US20230026069A1 - Adhesive sheet - Google Patents
Adhesive sheet Download PDFInfo
- Publication number
- US20230026069A1 US20230026069A1 US17/787,123 US202017787123A US2023026069A1 US 20230026069 A1 US20230026069 A1 US 20230026069A1 US 202017787123 A US202017787123 A US 202017787123A US 2023026069 A1 US2023026069 A1 US 2023026069A1
- Authority
- US
- United States
- Prior art keywords
- pressure
- sensitive adhesive
- layer
- adhesive sheet
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 230000001070 adhesive effect Effects 0.000 title description 44
- 239000000853 adhesive Substances 0.000 title description 38
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 384
- 230000004888 barrier function Effects 0.000 claims abstract description 117
- 238000000034 method Methods 0.000 claims abstract description 52
- 230000014509 gene expression Effects 0.000 claims abstract description 20
- 239000010410 layer Substances 0.000 claims description 470
- 239000006096 absorbing agent Substances 0.000 claims description 40
- 229920005989 resin Polymers 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 37
- 238000006073 displacement reaction Methods 0.000 claims description 27
- 229920001971 elastomer Polymers 0.000 claims description 23
- 238000012545 processing Methods 0.000 claims description 16
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 14
- 238000011282 treatment Methods 0.000 claims description 9
- 229920005992 thermoplastic resin Polymers 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 238000000227 grinding Methods 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000000806 elastomer Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 230000008439 repair process Effects 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 239000000047 product Substances 0.000 description 87
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 72
- -1 2-(4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl)-5-hydroxyphenyl Chemical group 0.000 description 64
- 239000000203 mixture Substances 0.000 description 56
- 229920000642 polymer Polymers 0.000 description 56
- 239000000463 material Substances 0.000 description 36
- 239000003431 cross linking reagent Substances 0.000 description 35
- 229920000139 polyethylene terephthalate Polymers 0.000 description 35
- 239000005020 polyethylene terephthalate Substances 0.000 description 35
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 34
- 239000003795 chemical substances by application Substances 0.000 description 28
- 239000000178 monomer Substances 0.000 description 28
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 27
- 150000001875 compounds Chemical class 0.000 description 25
- JREYOWJEWZVAOR-UHFFFAOYSA-N triazanium;[3-methylbut-3-enoxy(oxido)phosphoryl] phosphate Chemical compound [NH4+].[NH4+].[NH4+].CC(=C)CCOP([O-])(=O)OP([O-])([O-])=O JREYOWJEWZVAOR-UHFFFAOYSA-N 0.000 description 25
- 238000004519 manufacturing process Methods 0.000 description 24
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 21
- 238000011156 evaluation Methods 0.000 description 21
- 238000005259 measurement Methods 0.000 description 21
- 239000002243 precursor Substances 0.000 description 21
- 230000000052 comparative effect Effects 0.000 description 20
- 239000005060 rubber Substances 0.000 description 20
- 229920001296 polysiloxane Polymers 0.000 description 19
- 239000012948 isocyanate Substances 0.000 description 18
- 239000000523 sample Substances 0.000 description 17
- 239000004593 Epoxy Substances 0.000 description 16
- 230000008859 change Effects 0.000 description 16
- 150000002513 isocyanates Chemical class 0.000 description 16
- 238000001035 drying Methods 0.000 description 15
- 230000005540 biological transmission Effects 0.000 description 14
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 14
- 238000005187 foaming Methods 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 239000002904 solvent Substances 0.000 description 13
- 239000000126 substance Substances 0.000 description 12
- 238000007373 indentation Methods 0.000 description 11
- 239000000243 solution Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 125000000524 functional group Chemical group 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 8
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 8
- 229920000103 Expandable microsphere Polymers 0.000 description 7
- 229920005601 base polymer Polymers 0.000 description 7
- 238000002309 gasification Methods 0.000 description 7
- 230000035945 sensitivity Effects 0.000 description 7
- 238000002834 transmittance Methods 0.000 description 7
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 229940059574 pentaerithrityl Drugs 0.000 description 6
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 6
- 229920000058 polyacrylate Polymers 0.000 description 6
- 239000004814 polyurethane Substances 0.000 description 6
- 229920002635 polyurethane Polymers 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- 239000004094 surface-active agent Substances 0.000 description 6
- 230000004580 weight loss Effects 0.000 description 6
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 5
- 239000004215 Carbon black (E152) Substances 0.000 description 5
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 5
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 5
- 125000005907 alkyl ester group Chemical group 0.000 description 5
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 description 5
- 125000000623 heterocyclic group Chemical group 0.000 description 5
- 229930195733 hydrocarbon Natural products 0.000 description 5
- 150000002430 hydrocarbons Chemical group 0.000 description 5
- 238000003475 lamination Methods 0.000 description 5
- 229920006132 styrene block copolymer Polymers 0.000 description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 4
- 239000004342 Benzoyl peroxide Substances 0.000 description 4
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 229920006243 acrylic copolymer Polymers 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 4
- 239000012964 benzotriazole Substances 0.000 description 4
- 235000019400 benzoyl peroxide Nutrition 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 239000003505 polymerization initiator Substances 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 4
- 229960002317 succinimide Drugs 0.000 description 4
- OLFNXLXEGXRUOI-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-phenylpropan-2-yl)phenol Chemical compound C=1C(N2N=C3C=CC=CC3=N2)=C(O)C(C(C)(C)C=2C=CC=CC=2)=CC=1C(C)(C)C1=CC=CC=C1 OLFNXLXEGXRUOI-UHFFFAOYSA-N 0.000 description 3
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- VMRIVYANZGSGRV-UHFFFAOYSA-N 4-phenyl-2h-triazin-5-one Chemical compound OC1=CN=NN=C1C1=CC=CC=C1 VMRIVYANZGSGRV-UHFFFAOYSA-N 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 229920002367 Polyisobutene Polymers 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- FQUNFJULCYSSOP-UHFFFAOYSA-N bisoctrizole Chemical compound N1=C2C=CC=CC2=NN1C1=CC(C(C)(C)CC(C)(C)C)=CC(CC=2C(=C(C=C(C=2)C(C)(C)CC(C)(C)C)N2N=C3C=CC=CC3=N2)O)=C1O FQUNFJULCYSSOP-UHFFFAOYSA-N 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 3
- 229920013730 reactive polymer Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- LEVFXWNQQSSNAC-UHFFFAOYSA-N 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-hexoxyphenol Chemical compound OC1=CC(OCCCCCC)=CC=C1C1=NC(C=2C=CC=CC=2)=NC(C=2C=CC=CC=2)=N1 LEVFXWNQQSSNAC-UHFFFAOYSA-N 0.000 description 2
- ZMWRRFHBXARRRT-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-methylbutan-2-yl)phenol Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC(N2N=C3C=CC=CC3=N2)=C1O ZMWRRFHBXARRRT-UHFFFAOYSA-N 0.000 description 2
- IYAZLDLPUNDVAG-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 IYAZLDLPUNDVAG-UHFFFAOYSA-N 0.000 description 2
- UZUNCLSDTUBVCN-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-6-(2-phenylpropan-2-yl)-4-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound C=1C(C(C)(C)CC(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C(O)C=1C(C)(C)C1=CC=CC=C1 UZUNCLSDTUBVCN-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- SITYOOWCYAYOKL-UHFFFAOYSA-N 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-(3-dodecoxy-2-hydroxypropoxy)phenol Chemical compound OC1=CC(OCC(O)COCCCCCCCCCCCC)=CC=C1C1=NC(C=2C(=CC(C)=CC=2)C)=NC(C=2C(=CC(C)=CC=2)C)=N1 SITYOOWCYAYOKL-UHFFFAOYSA-N 0.000 description 2
- UZOYICMDDCNJJG-UHFFFAOYSA-N 2-[[3-(benzotriazol-2-yl)-2-hydroxy-5-methylphenyl]methyl]-4,5,6,7-tetrahydroisoindole-1,3-dione Chemical compound N1=C2C=CC=CC2=NN1C1=CC(C)=CC(CN2C(C3=C(CCCC3)C2=O)=O)=C1O UZOYICMDDCNJJG-UHFFFAOYSA-N 0.000 description 2
- KANZWHBYRHQMKZ-UHFFFAOYSA-N 2-ethenylpyrazine Chemical compound C=CC1=CN=CC=N1 KANZWHBYRHQMKZ-UHFFFAOYSA-N 0.000 description 2
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- FKAWETHEYBZGSR-UHFFFAOYSA-N 3-methylidenepyrrolidine-2,5-dione Chemical compound C=C1CC(=O)NC1=O FKAWETHEYBZGSR-UHFFFAOYSA-N 0.000 description 2
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920001651 Cyanoacrylate Polymers 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 229920005549 butyl rubber Polymers 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 125000005670 ethenylalkyl group Chemical group 0.000 description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 229920003052 natural elastomer Polymers 0.000 description 2
- 229920001194 natural rubber Polymers 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229940068886 polyethylene glycol 300 Drugs 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
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- 238000012360 testing method Methods 0.000 description 2
- 238000002411 thermogravimetry Methods 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- IAUGBVWVWDTCJV-UHFFFAOYSA-N 1-(prop-2-enoylamino)propane-1-sulfonic acid Chemical compound CCC(S(O)(=O)=O)NC(=O)C=C IAUGBVWVWDTCJV-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- SJLLJZNSZJHXQN-UHFFFAOYSA-N 1-dodecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCN1C(=O)C=CC1=O SJLLJZNSZJHXQN-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 1
- DCRYNQTXGUTACA-UHFFFAOYSA-N 1-ethenylpiperazine Chemical compound C=CN1CCNCC1 DCRYNQTXGUTACA-UHFFFAOYSA-N 0.000 description 1
- PBGPBHYPCGDFEZ-UHFFFAOYSA-N 1-ethenylpiperidin-2-one Chemical compound C=CN1CCCCC1=O PBGPBHYPCGDFEZ-UHFFFAOYSA-N 0.000 description 1
- CSCSROFYRUZJJH-UHFFFAOYSA-N 1-methoxyethane-1,2-diol Chemical compound COC(O)CO CSCSROFYRUZJJH-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- BFYSJBXFEVRVII-UHFFFAOYSA-N 1-prop-1-enylpyrrolidin-2-one Chemical compound CC=CN1CCCC1=O BFYSJBXFEVRVII-UHFFFAOYSA-N 0.000 description 1
- NQDOCLXQTQYUDH-UHFFFAOYSA-N 1-propan-2-ylpyrrole-2,5-dione Chemical compound CC(C)N1C(=O)C=CC1=O NQDOCLXQTQYUDH-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- KQSMCAVKSJWMSI-UHFFFAOYSA-N 2,4-dimethyl-1-n,1-n,3-n,3-n-tetrakis(oxiran-2-ylmethyl)benzene-1,3-diamine Chemical compound CC1=C(N(CC2OC2)CC2OC2)C(C)=CC=C1N(CC1OC1)CC1CO1 KQSMCAVKSJWMSI-UHFFFAOYSA-N 0.000 description 1
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- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
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- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellityc acid Natural products OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- VOVUARRWDCVURC-UHFFFAOYSA-N thiirane Chemical compound C1CS1 VOVUARRWDCVURC-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/04—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/24—Presence of a foam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Definitions
- the present invention relates to a pressure-sensitive adhesive sheet.
- the pressure-sensitive adhesive sheet containing the thermally expandable microspheres has the following feature: while the sheet has a predetermined pressure-sensitive adhesive strength, the pressure-sensitive adhesive strength is decreased or eliminated by expanding the thermally expandable microspheres through heating to form unevenness on its pressure-sensitive adhesive surface, resulting in a reduced contact area.
- Such pressure-sensitive adhesive sheet has an advantage in that the workpiece can be easily peeled therefrom without an external stress.
- the present invention has been made to solve the problem of the related art described above, and an object of the present invention is to provide a pressure-sensitive adhesive sheet capable of allowing a small electronic part (e.g., a chip having a size of 100 ⁇ m/ ⁇ or less) to be temporarily fixed in a satisfactory manner and satisfactorily peeled.
- a small electronic part e.g., a chip having a size of 100 ⁇ m/ ⁇ or less
- a pressure-sensitive adhesive sheet including: a gas-generating layer; and a gas barrier layer arranged on at least one side of the gas-generating layer, wherein the gas barrier layer is a layer having a surface that is deformed through laser light irradiation of the pressure-sensitive adhesive sheet, wherein a thickness ( ⁇ m) of a highly elastic portion of the gas barrier layer is equal to or smaller than a value calculated by the following expression (1), and wherein the thickness ( ⁇ m) of the highly elastic portion of the gas barrier layer is equal to or larger than a value calculated by the following expression (2):
- Er represents a modulus of elasticity (MPa) of the highly elastic portion of the gas barrier layer by a nanoindentation method at 25° C.
- the gas-generating layer is a layer capable of absorbing UV light.
- the gas-generating layer contains a UV absorber.
- the gas barrier layer includes a pressure-sensitive adhesive layer.
- the gas barrier layer further includes an intermediate layer.
- the modulus of elasticity of the highly elastic portion of the gas barrier layer by the nanoindentation method is from 0.01 MPa to 10 GPa.
- the gas barrier layer has a thickness of from 0.1 ⁇ m to 200 ⁇ m.
- a deformation amount of the surface of the gas barrier layer caused by laser light irradiation of the gas barrier layer is 0.6 ⁇ m or more in terms of vertical displacement of the gas barrier layer.
- the pressure-sensitive adhesive sheet has a piercing strength of from 10 mN to 5,000 mN.
- an elongation of the pressure-sensitive adhesive sheet in a normal direction is 0.1 mm or more.
- the intermediate layer contains a thermoplastic resin.
- the intermediate layer is a resin film formed from a styrene-based elastomer.
- the intermediate layer contains a curable resin.
- the curable resin is a UV-curable resin.
- the method of treating an electronic part includes: bonding an electronic part onto the pressure-sensitive adhesive sheet; and peeling the electronic part from the pressure-sensitive adhesive sheet by irradiating the pressure-sensitive adhesive sheet with laser light.
- the peeling the electronic part is performed in a position-selective manner.
- the method of treating an electronic part further includes subjecting the electronic part to a predetermined treatment after the bonding the electronic part onto the pressure-sensitive adhesive sheet and before the peeling the electronic part from the pressure-sensitive adhesive sheet.
- the treatment is grinding processing, dicing processing, die bonding, wire bonding, etching, vapor deposition, molding, circuit formation, inspection, a product check, cleaning, transfer, arrangement, repair, or protection of a device surface.
- the method of treating an electronic part further includes placing the electronic part on another sheet after the peeling the electronic part from the pressure-sensitive adhesive sheet.
- the pressure-sensitive adhesive sheet capable of allowing a small electronic part (e.g., a chip having a size of 100 ⁇ m ⁇ or less) to be temporarily fixed in a satisfactory manner, the pressure-sensitive adhesive sheet being capable of allowing the small electronic part to be satisfactorily peeled by virtue of including the gas-generating layer capable of generating a gas through laser light irradiation.
- FIG. 1 is a schematic sectional view of a pressure-sensitive adhesive sheet according to one embodiment of the present invention.
- FIG. 2 is a schematic sectional view of a pressure-sensitive adhesive sheet according to another embodiment of the present invention.
- FIG. 3 is a schematic view for illustrating a method of measuring a piercing strength and an elongation in a normal direction.
- FIG. 1 is a schematic sectional view of a pressure-sensitive adhesive sheet according to a preferred embodiment of the present invention.
- a pressure-sensitive adhesive sheet 100 includes a gas-generating layer 10 and a gas barrier layer 20 arranged on at least one surface of the gas-generating layer 10 .
- the gas-generating layer 10 generates a gas through laser light irradiation. More specifically, the gas-generating layer 10 is a layer that generates a gas through the gasification of a component thereof by laser light irradiation. UV laser light is typically used as the laser light.
- the gas barrier layer 20 is capable of having its surface deformed by irradiating the pressure-sensitive adhesive sheet (substantially the gas-generating layer) with laser light. In one embodiment, the deformation may be caused by the gas generated from the gas-generating layer 10 to occur on the opposite side of the gas barrier layer 20 to the gas-generating layer 10 .
- UV laser light is typically used as the laser light.
- the gas barrier layer 20 includes a pressure-sensitive adhesive layer 21 .
- the pressure-sensitive adhesive layer 21 may be typically arranged on the outermost side of the pressure-sensitive adhesive sheet 100 .
- the pressure-sensitive adhesive sheet of the present invention may be used by bonding a workpiece such as an electronic part to the pressure-sensitive adhesive layer.
- the pressure-sensitive adhesive sheet of the present invention includes the gas-generating layer, and partly generates a gas in a fine range through laser light irradiation.
- the gas generation causes the pressure-sensitive adhesive layer to deform, and as a result, peelability is expressed in the portion irradiated with laser light.
- the laser light is typically radiated from the opposite side of the gas-generating layer to the pressure-sensitive adhesive layer.
- the gas barrier layer is arranged as described above, and hence an unnecessary escape of the gas generated from the gas-generating layer is prevented, with the result that the pressure-sensitive adhesive layer is satisfactorily deformed through laser light irradiation.
- the deformation can be caused in a fine range as described above, and hence, even in the processing of a small electronic part that is extremely fine, the small electronic part can be satisfactorily peeled.
- a small electronic part that needs to be peeled and a small electronic part that does not need to be peeled are temporarily fixed so as to be adjacent to each other, it is possible to perform peeling at the site to be peeled and prevent peeling at the site not to be peeled. That is, only the small electronic part that needs to be peeled can be peeled, and unnecessary separation of a small electronic part can be prevented.
- the pressure-sensitive adhesive sheet is excellent in directivity at the time of peeling and peelable only at a desired site, and hence has an advantage in that breakage is prevented and an adhesive residue is reduced as well.
- the directivity at the time of peeling is an indicator showing positional accuracy when an adherend such as a small electronic part is to be peeled from the pressure-sensitive adhesive sheet and ejected toward a place at a certain distance. When the directivity is excellent, the adherend is prevented from flying in an unexpected direction at the time of peeling.
- the deformation of the gas barrier layer means a displacement occurring in a direction horizontal with respect to the normal direction (thickness direction) of the gas barrier layer (direction orthogonal to the thickness direction).
- the deformation of the gas barrier layer is caused by, for example, performing a pulse scan with UV laser light having a wavelength of 355 nm and a beam diameter of about 20 ⁇ m ⁇ at an output of 0.80 mW and a frequency of 40 kHz to generate a gas from the gas-generating layer.
- a shape after the deformation is observed, for example, from measurement with a confocal laser microscope, a noncontact interference microscope (WYKO), or the like on any appropriate one spot subjected to the pulse scan after 1 minute from the laser light irradiation.
- the shape may be foaming (protrusion), a through-hole (unevenness), or a recess (depression), and any such deformation may generate peelability.
- a change in displacement in the normal direction between before and after the laser light irradiation is preferably large, and such a change as to form a foaming shape is particularly suitable.
- the foaming (protrusion) its highest point and full width at half maximum with reference to an unirradiated portion of the surface of the pressure-sensitive adhesive sheet are defined as a vertical displacement Y and a horizontal displacement X (diameter), respectively.
- the vertical displacement of the gas barrier layer is preferably 0.6 ⁇ m or more, more preferably 0.7 ⁇ m or more, still more preferably 1.0 ⁇ m or more. When the vertical displacement falls within such ranges, the peelability is excellent, and the directivity at the time of peeling is excellent.
- the upper limit of the vertical displacement is, for example, 10 ⁇ m (preferably 20 ⁇ m).
- the horizontal displacement of the gas barrier layer is preferably 60 ⁇ m or less, more preferably 50 ⁇ m or less, still more preferably 40 ⁇ m or less. When the horizontal displacement falls within such ranges, a small adherend can be preferably peeled only at a desired site. In addition, even when adherends are arranged at a small interval, a similar effect can be expected.
- the lower limit of the horizontal displacement is, for example, 3 ⁇ m (preferably 4 ⁇ m).
- FIG. 2 is a schematic sectional view of a pressure-sensitive adhesive sheet according to another embodiment of the present invention.
- the gas barrier layer 20 further includes an intermediate layer 22 .
- the pressure-sensitive adhesive sheet 200 includes the pressure-sensitive adhesive layer 21 , the intermediate layer 22 , and the gas-generating layer 10 in the stated order.
- the intermediate layer is arranged, the shape of the deformed portion can be easily controlled.
- a pressure-sensitive adhesive sheet improved in gas barrier property and capable of forming a deformed portion in a more preferred manner can be obtained.
- the intermediate layer may be a single layer, or may be a multilayer.
- the pressure-sensitive adhesive sheet may further include another layer (not shown).
- a base material, another pressure-sensitive adhesive layer, or the like may be arranged on the surface of the gas-generating layer on the opposite side to the gas barrier layer.
- a film formed from any appropriate resin is used as the base material.
- a thickness ( ⁇ m) of a highly elastic portion of the gas barrier layer is equal to or smaller than a value calculated by the following expression (1), and the thickness ( ⁇ m) of the highly elastic portion of the gas barrier layer is equal to or larger than a value calculated by the following expression (2):
- Er represents a modulus of elasticity (MPa) of the highly elastic portion of the gas barrier layer by a nanoindentation method.
