US20160211390A1 - Optical Sensor with Light-Guiding Feature and Method for Preparing the Same - Google Patents

Optical Sensor with Light-Guiding Feature and Method for Preparing the Same Download PDF

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Publication number
US20160211390A1
US20160211390A1 US14/996,037 US201614996037A US2016211390A1 US 20160211390 A1 US20160211390 A1 US 20160211390A1 US 201614996037 A US201614996037 A US 201614996037A US 2016211390 A1 US2016211390 A1 US 2016211390A1
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light
guiding
optical sensor
electrical
sample
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US14/996,037
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Coming Chen
Teng-Chien Yu
Yuan-Che Lee
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PERSONAL GENOMICS Inc
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PERSONAL GENOMICS Inc
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Priority to US14/996,037 priority Critical patent/US20160211390A1/en
Assigned to PERSONAL GENOMICS, INC. reassignment PERSONAL GENOMICS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LEE, YUAN-CHE, YU, TENG-CHIEN, CHEN, COMING
Publication of US20160211390A1 publication Critical patent/US20160211390A1/en
Priority to US16/665,352 priority patent/US11362223B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/09—Devices sensitive to infrared, visible or ultraviolet radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/04—Optical or mechanical part supplementary adjustable parts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G01N21/03—Cuvette constructions
    • G01N21/0303—Optical path conditioning in cuvettes, e.g. windows; adapted optical elements or systems; path modifying or adjustment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G01N21/645—Specially adapted constructive features of fluorimeters
    • G01N21/648—Specially adapted constructive features of fluorimeters using evanescent coupling or surface plasmon coupling for the excitation of fluorescence
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/75—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated
    • G01N21/77—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator
    • G01N21/7703—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator using reagent-clad optical fibres or optical waveguides
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/75—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated
    • G01N21/77—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator
    • G01N2021/7753—Reagent layer on photoelectrical transducer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/75—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated
    • G01N21/77—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator
    • G01N2021/7769—Measurement method of reaction-produced change in sensor
    • G01N2021/7786—Fluorescence
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G01N21/645—Specially adapted constructive features of fluorimeters
    • G01N21/6452—Individual samples arranged in a regular 2D-array, e.g. multiwell plates
    • G01N21/6454—Individual samples arranged in a regular 2D-array, e.g. multiwell plates using an integrated detector array
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/064—Stray light conditioning
    • G01N2201/0642—Light traps; baffles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present disclosure relates to an optical sensor with a light-guiding feature and a method for preparing the same.
  • Optical sensors are widely used in various imaging applications and products, such as cameras, scanners, photocopiers and the like. Optical sensors used in various fields of technology are designed for different purposes.
  • Quantum efficiency is a percentage of photons hitting the optical sensor that produce charge carriers. It is a measurement of the optical sensor's electrical sensitivity to light.
  • One aspect of the present disclosure provides an optical sensor with a light-guiding feature and a method for preparing the same.
  • An optical sensor comprises a semiconductive layer comprising an electrical circuit area and an optical sensing area, a sample-holding portion over the optical sensing area, a light-guiding structure between the sample-holding portion and the optical sensing area, and an electrical interconnect structure over the electrical circuit area, wherein the electrical interconnect structure is integrally formed with the light-guiding structure, and the light-guiding structure is configured to direct an emitting light from the sample-holding portion to the optical sensing area.
  • the electrical interconnect structure comprises at least one electrical contact over the electrical circuit area
  • the light-guiding structure comprises at least one first light-guiding part over the optical sensing area
  • the semiconductive layer has a horizontal upper surface, and the at least one electrical contact and the at least one first light-guiding part extend substantially in a same horizontal plane, which is in parallel to and above the horizontal upper surface.
  • the light-guiding structure comprises a plurality of first light-guiding parts arranged in a ring.
  • the at least one first light-guiding part is a ring-shaped part.
  • the electrical interconnect structure comprises at least one electrical via over the at least one electrical contact
  • the light-guiding structure comprises at least one second light-guiding part over the at least one first light-guiding part.
  • the semiconductive layer has a horizontal upper surface, and the at least one electrical via and the at least one second light-guiding part extend substantially in a same horizontal plane, which is in parallel to and above the horizontal upper surface.
  • the light-guiding structure comprises a plurality of second light-guiding parts arranged in a ring.
  • the at least one second light-guiding part is a ring-shaped part.
  • the light-guiding structure extends from a horizontal upper surface of the semiconductive layer.
  • the light-guiding structure comprises an inner light-guiding bar in a first layer over the semiconductive layer and an outer light-guiding bar in a second layer over the semiconductive layer.
  • a width of the light-guiding structure is larger in an upper region close to the sample-holding portion than that in a bottom region close to the light-sensing region.
  • a width of the light-guiding structure is larger in a bottom region close to the light-sensing region than that in the upper region close to the sample-holding portion.
  • An optical sensor comprises a semiconductive layer comprising an electrical circuit area and an optical sensing area, a sample-holding portion over the optical sensing area, at least one electrical contact over the electrical circuit area, and at least one first light-guiding part configured to direct an emitting light from the sample-holding portion to the optical sensing area, wherein the semiconductive layer has a horizontal upper surface, the at least one first light-guiding part is between the sample-holding portion and the optical sensing area, and the at least one electrical contact and the at least one first light-guiding part extend substantially in a same horizontal plane, which is in parallel to and above the horizontal upper surface.
  • the at least one electrical contact is integrally formed with the at least one first light-guiding part.
  • An optical sensor comprises a semiconductive layer comprising an optical sensing area, a sample-holding portion over the optical sensing area, and a light-guiding structure configured to direct an emitting light from the sample-holding portion to the optical sensing area, wherein the light-guiding structure comprises at least one light-guiding spacer extending from a horizontal upper surface of the semiconductive layer, and the light-guiding structure has a tapering top end near the sample-holding portion.
  • the light-guiding structure comprises a plurality of light-guiding spacers arranged in a ring.
  • the light-guiding structure comprises a ring-shaped guiding spacer.
  • the optical sensor comprises a plurality of dielectric layers over the optical sensing area, wherein the at least one light-guiding spacer extends through the plurality of dielectric layers.
  • the light-guiding structure has a sidewall tilted with respect to the semiconductive layer, and an included angle between the horizontal upper surface of the semiconductive layer and the sidewall is about 60 degrees to 89.5 degrees.
  • the light-guiding structure is designed to prevent light scattering. Due to the design of the light-guiding structure, the emitting light from the sample-holding portion can be more efficiently directed to the light-sensing region in the optical sensing area. Furthermore, the fabrication of the light-guiding structure complies with the back-end-of-line (BEOL) metallization technology and can be fabricated by the same fabrication process in the same die as the electrical interconnected structure and the multi junction photodiode of the light-sensing region. In addition, the light-guiding structure, the electrical interconnect structure and the multi junction photodiode of the light-sensing region are integrated in the same die by the same fabrication process rather than in two separated devices. Thus, the size of the optical sensor can be dramatically decreased.
  • BEOL back-end-of-line
  • FIG. 1A is a cross-sectional view of an optical sensor in accordance with some embodiments of the present disclosure.
  • FIG. 1B is a cross-sectional view of an optical sensor in accordance with some embodiments of the present disclosure.
  • FIG. 1C is a cross-sectional view of an optical sensor in accordance with some embodiments of the present disclosure
  • FIG. 2 is a top view of a light-guiding structure in accordance with some embodiments of the present disclosure.
  • FIG. 3 is a top view of a light-guiding structure in accordance with some embodiments of the present disclosure.
  • FIG. 4 is a top view of a light-guiding structure in accordance with some embodiments of the present disclosure.
  • FIG. 5 to FIG. 10 are cross-sectional views for preparing an optical sensor in accordance with some embodiments of the present disclosure.
  • FIG. 11A is a cross-sectional view of an optical sensor in accordance with some embodiments of the present disclosure.
  • FIG. 11B is a cross-sectional view of an optical sensor in accordance with some embodiments of the present disclosure.
  • FIG. 11C is a cross-sectional view of an optical sensor in accordance with some embodiments of the present disclosure
  • FIG. 12 to FIG. 17 are cross-sectional views for preparing an optical sensor in accordance with some embodiments of the present disclosure.
  • FIG. 18A is a cross-sectional view of an optical sensor in accordance with some embodiments of the present disclosure.
  • FIG. 18B is a cross-sectional view of an optical sensor in accordance with some embodiments of the present disclosure.
  • FIG. 19 to FIG. 23 are cross-sectional views for preparing an optical sensor in accordance with some embodiments of the present disclosure.
  • references to “one embodiment,” “an embodiment,” “exemplary embodiment,” “other embodiments,” “another embodiment,” etc. indicate that the embodiment(s) of the disclosure so described may include a particular feature, structure, or characteristic, but not every embodiment necessarily includes the particular feature, structure, or characteristic. Further, repeated use of the phrase “in the embodiment” does not necessarily refer to the same embodiment, although it may.
  • the present disclosure is directed to an optical sensor with a light-guiding feature.
  • detailed steps and structures are provided in the following description. Obviously, implementation of the present disclosure does not limit special details known by persons skilled in the art. In addition, known structures and steps are not described in detail, so as not to limit the present disclosure unnecessarily. Preferred embodiments of the present disclosure will be described below in detail. However, in addition to the detailed description, the present disclosure may also be widely implemented in other embodiments. The scope of the present disclosure is not limited to the detailed description, and is defined by the claims.
  • FIG. 1A is a cross-sectional view of an optical sensor 100 in accordance with some embodiments of the present disclosure.
  • the optical sensor 100 comprises a semiconductive layer 111 having an electrical circuit area 111 A and an optical sensing area 111 B, a sample-holding portion 23 over the optical sensing area 111 B, a light-guiding structure 130 between the sample-holding portion 23 and the optical sensing area 111 B, and an electrical interconnect structure 140 over the electrical circuit area 111 A.
  • the light-guiding structure 130 is configured to direct an emitting light from the sample-holding portion 23 to the optical sensing area 111 B.
  • the semiconductive layer 111 is a silicon substrate including a light-sensing region 55 in the optical sensing area 111 B used for detecting light of various wavelengths, and the sample holding portion 23 is used for holding a specimen 231 under analysis.
  • the sample holding portion 23 is disposed in a waveguide structure 120 over the light-guiding structure 130
  • the light-sensing region 55 is a multi junction photodiode disposed in an epitaxy region below the light-guiding structure 130 .
  • the light-sensing region 55 in the semiconductive layer 111 and the sample holding portion 23 in a waveguide structure 120 are disclosed in U.S.
