US20190120895A1 - Socket - Google Patents
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- Publication number
- US20190120895A1 US20190120895A1 US16/120,611 US201816120611A US2019120895A1 US 20190120895 A1 US20190120895 A1 US 20190120895A1 US 201816120611 A US201816120611 A US 201816120611A US 2019120895 A1 US2019120895 A1 US 2019120895A1
- Authority
- US
- United States
- Prior art keywords
- main body
- socket
- holding member
- connection terminals
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/639—Additional means for holding or locking coupling parts together, after engagement, e.g. separate keylock, retainer strap
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/97—Holders with separate means to prevent loosening of the coupling or unauthorised removal of apparatus held
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
- H01L2225/1023—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
- H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
Definitions
- a socket is used when inspecting a PCBA (Printed Circuit Board Assembly) mounted with electronic components, and this socket has inspection probes that make electrical connections to the PCBA.
- PCBA Print Circuit Board Assembly
- this socket has inspection probes that make electrical connections to the PCBA.
- the special structure for enabling inspection may be an inspection pattern that is provided on the lower surface of the PCBA and contactable by the probes upon inspection, or an inspection pattern that is provided in an extended region of the PCBA extended in a horizontal direction of the PCBA and contactable by the probes upon inspection.
- the special structure for enabling inspection increases a size of the PCBA, increases a cost of the PCBA, or increases both the size and the cost of the PCBA.
- a socket includes a main body including one of a cavity and an opening configured to accommodate a printed circuit board assembly that is to be inspected, wherein the printed circuit board assembly includes a substrate mounted with an electronic component, and a plurality of connection terminals protruding from a surface of the substrate and respectively having a side surface exposed at an outer peripheral surface of the substrate, and wherein the plurality of connection terminals are positioned within the one of the cavity and the opening in a state in which the printed circuit board assembly is accommodated in the one of the cavity and the opening; plurality of probes respectively including a fixed part that is fixed to the main body, and a movable part that is movable with respect to the fixed part; and a pressing part configured to press against the movable part, wherein the movable part includes a tip end part that moves to a position contactable to the side surface of one of the plurality of connection terminals within the one of the cavity and the opening, when the pressing part presses against the movable part.
- FIG. 1A and FIG. 1B are diagrams illustrating an example of a PCBA to be inspected
- FIG. 2 is a cross sectional view illustrating an example of a socket in a first embodiment
- FIG. 3A and FIG. 3B are plan views illustrating an example of a main body of the socket in the first embodiment
- FIG. 4A and FIG. 4B are plan views illustrating an example of a holding member of the socket in the first embodiment
- FIG. 5A and FIG. 5B are diagrams illustrating an example of a state in which the PCBA is accommodated in the socket in the first embodiment
- FIG. 6A and FIG. 6B are diagrams for explaining a probe of the socket in the first embodiment.
- FIG. 7A and FIG. 7B are diagrams illustrating an example of a state in which the PCBA is accommodated in the socket in a second embodiment.
- FIG. 1A and FIG. 1B are diagrams illustrating an example of the PCBA to be inspected.
- FIG. 1A is a plan view of the PCBA
- FIG. 1B is a cross sectional view of the PCBA along a line A-A in FIG. 1A .
- a PCBA 100 has a structure in which a substrate 110 and a substrate 130 are stacked via connection terminals 120 that electrically connect the substrate 110 and the substrate 130 .
- An electronic component 140 is mounted on a lower surface of the substrate 110
- an electronic component 150 is mounted on an upper surface of the substrate 110 .
- An electronic component 160 is mounted on an upper surface of the substrate 130 .
- an electronic component (not illustrated) may be mounted on a lower surface of the substrate 130 .
- Each of the substrates 110 and 130 is a so-called glass epoxy substrate made of a resin-impregnated glass cloth that is impregnated with an insulator resin, such as an epoxy resin or the like, for example.
- Each of the substrates 110 and 130 may be a build-up substrate, a silicon substrate, a ceramic substrate, or the like.
- the electronic components 140 , 150 , and 160 may be semiconductor devices, resistors, capacitors, or the like, for example.
- connection terminals 120 have functions to electrically connect the substrate 110 and the substrate 130 , and to secure a predetermined gap (or distance) between the substrate 110 and the substrate 130 .
- the connection terminals 120 are arranged in peripheral parts of the substrates 110 and 130 , for example. Conductive side surfaces of the connection terminals 120 are exposed at outer peripheral sides of the substrates 110 and 130 , and are contactable by probes from sides of the PCBA 100 .
- Each connection terminal 120 may be a solder ball with a core (for example, a copper core ball or the like), for example.
- Each connection terminal 120 may be a solder ball without a core.
- each connection terminal 120 may be a metal post (for example, a copper post or the like).
- the PCBA 100 has a so-called POP (Package-On-Package) structure.
- the inspection target to be inspected is not limited to the PCBA having the so-called POP structure.
- the inspection target to be inspected may be a PCBA at least including connection terminals protruding from substrates mounted with electronic parts, such that side surfaces of the connection terminals are exposed at outer peripheral sides of the substrates.
- the inspection target to be inspected such as the PCBA having the so-called POP structure, and the PCBA at least including the connection terminals protruding from the substrates as described above, may be inspected by the socket 10 which will be described later.
- FIG. 2 is a cross sectional view illustrating an example of the socket in a first embodiment.
- the socket 10 includes a main body 20 , a holding member 30 , and a lid part 40 , as constituent elements thereof.
- FIG. 3A and FIG. 3B are plan views illustrating an example of the main body of the socket in the first embodiment.
- FIG. 3A illustrates the main body 20 in an initial state in which probes 21 are not extended
- FIG. 3B illustrates the main body 20 in a state in which the probes 21 are extended.
- a position where the PCBA 100 is arranged is illustrated for the sake of convenience, however, the PCBA 100 is not a constituent element of the main body 20 .
- FIG. 4A and FIG. 4B are plan views illustrating an example of the holding member of the socket in the first embodiment.
- FIG. 4A illustrates an initial state in which the holding member 30 does not hold the PCBA 100
- FIG. 4B illustrates a state in which the holding member 30 holds the PCBA 100 .
- FIG. 5A and FIG. 5B are diagrams illustrating an example of a state in which the PCBA is accommodated in the socket in the first embodiment.
- FIG. 5A illustrates a state before the lid part 40 is arranged on the main body 20
- FIG. 5B illustrates a state after the lid part 40 is arranged on the main body 20 .
- the PCBA 100 is accommodated between the main body 20 and the lid part 40 , in a state in which the PCBA 100 is held by the holding member 30 .
- the main body 20 accommodates the PCBA 100 within an opening 20 x so that at least the connection terminals 120 are positioned within the opening 20 x .
- the opening 20 x is an example of an accommodating part of the main body 20 accommodating the PCBA 100 .
- the main body 20 is fixed to an inspection board 500 by screws. Pads 510 , and wirings 520 electrically connected to the pads 51 , are provided on the inspection board 500 .
- an inspection circuit (not illustrated) or the like, that inspects the PCBA 100 and outputs a judgment result related to the inspection, is electrically connected to the wirings 520 .
- the main body 20 , the holding member 30 , and the lid part 40 may be made of an insulator resin, such as an epoxy resin or the like, for example.
- the main body 20 , the holding member 30 , and the lid part 40 may be made of a metal, for example, and an insulator layer may be provided at required parts on the metal surface.
- the main body 20 is a tubular member having the opening 20 x at a central part thereof.
- the main body 20 includes probes 21 respectively having a movable part that moves in a horizontal direction to a position contactable to (that is, a position capable of making contact to) the side surface of the connection terminal 120 of the PCBA 100 .
- the number of probes 21 that are provided is equal to the number of connection terminals 120 to which the probes 21 are required to make contact when inspecting the PCBA 100 .
- the main body 20 may be a box-shaped member having a cavity (or recess) in place of the opening 20 x.
- the probe 21 may have an L-shape formed by a vertical part 22 that is fixed to the main body 20 , and a horizontal part 23 having a first part that is fixed to the main body 20 and a second part that is movable toward the PCBA 100 .
- a tip end part 222 of the vertical part 22 of each of the probes 21 has a columnar shape (or cylindrical shape), for example, and projects from a lower surface 20 b of the main body 20 .
- the tip end part 222 is electrically connectable to an electrode pad of the inspection board 500 that is arranged below the main body 20 .
- a tip end part 244 of the horizontal part 23 of each of the probes 21 has a columnar shape (or cylindrical shape), for example, and is exposed within the opening 20 x so as to oppose the side surface of one of the connection terminals 120 of the PCBA 100 .
- a stepped part 20 c that is one step lower than an upper surface 20 a of the main body 20 , is provided in the upper surface 20 a at the opening 20 x .
- the stepped part 20 c positions the holding member 30 with respect to the main body 20 when the holding member 30 is arranged on the main body 20 .
- the stepped part 20 c includes openings 20 y .
- the opening 20 y exposes an upper surface of the probe 21 , and the opening 20 y is provided for each of the probes 21 .
- the holding member 30 holds the PCBA 100 , and the holding member 30 is positioned with respect to the main body 20 .
- the holding member 30 includes two L-shaped members 31 and 32 .
- the L-shaped members 31 and 32 are configured to move back and forth in directions of arrows W and N in FIG. 4A .
- inner edge parts of the L-shaped members 31 and 32 contact outer edge parts of the lower surface of the substrate 130 , to hold the PCBA 100 on the holding member 30 .
- the L-shaped members 31 and 32 When holding the PCBA 100 on the holding member 30 , the L-shaped members 31 and 32 are moved in the directions of the arrows W to separate from each other, and the L-shaped members 31 and 32 are thereafter moved in the directions of the arrows N to close upon each other so as to sandwich the PCBA 100 from both sides.
- Each of the L-shaped members 31 and 32 includes openings 30 y .
- the openings 30 y are arranged at positions overlapping the openings 20 y of the main body 20 when the holding member 30 is arranged on the stepped part 20 c of the main body 20 .
- the lid part 40 is a tubular member having an opening 40 x at a central part thereof.
- the lid part 40 is arranged on the main body 20 to fix the PCBA 100 on the main body 20 .
- a plurality of pressing parts 41 project from a lower surface 40 b of the lid part 40 , in a direction toward the main body 20 .
- the lid part 40 may be a box-shaped member having a cavity (or recess) in place of the opening 40 x.
- the pressing parts 41 of the lid part 40 enter the respective openings 30 y and the respective openings 20 y .
- the tip end part 244 of each probe 21 moves toward the PCBA 100 , and contacts the side surface of the connection terminal 120 that is arranged at the corresponding position.
- the connection terminals 120 of the PCBA 100 electrically connect to the electrode pads of the inspection board 500 that is arranged below the main body 20 .
- the lid part 40 may be provided with a lock mechanism (not illustrated). This lock mechanism is locked to lock the lid part 40 onto the main body 20 in a state in which the PCBA 100 is accommodated between the main body 20 and the lid part 40 . This lock mechanism is unlocked to permit removal of the lid part 40 from the main body 20 , so that the PCBA 100 can be removed outside the socket 10 .
- FIG. 6A and FIG. 6B are diagrams for explaining the probe of the socket in the first embodiment.
- FIG. 6A illustrates a state in which the tip end part of the probe does not contact a target to be contacted
- FIG. 6B illustrates a state in which the tip end part of the probe contacts the target to be contacted.
- the vertical part 22 of the probe 21 includes a columnar part 221 and a tip end part 222 .
- the columnar part 221 has a cylindrical shape, for example, and is an example of a fixed part (of the vertical part 22 ) that is fixed to the main body 20 .
- the tip end part 222 is an example of a movable part (of the vertical part 22 ) that is movable with respect to the fixed part.
- One end of the tip end part 222 enters inside the columnar part 221 from a lower end of the columnar part 221 , and a coil spring 224 is arranged between the one end of the tip end part 222 and one end of the columnar part 221 .
- the other end of the tip end part 222 projects from the lower end of the columnar part 221 .
- the coil spring 224 is compressed and the tip end part 222 is urged toward the inspection board 500 .
- the other end of the tip end part 222 contacts a pad 510 provided on the inspection board 500 and is electrically connected to the pad 510 .
- the horizontal part 23 of the probe 21 includes a tubular part 231 and a movable part 232 .
- the tubular part 231 has a hollow cylindrical shape, for example, and is an example of a fixed part (of the horizontal part 23 ) that is fixed to the main body 20 .
- the movable part 232 is an example of a movable part (of the horizontal part 23 ) that is movable with respect to the fixed part (of the horizontal part 23 ).
- the movable part 232 includes a tapered part 241 , a tubular part 242 , a tubular part 243 , the tip end part 244 , and a coil spring 245 .
- the tapered part 241 has a diameter that increases from the tubular part 231 toward the opening 20 x (that is, toward the PCBA 100 ).
- the tubular part 242 has a hollow cylindrical shape, for example, and is connected to a small-diameter part of the tapered part 241 .
- the tubular part 243 has a hollow cylindrical shape, for example, and is connected to a large-diameter part of the tapered part 241 .
- One end of the tip end part 244 enters inside the tubular part 243 from an inner side (that is, the side of the opening 20 x ) along the horizontal direction of the tubular part 243 .
- the coil spring 245 is arranged between the one end of the tip end part 244 and the large-diameter part of the tapered part 241 .
- One end of the tubular part 242 enters inside the tubular part 231 from an inner side (that is, the side of the opening 20 x ) along the horizontal direction of the tubular part 231 .
- a coil spring 234 is arranged between the one end of the tubular part 242 and the other end of the columnar part 221 .
- the coil springs 224 , 234 , and 245 are examples of an urging means (or urging member).
- the urging means (or urging member) is not limited to the coil spring, and may include a leaf spring, a rubber member, or the like.
- a sloping part of the pressing part 41 presses the tapered part 241 in a direction of an arrow A, as illustrated in FIG. 6B .
- the compressed coil spring 234 expands, to move the movable part 232 in a direction of an arrow B (that is, in the direction toward the opening 20 x ).
- the other end of the tip end part 244 of the movable part 232 contacts the side surface of the connection terminal 120 within the opening 20 x.
- the coil spring 245 is compressed in the state in which the other end of the tip end part 244 contacts the side surface of the connection terminal 120 . Accordingly, the tip end part 244 is urged toward the connection terminal 120 , and the other end of the tip end part 244 contacts the connection terminal 120 and is electrically connected to the connection terminal 120 . By compressing the coil spring 245 , it is possible to prevent damage to the side surface of the connection terminal 120 .
- the probe 21 of the socket 10 may have any structure capable of moving the movable part 232 back and forth in the horizontal direction, parallel to the upper surface of the substrate 110 from which the connection terminals 120 protrude or parallel to the lower surface of the substrate 130 from which the connection terminals 120 protrude, according to a pressing force. Further, the probe 21 of the socket 10 is not limited to the structure in which the sloping part of the pressing part 41 presses against the tapered part 241 .
- the socket 10 is provided with the probe 21 having the movable part 232 that can move back and forth in the horizontal direction according to the pressing force of the pressing part 41 .
- the probes 21 can contact the side surfaces of the connection terminals 120 .
- the special structure for enabling inspection may be an inspection pattern that is provided on the lower surface of the PCBA and contactable by the probes upon inspection, or an inspection pattern that is provided in an extended region of the PCBA extended in a horizontal direction of the PCBA and contactable by the probes upon inspection.
- the special structure for enabling inspection is undesirable in that the special structure increases a size of the PCBA, increases a cost of the PCBA, or increases both the size and the cost of the PCBA.
- the increase in the cost of the PCBA may be caused by a need to cut and remove the extended region of the PCBA after the inspection of the PCBA.
- no holding member is provided.
- those parts that are the same as those corresponding parts of the first embodiment are designated by the same reference numerals, and a description thereof may be omitted.
- FIG. 7A and FIG. 7B are diagrams illustrating an example of a state in which the PCBA is accommodated in the socket in the second embodiment.
- FIG. 7A illustrates a state before a lid part 40 A is arranged on a main body 20 A
- FIG. 7B illustrates a state after the lid part 40 A is arranged on the main body 20 A.
- a socket 10 A in this second embodiment differs from the socket 10 in the first embodiment described above in conjunction with FIG. 2 , for example, in that the main body 20 having the opening 20 x is replaced by the main body 20 A having a cavity 20 z , no holding member 30 is provided, and the lid part 40 having the opening 40 x is replaced by the lid part 40 A having a cavity 40 z .
- the PCBA 100 is held directly inside the cavity 20 z of the main body 20 A, without providing the holding member 30 .
- no stepped part 20 c is provided in the main body 20 A for receiving the holding member 30 .
- the cavity 20 z is an example of the accommodating part of the main body 20 A accommodating the PCBA 100 .
- the holding member 30 it is unnecessary to use the holding member 30 .
- the holding member 30 it is advantageous in that the PCBA 100 can be held stably without being dependent on the structure at the lower surface of the PCBA 100 .
- the lid part 40 A does not need to have an opening and may have the cavity 40 z instead, for example.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
- This application is based upon and claims the benefit of priority of the prior Japanese Patent Application No. 2017-204693, filed on Oct. 23, 2017, the entire contents of which are incorporated herein by reference.
- Certain aspects of the embodiments discussed herein are related to a socket.
- A socket is used when inspecting a PCBA (Printed Circuit Board Assembly) mounted with electronic components, and this socket has inspection probes that make electrical connections to the PCBA. For example, it is possible to use a socket that is capable of contacting the probes to connection terminals provided on a lower surface of the PCBA, from under the lower surface of the PCBA, as proposed in Japanese Laid-Open Patent Publication No. 2011-123015, for example.
- However, in a case in which the PCBA has a structure such that the probes cannot contact the connection terminals provided on the lower surface of the PCBA, from under the lower surface of the PCBA, a special structure for enabling inspection needs to be provided on the PCBA. For example, the special structure for enabling inspection may be an inspection pattern that is provided on the lower surface of the PCBA and contactable by the probes upon inspection, or an inspection pattern that is provided in an extended region of the PCBA extended in a horizontal direction of the PCBA and contactable by the probes upon inspection. But the special structure for enabling inspection increases a size of the PCBA, increases a cost of the PCBA, or increases both the size and the cost of the PCBA.
- Accordingly, it is an object in one aspect of the embodiments to provide a socket that enables inspection of a PCBA without providing a special structure for enabling inspection, even in a case in which the PCBA has a structure such that probes cannot contact connection terminals provided on a lower surface of the PCBA, from under the lower surface of the PCBA.
- According to one aspect of the embodiments, a socket includes a main body including one of a cavity and an opening configured to accommodate a printed circuit board assembly that is to be inspected, wherein the printed circuit board assembly includes a substrate mounted with an electronic component, and a plurality of connection terminals protruding from a surface of the substrate and respectively having a side surface exposed at an outer peripheral surface of the substrate, and wherein the plurality of connection terminals are positioned within the one of the cavity and the opening in a state in which the printed circuit board assembly is accommodated in the one of the cavity and the opening; plurality of probes respectively including a fixed part that is fixed to the main body, and a movable part that is movable with respect to the fixed part; and a pressing part configured to press against the movable part, wherein the movable part includes a tip end part that moves to a position contactable to the side surface of one of the plurality of connection terminals within the one of the cavity and the opening, when the pressing part presses against the movable part.
- The object and advantages of the embodiments will be realized and attained by means of the elements and combinations particularly pointed out in the claims.
- It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and not restrictive of the invention, as claimed.
-
FIG. 1A andFIG. 1B are diagrams illustrating an example of a PCBA to be inspected; -
FIG. 2 is a cross sectional view illustrating an example of a socket in a first embodiment; -
FIG. 3A andFIG. 3B are plan views illustrating an example of a main body of the socket in the first embodiment; -
FIG. 4A andFIG. 4B are plan views illustrating an example of a holding member of the socket in the first embodiment; -
FIG. 5A andFIG. 5B are diagrams illustrating an example of a state in which the PCBA is accommodated in the socket in the first embodiment; -
FIG. 6A andFIG. 6B are diagrams for explaining a probe of the socket in the first embodiment; and -
FIG. 7A andFIG. 7B are diagrams illustrating an example of a state in which the PCBA is accommodated in the socket in a second embodiment. - Preferred embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings, those parts that are the same are designated by the same reference numerals, and a repeated description of the same parts may be omitted.
- A description will now be given of the socket in each embodiment according to the present invention.
- [Inspection Target]
- First, a description will be given of a PCBA (Printed Circuit Board Assembly) that is mounted with electronic components, and is an inspection target to be inspected by a
socket 10 which will be described later.FIG. 1A andFIG. 1B are diagrams illustrating an example of the PCBA to be inspected.FIG. 1A is a plan view of the PCBA, andFIG. 1B is a cross sectional view of the PCBA along a line A-A inFIG. 1A . - As illustrated in
FIG. 1A andFIG. 1B , aPCBA 100 has a structure in which asubstrate 110 and asubstrate 130 are stacked viaconnection terminals 120 that electrically connect thesubstrate 110 and thesubstrate 130. Anelectronic component 140 is mounted on a lower surface of thesubstrate 110, and anelectronic component 150 is mounted on an upper surface of thesubstrate 110. Anelectronic component 160 is mounted on an upper surface of thesubstrate 130. In addition, an electronic component (not illustrated) may be mounted on a lower surface of thesubstrate 130. - Each of the
substrates substrates electronic components - The
connection terminals 120 have functions to electrically connect thesubstrate 110 and thesubstrate 130, and to secure a predetermined gap (or distance) between thesubstrate 110 and thesubstrate 130. In the plan view illustrated inFIG. 1A , theconnection terminals 120 are arranged in peripheral parts of thesubstrates connection terminals 120 are exposed at outer peripheral sides of thesubstrates connection terminal 120 may be a solder ball with a core (for example, a copper core ball or the like), for example. Eachconnection terminal 120 may be a solder ball without a core. In addition, eachconnection terminal 120 may be a metal post (for example, a copper post or the like). - In the example illustrated in
FIG. 1A andFIG. 1B , thePCBA 100 has a so-called POP (Package-On-Package) structure. However, the inspection target to be inspected is not limited to the PCBA having the so-called POP structure. The inspection target to be inspected may be a PCBA at least including connection terminals protruding from substrates mounted with electronic parts, such that side surfaces of the connection terminals are exposed at outer peripheral sides of the substrates. The inspection target to be inspected, such as the PCBA having the so-called POP structure, and the PCBA at least including the connection terminals protruding from the substrates as described above, may be inspected by thesocket 10 which will be described later. - [Socket]
- Next, the socket used to inspect the PCBA will be described.
FIG. 2 is a cross sectional view illustrating an example of the socket in a first embodiment. As illustrated inFIG. 2 , thesocket 10 includes amain body 20, a holdingmember 30, and alid part 40, as constituent elements thereof. - Next, each of the constituent elements of the
socket 10 will be described, by referring toFIG. 3A throughFIG. 5B .FIG. 3A andFIG. 3B are plan views illustrating an example of the main body of the socket in the first embodiment.FIG. 3A illustrates themain body 20 in an initial state in which probes 21 are not extended, andFIG. 3B illustrates themain body 20 in a state in which theprobes 21 are extended. InFIG. 3A andFIG. 3B , a position where thePCBA 100 is arranged is illustrated for the sake of convenience, however, thePCBA 100 is not a constituent element of themain body 20. -
FIG. 4A andFIG. 4B are plan views illustrating an example of the holding member of the socket in the first embodiment.FIG. 4A illustrates an initial state in which the holdingmember 30 does not hold thePCBA 100, andFIG. 4B illustrates a state in which the holdingmember 30 holds thePCBA 100.FIG. 5A andFIG. 5B are diagrams illustrating an example of a state in which the PCBA is accommodated in the socket in the first embodiment.FIG. 5A illustrates a state before thelid part 40 is arranged on themain body 20, andFIG. 5B illustrates a state after thelid part 40 is arranged on themain body 20. - As illustrated in
FIG. 5A andFIG. 5B , thePCBA 100 is accommodated between themain body 20 and thelid part 40, in a state in which thePCBA 100 is held by the holdingmember 30. Themain body 20 accommodates thePCBA 100 within anopening 20 x so that at least theconnection terminals 120 are positioned within theopening 20 x. Theopening 20 x is an example of an accommodating part of themain body 20 accommodating thePCBA 100. InFIG. 5A andFIG. 5B , themain body 20 is fixed to aninspection board 500 by screws.Pads 510, and wirings 520 electrically connected to the pads 51, are provided on theinspection board 500. In addition, an inspection circuit (not illustrated) or the like, that inspects thePCBA 100 and outputs a judgment result related to the inspection, is electrically connected to thewirings 520. - The
main body 20, the holdingmember 30, and thelid part 40 may be made of an insulator resin, such as an epoxy resin or the like, for example. Themain body 20, the holdingmember 30, and thelid part 40 may be made of a metal, for example, and an insulator layer may be provided at required parts on the metal surface. - As illustrated in
FIG. 2 ,FIG. 3A , andFIG. 3B , themain body 20 is a tubular member having the opening 20 x at a central part thereof. Themain body 20 includesprobes 21 respectively having a movable part that moves in a horizontal direction to a position contactable to (that is, a position capable of making contact to) the side surface of theconnection terminal 120 of thePCBA 100. The number ofprobes 21 that are provided is equal to the number ofconnection terminals 120 to which theprobes 21 are required to make contact when inspecting thePCBA 100. Themain body 20 may be a box-shaped member having a cavity (or recess) in place of theopening 20 x. - The
probe 21 may have an L-shape formed by avertical part 22 that is fixed to themain body 20, and ahorizontal part 23 having a first part that is fixed to themain body 20 and a second part that is movable toward thePCBA 100. Atip end part 222 of thevertical part 22 of each of theprobes 21 has a columnar shape (or cylindrical shape), for example, and projects from alower surface 20 b of themain body 20. Thetip end part 222 is electrically connectable to an electrode pad of theinspection board 500 that is arranged below themain body 20. Atip end part 244 of thehorizontal part 23 of each of theprobes 21 has a columnar shape (or cylindrical shape), for example, and is exposed within theopening 20 x so as to oppose the side surface of one of theconnection terminals 120 of thePCBA 100. - A stepped
part 20 c, that is one step lower than anupper surface 20 a of themain body 20, is provided in theupper surface 20 a at theopening 20 x. The steppedpart 20 c positions the holdingmember 30 with respect to themain body 20 when the holdingmember 30 is arranged on themain body 20. The steppedpart 20 c includesopenings 20 y. Theopening 20 y exposes an upper surface of theprobe 21, and theopening 20 y is provided for each of theprobes 21. - As illustrated in
FIG. 2 ,FIG. 4A , andFIG. 4B , the holdingmember 30 holds thePCBA 100, and the holdingmember 30 is positioned with respect to themain body 20. In addition, the holdingmember 30 includes two L-shapedmembers members FIG. 4A . As illustrated inFIG. 4B ,FIG. 5A , andFIG. 5B , inner edge parts of the L-shapedmembers substrate 130, to hold thePCBA 100 on the holdingmember 30. - When holding the
PCBA 100 on the holdingmember 30, the L-shapedmembers members PCBA 100 from both sides. - Each of the L-shaped
members openings 30 y. Theopenings 30 y are arranged at positions overlapping theopenings 20 y of themain body 20 when the holdingmember 30 is arranged on the steppedpart 20 c of themain body 20. - The
lid part 40 is a tubular member having anopening 40 x at a central part thereof. When performing measurements on thePCBA 100 that is held by the holdingmember 30, thelid part 40 is arranged on themain body 20 to fix thePCBA 100 on themain body 20. A plurality ofpressing parts 41 project from alower surface 40 b of thelid part 40, in a direction toward themain body 20. Thelid part 40 may be a box-shaped member having a cavity (or recess) in place of theopening 40 x. - When the
lid part 40 is arranged on themain body 20, thepressing parts 41 of thelid part 40 enter therespective openings 30 y and therespective openings 20 y. Hence, as illustrated inFIG. 3B andFIG. 5B , thetip end part 244 of eachprobe 21 moves toward thePCBA 100, and contacts the side surface of theconnection terminal 120 that is arranged at the corresponding position. As a result, theconnection terminals 120 of thePCBA 100 electrically connect to the electrode pads of theinspection board 500 that is arranged below themain body 20. - The
lid part 40 may be provided with a lock mechanism (not illustrated). This lock mechanism is locked to lock thelid part 40 onto themain body 20 in a state in which thePCBA 100 is accommodated between themain body 20 and thelid part 40. This lock mechanism is unlocked to permit removal of thelid part 40 from themain body 20, so that thePCBA 100 can be removed outside thesocket 10. - Next, the
probe 21 will be described in more detail, by referring toFIG. 6A andFIG. 6B .FIG. 6A andFIG. 6B are diagrams for explaining the probe of the socket in the first embodiment.FIG. 6A illustrates a state in which the tip end part of the probe does not contact a target to be contacted, andFIG. 6B illustrates a state in which the tip end part of the probe contacts the target to be contacted. - As illustrated in
FIG. 6A andFIG. 6B , thevertical part 22 of theprobe 21 includes acolumnar part 221 and atip end part 222. Thecolumnar part 221 has a cylindrical shape, for example, and is an example of a fixed part (of the vertical part 22) that is fixed to themain body 20. Thetip end part 222 is an example of a movable part (of the vertical part 22) that is movable with respect to the fixed part. One end of thetip end part 222 enters inside thecolumnar part 221 from a lower end of thecolumnar part 221, and acoil spring 224 is arranged between the one end of thetip end part 222 and one end of thecolumnar part 221. The other end of thetip end part 222 projects from the lower end of thecolumnar part 221. When themain body 20 is arranged on theinspection board 500, thecoil spring 224 is compressed and thetip end part 222 is urged toward theinspection board 500. Hence, as illustrated inFIG. 6B , the other end of thetip end part 222 contacts apad 510 provided on theinspection board 500 and is electrically connected to thepad 510. - The
horizontal part 23 of theprobe 21 includes atubular part 231 and amovable part 232. Thetubular part 231 has a hollow cylindrical shape, for example, and is an example of a fixed part (of the horizontal part 23) that is fixed to themain body 20. Themovable part 232 is an example of a movable part (of the horizontal part 23) that is movable with respect to the fixed part (of the horizontal part 23). Themovable part 232 includes atapered part 241, atubular part 242, atubular part 243, thetip end part 244, and acoil spring 245. Thetapered part 241 has a diameter that increases from thetubular part 231 toward theopening 20 x (that is, toward the PCBA 100). Thetubular part 242 has a hollow cylindrical shape, for example, and is connected to a small-diameter part of thetapered part 241. Thetubular part 243 has a hollow cylindrical shape, for example, and is connected to a large-diameter part of thetapered part 241. One end of thetip end part 244 enters inside thetubular part 243 from an inner side (that is, the side of theopening 20 x) along the horizontal direction of thetubular part 243. Thecoil spring 245 is arranged between the one end of thetip end part 244 and the large-diameter part of thetapered part 241. - One end of the
tubular part 242 enters inside thetubular part 231 from an inner side (that is, the side of theopening 20 x) along the horizontal direction of thetubular part 231. Acoil spring 234 is arranged between the one end of thetubular part 242 and the other end of thecolumnar part 221. - The coil springs 224, 234, and 245 are examples of an urging means (or urging member). The urging means (or urging member) is not limited to the coil spring, and may include a leaf spring, a rubber member, or the like.
- When a transition is made from the state illustrated in
FIG. 5A to the state illustrated inFIG. 5B and thelid part 40 is arranged on themain body 20, a sloping part of thepressing part 41 presses thetapered part 241 in a direction of an arrow A, as illustrated inFIG. 6B . Hence, thecompressed coil spring 234 expands, to move themovable part 232 in a direction of an arrow B (that is, in the direction toward theopening 20 x). In addition, the other end of thetip end part 244 of themovable part 232 contacts the side surface of theconnection terminal 120 within theopening 20 x. - When the
movable part 232 moves further in the direction of the arrow B (that is, in the direction toward theopening 20 x), thecoil spring 245 is compressed in the state in which the other end of thetip end part 244 contacts the side surface of theconnection terminal 120. Accordingly, thetip end part 244 is urged toward theconnection terminal 120, and the other end of thetip end part 244 contacts theconnection terminal 120 and is electrically connected to theconnection terminal 120. By compressing thecoil spring 245, it is possible to prevent damage to the side surface of theconnection terminal 120. - The
probe 21 of thesocket 10 may have any structure capable of moving themovable part 232 back and forth in the horizontal direction, parallel to the upper surface of thesubstrate 110 from which theconnection terminals 120 protrude or parallel to the lower surface of thesubstrate 130 from which theconnection terminals 120 protrude, according to a pressing force. Further, theprobe 21 of thesocket 10 is not limited to the structure in which the sloping part of thepressing part 41 presses against thetapered part 241. - Accordingly, the
socket 10 is provided with theprobe 21 having themovable part 232 that can move back and forth in the horizontal direction according to the pressing force of thepressing part 41. For this reason, even in a case in which probes cannot contact theconnection terminals 120 from under the lower surface of thePCBA 100, theprobes 21 can contact the side surfaces of theconnection terminals 120. As a result, it is possible to inspect thePCBA 100 without providing a special structure for enabling inspection of thePCBA 100. - For example, the special structure for enabling inspection may be an inspection pattern that is provided on the lower surface of the PCBA and contactable by the probes upon inspection, or an inspection pattern that is provided in an extended region of the PCBA extended in a horizontal direction of the PCBA and contactable by the probes upon inspection. But the special structure for enabling inspection is undesirable in that the special structure increases a size of the PCBA, increases a cost of the PCBA, or increases both the size and the cost of the PCBA. The increase in the cost of the PCBA may be caused by a need to cut and remove the extended region of the PCBA after the inspection of the PCBA.
- In a second embodiment, no holding member is provided. In this second embodiment, those parts that are the same as those corresponding parts of the first embodiment are designated by the same reference numerals, and a description thereof may be omitted.
-
FIG. 7A andFIG. 7B are diagrams illustrating an example of a state in which the PCBA is accommodated in the socket in the second embodiment.FIG. 7A illustrates a state before alid part 40A is arranged on amain body 20A, andFIG. 7B illustrates a state after thelid part 40A is arranged on themain body 20A. - As illustrated in
FIG. 7A andFIG. 7B , asocket 10A in this second embodiment differs from thesocket 10 in the first embodiment described above in conjunction withFIG. 2 , for example, in that themain body 20 having the opening 20 x is replaced by themain body 20A having acavity 20 z, no holdingmember 30 is provided, and thelid part 40 having the opening 40 x is replaced by thelid part 40A having acavity 40 z. In thesocket 10A, thePCBA 100 is held directly inside thecavity 20 z of themain body 20A, without providing the holdingmember 30. For this reason, no steppedpart 20 c is provided in themain body 20A for receiving the holdingmember 30. Thecavity 20 z is an example of the accommodating part of themain body 20A accommodating thePCBA 100. - Accordingly, depending on the structure at the lower surface of the
PCBA 100, it is unnecessary to use the holdingmember 30. However, in the case in which the holdingmember 30 is used, it is advantageous in that thePCBA 100 can be held stably without being dependent on the structure at the lower surface of thePCBA 100. In addition, unlike thelid part 40 having the opening 40 x, thelid part 40A does not need to have an opening and may have thecavity 40 z instead, for example. - According to each of the embodiments described above, it is possible to provide a socket that enables inspection of a PCBA without providing a special structure for enabling inspection, even in a case in which the PCBA has a structure such that probes cannot contact connection terminals provided on a lower surface of the PCBA, from under the lower surface of the PCBA.
- Although the embodiments are numbered with, for example, “first,” or “second,” the ordinal numbers do not imply priorities of the embodiments. Many other variations and modifications will be apparent to those skilled in the art.
- All examples and conditional language recited herein are intended for pedagogical purposes to aid the reader in understanding the invention and the concepts contributed by the inventor to furthering the art, and are to be construed as being without limitation to such specifically recited examples and conditions, nor does the organization of such examples in the specification relate to a showing of the superiority and inferiority of the invention. Although the embodiments of the present invention have been described in detail, it should be understood that the various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the invention.
Claims (10)
Applications Claiming Priority (2)
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JP2017-204693 | 2017-10-23 | ||
JP2017204693A JP6898827B2 (en) | 2017-10-23 | 2017-10-23 | socket |
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US20190120895A1 true US20190120895A1 (en) | 2019-04-25 |
US10386407B2 US10386407B2 (en) | 2019-08-20 |
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US16/120,611 Active US10386407B2 (en) | 2017-10-23 | 2018-09-04 | Socket |
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US3844576A (en) * | 1973-07-18 | 1974-10-29 | Olin Corp | Vibration damped ski |
US7388742B2 (en) * | 1989-04-14 | 2008-06-17 | Broadcom Corporation | Portable computerized data communication device |
KR100718850B1 (en) * | 2003-01-22 | 2007-05-16 | 닛본 덴끼 가부시끼가이샤 | Circuit board device and method for interconnecting wiring boards |
US8836509B2 (en) * | 2009-04-09 | 2014-09-16 | Direct Payment Solutions Limited | Security device |
JP5500870B2 (en) * | 2009-05-28 | 2014-05-21 | 新光電気工業株式会社 | Substrate with connection terminal and socket for electronic parts |
JP2011123015A (en) | 2009-12-14 | 2011-06-23 | Renesas Electronics Corp | Method of manufacturing semiconductor device |
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