US20220115400A1 - Nand flash memory and manufacturing method thereof - Google Patents

Nand flash memory and manufacturing method thereof Download PDF

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US20220115400A1
US20220115400A1 US17/489,826 US202117489826A US2022115400A1 US 20220115400 A1 US20220115400 A1 US 20220115400A1 US 202117489826 A US202117489826 A US 202117489826A US 2022115400 A1 US2022115400 A1 US 2022115400A1
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channel
flash memory
nand flash
stack
manufacturing
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Riichiro Shirota
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Winbond Electronics Corp
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Winbond Electronics Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/10—EEPROM devices comprising charge-trapping gate insulators characterised by the top-view layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
    • H10B43/23—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
    • H10B43/27—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
    • H01L27/11582—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/823475—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type interconnection or wiring or contact manufacturing related aspects
    • H01L27/11565—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312—Gate electrodes for field effect devices
    • H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/4234—Gate electrodes for transistors with charge trapping gate insulator
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
    • H10B41/35—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/20—EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
    • H10B43/35—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region with cell select transistors, e.g. NAND
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/401—Multistep manufacturing processes
    • H01L29/4011—Multistep manufacturing processes for data storage electrodes
    • H01L29/40117—Multistep manufacturing processes for data storage electrodes the electrodes comprising a charge-trapping insulator

Definitions

  • the disclosure relates to a NAND flash memory, and particularly relates to a NAND flash memory with a three-dimensional structure.
  • FIG. 1A is a perspective view illustrating the three-dimensional structure of the memory cell array
  • FIG. 1B is a plan view thereof.
  • FIG. 2 is an equivalent circuit of the memory cell array of FIG. 1A .
  • a plurality of bit lines BL extending horizontally in the row direction are formed, and in the column direction orthogonal thereto, a plurality of word lines WL, a plurality of selection gate lines SSL and GSL and common source lines CSL are formed extending in the horizontal direction.
  • a plurality of long strips of multi active layers are formed on the bit lines BL, word lines WL, selection gate lines SSL, and selection gate lines GSL.
  • a multi active layer is a stacked structure of active regions of multiple polysilicon layers and an interlayer dielectric (ILD) formed between each of the multiple active regions, and each multi active layer extends in the row direction. In the space between the multi active layers, a plurality of vertical gates separated in the row direction are formed.
  • Each of the plurality of vertical gates is allocated from the word line WL, the selection gate line SSL, and the selection gate line GSL. Moreover, the bit line vertically allocated from the bit line BL is connected to an end on one side of the multi active layers, and the source line allocated vertically from the common source line CSL is connected to an end on another side of the multi active layers. An active region in the horizontal direction of the multi active layers provides a channel for a NAND string.
  • first step ( 1 ) the bit line BL extending in the row direction are formed on the substrate.
  • the processes can be changed to subsequent steps.
  • step ( 2 ) the laminate of the polysilicon layer and the interlayer dielectric is deposited on the substrate, and the laminate is etched to form long multi active layers extending in the row direction.
  • step ( 3 ) a laminate of insulators is deposited in the space between the multi active layers.
  • the laminate of the insulators includes at least three layers, and the center is a layer for storing electric charges.
  • a low-resistance gate material is deposited in the space of the multi active layer laminated with insulators. Therefore, the space of the multi active layer is filled with the laminate of the insulators and the gate material. Furthermore, the gate material is patterned to form a plurality of vertical gates separated in the row direction.
  • vertical plugs respectively connected to the bit line BL and the common source line CSL are formed.
  • Non-Patent Document 1 Multi-Layered Vertical Gate NAND Flash Overcoming Stacking Limit for Terabit Density Storage, wonjoo Kim et al., symposium on VLSI Technology Digest of Technical Papers, P188-189.
  • FIG. 4A is a perspective view illustrating a schematic structure of a vertical gate and a multi active layer
  • FIG. 4B is a cross-sectional view taken along line A-A of FIG. 4A
  • the strip patterning of multi active layers 10 including polysilicon layers 12 and interlayer dielectrics 14 is performed by anisotropic dry etching, for example.
