US20180168042A1 - Flexible connector - Google Patents

Flexible connector Download PDF

Info

Publication number
US20180168042A1
US20180168042A1 US15/377,670 US201615377670A US2018168042A1 US 20180168042 A1 US20180168042 A1 US 20180168042A1 US 201615377670 A US201615377670 A US 201615377670A US 2018168042 A1 US2018168042 A1 US 2018168042A1
Authority
US
United States
Prior art keywords
connector
board
chosen
facing areas
facing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/377,670
Other languages
English (en)
Inventor
Jeffrey David HARTMAN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Northrop Grumman Systems Corp
Original Assignee
Northrop Grumman Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northrop Grumman Systems Corp filed Critical Northrop Grumman Systems Corp
Priority to US15/377,670 priority Critical patent/US20180168042A1/en
Assigned to NORTHROP GRUMMAN SYSTEMS CORPORATION reassignment NORTHROP GRUMMAN SYSTEMS CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: Hartman, Jeffrey David
Priority to KR1020197015946A priority patent/KR102286169B1/ko
Priority to JP2019528086A priority patent/JP6834000B2/ja
Priority to AU2017377926A priority patent/AU2017377926B2/en
Priority to EP17801291.0A priority patent/EP3556185B1/en
Priority to CA3046344A priority patent/CA3046344C/en
Priority to PCT/US2017/060867 priority patent/WO2018111460A1/en
Publication of US20180168042A1 publication Critical patent/US20180168042A1/en
Priority to US16/439,415 priority patent/US10681812B2/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

Definitions

  • This disclosure relates to an apparatus and method for use of a flexible connector and, more particularly, to an apparatus and method for electrically connecting pairs of pads on mutually angularly arranged circuit boards.
  • Sophisticated integrated systems may use a combination of electronic component configurations to achieve desired packaging size/shape goals. For example, two circuit boards could be linked at an angle to one another (other than 180°) to fit in a desired use environment. These mutually-angled circuit boards need to be electrically connected together.
  • commercial angle connectors are only capable of 90° connections between circuit boards, for several hundred I/O connections on a 0.5-0.75 mm pitch spacing.
  • a flexible connector is described.
  • a unitary connector block has first and second board-facing areas.
  • the first and second board-facing areas are longitudinally spaced from each other on a chosen surface of the connector block.
  • the connector block includes a block body transversely separating the chosen surface from an opposing surface oppositely facing from the chosen surface.
  • the connector block includes a flexible connector bridge longitudinally interposed between the first and second board-facing areas.
  • a first connector port is located within the first board-facing area.
  • a second connector port is located within the second board-facing area.
  • a connector trace extends through at least a portion of the block body between the first and second board-facing areas. The connector trace electrically connects the first and second connector ports.
  • a planar chosen substrate has transversely spaced top and bottom chosen substrate surfaces. First and second board-facing areas longitudinally spaced from each other are defined on a selected one of the top and bottom chosen substrate surfaces.
  • a planar opposing substrate has transversely spaced top and bottom opposing substrate surfaces. The chosen and opposing substrates are attached together to at least partially form a unitary connector block including a block body with the first and second board-facing areas on an outward-facing surface thereof.
  • a conductive material is deposited to generate a first connector port located within the first board-facing area.
  • a conductive material is deposited to generate a second connector port located within the second board-facing area.
  • a conductive material is deposited on at least one of the chosen and opposing substrate surfaces to generate a connector trace extending through at least a portion of the block body between the first and second board-facing areas.
  • the first and second connector ports are electrically connected with the connector trace.
  • a thickness of one of the chosen and opposing substrate surfaces is selectively reduced to define a flexible connector bridge longitudinally interposed between the first and second board-facing areas. Relative angular motion of the first and second board-facing areas is facilitated with the connector bridge.
  • an apparatus for electrically connecting pairs of pads on mutually angularly arranged circuit boards.
  • a planar chosen substrate has transversely spaced top and bottom chosen substrate surfaces.
  • First and second board-facing areas are longitudinally spaced from each other on a selected one of the top and bottom chosen substrate surfaces.
  • a planar opposing substrate has transversely spaced top and bottom opposing substrate surfaces.
  • a selected one of the chosen and opposing substrates has a significantly varied transverse thickness along a longitudinal dimension thereof.
  • a unitary connector block is at least partially formed by the chosen and opposing substrates.
  • the connector block includes a block body.
  • a first connector port is located within the first board-facing area.
  • a second connector port is located within the second board-facing area.
  • a connector trace extends through at least a portion of the block body between the first and second board-facing areas.
  • the connector trace electrically connects the first and second connector ports.
  • a flexible connector bridge is longitudinally interposed between the first and second board-facing areas for facilitating relative angular motion of the first and second board-facing areas.
  • FIG. 1 is a schematic front view of one aspect of the invention
  • FIG. 2 is a schematic front view of the aspect of FIG. 1 in an example use environment
  • FIG. 3 is a schematic front view of an alternate configuration of the aspect of FIG. 1 ;
  • FIG. 4 is a schematic front view of the configuration of FIG. 3 in an example use environment
  • FIGS. 5A-5F schematically depict an example sequence of manufacture of the aspect of FIGS. 1 and 3 ;
  • FIG. 6 is a schematic plan view of the aspect of FIG. 1 ;
  • FIGS. 7A-7B are schematic side views of the aspect of FIG. 1 having different example configurations
  • FIG. 8 is a perspective top view of the aspect of FIG. 1 in the example configuration of FIG. 7A ;
  • FIGS. 9A-9C schematically depict an example sequence of installation of the aspect of FIG. 1 .
  • phrases such as “between X and Y” and “between about X and Y” can be interpreted to include X and Y.
  • phrases such as “between about X and Y” can mean “between about X and about Y.”
  • phrases such as “from about X to Y” can mean “from about X to about Y.”
  • references to a structure or feature that is disposed “directly adjacent” another feature may have portions that overlap or underlie the adjacent feature, whereas a structure or feature that is disposed “adjacent” another feature might not have portions that overlap or underlie the adjacent feature.
  • spatially relative terms such as “under,” “below,” “lower,” “over,” “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms can encompass different orientations of a device in use or operation, in addition to the orientation depicted in the figures. For example, if a device in the figures is inverted, elements described as “under” or “beneath” other elements or features would then be oriented “over” the other elements or features.
  • This technology comprises, consists of, or consists essentially of the following features, in any combination.
  • FIG. 1 depicts an apparatus, shown here as a flexible connector 100 , which could be a flexible circuit board connector, which can be used to electrically connect pairs of pads on mutually angularly arranged electronic components, as will be described in greater detail with circuit boards as an example in FIG. 2 .
  • the flexible connector 100 can allow for stripline, coplanar waveguide, and/or microstrip routing, and has a high density of interconnects, which may be sufficient to provide hundreds to thousands of I/O connections on a 100-200 micrometer pitch.
  • a unitary connector block 102 has first and second board-facing areas, shown generally at 104 and 106 , respectively.
  • the term “board-facing” is used here, for clarity of description, in the context of the circuit board example use environment, but it is contemplated that a “board” need not be present for another use environment of the flexible connector 100 .
  • the first and second board-facing areas 104 and 106 are longitudinally spaced from each other on a chosen surface (the lower side, in the orientation and configuration of FIG. 1 ) of the connector block 102 .
  • the “longitudinal” direction, as referenced herein, is substantially horizontal in the orientation of FIG. 1 , and is represented by arrow “L”.
  • the connector block 102 includes a block body 108 transversely separating the chosen surface from an opposing surface (the upper side, in the orientation and configuration of FIG. 1 ) oppositely facing from the chosen surface.
  • the “transverse” direction as referenced herein, is perpendicular to the longitudinal direction—thus, substantially vertical in the orientation of FIG. 1 —and is represented by arrow “T”.
  • the connector block 102 includes a flexible connector bridge 110 longitudinally interposed between the first and second board-facing areas 104 and 106 .
  • the connector bridge 110 and the first and second board-facing areas 104 and 106 may all be made from the same material.
  • the connector block 102 could at least partially be made of a silicon wafer that has been processed, as will be described below or in any other suitable manner, to generate the connector bridge 110 as a reduced-thickness (including zero-thickness) portion, and the first and second board-facing areas 104 and 106 as a full-thickness portion, of the same original block of raw material.
  • the connector bridge 110 and the first and second board-facing areas 104 and 106 may be concurrently and unitarily formed as a monolithic component of the connector block 102 (i.e., not intended for disassembly post-manufacture).
  • the connector block 102 may have a first transverse thickness (t 1 ) at the first and/or second board-facing areas 104 and 106 , and a second transverse thickness (t 2 ) at the connector bridge 110 .
  • the second transverse thickness t 2 may be a minority (less than half as much), which may be a superminority (less than one third as much), of the first transverse thickness t 1 .
  • the first transverse thickness t 1 could be in the range of 600-700 microns, such as in the range of 640-660 microns, while the second transverse thickness t 2 could be in the range of 5-25 microns, such as in the range of 10-20 microns.
  • silicon is sufficiently flexible across a thickness of 5-25 microns to permit bending through a range of angles as disclosed herein.
  • the first and second transverse thicknesses t 1 and t 2 could be substantially similar, for a particular use environment.
  • a selected one of the chosen surface and the opposing surface of the connector block 102 may be contoured at differing distances from the other one of the chosen surface and the opposing surface along a longitudinal dimension of the connector block 102 , as shown.
  • the opposing (top) surface of the connector block 102 when ready for use, may have a “stepped” profile (shown generally at P) which varies the distance of the opposing surface from the chosen (bottom) surface in a linear fashion.
  • the profile of the selected one of the chosen surface and the opposing surface of the connector block 102 may vary in a curved, curvilinear, linear, or any desired fashion (e.g., at least partially sloped or curved), and that the profile could also or instead vary in any desired fashion (e.g., gradually or in a stepwise fashion) in a lateral (i.e., into and out of the plane of the page of FIG. 1 ) direction, to provide a flexible connector 100 having desired properties for a particular use environment.
  • the flexible connector 100 includes a first connector port 112 located within the first board-facing area 104 .
  • a second connector port 114 is located within the second board-facing area 106 .
  • a connector trace 116 (two labeled, in FIG. 1 ) extends through at least a portion of the block body 108 between the first and second board-facing areas 104 and 106 .
  • the connector trace 116 electrically connects the first and second connector ports 112 and 114 .
  • the chosen surface (in this Figure, the bottom surface, using the orientation of FIG. 1 ) of the flexible connector 100 faces first and second circuit boards 218 and 220 , respectively for creating an electrical connection therebetween.
  • the block body 108 is interposed between the chosen surface and the opposing surface.
  • the flexible connector bridge 110 which is formed by a portion of the block body 108 , is longitudinally interposed between the first and second board-facing areas 104 and 106 for facilitating relative angular motion of the first and second board-facing areas 104 and 106 . In this manner, the flexible connector 100 can bend and flex to electrically connect pairs of pads 222 on mutually angularly arranged first and second circuit boards 218 and 220 .
  • the first and second circuit boards 218 and 220 are arranged relative to each other at an operative angle ⁇ .
  • the operative angle ⁇ may be any desired angle which can be physically achieved by a predetermined configuration of the flexible connector 100 .
  • the operative angle ⁇ is approximately 90°, or an orthogonal, “right” angle.
  • One of ordinary skill in the art will be able to provide a flexible connector 100 having suitable dimensions (relative and absolute) and flexibility for spanning a desired operative angle ⁇ between first and second circuit boards 218 and 220 .
  • the block body 108 may include a plurality of laminated substrate layers.
  • the block body 108 could include a portion (S) made of silicon, laminated with one or more layers of dielectric material (D), such as polymer, and/or metal (M).
  • D dielectric material
  • M metal
  • each layer of metal could include a different level of conductive traces, as desired.
  • Any flexible connector 100 can be configured as including, as shown in FIG. 1 , a planar chosen substrate ( 124 , as shown in FIG. 1 ) having transversely spaced top and bottom chosen substrate surfaces 126 and 128 , respectively, and first and second board-facing areas 104 and 106 being longitudinally spaced from each other on a selected one (here, bottom chosen substrate surface 128 ) of the top and bottom chosen substrate surfaces 126 and 128 .
  • a planar opposing substrate ( 130 , as shown in FIG. 1 ) has transversely spaced top and bottom opposing substrate surfaces 132 and 134 , respectively.
  • a selected one (here, opposing substrate 130 ) of the chosen and opposing substrates 124 and 130 has a significantly varied transverse thickness along a longitudinal dimension thereof.