- the thickness ( ⁇ m) of the highly elastic portion of the gas barrier layer is equal to or smaller than a value calculated by the following expression (3), and the thickness ( ⁇ m) of the highly elastic portion of the gas barrier layer is equal to or larger than a value calculated by the following expression (4):
- the thickness ( ⁇ m) of the highly elastic portion of the gas barrier layer is equal to or smaller than a value calculated by the following expression (5), and the thickness ( ⁇ m) of the highly elastic portion of the gas barrier layer is equal to or larger than a value calculated by the following expression (6):
- the term “highly elastic portion of the gas barrier layer” as used herein means the gas barrier layer itself (the pressure-sensitive adhesive layer when the gas barrier layer is formed of a single layer that is the pressure-sensitive adhesive layer), and when the gas barrier layer has a multilayer configuration (e.g., when the gas barrier layer is formed of the pressure-sensitive adhesive layer and the intermediate layer), the term means the layer having the highest modulus of elasticity.
- the “thickness of the highly elastic portion of the gas barrier layer” may correspond to the thickness of the intermediate layer
- the “modulus of elasticity of the highly elastic portion of the gas barrier layer by the nanoindenter method at 25° C.” may correspond to such modulus of elasticity of the intermediate layer.
- the modulus of elasticity by the nanoindentation method is obtained by: perpendicularly pressing a Berkovich (triangular pyramid-shaped) probe made of diamond against a sectional surface cut out of a layer serving as a measurement object; and subjecting the thus obtained displacement-load hysteresis curve to numerical processing with software (TriboScan) included with a measurement apparatus.
- the term “modulus of elasticity” refers to a modulus of elasticity measured with a nanoindenter (Triboindenter TI-950 manufactured by Hysitron, Inc.) by a single indentation method at a predetermined temperature (25° C.) under the measurement conditions of an indentation speed of about 500 nm/sec, a drawing speed of about 500 nm/sec, and an indentation depth of about 1,500 nm.
- the modulus of elasticity means the modulus of elasticity of the sectional surface by the nanoindentation method.
- the thickness ( ⁇ m) of the highly elastic portion of the gas barrier layer is equal to or smaller than the value calculated by the expression (1), and hence there can be provided a pressure-sensitive adhesive sheet that is excellent in peelability because its gas barrier layer sufficiently deforms.
- the thickness ( ⁇ m) of the highly elastic portion of the gas barrier layer is equal to or larger than the value calculated by the expression (2), and hence there can be provided a pressure-sensitive adhesive sheet that hardly causes a failure such as rupture because excessive deformation of its gas barrier layer is prevented.
- the present invention by virtue of the configuration in which the upper limit and lower limit of the thickness ( ⁇ m) of the highly elastic portion of the gas barrier layer satisfy the expressions (1) and (2), deformation occurs in a preferred manner through gas generation, the rupture or the like of the deformed portion hardly occurs, and even in the processing of a small electronic part, the small electronic part can be peeled satisfactorily (that is, with good peelability, in a selective manner, and with an adhesive residue being prevented).
- the pressure-sensitive adhesive strength of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet of the present invention with respect to SUS430 is preferably 0.1 N/20 mm or more, more preferably from 0.2 N/20 mm to 50 N/20 mm, still more preferably from 0.5 N/20 mm to 40 N/20 mm, particularly preferably from 0.7 N/20 mm to 20 N/20 mm, most preferably from 1 N/20 mm to 10 N/20 mm.
- a pressure-sensitive adhesive sheet showing a pressure-sensitive adhesive property satisfactory as a temporary fixing sheet to be used in the production of an electronic part can be obtained.
- pressure-sensitive adhesive strength refers to a pressure-sensitive adhesive strength measured under an environment at 23° C. by a method in conformity with JIS Z 0237:2000 (bonding conditions: one pass back and forth with a 2 kg roller, tensile rate: 300 mm/min, peel angle: 180°).
- the gas-generating layer has a predetermined pressure-sensitive adhesive strength.
- the pressure-sensitive adhesive strength of the gas-generating layer of the pressure-sensitive adhesive sheet of the present invention with respect to SUS430 is preferably 0.1 N/20 mm or more, more preferably from 0.5 N/20 mm to 50 N/20 mm, still more preferably from 1 N/20 mm to 40 N/20 mm, particularly preferably from 1.5 N/20 mm to 30 N/20 mm, most preferably from 2 N/20 mm to 20 N/20 mm.
- a pressure-sensitive adhesive sheet showing a pressure-sensitive adhesive property satisfactory as a temporary fixing sheet to be used in the production of an electronic part can be obtained.
- the thickness of the pressure-sensitive adhesive sheet of the present invention is preferably from 2 ⁇ m to 200 ⁇ m, more preferably from 3 ⁇ m to 150 ⁇ m, still more preferably from 5 ⁇ m to 120 ⁇ m.
- the water vapor transmission rate of the pressure-sensitive adhesive sheet of the present invention is preferably 5,000 g/(m 2 ⁇ day) or less, more preferably 4,800 g/(m 2 ⁇ day) or less, still more preferably 4,500 g/(m 2 ⁇ day) or less, still more preferably 4,200 g/(m 2 ⁇ day) or less.
- the pressure-sensitive adhesive sheet having a water vapor transmission rate in such ranges the escape of the gas generated through laser light irradiation is prevented, and hence a deformed portion of an excellent shape is formed in the gas barrier layer.
- a small adherend e.g., electronic part
- the water vapor transmission rate of the pressure-sensitive adhesive sheet of the present invention is preferably as small as possible, but its lower limit value is, for example, 0.1 g/(m 2 ⁇ day).
- the water vapor transmission rate may be measured under an atmosphere at 30° C. and 90% RH by a measurement method in conformity with JIS K7129B.
- the piercing strength of the pressure-sensitive adhesive sheet of the present invention is preferably from 10 mN to 5,000 mN, more preferably from 30 mN to 4,000 mN, still more preferably from 50 mN to 3,000 mN, particularly preferably from 100 mN to 2,000 mN.
- a pressure-sensitive adhesive sheet that deforms in a preferred manner through gas generation and hardly causes the rupture and the like of a deformed portion can be obtained.
- a small adherend e.g., electronic part
- the piercing strength is measured by sandwiching a sample 4 (e.g., the pressure-sensitive adhesive sheet) between sample holders 5 A and 5 B having a circular opening with a diameter of 11.28 mm through use of a compression testing machine 6 (manufactured by Kato Tech Co., Ltd., product name: “KES-G5”). More specifically, a piercing needle (radius of curvature: 1 mm) is caused to pierce the sample (piercing speed: 0.1 mm/s) at the center of the circular opening under a measurement temperature of 23° C., and the maximum load at the breaking point may be defined as the piercing strength.
- the piercing strength of the pressure-sensitive adhesive sheet may be a characteristic dependent on the mechanical characteristics of the gas barrier layer.
- the elongation of the pressure-sensitive adhesive sheet in a normal direction is preferably 0.1 mm or more, more preferably 0.5 mm or more, still more preferably 0.8 mm or more.
- a protrusion having a small diameter can be formed in the surface of the barrier layer.
- a small adherend e.g., electronic part
- the upper limit of the elongation of the pressure-sensitive adhesive sheet in the normal direction is, for example, 50 mm.
- the elongation in the normal direction corresponds to the distance by which the piercing needle is pushed at the breaking point in the measurement of the piercing strength, and means the elongation of the sample (e.g., the pressure-sensitive adhesive sheet) in its plane direction.
- the haze value of the pressure-sensitive adhesive sheet of the present invention is preferably 50% or less, more preferably from 0.1% to 40%, still more preferably from 0.2% to 30%.
- an adherend e.g., a table for temporarily fixing an electronic part
- the pressure-sensitive adhesive sheet of the present invention can have a configuration in which each layer included in the pressure-sensitive adhesive sheet is free of an insoluble filler, and hence a pressure-sensitive adhesive sheet having a small haze value and being excellent in adherend visibility as described above can be obtained.
- Such effect is an excellent effect that cannot be obtained with a pressure-sensitive adhesive sheet containing an insoluble filler (e.g., thermally expandable microspheres).
- the UV light transmittance of the pressure-sensitive adhesive sheet at a wavelength of 360 nm is preferably 30% or less, more preferably 20% or less, still more preferably 15% or less, particularly preferably 10% or less, most preferably 5% or less.
- the lower limit of the UV light transmittance of the pressure-sensitive adhesive sheet at a wavelength of 360 nm is, for example, 0% (preferably 0.05%, more preferably 0.1%).
- the 10% weight loss temperature of the pressure-sensitive adhesive sheet is preferably from 200° C. to 500° C., more preferably from 220° C. to 450° C., still more preferably from 250° C. to 400° C., particularly preferably from 270° C. to 370° C.
- a pressure-sensitive adhesive sheet capable of forming a more satisfactory deformed portion through laser light irradiation can be obtained.
- the 10% weight loss temperature of the pressure-sensitive adhesive sheet means a temperature at the time point when the weight of the pressure-sensitive adhesive sheet in TGA analysis at the time of an increase in temperature of the pressure-sensitive adhesive sheet reduces by 10 wt % as compared to the weight thereof before the temperature increase (that is, the weight of the pressure-sensitive adhesive sheet becomes 90% as compared to the weight thereof before irradiation).
- the gas-generating layer may be a layer capable of absorbing UV light.
- the gas-generating layer contains a UV absorber.
- a gas-generating layer capable of absorbing laser light to gasify can be formed.
- the gas-generating layer typically contains the UV absorber and a pressure-sensitive adhesive A.
- the UV absorber preferably exists dissolved in the pressure-sensitive adhesive A.
- a pressure-sensitive adhesive sheet that can generate a deformed portion (e.g., an uneven portion) at any site of its gas barrier layer and has little variation among the shapes of deformed portions (e.g., uneven portions) can be obtained.
- the state of “existing dissolved in the pressure-sensitive adhesive” means that the UV absorber does not exist as particles in the gas-generating layer.
- the gas-generating layer is preferably free of a UV absorber having a particle diameter of 10 ⁇ m or more in the measurement of a particle distribution in a sectional surface of the gas-generating layer by X-ray CT.
- the gas-generating layer may or may not contain a component insoluble in the pressure-sensitive adhesive.
- the presence or absence and content of the insoluble component in the gas-generating layer are estimated on the basis of the haze value of the gas-generating layer, and as the haze value becomes lower, the content of the insoluble component in the gas-generating layer is estimated to be smaller. It is preferred that the gas-generating layer be substantially free of the component insoluble in the pressure-sensitive adhesive.
- the modulus of elasticity of the gas-generating layer (sectional surface of the gas-generating layer) by the nanoindentation method is preferably from 0.01 MPa to 1,000 MPa, more preferably from 0.05 MPa to 800 MPa.
- the modulus of elasticity of the gas-generating layer may be adjusted on the basis of, for example, the kind of a material contained in the layer of interest, the structure of a base polymer forming the material, and the kind and amount of an additive added to the layer of interest.
- the modulus of elasticity of the surface of the gas-generating layer by the nanoindentation method is preferably from 0.01 MPa to 1,000 MPa, more preferably from 0.05 MPa to 800 MPa. When the modulus of elasticity falls within such ranges, a change in shape of the gas-generating layer caused by gas generation occurs in a preferred manner, and as a result, a deformed portion of an excellent shape is formed in the gas barrier layer.
