US20150283672A1 - Chemical mechanical polishing conditioner having different heights - Google Patents

Chemical mechanical polishing conditioner having different heights Download PDF

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Publication number
US20150283672A1
US20150283672A1 US14/676,992 US201514676992A US2015283672A1 US 20150283672 A1 US20150283672 A1 US 20150283672A1 US 201514676992 A US201514676992 A US 201514676992A US 2015283672 A1 US2015283672 A1 US 2015283672A1
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US
United States
Prior art keywords
abrasive
substrate
different heights
mechanical polishing
chemical mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/676,992
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English (en)
Inventor
Jui-Lin Chou
Chia-Chun Wang
Chia-Feng CHIU
Wen-Jen Liao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kinik Co
Original Assignee
Kinik Co
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Filing date
Publication date
Application filed by Kinik Co filed Critical Kinik Co
Assigned to KINIK COMPANY reassignment KINIK COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHIU, CHIA-FENG, CHOU, JUI-LIN, LIAO, WEN-JEN, WANG, CHIA-CHUN
Publication of US20150283672A1 publication Critical patent/US20150283672A1/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
US14/676,992 2014-04-08 2015-04-02 Chemical mechanical polishing conditioner having different heights Abandoned US20150283672A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW103112815 2014-04-08
TW103112815A TW201538276A (zh) 2014-04-08 2014-04-08 非等高度之化學機械研磨修整器

Publications (1)

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US20150283672A1 true US20150283672A1 (en) 2015-10-08

Family

ID=54208947

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/676,992 Abandoned US20150283672A1 (en) 2014-04-08 2015-04-02 Chemical mechanical polishing conditioner having different heights

Country Status (2)

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US (1) US20150283672A1 (zh)
TW (1) TW201538276A (zh)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160346901A1 (en) * 2015-06-01 2016-12-01 Kinik Company Chemical Mechanical Polishing Conditioner
WO2018169536A1 (en) * 2017-03-16 2018-09-20 Intel Corporation Conditioning disks for chemical mechanical polishing
US20190091832A1 (en) * 2005-05-16 2019-03-28 Chien-Min Sung Composite conditioner and associated methods
CN109922924A (zh) * 2016-09-15 2019-06-21 恩特格里斯公司 Cmp垫修整组合件
JP2020123751A (ja) * 2020-05-07 2020-08-13 キオクシア株式会社 ドレッサーの製造方法
CN113439010A (zh) * 2019-02-13 2021-09-24 3M创新有限公司 具有精确成形特征部的磨料元件、用其制成的磨料制品及其制造方法
WO2021216112A1 (en) * 2020-04-21 2021-10-28 Smart Pad LLC Chemical-mechanical polishing pad with protruded structures
US20220241929A1 (en) * 2021-02-01 2022-08-04 Kinik Company Ltd. Chemical mechanical polishing pad conditioner and manufacturing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI681843B (zh) * 2017-12-01 2020-01-11 詠巨科技有限公司 拋光墊修整方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6213856B1 (en) * 1998-04-25 2001-04-10 Samsung Electronics Co., Ltd. Conditioner and conditioning disk for a CMP pad, and method of fabricating, reworking, and cleaning conditioning disk
US8398466B2 (en) * 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US9067302B2 (en) * 2013-03-15 2015-06-30 Kinik Company Segment-type chemical mechanical polishing conditioner and method for manufacturing thereof
US9132526B2 (en) * 2011-03-07 2015-09-15 Entegris, Inc. Chemical mechanical planarization conditioner

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6213856B1 (en) * 1998-04-25 2001-04-10 Samsung Electronics Co., Ltd. Conditioner and conditioning disk for a CMP pad, and method of fabricating, reworking, and cleaning conditioning disk
US8398466B2 (en) * 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US9132526B2 (en) * 2011-03-07 2015-09-15 Entegris, Inc. Chemical mechanical planarization conditioner
US9067302B2 (en) * 2013-03-15 2015-06-30 Kinik Company Segment-type chemical mechanical polishing conditioner and method for manufacturing thereof

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190091832A1 (en) * 2005-05-16 2019-03-28 Chien-Min Sung Composite conditioner and associated methods
US20160346901A1 (en) * 2015-06-01 2016-12-01 Kinik Company Chemical Mechanical Polishing Conditioner
CN109922924A (zh) * 2016-09-15 2019-06-21 恩特格里斯公司 Cmp垫修整组合件
WO2018169536A1 (en) * 2017-03-16 2018-09-20 Intel Corporation Conditioning disks for chemical mechanical polishing
CN113439010A (zh) * 2019-02-13 2021-09-24 3M创新有限公司 具有精确成形特征部的磨料元件、用其制成的磨料制品及其制造方法
EP3924146A4 (en) * 2019-02-13 2022-11-09 3M Innovative Properties Company ABRASIVE MEMBERS HAVING PRECISE SHAPE FEATURES, ABRASIVE ARTICLES MANUFACTURED THEREOF, AND METHODS OF MAKING THEM
WO2021216112A1 (en) * 2020-04-21 2021-10-28 Smart Pad LLC Chemical-mechanical polishing pad with protruded structures
JP2020123751A (ja) * 2020-05-07 2020-08-13 キオクシア株式会社 ドレッサーの製造方法
JP7068380B2 (ja) 2020-05-07 2022-05-16 キオクシア株式会社 ドレッサーの製造方法
US20220241929A1 (en) * 2021-02-01 2022-08-04 Kinik Company Ltd. Chemical mechanical polishing pad conditioner and manufacturing method thereof
JP2022117934A (ja) * 2021-02-01 2022-08-12 中國砂輪企業股▲ふん▼有限公司 化学機械研磨パッドのコンディショナー及びその製造方法
JP7334225B2 (ja) 2021-02-01 2023-08-28 中國砂輪企業股▲ふん▼有限公司 化学機械研磨パッドのコンディショナー及びその製造方法

Also Published As

Publication number Publication date
TW201538276A (zh) 2015-10-16

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Legal Events

Date Code Title Description
AS Assignment

Owner name: KINIK COMPANY, TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHOU, JUI-LIN;WANG, CHIA-CHUN;CHIU, CHIA-FENG;AND OTHERS;REEL/FRAME:035318/0984

Effective date: 20150128

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION