US20200089084A1 - Camera module - Google Patents
Camera module Download PDFInfo
- Publication number
- US20200089084A1 US20200089084A1 US16/201,968 US201816201968A US2020089084A1 US 20200089084 A1 US20200089084 A1 US 20200089084A1 US 201816201968 A US201816201968 A US 201816201968A US 2020089084 A1 US2020089084 A1 US 2020089084A1
- Authority
- US
- United States
- Prior art keywords
- heat dissipation
- hole
- camera module
- escaping
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
Definitions
- the subject matter generally relates to a camera module.
- the holder, the lens, and the printed circuit board are made of plastic materials.
- An enclosed space is defined by the holder, the lens, and the printed circuit board to avoid dusts or debris entering into the interior of the optical projection device of the camera. Such arrangements may hinder heat dissipation from the camera module and cause heating of the camera module which will affect the precision and quality of the structures guiding light in the camera module.
- FIG. 1 is a view of a first embodiment of a camera module of the present disclosure.
- FIG. 3 is a cross-sectional view of the camera module along line of FIG. 1 .
- FIG. 4 is similar to FIG. 1 , but showing the camera module from another angle.
- FIG. 5 is a cross-sectional view of the camera module along line V-V of FIG. 4 .
- the base 10 includes a plurality of sidewalls 101 and a bottom wall 102 connected to each of the sidewalls 101 .
- the bottom wall 102 and the plurality of sidewalls 101 define a first receiving groove 14 .
- the first receiving groove 14 receives the optical filter 40 and the sensor 50 .
- the first receiving groove 14 runs through the second surface 12 .
- An opening 141 is defined in the bottom wall 102 , the opening 141 runs through the bottom wall 102 .
- At least one escaping hole 15 is defined at the sidewalls 101 or in the bottom wall 102 .
- the escaping hole 15 connects the first receiving groove 14 and the ambient environment.
- a heat dissipation block 16 is received in each of the at least one escaping hole 15 .
- the heat dissipation block 16 can be fixed in the escaping hole 15 by adhesive 17 .
- the heat dissipation block 16 can be made of metal or other materials having good heat dissipation efficiency.
- the at least one escaping hole 15 includes a first escaping hole 151 , a second escaping hole 152 , and a combination thereof.
- the heat dissipation block 16 includes a first heat dissipation block 161 , a second heat dissipation block 162 , and a combination thereof.
- the first heat dissipation block 161 is received in the first escaping hole 151 .
- the second heat dissipation block 162 is received in the second escaping hole 152 .
- the first escaping hole 151 is defined at the bottom wall 102 along a direction that is perpendicular to the printed circuit board 60 .
- the first escaping hole 151 run through the first surface 11 and the second surface 12 .
- the first escaping hole 151 is connected to the first receiving groove 14 .
- the first escaping hole 151 includes a first hole portion 1511 and a second hole portion 1512 connected to the first hole portion 1511 .
- the first hole portion 1511 is positioned adjacent to the first receiving groove 14 .
- the second hole portion 1512 is positioned adjacent to the first surface 11 .
- a width of the second hole portion 1512 is greater than a width of the first hole portion 1511 , the width being larger to increase heat dissipation area of the first heat dissipation block 161 .
- the first heat dissipation block 161 includes a first heat dissipation portion 1611 and a second heat dissipation portion 1612 connected to the first heat dissipation portion 1611 .
- the first heat dissipation portion 1611 is received in the first hole portion 1511 .
- the second heat dissipation portion 1612 is received in the second hole portion 1512 .
- a width of the second heat dissipation portion 1612 is greater than a width of the first heat dissipation portion 1611 .
- a width of the second hole portion 1512 is greater than a width of the second heat dissipation portion 1612 , a first gap 1513 is defined between the second hole portion 1512 and the second heat dissipation portion 1612 .
- the first gap receives the adhesive 17 .
- the second escaping hole 152 is defined at the sidewall 101 along a direction that is inclined with respect to the sidewall 101 , the inclination allows the second heat dissipation block 162 received therein to have a larger heat dissipation area.
- the second escaping hole 152 run through the sidewall 101 and is connected to the first receiving groove 14 .
- the third heat dissipation portion 1621 is received in the third hole portion 1521 .
- the fourth heat dissipation portion 1622 is received in the fourth hole portion 1522 .
- a width of the fourth heat dissipation portion 1622 is greater than a width of the third heat dissipation portion 1621 .
- a width of the fourth hole portion 1522 is greater than a width of the fourth heat dissipation portion 1622 , a second gap 1523 is defined between the fourth hole portion 1522 and the fourth heat dissipation portion 1622 .
- the second gap receives the adhesive 17 .
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Aviation & Aerospace Engineering (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
- The subject matter generally relates to a camera module.
- Most camera modules on the market are composed of a lens, a holder, a motor, a filter, a sensor chip, a plastic base, and a circuit board. Cameras are used more frequently and cameras with good reliability and quality are expected.
- The holder, the lens, and the printed circuit board are made of plastic materials. An enclosed space is defined by the holder, the lens, and the printed circuit board to avoid dusts or debris entering into the interior of the optical projection device of the camera. Such arrangements may hinder heat dissipation from the camera module and cause heating of the camera module which will affect the precision and quality of the structures guiding light in the camera module.
- Therefore, there is room for improvement in the art.
- Implementations of the present technology will now be described, by way of embodiments only, with reference to the attached figures.
-
FIG. 1 is a view of a first embodiment of a camera module of the present disclosure. -
FIG. 2 is an exploded view of the camera module ofFIG. 1 . -
FIG. 3 is a cross-sectional view of the camera module along line ofFIG. 1 . -
FIG. 4 is similar toFIG. 1 , but showing the camera module from another angle. -
FIG. 5 is a cross-sectional view of the camera module along line V-V ofFIG. 4 . - It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale, and the proportions of certain portions may be exaggerated to better illustrate details and features of the present disclosure.
- The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings, in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one.”
- The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.
-
FIGS. 1-5 illustrate an embodiment of acamera module 100. Thecamera module 100 includes abase 10, alens cone 20, alens 30, anoptical filter 40, asensor 50, and a printedcircuit board 60. Thelens 30 is received in thelens cone 20. Thelens cone 20 is fixed on thebase 10. Thebase 10 is fixed on the printedcircuit board 60. Theoptical filter 40 is received in thebase 10. Thesensor 50 is received in thebase 10 and formed on the printedcircuit board 60. - The
base 10 includes afirst surface 11, asecond surface 12 opposite to thefirst surface 11, and a plurality ofside surfaces 13 each perpendicularly connected to thefirst surface 11 and thesecond surface 12. - The
base 10 includes a plurality of sidewalls 101 and abottom wall 102 connected to each of the sidewalls 101. Thebottom wall 102 and the plurality of sidewalls 101 define afirst receiving groove 14. - The
first receiving groove 14 receives theoptical filter 40 and thesensor 50. The first receivinggroove 14 runs through thesecond surface 12. - An
opening 141 is defined in thebottom wall 102, the opening 141 runs through thebottom wall 102. - At least one escaping
hole 15 is defined at the sidewalls 101 or in thebottom wall 102. The escapinghole 15 connects the first receivinggroove 14 and the ambient environment. Aheat dissipation block 16 is received in each of the at least one escapinghole 15. Theheat dissipation block 16 can be fixed in theescaping hole 15 byadhesive 17. Theheat dissipation block 16 can be made of metal or other materials having good heat dissipation efficiency. - In an embodiment, the at least one escaping
hole 15 includes afirst escaping hole 151, asecond escaping hole 152, and a combination thereof. Theheat dissipation block 16 includes a firstheat dissipation block 161, a secondheat dissipation block 162, and a combination thereof. The firstheat dissipation block 161 is received in thefirst escaping hole 151. The secondheat dissipation block 162 is received in thesecond escaping hole 152. - The
first escaping hole 151 is defined at thebottom wall 102 along a direction that is perpendicular to the printedcircuit board 60. The first escapinghole 151 run through thefirst surface 11 and thesecond surface 12. Thefirst escaping hole 151 is connected to the first receivinggroove 14. - The
first escaping hole 151 includes afirst hole portion 1511 and asecond hole portion 1512 connected to thefirst hole portion 1511. Thefirst hole portion 1511 is positioned adjacent to the first receivinggroove 14. Thesecond hole portion 1512 is positioned adjacent to thefirst surface 11. A width of thesecond hole portion 1512 is greater than a width of thefirst hole portion 1511, the width being larger to increase heat dissipation area of the firstheat dissipation block 161. The firstheat dissipation block 161 includes a firstheat dissipation portion 1611 and a second heat dissipation portion 1612 connected to the firstheat dissipation portion 1611. The firstheat dissipation portion 1611 is received in thefirst hole portion 1511. The second heat dissipation portion 1612 is received in thesecond hole portion 1512. A width of the second heat dissipation portion 1612 is greater than a width of the firstheat dissipation portion 1611. A width of thesecond hole portion 1512 is greater than a width of the second heat dissipation portion 1612, afirst gap 1513 is defined between thesecond hole portion 1512 and the second heat dissipation portion 1612. The first gap receives theadhesive 17. - The
second escaping hole 152 is defined at the sidewall 101 along a direction that is inclined with respect to the sidewall 101, the inclination allows the secondheat dissipation block 162 received therein to have a larger heat dissipation area. The second escapinghole 152 run through the sidewall 101 and is connected to thefirst receiving groove 14. - The
second escaping hole 152 includes athird hole portion 1521 and afourth hole portion 1522 connected to thethird hole portion 1521. Thethird hole portion 1521 is positioned adjacent to the first receivinggroove 14. Thefourth hole portion 1522 is positioned adjacent to at least one of the side surfaces 13. A width of thefourth hole portion 1522 is greater than a width of thethird hole portion 1521, to increase heat dissipation area of the secondheat dissipation block 162. The secondheat dissipation block 162 includes a thirdheat dissipation portion 1621 and a fourthheat dissipation portion 1622 connected to the thirdheat dissipation portion 1621. The thirdheat dissipation portion 1621 is received in thethird hole portion 1521. The fourthheat dissipation portion 1622 is received in thefourth hole portion 1522. A width of the fourthheat dissipation portion 1622 is greater than a width of the thirdheat dissipation portion 1621. A width of thefourth hole portion 1522 is greater than a width of the fourthheat dissipation portion 1622, asecond gap 1523 is defined between thefourth hole portion 1522 and the fourthheat dissipation portion 1622. The second gap receives the adhesive 17. - The
lens cone 20 is fixed on thebase 10. In an embodiment, thelens cone 20 and the base 10 are integrally formed. In another embodiment, thelens cone 20 can be connected to thebase 10 by screws or adhesive. - The
lens cone 20 includes athird surface 21, asecond receiving groove 22 configured for thelens cone 20. Thesecond receiving groove 22 runs through thethird surface 21. Thesecond receiving groove 22 receives and fixes thelens 30. Thesecond receiving groove 22 is connected to the first receivinggroove 14. - The
lens 30 is received and fixed in the second receivinggroove 22. Thelens 30 includes anophthalmic lens 31 facing theopening 141. - The
optical filter 40 filters out stray light entering into thecamera module 100. Theoptical filter 40 is fixed on thebottom wall 102 and received in the first receivinggroove 14. A portion of theoptical filter 40 is exposed from theopening 141. - The
sensor 50 is fixed on and electrically connected to the printedcircuit board 60. Thesensor 50 is received in the first receivinggroove 14 and faces theoptical filter 40. - The
camera module 100 further includes a stiffeningadhesive 70. The stiffeningadhesive 70 is formed on thefirst side surface 13 of thebase 10 and the printedcircuit board 60, to enhance structural strength of thecamera module 100. - The
camera module 100 further includes a voice coil motor. The voice coil motor surrounds thelens cone 20 and is electrically connected to thelens 30. The voice coil motor can move thelens 30 up and down for focusing. - The camera module as disclosed, the escaping
hole 15 is defined at the sidewalls 101 or in thebottom wall 102. Theheat dissipation block 16 is received in each of the at least one escapinghole 15. Heat can be dissipated from thecamera module 100 quickly to have good heat dissipation efficiency, the heat generated by thesensor 50 or other electronic components can be dissipated to the ambient environment, further improving the quality of the images of thecamera module 100. Furthermore, theheat dissipation block 16 can improve the stability of thecamera module 100. - The embodiments shown and described above are only examples. Many details are often found in the art such as the other features of a camera module. Therefore, many such details are neither shown nor described. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes can be made in the detail, including in matters of shape, size, and arrangement of the parts within the principles of the present disclosure, up to and including the full extent established by the broad general meaning of the terms used in the claims. It will therefore be appreciated that the embodiments described above can be modified within the scope of the claims.
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811069806.0A CN110896435B (en) | 2018-09-13 | 2018-09-13 | Camera module |
CN201811069806 | 2018-09-13 | ||
CN201811069806.0 | 2018-09-13 |
Publications (2)
Publication Number | Publication Date |
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US10585335B1 US10585335B1 (en) | 2020-03-10 |
US20200089084A1 true US20200089084A1 (en) | 2020-03-19 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US16/201,968 Active US10585335B1 (en) | 2018-09-13 | 2018-11-27 | Camera module |
Country Status (3)
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US (1) | US10585335B1 (en) |
CN (1) | CN110896435B (en) |
TW (1) | TWI724343B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11683576B2 (en) * | 2020-11-16 | 2023-06-20 | Samsung Electro-Mechanics Co., Ltd. | Camera module |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113452875A (en) * | 2020-03-26 | 2021-09-28 | 晋城三赢精密电子有限公司 | Lens base, camera module and electronic device |
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JP5060935B2 (en) * | 2007-02-08 | 2012-10-31 | オリンパスイメージング株式会社 | Image sensor module and portable electronic device using the same |
US7928358B2 (en) * | 2007-02-08 | 2011-04-19 | Olympus Imaging Corp. | Imaging device module and portable electronic apparatus utilizing the same |
CN101609836B (en) * | 2008-06-19 | 2012-07-18 | 鸿富锦精密工业(深圳)有限公司 | Image sensor module and camera module |
KR101779499B1 (en) * | 2010-12-27 | 2017-09-18 | 엘지이노텍 주식회사 | Camera module |
CN102645820B (en) * | 2011-02-22 | 2016-08-03 | 广州美电恩智电子科技有限公司 | Camera module |
TWM448893U (en) * | 2012-11-13 | 2013-03-11 | Man Zai Ind Co Ltd | Assembling-type heat dissipation plate |
TW201426081A (en) * | 2012-12-28 | 2014-07-01 | Hon Hai Prec Ind Co Ltd | Image sensor module and camera module |
CN104660884A (en) * | 2013-11-25 | 2015-05-27 | 天津市天下数码视频有限公司 | Lighter type camera |
CN104836949A (en) * | 2015-05-11 | 2015-08-12 | 南昌欧菲光电技术有限公司 | Camera module and bracket thereof |
CN104902158B (en) * | 2015-06-17 | 2019-03-26 | 南昌欧菲光电技术有限公司 | Camera module bracket and camera module with it |
CN104994259A (en) * | 2015-06-26 | 2015-10-21 | 宁波舜宇光电信息有限公司 | Camera module support molded based on metal powder, and manufacturing method and application thereof |
US9984624B2 (en) * | 2015-12-28 | 2018-05-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, driver IC, and electronic device |
TWI639048B (en) * | 2017-05-22 | 2018-10-21 | 海華科技股份有限公司 | Portable electronic device and image-capturing module thereof, and carrier assembly thereof |
CN107249287A (en) * | 2017-07-27 | 2017-10-13 | 维沃移动通信有限公司 | A kind of electronic building brick and electronic equipment |
CN207443016U (en) * | 2017-12-07 | 2018-06-01 | 惠州海格光学技术有限公司 | A kind of band escapes the camera encapsulation module of air drain |
-
2018
- 2018-09-13 CN CN201811069806.0A patent/CN110896435B/en active Active
- 2018-11-02 TW TW107139039A patent/TWI724343B/en active
- 2018-11-27 US US16/201,968 patent/US10585335B1/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11683576B2 (en) * | 2020-11-16 | 2023-06-20 | Samsung Electro-Mechanics Co., Ltd. | Camera module |
Also Published As
Publication number | Publication date |
---|---|
TW202011100A (en) | 2020-03-16 |
US10585335B1 (en) | 2020-03-10 |
TWI724343B (en) | 2021-04-11 |
CN110896435B (en) | 2021-07-20 |
CN110896435A (en) | 2020-03-20 |
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