- the modulus of elasticity by the nanoindentation method refers to a modulus of elasticity determined from an applied load-indentation depth curve obtained by continuously measuring, during loading and unloading, an applied load to an indenter and an indentation depth when the indenter is pushed into a sample (e.g., a pressure-sensitive adhesive surface).
- the modulus of elasticity by the nanoindentation method is obtained by: perpendicularly pressing a Berkovich (triangular pyramid-shaped) probe made of diamond; and subjecting the thus obtained displacement-load hysteresis curve to numerical processing with software (TriboScan) included with a measurement apparatus.
- the term “modulus of elasticity of the surface by the nanoindentation method” refers to a modulus of elasticity measured with a nanoindenter (Triboindenter TI-950 manufactured by Hysitron, Inc.) by a single indentation method at a predetermined temperature (25° C.) under the measurement conditions of an indentation speed of about 500 nm/sec, a drawing speed of about 500 nm/sec, and an indentation depth of about 3,000 nm.
- the modulus of elasticity of the gas-generating layer may be adjusted on the basis of, for example, the kind of a material contained in the layer of interest, the structure of a base polymer forming the material, and the kind and amount of an additive added to the layer of interest.
- a modulus of elasticity by the nanoindentation method measured by the above-mentioned method using a sectional surface as a measurement surface and a modulus of elasticity by the nanoindentation method measured by the above-mentioned method using a surface as a measurement surface do not significantly differ from each other, and hence, when it is difficult to perform measurement from the sectional surface, a value measured from the surface may be adopted as a value measured from the sectional surface.
- the gasification starting temperature of the gas-generating layer is preferably from 150° C. to 500° C., more preferably from 170° C. to 450° C., still more preferably from 190° C. to 420° C., particularly preferably from 200° C. to 400° C.
- the gasification starting temperature of the gas-generating layer means a gas generation rise-up temperature calculated from EGA analysis at the time of an increase in temperature of the pressure-sensitive adhesive sheet.
- the gas generation rise-up temperature is defined as a temperature at which the half value of the highest gas generation peak of an EGA/MS spectrum obtained from EGA analysis is reached. As the gasification starting temperature becomes lower, the temperature at which a gas starts to be generated at the time of laser light irradiation becomes lower, and hence a sufficient amount of the gas is generated even when the laser light irradiation is performed with a smaller output.
- the gasification starting temperature of the gas-generating layer corresponds to the gasification starting temperature of the UV absorber.
- the 10% weight loss temperature of the gas-generating layer is preferably from 150° C. to 500° C., more preferably from 170° C. to 450° C., still more preferably from 200° C. to 400° C. When the 10% weight loss temperature falls within such ranges, a pressure-sensitive adhesive sheet capable of forming a more satisfactory deformed portion through laser light irradiation can be obtained.
- the 10% weight loss temperature of the gas-generating layer means a temperature at the time point when the weight of the gas-generating layer in TGA analysis at the time of an increase in temperature of the pressure-sensitive adhesive sheet (e.g., at the time of an increase in temperature thereof through laser light irradiation) reduces by 10 wt % as compared to the weight thereof before the temperature increase (that is, the weight of the gas-generating layer becomes 90% as compared to the weight thereof before the temperature increase).
- the thickness of the gas-generating layer is preferably from 0.1 ⁇ m to 50 ⁇ m, more preferably from 1 ⁇ m to 40 ⁇ m, still more preferably from 2 ⁇ m to 30 ⁇ m, particularly preferably from 5 ⁇ m to 20 ⁇ m.
- a pressure-sensitive adhesive sheet capable of forming a more satisfactory deformed portion through laser light irradiation can be obtained.
- the modulus of elasticity Er(gas) [unit: MPa] of the gas-generating layer by the nanoindentation method and the thickness h(gas) [unit: ⁇ m] thereof satisfy the following expression (i).
- the gas-generating layer is configured to satisfy the expression (1), and hence excessive deformation by the gas generated from the gas-generating layer is prevented, and the pressure-sensitive adhesive sheet is satisfactorily deformed through laser light irradiation.
- the gas-generating layer is formed, surface deformation in a fine range can be caused without arranging a thick barrier layer as a layer for preventing excessive deformation, and hence the gas barrier layer can be flexibly configured.
- the modulus of elasticity Er(gas) [unit: MPa] by the nanoindentation method and the thickness h(gas) [unit: ⁇ m] satisfy the following expression (ii). In one embodiment, the modulus of elasticity Er(gas) [unit: MPa] by the nanoindentation method and the thickness h(gas) [unit: ⁇ m] satisfy the following expression (iii).
- the modulus of elasticity Er(gas) [unit: MPa] by the nanoindentation method and the thickness h(gas) [unit: ⁇ m] further satisfy the following expression (iv).
- the UV light transmittance of the gas-generating layer at a wavelength of 360 nm is preferably 30% or less, more preferably 20% or less, still more preferably 15% or less, particularly preferably 10% or less, most preferably 5% or less.
- the lower limit of the UV light transmittance of the gas-generating layer at a wavelength of 360 nm is, for example, 0% (preferably 0.05%, more preferably 0.1%).
- the haze value of the gas-generating layer is preferably 55% or less, more preferably from 0.1% to 50%, still more preferably from 0.5% to 40%.
- any appropriate UV absorber may be used as the UV absorber as long as the effect of the present invention is obtained.
- the UV absorber include a benzotriazole-based UV absorber, a benzophenone-based UV absorber, a triazine-based UV absorber, a salicylate-based UV absorber, and a cyanoacrylate-based UV absorber.
- a triazine-based UV absorber or a benzotriazole-based UV absorber is preferred, and a triazine-based UV absorber is particularly preferred.
- the triazine-based UV absorber may be preferably used because of its high compatibility with the base polymer of the acrylic pressure-sensitive adhesive.
- the triazine-based UV absorber more preferably includes a compound having a hydroxy group, and is particularly preferably a UV absorber (hydroxyphenyltriazine-based UV absorber) including a hydroxyphenyltriazine-based compound.
- hydroxyphenyltriazine-based UV absorber examples include a reaction product of 2-(4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl)-5-hydroxyphenyl and a [(C10-C16 (mainly C12-C13) alkyloxy)methyl]oxirane (product name: “TINUVIN 400”, manufactured by BASF SE), 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy]phenol, a reaction product of 2-(2,4-dihydroxyphenyl)-4,6-bis-(2,4-dimethylphenyl)-1,3,5-triazine and (2-ethylhexyl)-glycidic acid ester (product name: “TINUVIN 405”, manufactured by BASF SE), 2,4-bis(2-hydroxy-4-butoxyphenyl)-6-(2,4-
- benzotriazole-based UV absorber examples include 2-(2-hydroxy-5-tert-butylphenyl)-2H-benzotriazole (product name: “TINUVIN PS”, manufactured by BASF SE), an ester compound of benzenepropanoic acid and 3-(2H-benzotriazol-2-yl)-5-(1,1-dimethylethyl)-4-hydroxy (C7-9 side chain and linear alkyl) (product name: “TINUVIN 384-2”, manufactured by BASF SE), a mixture of octyl 3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate and 2-ethylhexyl-3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate (product name: “TINUVIN 109”, manufactured
- the molecular weight of the compound for forming the UV absorber is preferably from 200 to 1,500, more preferably from 250 to 1,200, still more preferably from 300 to 1,000. When the molecular weight falls within such ranges, a pressure-sensitive adhesive sheet that can form a more satisfactory deformed portion through laser light irradiation can be obtained.
- the maximum absorption wavelength of the UV absorber is preferably from 300 nm to 450 nm, more preferably from 320 nm to 400 nm, still more preferably from 330 nm to 380 nm.
- the content ratio of the UV absorber is preferably from 1 part by weight to 100 parts by weight, more preferably from 1 part by weight to 50 parts by weight, still more preferably from 5 parts by weight to 30 parts by weight with respect to 100 parts by weight of the gas-generating layer.
- the content ratio falls within such ranges, a pressure-sensitive adhesive sheet capable of forming a more satisfactory deformed portion through laser light irradiation can be obtained.
- a pressure-sensitive adhesive A having pressure sensitivity is preferably used as the pressure-sensitive adhesive A contained in the gas-generating layer.
- the pressure-sensitive adhesive A include an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, a vinyl alkyl ether-based pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, a polyester-based pressure-sensitive adhesive, a polyamide-based pressure-sensitive adhesive, a urethane-based pressure-sensitive adhesive, and a styrene-diene block copolymer-based pressure-sensitive adhesive.
- an acrylic pressure-sensitive adhesive or a rubber-based pressure-sensitive adhesive is preferred, and an acrylic pressure-sensitive adhesive is more preferred.
- the pressure-sensitive adhesives may be used alone or in combination thereof.
- acrylic pressure-sensitive adhesive is an acrylic pressure-sensitive adhesive containing, as a base polymer, an acrylic polymer (homopolymer or copolymer) using one or two or more kinds of (meth)acrylic acid alkyl esters as a monomer component.
- the (meth)acrylic acid alkyl ester include (meth)acrylic acid C1-20 alkyl esters, such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (
- the acrylic polymer may contain a unit corresponding to any other monomer component copolymerizable with the (meth)acrylic acid alkyl ester, as required, for the purpose of modification of cohesive strength, heat resistance, cross-linkability, or the like.
- monomer component include: carboxyl group-containing monomers, such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; acid anhydride monomers, such as maleic anhydride and itaconic anhydride; hydroxyl group-containing monomers, such as hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxyhexyl (meth)acrylate, hydroxyoctyl (meth)acrylate, hydroxydecyl (meth)acrylate, hydroxylauryl (meth)acrylate,
- the rubber-based pressure-sensitive adhesive is, for example, a rubber-based pressure-sensitive adhesive including, as a base polymer, a natural rubber, or a synthetic rubber, such as a polyisoprene rubber, a styrene-butadiene (SB) rubber, a styrene-isoprene (SI) rubber, a styrene-isoprene-styrene block copolymer (SIS) rubber, a styrene-butadiene-styrene block copolymer (SBS) rubber, a styrene-ethylene-butylene-styrene block copolymer (SEBS) rubber, a styrene-ethylene-propylene-styrene block copolymer (SEPS) rubber, a styrene-ethylene-propylene block copolymer (SEP) rubber, a reclaimed rubber, a butyl rubber,
- the gas generated from the gas-generating layer is preferably a hydrocarbon (preferably aliphatic hydrocarbon)-based gas.
- a gas-generating layer capable of generating a hydrocarbon-based gas is formed using, for example, a hydrocarbon-based compound as a main component.
- the gas-generating layer is preferably free of a compound containing a halogen element.
- the corrosion of an electronic part serving as a workpiece can be prevented. Such effect is made more remarkable by forming a gas-generating layer free of a compound containing a halogen element.
- the formula weight of an ion generated from the gas-generating layer is preferably from 10 m/z to 800 m/z, more preferably from 11 m/z to 700 m/z, still more preferably from 12 m/z to 500 m/z, particularly preferably from 13 m/z to 400 m/z.
- the pressure-sensitive adhesive A may contain any appropriate additive as required.
- the additive include a cross-linking agent, a tackifier (e.g., a rosin-based tackifier, a terpene-based tackifier, or a hydrocarbon-based tackifier), a plasticizer (e.g., a trimellitic acid ester-based plasticizer or a pyromellitic acid ester-based plasticizer), a pigment, a dye, an age resistor, a conductive material, an antistatic agent, a light stabilizer, a peeling modifier, a softener, a surfactant, a flame retardant, and an antioxidant.
- a cross-linking agent e.g., a rosin-based tackifier, a terpene-based tackifier, or a hydrocarbon-based tackifier
- a plasticizer e.g., a trimellitic acid ester-based plasticizer or a py
- cross-linking agent examples include an isocyanate-based cross-linking agent, an epoxy-based cross-linking agent, a melamine-based cross-linking agent, a peroxide-based cross-linking agent, a urea-based cross-linking agent, a metal alkoxide-based cross-linking agent, a metal chelate-based cross-linking agent, a metal salt-based cross-linking agent, a carbodiimide-based cross-linking agent, an oxazoline-based cross-linking agent, an aziridine-based cross-linking agent, and an amine-based cross-linking agent.
- an isocyanate-based cross-linking agent or an epoxy-based cross-linking agent is preferred.
- isocyanate-based cross-linking agent examples include: lower aliphatic polyisocyanates, such as butylene diisocyanate and hexamethylene diisocyanate; alicyclic isocyanates, such as cyclopentylene diisocyanate, cyclohexylene diisocyanate, and isophorone diisocyanate; aromatic isocyanates, such as 2,4-tolylene diisocyanate, 4,4′-diphenylmethane diisocyanate, and xylylene diisocyanate; and isocyanate adducts, such as a trimethylolpropane/tolylene diisocyanate trimer adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., product name “Coronate L”), a trimethylolpropane/hexamethylene diisocyanate trimer adduct (manufactured by Nippon Polyurethane Industry Co., Ltd
- the content of the isocyanate-based cross-linking agent may be set to any appropriate amount depending on the desired pressure-sensitive adhesive strength, and is typically from 0.1 part by weight to 20 parts by weight, more preferably from 0.5 part by weight to 10 parts by weight with respect to 100 parts by weight of the base polymer.
- epoxy-based cross-linking agent examples include N,N,N′,N′-tetraglycidyl-m-xylenediamine, diglycidylaniline, 1,3-bis(N,N-glycidylaminomethyl)cyclohexane (manufactured by Mitsubishi Gas Chemical Company, Inc., product name “TETRAD-C”), 1,6-hexanediol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., product name “Epolite 1600”), neopentyl glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., product name “Epolite 1500NP”), ethylene glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., product name “Epolite 40E”), propylene glycol diglycidyl ether (manufactured by Kyoeisha Chemical
- the content of the epoxy-based cross-linking agent may be set to any appropriate amount depending on the desired pressure-sensitive adhesive strength, and is typically from 0.01 part by weight to 10 parts by weight, more preferably from 0.03 part by weight to 5 parts by weight with respect to 100 parts by weight of the base polymer.
- gas barrier layer means a layer having a water vapor transmission rate of 10,000 g/(m 2 ⁇ day) or less.
- the water vapor transmission rate of the gas barrier layer is preferably 7,000 g/(m 2 ⁇ day) or less, more preferably 5,000 g/(m 2 ⁇ day) or less, still more preferably 4,800 g/(m 2 ⁇ day) or less, particularly preferably 4,500 g/(m 2 ⁇ day) or less, most preferably 4,200 g/(m 2 ⁇ day) or less.
- the water vapor transmission rate of the gas barrier layer is preferably as small as possible, but its lower limit value is, for example, 1 g/(m 2 ⁇ day).
- the piercing strength of the gas barrier layer is preferably from 10 mN to 5,000 mN, more preferably from 30 mN to 4,000 mN, still more preferably from 50 mN to 3,000 mN, particularly preferably from 100 mN to 2,000 mN.
- the gas barrier layer satisfactorily functions, and besides, a change in shape due to gas generation occurs in a preferred manner, with the result that a deformed portion of an excellent shape is formed in the gas barrier layer (pressure-sensitive adhesive layer).
- a small adherend e.g., electronic part
- a gas barrier layer excellent in gas barrier property is formed.
- a change in shape of the gas barrier layer due to gas generation occurs in a preferred manner, and as a result, a depression of an excellent shape is formed.
- the gas barrier layer is likely to change in shape in its thickness direction at the time of the generation of a gas through irradiation with laser light, and as a result, for example, a protrusion having a small diameter can be formed.
- a small adherend e.g., electronic part
- the piercing strength of the gas barrier layer per unit thickness is preferably from 2 mN/ ⁇ m to 1,200 mN/ ⁇ m, more preferably from 3 mN/ ⁇ m to 1,000 mN/ ⁇ m, still more preferably from 5 mN/ ⁇ m to 700 mN/ ⁇ m.
- the gas barrier layer functions, and besides, a change in shape due to gas generation occurs in a preferred manner, with the result that a deformed portion of an excellent shape is formed in the gas barrier layer (pressure-sensitive adhesive layer).
- a small adherend e.g., electronic part
- the “piercing strength of the gas barrier layer per unit thickness” may be determined by dividing the piercing strength (mN) of gas barrier layer by the thickness ( ⁇ m) of the gas barrier layer.
- the modulus of elasticity of the highly elastic portion of the gas barrier layer by the nanoindentation method is preferably from 0.01 MPa to 10 GPa, more preferably from 0.05 MPa to 10 GPa, still more preferably from 0.1 MPa to 10 GPa, particularly preferably from 0.5 MPa to 9.8 GPa.
- the modulus of elasticity falls within such ranges, the gas barrier layer can be made excellent in mechanical characteristics and excellent in gas barrier property.
- the thickness of the gas barrier layer can be reduced.
- the thickness of the gas barrier layer is preferably from 0.1 ⁇ m to 200 ⁇ m, more preferably from 0.5 ⁇ m to 150 ⁇ m, still more preferably from 1 ⁇ m to 100 ⁇ m, particularly preferably from 1.5 ⁇ m to 50 ⁇ m. When the thickness falls within such ranges, a gas barrier layer capable of deforming in a preferred manner can be formed.
- the UV light transmittance of the gas barrier layer at a wavelength of 360 nm is preferably from 50% to 100%, more preferably from 60% to 95%.
- the pressure-sensitive adhesive layer contains any appropriate pressure-sensitive adhesive B.
- the pressure-sensitive adhesive B may be a pressure-sensitive adhesive B1 having pressure sensitivity, or may be a curable pressure-sensitive adhesive B2.
- the thickness of the pressure-sensitive adhesive layer is preferably from 0.1 ⁇ m to 200 ⁇ m, more preferably from 0.5 ⁇ m to 150 ⁇ m, still more preferably from 1 ⁇ m to 100 ⁇ m, particularly preferably from 2 ⁇ m to 50 ⁇ m. When the thickness falls within such ranges, a pressure-sensitive adhesive layer that has a preferred pressure-sensitive adhesive strength and satisfactorily functions as a gas barrier layer can be formed.
- the water vapor transmission rate of the pressure-sensitive adhesive layer is preferably 20,000 g/(m 2 ⁇ day) or less, more preferably 10,000 g/(m 2 ⁇ day) or less, still more preferably 7,000 g/(m 2 ⁇ day) or less, still more preferably 5,000 g/(m 2 ⁇ day) or less, particularly preferably 4,800 g/(m 2 ⁇ day) or less, most preferably 4,500 g/(m 2 ⁇ day) or less.
- the pressure-sensitive adhesive layer satisfactorily functions as a gas barrier layer, and hence a deformed portion of an excellent shape is formed.
- a small adherend e.g., electronic part
- the water vapor transmission rate of the pressure-sensitive adhesive layer is preferably as small as possible, but its lower limit value is, for example, 100 g/(m 2 ⁇ day).
- the piercing strength of the pressure-sensitive adhesive layer is preferably from 10 mN to 3,000 mN, more preferably from 30 mN to 2,500 mN, still more preferably from 50 mN to 2,000 mN, particularly preferably from 100 mN to 2,000 mN.
- the pressure-sensitive adhesive layer satisfactorily functions as a gas barrier layer, and besides, a change in shape due to gas generation occurs in a preferred manner, with the result that a deformed portion of an excellent shape is formed.
- a small adherend e.g., electronic part
- the UV light transmittance of the pressure-sensitive adhesive layer at a wavelength of 360 nm is preferably from 50% to 100%, more preferably from 60% to 95%.
- Examples of the pressure-sensitive adhesive B1 having pressure sensitivity include an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, a vinyl alkyl ether-based pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, a polyester-based pressure-sensitive adhesive, a polyamide-based pressure-sensitive adhesive, a urethane-based pressure-sensitive adhesive, and a styrene-diene block copolymer-based pressure-sensitive adhesive. Of those, an acrylic pressure-sensitive adhesive or a rubber-based pressure-sensitive adhesive is preferred, and an acrylic pressure-sensitive adhesive is more preferred.
- the pressure-sensitive adhesive described in the section B-2 may be used as the pressure-sensitive adhesive B1 contained in the pressure-sensitive adhesive layer containing the pressure-sensitive adhesive having pressure sensitivity.
- the curable pressure-sensitive adhesive B2 examples include a thermosetting pressure-sensitive adhesive and an active energy ray-curable pressure-sensitive adhesive. Of those, an active energy ray-curable pressure-sensitive adhesive is preferably used.
- the pressure-sensitive adhesive layer formed by the active energy ray-curable pressure-sensitive adhesive is a pressure-sensitive adhesive layer formed through irradiation with an active energy ray, that is, a pressure-sensitive adhesive layer having a predetermined pressure-sensitive adhesive strength after active energy ray irradiation.
- resin material for forming the active energy ray-curable pressure-sensitive adhesive there are given, for example, resin materials described in UV Curing System (written by Kiyomi Kato, published by Sogo Gijutsu Center (1989)), Photocuring Technology (edited by Technical Information Institute Co., Ltd. (2000)), JP 2003-292916 A, JP 4151850 B2, and the like. More specific examples thereof include a resin material (B2-1) containing a polymer serving as a parent agent and an active energy ray-reactive compound (monomer or oligomer), and a resin material (B2-2) containing an active energy ray-reactive polymer.