  • the polysilicon layer 12 provides a channel
  • the interlayer dielectric 14 provides insulation function between the laminated polysilicon layers 12 .
  • the etched surface in the vertical direction of the patterned multi active layer 10 may not be linear.
  • the etched surface of the interlayer dielectric 14 subsides to be slightly lower than the etched surface of the polysilicon layer 12 .
  • an insulator 22 including the charge storage layer is fully deposited, next the gate material is fully deposited, and then the gate material is patterned to form a vertical gate 20 .
  • the patterning of the gate material is performed by anisotropic dry etching. However, as shown in FIG.
  • the film thickness of the gate material may not be uniform and it is difficult to accurately etch the vertical gate.
  • the interlayer dielectric 14 of the multi active layer 10 is further over-etched in the horizontal direction, and there is a concern of poor insulation or a short circuit between the vertical gates 20 on opposite sides of the multi active layer 10 .
  • the deterioration of the etching accuracy of the vertical gate 20 may cause a short circuit between the adjacent vertical gates 20 in the extending direction (the direction orthogonal to line A-A) of the multi active layer 10 .
  • the purpose of the disclosure is to solve such a conventional problem and provide a NAND flash memory and a manufacturing method thereof capable of preventing a short circuit between gates extending along the vertical direction.
  • the manufacturing method of the NAND flash memory of the disclosure includes steps as follows.
  • multiple channel stacks including a first interlayer dielectric and a channel layer alternately stacked are formed on a substrate.
  • the channel stacks include a first side surface and a second side surface opposite to the first side surface, and the first side surface and the second side surface extend along a first direction.
  • a second interlayer dielectric is formed between the first side surface and the second side surface of each of the multiple channel stacks.
  • multiple trenches are formed at a fixed pitch in a first direction of the second interlayer dielectric.
  • an insulator including a charge storage layer is formed so as to cover at least inner walls of each trench.
  • multiple gates extending along a second direction are formed so as to fill a space in each trench in the second direction orthogonal to the first direction.
  • the NAND flash memory of the disclosure includes a substrate, multiple channel stacks, an interlayer dielectric, multiple trenches, an insulator, and multiple gates.
  • the channel stacks are formed on the substrate.
  • the channel stacks have a first side surface and a second side surface opposite to the first side surface, and the first side surface and the second side surface extend along the first direction.
  • the interlayer dielectric is formed between the first side surface and the second side surface of each adjacent channel stack.
  • the trenches are formed at a fixed pitch in the first direction of the interlayer dielectric.
  • the insulator including a charge storage layer is formed so as to cover at least sidewalls of each trench.
  • the gates extend along the second direction so as to fill a space in each trench in the second direction orthogonal to the first direction.
  • the gate is formed in the space in the trench formed between the channel stacks, and therefore, it is possible to prevent a short circuit of the adjacent gate in the first direction and the second direction.
  • FIG. 1A is a perspective view illustrating the three-dimensional structure of the memory cell array
  • FIG. 1B is a plan view thereof.
  • FIG. 2 is an equivalent circuit of the memory cell array of FIG. 1A .
  • FIG. 3 is a schematic cross-sectional view illustrating the manufacturing process of the memory cell array shown in FIG. 1A .
  • FIG. 4A and FIG. 4B are views illustrating the problems of the conventional three-dimensional structure of the flash memory.
  • FIG. 4A is a perspective view illustrating the connection relationship between the vertical gate and the multi active layer.
  • FIG. 4B is a cross-sectional view taken along line A-A of FIG. 4A .
  • FIG. 5 is a plan view of a NAND flash memory with a three-dimensional structure according to an embodiment of the disclosure.
  • FIG. 6A is a cross-sectional view taken along line A 1 -A 1 in FIG. 5 .
  • FIG. 6B is a cross-sectional view taken along line A 2 -A 2 in FIG. 5 .
  • FIG. 7 is a cross-sectional view taken along line B-B in FIG. 5 .
  • FIG. 8A to FIG. 8C are views illustrating the manufacturing steps of a NAND flash memory with a three-dimensional structure according to an embodiment of the disclosure.
  • FIG. 9A is a plan view of a mask for forming trenches
  • FIG. 9B is a plan view when a mask is formed on the channel stack.
  • FIG. 10A is a plan view when trenches are formed, and FIG. 10B is a C-C line cross-sectional view thereof.
  • FIG. 11A is a plan view of the cross section taken along line D-D when the insulator stack including the charge storage layer has been formed
  • FIG. 11B is the cross-sectional view corresponding to line C-C.
  • FIG. 12A is a plan view of cross section taken along line D-D when the gate material has been deposited
  • FIG. 12B is a cross-sectional view corresponding to line C-C.
  • the NAND flash memory with the three-dimensional structure of the disclosure is used as a storage medium for various semiconductor devices (e.g., microcontrollers, microprocessors, logic devices, and the like embedded in such flash memory).
  • various semiconductor devices e.g., microcontrollers, microprocessors, logic devices, and the like embedded in such flash memory.
  • the NAND flash memory of the embodiment includes a substrate 100 ; a lower interlayer dielectric 110 formed on the substrate 100 ; a plurality of channel stacks 120 formed on the lower interlayer dielectric 110 and extending along the X direction; a plurality of vertical gates 130 extending in the vertical direction so as to cover the sides of the plurality of channel stacks 120 and extending in the Y direction on the plurality of channel stacks 120 ; a plurality of bit lines 150 electrically connected to one end of one side of each channel stack 120 and extending along the X direction; and a common source line 160 electrically connected to one end of another side of each channel stack 120 in a shared manner and extending along the Y direction.
  • the substrate 100 is not particularly limited and includes a silicon substrate, for example.
  • the lower interlayer dielectric 110 is not particularly limited and includes silicon oxide or silicon nitride, for example.
  • One channel stack 120 has a first side surface S 1 extending in a vertical direction from the substrate 100 and a second side surface S 2 opposite to the first side surface S 1 , and the first side surface S 1 and the second side surface S 2 extend in the X direction.
  • the channel stack 120 is fin-shaped or thin plate-shaped, and the planar shape of the channel stack 120 is rectangular or long strip-shaped when viewed from the Y direction.
  • the channel stack 120 is a structure in which a polysilicon layer 122 and an interlayer dielectric 124 are alternately stacked to serve as channel layers and provide channel regions. A plurality of such channel stacks 120 are disposed at a fixed interval along the Y direction.
  • An interlayer dielectric 170 is formed between the plurality of channel stacks 120 , and a plurality of trenches 180 leading to the lower interlayer dielectric 110 are formed in the interlayer dielectric 170 . That is, a plurality of the trench 180 are formed at a fixed pitch along the X direction of the interlayer dielectric 170 so as to expose the adjacent first side surface S 1 and second side surface S 2 of the channel stack 120 . Therefore, each trench 180 is also arranged in the Y direction. In the example of FIG. 6A , the planar shape of one trench 180 is rectangular.
  • an insulator stack 190 is formed so as to cover the bottom surface and the side surfaces of the trench 180 .
  • the insulator stack 190 covers the first side S 1 and the second side S 2 of the channel stack 120 exposed in the trench 180 .
  • the insulator stack 190 is a structure in which three or more interlayer dielectrics including a charge storage layer are laminated.
  • the insulator stack 190 includes an oxide layer/nitride layer/oxide layer (ONO), and the nitride layer accumulates charges at the interface with the oxide layer.
  • the insulator stack 190 includes a conductive polysilicon layer in the center instead of the nitride layer, and charges are stored in the polysilicon layer.
  • the charge accumulation layer can accumulate negative or positive charges generated by programming actions or erasing actions.
  • the film thickness of the insulator stack 190 is less than the dimensions of the trench 180 in the X direction and the Y direction. After the insulator stack 190 is formed, a space surrounded by the insulator stack 190 is formed in the trench 180 .
  • the plurality of vertical gates 130 are formed to cover the direction intersecting the plurality of channel stacks 120 , that is, the Y-direction that the trench 180 is disposed.
  • the vertical gate 130 fills the space left by the insulator stack 190 in the trench 180 . Therefore, the vertical gate 130 separated from the insulator stack 190 extends in the vertical direction from the substrate in the trench 180 and elongates in the vertical direction on the first side S 1 and the second side S 2 of the channel stack 120 .
  • Each of the plurality of vertical gates 130 constitutes a plurality of bit line side selection transistors, a memory cell, and a selection gate line and word line of the source line side selection transistor of the NAND string.
  • An interlayer insulating film 140 is formed on the plurality of channel stacks 120 .
  • the common source line 160 extending in the Y direction is formed.
  • the common source line 160 includes a conductive material such as metal.
  • the interlayer insulating film 140 , the insulator stack 190 , and a contact hole 162 extending from an uppermost interlayer dielectric 124 A of the channel stack 120 to a lowermost interlayer dielectric 124 B are formed.
  • the contact hole 162 is filled with a conductive plug 164 . Therefore, the common source line 160 is electrically connected to the end of the another side of the channel stack 120 from the uppermost polysilicon layer 122 A to the lowermost polysilicon layer 122 B through the conductive plug 164 in a shared manner.
  • the interlayer insulating film 140 is further formed to cover the common source line 160 , and the plurality of bit lines 150 extending in the X direction are formed on the interlayer insulating film 140 .
  • the bit line 150 includes a conductive material such as metal, and each bit line 150 is patterned so as to extend right above the channel stack 120 in parallel with the plurality of channel stacks 120 .
  • an interlayer insulating film 140 , an insulator stack 190 , and a contact hole 152 extending from the uppermost interlayer dielectric 124 A of the channel stack 120 to the lowermost interlayer dielectric 124 B are formed.
  • each bit line 150 is electrically connected to one end of one side of the channel stack 120 from the uppermost polysilicon layer 122 A to the lowermost polysilicon layer 122 B via each conductive plug 154 .
  • One or more vertical gates 130 adjacent to the contact hole 152 beside the bit line constitute the selection gate line of one or more bit line side selection transistors of the NAND string
  • one or more vertical gates 130 adjacent to the common source line 160 constitute the selection gate line of one or more source line side selection transistors of the NAND string
  • a plurality of vertical gates 130 other than those described constitute the word lines of a plurality of memory cells.
  • NAND flash memory In NAND flash memory, read operations or programming operations are performed in units of pages, and erasing is performed in units of blocks.
  • One polysilicon layer 122 of one channel stack 120 in the X direction corresponds to one NAND string. Therefore, a number of NAND strings corresponding to the number of stacks of the polysilicon layer 122 are formed in one channel stack 120 .
  • the selection of one NAND string is performed by selective driving of a plurality of bit line side selection transistors. The selection of the page or the selection of the block is well known, so the detailed description is omitted herein.
  • FIG. 8A to FIG. 8C illustrate manufacturing steps corresponding to the cross section taken along line A 1 -A 1 of FIG. 5 .
  • the lower interlayer dielectric 110 is formed on the silicon substrate 100 , and a pre-channel stack in which the polysilicon layer 122 and the interlayer dielectric 124 are stacked alternately is formed on the lower interlayer dielectric 110 .
  • the pre-channel stack is patterned by anisotropic etching to form a plurality of thin plate-shaped or fin-shaped channel stacks 120 .
  • the first side S 1 and the second side S 2 of each channel stack 120 extend along the X direction.
  • the interlayer dielectric 170 is fully deposited by filling between the channel stacks 120 .
  • the material or deposition method of the interlayer dielectric 170 is not particularly limited, and a material or method with excellent step coverage, such as a step coverage that can cover the step difference of the channel stack 120 , is selected.
  • the interlayer dielectric 170 is etched until the uppermost interlayer dielectric 124 A of the channel stack 120 is exposed.
  • the etching step may also include planarization of the interlayer dielectric 124 A and the interlayer dielectric 170 .
  • FIG. 9A is a plan view of an etching mask for forming trenches in the interlayer dielectric 170 .
  • An etching mask 200 has a plurality of openings 210 formed at a fixed interval along the X direction, and each opening 210 extends along the Y direction.
  • FIG. 9B is a plan view when the etching mask 200 is formed after the step of FIG. 8C .
  • the opening 210 positions the trench 180 formed in the interlayer dielectric 170 .
  • anisotropic etching is performed through the etching mask 200 .
  • an etchant with a large etching selection ratio of the interlayer dielectric 170 and the interlayer dielectric 124 A is used. The etching proceeds until the lower interlayer dielectric 110 is exposed. Through this etching, a part of the interlayer dielectric 170 exposed through the opening 210 is removed, and the trench 180 is formed therein.
  • the etching mask 200 is not necessarily limited to the structure shown in FIG. 9A and FIG. 9B .
  • it may also be an etching mask in which a rectangular opening is formed two-dimensionally such that the interlayer dielectric 124 A of the channel stack 120 is not exposed.
  • the etching selection ratio of the interlayer dielectric 170 and the interlayer dielectric 124 A may not necessarily be large.
  • FIG. 10A is a plan view after the etching mask 200 is removed
  • FIG. 10B is a C-C line cross-sectional view thereof.
  • the trench 180 that exposes the first side surface S 1 and the second side surface S 2 is formed.
  • the inner space of the trench 180 is filled with the insulator stack 190 or the vertical gate 130 as illustrated in the subsequent paragraphs.
  • the dimensions of the trench 180 in the X direction and the Y direction are appropriately selected corresponding to the pitch of the channel stack 120 in the Y direction.
  • FIG. 11A is a plan view of the cross section taken along line D-D of FIG. 11B
  • FIG. 11B is a cross-sectional view corresponding to line C-C of FIG. 10A
  • the insulator stack 190 is formed on the entire surface of the substrate so as to cover the bottom and sides of the trench 180 .
  • the film thickness of the insulator stack 190 is appropriately selected, and the vertical gate 130 is formed in space left after the insulator stack 190 is formed.
  • the insulator stack 190 only needs to be formed at least in the trench 180 , and if it is not required, the insulator stack on the interlayer dielectric 170 can also be removed.
  • FIG. 12A is a plan view of the cross section taken along line D-D of FIG. 12B
  • FIG. 12B is a cross sectional view corresponding to line C-C of FIG. 10A
  • the vertical gate 130 extends in the vertical direction in the trench 180 and is surrounded by the insulator stack 190 .
  • One side surface of the vertical gate 130 separated from the insulator stack 190 is opposite to the first side S 1 of the channel stack 120 , and another side surface is opposite to the second side S 2 of the adjacent channel stack 120 .
  • the interlayer insulating film 140 is formed. Then, after the contact hole 162 is formed, the conductive plug 164 is formed in the contact hole 162 , and then a common source line 160 connected to the conductive plug 164 is formed. Then, the interlayer insulating film 140 is formed so as to cover the common source line 160 . Then, after the contact hole 152 is formed, the conductive plug 154 is formed in the contact hole 152 , and thereafter, the bit line 150 connected to the conductive plug 154 is formed. Accordingly, the manufacturing process of the memory cell array is completed.
  • the trench for forming the vertical gate is formed in advance, and the vertical gate is formed in the trench. Therefore, there is no need to pattern and etch the vertical gate opposite to the side surface of the channel stack. The machining accuracy of the vertical gate can be improved. Furthermore, by forming an insulator stack in the trench, the vertical gate is surrounded by the insulator stack in the trench, so that it is possible to prevent a short circuit of adjacent vertical gates in the X direction and the Y direction.
  • the bit line 150 and the common source line 160 are formed after the channel stack 120 is formed, but the disclosure is not limited thereto.
  • the conductive plug 154 for electrically connected to the bit line 150 and one end of one side of the polysilicon layer of the channel stack 120 and the conductive plug 164 for electrically connected to the common source line 160 and one end of another side of the polysilicon layer of the channel stack 120 are filled in the contact hole 152 and the contact hole 162 of the interlayer insulating film 140 .
  • the memory cell can be a single layer cell (SLC) type that stores one bit (binary data), or a type that stores multiple bits.
  • SLC single layer cell

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JP2020170882A JP7282728B2 (ja) 2020-10-09 2020-10-09 Ｎａｎｄ型フラッシュメモリおよびその製造方法
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Citations (3)

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