US20200089084A1 - Camera module - Google Patents

Camera module Download PDF

Info

Publication number
US20200089084A1
US20200089084A1 US16/201,968 US201816201968A US2020089084A1 US 20200089084 A1 US20200089084 A1 US 20200089084A1 US 201816201968 A US201816201968 A US 201816201968A US 2020089084 A1 US2020089084 A1 US 2020089084A1
Authority
US
United States
Prior art keywords
heat dissipation
hole
camera module
escaping
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
US16/201,968
Other versions
US10585335B1 (en
Inventor
Shin-Wen Chen
Jian-Chao Song
Jing-Wei Li
Sheng-Jie Ding
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Triple Win Technology Shenzhen Co Ltd
Original Assignee
Triple Win Technology Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Triple Win Technology Shenzhen Co Ltd filed Critical Triple Win Technology Shenzhen Co Ltd
Assigned to TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD. reassignment TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, SHIN-WEN, DING, Sheng-jie, LI, Jing-wei, SONG, Jian-chao
Application granted granted Critical
Publication of US10585335B1 publication Critical patent/US10585335B1/en
Publication of US20200089084A1 publication Critical patent/US20200089084A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/55Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/02Bodies
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/02Bodies
    • G03B17/12Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/52Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0209External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06Thermal details
    • H05K2201/066Heatsink mounted on the surface of the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10121Optical component, e.g. opto-electronic component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10151Sensor

Definitions

  • the subject matter generally relates to a camera module.
  • the holder, the lens, and the printed circuit board are made of plastic materials.
  • An enclosed space is defined by the holder, the lens, and the printed circuit board to avoid dusts or debris entering into the interior of the optical projection device of the camera. Such arrangements may hinder heat dissipation from the camera module and cause heating of the camera module which will affect the precision and quality of the structures guiding light in the camera module.
  • FIG. 1 is a view of a first embodiment of a camera module of the present disclosure.
  • FIG. 3 is a cross-sectional view of the camera module along line of FIG. 1 .
  • FIG. 4 is similar to FIG. 1 , but showing the camera module from another angle.
  • FIG. 5 is a cross-sectional view of the camera module along line V-V of FIG. 4 .
  • the base 10 includes a plurality of sidewalls 101 and a bottom wall 102 connected to each of the sidewalls 101 .
  • the bottom wall 102 and the plurality of sidewalls 101 define a first receiving groove 14 .
  • the first receiving groove 14 receives the optical filter 40 and the sensor 50 .
  • the first receiving groove 14 runs through the second surface 12 .
  • An opening 141 is defined in the bottom wall 102 , the opening 141 runs through the bottom wall 102 .
  • At least one escaping hole 15 is defined at the sidewalls 101 or in the bottom wall 102 .
  • the escaping hole 15 connects the first receiving groove 14 and the ambient environment.
  • a heat dissipation block 16 is received in each of the at least one escaping hole 15 .
  • the heat dissipation block 16 can be fixed in the escaping hole 15 by adhesive 17 .
  • the heat dissipation block 16 can be made of metal or other materials having good heat dissipation efficiency.
  • the at least one escaping hole 15 includes a first escaping hole 151 , a second escaping hole 152 , and a combination thereof.
  • the heat dissipation block 16 includes a first heat dissipation block 161 , a second heat dissipation block 162 , and a combination thereof.
  • the first heat dissipation block 161 is received in the first escaping hole 151 .
  • the second heat dissipation block 162 is received in the second escaping hole 152 .
  • the first escaping hole 151 is defined at the bottom wall 102 along a direction that is perpendicular to the printed circuit board 60 .
  • the first escaping hole 151 run through the first surface 11 and the second surface 12 .
  • the first escaping hole 151 is connected to the first receiving groove 14 .
  • the first escaping hole 151 includes a first hole portion 1511 and a second hole portion 1512 connected to the first hole portion 1511 .
  • the first hole portion 1511 is positioned adjacent to the first receiving groove 14 .
  • the second hole portion 1512 is positioned adjacent to the first surface 11 .
  • a width of the second hole portion 1512 is greater than a width of the first hole portion 1511 , the width being larger to increase heat dissipation area of the first heat dissipation block 161 .
  • the first heat dissipation block 161 includes a first heat dissipation portion 1611 and a second heat dissipation portion 1612 connected to the first heat dissipation portion 1611 .
  • the first heat dissipation portion 1611 is received in the first hole portion 1511 .
  • the second heat dissipation portion 1612 is received in the second hole portion 1512 .
  • a width of the second heat dissipation portion 1612 is greater than a width of the first heat dissipation portion 1611 .
  • a width of the second hole portion 1512 is greater than a width of the second heat dissipation portion 1612 , a first gap 1513 is defined between the second hole portion 1512 and the second heat dissipation portion 1612 .
  • the first gap receives the adhesive 17 .
  • the second escaping hole 152 is defined at the sidewall 101 along a direction that is inclined with respect to the sidewall 101 , the inclination allows the second heat dissipation block 162 received therein to have a larger heat dissipation area.
  • the second escaping hole 152 run through the sidewall 101 and is connected to the first receiving groove 14 .
  • the third heat dissipation portion 1621 is received in the third hole portion 1521 .
  • the fourth heat dissipation portion 1622 is received in the fourth hole portion 1522 .
  • a width of the fourth heat dissipation portion 1622 is greater than a width of the third heat dissipation portion 1621 .
  • a width of the fourth hole portion 1522 is greater than a width of the fourth heat dissipation portion 1622 , a second gap 1523 is defined between the fourth hole portion 1522 and the fourth heat dissipation portion 1622 .
  • the second gap receives the adhesive 17 .

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

A camera module with good heat dissipation efficiency and stability includes a base. The base comprises a first receiving groove. At least one escaping hole is defined at the base and the escaping hole forms a connection between the first receiving groove and the ambient environment. At least one heat dissipation block is received in each escaping hole.

Description

    FIELD
  • The subject matter generally relates to a camera module.
  • BACKGROUND
  • Most camera modules on the market are composed of a lens, a holder, a motor, a filter, a sensor chip, a plastic base, and a circuit board. Cameras are used more frequently and cameras with good reliability and quality are expected.
  • The holder, the lens, and the printed circuit board are made of plastic materials. An enclosed space is defined by the holder, the lens, and the printed circuit board to avoid dusts or debris entering into the interior of the optical projection device of the camera. Such arrangements may hinder heat dissipation from the camera module and cause heating of the camera module which will affect the precision and quality of the structures guiding light in the camera module.
  • Therefore, there is room for improvement in the art.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Implementations of the present technology will now be described, by way of embodiments only, with reference to the attached figures.
  • FIG. 1 is a view of a first embodiment of a camera module of the present disclosure.
  • FIG. 2 is an exploded view of the camera module of FIG. 1.
  • FIG. 3 is a cross-sectional view of the camera module along line of FIG. 1.
  • FIG. 4 is similar to FIG. 1, but showing the camera module from another angle.
  • FIG. 5 is a cross-sectional view of the camera module along line V-V of FIG. 4.
  • DETAILED DESCRIPTION
  • It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale, and the proportions of certain portions may be exaggerated to better illustrate details and features of the present disclosure.
  • The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings, in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one.”
  • The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.
  • FIGS. 1-5 illustrate an embodiment of a camera module 100. The camera module 100 includes a base 10, a lens cone 20, a lens 30, an optical filter 40, a sensor 50, and a printed circuit board 60. The lens 30 is received in the lens cone 20. The lens cone 20 is fixed on the base 10. The base 10 is fixed on the printed circuit board 60. The optical filter 40 is received in the base 10. The sensor 50 is received in the base 10 and formed on the printed circuit board 60.
  • The base 10 includes a first surface 11, a second surface 12 opposite to the first surface 11, and a plurality of side surfaces 13 each perpendicularly connected to the first surface 11 and the second surface 12.
  • The base 10 includes a plurality of sidewalls 101 and a bottom wall 102 connected to each of the sidewalls 101. The bottom wall 102 and the plurality of sidewalls 101 define a first receiving groove 14.
  • The first receiving groove 14 receives the optical filter 40 and the sensor 50. The first receiving groove 14 runs through the second surface 12.
  • An opening 141 is defined in the bottom wall 102, the opening 141 runs through the bottom wall 102.
  • At least one escaping hole 15 is defined at the sidewalls 101 or in the bottom wall 102. The escaping hole 15 connects the first receiving groove 14 and the ambient environment. A heat dissipation block 16 is received in each of the at least one escaping hole 15. The heat dissipation block 16 can be fixed in the escaping hole 15 by adhesive 17. The heat dissipation block 16 can be made of metal or other materials having good heat dissipation efficiency.
  • In an embodiment, the at least one escaping hole 15 includes a first escaping hole 151, a second escaping hole 152, and a combination thereof. The heat dissipation block 16 includes a first heat dissipation block 161, a second heat dissipation block 162, and a combination thereof. The first heat dissipation block 161 is received in the first escaping hole 151. The second heat dissipation block 162 is received in the second escaping hole 152.
  • The first escaping hole 151 is defined at the bottom wall 102 along a direction that is perpendicular to the printed circuit board 60. The first escaping hole 151 run through the first surface 11 and the second surface 12. The first escaping hole 151 is connected to the first receiving groove 14.
  • The first escaping hole 151 includes a first hole portion 1511 and a second hole portion 1512 connected to the first hole portion 1511. The first hole portion 1511 is positioned adjacent to the first receiving groove 14. The second hole portion 1512 is positioned adjacent to the first surface 11. A width of the second hole portion 1512 is greater than a width of the first hole portion 1511, the width being larger to increase heat dissipation area of the first heat dissipation block 161. The first heat dissipation block 161 includes a first heat dissipation portion 1611 and a second heat dissipation portion 1612 connected to the first heat dissipation portion 1611. The first heat dissipation portion 1611 is received in the first hole portion 1511. The second heat dissipation portion 1612 is received in the second hole portion 1512. A width of the second heat dissipation portion 1612 is greater than a width of the first heat dissipation portion 1611. A width of the second hole portion 1512 is greater than a width of the second heat dissipation portion 1612, a first gap 1513 is defined between the second hole portion 1512 and the second heat dissipation portion 1612. The first gap receives the adhesive 17.
  • The second escaping hole 152 is defined at the sidewall 101 along a direction that is inclined with respect to the sidewall 101, the inclination allows the second heat dissipation block 162 received therein to have a larger heat dissipation area. The second escaping hole 152 run through the sidewall 101 and is connected to the first receiving groove 14.
  • The second escaping hole 152 includes a third hole portion 1521 and a fourth hole portion 1522 connected to the third hole portion 1521. The third hole portion 1521 is positioned adjacent to the first receiving groove 14. The fourth hole portion 1522 is positioned adjacent to at least one of the side surfaces 13. A width of the fourth hole portion 1522 is greater than a width of the third hole portion 1521, to increase heat dissipation area of the second heat dissipation block 162. The second heat dissipation block 162 includes a third heat dissipation portion 1621 and a fourth heat dissipation portion 1622 connected to the third heat dissipation portion 1621. The third heat dissipation portion 1621 is received in the third hole portion 1521. The fourth heat dissipation portion 1622 is received in the fourth hole portion 1522. A width of the fourth heat dissipation portion 1622 is greater than a width of the third heat dissipation portion 1621. A width of the fourth hole portion 1522 is greater than a width of the fourth heat dissipation portion 1622, a second gap 1523 is defined between the fourth hole portion 1522 and the fourth heat dissipation portion 1622. The second gap receives the adhesive 17.
  • The lens cone 20 is fixed on the base 10. In an embodiment, the lens cone 20 and the base 10 are integrally formed. In another embodiment, the lens cone 20 can be connected to the base 10 by screws or adhesive.
  • The lens cone 20 includes a third surface 21, a second receiving groove 22 configured for the lens cone 20. The second receiving groove 22 runs through the third surface 21. The second receiving groove 22 receives and fixes the lens 30. The second receiving groove 22 is connected to the first receiving groove 14.
  • The lens 30 is received and fixed in the second receiving groove 22. The lens 30 includes an ophthalmic lens 31 facing the opening 141.
  • The optical filter 40 filters out stray light entering into the camera module 100. The optical filter 40 is fixed on the bottom wall 102 and received in the first receiving groove 14. A portion of the optical filter 40 is exposed from the opening 141.
  • The sensor 50 is fixed on and electrically connected to the printed circuit board 60. The sensor 50 is received in the first receiving groove 14 and faces the optical filter 40.
  • The camera module 100 further includes a stiffening adhesive 70. The stiffening adhesive 70 is formed on the first side surface 13 of the base 10 and the printed circuit board 60, to enhance structural strength of the camera module 100.
  • The camera module 100 further includes a voice coil motor. The voice coil motor surrounds the lens cone 20 and is electrically connected to the lens 30. The voice coil motor can move the lens 30 up and down for focusing.
  • The camera module as disclosed, the escaping hole 15 is defined at the sidewalls 101 or in the bottom wall 102. The heat dissipation block 16 is received in each of the at least one escaping hole 15. Heat can be dissipated from the camera module 100 quickly to have good heat dissipation efficiency, the heat generated by the sensor 50 or other electronic components can be dissipated to the ambient environment, further improving the quality of the images of the camera module 100. Furthermore, the heat dissipation block 16 can improve the stability of the camera module 100.
  • The embodiments shown and described above are only examples. Many details are often found in the art such as the other features of a camera module. Therefore, many such details are neither shown nor described. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes can be made in the detail, including in matters of shape, size, and arrangement of the parts within the principles of the present disclosure, up to and including the full extent established by the broad general meaning of the terms used in the claims. It will therefore be appreciated that the embodiments described above can be modified within the scope of the claims.

Claims (20)

1. A camera module comprising:
a base, wherein the base comprises a first receiving groove, a plurality of sidewalls, and a bottom wall connected to each of the sidewalls, the first receiving groove is defined by the bottom wall and the plurality of sidewalls;
at least one escaping hole, wherein the at least one escaping hole is defined at the base and connects to the first receiving groove and ambient environment, the at least one escaping hole comprises a first escaping hole, the first escaping hole is defined in the bottom wall; and
at least one heat dissipation block, wherein the heat dissipation block is received in each of the at least one escaping hole, each of the at least one heat dissipation block comprises a first heat dissipation block, the first heat dissipation block is received in the first escaping hole.
2. The camera module of claim 1, wherein the heat dissipation block is made of metal or other materials having good heat dissipation efficiency.
3. The camera module of claim 1, wherein each of the at least one heat dissipation block is fixed in each of the at least one escaping hole by adhesive.
4. (canceled)
5. (canceled)
6. The camera module of claim 1, wherein the camera module further comprises a printed circuit board, the base is formed on the printed circuit board; the first escaping hole is defined at the bottom wall along a direction perpendicular to the printed circuit board.
7. The camera module of claim 1, wherein each of the at least one first escaping hole comprises a first hole portion and a second hole portion connecting to the first hole portion; the first hole portion is positioned adjacent to the first receiving groove.
8. The camera module of claim 7, wherein a width of the second hole portion is greater than a width of the first hole portion.
9. The camera module of claim 7, wherein the first heat dissipation block comprises a first heat dissipation portion and a second heat dissipation portion connecting to the first heat dissipation portion, the first heat dissipation portion is received in the first hole portion, the second heat dissipation portion is received in the second hole portion.
10. The camera module of claim 9, wherein a width of the second heat dissipation portion is greater than a width of the first heat dissipation portion.
11. The camera module of claim 9, wherein a width of the second hole portion is greater than a width of the second heat dissipation portion, a first gap is defined between the second hole portion and the second heat dissipation portion, the first gap receives the adhesive.
12-16. (canceled)
17. The camera module of claim 1, wherein the camera module further comprises a lens cone formed on the base and a lens received in the lens cone.
18. The camera module of claim 4, wherein the camera module further comprises an optical filter, the optical filter is fixed on the bottom wall and received in the first receiving groove.
19. The camera module of claim 18, wherein an opening is defined at the bottom wall, a portion of the optical filter is exposed from the opening.
20. A camera module comprising:
a base, wherein the base comprises a first receiving groove, a plurality of sidewalls, and a bottom wall connected to each of the sidewalls, the first receiving groove is defined by the bottom wall and the plurality of sidewalls;
at least one escaping hole, wherein the at least one escaping hole is defined at the base and connects to the first receiving groove and ambient environment, the at least one escaping hole comprises a second escaping hole, the second escaping hole is defined at the sidewall along a direction inclined with respect to the sidewall; and
at least one heat dissipation block, wherein the heat dissipation block is received in each of the at least one escaping hole, each of the at least one heat dissipation block comprises a second heat dissipation block, the second heat dissipation block is received in the second escaping hole.
21. The camera module of claim 20, wherein the second escaping hole comprises a third hole portion and a fourth hole portion connecting to the third hole portion, the third hole portion is positioned adjacent to the first receiving groove; the second heat dissipation block comprises a third heat dissipation portion and a fourth heat dissipation portion connecting to the third heat dissipation portion, the third heat dissipation portion is received in the third hole portion, the fourth heat dissipation portion is received in the fourth hole portion.
22. The camera module of claim 21, wherein a width of the fourth hole portion is greater than a width of the fourth heat dissipation portion, a second gap is defined between the fourth hole portion and the fourth heat dissipation portion, the second gap receives the adhesive.
23. The camera module of claim 21, wherein a width of the fourth hole portion is greater than a width of the third hole portion.
24. The camera module of claim 21, wherein a width of the fourth heat dissipation portion is greater than a width of the third heat dissipation portion.
US16/201,968 2018-09-13 2018-11-27 Camera module Active US10585335B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201811069806.0A CN110896435B (en) 2018-09-13 2018-09-13 Camera module
CN201811069806 2018-09-13
CN201811069806.0 2018-09-13

Publications (2)

Publication Number Publication Date
US10585335B1 US10585335B1 (en) 2020-03-10
US20200089084A1 true US20200089084A1 (en) 2020-03-19

Family

ID=69723429

Family Applications (1)

Application Number Title Priority Date Filing Date
US16/201,968 Active US10585335B1 (en) 2018-09-13 2018-11-27 Camera module

Country Status (3)

Country Link
US (1) US10585335B1 (en)
CN (1) CN110896435B (en)
TW (1) TWI724343B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11683576B2 (en) * 2020-11-16 2023-06-20 Samsung Electro-Mechanics Co., Ltd. Camera module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113452875A (en) * 2020-03-26 2021-09-28 晋城三赢精密电子有限公司 Lens base, camera module and electronic device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5060935B2 (en) * 2007-02-08 2012-10-31 オリンパスイメージング株式会社 Image sensor module and portable electronic device using the same
US7928358B2 (en) * 2007-02-08 2011-04-19 Olympus Imaging Corp. Imaging device module and portable electronic apparatus utilizing the same
CN101609836B (en) * 2008-06-19 2012-07-18 鸿富锦精密工业(深圳)有限公司 Image sensor module and camera module
KR101779499B1 (en) * 2010-12-27 2017-09-18 엘지이노텍 주식회사 Camera module
CN102645820B (en) * 2011-02-22 2016-08-03 广州美电恩智电子科技有限公司 Camera module
TWM448893U (en) * 2012-11-13 2013-03-11 Man Zai Ind Co Ltd Assembling-type heat dissipation plate
TW201426081A (en) * 2012-12-28 2014-07-01 Hon Hai Prec Ind Co Ltd Image sensor module and camera module
CN104660884A (en) * 2013-11-25 2015-05-27 天津市天下数码视频有限公司 Lighter type camera
CN104836949A (en) * 2015-05-11 2015-08-12 南昌欧菲光电技术有限公司 Camera module and bracket thereof
CN104902158B (en) * 2015-06-17 2019-03-26 南昌欧菲光电技术有限公司 Camera module bracket and camera module with it
CN104994259A (en) * 2015-06-26 2015-10-21 宁波舜宇光电信息有限公司 Camera module support molded based on metal powder, and manufacturing method and application thereof
US9984624B2 (en) * 2015-12-28 2018-05-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, driver IC, and electronic device
TWI639048B (en) * 2017-05-22 2018-10-21 海華科技股份有限公司 Portable electronic device and image-capturing module thereof, and carrier assembly thereof
CN107249287A (en) * 2017-07-27 2017-10-13 维沃移动通信有限公司 A kind of electronic building brick and electronic equipment
CN207443016U (en) * 2017-12-07 2018-06-01 惠州海格光学技术有限公司 A kind of band escapes the camera encapsulation module of air drain

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11683576B2 (en) * 2020-11-16 2023-06-20 Samsung Electro-Mechanics Co., Ltd. Camera module

Also Published As

Publication number Publication date
TW202011100A (en) 2020-03-16
US10585335B1 (en) 2020-03-10
TWI724343B (en) 2021-04-11
CN110896435B (en) 2021-07-20
CN110896435A (en) 2020-03-20

Similar Documents

Publication Publication Date Title
KR20220007899A (en) Lens moving apparatus
US8018527B2 (en) Connecting structure and digital camera module employing the same
US7542220B2 (en) Camera module assembly and method for assembling same
US10681255B2 (en) Holder for camera module and camera module with holder
KR20090062472A (en) Camera module
US10585335B1 (en) Camera module
US20240170466A1 (en) Optical navigation module performing lateral detection
KR20180102945A (en) Dual camera module
KR20220141770A (en) Lens driving unit and camera module including the same
CN112005167B (en) Camera module and optical apparatus including the same
US8736738B2 (en) Optical lens and image pick-up apparatus having same
US10948805B2 (en) Camera module
US20230296863A1 (en) Lens element, imaging lens assembly, camera module and electronic device
US11778296B2 (en) Camera module and electronic device having the camera module
US10627097B2 (en) Optical projection device
EP1906654A1 (en) Flat camera module
US11381766B2 (en) Bracket reducing flare and having no dark edges, lens module, and electronic device
JP7382271B2 (en) Imaging device
JP7382272B2 (en) Imaging device manufacturing method and imaging device
KR200497627Y1 (en) Center block for positioning stage
US11506909B2 (en) Optical mechanism
US20230065258A1 (en) Lens base with improved strength and reduced size, camera module and electronic devices having the same
KR102617335B1 (en) Lens moving unit and camera module including the same
WO2020062146A1 (en) Bearing structure in camera module and manufacturing method therefor, and camera module and terminal device
KR20230031685A (en) Camera module

Legal Events

Date Code Title Description
AS Assignment

Owner name: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD., CHINA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, SHIN-WEN;SONG, JIAN-CHAO;LI, JING-WEI;AND OTHERS;REEL/FRAME:047597/0303

Effective date: 20181106

FEPP Fee payment procedure

Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

STCF Information on status: patent grant

Free format text: PATENTED CASE

MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 4