- Examples of the polymer serving as a parent agent include: rubber-based polymers, such as a natural rubber, a polyisobutylene rubber, a styrene-butadiene rubber, a styrene-isoprene-styrene block copolymer rubber, a reclaimed rubber, a butyl rubber, a polyisobutylene rubber, and a nitrile rubber (NBR); silicone-based polymers; and acrylic polymers. Those polymers may be used alone or in combination thereof.
- rubber-based polymers such as a natural rubber, a polyisobutylene rubber, a styrene-butadiene rubber, a styrene-isoprene-styrene block copolymer rubber, a reclaimed rubber, a butyl rubber, a polyisobutylene rubber, and a nitrile rubber (NBR); silicone-based polymers; and acrylic polymers.
- the active energy ray-reactive compound is, for example, a photoreactive monomer or oligomer having a plurality of functional groups each having a carbon-carbon multiple bond, such as an acryloyl group, a methacryloyl group, a vinyl group, an allyl group, or an acetylene group.
- a compound having an ethylenically unsaturated functional group is preferably used, and a (meth)acrylic compound having an ethylenically unsaturated functional group is more preferably used.
- the compound having an ethylenically unsaturated functional group easily produces a radical with UV light, and hence, when such compound is used, a pressure-sensitive adhesive layer capable of curing within a short time period can be formed.
- a pressure-sensitive adhesive layer having a moderate hardness after curing can be formed.
- photoreactive monomer or oligomer examples include: (meth)acryloyl group-containing compounds, such as trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxy penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, polyethylene glycol di(meth)acrylate, and a urethane (meth)acrylate-based compound; and dimers to pentamers of the (meth)acryloyl group-containing compounds. Those compounds may be used alone or in combination thereof.
- a monomer such as epoxidized butadiene, glycidyl methacrylate, acrylamide, or vinylsiloxane, or an oligomer formed of the monomer may be used as the active energy ray-reactive compound.
- the resin material (B2-1) containing any such compound can be cured with a high-energy ray, such as UV light or an electron beam.
- a mixture of an organic salt such as an onium salt, and a compound having a plurality of heterocycles in a molecule thereof may be used as the active energy ray-reactive compound.
- an active energy ray e.g., UV light or an electron beam
- the organic salt cleaves to produce an ion, and the ion serves as an initiation species to cause the ring-opening reaction of the heterocycles.
- a three-dimensional network structure can be formed.
- the organic salt include an iodonium salt, a phosphonium salt, an antimonium salt, a sulfonium salt, and a borate salt.
- the heterocycles in the compound having the plurality of heterocycles in a molecule thereof include oxirane, oxetane, oxolane, thiirane, and aziridine.
- the content ratio of the active energy ray-reactive compound is preferably from 0.1 part by weight to 500 parts by weight, more preferably from 1 part by weight to 300 parts by weight, still more preferably from 10 parts by weight to 200 parts by weight with respect to 100 parts by weight of the polymer serving as a parent agent.
- an example of the active energy ray-reactive polymer is a polymer having an active energy ray-reactive functional group having a carbon-carbon multiple bond, such as an acryloyl group, a methacryloyl group, a vinyl group, an allyl group, or an acetylene group.
- a compound (polymer) having an ethylenically unsaturated functional group is preferably used, and a (meth)acrylic polymer having an acryloyl group or a methacryloyl group is more preferably used.
- a specific example of the polymer having an active energy ray-reactive functional group is a polymer formed from a polyfunctional (meth)acrylate.
- the polymer formed from a polyfunctional (meth)acrylate has in a side chain thereof preferably an alkyl ester having 4 or more carbon atoms, more preferably an alkyl ester having 6 or more carbon atoms, still more preferably an alkyl ester having 8 or more carbon atoms, particularly preferably an alkyl ester having 8 to 20 carbon atoms, most preferably an alkyl ester having 8 to 18 carbon atoms.
- the resin material (B2-2) containing the active energy ray-reactive polymer may further contain the active energy ray-reactive compound (monomer or oligomer).
- the active energy ray-curable pressure-sensitive adhesive can be cured through irradiation with an active energy ray.
- the pressure-sensitive adhesive sheet of the present invention can allow an adherend to adhere thereto by bonding the adherend thereto before the curing of the pressure-sensitive adhesive, and then curing the pressure-sensitive adhesive through irradiation with an active energy ray.
- the active energy ray include a gamma ray, UV light, visible light, an infrared ray (heat ray), a radio wave, an alpha ray, a beta ray, an electron beam, a plasma flow, an ionizing ray, and a particle beam.
- the conditions, such as wavelength and irradiation dose, of the active energy ray may be set to any appropriate conditions depending on, for example, the kind of the resin material to be used.
- the pressure-sensitive adhesive may be cured through irradiation with UV light at an irradiation dose of from 10 mJ/cm 2 to 1,000 mJ/cm 2 .
- Examples of the form of the intermediate layer include a resin layer and a layer having a pressure-sensitive adhesive property.
- the intermediate layer contains a thermoplastic resin.
- Such intermediate layer may be, for example, a resin film containing a thermoplastic resin, or a layer containing a pressure-sensitive adhesive C formed of a thermoplastic resin.
- the intermediate layer contains a curable resin (e.g., a UV-curable resin or a thermosetting resin).
- a curable resin e.g., a UV-curable resin or a thermosetting resin.
- Such intermediate layer may be, for example, a resin film containing a curable resin, or a layer containing a curable pressure-sensitive adhesive D.
- the thickness of the intermediate layer is preferably from 0.1 ⁇ m to 200 ⁇ m, more preferably from 0.5 ⁇ m to 100 ⁇ m, still more preferably from 1 ⁇ m to 50 ⁇ m, particularly preferably from 1 ⁇ m to 30 ⁇ m. When the thickness falls within such ranges, an intermediate layer that satisfactorily functions as a gas barrier layer can be formed.
- the water vapor transmission rate of the intermediate layer is preferably 5,000 g/(m 2 ⁇ day) or less, more preferably 4,800 g/(m 2 ⁇ day) or less, still more preferably 4,500 g/(m 2 ⁇ day) or less, still more preferably 4,200 g/(m 2 ⁇ day) or less.
- the intermediate layer satisfactorily functions as a gas barrier layer, and hence a deformed portion of an excellent shape is formed.
- a small adherend e.g., electronic part
- the water vapor transmission rate of the intermediate layer is preferably as small as possible, but its lower limit value is, for example, 0.1 g/(m 2 ⁇ day).
- the piercing strength of the intermediate layer is preferably from 300 mN to 5,000 mN, more preferably from 500 mN to 4,500 mN, still more preferably from 1,000 mN to 4,000 mN.
- the intermediate layer satisfactorily functions as a gas barrier layer, and besides, a change in shape due to gas generation occurs in a preferred manner, with the result that a protrusion of an excellent shape is formed.
- a small adherend e.g., electronic part
- the UV light transmittance of the intermediate layer at a wavelength of 360 nm is preferably from 50% to 100%, more preferably from 60% to 95%.
- the intermediate layer as the resin layer is formed from, for example, a resin film.
- a resin for forming the resin film include a polyethylene terephthalate-based resin, a polyolefin-based resin, a styrene-based elastomer (e.g., SEBS), a UV-curable resin, a thermosetting resin, a urethane-based resin, and an epoxy-based resin.
- the resin film is formed from a thermoplastic resin.
- the thickness of the resin film is preferably from 0.1 ⁇ m to 50 ⁇ m, more preferably from 0.5 ⁇ m to 30 ⁇ m, still more preferably from 1 ⁇ m to 20 ⁇ m.
- Examples of the intermediate layer as a layer having a pressure-sensitive adhesive property include an intermediate layer containing a pressure-sensitive adhesive having pressure sensitivity, and an intermediate layer containing a curable pressure-sensitive adhesive.
- An intermediate layer containing a curable pressure-sensitive adhesive C is preferably arranged. Particularly when, as the pressure-sensitive adhesive layer, a pressure-sensitive adhesive layer containing the pressure-sensitive adhesive A having pressure sensitivity and an intermediate layer containing the curable pressure-sensitive adhesive C are combined, a pressure-sensitive adhesive sheet capable of forming a more satisfactory deformed portion through laser light irradiation can be obtained.
- the pressure-sensitive adhesive described in the section C-1-2 may be used as the curable pressure-sensitive adhesive C.
- the thickness of the intermediate layer as a layer having a pressure-sensitive adhesive property is preferably from 5 ⁇ m to 50 ⁇ m, more preferably from 5 ⁇ m to 30 ⁇ m.
- the pressure-sensitive adhesive sheet of the present invention may be produced by any appropriate method.
- An example of the method of producing the pressure-sensitive adhesive sheet of the present invention is a method involving directly applying a composition for forming a gas-generating layer containing the pressure-sensitive adhesive A and the UV absorber onto a predetermined base material to form the gas-generating layer, and applying a composition for forming a pressure-sensitive adhesive layer containing the pressure-sensitive adhesive B onto the gas-generating layer to form the pressure-sensitive adhesive layer.
- the composition for forming an intermediate layer is applied onto the gas-generating layer to form the intermediate layer before the formation of the pressure-sensitive adhesive layer, and the composition for forming a pressure-sensitive adhesive layer is applied onto the intermediate layer to form the pressure-sensitive adhesive layer.
- the layers may be separately formed and then bonded to each other to form the pressure-sensitive adhesive sheet.
- each layer may be formed by application, followed by drying.
- the application method include application methods each using a multicoater, a die coater, a gravure coater, an applicator, or the like.
- a drying method there are given, for example, natural drying and drying by heating. When the drying by heating is performed, a heating temperature may be set to any appropriate temperature depending on the characteristics of a substance to be dried.
- active energy ray irradiation e.g., UV irradiation
- UV irradiation may be performed depending on the form of each layer.
- a method of treating an electronic part of the present invention includes: bonding an electronic part onto the pressure-sensitive adhesive sheet; and peeling the electronic part from the pressure-sensitive adhesive sheet by irradiating the pressure-sensitive adhesive sheet with laser light.
- the electronic part include a semiconductor chip, a LED chip, and a MLCC.
- the peeling of the electronic part is performed in a position-selective manner. Specifically, it may be appropriate that a plurality of electronic parts be bonded and fixed to the pressure-sensitive adhesive sheet, and the peeling of the electronic parts be performed so that some of the electronic parts may be peeled and the other electronic part(s) may remain fixed.
- the method of treating an electronic part of the present invention further includes subjecting the electronic part to a predetermined treatment after the bonding of the electronic part onto the pressure-sensitive adhesive sheet and before the peeling of the electronic part from the pressure-sensitive adhesive sheet.
- the treatment is not particularly limited, and examples thereof include treatments, such as grinding processing, dicing processing, die bonding, wire bonding, etching, vapor deposition, molding, circuit formation, inspection, a product check, cleaning, transfer, arrangement, repair, or protection of a device surface.
- the size of the electronic part is, for example, from 1 ⁇ m 2 to 250,000 ⁇ m 2 . In one embodiment, such an electronic part that the size of the electronic part (area of the bonding surface thereof) is from 1 ⁇ m 2 to 6,400 ⁇ m 2 may be subjected to the treatment. In another embodiment, such an electronic part that the size of the electronic part (area of the bonding surface thereof) is from 1 ⁇ m 2 to 2,500 ⁇ m 2 may be subjected to the treatment.
- a plurality of electronic parts may be arranged on the pressure-sensitive adhesive sheet.
- An interval between the electronic parts is, for example, from 1 ⁇ m to 500 ⁇ m.
- UV laser light may be used as the laser light.
- the irradiation output of the laser light is, for example, from 1 ⁇ J to 1,000 ⁇ J.
- the wavelength of the UV laser light is, for example, from 240 nm to 380 nm.
- the method of treating an electronic part includes placing the electronic part on another sheet (e.g., a pressure-sensitive adhesive sheet or a substrate) after the peeling of the electronic part.
- another sheet e.g., a pressure-sensitive adhesive sheet or a substrate
- the modulus of elasticity of each of a sectional surface of a gas barrier layer and a sectional surface of a gas-generating layer was measured with a nanoindenter (Triboindenter TI-950 manufactured by Hysitron, Inc.) by a single indentation method at a predetermined temperature (25° C.) under the measurement conditions of an indentation speed of about 500 nm/sec, a drawing speed of about 500 nm/sec, and an indentation depth of about 1,500 nm.
- a nanoindenter Tetraindenter TI-950 manufactured by Hysitron, Inc.
- the piercing strength was measured by sandwiching a sample 4 between sample holders 5 A and 5 B having a circular opening with a diameter of 11.28 mm through use of a compression testing machine 6 (manufactured by Kato Tech Co., Ltd., product name: “KES-G5”). More specifically, a piercing needle (radius of curvature: 1 mm) was caused to pierce the sample (piercing speed: 0.1 mm/s) at the center of the circular opening under a measurement temperature of 23° C., and the maximum load at the breaking point was defined as the piercing strength.
- a glass plate manufactured by Matsunami Glass Ind., Ltd., Large Slide Glass 59112 (standard, large-sized, WHITE EDGE GRINDING No. 2) was bonded to the gas-generating layer side of a pressure-sensitive adhesive sheet (opposite side thereof to its pressure-sensitive adhesive layer) to provide a measurement sample.
- the measurement sample was subjected to a pulse scan from its glass plate side with UV laser light having a wavelength of 355 nm and a beam diameter of about 20 pimp at an output of 0.80 mW and a frequency of 40 kHz to generate a gas from the gas-generating layer.
- a pressure-sensitive adhesive layer surface corresponding to any appropriate one spot subjected to the pulse scan was observed with a confocal laser microscope after 24 hours from the laser light irradiation, and a vertical displacement Y and a horizontal displacement X (diameter; full width at half maximum) were measured.
- PET #25 was bonded to the pressure-sensitive adhesive layer side of a pressure-sensitive adhesive sheet to provide a measurement sample.
- the pressure-sensitive adhesive strength of the gas-generating layer side of the measurement sample with respect to SUS430 was measured by a method in conformity with JIS Z 0237:2000 (bonding conditions: one pass back and forth with a 2 kg roller, tensile rate: 300 mm/min, peel angle: 180°).
- PET #25 was bonded to the gas-generating layer side of a pressure-sensitive adhesive sheet to provide a measurement sample.
- the pressure-sensitive adhesive strength of the pressure-sensitive adhesive layer side of the measurement sample with respect to SUS430 was measured by a method in conformity with JIS Z 0237:2000 (bonding conditions: one pass back and forth with a 2 kg roller, tensile rate: 300 mm/min, peel angle: 180°).
- the toluene solution of the polymer A (polymer A: 100 parts by weight), 3 parts by weight of an isocyanate-based cross-linking agent (manufactured by Nippon Polyurethane Industry Co., Ltd., product name: “Coronate L”), and 5 parts by weight of a surfactant (manufactured by Kao Corporation, product name: “EXCEPARL IPP”) were mixed to prepare a pressure-sensitive adhesive “a”.
- the composition of the pressure-sensitive adhesive “a” is shown in Table 1.
- the ethyl acetate solution of the polymer A2 (polymer A2: 100 parts by weight), 1 part by weight of an epoxy-based cross-linking agent (manufactured by Mitsubishi Gas Chemical Company, Inc., product name: “TETRAD-C”), and 3 parts by weight of an isocyanate-based cross-linking agent (manufactured by Nippon Polyurethane Industry Co., Ltd., product name: “Coronate L”) were mixed to prepare a pressure-sensitive adhesive “c”.
- the composition of the pressure-sensitive adhesive “c” is shown in Table 1.
- Example 2 Example 3 Pressure- Pressure- Pressure- Pressure-sensitive sensitive sensitive adhesive composition adhesive “a” adhesive “b” adhesive “c” Base Material Acrylic SEBS-based Acrylic polymer Kind of Polymer A Polymer A2 polymer Cross- Kind of cross- Isocyanate- Epoxy- Isocyanate- linking linking agent based based based agent Product name/ Coronate/L TETRAD-C Coronate/L number of parts (3) (3) (3) Kind of cross- — — Epoxy- linking agent based Product name/ — — TETRAD-C number of parts (1) Surfactant Kind of Fatty acid Fatty acid — surfactant ester-based ester-based Product name/ EXCEPARL EXCEPARL — number of parts IPP (5) IPP (3) Example 1 Example 2 Reference and Examples Comparative Examples 1 3 to 9 Examples 3 and 2 Comparative and 4 Examples 2 and 5 to 8
- the ethyl acetate solution of the polymer B (polymer B: 100 parts by weight), 1 part by weight of an epoxy-based cross-linking agent (manufactured by Mitsubishi Gas Chemical Company, Inc., product name: “TETRAD-C”), 50 parts by weight of a UV oligomer (manufactured by Mitsubishi Chemical Corporation, product name: “SHIKOH UV-1700B”), and 3 parts by weight of a photopolymerization initiator (manufactured by BASF SE, product name: “Omnirad 127”) were mixed to prepare a composition “a” for forming an intermediate layer.
- the composition of the composition “a” for forming an intermediate layer is shown in Table 2.
- Example 5 Composition Composition “a” for forming “b” for forming Composition for forming intermediate intermediate intermediate layer layer layer Base Material Acrylic SEBS-based polymer Kind of polymer Polymer B UV oligomer UV oligomer UV-curable — urethane acrylate Product name/ UV-1700B (50) — number of parts Cross-linking Kind of cross- Epoxy-based Epoxy-based agent linking agent Product name/ TETRAD-C (1.0) TETRAD-C (3) number of parts Photopoly- Photopoly- Alkylphenone- — merization merization based initiator initiator Product name/ Irg127 (3) — number of parts Examples 3 and 4 Examples 5 and 6 Comparative Comparative Example 5 Examples 6 and 7
- the polymer A was obtained in the same manner as in Production Example 1.
- the toluene solution of the polymer A (polymer A: 100 parts by weight), 1.5 parts by weight of an isocyanate-based cross-linking agent (manufactured by Nippon Polyurethane Industry Co., Ltd., product name: “Coronate L”), and 20 parts by weight of a UV absorber (manufactured by BASF SE, product name: “Tinuvin 477”) were mixed to prepare a composition “a” for forming a gas-generating layer.
- the composition of the composition “a” for forming a gas-generating layer is shown in Table 3.
- the ethyl acetate solution of the polymer C (polymer C: 100 parts by weight), 0.1 part by weight of an epoxy-based cross-linking agent (manufactured by Mitsubishi Gas Chemical Company, Inc., product name: “TETRAD-C”), and 20 parts by weight of a UV absorber (manufactured by BASF SE, product name: “Tinuvin 477”) were mixed to prepare a composition “b” for forming a gas-generating layer.
- the composition of the composition “b” for forming a gas-generating layer is shown in Table 3.
- SEBS maleic acid-modified styrene-ethylene-butylene-styrene block copolymer
- acid value 10 (mg-CH 3 ONa/g), manufactured by Asahi Kasei Chemicals Corporation, product name: “Tuftec M1913”)
- 3 parts by weight of an epoxy-based cross-linking agent manufactured by Mitsubishi Gas Chemical Company, Inc., product name: “TETRAD-C”
- 20 parts by weight of a UV absorber manufactured by BASF SE, product name: “Tinuvin 477”
- toluene serving as a solvent were mixed to provide a composition “c” for forming a gas-generating layer.
- the composition of the composition “c” for forming a gas-generating layer is shown in Table 3.
- the pressure-sensitive adhesive “a” obtained in Production Example 1 was applied to a polyethylene terephthalate film with a silicone release agent-treated surface (thickness: 75 ⁇ m) so as to have a thickness of 50 ⁇ m after solvent volatilization (drying), and was then dried to form a pressure-sensitive adhesive layer precursor layer “a” on the polyethylene terephthalate film.
- composition “a” for forming a gas-generating layer obtained in Production Example 5 was applied to a polyethylene terephthalate film with a silicone release agent-treated surface (manufactured by Toray Industries, Inc., product name: “Cerapeel”, thickness: 38 ⁇ m) so as to have a thickness of 15 ⁇ m after solvent volatilization (drying), and was then dried to form a gas-generating layer precursor layer “a” on the polyethylene terephthalate film.
- a silicone release agent-treated surface manufactured by Toray Industries, Inc., product name: “Cerapeel”, thickness: 38 ⁇ m
- the pressure-sensitive adhesive layer precursor layer “a” and the gas-generating layer precursor layer “a” were bonded to each other through lamination between rolls to provide a pressure-sensitive adhesive sheet (pressure-sensitive adhesive layer/gas-generating layer) sandwiched between the polyethylene terephthalate films with silicone release agent-treated surfaces.
- a pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1 except that: the pressure-sensitive adhesive “b” was used in place of the pressure-sensitive adhesive “a”; and the thickness of the pressure-sensitive adhesive layer was changed to 30 ⁇ m.
- the resultant pressure-sensitive adhesive sheet was subjected to the evaluations (1) to (6). The results are shown in Table 3.
- the pressure-sensitive adhesive “a” obtained in Production Example 1 was applied to a polyethylene terephthalate film with a silicone release agent-treated surface (thickness: 75 ⁇ m) so as to have a thickness of 7 ⁇ m after solvent volatilization (drying), and was then dried to form a pressure-sensitive adhesive layer precursor layer “a” on the polyethylene terephthalate film.
- composition “a” for forming an intermediate layer obtained in Production Example 3 was applied to a polyethylene terephthalate film with a silicone release agent-treated surface (manufactured by Toray Industries, Inc., product name: “Cerapeel”, thickness: 38 ⁇ m) so as to have a thickness of 15 ⁇ m after solvent volatilization (drying), and was then dried to form an intermediate layer precursor layer “a” on the polyethylene terephthalate film.
- a silicone release agent-treated surface manufactured by Toray Industries, Inc., product name: “Cerapeel”, thickness: 38 ⁇ m
- the pressure-sensitive adhesive layer precursor layer “a” and the intermediate layer precursor layer “a” were bonded to each other through lamination between rolls, and the resultant was subjected to UV irradiation from the intermediate layer precursor layer side under the condition of 500 mJ/cm 2 to provide a gas barrier layer precursor layer “a” sandwiched between the polyethylene terephthalate films with silicone release agent-treated surfaces.
- composition “a” for forming a gas-generating layer obtained in Production Example 5 was applied to a polyethylene terephthalate film with a silicone release agent-treated surface (manufactured by Toray Industries, Inc., product name: “Cerapeel”, thickness: 38 ⁇ m) so as to have a thickness of 7 ⁇ m after solvent volatilization (drying), and was then dried to form a gas-generating layer precursor layer “a” on the polyethylene terephthalate film.
- a silicone release agent-treated surface manufactured by Toray Industries, Inc., product name: “Cerapeel”, thickness: 38 ⁇ m
- the polyethylene terephthalate film with a silicone release agent-treated surface on the intermediate layer precursor layer “a” side of the gas barrier layer precursor layer “a” was peeled, and then the intermediate layer precursor layer “a” of the laminate precursor layer “a” and the gas-generating layer precursor layer “a” were bonded to each other through lamination between rolls to provide a pressure-sensitive adhesive sheet (pressure-sensitive adhesive layer/intermediate layer/gas-generating layer) sandwiched between the polyethylene terephthalate films with silicone release agent-treated surfaces.
- a pressure-sensitive adhesive sheet pressure-sensitive adhesive layer/intermediate layer/gas-generating layer
- a pressure-sensitive adhesive sheet was obtained in the same manner as in Example 3 except that the thickness of the intermediate layer was changed to 7 ⁇ m.
- the resultant pressure-sensitive adhesive sheet was subjected to the evaluations (1) to (6). The results are shown in Table 3.
- a pressure-sensitive adhesive sheet was obtained in the same manner as in Example 3 except that: the composition “b” for forming an intermediate layer was used in place of the composition “a” for forming an intermediate layer; and the thickness of the intermediate layer was changed to 30 ⁇ m.
- the resultant pressure-sensitive adhesive sheet was subjected to the evaluations (1) to (6). The results are shown in Table 3.
- a pressure-sensitive adhesive sheet was obtained in the same manner as in Example 3 except that the thickness of the intermediate layer was changed to 15 ⁇ m.
- the resultant pressure-sensitive adhesive sheet was subjected to the evaluations (1) to (6). The results are shown in Table 3.
- the pressure-sensitive adhesive “a” obtained in Production Example 1 was applied to a polyethylene terephthalate film with a silicone release agent-treated surface (thickness: 75 ⁇ m) so as to have a thickness of 7 ⁇ m after solvent volatilization (drying), and was then dried to form a pressure-sensitive adhesive layer precursor layer “a” on the polyethylene terephthalate film.
- composition “a” for forming a gas-generating layer obtained in Production Example 5 was applied to a polyethylene terephthalate film with a silicone release agent-treated surface (manufactured by Toray Industries, Inc., product name: “Cerapeel”, thickness: 38 ⁇ m) so as to have a thickness of 7 ⁇ m after solvent volatilization (drying), and was then dried to form a gas-generating layer precursor layer “a” on the polyethylene terephthalate film.
- a silicone release agent-treated surface manufactured by Toray Industries, Inc., product name: “Cerapeel”, thickness: 38 ⁇ m
- the pressure-sensitive adhesive layer precursor layer “a” was bonded to one side of a polyethylene terephthalate film (manufactured by Toray Industries, Inc., product name: “Lumirror #2F51N”, thickness: 2 ⁇ m) through lamination between rolls.
- a polyethylene terephthalate film manufactured by Toray Industries, Inc., product name: “Lumirror #2F51N”, thickness: 2 ⁇ m
- gas-generating layer precursor layer “a” was bonded to the opposite side of the polyethylene terephthalate film to the pressure-sensitive adhesive layer precursor layer “a” through lamination between rolls.
- a pressure-sensitive adhesive sheet was obtained in the same manner as in Example 7 except that a PET film having a thickness of 4.5 ⁇ m was used.
- the resultant pressure-sensitive adhesive sheet was subjected to the evaluations (1) to (6). The results are shown in Table 3.
- a pressure-sensitive adhesive sheet was obtained in the same manner as in Example 7 except that a PET film having a thickness of 9 ⁇ m was used.
- the resultant pressure-sensitive adhesive sheet was subjected to the evaluations (1) to (6). The results are shown in Table 3.
- composition “b” for forming a gas-generating layer was applied to one surface of a polyethylene terephthalate film (manufactured by Toray Industries, Inc., product name: “Lumirror S10”, thickness: 50 ⁇ m) so as to have a thickness of 20 ⁇ m after solvent volatilization (drying), to thereby form a gas-generating layer.
- a polyethylene terephthalate film manufactured by Toray Industries, Inc., product name: “Lumirror S10”, thickness: 50 ⁇ m
- the pressure-sensitive adhesive “c” was applied to a polyethylene terephthalate film with a silicone release agent-treated surface (manufactured by Toray Industries, Inc., product name: “Cerapeel”, thickness: 38 ⁇ m) so as to have a thickness of 10 ⁇ m after solvent volatilization (drying), to thereby form a pressure-sensitive adhesive layer.
- a silicone release agent-treated surface manufactured by Toray Industries, Inc., product name: “Cerapeel”, thickness: 38 ⁇ m
- the gas-generating layer and the pressure-sensitive adhesive layer were laminated to provide a pressure-sensitive adhesive sheet (pressure-sensitive adhesive layer/gas-generating layer/base material) protected by the polyethylene terephthalate film with a silicone release agent-treated surface.
- a pressure-sensitive adhesive sheet was obtained in the same manner as in Example 10 except that the composition “c” for forming a gas-generating layer was used in place of the composition “b” for forming a gas-generating layer.
- the resultant pressure-sensitive adhesive sheet was subjected to the evaluations. The results are shown in Table 4.
- composition “a” for forming a gas-generating layer obtained in Production Example 5 was applied to a polyethylene terephthalate film with a silicone release agent-treated surface (manufactured by Toray Industries, Inc., product name: “Cerapeel”, thickness: 38 ⁇ m) so as to have a thickness of 7 ⁇ m after solvent volatilization (drying), and was then dried to form a pressure-sensitive adhesive sheet formed only of a gas-generating layer on the polyethylene terephthalate film.
- the resultant pressure-sensitive adhesive sheet was subjected to the evaluations (1) to (6). The results are shown in Table 5.
- a pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1 except that the thickness of the pressure-sensitive adhesive layer was changed to 7 ⁇ m.
- the resultant pressure-sensitive adhesive sheet was subjected to the evaluations (1) to (6). The results are shown in Table 5.
- a pressure-sensitive adhesive sheet was obtained in the same manner as in Example 2 except that the thickness of the pressure-sensitive adhesive layer was changed to 2 ⁇ m.
- the resultant pressure-sensitive adhesive sheet was subjected to the evaluations (1) to (6). The results are shown in Table 5.
- a pressure-sensitive adhesive sheet was obtained in the same manner as in Example 2 except that the thickness of the pressure-sensitive adhesive layer was changed to 60 ⁇ m.
- the resultant pressure-sensitive adhesive sheet was subjected to the evaluations (1) to (6). The results are shown in Table 5.
- a pressure-sensitive adhesive sheet was obtained in the same manner as in Example 3 except that the thickness of the intermediate layer was changed to 40 ⁇ m.
- the resultant pressure-sensitive adhesive sheet was subjected to the evaluations (1) to (6). The results are shown in Table 5.
- a pressure-sensitive adhesive sheet was obtained in the same manner as in Example 5 except that the thickness of the intermediate layer was changed to 2 ⁇ m.
- the resultant pressure-sensitive adhesive sheet was subjected to the evaluations (1) to (6). The results are shown in Table 5.
- a pressure-sensitive adhesive sheet was obtained in the same manner as in Example 5 except that the thickness of the intermediate layer was changed to 60 ⁇ m.
- the resultant pressure-sensitive adhesive sheet was subjected to the evaluations (1) to (6). The results are shown in Table 5.
- a pressure-sensitive adhesive sheet was obtained in the same manner as in Example 7 except that a PET film having a thickness of 25 ⁇ m was used.
- the resultant pressure-sensitive adhesive sheet was subjected to the evaluations (1) to (6). The results are shown in Table 5.
- Example 1 Example 2
- Example 3 Example 4
- Example 5 Gas Pressure- Pressure-sensitive adhesive Pressure- Pressure- Pressure- Pressure- Pressure- barrier sensitive sensitive sensitive sensitive sensitive sensitive sensitive layer adhesive adhesive ′′a′′ adhesive ′′b′′ adhesive ′′a′′ adhesive ′′a′′ adhesive ′′a′′ layer Thickness [ ⁇ m] 50 30 7 7 7 Modulus of elasticity of 2.45 78 2.45 2.45 2.45 pressure-sensitive adhesive layer [MPa] Piercing strength of 282.1 928.8 112.5 112.5 112.5 pressure-sensitive adhesive layer [mN] Elongation of pressure- 18.4 5.38 7.94 7.94 7.94 sensitive adhesive layer in normal direction [mm] Inter- Material for intermediate — — Composition ′′a′′ Composition ′′a′′ Composition ′′b′′ mediate layer for forming for forming for forming layer intermediate intermediate intermediate layer layer layer layer Thickness [ ⁇ m] — — 15 7 30 Modulus of elasticity of — — 1,778 1,778 78 intermediate layer [MPa] Piercing strength of — — 1,34
- Example 11 Gas Pressure- Pressure-sensitive adhesive Pressure-sensitive Pressure-sensitive barrier sensitive adhesive “c” adhesive “c” layer adhesive Thickness [ ⁇ m] 10 10 layer Modulus of elasticity of pressure-sensitive adhesive layer [MPa] 7.76 7.76 Piercing strength of pressure-sensitive adhesive layer [mN] 134.0 134.0 Elongation of pressure-sensitive adhesive layer in normal direction [mm] 9.32 9.32 Intermediate Material for intermediate layer — — layer Thickness [ ⁇ m] — — Modulus of elasticity of intermediate layer [MPa] — — Piercing strength of intermediate layer [mN] — — Piercing strength of intermediate layer per unit thickness [mN/ ⁇ m] Elongation of intermediate layer in normal direction [mm] — — 35011 ⁇ EXP( ⁇ 0.812 ⁇ log 10 (Er ⁇ 10 6 )) 130.16 130.16 20081 ⁇ EXP( ⁇ 1.145 ⁇ log 10 (Er ⁇ 10 6 )) 7.53 7.53 Gas-generating layer Material for Material Acrylic Rubber-based gas
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