  • the specimen 231 When a light 8 having wavelengths from around 450 nanometers to around 500 nanometers shines on the specimen 231 in the sample holding portion 23 , the specimen 231 emits lights 81 such as fluorescent lights, and the light-guiding structure 130 is configured to direct the emitting lights 81 to the light-sensing region 55 .
  • the wavelength of the emitted fluorescent light for example, can be a characteristic of a material in the specimen 231 .
  • the specimen 231 emits fluorescent lights with different wavelengths.
  • the light-sensing region 55 is electrically connected to the electrical interconnect structure 140 through conductor so as to transfer the charge carriers generated in the light sensing region 55 to the electrical circuitry in the electrical interconnect structure 140 for further signal processing and/or output to signal-processing electronics, such as a DSP or microprocessor.
  • signal-processing electronics such as a DSP or microprocessor.
  • the electrical interconnect structure 140 is integrally formed with the light-guiding structure 130 .
  • the correspondingly elements of the electrical interconnect structure 140 and the light-guiding structure 130 are formed substantially by the same fabrication process, and have substantially the same physical and chemical properties.
  • the electrical interconnect structure 140 comprises at least one electrical contact 141 over the electrical circuit area 111 A
  • the light-guiding structure 130 comprises at least one first light-guiding part 131 over the optical sensing area 111 B.
  • the first light-guiding part 131 is simultaneously formed with the electrical contact 141 substantially by the same fabrication process and the same material, and the first light-guiding part 131 and the electrical interconnect contact 141 have substantially the same physical and chemical properties.
  • the semiconductive layer 111 has a horizontal upper surface 112 , and the electrical contact 141 and the first light-guiding part 131 extend substantially in a same horizontal plane, which is in parallel to and above the horizontal upper surface 112 .
  • the optical sensor 100 has a dielectric layer 101 over the horizontal upper surface 112 , and the electrical contact 141 and the first light-guiding part 131 are positioned in the dielectric layer 101 .
  • the bottom ends of the electrical contact 141 and the first light-guiding part 131 are substantially at the same level, the upper ends of the electrical contact 141 and the first light-guiding part 131 are substantially at the same level; thus, the electrical contact 141 and the first light-guiding part 131 can be formed through the same fabrication process.
  • the electrical interconnect structure 140 comprises at least one electrical via 142 over the electrical contact 141
  • the light-guiding structure 130 comprises at least one second light-guiding part 132 over the first light-guiding part 131 .
  • the second light-guiding part 132 is simultaneously formed with the electrical via 142 substantially by the same fabrication process and the same material, and the second light-guiding part 132 and the electrical via 142 have substantially the same physical and chemical properties.
  • the electrical interconnect structure 140 has an electrical metal layer 143 between the electrical via 142 and the electrical contact 141 ; similarly, the light-guiding structure 130 has a third light-guiding part 133 between the second light-guiding part 132 and the first light-guiding part 131 .
  • the third light-guiding part 133 is simultaneously formed with the electrical metal layer 143 substantially by the same fabrication process and the same material, and the third light-guiding part 133 and the electrical metal layer 143 have substantially the same physical and chemical properties.
  • the electrical via 142 and the second light-guiding part 132 extend substantially in a same horizontal plane, which is in parallel to and above the horizontal upper surface 112 .
  • the optical sensor 100 has a dielectric layer 102 over the horizontal upper surface 112 , and the electrical via 142 and the second light-guiding part 132 are positioned in the dielectric layer 102 .
  • the bottom ends of the electrical metal layer 143 and the third light-guiding part 133 are substantially at the same level, the upper ends of the electrical via 142 and the second light-guiding part 132 are substantially at the same level; thus, the electrical contact 141 and the first light-guiding part 131 can be formed through the same fabrication processes.
  • the optical sensor 100 has a plurality of dielectric layers 102 - 104 over the dielectric layer 101 , and each dielectric layer has at least one electrical via 142 and at least one second light-guiding part 132 extending substantially in a same horizontal plane.
  • the second light-guiding part 132 can be optionally implemented in some of the dielectric layers, rather than in all of the dielectric layers.
  • the light-guiding structure 130 extends vertically or in a tilt manner from the horizontal upper surface 112 of the semiconductive layer 111 .
  • the horizontal distance between the second light-guiding parts 132 in the upper dielectric layer 104 is larger than that in the lower dielectric layer 102 ; in other words, the horizontal distance shrinks along a light-propagating direction from the sample-holding portion 23 to the light-sensing region 55 .
  • FIG. 1B is a cross-sectional view of an optical sensor 100 ′ in accordance with some embodiments of the present disclosure.
  • the optical sensor 100 ′ shown in FIG. 1B is substantially the same as the optical sensor 100 shown in FIG. 1A , except the design of the light-guiding structure.
  • the width of the light-guiding structure 130 is larger in the upper region (close to the sample-holding portion 23 ) than that in the bottom region (close to the light-sensing region 55 ); in contrast, in FIG. 1B , the width of the light-guiding structure 130 ′ is larger in the bottom region (close to the light-sensing region 55 ) than that in the upper region (close to the sample-holding portion 23 ).
  • FIG. 1C is a cross-sectional view of an optical sensor 100 ′′ in accordance with some embodiments of the present disclosure.
  • the optical sensor 100 ′′ shown in FIG. 1C is substantially the same as the optical sensor 100 shown in FIG. 1A , except the design of the light-guiding structure.
  • the width of the light-guiding structure 130 is larger in the upper region (close to the sample-holding portion 23 ) than that in the bottom region (close to the light-sensing region 55 ); in contrast, in FIG. 1C , the width of the light-guiding structure 130 ′′ in the bottom region (close to the light-sensing region 55 ) is substantially the same as that in the upper region (close to the sample-holding portion 23 ).
  • the inner sidewall of the light-guiding structure 130 ′′ is substantially vertical to the horizontal upper surface 112 .
  • FIG. 2 is a top view of a light-guiding structure 130 A in accordance with some embodiments of the present disclosure.
  • the light-guiding structure 130 A comprises a ring-shaped first light-guiding part 131 A and a ring-shaped second light-guiding part 132 A.
  • the ring-shaped first light-guiding part 131 A can be optionally disposed inside or outside of the ring-shaped second light-guiding part 132 A, and more second light-guiding parts can be optionally disposed in the light-guiding structure 130 A.
  • the outer periphery of the ring-shaped first light-guiding part 131 A can be optionally overlapped with the inner periphery of the ring-shaped second light-guiding part 132 A where the ring-shaped first light-guiding part 131 A is disposed inside the ring-shaped second light-guiding part 132 A, or vice versa.
  • FIG. 3 is a top view of a light-guiding structure 130 B in accordance with some embodiments of the present disclosure.
  • the light-guiding structure 130 B comprises a plurality of first light-guiding parts 131 B arranged in a ring, and a plurality of second light-guiding parts 132 B arranged in a ring.
  • the plurality of first light-guiding part 131 B can be optionally disposed inside or outside of the plurality of second light-guiding parts 132 B, and more second light-guiding parts can be optionally disposed in the light-guiding structure 130 B.
  • the outer periphery of the first light-guiding part 131 B can be optionally overlapped with the inner periphery of the second light-guiding part 132 B where the first light-guiding part 131 B is disposed inside the second light-guiding part 132 B, or vice versa.
  • FIG. 4 is a top view of a light-guiding structure 130 C in accordance with some embodiments of the present disclosure.
  • the light-guiding structure 130 C comprises an inner light-guiding bar 131 C serving as the first light-guiding part in the dielectric layer 101 over the semiconductive layer 111 and an outer light-guiding bar 132 C serving as the second light-guiding part in the dielectric layer 102 over the semiconductive layer 111 .
  • the light-guiding bar 131 C can be optionally disposed inside or outside of the light-guiding bar 132 C, and more light-guiding bars can be optionally disposed in the light-guiding structure 130 C.
  • the outer periphery of the inner light-guiding bar can be optionally overlapped with the inner periphery of the outer light-guiding bar.
  • each of the light-guiding bars 131 C can be further laterally divided into serval parts; similarly, each of the light-guiding bars 132 C can be further laterally divided into serval parts.
  • the light-guiding bars 131 C can be optionally connected to form an integral rectangular light-guiding ring, and the light-guiding bars 132 C can be optionally connected to form an integral rectangular light-guiding ring.
  • the emitting light 81 from the sample-holding portion 23 can be more efficiently directed to the light-sensing region 55 in the optical sensing area 111 B.
  • the fabrication of the light-guiding structure 130 , the electrical interconnect structure 140 , and the multi junction photodiode of the light-sensing region 55 comply with the back-end-of-line (BEOL) metallization technology, and can be fabricated by the same fabrication process in the same die.
  • the light-guiding structure 130 , the electrical interconnect structure 140 , and the multi junction photodiode of the light-sensing region are integrated in the same die by the same fabrication process rather than in two separated devices. Thus, the size of the optical sensor 100 can be dramatically decreased.
  • FIG. 5 to FIG. 10 are cross-sectional views for preparing an optical sensor in accordance with some embodiments of the present disclosure.
  • the fabrication processes disclosed in FIG. 5 to FIG. 10 comply with the aluminum back-end-of-line (BEOL) metallization technology.
  • BEOL aluminum back-end-of-line
  • a light-sensing region 55 is formed in a semiconductive layer 111 , electronic devices 149 such as transistors are formed over an electrical circuit area 111 A, and an inter-layer dielectric layer 101 is then formed on the semiconductive layer 111 by deposition and planarization processes. Subsequently, lithographic, etching, deposition and planarization processes are performed to form electrical contacts 141 over the electrical circuit area 111 A and form first light-guiding parts 131 over the optical sensing area 111 B.
  • the electrical contact 141 and the first light-guiding part 131 include tungsten (W).
  • deposition, lithographic and etching processes are performed to form an electrical metal layer 143 over the electrical contact 141 and form a third light-guiding part 133 over the first light-guiding part 131 .
  • the electrical metal layer 143 and the third light-guiding part 133 include aluminum (Al).
  • an inter-metal dielectric layer 102 is formed on the inter-layer dielectric layer 101 by deposition and planarization processes.
  • the inter-metal dielectric layer 102 includes a lower portion 102 A formed by an HDP deposition process and an upper layer 102 B formed by a PECVD process.
  • lithographic, etching, deposition and planarization processes are performed to form electrical vias 142 over the electrical contacts 141 and form second light-guiding parts 132 over the first light-guiding parts 131 .
  • the electrical via 142 and the second light-guiding part 132 include tungsten (W).
  • a metal layer 147 having an opening 147 A is formed by fabrication processes including deposition, lithographic and etching processes, wherein the opening 147 A can be a rectangular opening.
  • the metal layer 147 serves as a light shielding layer, wherein the opening 147 A exposes the light sensing region 55 for receiving the light from the sample-holding portion 23 , while the metal layer 147 covers the other regions.
  • the metal layer 147 can serve as a contact pad for forming electrical connection to an external printed circuit board (PCB) by wire bonding.
  • the thickness of the metal layer 147 is larger than that of the metal layer below, and the thickness of the metal layer 147 is preferably larger than 4,000 angstroms.
  • dielectric deposition and planarization processes are performed to form a dielectric layer 106 on the metal layer 147 and fills the opening 147 A.
  • the dielectric deposition is a PECVD process
  • the planarization is an oxide CMP process.
  • the dielectric deposition includes a spin-on glass (SOG), SOG curing, SOG etching back, and a PECVD process.
  • the dielectric layer 106 includes silicon oxide or silicon nitride, and silicon nitride is preferred for absorbing background light having a wavelength of 488 nanometers.
  • a deposition process is performed to form a filter layer 119 over the inter-metal dielectric layer 105 .
  • deposition processes are performed to form a lower cladding layer 121 and a core layer 123 over the filter layer 119 ; subsequently, deposition, lithographic and etching processes are performed to an upper cladding layer 125 having a sample-holding portion 23 over the light sensing region 55 .
  • the refractive index of the core layer 123 is higher than that of the cladding layers 121 and 125 .
  • the filter layer 119 is transparent to the wavelength emitted from the specimen 231 , and the emitting light 81 from the sample-holding portion 23 travels through the filter layer 119 toward the light-sensing region 55 .
  • the lower cladding layer 121 , the core layer 123 , and the upper cladding layer 125 form a waveguide structure 120 .
  • the lower cladding layer 121 and the upper cladding layer 125 include oxide such as SiO 2 .
  • the core layer 123 includes dielectric such as Ta 2 O 5 or SiON.
  • the embodiment shown in FIG. 5 to FIG. 10 is characterized in integrally forming the light-guiding structure (first light-guiding part, second light-guiding part, third light-guiding part) and the electrical interconnect structure (electrical contact, electrical via, electrical metal layer), i.e., substantially by the same fabrication process and the same material simultaneously, and the corresponding elements of the light-guiding structure and the electrical interconnect structure have substantially the same physical and chemical properties.
  • integrally forming the light-guiding structure and the electrical interconnect structure not only decreases the fabrication cost, but also simplify the fabrication process.
  • FIG. 11A is a cross-sectional view of an optical sensor 200 in accordance with some embodiments of the present disclosure.
  • the optical sensor 200 comprises a semiconductive layer 111 comprising an electrical circuit area 111 A and an optical sensing area 111 B, a sample-holding portion 23 over the optical sensing area 111 B, an electrical interconnect structure 240 including at least one electrical contact 141 over the electrical circuit area 111 A, and a light-guiding structure 230 including at least one first light-guiding part 131 between the sample-holding portion 23 and the optical sensing area 111 A.
  • the electrical interconnect structure 240 is integrally formed with the light-guiding structure 230 .
  • the elements of the electrical interconnect structure 240 and the elements of the light-guiding structure 230 are formed substantially by the same fabrication process, and have substantially the same physical and chemical properties.
  • the first light-guiding part 131 is simultaneously formed with the electrical contact 141 substantially by the same fabrication process and the same material, and the first light-guiding part 131 and the electrical interconnect contact 141 have substantially the same physical and chemical properties.
  • the semiconductive layer 111 has a horizontal upper surface 112 , the at least one electrical contact 141 and the at least one first light-guiding part 131 extend substantially in a same horizontal plane, which is in parallel to and above the horizontal upper surface 112 , and the light-guiding structure 230 is configured to direct an emitting light 81 from the sample-holding portion 23 to the optical sensing area 111 A.
  • the optical sensor 200 comprises an inter-layer dielectric layer 101 and a plurality of inter-metal dielectric layers 202 - 205 , wherein the inter-layer dielectric layer 101 has the electrical contact 141 and the first light-guiding part 131 , while the inter-metal dielectric layers 202 - 205 have at least one electrical via 242 and at least one electrical metal layer 243 over the electrical circuit area 111 A, and at least one second light-guiding part 232 and at least one third light-guiding part 233 over the optical sensing area 111 B.
  • the light-guiding structure 230 can use the ring-shaped layout shown in FIG. 3 , the part layout in a ring shown in FIG. 4 , or the bar layout shown in FIG. 5 .
  • the third light-guiding part 233 is simultaneously formed with the electrical metal layer 243 substantially by the same fabrication process and the same material, and the third light-guiding part 233 and the electrical metal layer 243 have substantially the same physical and chemical properties.
  • the electrical metal layer 243 and the third light-guiding part 233 extend substantially in a same horizontal plane, which is in parallel to and above the horizontal upper surface 112 .
  • the upper ends of the electrical metal layer 243 and the third light-guiding part 233 are substantially at the same level, and the bottom ends of the electrical metal layer 243 and the third light-guiding part 233 are substantially at the same level, and they can be formed through the same fabrication processes.
  • the second light-guiding part 232 is simultaneously formed with the electrical via 242 substantially by the same fabrication process and the same material, and the second light-guiding part 232 and the electrical via 242 have substantially the same physical and chemical properties.
  • the electrical via 242 and the second light-guiding part 232 extend substantially in a same horizontal plane, which is in parallel to and above the horizontal upper surface 112 .
  • the upper ends of the electrical via 242 and the second light-guiding part 232 are substantially at the same level, and the bottom ends of the electrical via 242 and the second light-guiding part 232 are substantially at the same level, and they can be formed through the same fabrication processes.
  • the second light-guiding part 232 can be optionally implemented in some of the dielectric layers, rather than in all of the dielectric layers.
  • the horizontal distance between the second light-guiding parts 232 in the upper dielectric layer 205 is larger than that in the lower dielectric layer 203 ; in other words, the horizontal distance shrinks along a light-propagating direction from the sample-holding portion 23 to the light-sensing region 55 in the optical sensing area 111 B.
  • the light-guiding structure 230 extends vertically or in a tilt manner from the horizontal upper surface 112 of the semiconductive layer 111 .
  • the light-sensing region 55 is electrically connected to the electrical interconnect structure 240 through conductor so as to transfer the charge carriers generated in the light sensing region 55 to the electrical circuitry in the electrical interconnect structure 240 for further signal processing and/or output to signal-processing electronics, such as a DSP or microprocessor.
  • signal-processing electronics such as a DSP or microprocessor.
  • FIG. 11B is a cross-sectional view of an optical sensor 200 ′ in accordance with some embodiments of the present disclosure.
  • the optical sensor 200 ′ shown in FIG. 11B is substantially the same as the optical sensor 200 shown in FIG. 11A , except the design of the light-guiding structure.
  • the width of the light-guiding structure 230 is larger in the upper region (close to the sample-holding portion 23 ) than that in the bottom region (close to the light-sensing region 55 ); in contrast, in FIG. 11B , the width of the light-guiding structure 230 ′ is larger in the bottom region (close to the light-sensing region 55 ) than that in the upper region (close to the sample-holding portion 23 ).
  • FIG. 11C is a cross-sectional view of an optical sensor 200 ′′ in accordance with some embodiments of the present disclosure.
  • the optical sensor 200 ′′ shown in FIG. 11C is substantially the same as the optical sensor 200 shown in FIG. 11A , except the design of the light-guiding structure.
  • the width of the light-guiding structure 230 is larger in the upper region (close to the sample-holding portion 23 ) than that in the bottom region (close to the light-sensing region 55 ); in contrast, in FIG. 11C , the width of the light-guiding structure 230 ′′ in the bottom region (close to the light-sensing region 55 ) is substantially the same as that in the upper region (close to the sample-holding portion 23 ).
  • the inner sidewall of the light-guiding structure 230 ′′ is substantially vertical to the horizontal upper surface 112 .
  • the emitting light 81 from the sample-holding portion 23 can be more efficiently directed to the light-sensing region 55 in the optical sensing area 111 B.
  • the fabrication of the light-guiding structure 230 , the electrical interconnect structure 240 and the multi junction photodiode of the light-sensing region 55 comply with the back-end-of-line (BEOL) metallization technology, and can be fabricated by the same fabrication process in the same die.
  • the light-guiding structure 230 , the electrical interconnect structure 240 , and the multi junction photodiode of the light-sensing region 55 are integrated in the same die by the same fabrication process rather than in two separated devices. Thus, the size of the optical sensor 200 can be dramatically decreased.
  • FIG. 12 to FIG. 17 are cross-sectional views for preparing an optical sensor in accordance with some embodiments of the present disclosure.
  • the fabrication processes disclosed in FIG. 12 to FIG. 17 comply with the copper back-end-of-line (BEOL) metallization technology.
  • BEOL copper back-end-of-line
  • a light-sensing region 55 is formed in a semiconductive layer 111 , electronic devices 149 such as transistors are formed over an electrical circuit area 111 A, and an inter-layer dielectric layer 101 is then formed on the semiconductive layer 111 by deposition and planarization processes. Subsequently, lithographic, etching, deposition and planarization processes are performed to form electrical contacts 141 over the electrical circuit area 111 A and form first light-guiding parts 131 over the optical sensing area 111 B.
  • deposition, lithographic and etching processes are performed to form an inter-metal dielectric layer 202 having an aperture 2021 A and an aperture 2021 B, which expose the first light-guiding part 131 over the electrical circuit area 111 A and the electrical contact 141 over the optical sensing area 111 B.
  • deposition and planarization processes are performed to form at least one electrical metal layer 243 in the aperture 2021 A over the electrical contact 141 and form at least one third light-guiding part 233 in the aperture 2021 B over the first light-guiding part 131 .
  • the electrical metal layer 243 and the third light-guiding part 233 include copper (Cu).
  • deposition, lithographic and etching processes are performed to form an inter-metal dielectric layer 203 over the inter-metal dielectric layer 202 .
  • deposition and planarization processes are performed to form an electrical via 242 over the electrical contact 141 and form a second light-guiding part 232 over the first light-guiding part 131 .
  • the electrical metal layer 243 and the third light-guiding part 233 include copper (Cu).
  • a metal layer 147 having an opening 147 A is formed by fabrication processes including deposition, lithographic and etching processes, wherein the opening 147 A can be a rectangular opening.
  • the metal layer 147 serves as a light shielding layer, wherein the opening 147 A exposes the light sensing region 55 for receiving the light from the sample-holding portion 23 , while the metal layer 147 covers the other regions.
  • the metal layer 147 can serve as a contact pad for forming electrical connection to an external printed circuit board (PCB) by wire bonding.
  • the thickness of the metal layer 147 is larger than that of the metal layer below, and the thickness of the metal layer 147 is preferably larger than 4,000 angstroms.
  • dielectric deposition and planarization processes are performed to form a dielectric layer 106 on the metal layer 147 and fills the opening 147 A.
  • the dielectric deposition is a PECVD process
  • the planarization is an oxide CMP process.
  • the dielectric deposition includes a spin-on glass (SOG), SOG curing, SOG etching back, and a PECVD process.
  • the dielectric layer 106 includes silicon oxide or silicon nitride, and silicon nitride is preferred for absorbing background light having a wavelength of 488 nanometers.
  • a deposition process is performed to form a filter layer 119 over the inter-metal dielectric layer 205 .
  • deposition processes are performed to form a lower cladding layer 121 and a core layer 123 over the filter layer 119 ; subsequently, deposition, lithographic and etching processes are performed to an upper cladding layer 125 having a sample-holding portion 23 over the light sensing region 55 .
  • the filter layer 119 is transparent to the wavelength emitted from the specimen 231 , and the emitting light 81 from the sample-holding portion 23 travels through the filter layer 119 toward the light-sensing region 55 .
  • the lower cladding layer 121 , the core layer 123 , and the upper cladding layer 125 form a waveguide structure 120 .
  • the lower cladding layer 121 and the upper cladding layer 125 include oxide such as SiO 2 .
  • the core layer 123 includes dielectric such as Ta 2 O 5 or SiON.
  • the embodiment shown in FIG. 12 to FIG. 17 is characterized in integrally forming the light-guiding structure (first light-guiding part, second light-guiding part, third light-guiding part) and the electrical interconnect structure (electrical contact, electrical via, electrical metal layer), i.e., substantially by the same fabrication process and the same material simultaneously, and the corresponding elements of the light-guiding structure and the electrical interconnect structure have substantially the same physical and chemical properties.
  • integrally forming the light-guiding structure and the electrical interconnect structure not only decreases the fabrication cost, but also simplify the fabrication process.
  • FIG. 18A is a cross-sectional view of an optical sensor 300 in accordance with some embodiments of the present disclosure.
  • the optical sensor 300 comprises a semiconductive layer 111 having an optical sensing area 111 B, a sample-holding portion 23 over the optical sensing area 111 B, and a light-guiding structure 330 configured to direct an emitting light 81 from the sample-holding portion 23 to the optical sensing area 111 B.
  • the light-guiding structure 330 comprises at least one light-guiding spacer 331 and extends from a horizontal upper surface 112 of the semiconductive layer 111 , and the light-guiding structure 330 has a tapering top end 332 near the sample-holding portion 23 .
  • the optical sensor 100 has a plurality of dielectric layers 101 - 105 over the optical sensing area 111 B, and the light-guiding spacer 331 is a wall extending from the horizontal upper surface 112 of the semiconductive layer 111 through the plurality of dielectric layers 101 - 105 .
  • the light-guiding spacer 331 can optionally extend vertically or in a tilt manner from the horizontal upper surface 112 through the plurality of dielectric layers 101 - 105 .
  • the light-guiding structure 330 can use the ring-shaped layout shown in FIG. 3 , the part layout in a ring shown in FIG. 4 , or the bar layout shown in FIG. 5 .
  • FIG. 18B is a cross-sectional view of an optical sensor 300 ′ in accordance with some embodiments of the present disclosure.
  • the optical sensor 300 ′ shown in FIG. 18B is substantially the same as the optical sensor 300 shown in FIG. 18A , except the design of the light-guiding structure.
  • the sidewall 331 of the light-guiding structure 330 ′ is tilted with respect to the semiconductive layer 111 , wherein the included angle ( ⁇ ) between the horizontal upper surface 112 of the semiconductive layer 111 and the sidewall 331 of the light-guiding structure 330 ′ is about 60 degrees to 89.5 degrees.
  • the emitting light 81 from the sample-holding portion 23 can be more efficiently directed to the light-sensing region 55 in the optical sensing area 111 B. Furthermore, the fabrication of the light-guiding structure 330 complies with the back-end-of-line (BEOL) metallization technology, and can be fabricated by the same fabrication process in the same die as the electrical interconnected structure 140 and the multi junction photodiode of the light-sensing region 55 .
  • BEOL back-end-of-line
  • the light-guiding structure 130 , the electrical interconnect structure 140 and the multi junction photodiode of the light-sensing region 55 are integrated in the same die by the same fabrication process rather than in two separated devices.
  • the size of the optical sensor 300 can be dramatically decreased.
  • FIG. 19 to FIG. 23 are cross-sectional views for preparing an optical sensor in accordance with some embodiments of the present disclosure.
  • the fabrication processes disclosed in FIG. 19 to FIG. 23 comply with both the aluminum back-end-of-line (BEOL) metallization technology and the copper back-end-of-line (BEOL) metallization technology.
  • BEOL aluminum back-end-of-line
  • BEOL copper back-end-of-line
  • a light-sensing region 55 is formed in a semiconductive layer 111 , and electronic devices 149 such as transistors are formed over an electrical circuit area 111 A. Subsequently, lithographic, etching, deposition and planarization processes are performed to form an electrical interconnect structure 140 having electrical contacts 141 , electrical metal layers 143 , and electrical vias 142 over an electrical circuit area 111 A of the semiconductive layer 111 .
  • lithographic and etching processes are performed to form an aperture 301 over the light-sensing region 55 in the optical sensing area 111 B.
  • a metal disposition process is performed to form a metal layer 302 on the sidewall of the aperture 301 and the upper surface of the dielectric layer 105 .
  • a metal etching back process is performed to remove a portion of the metal layer 302 to form a metal spacer on the sidewall of the aperture 301 .
  • dielectric deposition and planarization processes are performed to form a dielectric layer 303 filling the aperture 301 .
  • the dielectric layer 303 includes dielectric such as silicon oxide or silicon nitride, and silicon nitride is preferred for absorbing background light having a wavelength of 488 nanometers.
  • a metal layer 147 having an opening 147 A is formed by fabrication processes including deposition, lithographic and etching processes, wherein the opening 147 A can be a rectangular opening.
  • the metal layer 147 serves as a light shielding layer, wherein the opening 147 A exposes the light sensing region 55 for receiving the light from the sample-holding portion 23 , while the metal layer 147 covers the other regions.
  • the metal layer 147 can serve as a contact pad for forming electrical connection to an external printed circuit board (PCB) by wire bonding.
  • the thickness of the metal layer 147 is larger than that of the metal layer below, and the thickness of the metal layer 147 is preferably larger than 4,000 angstroms.
  • dielectric deposition and planarization processes are performed to form a dielectric layer 304 on the metal layer 147 and fills the aperture 301 and the opening 147 A.
  • the dielectric deposition is a PECVD process
  • the planarization is an oxide CMP process.
  • the dielectric deposition includes a spin-on glass (SOG), SOG curing, SOG etching back, and a PECVD process.
  • the dielectric layer 304 includes dielectric such as silicon oxide or silicon nitride, and silicon nitride is preferred for absorbing background light having a wavelength of 488 nanometers.
  • a deposition process is performed to form a filter layer 119 over the inter-metal dielectric layer 105 .
  • deposition processes are performed to form a lower cladding layer 121 and a core layer 123 over the filter layer 119 ; subsequently, deposition, lithographic and etching processes are performed to an upper cladding layer 125 having a sample-holding portion 23 over the light sensing region 55 .
  • the filter layer 119 is transparent to the wavelength emitted from the specimen 231 , and the emitting light 81 from the sample-holding portion 23 travels through the filter layer 119 toward the light-sensing region 55 .
  • the lower cladding layer 121 , the core layer 123 , and the upper cladding layer 125 form a waveguide structure 120 .
  • the lower cladding layer 121 and the upper cladding layer 125 include oxide such as SiO 2 .
  • the core layer 123 includes dielectric such as Ta 2 O 5 or SiON.
  • the optical sensor includes a semiconductive layer comprising an electrical circuit area and an optical sensing area, a sample-holding portion over the optical sensing area, a light-guiding structure between the sample-holding portion and the optical sensing area, and an electrical interconnect structure over the electrical circuit area.
  • the electrical interconnect structure is integrally formed with the light-guiding structure, and the light-guiding structure is configured to direct an emitting light from the sample-holding portion to the optical sensing area.
  • the optical sensor includes a semiconductive layer comprising an electrical circuit area and an optical sensing area, a sample-holding portion over the optical sensing area, at least one electrical contact over the electrical circuit area, and at least one first light-guiding part configured to direct an emitting light from the sample-holding portion to the optical sensing area.
  • the semiconductive layer has a horizontal upper surface, the at least one first light-guiding part is between the sample-holding portion and the optical sensing area, and the at least one electrical contact and the at least one first light-guiding part extend substantially in a same horizontal plane, which is in parallel to and above the horizontal upper surface.
  • the optical sensor includes a semiconductive layer comprising an optical sensing area, a sample-holding portion over the optical sensing area, and a light-guiding structure configured to direct an emitting light from the sample-holding portion to the optical sensing area.
  • the light-guiding structure comprises at least one light-guiding spacer and extends from a horizontal upper surface of the semiconductive layer, and the light-guiding structure has a tapering top end near the sample-holding portion.
  • the light-guiding structure is designed to prevent light scattering. Due to the design of the light-guiding structure, the emitting light from the sample-holding portion can be more efficiently directed to the light-sensing region in the optical sensing area. Furthermore, the fabrication of the light-guiding structure complies with the back-end-of-line (BEOL) metallization technology, and can be fabricated by the same fabrication process in the same die as the electrical interconnected structure and the multi junction photodiode of the light-sensing region. In addition, the light-guiding structure, the electrical interconnect structure and the multi junction photodiode of the light-sensing region are integrated in the same die by the same fabrication process rather than in two separated devices. Thus, the size of the optical sensor can be dramatically decreased.
  • BEOL back-end-of-line

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EP3045896A1 (de) 2016-07-20
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CN105810701A (zh) 2016-07-27
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JP2016133510A (ja) 2016-07-25
US11362223B2 (en) 2022-06-14
US20200066926A1 (en) 2020-02-27
AU2016200223B2 (en) 2017-02-09
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JP2018054623A (ja) 2018-04-05
KR101994331B1 (ko) 2019-09-30

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