • FIG. 3 shows a chip depiction after longitudinal turning of a third example alloy
  • FIG. 4 shows a chip depiction after longitudinal turning of a fourth example alloy.
  • FIGS. 1 - 4 of the drawings in detail, there are seen chip depictions which were produced in each case by subjecting alloys to longitudinal turning at a rotary speed of 850 rpm.
  • An indexable cutting insert was used with the identification KNMX160405 R8lC907.
  • the scale bar included in FIGS. 1 to 4 is 5 mm in each case.
  • FIG. 1 shows a chip depiction after longitudinal turning of a first example alloy.
  • the first example alloy is a reference alloy.
  • the first example alloy contains 58% Cu and 42% Zn, meaning that the first example alloy contains no addition of Mg.
  • the longitudinal turning of the example alloy 1 produces long spiral chips. Such spiral chips are unwanted when machining. They may lead to blockages when being transported away, and to tool breakage.
  • FIG. 2 shows a chip depiction after the longitudinal turning of a second example alloy.
  • the second example alloy contains 58% Cu, 41.5% Zn and 0.5% Mg. It is apparent that the chips generated during longitudinal turning are shorter than the chips shown in FIG. 1 .
  • FIG. 3 shows a chip depiction after the longitudinal turning of a third example alloy.
  • the third example alloy is formed of 58% Cu, 41% Zn and 1% Mg. It is clearly apparent that the chips produced are again shorter than the chips generated by the longitudinal turning of the second example alloy.
  • FIG. 4 shows a chip depiction after the longitudinal turning of a fourth example alloy.
  • the fourth example alloy is formed of 58% Cu, 40.5% Zn and 1.5% Mg.
  • the chips generated during turning of the fourth example alloy are again smaller than the chips generated by the longitudinal turning of the third example alloy.
  • the proposed brass alloy is notable, moreover, for little hot embrittlement. It may be processed by hot forming, particularly in a continuous casting process.

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  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Domestic Plumbing Installations (AREA)
  • Conductive Materials (AREA)
  • Contacts (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
  • Sliding-Contact Bearings (AREA)
  • Lead Frames For Integrated Circuits (AREA)
US17/874,712 2021-07-27 2022-07-27 Lead-free and antimony-free brass alloy Abandoned US20230035864A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US19/183,024 US20250270677A1 (en) 2021-07-27 2025-04-18 Lead-free and antimony-free brass alloy

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021119474.1 2021-07-27
DE102021119474.1A DE102021119474A1 (de) 2021-07-27 2021-07-27 Blei- und Antimonfreie Messinglegierung

Related Child Applications (1)

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US19/183,024 Continuation-In-Part US20250270677A1 (en) 2021-07-27 2025-04-18 Lead-free and antimony-free brass alloy

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US20230035864A1 true US20230035864A1 (en) 2023-02-02

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US17/874,712 Abandoned US20230035864A1 (en) 2021-07-27 2022-07-27 Lead-free and antimony-free brass alloy

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US (1) US20230035864A1 (https=)
EP (1) EP4124667A1 (https=)
JP (1) JP2023021941A (https=)
KR (1) KR20230017150A (https=)
CN (1) CN115679151A (https=)
AU (1) AU2022209210A1 (https=)
BR (1) BR102022014247A2 (https=)
DE (1) DE102021119474A1 (https=)
IL (1) IL295024B2 (https=)
MX (1) MX2022009224A (https=)
ZA (1) ZA202207823B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4124667A1 (de) 2021-07-27 2023-02-01 Diehl Brass Solutions Stiftung & Co. KG Blei- und antimonfreie messinglegierung

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4621084A1 (de) 2024-03-21 2025-09-24 Otto Fuchs - Kommanditgesellschaft - Verfahren zum schmelzmetallurgischen herstellen einer hochfesten messinglegierung sowie messinglegierung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110214836A1 (en) * 2010-03-02 2011-09-08 Zhenqing Hu Environment-friendly manganese brass alloy and manufacturing method thereof
JP2013234362A (ja) * 2012-05-09 2013-11-21 San-Etsu Metals Co Ltd 耐高温脆性に優れた黄銅合金
DE102013107011A1 (de) * 2013-07-03 2015-01-08 Thyssenkrupp Steel Europe Ag Verfahren zum Beschichten von Cu-Langprodukten mit einer metallischen Schutzschicht und mit einer metallischen Schutzschicht versehenes Cu-Langprodukt
CN112226645A (zh) * 2020-09-03 2021-01-15 宁波金田铜业(集团)股份有限公司 一种无铅易切削黄铜及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61178216A (ja) 1985-02-01 1986-08-09 Sanden Corp 車輛用空調装置における可変容量圧縮機の制御装置
JPH04236734A (ja) 1991-01-14 1992-08-25 Sumitomo Metal Mining Co Ltd Ｓｎ、Ｍｇ及びＰが添加された耐腐食性に優れる黄銅
JPH06179932A (ja) * 1991-07-01 1994-06-28 Nikko Kinzoku Kk 導電性ばね用銅合金
JPH08176707A (ja) * 1994-12-27 1996-07-09 Sumitomo Electric Ind Ltd ワイヤ放電加工用電極線
CN101289714B (zh) * 2007-04-18 2011-06-15 北京有色金属研究总院 一种无铅的易切削镁铋黄铜合金
CN100552070C (zh) 2007-10-16 2009-10-21 中南大学 一种无铅易切削镁黄铜合金及其制备方法
CN101285137B (zh) * 2008-06-11 2010-06-02 路达(厦门)工业有限公司 无铅易切削镁黄铜合金及其制造方法
DE102009038657A1 (de) 2009-08-18 2011-02-24 Aurubis Stolberg Gmbh & Co. Kg Messinglegierung
EP2913415A4 (en) 2014-01-03 2016-10-26 Jiaxing Idc Plumbing & Heating Technology Ltd STAINLESS, INSULATED, SILICONE-FREE BRASS
DE102015212937A1 (de) 2015-07-10 2017-01-12 Aurubis Stolberg Gmbh & Co. Kg Messinglegierung
TWI731506B (zh) 2019-06-25 2021-06-21 日商三菱伸銅股份有限公司 快削性銅合金及快削性銅合金的製造方法
DE102021119474A1 (de) 2021-07-27 2023-02-02 Diehl Brass Solutions Stiftung & Co. Kg Blei- und Antimonfreie Messinglegierung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110214836A1 (en) * 2010-03-02 2011-09-08 Zhenqing Hu Environment-friendly manganese brass alloy and manufacturing method thereof
JP2013234362A (ja) * 2012-05-09 2013-11-21 San-Etsu Metals Co Ltd 耐高温脆性に優れた黄銅合金
DE102013107011A1 (de) * 2013-07-03 2015-01-08 Thyssenkrupp Steel Europe Ag Verfahren zum Beschichten von Cu-Langprodukten mit einer metallischen Schutzschicht und mit einer metallischen Schutzschicht versehenes Cu-Langprodukt
CN112226645A (zh) * 2020-09-03 2021-01-15 宁波金田铜业(集团)股份有限公司 一种无铅易切削黄铜及其制备方法

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
English language machine translation of CN-101161836 to Xiao et al. Generated 4/7/2023. (Year: 2023) *
English language machine translation of CN-112226645-A. Generated 4/7/2023. (Year: 2023) *
English language machine translation of DE-102013107011-A1. Generated 14 December 2023. (Year: 2023) *
English language machine translation of JP-2013234362-A. Generated 4/7/2023. (Year: 2023) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4124667A1 (de) 2021-07-27 2023-02-01 Diehl Brass Solutions Stiftung & Co. KG Blei- und antimonfreie messinglegierung

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IL295024B2 (en) 2026-03-01
AU2022209210A1 (en) 2023-02-16
BR102022014247A2 (pt) 2023-02-07
EP4124667A1 (de) 2023-02-01
DE102021119474A1 (de) 2023-02-02
CN115679151A (zh) 2023-02-03
KR20230017150A (ko) 2023-02-03
MX2022009224A (es) 2023-01-30
JP2023021941A (ja) 2023-02-14
ZA202207823B (en) 2023-04-26
IL295024B1 (en) 2025-11-01
IL295024A (en) 2023-02-01

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