US20150357438A1 - Method for manuracturing pillar-shaped semiconductor device - Google Patents
Method for manuracturing pillar-shaped semiconductor device Download PDFInfo
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- US20150357438A1 US20150357438A1 US14/680,420 US201514680420A US2015357438A1 US 20150357438 A1 US20150357438 A1 US 20150357438A1 US 201514680420 A US201514680420 A US 201514680420A US 2015357438 A1 US2015357438 A1 US 2015357438A1
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
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- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
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- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
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- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
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- H01L21/823885—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of vertical transistor structures, i.e. with channel vertical to the substrate surface
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- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
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- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42372—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out
- H01L29/42376—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the conducting layer, e.g. the length, the sectional shape or the lay-out characterised by the length or the sectional shape
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
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- H01L29/772—Field effect transistors
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Definitions
- the present invention relates to a method for manufacturing a pillar-shaped semiconductor device.
- SGTs surrounding gate MOS transistors
- a typical planar MOS transistor has a channel extending in a horizontal direction along an upper surface of a semiconductor substrate.
- the channel of an SGT extends in a direction perpendicular to an upper surface of a semiconductor substrate (for example, refer to PTL 1 and NPL 1).
- SGTs help increase the density of semiconductor devices.
- FIG. 10 is a schematic diagram of an N-channel SGT.
- An N + region 101 a and an N + region 101 b (hereinafter a semiconductor region having a high donor impurity concentration is referred to as an “N + region”) are respectively formed in an upper portion and a lower portion of a Si pillar 100 having a P-type or i(intrinsic)-type conductivity (hereinafter a silicon semiconductor pillar is referred to as “Si pillar”).
- Si pillar silicon semiconductor pillar
- the Si pillar 100 that lies between the N + region 101 a and N + region 101 b serving as a source and a drain is a channel region 102 .
- a gate insulating layer 103 is formed so as to surround the channel region 102 and a gate conductor layer 104 is formed so as to surround the gate insulating layer 103 .
- the N + regions 101 a and 101 b serving as a source and a drain, the channel region 102 , the gate insulating layer 103 , and the gate conductor layer 104 are formed within a single Si pillar 100 . Accordingly, the area of the SGT in plan view corresponds to the area of a single source or drain N + region of a planar MOS transistor.
- a circuit chip that includes SGTs is smaller than a circuit chip that includes planar MOS transistors.
- FIG. 11 is a schematic diagram of a CMOS inverter circuit in which an N channel SGT 116 a is formed in a lower portion of the Si pillar 115 and a P channel SGT 116 b is formed above the N channel SGT 116 a.
- the Si pillar 115 is formed on a P layer substrate 117 (hereinafter, a semiconductor layer containing an acceptor impurity is referred to as a “P layer”).
- a SiO 2 layer 118 is formed at the outer periphery of the Si pillar 115 and on the P layer substrate 117 .
- a gate insulating layer 119 a of the N channel SGT 116 a and a gate insulating layer 119 b of the P channel SGT 116 b are formed so as to surround the Si pillar 115 .
- a gate conductor layer 120 a of the N channel SGT 116 a and a gate conductor layer 120 b of the P channel SGT 116 b are formed at the outer periphery of the Si pillar 115 so as to surround the gate insulating layers 119 a and 119 b.
- An N + region 121 a is formed in a surface layer portion of the P layer substrate 117 connected to the bottom portion of the Si pillar 115 , an N + region 121 b is formed at the center of the Si pillar 115 , a P + region 122 a (hereinafter a semiconductor region having a high acceptor impurity concentration is referred to as a “P + region”) is formed within the Si pillar 115 connected to the N + region 121 b, and a P + region 122 b is formed in a top portion of the Si pillar 115 .
- the N + region 121 a is a source of the N channel SGT 116 a and the N + region 121 b is a drain of the N channel SGT 116 a.
- the Si pillar 115 that lies between the N + regions 121 a and 121 b is a channel region 123 a of the N channel SGT 116 a.
- the P + region 122 b is a source of the P channel SGT 116 b and the P + region 122 a is a drain of the P channel SGT 116 b.
- the Si pillar 115 that lies between the P + regions 122 a and 122 b is a channel region 123 b of the P channel SGT 116 b.
- a nickel silicide layer (NiSi layer) 125 a is formed in the surface layer portion of the N + region 121 a connected to the bottom portion of the Si pillar 115 , a NiSi layer 125 b is formed at the outer peripheries of the N + region 121 b and the P + region 122 a located in the center portion of the Si pillar 115 , and a NiSi layer 125 c is formed in an upper surface layer of the P + region 122 b in the top portion of the Si pillar 115 .
- a ground wiring metal layer 126 a is formed so as to connect to the NiSi layer 125 a in the N + region 121 a.
- the ground wiring metal layer 126 a is connected to a ground terminal VSS.
- an output wiring metal layer 126 b is formed so as to connect to the NiSi layer 125 b.
- the output wiring metal layer 126 b is connected to an output terminal Vo.
- a power supply wiring metal layer 126 c is formed so as to connect to the NiSi layer 125 c.
- the power supply wiring metal layer 126 c is connected to a power supply terminal VDD.
- Input wiring metal layers 127 a and 127 b are formed so as to connect to the gate conductor layers 120 a and 120 b.
- the input wiring metal layers 127 a and 127 b are each connected to an input terminal Vi.
- the NiSi layer 125 b connected to the N + region 121 b and the P + region 122 a located in the center portion of the Si pillar 115 is formed by coating outer peripheral surfaces of the N + region 121 b and the P + region 122 a with a nickel (Ni) film, performing a heat treatment at about 450° C., for example, and removing the Ni film remaining on the surfaces.
- the NiSi layer 125 b is formed so as to extend from the outer peripheries of the N + region 121 b and the P + region 122 a toward the interior.
- the NiSi layer 125 b is preferably formed to have a thickness of about 5 nm to 10 nm.
- the NiSi layer 125 b occupies the entire cross section of the Si pillar 115 .
- the linear thermal expansion coefficient of NiSi is 12 ⁇ 10 ⁇ 6 /K, which is five times the linear thermal expansion coefficient of Si which is 2.4 ⁇ 10 ⁇ 6 /K.
- NPL 1 Hiroshi Takato, Kazumasa Sunouchi, Naoko Okabe, Akihiro Nitayama, Katsuhiko Hieda, Fumio Horiguchi, and Fujio Masuoka: IEEE Transaction on Electron Devices, Vol. 38, No. 3, pp. 573-578 (1991)
- NPL 2 Tadashi Shibata, Susumu Kohyama and Hisakazu Iizuka: “A New Field Isolation Technology for High Density MOS LSI”, Japanese Journal of Applied Physics, Vol. 18, pp. 263-267 (1979)
- NPL 3 C. Y. Ting, V. J. Vivalda, and H. G. Schaefer: “Study of planarized sputter-deposited SiO 2′′ J. Vac. Sci. Technol, 15(3), May/June (1978)
- an SGT-including pillar-shaped semiconductor device illustrated in FIG. 11 requires a technique of securely and easily forming the output wiring metal layer 126 b at the side surface of the Si pillar 115 and the N + region 121 b and the P + region 122 a at the center portion of the Si pillar 115 without causing bending or collapsing of the Si pillar 115 . Furthermore, a technique of securely and easily forming a connection between the gate conductor layer 120 a and the input wiring metal layer 127 a and the gate conductor layer 120 b and the input wiring metal layer 127 b at the side surface of the Si pillar 115 is also required.
- An aspect of the present invention provides a method for manufacturing a pillar-shaped semiconductor device, the method comprising:
- an interlayer insulating layer forming step including at least one selected from a third insulating layer forming step of forming a third insulating layer having an upper surface positioned near a lower end of the first impurity region and a fourth insulating layer forming step of forming a fourth insulating layer having an upper surface positioned at a side surface of the conductive layer in a middle position in a height direction;
- a side surface contact portion forming step including at least one selected from an impurity region side surface contact portion forming step of forming an impurity region side surface contact portion by etching-away the first insulating layer, the conductive layer, and the second insulating layer in a portion positioned at an outer periphery of a side surface of the first impurity region above the upper surface of the third insulating layer and a conductive layer side surface contact portion forming step of forming a conductive layer side surface contact portion by etching-away the second insulating layer in a portion positioned at the outer periphery of the conductive layer above the upper surface of the fourth insulating layer;
- a material layer depositing step including at least one selected from a step of forming a first material layer on the third insulating layer so that the impurity region side surface contact portion forms a space and an upper surface of the first material layer is positioned near an upper end portion of the impurity region side surface contact portion and a step of forming a second material layer on the fourth insulating layer so that the conductive layer side surface contact portion forms a space and an upper surface of the second material layer is positioned to be higher than an upper end of the conductive layer side surface contact portion, these steps being performed by injecting an atom group in a direction perpendicular to an upper surface of the semiconductor substrate from above the semiconductor pillar, the atom group containing atoms constituting at least a conductive material; and
- the heat treatment step includes a material layer connecting step that includes at least one selected from a step of expanding the first material layer so as to connect to the side surface of the first impurity region and a step of expanding the second material layer so as to connect to the side surface of the conductive layer.
- the method further comprises a second impurity region forming step of forming a second impurity region in a lower portion and/or an upper portion of the semiconductor pillar, the second impurity region having the same conductivity type as each impurity layer constituting the first impurity region,
- a surrounding gate MOS transistor SGT is formed in which when one of the first impurity region and the second impurity region serves as a source, the other serves as a drain, the first insulating layer serves as a gate insulating layer, and the first conductive layer serves as a gate conductor layer.
- SGT surrounding gate MOS transistor
- At least one selected from the first material layer and the second material layers is composed of a semiconductor material
- the method further comprises a first metal material layer forming step of forming a metal-containing first metal material layer so as to contact at least one selected from an upper surface and a lower surface of the first material or the second material layer composed of the semiconductor material, and
- the heat treatment is performed to diffuse metal atoms from the first metal material layer into at least one selected from the first material layer and the second material layer so as to form a first alloy layer and the material layer connecting step is performed by expanding the first alloy layer.
- the method further comprises a second metal material layer forming step of forming a second metal material layer by causing at least one selected from the first material layer and the second material layer to contain a metal, wherein, in the heat treatment step, the heat treatment is performed so as to plastically deform and expand the second metal material layer to carry out the material layer connecting step.
- a second alloy layer having the same composition as the first alloy layer is formed in a side surface layer of the first impurity region.
- a third alloy layer having the same composition as the first alloy layer is formed so as to penetrate the first impurity region in a horizontal direction.
- a fourth alloy layer containing metal atoms contained in the second metal material layer is formed in a part of the first impurity region.
- the method further comprises a semiconductor material layer forming step of forming a semiconductor material layer so as to surround the outer periphery of the first impurity region at the impurity region side surface contact portion,
- the heat treatment is performed so as to connect the first material layer to a side surface of the semiconductor material layer by expanding the first material layer.
- an SGT-including semiconductor device it becomes possible to suppress bending and collapsing of a semiconductor pillar that occur when an alloy layer is formed in a metal wiring layer electrically connected to a semiconductor region or a gate conductor layer present in a central portion of the semiconductor pillar. Furthermore, The connection between the semiconductor region or gate conductor layer and the wiring metal layer connected to the alloy layer can be securely established.
- FIG. 1 AA is a plan view
- FIG. 1 AB and FIG. 1 AC are cross-sectional views of a CMOS inverter circuit for explaining a method for manufacturing an SGT-including semiconductor device according to a first embodiment of the present invention.
- FIG. 1 BA is a plan view
- FIG. 1 BB and FIG. 1 BC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 1 CA is a plan view
- FIG. 1 CB and FIG. 1 CC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 1 DA is a plan view
- FIG. 1 DB and FIG. 1 DC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 1 EA is a plan view
- FIG. 1 EB and FIG. 1 EC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 1 FA is a plan view
- FIG. 1 FB and FIG. 1 FC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 1 GA is a plan view
- FIG. 1 GB and FIG. 1 GC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 1 HA is a plan view
- FIG. 1 HB and FIG. 1 HC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 1 IA is a plan view
- FIG. 1 IB and FIG. 1 IC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 1 JA is a plan view
- FIG. 1 JB and FIG. 1 JC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 1 KA is a plan view
- FIG. 1 KB and FIG. 1 KC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 1 LA is a plan view
- FIG. 1 LB and FIG. 1 LC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 2 AA is a plan view
- FIG. 2 AB and FIG. 2 AC are cross-sectional views of a CMOS inverter circuit for explaining a method for manufacturing an SGT-including semiconductor device according to a second embodiment of the present invention.
- FIG. 2 BA is a plan view
- FIG. 2 BB and FIG. 2 BC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the second embodiment.
- FIG. 3 AA is a plan view
- FIG. 3 AB and FIG. 3 AC are cross-sectional views of a CMOS inverter circuit for explaining a method for manufacturing an SGT-including semiconductor device according to a third embodiment of the present invention.
- FIG. 4 AA is a plan view
- FIG. 4 AB and FIG. 4 AC are cross-sectional views of a CMOS inverter circuit for explaining a method for manufacturing an SGT-including semiconductor device according to a fourth embodiment of the present invention.
- FIG. 4 BA is a plan view
- FIG. 4 BB and FIG. 4 BC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the fourth embodiment.
- FIG. 5 AA is a plan view
- FIG. 5 AB and FIG. 5 AC are cross-sectional views of a CMOS inverter circuit for explaining a method for manufacturing an SGT-including semiconductor device according to a fifth embodiment of the present invention.
- FIG. 5 BA is a plan view
- FIG. 5 BB and FIG. 5 BC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the fifth embodiment.
- FIG. 5 CA is a plan view
- FIG. 5 CB and FIG. 5 CC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the fifth embodiment.
- FIG. 6 AA is a plan view
- FIG. 6 AB and FIG. 6 AC are cross-sectional views of a CMOS inverter circuit for explaining a method for manufacturing an SGT-including semiconductor device according to a sixth embodiment of the present invention.
- FIG. 7 AA is a plan view
- FIG. 7 AB and FIG. 7 AC are cross-sectional views of a CMOS inverter circuit for explaining a method for manufacturing an SGT-including semiconductor device according to a sixth embodiment of the present invention.
- FIG. 8 AA is a plan view
- FIG. 8 AB and FIG. 8 AC are cross-sectional views of a CMOS inverter circuit for explaining a method for manufacturing an SGT-including semiconductor device according to an eighth embodiment of the present invention.
- FIG. 8 BA is a plan view
- FIG. 8 BB and FIG. 8 BC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the eighth embodiment.
- FIG. 9 AA is a plan view
- FIG. 9 AB and FIG. 9 AC are cross-sectional views of a CMOS inverter circuit for explaining a method for manufacturing an SGT-including semiconductor device according to a ninth embodiment of the present invention.
- FIG. 9 BA is a plan view
- FIG. 9 BB and FIG. 9 BC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the ninth embodiment.
- FIG. 9 CA is a plan view
- FIG. 9 CB and FIG. 9 CC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the ninth embodiment.
- FIG. 9 DA is a plan view
- FIG. 9 DB and FIG. 9 DC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the ninth embodiment.
- FIG. 10 is a schematic view of a conventional SGT.
- FIG. 11 is a schematic view of a CMOS inverter circuit in which an N-channel SGT is formed in a lower portion and a P-channel SGT is formed in an upper portion of one Si pillar according to a conventional example.
- FIGS. 1A to 1L A method for manufacturing an SGT-including CMOS inverter circuit according to a first embodiment of the present invention is described below with reference to FIGS. 1A to 1L .
- FIG. 1A includes a plan view and cross-sectional views illustrating a first step of the SGT-including CMOS inverter circuit.
- Part (a) is a plan view
- part (b) is a cross-sectional view taken along line X-X′ in (a)
- part (c) is a cross-sectional view taken along line Y-Y′ in (a).
- the relationship between the diagrams in part (a), part (b), and part (c) is the same for other drawings referred in the description below.
- an N + region 2 containing a donor impurity such as arsenic (As) is formed on an i-layer substrate 1 by an ion implantation method or an epitaxial growth method.
- a P + region 3 containing an acceptor impurity such as boron (B) is formed on the N + region 2 by an ion implantation method or an epitaxial growth method.
- An i-region 4 is formed on the P + region 3 by an epitaxial growth method.
- a SiO 2 layer 5 is formed on the i-region 4 by a thermal oxidation method.
- the SiO 2 layer 5 is etched by performing a lithography method and a reactive ion etching (RIE) method so as to form a SiO 2 layer 5 a.
- the i-region 4 , the P + region 3 , the N + region 2 , and the i-layer substrate 1 are then etched by a RIE method using the SiO 2 layer 5 a as a mask so as to form a Si pillar 6 that includes an i-region 4 a, a P + region 3 a, a N + region 2 a, and an i-layer substrate 1 a.
- the cross-sectional shape of the Si pillar 6 is preferably round as illustrated in FIG. 1 B(a).
- the side surface of the Si pillar 6 preferably forms a substantially right angle with the upper surface of the i-layer substrate 1 .
- an N + region 7 is formed in the upper surface layer of the i-layer substrate 1 at the outer periphery of the Si pillar 6 by an ion implantation method.
- a SiO 2 film is deposited by a chemical vapor deposition (CVD) method, the upper surface of the SiO 2 film is planarized by a mechanical chemical polishing (MCP) method, and the SiO 2 film is etched by an etch back method so as to have a SiO 2 layer 8 remain on the i-layer substrate 1 at the outer periphery of the Si pillar 6 .
- CVD chemical vapor deposition
- MCP mechanical chemical polishing
- an atomic layer deposition (ALD) method is employed to coat the entire Si pillar 6 and SiO 2 layer 8 with a hafnium oxide (HfO 2 ) layer 9 and a titanium nitride (TiN) layer 10 . Then the Si pillar 6 and the entire peripheral area of the Si pillar 6 are coated with a SiO 2 layer 11 by a CVD method.
- ALD atomic layer deposition
- the SiO 2 layer 11 and the TiN layer 10 are etched by a RIE method using a mask formed of a resist formed by a lithography method so as to form a SiO 2 layer 11 a and a TiN layer 10 a from the upper surface of the Si pillar 6 to the upper surface of the SiO 2 layer 8 .
- a silicon nitride (SiN) layer 12 is formed at the outer periphery of the Si pillar 6 .
- the SiN layer 12 is formed so that the position of its upper surface is at the same height as the lower end of the N + region 2 a formed in the Si pillar 6 .
- a resist layer 13 is formed on the SiN layer 12 .
- the resist layer 13 is formed so that the position of the upper surface is at the same height as the upper end of the P + region 3 a.
- the resist layer 13 is formed by applying a resist material over the entire upper surface of the i-layer substrate 1 and performing a heat treatment at 200° C., for example, so as to increase the flowability of the resist material and to allow the resist material to evenly collect on the SiN layer 12 on the outer side of the Si pillar 6 .
- hydrogen fluoride gas hereinafter referred to as “HF gas”
- HF gas hydrogen fluoride gas
- a heating environment of 180° C. is created so as to ionize the HF gas by the moisture contained in the resist layer 13 .
- HF ions hydrogen fluoride ions
- the HF ions thermally diffuse into the resist layer 13 and etch the SiO 2 layer 11 a in contact with the resist layer 13 (refer to NPL 2 for the mechanism of etching). In contrast, the SiO 2 layer 11 a not in contact with the resist layer 13 remains substantially unetched. Then the resist layer 13 is removed.
- the SiO 2 layer 11 a is divided into a SiO 2 layer 11 b in a region covered with the SiN layer 12 and a SiO 2 layer 11 c in an upper region of the Si pillar 6 .
- the TiN layer 10 a is etched by using the SiO 2 layers 11 b and 11 c as a mask.
- the TiN layer 10 a is divided into a TiN layer 10 b covered with the SiO 2 layer 11 b in the lower region of the Si pillar 6 and a TiN layer 10 c covered with the SiO 2 layer 11 c in the upper region of the Si pillar 6 .
- the HfO 2 layer 9 is etched by using the SiO 2 layers 11 b and 11 c and the TiN layers 10 b and 10 c as a mask so as to divide the HfO 2 layer 9 into a HfO 2 layer 9 a partly covered with the TiN layer 10 b in the lower region of the Si pillar 6 and a HfO 2 layer 9 b covered with the TiN layer 10 c in the upper region of the Si pillar 6 .
- exposed portions of the TiN layers 10 b and 10 c are oxidized to form TiO (titanium oxide) layers 14 a and 14 b.
- a substrate metal plate on which the i-layer substrate 1 is placed and a counter metal plate distant from the substrate metal plate are prepared, a DC voltage is applied to the substrate metal plate, and radiofrequency (RF) voltage is applied between these two parallel metal plates so as to sputter atoms of the material of the counter metal plate and deposit the atoms on the i-layer substrate 1 .
- This process is a bias sputtering method.
- the bias sputtering method is performed so as to inject Si atoms in a direction perpendicular to the upper surface of the i-layer substrate 1 and to form a Si layer 15 a on the SiN layer 12 and a Si layer 15 b on the Si pillar 6 .
- the Si layer 15 a is positioned so that the upper surface thereof is positioned near the upper end of an opening 21 a. Then Ni atoms are injected in a direction perpendicular to the upper surface of the i-layer substrate 1 so as to deposit a Ni layer 16 a on the Si layer 15 a and a Ni layer 16 b on the Si layer 15 b.
- a space 17 having a width (depth) in a horizontal direction equal to the total thickness of the SiO 2 layer 11 b, the TiN layer 10 b, and the HfO 2 layer 9 a or the total thickness of the SiO 2 layer 11 c, the TiN layer 10 c, and the HfO 2 layer 9 b is formed in the opening 21 a between the outer periphery of the N + region 2 a and the P + region 3 a and the Si layer 15 .
- the angle between the side surface of the Si pillar 6 and the upper surface of the i-layer substrate 1 is a substantially right angle and thus the Si layer 15 and the Ni layer 16 can be formed only on the SiN layer 12 by controlling the bias voltage applied between the counter metal plate of the bias sputtering system and the substrate metal plate on which the i-layer substrate 1 is placed (refer to NPL 3 for the basic control method). Then the Si layer 15 b and the Ni layer 16 b on the Si pillar 6 are removed.
- a heat treatment is performed at, for example, 550° C. to diffuse the Ni atoms in the Ni layer 16 a into the Si layer 15 a so as to form a nickel silicide (NiSi) layer 18 .
- the NiSi layer 18 expands and acquires a volume larger than that of the Si layer 15 a.
- the expansion of the NiSi layer 18 occurs in the vertical (up-down) and horizontal (right-left) directions. Accordingly, the side surface of the NiSi layer 18 comes into contact with the side surfaces of the N + region 2 a and the P + region 3 a. Then the remaining Ni layer 16 a is removed.
- the NiSi layer 18 is patterned by a lithography method and a RIE method so as to form a NiSi layer 18 a.
- a SiN layer 20 is formed by the same method as that for forming the SiN layer 12 so that the upper surface thereof is positioned in the middle of the TiN layer 10 c in the height direction. Then an opening 21 b is formed at the outer periphery of the TiN layer 10 c by the same method as that used for forming the opening 21 a. Then a Si layer and a Ni layer are formed by injecting Si and Ni atoms in a direction perpendicular to the upper surface of the i-layer substrate 1 by the same method as that used for forming the Si layer 15 a, for example, by a bias sputtering method.
- the Si layer is, for example, Ni-silicided by a heat treatment at 550° C., for example.
- a NiSi layer 22 is formed by a lithography method and a RIE method.
- the TiN layer 10 c comes into contact with the NiSi layer 22 in which the Si layer has expanded by Ni-silicidation.
- a SiO 2 layers 23 is formed over the entirety by a CVD method so that the upper surface thereof is positioned to be higher than the surface of the NiSi layer 22 and lower than the top portion of the Si pillar 6 . Then the SiO 2 layer 11 c, the TiN layer 10 c, the HfO 2 layer 9 b are etched by using the SiO 2 layer 23 as a mask so as to form a SiO 2 layer 11 d, a TiN layer 10 d, and a HfO 2 layer 9 c.
- a P + region 24 is formed in the top portion of the Si pillar 6 by a boron (B) ion implantation method by using the SiO 2 layers 23 and 11 d, the TiN layer 10 d, and the HfO 2 layer 9 c as a mask.
- a SiO 2 layer 27 is formed over the entirety by a CVD method. Then a lithography method and a RIE method are employed to form a contact hole 28 a on the TiN layer 10 b so as to penetrate the NiSi layer 22 , a contact hole 28 b on the top portion of the Si pillar 6 , a contact hole 28 c on the NiSi layer 18 a, and a contact hole 28 d on an N + region 7 a.
- an input wiring metal layer Vin electrically connected to the NiSi layer 22 and the TiN layer 10 b through the contact hole 28 a is formed and a power supply wiring metal layer Vdd electrically connected to the P + region 24 in the top portion of the Si pillar 6 through the contact hole 28 b is formed.
- An output wiring metal layer Vout electrically connected to the NiSi layer 18 a through the contact hole 28 c is formed and a ground wiring metal layer Vss electrically connected to an N + region 7 a through the contact hole 28 d is formed.
- a NiSi layer 29 is formed in the side surface layers of the N + region 2 a and the P + region 3 a in contact with the NiSi layer 18 a.
- a CMOS inverter circuit that includes an N-channel SGT and a P-channel SGT is formed, in which the N-channel SGT includes a channel which is the i-layer 1 a in the lower portion of the Si pillar 6 , a gate insulating layer which is the HfO 2 layer 9 a surrounding the outer periphery of the i-layer 1 a, a gate conductor layer which is the TiN layer 10 b surrounding the outer periphery of the HfO 2 layer 9 a, a source which is the N + region 7 a below the i-layer 1 a, and a drain which is the N + region 2 a on the i-layer 1 a and in which the P-channel SGT includes a channel which is the i-layer 4 a in the upper portion of the Si pillar 6 , a gate insulating layer which is the HfO 2 layer 9 c surrounding the outer periphery of the i-layer 4 a
- the NiSi layer 18 is connected to the the N + region 2 a and the P + region 3 a by performing a heat treatment at, for example, 550° C. so as to diffuse the Ni atoms in the Ni layer 16 a into the Si layer 15 to form a nickel silicide (NiSi) layer 18 and expand the NiSi layer 18 to be larger than the Si layer 15 a.
- a heat treatment at, for example, 550° C.
- connecting the NiSi layer 18 a to the N + region 2 a and the P + region 3 a need not be completed by a single treatment; it is sufficient if the NiSi layer 18 a becomes connected to the N + region 2 a and the P + region 3 a by performing a heat treatment two or more times in the steps illustrated in FIGS. 1G to 1L so that the NiSi layer 18 a is expanded before the last step of manufacturing the SGT.
- the remaining Ni layer 16 is preferably left unremoved.
- the method for manufacturing a CMOS inverter circuit according to the first embodiment has the following effects.
- a method for manufacturing an SGT-including CMOS inverter circuit according to a second embodiment of the present invention will now be described with reference to FIGS. 2A and 2B .
- a CMOS inverter circuit of the second embodiment is manufactured by the same steps as those illustrated in FIGS. 1A to 1L in the first embodiment except for the following structural differences.
- a Si layer 30 b the following step illustrated in FIG. 2A is performed by, for example, a bias sputtering method: Si atoms are injected in a direction perpendicular to the upper surface of the i-layer substrate 1 so as to form a Si layer 30 a on the SiN layer 12 and a Si layer 30 c on the Si pillar 6 , Ni atoms are then injected in a direction perpendicular to the upper surface of the i-layer substrate 1 so as to form a Ni layer 31 a on the Si layer 30 a and a Ni layer 31 b on the Si layer 30 c, and then Si atoms are injected in a direction perpendicular to the upper surface of the i-layer substrate 1 so as to form a Si layer 30 b on the Ni layer 31 a and a Si layer 30 d on the Ni layer 31 b.
- Si atoms are injected in a direction perpendicular to the upper surface of the i-layer substrate 1 so as to form a Si
- a space 17 a similar to the space 17 in FIG. 1G is formed between the N + region 2 a and the P + region 3 a and the Si layer 30 a, the Ni layer 31 a, and the Si layer 30 b.
- No Si layer or Ni layer is deposited on the side surface of the Si pillar 6 . Then the Si layer 30 c, the Ni layer 31 b, and the Si layer 30 d on the Si pillar 6 are removed.
- a heat treatment at, for example, 550° C. is performed to diffuse the Ni atoms from the Ni layer 31 a into the Si layers 30 a and 30 b so as to form a nickel silicide (NiSi) layer 32 by the method shown in FIG. 1H .
- the NiSi layer 32 expands and acquires a volume larger than that of the Si layers 30 a and 30 b. This expansion of the NiSi layer 32 occurs in the vertical (up-down) and horizontal (right-left) directions and thus the side surface of the NiSi layer 32 comes into contact with the side surfaces of the N + region 2 a and the P + region 3 a.
- volume of the Ni layer 31 a decreases as the Ni atoms diffuse into the Si layers 30 a and 30 b.
- the method for manufacturing a CMOS inverter circuit according to the second embodiment has the following effects.
- CMOS inverter circuit A method for manufacturing an SGT-including CMOS inverter circuit according to the third embodiment of the present invention is described below with reference to FIG. 3 .
- the CMOS inverter circuit of the third embodiment is manufactured by the same steps as those illustrated in FIGS. 1A to 1L of the first embodiment except for the structural differences described below.
- Ni atoms are injected in a direction perpendicular to the upper surface of the i-layer substrate 1 to form a Ni layer 19 a on the SiN layer 12 and a Ni layer 19 b on the Si pillar 6 , then Si atoms are injected in a direction perpendicular to the upper surface of the i-layer substrate 1 to form a Si layer 15 a on the Ni layer 19 a and a Si layer 15 b on the Ni layer 19 b, and then Ni atoms are injected in a direction perpendicular to the upper surface of the i-layer substrate 1 to form an Ni layer 16 a on the Ni layer 19 a and a Ni layer 16 b on the Si layer 15 b.
- a space 17 b similar to the space 17 in FIG. 1G is formed between the N + region 2 a and the P + region 3 a and the Ni layer 19 a, the Si layer 15 a, and the Ni layer 16 a.
- No Si layer or Ni layer is deposited on a side surface of the Si pillar 6 .
- the Ni layer 19 b, the Si layer 15 b, and the Ni layer 16 b on the Si pillar 6 are removed.
- a heat treatment at 550° C. is performed so that the Ni silicide layer formed by Ni-silicidation of the Si layer 15 a expands in the horizontal direction as illustrated in FIG. 2B so as to come into contact with side surfaces of the N + region 2 a and the P + region 3 a.
- the Ni layers 19 a and 16 a are formed above and below the Si layer 15 a. Accordingly, when a heat treatment is performed subsequently as illustrated in FIG. 2B , expansion occurs evenly in upward and downward directions centering about the height near the interface between the N + region 2 a and the P + region 3 a, thereby establishing connection to the N + region 2 a and the P + region 3 a. Therefore, the third embodiment achieves the same effect as the second embodiment.
- An SGT-including CMOS inverter circuit according to a fourth embodiment of the present invention is described below with reference to FIGS. 4A and 4B .
- a Si layer 30 a, a Ni layer 31 a, and a Si layer 30 b are formed on the SiN layer 12 by a bias sputtering method as illustrated in FIG. 2A while a Si layer 30 c, a Ni layer 31 b, and a Si layer 30 d are formed on the Si pillar 6 .
- a SiO 2 layer 33 a is formed on the Si layer 30 a and a SiO 2 layer 33 b is formed on the Si layer 30 d by a bias sputtering method.
- the Si layer 30 c, the Ni layer 31 b, the Si layer 30 d, and the SiO 2 layer 33 b on the Si pillar 6 are removed.
- a heat treatment at 550° C. is conducted by the method illustrated in FIG. 2B so as to diffuse the Ni atoms in the Ni layer 31 a into the Si layers 30 a and 30 b so as to form a NiSi layer 32 a.
- the NiSi layer 32 a expands and acquires a larger volume than the Si layers 30 a and 30 b.
- the SiO 2 layer 33 a on the NiSi layer 32 a suppresses expansion of the NiSi layer 32 a in the upward direction.
- the SiN layer 12 below the NiSi layer 32 a suppresses expansion of the NiSi layer 32 a in the downward direction.
- the SiO 2 layer 33 a and the SiN layer 12 above and below the NiSi layer 32 a promote expansion of the NiSi layer 32 a in the horizontal direction (capping effect) so that the side surface of the NiSi layer 32 a securely comes into contact with the side surfaces of the N + region 2 a and the P + region 3 a.
- expansion of the NiSi layer 32 a in the horizontal direction can be accelerated by the capping effect of the SiO 2 layer 33 a compared to the method (methods described with reference to FIGS. 1H , 2 B, and 3 , for example) in which an Ni-silicidation is performed without depositing the SiO 2 layer 33 a.
- the HfO 2 layers 9 a and 9 b, TiN layers 10 b and 10 c, and SiO 2 layers 11 b and 11 c surrounding the outer periphery of the Si pillar 6 are thick, the connection between the NiSi layer 32 a and the N + region 2 a and the P + region 3 a can be easily established even in a case where the N + region 2 a and the P + region 3 a are greatly distanced from the Si layer 30 a, the Ni layer 31 a, and the Si layer 30 b in the space 17 a.
- An SGT-including CMOS inverter circuit according to a fifth embodiment of the present invention is described below with reference to FIGS. 5A to 5C .
- Si and Ni atoms are injected in a direction perpendicular to the upper surface of the i-layer substrate 1 by, for example, a bias sputtering method illustrated in FIG. 2A so as to form a Si layer 30 a, a Ni layer 31 a, and a Si layer 30 b on the SiN layer 12 while forming a Si layer 30 c, a Ni layer 31 b, and a Si layer 30 d on the Si pillar 6 . Then the Si layer 30 c, the Ni layer 31 b, and the Si layer 30 d on the Si pillar 6 are removed.
- the Si layer 30 a, the Ni layer 31 a, and the Si layer 30 b are etched by a lithography method and a RIE method so as to form a Si layer 30 aa, a Ni layer 31 aa, and a Si layer 30 bb.
- the shapes of the Si layer 30 aa, the Ni layer 31 aa, and the Si layer 30 bb in plan view are the same as those illustrated in FIG. 1I .
- a space 17 a illustrated in FIG. 2A is formed between the N + region 2 a and the P + region 3 a and the Si layer 30 aa, the Ni layer 31 aa, and the Si layer 30 aa.
- a SiO 2 layer 35 is deposited so as to cover the entirety by, for example, a CVD method.
- a heat treatment at, for example, 550° C. is performed so as to diffuse the Ni atoms in the Ni layer 31 aa into the Si layers 30 aa and 30 bb so as to form a NiSi layer 36 .
- the NiSi layer 36 expands to have a volume larger than the Si layers 30 aa and 30 bb and comes into contact with the side surfaces of the N + region 2 a and the P + region 3 a.
- the SiO 2 layer 35 is formed so as to cover the upper surface and the side surface of the NiSi layer 36 , expansion of the NiSi layer 36 is suppressed in the regions contacting the SiO 2 layer 35 and the SiN layer 12 . Consequently, expansion of the side surface of the NiSi layer 36 facing the side surfaces of the N + region 2 a and the P + region 3 a is accelerated. As a result, connection between the NiSi layer 36 and the N + region 2 a and the P + region 3 a can be easily established.
- An SGT-including CMOS inverter circuit according to a sixth embodiment of the present invention is described below with reference to FIG. 6 .
- Ni—Si layers (hereinafter, a mixed layer containing Ni atoms and Si atoms is referred to as a “Ni—Si layer”) 37 a and 37 b on the SiN layer 12 and the Si pillar 6 , in which the Ni atom concentration in the Ni—Si layers 37 a and 37 b is higher than the Si atom concentration in the Ni—Si layers 37 a and 37 b.
- the Si layer 30 c, the Ni—Si layer 37 b, and the Si layer 30 d on the Si pillar 6 are removed.
- a heat treatment at, for example, 550° C. was performed so as to Ni-silicidize the Ni—Si layer 37 a and diffuse excess Ni atoms in the Ni—Si layer 37 a into the Si layers 30 a and 30 b so as to form a NiSi layer 32 as illustrated in FIG. 2B .
- voids sometimes occur in the NiSi layer 32 in portions where the Ni layer 31 a used to exist depending on the thickness, film quality, and silicidation conditions of the Ni layer 31 a.
- the portion where the Ni—Si layer 37 a used to exist is silicided first and thus occurrence of voids is prevented.
- An SGT-including semiconductor device according to a seventh embodiment of the present invention is described below with reference to FIG. 7 .
- the NiSi layer 18 a is in contact with the N + region 2 a and the P + region 3 a and Ni atoms from the NiSi layer 18 a diffuse so as to form a NiSi layer 38 that lies in the N + region 2 a and the P + region 3 a and penetrates the Si pillar 6 .
- the NiSi layer 38 is preferably formed at the outer periphery of the Si pillar 6 after forming the SiN layer 20 functioning as a material for preventing bending and collapsing of the Si pillar 6 .
- the NiSi layers 18 a, 32 , 32 a, and 36 are in contact with the outer peripheral side surfaces of the N + region 2 a and the P + region 3 a.
- a Ni silicide layer is formed in the surface layers of the N + region 2 a and the P + region 3 a.
- the NiSi layer 38 is formed so as to lie within the N + region 2 a and the P + region 3 a and penetrate the Si pillar 6 .
- the NiSi layer 38 is formed so as to spread from the outer peripheral portions of the N + region 2 a and the P + region 3 a toward the center portion, the donor and acceptor impurities in the N + region 2 a and the P + region 3 a are swept out from the NiSi layer 38 .
- the donor and acceptor impurity concentrations near the interfaces between the NiSi layer and the N + region 2 a and the P + region 3 a are increased. Consequently, the contact resistance between the NiSi layer 18 a and the N + region 2 a and the P + region 3 a can be decreased.
- FIGS. 8A and 8B An SGT-including semiconductor device according to an eighth embodiment of the present invention is described below with reference to FIGS. 8A and 8B .
- TiN layers 40 a and 40 b are formed instead of the Si layers 15 a and 15 b and SiO 2 layers 41 a and 41 b are formed instead of the Ni layers 16 a and 16 b by a bias sputtering method as illustrated in FIG. 1H .
- a space 17 is formed between the N + region 2 a and the P + region 3 a and the TiN layer 40 a and the SiO 2 layer 41 a.
- the TiN layer 40 b and the SiO 2 layer 41 b are removed and then a heat treatment at, for example, 650° C. is performed.
- a heat treatment at, for example, 650° C.
- the TiN layer 40 a undergoes plastic deformation and expands in the horizontal direction and a TiN layer 40 c after plastic deformation connects to the side surfaces of the N + region 2 a and the P + region 3 a.
- the TiN layer 40 a is sandwiched between the SiN layer 12 and the SiO 2 layer 41 a having different thermal expansion coefficients and thus stress-induced strain is increased.
- the TiN layer 40 c easily undergoes plastic deformation during which deformation in the upward direction is suppressed and expansion of the TiN layer 40 c in the horizontal direction is accelerated.
- the connection to the N + region 2 a and the P + region 3 a is easily established.
- the NiSi layer 18 which is a conductor layer, is being formed as a result of diffusion of Ni atoms from the Ni layer 16 a into the Si layer 15 a (Ni silicidation), the NiSi layer 18 expands in the horizontal direction and connects to the N + region 2 a and the P + region 3 a.
- the TiN layer 40 c undergoing plastic deformation by the heat treatment expands in the horizontal direction and connects to the N + region 2 a and the P + region 3 a as in the first embodiment.
- the eighth embodiment achieves the same effect as the first embodiment.
- FIGS. 9A to 9D An SGT-including semiconductor device according to an eighth embodiment of the present invention is described below with reference to FIGS. 9A to 9D .
- a CMOS inverter circuit according to the ninth embodiment is manufactured by the same steps as those illustrated in FIGS. 1A to 1L in the first embodiment except for the following structural differences.
- a poly Si layer 42 is formed to cover the entirety by, for example, a CVD method. As a result, a poly Si layer 42 that surrounds the outer peripheries of the N + region 2 a and the P + region 3 a is formed.
- Si and Ni atoms are injected in a direction perpendicular to the upper surface of the i-layer substrate 1 from above the Si pillar 6 so as to form a Si layer 43 and a Ni layer 44 on the SiN layer 12 .
- a space 17 b is formed between the Si layer 43 and the N + region 2 a and the P + region 3 a.
- the poly Si layer 42 in contact with the SiO 2 layer 11 c surrounding the Si pillar 6 is removed by using the Ni layer 44 as a mask so as to form a poly Si layer 42 a.
- a heat treatment at, for example, 550° C. is performed to diffuse the Ni atoms in the Ni layer 44 into a Si layer 43 .
- the NiSi layer 45 expands in the horizontal direction due to Ni-silicidation of the NiSi layer 45 and comes into contact with the poly Si layer 42 a formed on the side surfaces of the N + region 2 a and the P + region 3 a.
- the NiSi layer 45 is electrically connected to the N + region 2 a and the P + region 3 a.
- the NiSi layer 45 does not make direct contact with the N + region 2 a and the P + region 3 a but with the poly Si layer 42 a surrounding the N + region 2 a and the P + region 3 a.
- This poly Si layer 42 a serves as a reinforcing material that prevents bending and collapsing of the Si pillar 6 .
- the effect of preventing bending and collapsing of the Si pillar 6 is more effectively exhibited as the diameter of the Si pillar 6 decreases.
- Si and Ni atoms are injected in a direction perpendicular to the upper surface of the i-layer substrate 1 by a bias sputtering method so as to deposit the Si layers 15 a and 15 b and the Ni layers 16 a and 16 b on the SiN layer 12 and the top portion of the Si pillar 6 .
- the bias sputtering method used here involves applying radiofrequency voltage to the substrate electrode plate on which the i-layer substrate 1 is placed and a counter electrode plate distant from the i-layer substrate 1 while applying voltage to the substrate electrode plate so as to deposit Si atom ions, Ni atom ions, etc., over the i-layer substrate 1 .
- any method other than the bias sputtering method may be employed as long as the Si layer 15 a and the Ni layer 16 a can be formed by injecting Si and Ni atoms in a direction perpendicular to the upper surface of the i-layer substrate 1 .
- Such a method can also be used to connect the TiN layer 10 d to the NiSi layer 22 .
- this method is also applicable to other embodiments of the present invention.
- the Si layer 15 a and the Ni layer 16 a are formed and subjected to a heat treatment so as to diffuse Ni atoms in the Ni layer 16 a into the Si layer 15 a, thereby silicidizing the Si layer 15 a into the NiSi layer 18 .
- the NiSi layer 18 expands and connects to the N + region 2 a and the P + region 3 a which had been distant.
- Any other metal layer, such as titanium (Ti) or cobalt (Co) may be used instead of the Ni layer 16 a as long as metal atoms diffuse into the Si layer 15 a and the Si layer 15 a expands to form an alloy layer. This is also applicable to the connection between the TiN layer 10 d and the NiSi layer 22 . This is also applicable to other embodiments of the present invention.
- the Si layer 15 a and the Ni layer 16 a are formed and subjected to a heat treatment so as to diffuse Ni atoms in the Ni layer 16 a into the Si layer 15 a, thereby silicidizing the Si layer 15 a into the NiSi layer 18 .
- the NiSi layer 18 expands and connects to the N + region 2 a and the P + region 3 a which had been distant.
- any other material layer can be used as long as material atoms can be injected in a direction perpendicular to the upper surface of the i-layer substrate 1 so as to form a material layer including one or more conductor layers (semiconductor layers or conductor layers) on the i-layer substrate 1 and the alloyed conductor material layers can expand in the horizontal direction by the subsequent heat treatment so as to connect to the side surfaces of the N + region 2 a and the P + region 3 a.
- This is also applicable to the connection between the TiN layer 10 d and the NiSi layer 22 . This is also applicable to other embodiments of the present invention.
- a Si pillar 6 whose side surface forms a substantially right angle (about 90°) with the upper surface of the i-layer substrate 1 is formed, a Si layer 15 a and a Ni layer 16 a are formed on the SiN layer 12 , and a Si layer 15 b and a Ni layer 16 b are formed on the top of the Si pillar 6 . Because the angle formed between the side surface of the Si pillar 6 and the upper surface of the i-layer substrate 1 is a substantially right angle, deposition of Si and Ni atoms on the side surface of the SiO 2 layer 11 c surrounding the outer periphery of the Si pillar 6 is prevented.
- This angle at the side surface of the Si pillar 6 can be less than 90° as long as Si and Ni atoms do not deposit on the side surface of the SiO 2 layer 11 c surrounding the outer periphery of the Si pillar 6 .
- the bias voltage applied between the substrate electrode plate on which the i-layer substrate 1 is placed and the counter electrode plate distant from the i-layer substrate 1 is controlled so as to prevent deposition of Si and Ni atoms on the side surface of the SiO 2 layer 11 c (refer to NPL 3 for the basic procedure).
- Deposition of Si and Ni atoms on the side surface of the SiO 2 layer 11 c should not be a problem as long as the atoms can be easily etched away with a diluted hydrofluoric acid, for example. This is also applicable to the connection between the TiN layer 10 d and the NiSi layer 22 . This is also applicable to other embodiments of the present invention.
- connection between the NiSi layer 18 and the N + region 2 a and the P + region 3 a is established by a heat treatment in FIG. 1H .
- the connection between the NiSi layer 18 and the N + region 2 a and the P + region 3 a need only be established before the final step of manufacturing the SGT by expansion of the NiSi layer 18 a.
- the NiSi layer 29 is formed in the side surface layers of the N + region 2 a and the P + region 3 a so as to contact the NiSi layer 18 a.
- the NiSi layer 29 is formed after the NiSi layer 29 has come into contact with the side surfaces of the N + region 2 a and the P + region 3 a as a result of diffusion of the Ni atoms into the N + region 2 a and the P + region 3 a through the heating process conducted before and in the step illustrated in FIG. 1L .
- NiSi layers similar to the NiSi layer 29 are formed in the side surface layers of the N + region 2 a and the P + region 3 a in contact with the NiSi layers 18 a, 32 , 32 a, 36 , and 45 .
- a Ti atom-containing alloy layer is formed in the side surface layers of the N + region 2 a and the P + region 3 a in contact with the TiN layer 40 c as a result of the subsequent heating process.
- an SGT is a pillar-shaped semiconductor device in which the technical idea of the present invention is applied to the connection between the NiSi layer 18 a and the N + region 2 a and the P + region 3 a and the connection between the TiN layer 10 d and the NiSi layer 22 .
- one of the connection form can be applied to a pillar-shaped semiconductor device. This is also applicable to other embodiments of the present invention.
- the technical idea of the present invention is applied to the connection between the N + region 2 a and the P + region 3 a and the NiSi layers 18 , 18 a, 32 , 32 a, and 36 or the TiN layer 40 a.
- the manufacturing methods of these embodiments is also applicable to the connection to the TiN layer 10 d.
- the Ni—Si layer 37 a containing Ni and Si is used instead of the Ni layer 31 a. This is also applicable to other embodiments of the present invention. This is also applicable to the connection to the TiN layer 10 d.
- the SiO 2 layer 41 a is formed on the TiN layer 40 a.
- the same effect can be obtained by performing patterning on the TiN layer 40 a by a lithography method and a RIE method, coating the entirety with the SiO 2 layer 35 by a CVD method, and performing a heat treatment.
- the case in which the TiN layer 40 a is used is described.
- the technical idea of the present invention can be applied to a metal layer such as Ta Ti, or Pt or an alloy layer as long as the layer can connect to the N + region 2 a and the P + region 3 a by undergoing plastic deformation by being heat-treated. This is also applicable to the connection to the NiSi layer 22 .
- a Ti alloy layer may be formed in the side surface layers of the N + region 2 a and the P + region 3 a or a Ti alloy layer may be formed inside as illustrated in FIG. 7 .
- the poly Si layer 42 is formed so as to surround the side surfaces of the N + region 2 a and the P + region 3 a.
- any other semiconductor material or metal-containing material can be used as long as the NiSi layer 45 can be electrically connected to the N + region 2 a and the P + region 3 a.
- the Ni layer 44 is formed on the Si layer 43 .
- the technical idea of the present invention is also applicable to the conductor connecting method similar to those in the second to eighth embodiments.
- the embodiments described above relate to a method for manufacturing a semiconductor device in which two SGTs are formed in one Si pillar.
- the technical idea of the present invention is not limited to this and is applicable to a method for manufacturing an SGT-including semiconductor device in which one SGT or three or more SGTs are formed in one semiconductor pillar.
- an N-channel SGT is formed in a lower portion of the Si pillar 6 and a P-channel SGT is formed in an upper portion of the Si pillar 6 .
- the technical idea of the present invention is applicable to a circuit in which a P-channel SGT is formed in the lower portion and an N-channel SGT is formed in the upper portion.
- the technical idea of the present invention is applicable to formation of a circuit that includes N-channel SGTs or P-channel SGTs in both the upper and lower portions. This is also applicable to other embodiments of the present invention.
- the Si layer 15 a in the first embodiment may be replaced by any of other material layers such as a SiGe material layer as long as the material layer expands in the horizontal direction by a heat treatment performed after formation of the initial material layer on the SiN layer 12 so that the material layer connects to the N + region 2 a and the P + region 3 a.
- This is also applicable to the connection between the TiN layer 10 d and the NiSi layer 22 . This is also applicable to other embodiments of the present invention.
- the embodiments described above each include an SGT having a structure in which the gate SiO 2 layer (gate insulating layer) 9 c is formed at the outer periphery of a semiconductor pillar such as the Si pillar 6 and a TiN layer (gate conductor layer) 10 d is formed at the outer periphery of the gate SiO 2 layer 9 c.
- the structure is not limited to this. Since a flash memory element that has a conductor layer electrically floating between the TiN layer 10 d and the gate SiO 2 layer 9 c or a charge storage layer such as a SiN layer, for example, is also a type of SGTs, the technical idea of the present invention can be applied to a method for manufacturing such a flash memory element.
- the technical idea of the present invention are applied to CMOS inverter circuits.
- the technical idea of the present invention is also applicable to other semiconductor devices such as circuits, devices, and elements.
- the gate conductor layers are the TiN layers 10 b and 10 d. This is not limiting and the gate conductor layers may be composed of other metal materials.
- the gate conductor layers may have a multilayer structure including a metal layer and a poly Si layer, for example.
- the impurity regions such as N + region 2 a and the P + region 3 a may have different conductivity types as with the N + region 2 a and the P + region 3 a or may be constituted by impurity layers of the same conductivity type.
- two impurity layers form one impurity region of the same conductivity type as a whole.
- the impurity regions have different conductivity types the two impurity layers also form one impurity region as a whole.
- Such a structure is also applicable to other embodiments of the present invention.
- a SOI substrate can be used instead of the i-layer substrate 1 .
- the N + region 2 a and the P + region 3 a are in contact with each other.
- the technical idea of the present invention is applicable to the cases in which an insulating layer is formed between the N + region 2 a and the P + region 3 a. This is also applicable to other embodiments of the present invention.
- the present invention is subject to various embodiments and modifications without departing from the spirit and scope of the present invention in a broad sense.
- the embodiments described above are illustrative examples of the present invention and do not limit the scope of the present invention.
- the embodiments and modifications can be freely combined. If needed, some of the structural features of the embodiments described above may be omitted but such an omission may still fall within the technical scope of the present invention.
- a highly integrated semiconductor device is obtained.
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Abstract
Description
- This application is a continuation, under 35 U.S.C. §120, of copending international application No. PCT/JP2013/084759, filed Dec. 25, 2013, which designated the United States; the prior application is herewith incorporated by reference in its entirety.
- The present invention relates to a method for manufacturing a pillar-shaped semiconductor device.
- In recent years, surrounding gate MOS transistors (SGTs) which are a representative example of pillar-shaped semiconductor devices have gathered much attention as semiconductor elements that can be used to form highly integrated semiconductor devices. A further increase in the degree of integration of SGT-including semiconductor devices is highly anticipated.
- A typical planar MOS transistor has a channel extending in a horizontal direction along an upper surface of a semiconductor substrate. In contrast, the channel of an SGT extends in a direction perpendicular to an upper surface of a semiconductor substrate (for example, refer to
PTL 1 and NPL 1). Thus, compared to planar MOS transistors, SGTs help increase the density of semiconductor devices. -
FIG. 10 is a schematic diagram of an N-channel SGT. An N+ region 101 a and an N+ region 101 b (hereinafter a semiconductor region having a high donor impurity concentration is referred to as an “N+ region”) are respectively formed in an upper portion and a lower portion of aSi pillar 100 having a P-type or i(intrinsic)-type conductivity (hereinafter a silicon semiconductor pillar is referred to as “Si pillar”). When the N+ region 101 a serves as a source, the N+ region 101 b serves as a drain and when the N+ region 101 a serves as a drain, the N+ region 101 b serves as a source. The Sipillar 100 that lies between the N+ region 101 a and N+ region 101 b serving as a source and a drain is achannel region 102. Agate insulating layer 103 is formed so as to surround thechannel region 102 and agate conductor layer 104 is formed so as to surround thegate insulating layer 103. In the SGT, the N+ regions 101 a and 101 b serving as a source and a drain, thechannel region 102, thegate insulating layer 103, and thegate conductor layer 104 are formed within asingle Si pillar 100. Accordingly, the area of the SGT in plan view corresponds to the area of a single source or drain N+ region of a planar MOS transistor. Thus, a circuit chip that includes SGTs is smaller than a circuit chip that includes planar MOS transistors. - Attempts are now being made to further decrease the size of SGT-including circuit chips. For example, it has been anticipated that the circuit area can be reduced by forming two
SGTs Si pillar 115 as illustrated in a schematic diagram ofFIG. 11 . -
FIG. 11 is a schematic diagram of a CMOS inverter circuit in which anN channel SGT 116 a is formed in a lower portion of theSi pillar 115 and a P channel SGT 116 b is formed above theN channel SGT 116 a. TheSi pillar 115 is formed on a P layer substrate 117 (hereinafter, a semiconductor layer containing an acceptor impurity is referred to as a “P layer”). A SiO2 layer 118 is formed at the outer periphery of theSi pillar 115 and on theP layer substrate 117. Agate insulating layer 119 a of theN channel SGT 116 a and agate insulating layer 119 b of the P channel SGT 116 b are formed so as to surround theSi pillar 115. Agate conductor layer 120 a of the N channel SGT 116 a and agate conductor layer 120 b of the P channel SGT 116 b are formed at the outer periphery of theSi pillar 115 so as to surround the gateinsulating layers P layer substrate 117 connected to the bottom portion of theSi pillar 115, an N+ region 121 b is formed at the center of theSi pillar 115, a P+ region 122 a (hereinafter a semiconductor region having a high acceptor impurity concentration is referred to as a “P+ region”) is formed within theSi pillar 115 connected to the N+ region 121 b, and a P+ region 122 b is formed in a top portion of theSi pillar 115. The N+ region 121 a is a source of theN channel SGT 116 a and the N+ region 121 b is a drain of theN channel SGT 116 a. The Sipillar 115 that lies between the N+ regions 121 a and 121 b is achannel region 123 a of theN channel SGT 116 a. The P+ region 122 b is a source of theP channel SGT 116 b and the P+ region 122 a is a drain of theP channel SGT 116 b. TheSi pillar 115 that lies between the P+ regions 122 a and 122 b is achannel region 123 b of the P channel SGT 116 b. A nickel silicide layer (NiSi layer) 125 a is formed in the surface layer portion of the N+ region 121 a connected to the bottom portion of theSi pillar 115, a NiSilayer 125 b is formed at the outer peripheries of the N+ region 121 b and the P+ region 122 a located in the center portion of theSi pillar 115, and aNiSi layer 125 c is formed in an upper surface layer of the P+ region 122 b in the top portion of theSi pillar 115. A groundwiring metal layer 126 a is formed so as to connect to the NiSilayer 125 a in the N+ region 121 a. The groundwiring metal layer 126 a is connected to a ground terminal VSS. Similarly, an outputwiring metal layer 126 b is formed so as to connect to the NiSilayer 125 b. The outputwiring metal layer 126 b is connected to an output terminal Vo. Similarly, a power supplywiring metal layer 126 c is formed so as to connect to the NiSilayer 125 c. The power supplywiring metal layer 126 c is connected to a power supply terminal VDD. Inputwiring metal layers gate conductor layers wiring metal layers - In
FIG. 11 , the NiSilayer 125 b connected to the N+ region 121 b and the P+ region 122 a located in the center portion of theSi pillar 115 is formed by coating outer peripheral surfaces of the N+ region 121 b and the P+ region 122 a with a nickel (Ni) film, performing a heat treatment at about 450° C., for example, and removing the Ni film remaining on the surfaces. As a result, the NiSilayer 125 b is formed so as to extend from the outer peripheries of the N+ region 121 b and the P+ region 122 a toward the interior. For example, when theSi pillar 115 has a diameter of 20 nm, the NiSilayer 125 b is preferably formed to have a thickness of about 5 nm to 10 nm. When the NiSilayer 125 b has a thickness of 10 nm, the NiSilayer 125 b occupies the entire cross section of theSi pillar 115. The linear thermal expansion coefficient of NiSi is 12×10−6/K, which is five times the linear thermal expansion coefficient of Si which is 2.4×10−6/K. Thus, large stress-induced strain is generated inside theSi pillar 115 due to theNiSi layer 125 b. As a result, failures such as bending or collapsing of theSi pillar 115 may readily occur. More failures would occur when the diameter of the Si pillar is decreased in order to increase the degree of circuit integration. Under such circumstances, a technique of securely establishing the connection between the N+ region 121 b and the outputwiring metal layer 126 b and between the P+ region 122 a and the outputwiring metal layer 126 b has been a challenge. Moreover, since the side surface of theSi pillar 115 is processed, the technique of securely establishing the connection between thegate conductor layer 120 a and the inputwiring metal layer 127 a and between thegate conductor layer 120 b and the inputwiring metal layer 127 b has also been a challenge. - The following list includes patent and non-patent literature regarding the background of this invention:
- PTL 1: Japanese Unexamined Patent Application Publication No. 2-188966
- NPL 1: Hiroshi Takato, Kazumasa Sunouchi, Naoko Okabe, Akihiro Nitayama, Katsuhiko Hieda, Fumio Horiguchi, and Fujio Masuoka: IEEE Transaction on Electron Devices, Vol. 38, No. 3, pp. 573-578 (1991)
- NPL 2: Tadashi Shibata, Susumu Kohyama and Hisakazu Iizuka: “A New Field Isolation Technology for High Density MOS LSI”, Japanese Journal of Applied Physics, Vol. 18, pp. 263-267 (1979)
- NPL 3: C. Y. Ting, V. J. Vivalda, and H. G. Schaefer: “Study of planarized sputter-deposited SiO2″ J. Vac. Sci. Technol, 15(3), May/June (1978)
- As discussed above, an SGT-including pillar-shaped semiconductor device illustrated in
FIG. 11 requires a technique of securely and easily forming the outputwiring metal layer 126 b at the side surface of theSi pillar 115 and the N+ region 121 b and the P+ region 122 a at the center portion of theSi pillar 115 without causing bending or collapsing of theSi pillar 115. Furthermore, a technique of securely and easily forming a connection between thegate conductor layer 120 a and the inputwiring metal layer 127 a and thegate conductor layer 120 b and the inputwiring metal layer 127 b at the side surface of theSi pillar 115 is also required. - An aspect of the present invention provides a method for manufacturing a pillar-shaped semiconductor device, the method comprising:
- a semiconductor pillar forming step of forming a semiconductor pillar on a semiconductor substrate;
- a first impurity region forming step of forming a first impurity region in the semiconductor pillar, the first impurity region containing a donor and/or acceptor impurity and including at least one impurity layer;
- a first insulating layer forming step of forming a first insulating layer so as to surround an outer periphery of the semiconductor pillar;
- a conductive layer forming step of forming a conductive layer so as to surround an outer periphery of the first insulating layer;
- a second insulating layer forming step of forming a second insulating layer so as to surround an outer periphery of the conductive layer;
- an interlayer insulating layer forming step including at least one selected from a third insulating layer forming step of forming a third insulating layer having an upper surface positioned near a lower end of the first impurity region and a fourth insulating layer forming step of forming a fourth insulating layer having an upper surface positioned at a side surface of the conductive layer in a middle position in a height direction;
- a side surface contact portion forming step including at least one selected from an impurity region side surface contact portion forming step of forming an impurity region side surface contact portion by etching-away the first insulating layer, the conductive layer, and the second insulating layer in a portion positioned at an outer periphery of a side surface of the first impurity region above the upper surface of the third insulating layer and a conductive layer side surface contact portion forming step of forming a conductive layer side surface contact portion by etching-away the second insulating layer in a portion positioned at the outer periphery of the conductive layer above the upper surface of the fourth insulating layer;
- a material layer depositing step including at least one selected from a step of forming a first material layer on the third insulating layer so that the impurity region side surface contact portion forms a space and an upper surface of the first material layer is positioned near an upper end portion of the impurity region side surface contact portion and a step of forming a second material layer on the fourth insulating layer so that the conductive layer side surface contact portion forms a space and an upper surface of the second material layer is positioned to be higher than an upper end of the conductive layer side surface contact portion, these steps being performed by injecting an atom group in a direction perpendicular to an upper surface of the semiconductor substrate from above the semiconductor pillar, the atom group containing atoms constituting at least a conductive material; and
- a heat treatment step of performing a heat treatment to change a shape of the first material layer or the second material layer,
- wherein the heat treatment step includes a material layer connecting step that includes at least one selected from a step of expanding the first material layer so as to connect to the side surface of the first impurity region and a step of expanding the second material layer so as to connect to the side surface of the conductive layer.
- Preferably, the method further comprises a second impurity region forming step of forming a second impurity region in a lower portion and/or an upper portion of the semiconductor pillar, the second impurity region having the same conductivity type as each impurity layer constituting the first impurity region,
- wherein a surrounding gate MOS transistor (SGT) is formed in which when one of the first impurity region and the second impurity region serves as a source, the other serves as a drain, the first insulating layer serves as a gate insulating layer, and the first conductive layer serves as a gate conductor layer.
- a. Preferably, the method further comprises a fifth insulating layer forming step of forming, after forming at least one selected from the first material layer and the second material layer, a fifth insulating layer on the first material layer and the second material layer, wherein the heat treatment step is performed after the fifth insulating layer forming step.
- Preferably, at least one selected from the first material layer and the second material layers is composed of a semiconductor material,
- the method further comprises a first metal material layer forming step of forming a metal-containing first metal material layer so as to contact at least one selected from an upper surface and a lower surface of the first material or the second material layer composed of the semiconductor material, and
- in the heat treatment step, the heat treatment is performed to diffuse metal atoms from the first metal material layer into at least one selected from the first material layer and the second material layer so as to form a first alloy layer and the material layer connecting step is performed by expanding the first alloy layer.
- Preferably, the method further comprises a second metal material layer forming step of forming a second metal material layer by causing at least one selected from the first material layer and the second material layer to contain a metal, wherein, in the heat treatment step, the heat treatment is performed so as to plastically deform and expand the second metal material layer to carry out the material layer connecting step.
- Preferably, in the material layer connecting step of connecting the first alloy layer to the side surface of the first impurity region by expanding the first alloy layer, a second alloy layer having the same composition as the first alloy layer is formed in a side surface layer of the first impurity region.
- Preferably, in the material layer connecting step of connecting the first alloy layer to the side surface of the first impurity region by expanding the first alloy layer, a third alloy layer having the same composition as the first alloy layer is formed so as to penetrate the first impurity region in a horizontal direction.
- Preferably, in the material layer connecting step, a fourth alloy layer containing metal atoms contained in the second metal material layer is formed in a part of the first impurity region.
- Preferably, the method further comprises a semiconductor material layer forming step of forming a semiconductor material layer so as to surround the outer periphery of the first impurity region at the impurity region side surface contact portion,
- wherein in the heat treatment step, the heat treatment is performed so as to connect the first material layer to a side surface of the semiconductor material layer by expanding the first material layer.
- According to the present invention, in an SGT-including semiconductor device, it becomes possible to suppress bending and collapsing of a semiconductor pillar that occur when an alloy layer is formed in a metal wiring layer electrically connected to a semiconductor region or a gate conductor layer present in a central portion of the semiconductor pillar. Furthermore, The connection between the semiconductor region or gate conductor layer and the wiring metal layer connected to the alloy layer can be securely established.
- Other features which are considered as characteristic for the invention are set forth in the appended claims.
- Although the invention is illustrated and described herein as embodied in a Method For Manufacturing Pillar-Shaped Semiconductor Device, it is nevertheless not intended to be limited to the details shown, since various modifications and structural changes may be made therein without departing from the spirit of the invention and within the scope and range of equivalents of the claims.
- The construction and method of operation of the invention, however, together with additional objects and advantages thereof will be best understood from the following description of specific embodiments when read in connection with the accompanying drawings.
- FIG. 1AA is a plan view, FIG. 1AB and FIG. 1AC are cross-sectional views of a CMOS inverter circuit for explaining a method for manufacturing an SGT-including semiconductor device according to a first embodiment of the present invention.
- FIG. 1BA is a plan view, FIG. 1BB and FIG. 1BC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 1CA is a plan view, FIG. 1CB and FIG. 1CC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 1DA is a plan view, FIG. 1DB and FIG. 1DC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 1EA is a plan view, FIG. 1EB and FIG. 1EC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 1FA is a plan view, FIG. 1FB and FIG. 1FC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 1GA is a plan view, FIG. 1GB and FIG. 1GC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 1HA is a plan view, FIG. 1HB and FIG. 1HC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 1IA is a plan view, FIG. 1IB and FIG. 1IC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 1JA is a plan view, FIG. 1JB and FIG. 1JC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 1KA is a plan view, FIG. 1KB and FIG. 1KC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 1LA is a plan view, FIG. 1LB and FIG. 1LC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the first embodiment.
- FIG. 2AA is a plan view, FIG. 2AB and FIG. 2AC are cross-sectional views of a CMOS inverter circuit for explaining a method for manufacturing an SGT-including semiconductor device according to a second embodiment of the present invention.
- FIG. 2BA is a plan view, FIG. 2BB and FIG. 2BC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the second embodiment.
- FIG. 3AA is a plan view, FIG. 3AB and FIG. 3AC are cross-sectional views of a CMOS inverter circuit for explaining a method for manufacturing an SGT-including semiconductor device according to a third embodiment of the present invention.
- FIG. 4AA is a plan view, FIG. 4AB and FIG. 4AC are cross-sectional views of a CMOS inverter circuit for explaining a method for manufacturing an SGT-including semiconductor device according to a fourth embodiment of the present invention.
- FIG. 4BA is a plan view, FIG. 4BB and FIG. 4BC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the fourth embodiment.
- FIG. 5AA is a plan view, FIG. 5AB and FIG. 5AC are cross-sectional views of a CMOS inverter circuit for explaining a method for manufacturing an SGT-including semiconductor device according to a fifth embodiment of the present invention.
- FIG. 5BA is a plan view, FIG. 5BB and FIG. 5BC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the fifth embodiment.
- FIG. 5CA is a plan view, FIG. 5CB and FIG. 5CC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the fifth embodiment.
- FIG. 6AA is a plan view, FIG. 6AB and FIG. 6AC are cross-sectional views of a CMOS inverter circuit for explaining a method for manufacturing an SGT-including semiconductor device according to a sixth embodiment of the present invention.
- FIG. 7AA is a plan view, FIG. 7AB and FIG. 7AC are cross-sectional views of a CMOS inverter circuit for explaining a method for manufacturing an SGT-including semiconductor device according to a sixth embodiment of the present invention.
- FIG. 8AA is a plan view, FIG. 8AB and FIG. 8AC are cross-sectional views of a CMOS inverter circuit for explaining a method for manufacturing an SGT-including semiconductor device according to an eighth embodiment of the present invention.
- FIG. 8BA is a plan view, FIG. 8BB and FIG. 8BC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the eighth embodiment.
- FIG. 9AA is a plan view, FIG. 9AB and FIG. 9AC are cross-sectional views of a CMOS inverter circuit for explaining a method for manufacturing an SGT-including semiconductor device according to a ninth embodiment of the present invention.
- FIG. 9BA is a plan view, FIG. 9BB and FIG. 9BC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the ninth embodiment.
- FIG. 9CA is a plan view, FIG. 9CB and FIG. 9CC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the ninth embodiment.
- FIG. 9DA is a plan view, FIG. 9DB and FIG. 9DC are cross-sectional views of the CMOS inverter circuit for explaining the method for manufacturing an SGT-including semiconductor device according to the ninth embodiment.
-
FIG. 10 is a schematic view of a conventional SGT. -
FIG. 11 is a schematic view of a CMOS inverter circuit in which an N-channel SGT is formed in a lower portion and a P-channel SGT is formed in an upper portion of one Si pillar according to a conventional example. - A method for manufacturing an SGT-including pillar-shaped semiconductor device according to an embodiment of the present invention will now be described with reference to the drawings.
- A method for manufacturing an SGT-including CMOS inverter circuit according to a first embodiment of the present invention is described below with reference to
FIGS. 1A to 1L . -
FIG. 1A includes a plan view and cross-sectional views illustrating a first step of the SGT-including CMOS inverter circuit. Part (a) is a plan view, part (b) is a cross-sectional view taken along line X-X′ in (a), and part (c) is a cross-sectional view taken along line Y-Y′ in (a). The relationship between the diagrams in part (a), part (b), and part (c) is the same for other drawings referred in the description below. - As illustrated in
FIG. 1A , an N+ region 2 containing a donor impurity such as arsenic (As) is formed on an i-layer substrate 1 by an ion implantation method or an epitaxial growth method. Next, a P+ region 3 containing an acceptor impurity such as boron (B) is formed on the N+ region 2 by an ion implantation method or an epitaxial growth method. An i-region 4 is formed on the P+ region 3 by an epitaxial growth method. Then a SiO2 layer 5 is formed on the i-region 4 by a thermal oxidation method. - Next, as illustrated in
FIG. 1B , the SiO2 layer 5 is etched by performing a lithography method and a reactive ion etching (RIE) method so as to form a SiO2 layer 5 a. The i-region 4, the P+ region 3, the N+ region 2, and the i-layer substrate 1 are then etched by a RIE method using the SiO2 layer 5 a as a mask so as to form aSi pillar 6 that includes an i-region 4 a, a P+ region 3 a, a N+ region 2 a, and an i-layer substrate 1 a. The cross-sectional shape of theSi pillar 6 is preferably round as illustrated in FIG. 1B(a). The side surface of theSi pillar 6 preferably forms a substantially right angle with the upper surface of the i-layer substrate 1. - Next, as illustrated in
FIG. 1C , an N+ region 7 is formed in the upper surface layer of the i-layer substrate 1 at the outer periphery of theSi pillar 6 by an ion implantation method. Then a SiO2 film is deposited by a chemical vapor deposition (CVD) method, the upper surface of the SiO2 film is planarized by a mechanical chemical polishing (MCP) method, and the SiO2 film is etched by an etch back method so as to have a SiO2 layer 8 remain on the i-layer substrate 1 at the outer periphery of theSi pillar 6. Subsequently, an atomic layer deposition (ALD) method is employed to coat theentire Si pillar 6 and SiO2 layer 8 with a hafnium oxide (HfO2)layer 9 and a titanium nitride (TiN)layer 10. Then theSi pillar 6 and the entire peripheral area of theSi pillar 6 are coated with a SiO2 layer 11 by a CVD method. - Next, as illustrated in
FIG. 1D , the SiO2 layer 11 and theTiN layer 10 are etched by a RIE method using a mask formed of a resist formed by a lithography method so as to form a SiO2 layer 11 a and aTiN layer 10 a from the upper surface of theSi pillar 6 to the upper surface of the SiO2 layer 8. - Next, as illustrated in
FIG. 1E , a silicon nitride (SiN)layer 12 is formed at the outer periphery of theSi pillar 6. TheSiN layer 12 is formed so that the position of its upper surface is at the same height as the lower end of the N+ region 2 a formed in theSi pillar 6. Then a resistlayer 13 is formed on theSiN layer 12. Here, the resistlayer 13 is formed so that the position of the upper surface is at the same height as the upper end of the P+ region 3 a. The resistlayer 13 is formed by applying a resist material over the entire upper surface of the i-layer substrate 1 and performing a heat treatment at 200° C., for example, so as to increase the flowability of the resist material and to allow the resist material to evenly collect on theSiN layer 12 on the outer side of theSi pillar 6. Then hydrogen fluoride gas (hereinafter referred to as “HF gas”) is supplied to all parts. Subsequently, a heating environment of 180° C. is created so as to ionize the HF gas by the moisture contained in the resistlayer 13. As a result, hydrogen fluoride ions (hereinafter referred to as “HF ions”) (HF2 +) are formed. The HF ions thermally diffuse into the resistlayer 13 and etch the SiO2 layer 11 a in contact with the resist layer 13 (refer toNPL 2 for the mechanism of etching). In contrast, the SiO2 layer 11 a not in contact with the resistlayer 13 remains substantially unetched. Then the resistlayer 13 is removed. - As a result, as illustrated in
FIG. 1F , the SiO2 layer 11 a is divided into a SiO2 layer 11 b in a region covered with theSiN layer 12 and a SiO2 layer 11 c in an upper region of theSi pillar 6. Then theTiN layer 10 a is etched by using the SiO2 layers 11 b and 11 c as a mask. As a result, theTiN layer 10 a is divided into aTiN layer 10 b covered with the SiO2 layer 11 b in the lower region of theSi pillar 6 and aTiN layer 10 c covered with the SiO2 layer 11 c in the upper region of theSi pillar 6. Then the HfO2 layer 9 is etched by using the SiO2 layers 11 b and 11 c and the TiN layers 10 b and 10 c as a mask so as to divide the HfO2 layer 9 into a HfO2 layer 9 a partly covered with theTiN layer 10 b in the lower region of theSi pillar 6 and a HfO2 layer 9 b covered with theTiN layer 10 c in the upper region of theSi pillar 6. Then exposed portions of the TiN layers 10 b and 10 c are oxidized to form TiO (titanium oxide) layers 14 a and 14 b. - Next, as illustrated in
FIG. 1G , for example, a substrate metal plate on which the i-layer substrate 1 is placed and a counter metal plate distant from the substrate metal plate are prepared, a DC voltage is applied to the substrate metal plate, and radiofrequency (RF) voltage is applied between these two parallel metal plates so as to sputter atoms of the material of the counter metal plate and deposit the atoms on the i-layer substrate 1. This process is a bias sputtering method. The bias sputtering method is performed so as to inject Si atoms in a direction perpendicular to the upper surface of the i-layer substrate 1 and to form aSi layer 15 a on theSiN layer 12 and aSi layer 15 b on theSi pillar 6. Here, theSi layer 15 a is positioned so that the upper surface thereof is positioned near the upper end of anopening 21 a. Then Ni atoms are injected in a direction perpendicular to the upper surface of the i-layer substrate 1 so as to deposit aNi layer 16 a on theSi layer 15 a and aNi layer 16 b on theSi layer 15 b. Since the Si and Ni atoms are injected in a direction perpendicular to the upper surface of the i-layer substrate 1, aspace 17 having a width (depth) in a horizontal direction equal to the total thickness of the SiO2 layer 11 b, theTiN layer 10 b, and the HfO2 layer 9 a or the total thickness of the SiO2 layer 11 c, theTiN layer 10 c, and the HfO2 layer 9 b is formed in theopening 21 a between the outer periphery of the N+ region 2 a and the P+ region 3 a and the Si layer 15. In forming the Si layers 15 a and 15 b and the Ni layers 16 a and 16 b, the angle between the side surface of theSi pillar 6 and the upper surface of the i-layer substrate 1 is a substantially right angle and thus the Si layer 15 and theNi layer 16 can be formed only on theSiN layer 12 by controlling the bias voltage applied between the counter metal plate of the bias sputtering system and the substrate metal plate on which the i-layer substrate 1 is placed (refer toNPL 3 for the basic control method). Then theSi layer 15 b and theNi layer 16 b on theSi pillar 6 are removed. - Next, as illustrated in
FIG. 1H , a heat treatment is performed at, for example, 550° C. to diffuse the Ni atoms in theNi layer 16 a into theSi layer 15 a so as to form a nickel silicide (NiSi)layer 18. TheNiSi layer 18 expands and acquires a volume larger than that of theSi layer 15 a. The expansion of theNiSi layer 18 occurs in the vertical (up-down) and horizontal (right-left) directions. Accordingly, the side surface of theNiSi layer 18 comes into contact with the side surfaces of the N+ region 2 a and the P+ region 3 a. Then the remainingNi layer 16 a is removed. - Next, as illustrated in
FIG. 11 , theNiSi layer 18 is patterned by a lithography method and a RIE method so as to form aNiSi layer 18 a. - Next, as illustrated in
FIG. 1J , aSiN layer 20 is formed by the same method as that for forming theSiN layer 12 so that the upper surface thereof is positioned in the middle of theTiN layer 10 c in the height direction. Then anopening 21 b is formed at the outer periphery of theTiN layer 10 c by the same method as that used for forming the opening 21 a. Then a Si layer and a Ni layer are formed by injecting Si and Ni atoms in a direction perpendicular to the upper surface of the i-layer substrate 1 by the same method as that used for forming theSi layer 15 a, for example, by a bias sputtering method. Then the Si layer is, for example, Ni-silicided by a heat treatment at 550° C., for example. After removing the remaining Ni layer, aNiSi layer 22 is formed by a lithography method and a RIE method. As a result, in theopening 21 b, theTiN layer 10 c comes into contact with theNiSi layer 22 in which the Si layer has expanded by Ni-silicidation. - Next, as illustrated in
FIG. 1K , a SiO2 layers 23 is formed over the entirety by a CVD method so that the upper surface thereof is positioned to be higher than the surface of theNiSi layer 22 and lower than the top portion of theSi pillar 6. Then the SiO2 layer 11 c, theTiN layer 10 c, the HfO2 layer 9 b are etched by using the SiO2 layer 23 as a mask so as to form a SiO2 layer 11 d, aTiN layer 10 d, and a HfO2 layer 9 c. Next, a P+ region 24 is formed in the top portion of theSi pillar 6 by a boron (B) ion implantation method by using the SiO2 layers 23 and 11 d, theTiN layer 10 d, and the HfO2 layer 9 c as a mask. - Next, as illustrated in
FIG. 1L , a SiO2 layer 27 is formed over the entirety by a CVD method. Then a lithography method and a RIE method are employed to form acontact hole 28 a on theTiN layer 10 b so as to penetrate theNiSi layer 22, acontact hole 28 b on the top portion of theSi pillar 6, acontact hole 28 c on theNiSi layer 18 a, and acontact hole 28 d on an N+ region 7 a. Next, an input wiring metal layer Vin electrically connected to theNiSi layer 22 and theTiN layer 10 b through thecontact hole 28 a is formed and a power supply wiring metal layer Vdd electrically connected to the P+ region 24 in the top portion of theSi pillar 6 through thecontact hole 28 b is formed. An output wiring metal layer Vout electrically connected to theNiSi layer 18 a through thecontact hole 28 c is formed and a ground wiring metal layer Vss electrically connected to an N+ region 7 a through thecontact hole 28 d is formed. ANiSi layer 29 is formed in the side surface layers of the N+ region 2 a and the P+ region 3 a in contact with theNiSi layer 18 a. - As a result of performing the manufacturing method described above, a CMOS inverter circuit that includes an N-channel SGT and a P-channel SGT is formed, in which the N-channel SGT includes a channel which is the i-
layer 1 a in the lower portion of theSi pillar 6, a gate insulating layer which is the HfO2 layer 9 a surrounding the outer periphery of the i-layer 1 a, a gate conductor layer which is theTiN layer 10 b surrounding the outer periphery of the HfO2 layer 9 a, a source which is the N+ region 7 a below the i-layer 1 a, and a drain which is the N+ region 2 a on the i-layer 1 a and in which the P-channel SGT includes a channel which is the i-layer 4 a in the upper portion of theSi pillar 6, a gate insulating layer which is the HfO2 layer 9 c surrounding the outer periphery of the i-layer 4 a, a gate conductor layer which is theTiN layer 10 d surrounding the outer periphery of the HfO2 layer 9 c, a source which is the P+ region 3 a below the i-region 4 a, and a drain which is the P+ region 24 on the i-layer 4 a. - As illustrated in
FIG. 1H , theNiSi layer 18 is connected to the the N+ region 2 a and the P+ region 3 a by performing a heat treatment at, for example, 550° C. so as to diffuse the Ni atoms in theNi layer 16 a into the Si layer 15 to form a nickel silicide (NiSi)layer 18 and expand theNiSi layer 18 to be larger than theSi layer 15 a. However, connecting theNiSi layer 18 a to the N+ region 2 a and the P+ region 3 a need not be completed by a single treatment; it is sufficient if theNiSi layer 18 a becomes connected to the N+ region 2 a and the P+ region 3 a by performing a heat treatment two or more times in the steps illustrated inFIGS. 1G to 1L so that theNiSi layer 18 a is expanded before the last step of manufacturing the SGT. In this case, after the step illustrated inFIG. 1H , the remainingNi layer 16 is preferably left unremoved. - The method for manufacturing a CMOS inverter circuit according to the first embodiment has the following effects.
- A. According to a conventional method, an opening 21 a is formed in a side surface of the
Si pillar 6 and a Ni silicide layer having a thermal expansion coefficient different from that of theSi pillar 6 is directly formed inside theSi pillar 6 from the side surfaces of the N+ region 2 a and the P+ region 3 a in theopening 21 a. According to this conventional method, bending and collapsing of theSi pillar 6 readily occur due to the thermal stress-induced strains occurring between the Si pillar and the Ni silicide layer having different thermal expansion coefficients. In contrast, according to the first embodiment, theSi layer 15 a and theNi layer 16 a are formed by injecting the Si and Ni atoms in a direction perpendicular to the upper surface of the i-layer substrate 1. As a result, aspace 17 is formed between theSi layer 15 a, and the N+ region 2 a and the P+ region 3 a. When a heat treatment is performed subsequently to Ni-silicide theSi layer 15 a to form aNiSi layer 18, theNiSi layer 18 expands and connects to the N+ region 2 a and the P+ region 3 a in thespace 17. As a result, theSi layer 15 a or the NiSi layers 18 and 18 a surrounding theSi pillar 6 prevent bending and collapsing of theSi pillar 6. Moreover, since the NiSi layer is not directly formed on the N+ region 2 a and the P+ region 3 a, bending and collapsing of theSi pillar 6 are prevented. - B. Since the
Si layer 15 a and theNi layer 16 a are formed by injecting the Si and Ni atoms in a direction perpendicular to the upper surface of the i-layer substrate 1, the Si and Ni atoms are not deposited on the side surface of the SiO2 layer 11 c at the outer periphery of theSi pillar 6. Accordingly, there is no need to perform a step of removing a Si layer and a Ni layer deposited on the side surface of the SiO2 layer 11 c. As a result, the method for manufacturing a CMOS inverter circuit can be simplified. - A method for manufacturing an SGT-including CMOS inverter circuit according to a second embodiment of the present invention will now be described with reference to
FIGS. 2A and 2B . A CMOS inverter circuit of the second embodiment is manufactured by the same steps as those illustrated inFIGS. 1A to 1L in the first embodiment except for the following structural differences. - Instead of the step of forming the Si layers 15 a and 15 b and the Ni layers 16 a and 16 b in
FIG. 1G , aSi layer 30 b, the following step illustrated inFIG. 2A is performed by, for example, a bias sputtering method: Si atoms are injected in a direction perpendicular to the upper surface of the i-layer substrate 1 so as to form aSi layer 30 a on theSiN layer 12 and aSi layer 30 c on theSi pillar 6, Ni atoms are then injected in a direction perpendicular to the upper surface of the i-layer substrate 1 so as to form aNi layer 31 a on theSi layer 30 a and aNi layer 31 b on theSi layer 30 c, and then Si atoms are injected in a direction perpendicular to the upper surface of the i-layer substrate 1 so as to form aSi layer 30 b on theNi layer 31 a and aSi layer 30 d on theNi layer 31 b. When the Si and Ni atoms are injected in a direction perpendicular to the upper surface of the i-layer substrate 1 as such to form theSi layer 30 a, theNi layer 31 a, and theSi layer 30 b, aspace 17 a similar to thespace 17 inFIG. 1G is formed between the N+ region 2 a and the P+ region 3 a and theSi layer 30 a, theNi layer 31 a, and theSi layer 30 b. No Si layer or Ni layer is deposited on the side surface of theSi pillar 6. Then theSi layer 30 c, theNi layer 31 b, and theSi layer 30 d on theSi pillar 6 are removed. - Next, as illustrated in
FIG. 2B , a heat treatment at, for example, 550° C. is performed to diffuse the Ni atoms from theNi layer 31 a into the Si layers 30 a and 30 b so as to form a nickel silicide (NiSi)layer 32 by the method shown inFIG. 1H . Here, theNiSi layer 32 expands and acquires a volume larger than that of the Si layers 30 a and 30 b. This expansion of theNiSi layer 32 occurs in the vertical (up-down) and horizontal (right-left) directions and thus the side surface of theNiSi layer 32 comes into contact with the side surfaces of the N+ region 2 a and the P+ region 3 a. Volume of theNi layer 31 a decreases as the Ni atoms diffuse into the Si layers 30 a and 30 b. By adequately adjusting the thickness of theNi layer 31 a, the Si layers 30 a and 30 b above and below theNi layer 31 a expand and ahomogeneous NiSi layer 32 free of voids is ultimately formed. - The method for manufacturing a CMOS inverter circuit according to the second embodiment has the following effects.
- A. The
NiSi layer 32 preferably makes contact with the N+ region 2 a and the P+ region 3 a uniformly in the height direction. In the first embodiment, since theNi layer 16 a is formed at a height near the upper surface of the P+ region 3 a and on theSi layer 15 a, the degree of expansion of theNiSi layer 18 within thespace 17 differs in the vertical directions. In contrast, in the second embodiment, the Si layers 30 a and 30 b having substantially the same thickness are formed above and below theNi layer 31 a formed at the height near the interface between the N+ region 2 a and the P+ region 3 a and thus theNiSi layer 32 formed from theNi layer 31 a by the subsequent heat treatment expands uniformly in the vertical direction of theNi layer 31 a and uniformly connects to the N+ region 2 a and the P+ region 3 a. - B. Since the
Ni layer 31 a is sandwiched between the Si layers 30 a and 30 b, theNi layer 31 a cannot be removed as with theNi layer 16 a in the first embodiment after Ni-silicidation. Thus, the Ni layer may remain inside theNiSi layer 32 after Ni-silicidation. Even if all of the Ni atoms in theNi layer 31 a are diffused into the Si layers 30 a and 30 b and consumed, the space where theNi layer 31 a had existed does not turn into aNiSi layer 32 and voids may be formed. When voids are formed and theNiSi layer 18 a is processed, failures such as abnormal etching will occur due to voids and contamination inside the voids by a cleaning solution. To address this, theNi layer 31 a is designed to have a thickness that does not cause voids in theNiSi layer 32 at least after the Ni-silicidation step so as to prevent such failures. - An SGT-including CMOS inverter circuit according to a third embodiment of the present invention will now be described with reference to
FIG. 3 . - A method for manufacturing an SGT-including CMOS inverter circuit according to the third embodiment of the present invention is described below with reference to
FIG. 3 . The CMOS inverter circuit of the third embodiment is manufactured by the same steps as those illustrated inFIGS. 1A to 1L of the first embodiment except for the structural differences described below. - Instead of the step illustrated in
FIG. 1G of forming the Si layers 15 a and 15 b and the Ni layers 16 a and 16 b, the following process is performed by, for example, a bias sputtering method as illustrated inFIG. 3 : Ni atoms are injected in a direction perpendicular to the upper surface of the i-layer substrate 1 to form aNi layer 19 a on theSiN layer 12 and aNi layer 19 b on theSi pillar 6, then Si atoms are injected in a direction perpendicular to the upper surface of the i-layer substrate 1 to form aSi layer 15 a on theNi layer 19 a and aSi layer 15 b on theNi layer 19 b, and then Ni atoms are injected in a direction perpendicular to the upper surface of the i-layer substrate 1 to form anNi layer 16 a on theNi layer 19 a and aNi layer 16 b on theSi layer 15 b. Because the Si and Ni atoms are injected in a direction perpendicular to the upper surface of the i-layer substrate 1 to form theNi layer 19 a, theSi layer 15 a, and theNi layer 16 a, aspace 17 b similar to thespace 17 inFIG. 1G is formed between the N+ region 2 a and the P+ region 3 a and theNi layer 19 a, theSi layer 15 a, and theNi layer 16 a. No Si layer or Ni layer is deposited on a side surface of theSi pillar 6. Then theNi layer 19 b, theSi layer 15 b, and theNi layer 16 b on theSi pillar 6 are removed. Then, for example, a heat treatment at 550° C. is performed so that the Ni silicide layer formed by Ni-silicidation of theSi layer 15 a expands in the horizontal direction as illustrated inFIG. 2B so as to come into contact with side surfaces of the N+ region 2 a and the P+ region 3 a. - According to a CMOS inverter circuit of the third embodiment, the Ni layers 19 a and 16 a are formed above and below the
Si layer 15 a. Accordingly, when a heat treatment is performed subsequently as illustrated inFIG. 2B , expansion occurs evenly in upward and downward directions centering about the height near the interface between the N+ region 2 a and the P+ region 3 a, thereby establishing connection to the N+ region 2 a and the P+ region 3 a. Therefore, the third embodiment achieves the same effect as the second embodiment. - An SGT-including CMOS inverter circuit according to a fourth embodiment of the present invention is described below with reference to
FIGS. 4A and 4B . - As illustrated in
FIG. 4A , aSi layer 30 a, aNi layer 31 a, and aSi layer 30 b are formed on theSiN layer 12 by a bias sputtering method as illustrated inFIG. 2A while aSi layer 30 c, aNi layer 31 b, and aSi layer 30 d are formed on theSi pillar 6. Subsequently, a SiO2 layer 33 a is formed on theSi layer 30 a and a SiO2 layer 33 b is formed on theSi layer 30 d by a bias sputtering method. Then theSi layer 30 c, theNi layer 31 b, theSi layer 30 d, and the SiO2 layer 33 b on theSi pillar 6 are removed. - Next, as illustrated in
FIG. 4B , for example, a heat treatment at 550° C. is conducted by the method illustrated inFIG. 2B so as to diffuse the Ni atoms in theNi layer 31 a into the Si layers 30 a and 30 b so as to form aNiSi layer 32 a. TheNiSi layer 32 a expands and acquires a larger volume than the Si layers 30 a and 30 b. The SiO2 layer 33 a on theNiSi layer 32 a suppresses expansion of theNiSi layer 32 a in the upward direction. Meanwhile, theSiN layer 12 below theNiSi layer 32 a suppresses expansion of theNiSi layer 32 a in the downward direction. The SiO2 layer 33 a and theSiN layer 12 above and below theNiSi layer 32 a promote expansion of theNiSi layer 32 a in the horizontal direction (capping effect) so that the side surface of theNiSi layer 32 a securely comes into contact with the side surfaces of the N+ region 2 a and the P+ region 3 a. - According to the fourth embodiment, expansion of the
NiSi layer 32 a in the horizontal direction can be accelerated by the capping effect of the SiO2 layer 33 a compared to the method (methods described with reference toFIGS. 1H , 2B, and 3, for example) in which an Ni-silicidation is performed without depositing the SiO2 layer 33 a. Accordingly, because the HfO2 layers 9 a and 9 b, TiN layers 10 b and 10 c, and SiO2 layers 11 b and 11 c surrounding the outer periphery of theSi pillar 6 are thick, the connection between theNiSi layer 32 a and the N+ region 2 a and the P+ region 3 a can be easily established even in a case where the N+ region 2 a and the P+ region 3 a are greatly distanced from theSi layer 30 a, theNi layer 31 a, and theSi layer 30 b in thespace 17 a. - An SGT-including CMOS inverter circuit according to a fifth embodiment of the present invention is described below with reference to
FIGS. 5A to 5C . - As illustrated in
FIG. 5A , Si and Ni atoms are injected in a direction perpendicular to the upper surface of the i-layer substrate 1 by, for example, a bias sputtering method illustrated inFIG. 2A so as to form aSi layer 30 a, aNi layer 31 a, and aSi layer 30 b on theSiN layer 12 while forming aSi layer 30 c, aNi layer 31 b, and aSi layer 30 d on theSi pillar 6. Then theSi layer 30 c, theNi layer 31 b, and theSi layer 30 d on theSi pillar 6 are removed. Then theSi layer 30 a, theNi layer 31 a, and theSi layer 30 b are etched by a lithography method and a RIE method so as to form a Si layer 30 aa, aNi layer 31 aa, and a Si layer 30 bb. Here, the shapes of the Si layer 30 aa, theNi layer 31 aa, and the Si layer 30 bb in plan view are the same as those illustrated inFIG. 1I . Aspace 17 a illustrated inFIG. 2A is formed between the N+ region 2 a and the P+ region 3 a and the Si layer 30 aa, theNi layer 31 aa, and the Si layer 30 aa. - Next, as illustrated in
FIG. 5B , a SiO2 layer 35 is deposited so as to cover the entirety by, for example, a CVD method. - Next, as illustrated in
FIG. 5C , a heat treatment at, for example, 550° C. is performed so as to diffuse the Ni atoms in theNi layer 31 aa into the Si layers 30 aa and 30 bb so as to form aNiSi layer 36. TheNiSi layer 36 expands to have a volume larger than the Si layers 30 aa and 30 bb and comes into contact with the side surfaces of the N+ region 2 a and the P+ region 3 a. - According to the fifth embodiment, since the SiO2 layer 35 is formed so as to cover the upper surface and the side surface of the
NiSi layer 36, expansion of theNiSi layer 36 is suppressed in the regions contacting the SiO2 layer 35 and theSiN layer 12. Consequently, expansion of the side surface of theNiSi layer 36 facing the side surfaces of the N+ region 2 a and the P+ region 3 a is accelerated. As a result, connection between theNiSi layer 36 and the N+ region 2 a and the P+ region 3 a can be easily established. - An SGT-including CMOS inverter circuit according to a sixth embodiment of the present invention is described below with reference to
FIG. 6 . - As illustrated in
FIG. 6 , Si atoms and Ni atoms are simultaneously injected in a direction perpendicular to the upper surface of the i-layer substrate 1 by, for example, a bias sputtering method so as to form, instead of the Ni layers 31 a and 31 b illustrated inFIG. 2A , Ni—Si layers (hereinafter, a mixed layer containing Ni atoms and Si atoms is referred to as a “Ni—Si layer”) 37 a and 37 b on theSiN layer 12 and theSi pillar 6, in which the Ni atom concentration in the Ni—Si layers 37 a and 37 b is higher than the Si atom concentration in the Ni—Si layers 37 a and 37 b. Then theSi layer 30 c, the Ni—Si layer 37 b, and theSi layer 30 d on theSi pillar 6 are removed. Subsequently, a heat treatment at, for example, 550° C. was performed so as to Ni-silicidize the Ni—Si layer 37 a and diffuse excess Ni atoms in the Ni—Si layer 37 a into the Si layers 30 a and 30 b so as to form aNiSi layer 32 as illustrated inFIG. 2B . - In the second embodiment referring to
FIG. 2A , voids sometimes occur in theNiSi layer 32 in portions where theNi layer 31 a used to exist depending on the thickness, film quality, and silicidation conditions of theNi layer 31 a. In contrast, according to the sixth embodiment, the portion where the Ni—Si layer 37 a used to exist is silicided first and thus occurrence of voids is prevented. - An SGT-including semiconductor device according to a seventh embodiment of the present invention is described below with reference to
FIG. 7 . - As illustrated in
FIG. 7 , prior to the last step of manufacturing an SGT-including semiconductor device, theNiSi layer 18 a is in contact with the N+ region 2 a and the P+ region 3 a and Ni atoms from theNiSi layer 18 a diffuse so as to form aNiSi layer 38 that lies in the N+ region 2 a and the P+ region 3 a and penetrates theSi pillar 6. TheNiSi layer 38 is preferably formed at the outer periphery of theSi pillar 6 after forming theSiN layer 20 functioning as a material for preventing bending and collapsing of theSi pillar 6. - According to the first to sixth embodiments, the NiSi layers 18 a, 32, 32 a, and 36 are in contact with the outer peripheral side surfaces of the N+ region 2 a and the P+ region 3 a. When such a contact is established or when a heat treatment process is subsequently performed, a Ni silicide layer is formed in the surface layers of the N+ region 2 a and the P+ region 3 a. In contrast, according to the seventh embodiment, the
NiSi layer 38 is formed so as to lie within the N+ region 2 a and the P+ region 3 a and penetrate theSi pillar 6. Since theNiSi layer 38 is formed so as to spread from the outer peripheral portions of the N+ region 2 a and the P+ region 3 a toward the center portion, the donor and acceptor impurities in the N+ region 2 a and the P+ region 3 a are swept out from theNiSi layer 38. As a result, the donor and acceptor impurity concentrations near the interfaces between the NiSi layer and the N+ region 2 a and the P+ region 3 a are increased. Consequently, the contact resistance between theNiSi layer 18 a and the N+ region 2 a and the P+ region 3 a can be decreased. - An SGT-including semiconductor device according to an eighth embodiment of the present invention is described below with reference to
FIGS. 8A and 8B . - As illustrated in
FIG. 8A , TiN layers 40 a and 40 b are formed instead of the Si layers 15 a and 15 b and SiO2 layers 41 a and 41 b are formed instead of the Ni layers 16 a and 16 b by a bias sputtering method as illustrated inFIG. 1H . During this process, as inFIG. 1H , aspace 17 is formed between the N+ region 2 a and the P+ region 3 a and theTiN layer 40 a and the SiO2 layer 41 a. - Next, as illustrated in
FIG. 8B , theTiN layer 40 b and the SiO2 layer 41 b are removed and then a heat treatment at, for example, 650° C. is performed. As a result of this heat treatment, theTiN layer 40 a undergoes plastic deformation and expands in the horizontal direction and aTiN layer 40 c after plastic deformation connects to the side surfaces of the N+ region 2 a and the P+ region 3 a. TheTiN layer 40 a is sandwiched between theSiN layer 12 and the SiO2 layer 41 a having different thermal expansion coefficients and thus stress-induced strain is increased. Accordingly, theTiN layer 40 c easily undergoes plastic deformation during which deformation in the upward direction is suppressed and expansion of theTiN layer 40 c in the horizontal direction is accelerated. Thus, the connection to the N+ region 2 a and the P+ region 3 a is easily established. - In the first embodiment, when the
NiSi layer 18, which is a conductor layer, is being formed as a result of diffusion of Ni atoms from theNi layer 16 a into theSi layer 15 a (Ni silicidation), theNiSi layer 18 expands in the horizontal direction and connects to the N+ region 2 a and the P+ region 3 a. In contrast, in the eighth embodiment, theTiN layer 40 c undergoing plastic deformation by the heat treatment expands in the horizontal direction and connects to the N+ region 2 a and the P+ region 3 a as in the first embodiment. As a result, the eighth embodiment achieves the same effect as the first embodiment. - An SGT-including semiconductor device according to an eighth embodiment of the present invention is described below with reference to
FIGS. 9A to 9D . A CMOS inverter circuit according to the ninth embodiment is manufactured by the same steps as those illustrated inFIGS. 1A to 1L in the first embodiment except for the following structural differences. - As illustrated in
FIG. 9A , after the step ofFIG. 1F , apoly Si layer 42 is formed to cover the entirety by, for example, a CVD method. As a result, apoly Si layer 42 that surrounds the outer peripheries of the N+ region 2 a and the P+ region 3 a is formed. - Next, as illustrated in
FIG. 9B , Si and Ni atoms are injected in a direction perpendicular to the upper surface of the i-layer substrate 1 from above theSi pillar 6 so as to form aSi layer 43 and aNi layer 44 on theSiN layer 12. During this process, aspace 17 b is formed between theSi layer 43 and the N+ region 2 a and the P+ region 3 a. - Next, as illustrated in
FIG. 9C , thepoly Si layer 42 in contact with the SiO2 layer 11 c surrounding theSi pillar 6 is removed by using theNi layer 44 as a mask so as to form apoly Si layer 42 a. - Next, as illustrated in
FIG. 9D , a heat treatment at, for example, 550° C. is performed to diffuse the Ni atoms in theNi layer 44 into aSi layer 43. During this process, theNiSi layer 45 expands in the horizontal direction due to Ni-silicidation of theNiSi layer 45 and comes into contact with thepoly Si layer 42 a formed on the side surfaces of the N+ region 2 a and the P+ region 3 a. In such a case, because of the diffusion of donor and acceptor impurities from the N+ region 2 a and the P+ region 3 a into thepoly Si layer 42 a and Ni silicidation of thepoly Si layer 42 a in contact with theNiSi layer 45, theNiSi layer 45 is electrically connected to the N+ region 2 a and the P+ region 3 a. - According to the ninth embodiment, the
NiSi layer 45 does not make direct contact with the N+ region 2 a and the P+ region 3 a but with thepoly Si layer 42 a surrounding the N+ region 2 a and the P+ region 3 a. Thispoly Si layer 42 a serves as a reinforcing material that prevents bending and collapsing of theSi pillar 6. The effect of preventing bending and collapsing of theSi pillar 6 is more effectively exhibited as the diameter of theSi pillar 6 decreases. - Note that in the first embodiment, Si and Ni atoms are injected in a direction perpendicular to the upper surface of the i-
layer substrate 1 by a bias sputtering method so as to deposit the Si layers 15 a and 15 b and the Ni layers 16 a and 16 b on theSiN layer 12 and the top portion of theSi pillar 6. The bias sputtering method used here involves applying radiofrequency voltage to the substrate electrode plate on which the i-layer substrate 1 is placed and a counter electrode plate distant from the i-layer substrate 1 while applying voltage to the substrate electrode plate so as to deposit Si atom ions, Ni atom ions, etc., over the i-layer substrate 1. Any method other than the bias sputtering method may be employed as long as theSi layer 15 a and theNi layer 16 a can be formed by injecting Si and Ni atoms in a direction perpendicular to the upper surface of the i-layer substrate 1. Such a method can also be used to connect theTiN layer 10 d to theNiSi layer 22. Moreover, this method is also applicable to other embodiments of the present invention. - In the first embodiment, the
Si layer 15 a and theNi layer 16 a are formed and subjected to a heat treatment so as to diffuse Ni atoms in theNi layer 16 a into theSi layer 15 a, thereby silicidizing theSi layer 15 a into theNiSi layer 18. During this process, theNiSi layer 18 expands and connects to the N+ region 2 a and the P+ region 3 a which had been distant. Any other metal layer, such as titanium (Ti) or cobalt (Co), may be used instead of theNi layer 16 a as long as metal atoms diffuse into theSi layer 15 a and theSi layer 15 a expands to form an alloy layer. This is also applicable to the connection between theTiN layer 10 d and theNiSi layer 22. This is also applicable to other embodiments of the present invention. - In the first embodiment, the
Si layer 15 a and theNi layer 16 a are formed and subjected to a heat treatment so as to diffuse Ni atoms in theNi layer 16 a into theSi layer 15 a, thereby silicidizing theSi layer 15 a into theNiSi layer 18. During this process, theNiSi layer 18 expands and connects to the N+ region 2 a and the P+ region 3 a which had been distant. However, any other material layer can be used as long as material atoms can be injected in a direction perpendicular to the upper surface of the i-layer substrate 1 so as to form a material layer including one or more conductor layers (semiconductor layers or conductor layers) on the i-layer substrate 1 and the alloyed conductor material layers can expand in the horizontal direction by the subsequent heat treatment so as to connect to the side surfaces of the N+ region 2 a and the P+ region 3 a. This is also applicable to the connection between theTiN layer 10 d and theNiSi layer 22. This is also applicable to other embodiments of the present invention. - In the first embodiment, a
Si pillar 6 whose side surface forms a substantially right angle (about 90°) with the upper surface of the i-layer substrate 1 is formed, aSi layer 15 a and aNi layer 16 a are formed on theSiN layer 12, and aSi layer 15 b and aNi layer 16 b are formed on the top of theSi pillar 6. Because the angle formed between the side surface of theSi pillar 6 and the upper surface of the i-layer substrate 1 is a substantially right angle, deposition of Si and Ni atoms on the side surface of the SiO2 layer 11 c surrounding the outer periphery of theSi pillar 6 is prevented. This angle at the side surface of theSi pillar 6 can be less than 90° as long as Si and Ni atoms do not deposit on the side surface of the SiO2 layer 11 c surrounding the outer periphery of theSi pillar 6. For example, in a bias sputtering method, the bias voltage applied between the substrate electrode plate on which the i-layer substrate 1 is placed and the counter electrode plate distant from the i-layer substrate 1 is controlled so as to prevent deposition of Si and Ni atoms on the side surface of the SiO2 layer 11 c (refer toNPL 3 for the basic procedure). Deposition of Si and Ni atoms on the side surface of the SiO2 layer 11 c should not be a problem as long as the atoms can be easily etched away with a diluted hydrofluoric acid, for example. This is also applicable to the connection between theTiN layer 10 d and theNiSi layer 22. This is also applicable to other embodiments of the present invention. - In the first embodiment, the connection between the
NiSi layer 18 and the N+ region 2 a and the P+ region 3 a is established by a heat treatment inFIG. 1H . The connection between theNiSi layer 18 and the N+ region 2 a and the P+ region 3 a need only be established before the final step of manufacturing the SGT by expansion of theNiSi layer 18 a. This is also applicable to the connection between theTiN layer 10 d and theNiSi layer 22. This is also applicable to other embodiments of the present invention. - Referring to
FIG. 1L related to the first embodiment, it has been described that theNiSi layer 29 is formed in the side surface layers of the N+ region 2 a and the P+ region 3 a so as to contact theNiSi layer 18 a. TheNiSi layer 29 is formed after theNiSi layer 29 has come into contact with the side surfaces of the N+ region 2 a and the P+ region 3 a as a result of diffusion of the Ni atoms into the N+ region 2 a and the P+ region 3 a through the heating process conducted before and in the step illustrated inFIG. 1L . NiSi layers similar to theNiSi layer 29 are formed in the side surface layers of the N+ region 2 a and the P+ region 3 a in contact with the NiSi layers 18 a, 32, 32 a, 36, and 45. - In
FIG. 8B related to the eighth embodiment, a Ti atom-containing alloy layer is formed in the side surface layers of the N+ region 2 a and the P+ region 3 a in contact with theTiN layer 40 c as a result of the subsequent heating process. - In the first embodiment, an SGT is a pillar-shaped semiconductor device in which the technical idea of the present invention is applied to the connection between the
NiSi layer 18 a and the N+ region 2 a and the P+ region 3 a and the connection between theTiN layer 10 d and theNiSi layer 22. Alternatively, one of the connection form can be applied to a pillar-shaped semiconductor device. This is also applicable to other embodiments of the present invention. - In the second to eighth embodiments, the technical idea of the present invention is applied to the connection between the N+ region 2 a and the P+ region 3 a and the NiSi layers 18, 18 a, 32, 32 a, and 36 or the
TiN layer 40 a. However, the manufacturing methods of these embodiments is also applicable to the connection to theTiN layer 10 d. - In the sixth embodiment, the Ni—
Si layer 37 a containing Ni and Si is used instead of theNi layer 31 a. This is also applicable to other embodiments of the present invention. This is also applicable to the connection to theTiN layer 10 d. - In the eighth embodiment, the SiO2 layer 41 a is formed on the
TiN layer 40 a. Alternatively, as illustrated inFIG. 5B , the same effect can be obtained by performing patterning on theTiN layer 40 a by a lithography method and a RIE method, coating the entirety with the SiO2 layer 35 by a CVD method, and performing a heat treatment. - In the eighth embodiment, the case in which the
TiN layer 40 a is used is described. Alternatively, for example, the technical idea of the present invention can be applied to a metal layer such as Ta Ti, or Pt or an alloy layer as long as the layer can connect to the N+ region 2 a and the P+ region 3 a by undergoing plastic deformation by being heat-treated. This is also applicable to the connection to theNiSi layer 22. - In connecting the
TiN layer 40 c to the N+ region 2 a and the P+ region 3 a in the eighth embodiment, a Ti alloy layer may be formed in the side surface layers of the N+ region 2 a and the P+ region 3 a or a Ti alloy layer may be formed inside as illustrated inFIG. 7 . - In the ninth embodiment, the
poly Si layer 42 is formed so as to surround the side surfaces of the N+ region 2 a and the P+ region 3 a. Instead of the poly Si material, any other semiconductor material or metal-containing material can be used as long as theNiSi layer 45 can be electrically connected to the N+ region 2 a and the P+ region 3 a. - In the ninth embodiment, as in the first embodiment, the
Ni layer 44 is formed on theSi layer 43. The technical idea of the present invention is also applicable to the conductor connecting method similar to those in the second to eighth embodiments. - In the embodiments described above, examples in which a silicon (Si) pillar is used as a semiconductor pillar have been described. However, the technical idea of the present invention is not limited to this and is applicable to an SGT-including semiconductor device that uses a semiconductor pillar composed of a semiconductor material other than silicon.
- The embodiments described above relate to a method for manufacturing a semiconductor device in which two SGTs are formed in one Si pillar. However, the technical idea of the present invention is not limited to this and is applicable to a method for manufacturing an SGT-including semiconductor device in which one SGT or three or more SGTs are formed in one semiconductor pillar.
- In the first embodiment, an N-channel SGT is formed in a lower portion of the
Si pillar 6 and a P-channel SGT is formed in an upper portion of theSi pillar 6. The technical idea of the present invention is applicable to a circuit in which a P-channel SGT is formed in the lower portion and an N-channel SGT is formed in the upper portion. Moreover, the technical idea of the present invention is applicable to formation of a circuit that includes N-channel SGTs or P-channel SGTs in both the upper and lower portions. This is also applicable to other embodiments of the present invention. - The
Si layer 15 a in the first embodiment may be replaced by any of other material layers such as a SiGe material layer as long as the material layer expands in the horizontal direction by a heat treatment performed after formation of the initial material layer on theSiN layer 12 so that the material layer connects to the N+ region 2 a and the P+ region 3 a. This is also applicable to the connection between theTiN layer 10 d and theNiSi layer 22. This is also applicable to other embodiments of the present invention. - The embodiments described above each include an SGT having a structure in which the gate SiO2 layer (gate insulating layer) 9 c is formed at the outer periphery of a semiconductor pillar such as the
Si pillar 6 and a TiN layer (gate conductor layer) 10 d is formed at the outer periphery of the gate SiO2 layer 9 c. However, the structure is not limited to this. Since a flash memory element that has a conductor layer electrically floating between theTiN layer 10 d and the gate SiO2 layer 9 c or a charge storage layer such as a SiN layer, for example, is also a type of SGTs, the technical idea of the present invention can be applied to a method for manufacturing such a flash memory element. - In the embodiments described above, the technical idea of the present invention are applied to CMOS inverter circuits. However, the technical idea of the present invention is also applicable to other semiconductor devices such as circuits, devices, and elements.
- In the first embodiment, the gate conductor layers are the TiN layers 10 b and 10 d. This is not limiting and the gate conductor layers may be composed of other metal materials. The gate conductor layers may have a multilayer structure including a metal layer and a poly Si layer, for example. The impurity regions such as N+ region 2 a and the P+ region 3 a may have different conductivity types as with the N+ region 2 a and the P+ region 3 a or may be constituted by impurity layers of the same conductivity type. When the impurity regions have the same conductivity type, two impurity layers form one impurity region of the same conductivity type as a whole. Similarly, when the impurity regions have different conductivity types the two impurity layers also form one impurity region as a whole. Such a structure is also applicable to other embodiments of the present invention.
- In the embodiments described above, a SOI substrate can be used instead of the i-
layer substrate 1. - In the first embodiment, the N+ region 2 a and the P+ region 3 a are in contact with each other. The technical idea of the present invention is applicable to the cases in which an insulating layer is formed between the N+ region 2 a and the P+ region 3 a. This is also applicable to other embodiments of the present invention.
- The present invention is subject to various embodiments and modifications without departing from the spirit and scope of the present invention in a broad sense. The embodiments described above are illustrative examples of the present invention and do not limit the scope of the present invention. The embodiments and modifications can be freely combined. If needed, some of the structural features of the embodiments described above may be omitted but such an omission may still fall within the technical scope of the present invention.
- According to a method for manufacturing a pillar-shape semiconductor device, a highly integrated semiconductor device is obtained.
- The following is a summary list of reference numerals and the corresponding structure used in the above description of the invention:
- i-layer substrate
- 1 a, 4, 4 a i layer
- 2, 2 a, 7, 7 a N+ region
- 3, 3 a, 24 P+ region
- 5, 5 a, 8, 11, 11 a, 11 b, 11 c, 11 d, 23, 27, 33 a, 33 b, 35, 41 a, 41 b SiO2 layer
- 6 Si pillar
- 9, 9 a, 9 b, 9 c HfO2 layer
- 10, 10 a, 10 b, 10 c, 10 d, 40 a, 40 b, 40 c TiN layer
- 12, 20 SiN layer
- 13 resist layer
- 14 a, 14 b TiO layer
- 15 a, 15 b, 30 a, 30 b, 30 c, 30 d, 30 aa, 30 bb, 43 Si layer
- 17, 17 a, 17 b space
- 18, 18 a, 19 a, 19 b, 19 c, 22, 23 a, 23 b, 23 c, 29, 30 a, 30 b, 32 a, 36, 38, 45 NiSi layer
- 21 a, 21 b opening
- 28 a, 28 b, 28 c, 28 d, 43 a, 43 b, 43 c, 43 d contact hole
- 31 a, 31 b, 31 aa, 44 Ni layer
- 37 a, 37 b Ni—Si layer
- 42, 42 a poly Si layer
- Vin input wiring metal layer
- Vdd power supply wiring metal layer
- Vout output wiring metal layer
- Vss ground wiring metal layer
- V1, V2 wiring metal layer
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US20160155842A1 (en) * | 2014-11-27 | 2016-06-02 | Unisantis Electronics Singapore Pte. Ltd. | Pillar-shaped semiconductor device and method for producing the same |
US10211340B2 (en) | 2015-12-18 | 2019-02-19 | Unisantis Electronics Singapore Pte. Ltd. | Method for producing pillar-shaped semiconductor device |
US20190109140A1 (en) * | 2015-04-06 | 2019-04-11 | Unisantis Electronics Singapore Pte. Ltd. | Method for producing pillar-shaped semiconductor device |
US10535756B2 (en) | 2015-12-18 | 2020-01-14 | Unisantis Electronics Singapore Pte. Ltd. | Method for producing pillar-shaped semiconductor device |
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US8212298B2 (en) | 2008-01-29 | 2012-07-03 | Unisantis Electronics Singapore Pte Ltd. | Semiconductor storage device and methods of producing it |
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US20160155842A1 (en) * | 2014-11-27 | 2016-06-02 | Unisantis Electronics Singapore Pte. Ltd. | Pillar-shaped semiconductor device and method for producing the same |
US9673321B2 (en) * | 2014-11-27 | 2017-06-06 | Unisantis Electronics Singapore Pte. Ltd. | Pillar-shaped semiconductor device and method for producing the same |
US10050124B2 (en) | 2014-11-27 | 2018-08-14 | Unisantis Electronics Singapore Pte. Ltd. | Method for producing a pillar-shaped semiconductor device |
US20190109140A1 (en) * | 2015-04-06 | 2019-04-11 | Unisantis Electronics Singapore Pte. Ltd. | Method for producing pillar-shaped semiconductor device |
US10651180B2 (en) * | 2015-04-06 | 2020-05-12 | Unisantis Electronics Singapore Pte. Ltd. | Method for producing pillar-shaped semiconductor device |
US10211340B2 (en) | 2015-12-18 | 2019-02-19 | Unisantis Electronics Singapore Pte. Ltd. | Method for producing pillar-shaped semiconductor device |
US10535756B2 (en) | 2015-12-18 | 2020-01-14 | Unisantis Electronics Singapore Pte. Ltd. | Method for producing pillar-shaped semiconductor device |
US10553715B2 (en) | 2015-12-18 | 2020-02-04 | Unisantis Electronics Singapore Pte. Ltd. | Semiconductor device including SGT and method for producing the same |
US10644151B2 (en) | 2015-12-18 | 2020-05-05 | Unisantis Electronics Singapore Pte. Ltd. | Semiconductor device including SGT |
US11183582B2 (en) | 2015-12-18 | 2021-11-23 | Unisantis Electronics Singapore Pte. Ltd. | Method for producing pillar-shaped semiconductor device |
US11211488B2 (en) | 2015-12-18 | 2021-12-28 | Unisantis Electronics Singapore Pte. Ltd. | Method for producing a pillar-shaped semiconductor device |
US11282958B2 (en) | 2015-12-18 | 2022-03-22 | Unisantis Electronics Singapore Pte. Ltd. | Semiconductor device including SGT |
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