US20150008015A1 - Printed circuit board and method of fabricating the same - Google Patents

Printed circuit board and method of fabricating the same Download PDF

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Publication number
US20150008015A1
US20150008015A1 US14/368,198 US201214368198A US2015008015A1 US 20150008015 A1 US20150008015 A1 US 20150008015A1 US 201214368198 A US201214368198 A US 201214368198A US 2015008015 A1 US2015008015 A1 US 2015008015A1
Authority
US
United States
Prior art keywords
circuit board
printed circuit
thermal conductive
conductive layer
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/368,198
Other languages
English (en)
Inventor
Yong Seok Cho
Chang Sung Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Assigned to LG INNOTEK CO., LTD. reassignment LG INNOTEK CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHO, YONG SEOK, KIM, CHANG SUNG
Publication of US20150008015A1 publication Critical patent/US20150008015A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0227—Split or nearly split shielding or ground planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Definitions

  • the disclosure relates to a printed circuit board and a method of fabricating the same.
  • the disclosure relates to a printed circuit board capable of significantly improving heat radiation efficiency and cooling efficiency, and a method of fabricating the same.
  • PCB printed circuit board
  • electrical parts such as integrated circuits, resistors, or switches are soldered.
  • circuits used in a computer and various display devices are mounted on the PCB.
  • some heating electronic parts emit the slight amount of heat, so that the operation of the electronic parts may be not damaged by the natural cooling.
  • other heating electronic parts emit a great amount of heat, so that the temperature of the electronic parts is continuously increased in spite of the natural cooling.
  • the electronic parts may be erroneously operated and damaged due to the increase of the temperature thereof.
  • the heat emission causes the problems related to the reliability of the electronic parts.
  • thermal conductivity associated with the conduction of heat energy generated from the parts makes a trade-off relation with the electrical conductivity. Accordingly, the PCB satisfying the two factors may not be easily fabricated.
  • the embodiment of the disclosure is to provide a printed circuit board capable of improving heat radiation efficiency and reliability and a method of fabricating the same.
  • the printed circuit board includes an insulating layer, a copper foil formed on the insulating layer and formed therein with a groove to expose a portion of a top surface of the insulating layer, and a thermal conductive layer filled in the groove.
  • the printed circuit board having superior heat radiation and cooling functions can be fabricated.
  • a cooling structure such as a fan or a cooling pipe is not required. Accordingly, the fabricating cost and time can be reduced.
  • FIG. 1 is a sectional view showing the temperature variation of a printed circuit board according to the related art
  • FIG. 2 is a top view showing the printed circuit board according to the embodiment of the disclosure.
  • FIG. 3 is a sectional view showing a method of fabricating the printed circuit board according to the embodiment of the disclosure
  • FIG. 4 is a sectional view showing a method of fabricating a printed circuit board according to another embodiment of the disclosure.
  • FIG. 5 is a table showing the temperature variation of the printed circuit board according to the embodiment of the disclosure.
  • FIG. 1 is a sectional view showing the temperature variation of the printed circuit board according to the related art.
  • a high temperature is represented at a section b having a copper foil
  • a low temperature is represented at sections a and c without the copper foil.
  • the thermal conductivity is relatively low, the discrete section of the thermal conductivity exists. Accordingly, the temperature is not effectively distributed throughout the whole sections, but concentrated on one section. Therefore, the reliability for the device may be degraded.
  • FIG. 2 is a top view showing the printed circuit board according to the embodiment of the disclosure.
  • the printed circuit board includes a copper foil 200 having a predetermined pattern on an insulating layer 100 and a heat conduction layer 250 formed at a region in which the copper foil 200 is cut.
  • the heat conduction layer 250 is formed at the region in which the copper foil 200 is cut, so that the thermal conductivity between copper foils can be improved.
  • FIG. 3 is a sectional view showing the method of fabricating the printed circuit board according to the embodiment of the disclosure.
  • the copper foil 200 is formed with a predetermined pattern on the insulating layer 100 .
  • the printed circuit board is printed with circuits by laminating and etching a foil including copper (Cu), or a circuit pattern is printed on the printed circuit board through a screen printing scheme by using a composition used to print the circuit pattern.
  • the composition used to print the circuit pattern includes a flux composition including nano silver powders, nano copper powders, nano magnesium powders, nano tellurium powders, nano bismuth powders, nano zirconium powders, nano titanium powders, or conductive powders, which include a mixture of at least one of the above materials, and resin.
  • the conductive powders are ground in a size of about 50 nm for the use thereof, and the resin may include pine resin.
  • the conductive powders and the resin are put into a mixer and mixed with each other. Thereafter, the mixture is subject to a milling process, so that a paste-state composition for the printing of the printed circuit board can be obtained.
  • the composition is used to print the circuit pattern through the screen printing scheme.
  • the circuit pattern may be formed by using the copper foil 200 .
  • the copper foil 200 may include a material representing superior electrical conductivity.
  • a gap 201 is formed by the pattern so that copper foils 200 may be spaced apart from each other.
  • the gap 201 may be formed through a mechanical scheme using a laser. Therefore, the top surface of the insulating layer 100 may be exposed.
  • the width of the gap 201 may be in the range of 1 mm to 2 mm, but the embodiment is not limited thereto.
  • a thermal conductive layer 250 is filled in the gap 201 .
  • the thermal conductive layer 250 may have the same height as that of the copper foil 200 . In other words, the lateral side of the thermal conductive layer 250 may make contact with the copper foil 200 .
  • the thermal conductive layer 250 may be formed through a photoresist scheme, and may include non-metallic materials representing superior thermal conductivity.
  • a solder resist 300 is formed on top surfaces of the copper foil 200 and the thermal conductive layer 250 through a soldering mask work. Therefore, a portion of the top surfaces of the copper foil 200 and the thermal conductive layer 250 may be exposed.
  • FIG. 4 is a sectional view showing a method of fabricating a printed circuit board according to still another embodiment of the disclosure.
  • the copper foil 200 having a predetermined pattern is formed on the insulating layer 100 .
  • the copper foil 200 includes a material representing superior electrical conductivity.
  • the gap 201 is formed in such a manner that copper foils 200 are spaced apart from each other by the pattern. Therefore, a portion of the top surface of the insulating layer 100 may be exposed.
  • the width of the gap 201 may be in the range of 1 mm to 2 mm, but the embodiment is not limited thereto.
  • solder resist 300 is formed on the top surface of the copper foil 200 .
  • the solder resist 300 is not filled in the gap 201 .
  • the thermal conductive layer 250 is formed on the top surface of the insulating layer 100 so that the thermal conductive layer 250 is filled in the gap 201 .
  • the thermal conductive layer 250 may have the same height as those of the copper foil 200 and the solder resist 300 .
  • FIG. 5 is a table showing the temperature variation on the printed circuit board according to the embodiment of the disclosure.
  • the temperature variation is reduced according to the formation of the thermal conductive layer.
  • the temperature distribution of the PCB can be uniform.
US14/368,198 2011-12-23 2012-08-22 Printed circuit board and method of fabricating the same Abandoned US20150008015A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020110141772A KR101895416B1 (ko) 2011-12-23 2011-12-23 인쇄회로기판 및 그 제조방법
KR10-2011-0141772 2011-12-23
PCT/KR2012/006671 WO2013094842A1 (en) 2011-12-23 2012-08-22 Printed circuit board and method of fabricating the same

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/006671 A-371-Of-International WO2013094842A1 (en) 2011-12-23 2012-08-22 Printed circuit board and method of fabricating the same

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US15/184,511 Continuation US9814129B2 (en) 2011-12-23 2016-06-16 Printed circuit board and method of fabricating the same
US15/184,511 Division US9814129B2 (en) 2011-12-23 2016-06-16 Printed circuit board and method of fabricating the same

Publications (1)

Publication Number Publication Date
US20150008015A1 true US20150008015A1 (en) 2015-01-08

Family

ID=48668698

Family Applications (2)

Application Number Title Priority Date Filing Date
US14/368,198 Abandoned US20150008015A1 (en) 2011-12-23 2012-08-22 Printed circuit board and method of fabricating the same
US15/184,511 Active US9814129B2 (en) 2011-12-23 2016-06-16 Printed circuit board and method of fabricating the same

Family Applications After (1)

Application Number Title Priority Date Filing Date
US15/184,511 Active US9814129B2 (en) 2011-12-23 2016-06-16 Printed circuit board and method of fabricating the same

Country Status (5)

Country Link
US (2) US20150008015A1 (zh)
KR (1) KR101895416B1 (zh)
CN (1) CN104137662B (zh)
TW (1) TWI612865B (zh)
WO (1) WO2013094842A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106572591A (zh) * 2016-10-28 2017-04-19 广东欧珀移动通信有限公司 Pcb板及终端设备

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5068708A (en) * 1989-10-02 1991-11-26 Advanced Micro Devices, Inc. Ground plane for plastic encapsulated integrated circuit die packages
US5896271A (en) * 1997-07-21 1999-04-20 Packard Hughes Interconnect Company Integrated circuit with a chip on dot and a heat sink
US5912809A (en) * 1997-01-21 1999-06-15 Dell Usa, L.P. Printed circuit board (PCB) including channeled capacitive plane structure
US6219255B1 (en) * 1998-08-20 2001-04-17 Dell Usa, L.P. Method and apparatus for reducing EMI in a computer system
US6217987B1 (en) * 1996-11-20 2001-04-17 Ibiden Co. Ltd. Solder resist composition and printed circuit boards
US20010036065A1 (en) * 2000-04-26 2001-11-01 Matsushita Electric Industrial Co., Ltd. Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein
US20020162685A1 (en) * 2001-05-07 2002-11-07 Jeffrey Gotro Thermal dissipating printed circuit board and methods
US20060087037A1 (en) * 2004-10-22 2006-04-27 Phoenix Precision Technology Corporation Substrate structure with embedded chip of semiconductor package and method for fabricating the same
US20060183342A1 (en) * 2005-02-15 2006-08-17 Eastman Kodak Company Metal and metal oxide patterned device
US20060221585A1 (en) * 2005-04-05 2006-10-05 Brench Colin E Apparatus and method for reducing noise coupling
US20070082183A1 (en) * 2005-09-30 2007-04-12 Makoto Murai Circuit board
US7326858B2 (en) * 2002-12-24 2008-02-05 Samsung Electro-Mechanics Co., Ltd. Printed circuit board with embedded capacitors and manufacturing method thereof
US20100230138A1 (en) * 2007-03-30 2010-09-16 Toshiyuki Asahi Wiring board
US20110005815A1 (en) * 2009-07-08 2011-01-13 Chimei Innolux Corporation Conductive plate and touch panel including the same
US8217278B2 (en) * 2009-08-25 2012-07-10 Unimicron Technology Corp. Embedded wiring board and a manufacturing method thereof

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JP4711208B2 (ja) * 2006-03-17 2011-06-29 山栄化学株式会社 感光性熱硬化性樹脂組成物、並びにレジスト膜被覆平滑化プリント配線基板及びその製造法。
JP2008103548A (ja) * 2006-10-19 2008-05-01 Sumitomo Electric Ind Ltd 多層プリント配線板及びその製造方法
JP2008251950A (ja) * 2007-03-30 2008-10-16 Matsushita Electric Ind Co Ltd 配線基板
KR100962369B1 (ko) * 2008-06-26 2010-06-10 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN101861049B (zh) * 2009-04-08 2012-03-07 昆山市华升电路板有限公司 厚铜线路板的线路蚀刻和阻焊制作方法
US8471154B1 (en) * 2009-08-06 2013-06-25 Amkor Technology, Inc. Stackable variable height via package and method
KR101055297B1 (ko) * 2010-03-18 2011-08-09 기주산업(주) 개선된 열방출 특성을 갖는 메탈 인쇄회로기판의 제조 방법

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5068708A (en) * 1989-10-02 1991-11-26 Advanced Micro Devices, Inc. Ground plane for plastic encapsulated integrated circuit die packages
US6217987B1 (en) * 1996-11-20 2001-04-17 Ibiden Co. Ltd. Solder resist composition and printed circuit boards
US5912809A (en) * 1997-01-21 1999-06-15 Dell Usa, L.P. Printed circuit board (PCB) including channeled capacitive plane structure
US5896271A (en) * 1997-07-21 1999-04-20 Packard Hughes Interconnect Company Integrated circuit with a chip on dot and a heat sink
US6219255B1 (en) * 1998-08-20 2001-04-17 Dell Usa, L.P. Method and apparatus for reducing EMI in a computer system
US20010036065A1 (en) * 2000-04-26 2001-11-01 Matsushita Electric Industrial Co., Ltd. Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein
US20020162685A1 (en) * 2001-05-07 2002-11-07 Jeffrey Gotro Thermal dissipating printed circuit board and methods
US7326858B2 (en) * 2002-12-24 2008-02-05 Samsung Electro-Mechanics Co., Ltd. Printed circuit board with embedded capacitors and manufacturing method thereof
US20060087037A1 (en) * 2004-10-22 2006-04-27 Phoenix Precision Technology Corporation Substrate structure with embedded chip of semiconductor package and method for fabricating the same
US20060183342A1 (en) * 2005-02-15 2006-08-17 Eastman Kodak Company Metal and metal oxide patterned device
US20060221585A1 (en) * 2005-04-05 2006-10-05 Brench Colin E Apparatus and method for reducing noise coupling
US20070082183A1 (en) * 2005-09-30 2007-04-12 Makoto Murai Circuit board
US20100230138A1 (en) * 2007-03-30 2010-09-16 Toshiyuki Asahi Wiring board
US20110005815A1 (en) * 2009-07-08 2011-01-13 Chimei Innolux Corporation Conductive plate and touch panel including the same
US8217278B2 (en) * 2009-08-25 2012-07-10 Unimicron Technology Corp. Embedded wiring board and a manufacturing method thereof

Also Published As

Publication number Publication date
CN104137662A (zh) 2014-11-05
KR101895416B1 (ko) 2018-09-06
WO2013094842A1 (en) 2013-06-27
US20160295684A1 (en) 2016-10-06
CN104137662B (zh) 2017-11-17
KR20130073757A (ko) 2013-07-03
US9814129B2 (en) 2017-11-07
TWI612865B (zh) 2018-01-21
TW201328466A (zh) 2013-07-01

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AS Assignment

Owner name: LG INNOTEK CO., LTD., KOREA, REPUBLIC OF

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHO, YONG SEOK;KIM, CHANG SUNG;REEL/FRAME:033575/0093

Effective date: 20140624

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION