US20200066957A1 - Optoelectronic modules having fluid permeable channels and methods for manufacturing the same - Google Patents

Optoelectronic modules having fluid permeable channels and methods for manufacturing the same Download PDF

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Publication number
US20200066957A1
US20200066957A1 US16/071,320 US201716071320A US2020066957A1 US 20200066957 A1 US20200066957 A1 US 20200066957A1 US 201716071320 A US201716071320 A US 201716071320A US 2020066957 A1 US2020066957 A1 US 2020066957A1
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Prior art keywords
optoelectronic
module
mounting surface
optical component
component
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US16/071,320
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English (en)
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Tobias Senn
Julien Boucart
Susanne Westenhöfer
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Ams Sensors Singapore Pte Ltd
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Ams Sensors Singapore Pte Ltd
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Priority to US16/071,320 priority Critical patent/US20200066957A1/en
Assigned to HEPTAGON MICRO OPTICS PTE. LTD. reassignment HEPTAGON MICRO OPTICS PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BOUCART, JULIEN, Senn, Tobias, Westenhöfer, Susanne
Assigned to AMS SENSORS SINGAPORE PTE. LTD. reassignment AMS SENSORS SINGAPORE PTE. LTD. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: HEPTAGON MICRO OPTICS PTE. LTD.
Publication of US20200066957A1 publication Critical patent/US20200066957A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H01S5/02244—
    • H01S5/0226—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/0232—Lead-frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0236—Fixing laser chips on mounts using an adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Definitions

  • a typical optoelectronic module is often constructed with at least one fluid permeable channel, such as a venting hole, designed to allow fluids, such as gasses, to pass into or out of a cavity within the module.
  • Fluid permeable channels can be incorporated into a module for a number of reasons.
  • a module that includes a heat-generating active optoelectronic component e.g., a laser diode or a light-emitting diode mounted onto an electrical substrate within a cavity
  • a fluid-permeable channel for optimum performance That is, during operation, heat generated by the component can accumulate within the module and can alter the performance of temperature-sensitive electronic components or alter the size or shape of dimension-critical components, such as optical elements (e.g., refractive, diffractive lenses) or spacers between optical elements.
  • a fluid-permeable channel through the electronic substrate and adjacent to the heat-generating component can conduct heat out of the cavity and away from any adjacent temperature-sensitive electronic components, optical elements, or spacers.
  • the process for manufacturing an optoelectronic module influences the location of the fluid-permeable channel within the module.
  • wafer-level manufacturing methods are employed to manufacture a wafer of tens, hundreds, or even thousands of contiguous optoelectronic modules.
  • Subsequent manufacturing steps require separating (e.g., dicing) the wafer of contiguous optoelectronic modules into discrete modules.
  • the separating process can introduce foreign matter (e.g., dicing fluid, dicing particles) into the module via the fluid-permeable channels.
  • the foreign matter can detrimentally affect performance and, in some instances, can generate serious eye-safety concerns.
  • the wafer of contiguous optoelectronic modules is typically mounted onto a separation substrate such as dicing tape via the electronic substrate wherein the fluid-permeable channels have been previously incorporated.
  • the procedure effectively seals off the fluid-permeable channels for the subsequent separating steps thereby preventing foreign matter from entering into the optoelectronic modules via the fluid permeable channels.
  • the optoelectronic modules include fluid permeable channels, and are configured such that: 1) the channels are sealed to foreign matter during certain manufacturing steps, such as steps involving the separation of a plurality of contiguous modules into a plurality of discrete, non-contiguous modules; 2) the channels remain free from blockages, such as solidified flux, during certain manufacturing steps, such as steps involving electrically mounting components; 3) the channels can permit heat (i.e., heated fluids) to escape from the optoelectronic module during operation; 4) incorporated spacers can mitigate or eliminate cross-talk; 5) incorporated alignment components can permit the precise alignment of optical components and respective active optoelectronic components; and/or 6) incorporated adhesive channels can prevent adhesive from migrating onto optical components.
  • an optoelectronic module in a first aspect, for example, includes an active optoelectronic component mounted electrically to an active optoelectronic component substrate, and a spacer laterally surrounding the active optoelectronic component thereby forming a chamber.
  • the spacer includes an optical component mounting surface, a fluid permeable channel, and a module mounting surface.
  • the optoelectronic module further includes an optical component mounted onto the optical component mounting surface.
  • an optoelectronic module in another aspect, for example, includes a fluid permeable channel.
  • the channel can be adjacent to an optical component mounting surface.
  • an optoelectronic module includes a module mounting surface adjacent to an optical component mounting surface.
  • an optoelectronic module includes an active optoelectronic component operable to emit a particular range of wavelengths of electromagnetic radiation, and in some instance, can include an active optoelectronic component sensitive to a particular range of wavelengths of electromagnetic radiation.
  • an optoelectronic module includes a spacer that is substantially non-transmissive to a particular range of wavelengths of electromagnetic radiation.
  • an optoelectronic module includes an optical component mounted to an optical mounting surface with adhesive.
  • an optoelectronic module in another aspect, for example, includes a spacer having an adhesive channel adjacent to an optical component mounting surface.
  • an optoelectronic module in another aspect, for example, includes a spacer with an alignment component and an adhesive channel. Both the alignment component and the adhesive channel can be adjacent to an optical component mounting surface.
  • an optoelectronic module includes an optical component having an adhesive channel and an alignment component.
  • an optoelectronic module in another aspect, for example, includes a fluid permeable channel adjacent to an active optoelectronic component.
  • the fluid permeable channel can include a fluid permeable membrane.
  • an optoelectronic module in another aspect, for example, includes a module mounting surface.
  • the module mounting surface can be operable to seal a chamber and a fluid-permeable channel when the module mounting surface is in contact with an adhesive substrate.
  • an optoelectronic module includes an active optoelectronic component.
  • the active optoelectronic component can be a laser diode, a light-emitting diode, an array of laser diodes, and/or an array of light emitting diodes.
  • an optoelectronic module includes an active optoelectronic component.
  • the active optoelectronic component can be a photodiode, an array of photodiodes, and/or an array of pixels.
  • an optoelectronic module includes a spacer.
  • the spacer can be composed, at least in part, of a polymeric material.
  • an optoelectronic module includes an active optoelectronic component substrate.
  • the active optoelectronic component substrate can be composed, at least in part, of a lead frame.
  • a method of manufacturing an optoelectronic module from a plurality of optoelectronic modules includes the step of mounting electrically a plurality of active optoelectronic components to an active optoelectronic component substrate.
  • the active optoelectronic component substrate can be laterally surrounded by a spacer forming a chamber.
  • the spacer can include an optical component mounting surface, a fluid permeable channel, and a module mounting surface.
  • the method of manufacturing can further include the steps of applying an adhesive to the optical component mounting surface, mounting an optical component to the optical component mounting surface, curing the adhesive, mounting the optoelectronic module via the module mounting surface to an adhesive substrate, and separating the plurality of optoelectronic modules into singulated optoelectronic modules.
  • a method can include the step of removing an adhesive substrate from a plurality of optoelectronic modules with thermal and/or electromagnetic radiation.
  • a method can include the step of mounting an optoelectronic module or a plurality of optoelectronic modules into a host device.
  • a method can include the step of subjecting an optoelectronic module or a plurality of optoelectronic modules to a heat treatment.
  • a method can include the step of mounting an optoelectronic module or a plurality of optoelectronic modules via a module mounting surface to an adhesive substrate, wherein the adhesive substrate is a dicing tape.
  • FIG. 1A depicts a schematic top view of an example optoelectronic module having a fluid permeable channel.
  • FIG. 1B depicts a schematic side view of the example optoelectronic module depicted in FIG. 1A .
  • FIG. 1C depicts a magnified side view of the example optoelectronic module depicted in FIG. 1A .
  • FIG. 1D depicts a plan view of an example optoelectronic module with adhesive.
  • FIG. 1E depicts a side view of the example optoelectronic module depicted in FIG. 1D .
  • FIG. 1F depicts a magnified side view of the example optoelectronic module depicted in FIG. 1A .
  • FIG. 1G depicts a side view of an example of a plurality of contiguous optoelectronic modules.
  • FIG. 1H depicts a side view of the plurality of optoelectronic modules depicted in FIG. 1G including singulation lines.
  • FIG. 2A depicts a schematic top view of another example optoelectronic module having a fluid permeable channel.
  • FIG. 2B depicts a schematic side view of the example optoelectronic module depicted in FIG. 2A .
  • FIG. 3A depicts a schematic top view of an optoelectronic module having a fluid permeable channel and an adhesive channel.
  • FIG. 3B depicts a schematic side view of the example optoelectronic module depicted in FIG. 3A .
  • FIG. 3C depicts a magnified side view of the example optoelectronic module depicted in FIG. 3A .
  • FIG. 3D depicts a magnified side view of the example optoelectronic module depicted in FIG. 3A with adhesive.
  • FIG. 4A depicts a schematic top view of an example optoelectronic module having a fluid permeable channel, an adhesive channel, and an alignment component.
  • FIG. 4B depicts a schematic side view of the example optoelectronic module depicted in FIG. 4A .
  • FIG. 4C depicts a magnified side view of the example optoelectronic module depicted in FIG. 4A .
  • FIG. 4D depicts a magnified side view of the example optoelectronic module depicted in FIG. 4A and an example location of adhesive.
  • FIG. 5A depicts a schematic top view of yet another example optoelectronic module having a fluid permeable channel.
  • FIG. 5B depicts a schematic side view of the example optoelectronic module depicted in FIG. 5A .
  • FIG. 5C depicts a magnified side view of the example optoelectronic module depicted in FIG. 5A .
  • FIG. 6A depicts a schematic top view of another example optoelectronic module having a fluid permeable channel, an adhesive channel, and an alignment component.
  • FIG. 6B depicts a schematic side view of the example optoelectronic module depicted in FIG. 6A .
  • FIG. 6C depicts a magnified side view of the example optoelectronic module depicted in FIG. 6A .
  • FIG. 6D depicts a magnified side view of the example optoelectronic module depicted in FIG. 6A and an example location of adhesive.
  • FIG. 7 depicts a process of manufacturing an example optoelectronic module from a plurality of optoelectronic modules.
  • FIG. 8 depicts another process of manufacturing an example optoelectronic module from a plurality of optoelectronic modules.
  • FIG. 1A depicts a schematic top view of an example optoelectronic module 100 having a fluid permeable channel.
  • the optoelectronic module 100 can include an active optoelectronic component 102 mounted electrically to an active optoelectronic component substrate 104 (e.g., a printed circuit board PCB or a metallic component such as a lead frame).
  • an active optoelectronic component substrate 104 e.g., a printed circuit board PCB or a metallic component such as a lead frame.
  • the active optoelectronic component 102 can include light emitting (e.g., light-emitting diodes, laser diodes, and/or arrays of light-emitting diodes or laser diodes) and/or light detecting components (e.g., photodiodes, arrays of photodiodes, charge-couple device-based image sensors and/or complementary metal-oxide semiconductor-based image sensors).
  • light emitting e.g., light-emitting diodes, laser diodes, and/or arrays of light-emitting diodes or laser diodes
  • light detecting components e.g., photodiodes, arrays of photodiodes, charge-couple device-based image sensors and/or complementary metal-oxide semiconductor-based image sensors.
  • the optoelectronic module 100 can further include a spacer 106 .
  • the spacer 106 can laterally surround the active optoelectronic component 102 thereby forming a chamber 108 .
  • the spacer 106 can be formed around the active optoelectronic component substrate 104 .
  • a plurality of spacers 106 can be formed around a lead frame, the lead frame being a plurality of active optoelectronic component substrates 104 .
  • the spacer can be composed of a polymeric material such as an epoxy resin.
  • the spacer 106 can be operable to substantially attenuate wavelengths of electromagnetic radiation.
  • the spacer 106 can be substantially non-transparent to wavelengths of light emitted by and/or detectable by the active optoelectronic component 102 .
  • the spacer 106 can be formed from a moldable material.
  • the spacer 106 can be formed via injection molding and/or vacuum assisted molding in some implementations.
  • the spacer 106 can be formed from a molding resin.
  • the spacer 106 can further be composed of non-transparent organic and/or inorganic fillers such as carbon black.
  • the optoelectronic module 100 can further include an optical component 110 mounted to the spacer 106 via an optical component mounting surface 112 .
  • the optical component 110 can include a refractive lens, a diffractive lens, and/or an array of refractive and/or diffractive lenses.
  • the optical component 110 can include a spectral filter.
  • the optical component 110 can include a transparent cover.
  • the optical component 110 can be mounted to the optical component mounting surface 112 at an operable distance from the active optoelectronic component 102 .
  • the optoelectronic module 100 can further include a fluid-permeable channel 114 formed within the spacer 106 .
  • the fluid-permeable channel 114 is operable to permit the outflow of fluids from the chamber 108 .
  • the fluid-permeable channel 114 can be formed within the spacer 106 adjacent to the optical component 110 .
  • the optoelectronic module 100 can further include a module mounting surface 116 formed on the spacer 106 .
  • the module mounting surface 116 is configured to permit the optoelectronic module 100 to be temporarily sealed during manufacturing of the optoelectronic module 100 .
  • the module mounting surface 116 is characterized by a flat surface wherein the fluid-permeable channel 114 does not extend such that a seal can be established via a temporary substrate (e.g., dicing tape).
  • the optoelectronic module 100 can further include an optical component offset 118 as depicted in the schematic side view of FIG. 1B and the magnified side of FIG. 1C .
  • the optical component offset 118 can prevent the optical component 110 from adhering to a temporary substrate, such as a dicing tape, while still allowing the optoelectronic module 100 to be securely fixed to the temporary substrate.
  • FIG. 1D depicts a plan view of the optoelectronic module 100 with adhesive 122 .
  • FIG. 1E depicts a side view of the example optoelectronic module 100 with adhesive
  • FIG. 1F depicts a magnified side view of the example optoelectronic module depicted in FIG. 1A .
  • the adhesive 122 is depicted in an example location. In some instance, more or less adhesive, corresponding to more or less coverage may be required.
  • the adhesive 122 can be located on the optical component mounting surface 112 . In some implementations, the adhesive 122 can be located in between the optical component mounting surface 112 and the optical component 110 .
  • the adhesive 122 is operable to fix the optical component 110 to the optical component mounting surface 112 .
  • the adhesive 122 can be mounted to the optical component mounting surface 112 by jetting and/or screen printing.
  • the adhesive 122 can be a curable adhesive such as epoxy.
  • the adhesive 122 can be mounted to the optical component mounting surface 112 in a substantially fluidic state and can be cured with electromagnetic radiation, such as ultraviolet light and/or infrared light.
  • FIG. 1G depicts a side view of a contiguous plurality of optoelectronic modules.
  • the optoelectronic module 100 can be manufactured from an optoelectronic module plurality 120 .
  • the optoelectronic module plurality 120 can be mounted to an adhesive substrate 124 via the module mounting surface 116 .
  • the optoelectronic module plurality 120 can include a large number of optoelectronic modules.
  • optoelectronic module plurality 120 can include tens, hundreds, or even thousands of optoelectronic modules.
  • the optoelectronic module plurality 120 can be a wafer.
  • the adhesive substrate 124 can be an adhesive tape such as dicing tape.
  • the adhesive substrate 124 can be thermally deactivated adhesive tape or can be deactivated with electromagnetic radiation, such as ultraviolet light or infrared light.
  • FIG. 1H depicts a side view of a contiguous plurality of optoelectronic modules with schematic singulation lines.
  • the optoelectronic module plurality 120 can be separated into discrete optoelectronic modules (e.g., optoelectronic module 100 ) along singulation lines 126 .
  • the optoelectronic module plurality 120 can be separated by mechanical dicing.
  • a fluid can be used when mechanically dicing the optoelectronic module plurality 120 .
  • the optoelectronic module plurality 120 can be separated by a laser beam.
  • the module mounting surface 116 and the adhesive substrate 124 can form a barrier against the fluid.
  • the module mounting surface 116 and the adhesive substrate 124 can form a barrier against particles created during the mechanical separation of optoelectronic module plurality 120 into discrete optoelectronic modules 100 .
  • FIG. 2A depicts a schematic top view of another example optoelectronic module 200 having a fluid permeable channel.
  • the optoelectronic module 200 can include an active optoelectronic component 202 mounted electrically to an active optoelectronic component substrate 204 (e.g., a printed circuit board PCB or a metallic component such as a lead frame).
  • an active optoelectronic component substrate 204 e.g., a printed circuit board PCB or a metallic component such as a lead frame.
  • the active optoelectronic component 202 can include light emitting (e.g., light-emitting diodes, laser diodes, and/or arrays of light-emitting diodes or laser diodes) and/or light detecting components (e.g., photodiodes, arrays of photodiodes, charge-couple device-based image sensors and/or complementary metal-oxide semiconductor-based image sensors).
  • light emitting e.g., light-emitting diodes, laser diodes, and/or arrays of light-emitting diodes or laser diodes
  • light detecting components e.g., photodiodes, arrays of photodiodes, charge-couple device-based image sensors and/or complementary metal-oxide semiconductor-based image sensors.
  • the optoelectronic module 200 can further include a spacer 206 .
  • the spacer 206 can laterally surround the active optoelectronic component 202 thereby forming a chamber 208 .
  • the spacer 206 can be formed around the active optoelectronic component substrate 204 .
  • a plurality of spacers 206 can be formed around a lead frame, the lead frame being a plurality of active optoelectronic component substrates 204 .
  • the spacer can be composed of a polymeric material such as an epoxy resin.
  • the spacer 206 can be operable to substantially attenuate wavelengths of electromagnetic radiation.
  • the spacer 206 can be substantially non-transparent to wavelengths of light emitted by and/or detectable by the active optoelectronic component 202 .
  • the spacer 206 can be formed from a moldable material.
  • the spacer 206 can be formed via injection molding and/or vacuum assisted molding in some implementations.
  • the spacer 206 can be formed from a molding resin.
  • the spacer 206 can further be composed of non-transparent organic and/or inorganic fillers such as carbon black.
  • the optoelectronic module 200 can further include an optical component 210 mounted to the spacer 206 via an optical component mounting surface 212 .
  • the optical component 210 can include a refractive lens, a diffractive lens, and/or an array of refractive and/or diffractive lenses.
  • the optical component 210 can include a spectral filter.
  • the optical component 210 can include a transparent cover.
  • the optical component 210 can be mounted to the optical component mounting surface 212 at an operable distance from the active optoelectronic component 202 .
  • the optoelectronic module 200 can further include a fluid-permeable channel 214 formed within the spacer 206 .
  • the fluid-permeable channel 214 is operable to permit the outflow of fluids from the chamber 208 .
  • the fluid-permeable channel 214 can be formed within the spacer 206 adjacent to the optical component 210 .
  • the optoelectronic module 200 further includes a module mounting surface 216 formed on the spacer 206 .
  • the module mounting surface 216 is configured to permit the optoelectronic module 200 to be temporarily sealed during manufacturing of the optoelectronic module 200 .
  • the module mounting surface 216 is characterized by a flat surface wherein the fluid-permeable channel 214 does not extend such that a seal can be established via a temporary substrate (e.g., dicing tape).
  • the optoelectronic module 200 can further includes a fluid-permeable channel 214 .
  • the fluid-permeable channel 214 can extend into the module mounting surface 216 as depicted in FIG. 2A and FIG. 2B .
  • FIG. 2B depicts a schematic side view of the optoelectronic module depicted in FIG. 2A .
  • the fluid-permeable channel 214 extends into the module mounting surface 216 .
  • the fluid-permeable channel 214 depicted in FIG. 2A and FIG. 2B can have an advantage in some implementations.
  • adhesive used to mount the optical component 210 to the optical component mounting surface 212 can partially obstruct part of the fluid-permeable channel 214 .
  • the fluid-permeable channel 214 extension into the module mounting surface 216 can permit outflow of fluids despite the partial incursion of adhesive into the fluid-permeable channel 214 .
  • FIG. 3A depicts a schematic top view of an example optoelectronic module 300 having a fluid permeable channel and an adhesive channel.
  • the optoelectronic module 300 can include an active optoelectronic component 302 mounted electrically to an active optoelectronic component substrate 304 (e.g., a printed circuit board PCB or a metallic component such as a lead frame).
  • an active optoelectronic component substrate 304 e.g., a printed circuit board PCB or a metallic component such as a lead frame.
  • the active optoelectronic component 302 can include light emitting (e.g., light-emitting diodes, laser diodes, and/or arrays of light-emitting diodes or laser diodes) and/or light detecting components (e.g., photodiodes, arrays of photodiodes, charge-couple device-based image sensors and/or complementary metal-oxide semiconductor-based image sensors).
  • light emitting e.g., light-emitting diodes, laser diodes, and/or arrays of light-emitting diodes or laser diodes
  • light detecting components e.g., photodiodes, arrays of photodiodes, charge-couple device-based image sensors and/or complementary metal-oxide semiconductor-based image sensors.
  • the optoelectronic module 300 can further include a spacer 306 .
  • the spacer 306 can laterally surround the active optoelectronic component 302 thereby forming a chamber 308 .
  • the spacer 306 can be formed around the active optoelectronic component substrate 304 .
  • a plurality of spacers 306 can be formed around a lead frame, the lead frame being a plurality of active optoelectronic component substrates 304 .
  • the spacer can be composed of a polymeric material such as an epoxy resin.
  • the spacer 306 can be operable to substantially attenuate wavelengths of electromagnetic radiation.
  • the spacer 306 can be substantially non-transparent to wavelengths of light emitted by and/or detectable by the active optoelectronic component 302 .
  • the spacer 306 can be formed from a moldable material.
  • the spacer 306 can be formed via injection molding and/or vacuum assisted molding in some implementations.
  • the spacer 306 can be formed from a molding resin.
  • the spacer 306 can further be composed of non-transparent organic and/or inorganic fillers such as carbon black.
  • the optoelectronic module 300 can further include an optical component 310 mounted to the spacer 306 via an optical component mounting surface 312 .
  • the optical component 310 can include a refractive lens, a diffractive lens, and/or an array of refractive and/or diffractive lenses.
  • the optical component 310 can include a spectral filter.
  • the optical component 310 can include a transparent cover.
  • the optical component 310 can be mounted to the optical component mounting surface 312 at an operable distance from the active optoelectronic component 302 .
  • the optoelectronic module 300 can further include a fluid-permeable channel 314 formed within the spacer 306 .
  • the fluid-permeable channel 314 is operable to permit the outflow of fluids from the chamber 308 .
  • the fluid-permeable channel 314 can be formed within the spacer 306 adjacent to the optical component 310 .
  • the optoelectronic module 300 further includes a module mounting surface 316 formed on the spacer 306 .
  • the module mounting surface 316 is configured to permit the optoelectronic module 300 to be temporarily sealed during manufacturing of the optoelectronic module 300 .
  • the module mounting surface 316 is characterized by a flat surface wherein the fluid-permeable channel 314 does not extend such that a seal can be established via a temporary substrate (e.g., dicing tape).
  • the optoelectronic module 300 further includes an adhesive channel 321 .
  • the adhesive channel 321 can be filled with adhesive 322 such that optical component 310 is mounted to the optical component mounting surface 312 via the adhesive 322 .
  • the adhesive channel 321 can lead to less tolerance in the mounting of the optical component 310 with respect to the active optoelectronic component 302 .
  • FIG. 3B depicts a schematic side view of the optoelectronic module depicted in FIG. 3A .
  • FIG. 3C depicts a magnified side view of the optoelectronic module depicted in FIG. 3A .
  • FIG. 3D depicts a magnified side view of the optoelectronic module depicted in FIG. 3A and an example location of adhesive 322 .
  • FIG. 4A depicts a schematic top view of an example optoelectronic module 400 having a fluid permeable channel, an adhesive channel, and an alignment component.
  • the optoelectronic module 400 can include an active optoelectronic component 402 mounted electrically to an active optoelectronic component substrate 404 (e.g., a printed circuit board PCB or a metallic component such as a lead frame).
  • an active optoelectronic component substrate 404 e.g., a printed circuit board PCB or a metallic component such as a lead frame.
  • the active optoelectronic component 402 can include light emitting (e.g., light-emitting diodes, laser diodes, and/or arrays of light-emitting diodes or laser diodes) and/or light detecting components (e.g., photodiodes, arrays of photodiodes, charge-couple device-based image sensors and/or complementary metal-oxide semiconductor-based image sensors).
  • light emitting e.g., light-emitting diodes, laser diodes, and/or arrays of light-emitting diodes or laser diodes
  • light detecting components e.g., photodiodes, arrays of photodiodes, charge-couple device-based image sensors and/or complementary metal-oxide semiconductor-based image sensors.
  • the optoelectronic module 400 can further include a spacer 406 .
  • the spacer 406 can laterally surround the active optoelectronic component 402 thereby forming a chamber 408 .
  • the spacer 406 can be formed around the active optoelectronic component substrate 404 .
  • a plurality of spacers 406 can be formed around a lead frame, the lead frame being a plurality of active optoelectronic component substrates 404 .
  • the spacer can be composed of a polymeric material such as an epoxy resin.
  • the spacer 406 can be operable to substantially attenuate wavelengths of electromagnetic radiation.
  • the spacer 406 can be substantially non-transparent to wavelengths of light emitted by and/or detectable by the active optoelectronic component 402 .
  • the spacer 406 can be formed from a moldable material.
  • the spacer 406 can be formed via injection molding and/or vacuum assisted molding in some implementations.
  • the spacer 406 can be formed from a molding resin.
  • the spacer 406 can further be composed of non-transparent organic and/or inorganic fillers such as carbon black.
  • the optoelectronic module 400 can further include an optical component 410 mounted to the spacer 406 via an optical component mounting surface 412 .
  • the optical component 410 can include a refractive lens, a diffractive lens, and/or an array of refractive and/or diffractive lenses.
  • the optical component 410 can include a spectral filter.
  • the optical component 410 can include a transparent cover.
  • the optical component 410 can be mounted to the optical component mounting surface 412 at an operable distance from the active optoelectronic component 402 .
  • the optoelectronic module 400 can further include an alignment component 413 and an adhesive channel 421 .
  • the alignment component 413 can be an extension of the spacer 406 , the alignment component 413 terminating in the optical component mounting surface 412 .
  • the adhesive channel 421 can be filled with adhesive 422 such that optical component 410 is mounted to the optical component mounting surface 412 via the adhesive 422 .
  • the adhesive channel 421 can lead to less tolerance in the mounting of the optical component 410 with respect to the active optoelectronic component 402 .
  • the alignment component 413 and the adhesive channel 421 can lead to less tolerance in the mounting of the optical component 410 with respect to the active optoelectronic components active optoelectronic component 402 .
  • the alignment component 413 can be adjusted (e.g., via mechanically machining, or via laser) so that the optical component 410 can be mounted with respect to the active optoelectronic component 402 . Accordingly, in some cases the alignment component 413 can be configured to correct for tilt. In some implementations, the optical component 410 is directly mounted to the optical component mounting surface 412 via the alignment component 413 .
  • FIG. 4B depicts a schematic side view of the optoelectronic module depicted in FIG. 4A .
  • FIG. 4C depicts a magnified side view of the optoelectronic module depicted in FIG. 4A .
  • FIG. 4D depicts a magnified side view of the optoelectronic module depicted in FIG. 4A and an example location of adhesive.
  • FIG. 5A depicts a schematic top view of another optoelectronic module 500 having a fluid permeable channel.
  • the optoelectronic module 500 can include an active optoelectronic component 502 mounted electrically to an active optoelectronic component substrate 504 (e.g., a printed circuit board PCB or a metallic component such as a lead frame).
  • an active optoelectronic component substrate 504 e.g., a printed circuit board PCB or a metallic component such as a lead frame.
  • the active optoelectronic component 502 can include light emitting (e.g., light-emitting diodes, laser diodes, and/or arrays of light-emitting diodes or laser diodes) and/or light detecting components (e.g., photodiodes, arrays of photodiodes, charge-couple device-based image sensors and/or complementary metal-oxide semiconductor-based image sensors).
  • light emitting e.g., light-emitting diodes, laser diodes, and/or arrays of light-emitting diodes or laser diodes
  • light detecting components e.g., photodiodes, arrays of photodiodes, charge-couple device-based image sensors and/or complementary metal-oxide semiconductor-based image sensors.
  • the optoelectronic module 500 can further include a spacer 506 .
  • the spacer 506 can laterally surround the active optoelectronic component 502 thereby forming a chamber 508 .
  • the spacer 506 can be formed around the active optoelectronic component substrate 504 .
  • a plurality of spacers 506 can be formed around a lead frame, the lead frame being a plurality of active optoelectronic component substrates 504 .
  • the spacer can be composed of a polymeric material such as an epoxy resin.
  • the spacer 506 can be operable to substantially attenuate wavelengths of electromagnetic radiation.
  • the spacer 506 can be substantially non-transparent to wavelengths of light emitted by and/or detectable by the active optoelectronic component 502 .
  • the spacer 506 can be formed from a moldable material.
  • the spacer 506 can be formed via injection molding and/or vacuum assisted molding in some implementations.
  • the spacer 506 can be formed from a molding resin.
  • the spacer 506 can further be composed of non-transparent organic and/or inorganic fillers such as carbon black.
  • the optoelectronic module 500 can further include an optical component 510 mounted to the spacer 506 via an optical component mounting surface 512 .
  • the optical component 510 can include a refractive lens, a diffractive lens, and/or an array of refractive and/or diffractive lenses.
  • the optical component 510 can include a spectral filter.
  • the optical component 510 can include a transparent cover.
  • the optical component 510 can be mounted to the optical component mounting surface 512 at an operable distance from the active optoelectronic component 502 .
  • the optoelectronic module 500 can further include a fluid-permeable channel 514 formed within the spacer 506 .
  • the fluid-permeable channel 514 includes a fluid-permeable membrane 528 (e.g., GORE-TEX®).
  • the fluid-permeable membrane 528 can be fixed on or in the fluid-permeable channel 514 .
  • the fluid-permeable channel 514 is operable to permit the outflow of fluids from the chamber 508 .
  • the fluid-permeable channel 514 can be formed within the active optoelectronic component substrates 504 adjacent to the active optoelectronic component 502 .
  • the optoelectronic module 500 can further include a module mounting surface 516 formed on the spacer 506 .
  • the module mounting surface 516 is configured to permit the optoelectronic module 500 to be temporarily sealed during manufacturing of the optoelectronic module 500 .
  • the module mounting surface 516 is characterized by a flat surface such that a seal can be established via a temporary substrate (e.g., dicing tape).
  • the optoelectronic module 500 need not include a module mounting surface 516 , the module can be mounted via the active optoelectronic mounting surface 512 .
  • FIG. 5B depicts a schematic side view of the optoelectronic module depicted in FIG. 5A .
  • FIG. 5C depicts a magnified side view of the optoelectronic module depicted in FIG. 5A .
  • FIG. 6A depicts a schematic top view of an optoelectronic module 600 having a fluid permeable channel and an adhesive channel.
  • the optoelectronic module 600 can include an active optoelectronic component 602 mounted electrically to an active optoelectronic component substrate 604 (e.g., a printed circuit board PCB or a metallic component such as a lead frame).
  • an active optoelectronic component substrate 604 e.g., a printed circuit board PCB or a metallic component such as a lead frame.
  • the active optoelectronic component 602 can include light emitting (e.g., light-emitting diodes, laser diodes, and/or arrays of light-emitting diodes or laser diodes) and/or light detecting components (e.g., photodiodes, arrays of photodiodes, charge-couple device-based image sensors and/or complementary metal-oxide semiconductor-based image sensors).
  • light emitting e.g., light-emitting diodes, laser diodes, and/or arrays of light-emitting diodes or laser diodes
  • light detecting components e.g., photodiodes, arrays of photodiodes, charge-couple device-based image sensors and/or complementary metal-oxide semiconductor-based image sensors.
  • the optoelectronic module 600 can further include a spacer 606 .
  • the spacer 606 can laterally surround the active optoelectronic component 602 thereby forming a chamber 608 .
  • the spacer 606 can be formed around the active optoelectronic component substrate 604 .
  • a plurality of spacers 606 can be formed around a lead frame, the lead frame being a plurality of active optoelectronic component substrates 604 .
  • the spacer can be composed of a polymeric material such as an epoxy resin.
  • the spacer 606 can be operable to substantially attenuate wavelengths of electromagnetic radiation.
  • the spacer 606 can be substantially non-transparent to wavelengths of light emitted by and/or detectable by the active optoelectronic component 602 .
  • the spacer 606 can be formed from a moldable material.
  • the spacer 606 can be formed via injection molding and/or vacuum assisted molding in some implementations.
  • the spacer 606 can be formed from a molding resin.
  • the spacer 606 can further be composed of non-transparent organic and/or inorganic fillers such as carbon black.
  • the optoelectronic module 600 can further include an optical component 610 mounted to the spacer 606 via an optical component mounting surface 612 .
  • the optical component 610 can include a refractive lens, a diffractive lens, and/or an array of refractive and/or diffractive lenses.
  • the optical component 610 can include a spectral filter.
  • the optical component 610 can include a transparent cover.
  • the optical component 610 can be mounted to the optical component mounting surface 612 at an operable distance from the active optoelectronic component 602 .
  • the optoelectronic module 600 can further include a fluid-permeable channel 614 formed within the spacer 606 .
  • the fluid-permeable channel 614 is operable to permit the outflow of fluids from the chamber 608 .
  • the fluid-permeable channel 614 can be formed within the spacer 606 adjacent to the optical component 610 .
  • the optoelectronic module 600 further includes a module mounting surface 616 formed on the spacer 606 .
  • the module mounting surface 616 is configured to permit the optoelectronic module 600 to be temporarily sealed during manufacturing of the optoelectronic module 600 .
  • the module mounting surface 616 is characterized by a flat surface wherein the fluid-permeable channel 614 does not extend such that a seal can be established via a temporary substrate (e.g., dicing tape).
  • the optoelectronic module 600 further includes an adhesive channel 621 and an alignment component 613 formed within the optical component 610 .
  • the alignment component 613 and the adhesive channel 621 can lead to less tolerance in the mounting of the optical component 610 with respect to the active optoelectronic component 602 .
  • the alignment component 613 can be adjusted (e.g., via mechanically machining, or via laser) so that the optical component 610 can be mounted with respect to the active optoelectronic component 602 .
  • FIG. 6B depicts a schematic side view of the optoelectronic module depicted in FIG. 6A
  • FIG. 6C depicts a magnified side view of the optoelectronic module depicted in FIG. 6A
  • FIG. 6D depicts a magnified side view of the optoelectronic module depicted in FIG. 6A and an example location of adhesive.
  • FIG. 7 depicts a process 700 of manufacturing an optoelectronic module from a plurality of optoelectronic modules.
  • the process 700 of manufacturing an optoelectronic module from a plurality of optoelectronic modules includes an electrically mounting step 702 wherein a plurality of active optoelectronic components is mounted electrically to a plurality of active optoelectronic component substrates.
  • the active optoelectronic component substrates can be laterally surrounded by a plurality of spacers.
  • the spacers can form a plurality of respective chambers, and can further include a plurality of respective optical component mounting surfaces.
  • the spacer can further include a plurality of respective fluid permeable channels, and a plurality of respective module mounting surfaces.
  • the process 700 of manufacturing an optoelectronic module from a plurality of optoelectronic modules can further include an adhesive application step 704 wherein an adhesive is applied to the plurality of optical component mounting surfaces.
  • the process 700 of manufacturing an optoelectronic module from a plurality of optoelectronic modules can further include an optical component mounting step 706 wherein a plurality of optical components is mounted to a plurality of respective optical component mounting surfaces.
  • the process 700 of manufacturing an optoelectronic module from a plurality of optoelectronic modules can further include an adhesive curing step 708 wherein adhesive is cured (e.g., via the application of heat and/or electromagnetic radiation such as ultraviolet light).
  • the process 700 of manufacturing an optoelectronic module from a plurality of optoelectronic modules can further include an optoelectronic module mounting step 710 wherein a plurality of optoelectronic modules is mounted to an adhesive substrate (e.g., a dicing tape) via a plurality of module mounting surfaces.
  • an adhesive substrate e.g., a dicing tape
  • the process 700 of manufacturing an optoelectronic module from a plurality of optoelectronic modules can further include a module separation step 712 wherein the plurality of optoelectronic modules is separated into discrete optoelectronic modules (e.g., via dicing).
  • FIG. 8 depicts a process 800 of manufacturing an optoelectronic module from a plurality of optoelectronic modules.
  • the process 800 of manufacturing an optoelectronic module from a plurality of optoelectronic modules 800 includes an electrically mounting step 802 wherein a plurality of active optoelectronic components is mounted electrically to a plurality of active optoelectronic component substrates.
  • the active optoelectronic component substrates can be laterally surrounded by a plurality of spacers.
  • the spacers can form a plurality of respective chambers, and can further include a plurality of respective optical component mounting surfaces.
  • the spacer can further include a plurality of respective fluid permeable channels, and a plurality of respective module mounting surfaces.
  • the process 800 of manufacturing an optoelectronic module from a plurality of optoelectronic modules can further include an adhesive application step 804 wherein an adhesive is applied to the plurality of optical component mounting surfaces, and an optical component mounting step 806 wherein a plurality of optical components is mounted to a plurality of respective optical component mounting surfaces.
  • the process 800 of manufacturing an optoelectronic module from a plurality of optoelectronic modules can further include an adhesive curing step 808 wherein adhesive is cured (e.g., via the application of heat and/or electromagnetic radiation such as ultraviolet light).
  • the process 800 of manufacturing an optoelectronic module from a plurality of optoelectronic modules can further include an optoelectronic module mounting step 810 wherein a plurality of optoelectronic modules is mounted to an adhesive substrate (e.g., a dicing tape) via a plurality of module mounting surfaces.
  • an adhesive substrate e.g., a dicing tape
  • the process 800 of manufacturing an optoelectronic module from a plurality of optoelectronic modules can further include a module separation step 812 wherein the plurality of optoelectronic modules is separated into discrete optoelectronic modules (e.g., via dicing).
  • the process 800 of manufacturing an optoelectronic module from a plurality of optoelectronic modules can further include a host device mounting step 814 wherein a discrete optoelectronic module is mounted onto a circuit board (e.g., to be mounted into a host device), a heat treatment step 816 wherein the optoelectronic module is subject to a heat treatment followed by cooling in order to electrically connect the optoelectronic module to the circuit board (e.g., via the melting and cooling of solder and solder flux).
  • a host device mounting step 814 wherein a discrete optoelectronic module is mounted onto a circuit board (e.g., to be mounted into a host device)
  • a heat treatment step 816 wherein the optoelectronic module is subject to a heat treatment followed by cooling in order to electrically connect the optoelectronic module to the circuit board (e.g., via the melting and cooling of solder and solder flux).

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  • Condensed Matter Physics & Semiconductors (AREA)
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TW201729367A (zh) 2017-08-16
TWI713173B (zh) 2020-12-11
EP3405983A4 (fr) 2018-11-28
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EP3405983B1 (fr) 2021-03-10
EP3405983A1 (fr) 2018-11-28

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