US20210087701A1 - Aluminum plating film and method for producing aluminum plating film - Google Patents

Aluminum plating film and method for producing aluminum plating film Download PDF

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Publication number
US20210087701A1
US20210087701A1 US16/611,944 US201816611944A US2021087701A1 US 20210087701 A1 US20210087701 A1 US 20210087701A1 US 201816611944 A US201816611944 A US 201816611944A US 2021087701 A1 US2021087701 A1 US 2021087701A1
Authority
US
United States
Prior art keywords
plating film
aluminum
aluminum plating
substrate
replacement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US16/611,944
Other languages
English (en)
Inventor
Kengo Goto
Akihisa Hosoe
Hideaki SAKAIDA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD. reassignment SUMITOMO ELECTRIC INDUSTRIES, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SAKAIDA, Hideaki, GOTO, KENGO, HOSOE, AKIHISA
Publication of US20210087701A1 publication Critical patent/US20210087701A1/en
Abandoned legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/08—Perforated or foraminous objects, e.g. sieves
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/42—Electroplating: Baths therefor from solutions of light metals
    • C25D3/44—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/66—Electroplating: Baths therefor from melts
    • C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Definitions

  • a method for producing an aluminum plating film according to an embodiment of the present disclosure is a method for producing the aluminum plating film according to (1) above, the method including a first electrolytic treatment step of forming a pre-aluminum plating film by subjecting a substrate, at least a surface of the substrate being conductive, to an electrolytic treatment in a first electrolyte to electrodeposit aluminum on a surface of the substrate; a replacement step of, after the first electrolytic treatment step, forming a replacement plating film by immersing the pre-aluminum plating film in a replacement solution that contains the first electrolyte and a metal having a lower ionization tendency than aluminum to replace a surface of the pre-aluminum plating film with the metal having a lower ionization tendency than aluminum; and a second electrolytic treatment step of, after the replacement step, forming an aluminum plating film by subjecting the replacement plating film to an electrolytic treatment in a second electrolyte to electrodeposit aluminum on a surface of the replacement plat
  • the method for producing the aluminum plating film according to (8) or (9) above preferably includes a removal step of removing the substrate after the second electrolytic treatment step.
  • the coating weight of a conductive layer refers to the mass of the conductive layer per apparent unit area of a resin molded body that includes the conductive layer formed on the surface of the skeleton thereof.
  • an electrolyte suitable for electrodepositing aluminum on the surface of the substrate is obtained by adjusting a mixing ratio of the aluminum halide to the molten salt-forming compound in a range of 1:1 to 3:1 in terms of molar ratio.
  • the replacement solution was prepared by adding ZnCl 2 to the electrolyte used in the first electrolytic treatment step in Example 1 to have a concentration of 40 mmol/L.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
US16/611,944 2017-05-16 2018-01-19 Aluminum plating film and method for producing aluminum plating film Abandoned US20210087701A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-097138 2017-05-16
JP2017097138 2017-05-16
PCT/JP2018/001568 WO2018211740A1 (ja) 2017-05-16 2018-01-19 アルミニウムめっき膜及びアルミニウムめっき膜の製造方法

Publications (1)

Publication Number Publication Date
US20210087701A1 true US20210087701A1 (en) 2021-03-25

Family

ID=64273763

Family Applications (1)

Application Number Title Priority Date Filing Date
US16/611,944 Abandoned US20210087701A1 (en) 2017-05-16 2018-01-19 Aluminum plating film and method for producing aluminum plating film

Country Status (6)

Country Link
US (1) US20210087701A1 (zh)
JP (1) JPWO2018211740A1 (zh)
KR (1) KR20200007784A (zh)
CN (1) CN110546312A (zh)
DE (1) DE112018002512T5 (zh)
WO (1) WO2018211740A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI829439B (zh) * 2022-11-23 2024-01-11 亞福儲能股份有限公司 應用於具有氧化層的鋁極片的去除方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1087793B (it) * 1976-12-11 1985-06-04 Glyco Metall Werke Materiale stratificato e procedimento per la sua fabbricazione per mezzo della placcatura termocinetica
JPH07138792A (ja) * 1993-09-14 1995-05-30 Katayama Tokushu Kogyo Kk 金属多孔体および該金属多孔体の製造方法
JPH10102207A (ja) * 1996-09-25 1998-04-21 Matsushita Electric Works Ltd 表面硬化Ｆｅ−Ｎｉ−Ａｌ系合金及びその製造方法
JP3178373B2 (ja) 1997-05-22 2001-06-18 住友金属工業株式会社 連続電気めっき方法と装置
JPH11117089A (ja) 1997-08-11 1999-04-27 Heelios:Kk 長尺体の連続電気処理装置
CN1487122A (zh) * 2003-07-03 2004-04-07 孙伟成 一种泡沫铝的制备方法
CN101108546A (zh) * 2007-08-30 2008-01-23 山东天诺光电材料有限公司 柔性材料及其制备方法和用途
DE212010000137U1 (de) * 2009-09-04 2012-04-30 Meyer Intellectual Properties Limited Anodisiertes, ummanteltes Kupferkochgeschirr
JP2012007233A (ja) * 2010-04-22 2012-01-12 Sumitomo Electric Ind Ltd アルミニウム構造体の製造方法およびアルミニウム構造体
JP5691107B2 (ja) * 2011-01-17 2015-04-01 富山住友電工株式会社 高耐食性を有する金属多孔体及びその製造方法
JP2012256584A (ja) * 2011-02-18 2012-12-27 Sumitomo Electric Ind Ltd 電気化学素子
CN102191519B (zh) * 2011-04-28 2014-08-06 上海交通大学 铝基复合材料表面熔盐电沉积铝膜的制备方法
JP5880364B2 (ja) * 2012-09-05 2016-03-09 住友電気工業株式会社 アルミニウムめっき装置及びこれを用いたアルミニウム膜の製造方法

Also Published As

Publication number Publication date
WO2018211740A1 (ja) 2018-11-22
CN110546312A (zh) 2019-12-06
DE112018002512T5 (de) 2020-01-30
KR20200007784A (ko) 2020-01-22
JPWO2018211740A1 (ja) 2020-03-19

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Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:GOTO, KENGO;HOSOE, AKIHISA;SAKAIDA, HIDEAKI;SIGNING DATES FROM 20191004 TO 20191007;REEL/FRAME:050973/0152

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