  • a unitary connector block 102 is at least partially formed by the chosen and opposing substrates.
  • the connector block 102 includes a block body 108 .
  • a first connector port 112 is located within the first board-facing area 104 .
  • a second connector port 114 is located within the second board-facing area 106 .
  • a connector trace 116 may extend through at least a portion of the block body 108 between the first and second board-facing areas 104 and 106 .
  • the connector trace 116 electrically connects the first and second connector ports 112 and 114 .
  • a flexible connector bridge 110 may be longitudinally interposed between the first and second board-facing areas 104 and 106 for facilitating relative angular motion of the first and second board-facing areas 104 and 106 .
  • This general description applies to any embodiment of the aspects of the invention shown and described herein. However, it should be noted that the substrate definitions and descriptions earlier in this paragraph apply to the configuration of the flexible connector 100 shown in FIGS. 1-2 , where the connector bridge 110 is positioned on the connector block 102 toward the “interior” side of operative angle ⁇ .
  • the connector bridge 110 is positioned on the connector block 102 toward the “exterior” side of operative angle ⁇ . Therefore, the identification of the “chosen” substrate 124 and “opposing” substrate 130 , and the “top” and “bottom” as shown, are reversed for the configuration shown in FIGS. 3-4 , as compared to the configuration of FIGS. 1-2 .
  • One of ordinary skill in the art will understand the manner in which the orientation and definitions can be adjusted to accurately reference each of these two configurations.
  • the block body 108 includes at least one increased-thickness portion and at least one reduced-thickness portion, as with the previously described configuration of FIGS. 1-2 .
  • the selected substrate layer 124 or 130 forming the chosen surface has a significantly varied transverse thickness along a longitudinal dimension thereof.
  • each connector trace 116 of this configuration includes at least one via 436 extending transversely through an increased-thickness portion of the block body.
  • the material of the chosen substrate 124 can have the previously described varying profile P while also including the first and second board-facing areas 104 and 106 .
  • FIGS. 3-4 One of ordinary skill in the art will understand how to design and manufacture the configuration of the flexible connector 100 shown in FIGS. 3-4 . Therefore, the remainder of this description, and FIGS. 5A-9C , will use the configuration of FIGS. 1-2 as an example, without excluding or prejudicing a corresponding characterization of the described and shown features and actions which uses the configuration of FIGS. 3-4 .
  • FIGS. 5A-5F an example sequence of manufacture for the flexible connector 100 is shown.
  • a base block characterized here as a silicon (or silicon on insulator) wafer or block “S” is provided.
  • this block “S” is being described as a planar opposing substrate 130 having transversely spaced top and bottom opposing substrate surfaces 132 and 134 .
  • a planar chosen substrate 124 has transversely spaced top and bottom chosen substrate surfaces 126 and 128 , which is depicted in FIG.
  • First and second board-facing areas 104 and 106 longitudinally spaced from each other are defined on a selected one of the top and bottom chosen substrate surfaces—here, on the bottom chosen substrate surface 128 .
  • the chosen and opposing substrates 124 and 130 are attached together to at least partially form a unitary connector block 102 including a block body 108 with the first and second board-facing areas 104 and 106 on an outward-facing surface thereof.
  • a conductive material is deposited to generate at least one first connector port 112 located within the first board-facing area 104 .
  • a conductive material is deposited to generate at least one second connector port 114 located within the second board-facing area 106 .
  • the first and second connector ports 112 and 114 are shown and described herein as being “bump bonds”. It is also contemplated that the first and second connector ports 112 and 114 could instead or also include press contact type interfaces, but it may be desirable to include some sort of holdaway structures in the flexible connector 100 for press contact interfaces.
  • a conductive material is deposited on at least one of the chosen and opposing substrate surfaces to generate a connector trace 116 extending through at least a portion of the block body 108 between the first and second board-facing areas 104 and 106 . This could occur, for example, in any of FIGS. 5B-5F .
  • the first and second connector ports 112 and 114 are electrically connected with the connector trace 116 .
  • depositing a conductive material on at least one of the chosen and opposing substrate surfaces to generate a connector trace 116 may include creating at least one via 436 extending transversely through an increased-thickness portion of the block body 108 .
  • a “handle wafer” (not shown) could be removably attached to the chosen substrate surface to facilitate handling of the flexible connector 100 during manufacture without unduly stressing fragile portions of the structure.
  • a thickness of the opposing substrate 130 is optionally reduced across an entire longitudinal dimension thereof, in any desired manner, particularly if the initial silicon S block provided is thicker than desired for the final flexible connector 100 .
  • a thickness of one of the chosen and opposing substrate surfaces is selectively reduced, to define a flexible connector bridge 110 longitudinally interposed between the first and second board-facing areas 104 and 106 .
  • selectively reducing a thickness of one of the chosen and opposing substrate surfaces to define the flexible connector bridge 110 may include selectively reducing a thickness of the selected one of the chosen and opposing substrate surfaces upon which the first and second board-facing areas 104 and 106 are defined.
  • selectively reducing a thickness of one of the chosen and opposing substrate surfaces to define the flexible connector bridge 110 may include selectively reducing a thickness of the other one of the chosen and opposing substrate surfaces upon which the first and second board-facing areas 104 and 106 are defined.
  • One of ordinary skill in the art will be able to create a suitable manufacturing process, using standard silicon foundry processes or any other desired processes or techniques, to manufacture a flexible connector 100 having the desired structures and properties for a particular use environment of the present invention.
  • an elongated, mass-produced chain of flexible connector 100 units may be diced or singulated via etching, other chemical techniques, mechanical techniques, or in any other desired manner, into usable-length individual finished flexible connectors 100 , by cutting a very long (into and out of the plane of the page in FIGS. 5A-5F ) chain into strips.
  • Each of the individual finished flexible connectors 100 may be, for example, in the range of 5-50 millimeters, and, more specifically, in the range of 10-30 millimeters, deep, again, into and out of the plane of the page, in these Figures.
  • Each of the finished flexible connectors 100 may include facilitation of relative angular motion of the first and second board-facing areas 104 with the connector bridge 110 .
  • first and second mutually angularly arranged circuit boards 218 and 220 may be electrically connected with a flexible connector 100 including the connector block 102 at least partially formed via the sequence of FIGS. 5A-5F .
  • the first connector ports 112 on the first board-facing area 104 can be brought into electrical connection with appropriately located pads 222 on the first circuit board 218
  • the second connector ports 114 on the second board-facing area 106 can be brought into electrical connection with corresponding pads 222 on the second circuit board 220 .
  • FIGS. 6-9C an orientation scheme for locating a flexible connector 100 as desired in relation to first and second circuit boards 218 and 220 , is shown.
  • At least one connector orientation feature 640 is provided to the connector block 102 , optionally, as shown, in at least one of the first and second board-facing areas 104 and 106 .
  • the connector orientation features 640 can be full-depth (as shown in FIG. 7A ) or blind (as shown in FIG. 7B ) holes into/through the block body 108 .
  • the connector orientation features 640 are configured for selectively engaging corresponding board orientation features 842 on a corresponding first or second circuit board 218 or 220 .
  • the board orientation features 842 are depicted herein as pegs, in part to engage with the aperture type connector orientation features 640 in a male-to-female manner. However, it is contemplated that the board orientation features could be apertures for engaging with peg-type connector orientation features (neither shown) in a female-to-male manner. It is also contemplated that certain of the board orientation features could be apertures, and certain others could be pegs, with corresponding connector orientation features provided, as desired for a particular implementation of the flexible connector 100 .
  • pegs and apertures are shown for simplicity, it is contemplated that the pegs and apertures, or any other orientation feature structures, could have any suitable shape, configuration, number, placement, and/or mating or engaging features, as desired for a particular use environment.
  • one or both of the orientation feature structures could be threaded or otherwise configured to facilitate engagement and maintenance of the flexible connector 100 with the circuit boards 218 and 220 .
  • the flexible connector 100 can be therefore guided into engagement, and the engagement optionally at least partially effectuated, through use of the connector and board orientation feature 640 and 842 .
  • This sequence of selectively engaging a board orientation feature 842 on a circuit board 218 or 220 with a corresponding connector orientation feature 640 on the flexible connector 100 in the course of electrically connecting first and second mutually angularly arranged circuit boards 218 and 220 with a flexible connector 110 including the connector block 120 is depicted in FIGS. 9A-9C .
  • the flexible connector 100 is shown as being aligned as desired with respect to the circuit board 218 or 220 with the connector orientation features 640 poised for engagement with the board orientation features 842 .
  • the flexible connector 100 has been lowered toward the circuit board 218 or 222 insert the board orientation features 842 into the connector orientation feature 640 .
  • the first or second connector ports 112 or 114 have been brought into electrical contact with the pads 222 .
  • one or both of the connector and board orientation features 640 and 842 has been heated to engage and optionally draw down the flexible connector 100 into desired contact with the pads 222 of the first and second circuit boards 218 and 220 , particularly if a thermal coefficient of expansion mismatch technique is used.
  • the flexible connector 100 could be removed from the first and second circuit boards 218 and 220 by simply reversing the above-described sequence of installation.
  • the silicon wafer or other raw material could be completely removed (e.g., to a zero-thickness) at the connector bridge 110 to provide a connector bridge made from a different material than the first and second board-facing areas 104 and 106
  • Any of the described structures and components could be disposable or reusable as desired for a particular use environment. Any component could be provided with a user-perceptible marking to indicate a material, configuration, at least one dimension, or the like pertaining to that component, the user-perceptible marking aiding a user in selecting one component from an array of similar components for a particular use environment.
  • a “predetermined” status may be determined at any time before the structures being manipulated actually reach that status, the “predetermination” being made as late as immediately before the structure achieves the predetermined status.
  • Certain structures and components are schematically depicted in the Figures as being slightly separated from one another, for clarity of depiction, but one of ordinary skill in the art will understand the contacting relationships between these structures, based at least upon context and the corresponding written description.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
US15/377,670 2016-12-13 2016-12-13 Flexible connector Abandoned US20180168042A1 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
US15/377,670 US20180168042A1 (en) 2016-12-13 2016-12-13 Flexible connector
KR1020197015946A KR102286169B1 (ko) 2016-12-13 2017-11-09 플렉시블 커넥터
JP2019528086A JP6834000B2 (ja) 2016-12-13 2017-11-09 フレキシブルコネクタ
AU2017377926A AU2017377926B2 (en) 2016-12-13 2017-11-09 Flexible connector
EP17801291.0A EP3556185B1 (en) 2016-12-13 2017-11-09 Flexible connector
CA3046344A CA3046344C (en) 2016-12-13 2017-11-09 Flexible connector
PCT/US2017/060867 WO2018111460A1 (en) 2016-12-13 2017-11-09 Flexible connector
US16/439,415 US10681812B2 (en) 2016-12-13 2019-06-12 Method of providing a flexible connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15/377,670 US20180168042A1 (en) 2016-12-13 2016-12-13 Flexible connector

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US16/439,415 Division US10681812B2 (en) 2016-12-13 2019-06-12 Method of providing a flexible connector

Publications (1)

Publication Number Publication Date
US20180168042A1 true US20180168042A1 (en) 2018-06-14

Family

ID=60409491

Family Applications (2)

Application Number Title Priority Date Filing Date
US15/377,670 Abandoned US20180168042A1 (en) 2016-12-13 2016-12-13 Flexible connector
US16/439,415 Active US10681812B2 (en) 2016-12-13 2019-06-12 Method of providing a flexible connector

Family Applications After (1)

Application Number Title Priority Date Filing Date
US16/439,415 Active US10681812B2 (en) 2016-12-13 2019-06-12 Method of providing a flexible connector

Country Status (7)

Country Link
US (2) US20180168042A1 (cg-RX-API-DMAC7.html)
EP (1) EP3556185B1 (cg-RX-API-DMAC7.html)
JP (1) JP6834000B2 (cg-RX-API-DMAC7.html)
KR (1) KR102286169B1 (cg-RX-API-DMAC7.html)
AU (1) AU2017377926B2 (cg-RX-API-DMAC7.html)
CA (1) CA3046344C (cg-RX-API-DMAC7.html)
WO (1) WO2018111460A1 (cg-RX-API-DMAC7.html)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020045851A1 (ko) * 2018-08-28 2020-03-05 주식회사 엘지화학 인쇄회로기판 어셈블리 및 그것을 제조하는 제조방법
US11075486B1 (en) 2020-03-02 2021-07-27 Northrop Grumman Systems Corporation Signal connector system
US20220149552A1 (en) * 2019-07-31 2022-05-12 Hewlett-Packard Development Company, L.P. Board to board connectors
US20220256703A1 (en) * 2020-04-30 2022-08-11 Chengdu Boe Optoelectronics Technology Co., Ltd. Circuit board assembly, display apparatus, terminal, and signal processing system
US11569608B2 (en) 2021-03-30 2023-01-31 Northrop Grumman Systems Corporation Electrical connector system
US11672079B2 (en) 2018-11-14 2023-06-06 At&S (China) Co. Ltd. Component carrier with improved bending performance
EP4319498A4 (en) * 2021-07-01 2024-09-25 Samsung Electronics Co., Ltd. Rigid flexible printed circuit board and electronic device comprising same
EP4376561A4 (en) * 2022-10-12 2025-07-16 Ruijie Networks Co Ltd CHIP TO MODULE AND PCB CIRCUIT CABLE ASSEMBLY

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT201800009268A1 (it) * 2018-10-09 2020-04-09 Te Connectivity Italia Distrib Srl Dispositivo di connessione
CN110022644B (zh) * 2019-05-16 2020-04-03 广州市宝米勒电气技术有限公司 Pcb及其连接具有不同平面触点的元器件的方法、电子装置
GB201910805D0 (en) * 2019-07-29 2019-09-11 Leonardo Mw Ltd Circuit board assembly
US11038594B1 (en) 2020-05-13 2021-06-15 Northrop Grumman Systems Corporation Self-insulating high bandwidth connector
US11688962B2 (en) * 2021-05-13 2023-06-27 Veoneer Us, Llc Scalable electronic modules having a common form factor
CN114496358A (zh) * 2022-01-21 2022-05-13 武汉衷华脑机融合科技发展有限公司 一种连接线结构及其形成方法
US12494599B2 (en) * 2022-12-20 2025-12-09 Northrop Grumman Systems Corporation Silicon flexible connectors

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4687695A (en) * 1985-09-27 1987-08-18 Hamby Bill L Flexible printed circuits and methods of fabricating and forming plated thru-holes therein
US5419038A (en) * 1993-06-17 1995-05-30 Fujitsu Limited Method for fabricating thin-film interconnector
US5854534A (en) * 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
US6603079B2 (en) * 1999-02-05 2003-08-05 Mack Technologies Florida, Inc. Printed circuit board electrical interconnects
US7012812B2 (en) * 2002-03-13 2006-03-14 Rambus, Inc. Memory module
US20090014205A1 (en) * 2004-04-09 2009-01-15 Atsushi Kobayashi Printed circuit board assembled panel, unit sheet for packaging a printed circuit board, rigid-flexible board and method for manufacturing the same
US9485860B2 (en) * 2013-07-30 2016-11-01 Murata Manufacturing Co., Ltd. Multilayer board
US9743529B2 (en) * 2009-10-28 2017-08-22 Samsung Electro-Mechanics Co., Ltd. Multilayer rigid flexible printed circuit board and method for manufacturing the same

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2946726C2 (de) 1979-11-20 1982-05-19 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Leiterplatte mit starren und flexiblen Bereichen und Verfahren zu deren Herstellung
US4466184A (en) * 1981-04-21 1984-08-21 General Dynamics, Pomona Division Method of making pressure point contact system
US4715928A (en) * 1985-09-27 1987-12-29 Hamby Bill L Flexible printed circuits and methods of fabricating and forming plated thru-holes therein
US5160269A (en) * 1991-12-19 1992-11-03 Precision Interconnect Corporation Hydrostatic connector for flex circuits
US5161981A (en) * 1992-03-10 1992-11-10 Amp Incorporated Foldable stacking connector
US6040624A (en) * 1997-10-02 2000-03-21 Motorola, Inc. Semiconductor device package and method
JP3744383B2 (ja) * 2000-06-09 2006-02-08 松下電器産業株式会社 複合配線基板及びその製造方法
US6712620B1 (en) * 2002-09-12 2004-03-30 High Connection Density, Inc. Coaxial elastomeric connector system
JP4196743B2 (ja) * 2003-06-12 2008-12-17 沖電気工業株式会社 半導体記憶装置
JP2006339088A (ja) * 2005-06-06 2006-12-14 Fci Asia Technology Pte Ltd 電気コネクタ
US7438582B2 (en) * 2006-12-22 2008-10-21 Amphenol Corporation Flexible circuit connector assembly
US8178789B2 (en) * 2007-07-17 2012-05-15 Ibiden Co., Ltd. Wiring board and method of manufacturing wiring board
US8118611B2 (en) * 2008-10-31 2012-02-21 Myoungsoo Jeon PCB bridge connector for connecting PCB devices
EP2728983A1 (de) * 2012-10-30 2014-05-07 Continental Automotive GmbH Leiterplattenbaugruppe für ein Steuergerät, Steuergerät für ein Kraftfahrzeug und Signalverarbeitungsanordnung
US8878353B2 (en) 2012-12-20 2014-11-04 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
TW201448688A (zh) * 2013-06-03 2014-12-16 Mutual Tek Ind Co Ltd 複合式電路板及其製作方法
JP6270344B2 (ja) 2013-06-05 2018-01-31 ソニーセミコンダクタソリューションズ株式会社 伝送モジュール、シールド方法及びコネクタ

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4687695A (en) * 1985-09-27 1987-08-18 Hamby Bill L Flexible printed circuits and methods of fabricating and forming plated thru-holes therein
US5854534A (en) * 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
US5419038A (en) * 1993-06-17 1995-05-30 Fujitsu Limited Method for fabricating thin-film interconnector
US6603079B2 (en) * 1999-02-05 2003-08-05 Mack Technologies Florida, Inc. Printed circuit board electrical interconnects
US7012812B2 (en) * 2002-03-13 2006-03-14 Rambus, Inc. Memory module
US20090014205A1 (en) * 2004-04-09 2009-01-15 Atsushi Kobayashi Printed circuit board assembled panel, unit sheet for packaging a printed circuit board, rigid-flexible board and method for manufacturing the same
US9743529B2 (en) * 2009-10-28 2017-08-22 Samsung Electro-Mechanics Co., Ltd. Multilayer rigid flexible printed circuit board and method for manufacturing the same
US9485860B2 (en) * 2013-07-30 2016-11-01 Murata Manufacturing Co., Ltd. Multilayer board

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020045851A1 (ko) * 2018-08-28 2020-03-05 주식회사 엘지화학 인쇄회로기판 어셈블리 및 그것을 제조하는 제조방법
US11503721B2 (en) 2018-08-28 2022-11-15 Lg Energy Solution, Ltd. PCB assembly and manufacturing method thereof
US11672079B2 (en) 2018-11-14 2023-06-06 At&S (China) Co. Ltd. Component carrier with improved bending performance
US20220149552A1 (en) * 2019-07-31 2022-05-12 Hewlett-Packard Development Company, L.P. Board to board connectors
US12027791B2 (en) * 2019-07-31 2024-07-02 Hewlett-Packard Development Company, L.P. Board to board connectors
US11075486B1 (en) 2020-03-02 2021-07-27 Northrop Grumman Systems Corporation Signal connector system
US20220256703A1 (en) * 2020-04-30 2022-08-11 Chengdu Boe Optoelectronics Technology Co., Ltd. Circuit board assembly, display apparatus, terminal, and signal processing system
US11839026B2 (en) * 2020-04-30 2023-12-05 Chengdu Boe Optoelectronics Technology Co., Ltd. Circuit board assembly, display apparatus, terminal, and signal processing system
US11569608B2 (en) 2021-03-30 2023-01-31 Northrop Grumman Systems Corporation Electrical connector system
EP4319498A4 (en) * 2021-07-01 2024-09-25 Samsung Electronics Co., Ltd. Rigid flexible printed circuit board and electronic device comprising same
EP4376561A4 (en) * 2022-10-12 2025-07-16 Ruijie Networks Co Ltd CHIP TO MODULE AND PCB CIRCUIT CABLE ASSEMBLY

Also Published As

Publication number Publication date
CA3046344C (en) 2021-04-27
WO2018111460A1 (en) 2018-06-21
EP3556185A1 (en) 2019-10-23
CA3046344A1 (en) 2018-06-21
US20190313530A1 (en) 2019-10-10
KR102286169B1 (ko) 2021-08-06
JP6834000B2 (ja) 2021-02-24
AU2017377926A1 (en) 2019-05-23
AU2017377926B2 (en) 2020-06-18
EP3556185B1 (en) 2024-10-09
JP2019536294A (ja) 2019-12-12
KR20190077499A (ko) 2019-07-03
US10681812B2 (en) 2020-06-09

Similar Documents

Publication Publication Date Title
US10681812B2 (en) Method of providing a flexible connector
US8622752B2 (en) Probe-card interposer constructed using hexagonal modules
US9015935B2 (en) Method for manufacturing probe card
KR101582634B1 (ko) 프로브 모듈 및 프로브 모듈의 제조 방법
US8441808B2 (en) Interposer with microspring contacts
US10109595B2 (en) Double-sided package module and substrate strip
CN104733894B (zh) 阴连接器
TWI491886B (zh) 探針組合體及含有該探針組合體之探針卡以及其製造方法
TW201250257A (en) Testing head for a test equipment of electronic devices
US20130314291A1 (en) Millimeter scale three-dimensional antenna structures and methods for fabricating same
KR101745884B1 (ko) 초정밀 레이저를 활용한 소켓 및 그 제조방법
TW201340813A (zh) 含異向性導電層之微電子裝置及其製造方法
KR20200083351A (ko) 셀프 얼라인 버티컬 프로브 카드의 컨택터 블록 및 그 제조방법
US8263876B2 (en) Conductive substrate structure with conductive channels formed by using a two-sided cut approach and a method for manufacturing the same
KR101519222B1 (ko) 프로브의 제조방법
CN103137531B (zh) 晶圆对位方法
JP2000340277A (ja) インターコネクタ及びその製造方法
US20170234907A1 (en) Inspection terminal unit, probe card, and method for manufacturing inspection terminal unit
JP2003224170A (ja) 電気的接続装置
KR101529240B1 (ko) 반도체 장치의 제조방법 및 반도체 제조장치
US9780465B1 (en) Angled circuit board connector
KR100745108B1 (ko) 프로브 카드의 실리콘 기판
KR20170080034A (ko) 기판의 제조 방법
KR20030060146A (ko) 투과 전자 현미경의 시료 제작 방법
JP2012009570A (ja) 配線板の接続方法および接続治具

Legal Events

Date Code Title Description
AS Assignment

Owner name: NORTHROP GRUMMAN SYSTEMS CORPORATION, VIRGINIA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HARTMAN, JEFFREY DAVID;REEL/FRAME:040726/0958

Effective date: 20161209

STPP Information on status: patent application and granting procedure in general

Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER

STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION