US20140363637A1 - Heating Layer for Film Removal - Google Patents

Heating Layer for Film Removal Download PDF

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Publication number
US20140363637A1
US20140363637A1 US13/911,778 US201313911778A US2014363637A1 US 20140363637 A1 US20140363637 A1 US 20140363637A1 US 201313911778 A US201313911778 A US 201313911778A US 2014363637 A1 US2014363637 A1 US 2014363637A1
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US
United States
Prior art keywords
layer
applique
adhesive
magnetic material
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/911,778
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English (en)
Inventor
Daniel J Kovach
Gary E Georgeson
Robert J Miller
Jeffrey D Morgan
Diane C Rawlings
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Boeing Co
Original Assignee
Boeing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boeing Co filed Critical Boeing Co
Priority to US13/911,778 priority Critical patent/US20140363637A1/en
Assigned to THE BOEING COMPANY reassignment THE BOEING COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MORGAN, JEFFREY D, RAWLINGS, DIANE, MILLER, ROBERT J, GEORGESON, GARY E, KOVACH, DANIEL J
Priority to CA2847128A priority patent/CA2847128C/en
Priority to EP14162401.5A priority patent/EP2810777B1/en
Priority to JP2014093179A priority patent/JP6545931B2/ja
Publication of US20140363637A1 publication Critical patent/US20140363637A1/en
Priority to US15/716,700 priority patent/US10940958B2/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
    • B64D45/00—Aircraft indicators or protectors not otherwise provided for
    • B64D45/02—Lightning protectors; Static dischargers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B29C63/0013—Removing old coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64C—AEROPLANES; HELICOPTERS
    • B64C7/00—Structures or fairings not otherwise provided for
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C09J7/0296—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/208—Magnetic, paramagnetic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/01—Magnetic additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L11/00—Compositions of homopolymers or copolymers of chloroprene
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
    • Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
    • Y10T156/1917—Electromagnetic radiation delaminating means [e.g., microwave, uv, ir, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24843—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] with heat sealable or heat releasable adhesive layer

Definitions

  • the present disclosure relates generally to the fields of polymer film or applique construction, application, and removal. More specifically the disclosure relates to using time-varying magnetic fields to heat a layer containing magnetic susceptors comprising at least a portion of the film or applique which facilitates bonding and de-bonding of the polymer film or applique from a surface.
  • the layer containing the magnetic susceptors may be the bonding layer itself or may be in proximity to another bonding or adhesive layer.
  • an applique or polymer multilayer film may include serving as a layer on the exterior of a surface to provide environmental resistance (e.g., in lieu of paints), or to provide aerodynamic drag resistance (e.g., using riblets formed in the exterior layer). Other uses also exist.
  • Applique materials currently being used may include multiple layers electrically connected to a grounding system as described in the above-noted U.S. Pat. Nos. 7,277,266, and 7,867,621.
  • Other applique types may include only polymeric films and layers.
  • Still other appliques may include the following layers: decorative film or layer, or fluoropolymer (e.g., paint replacement), conductive layers consisting of solid copper foil, solid aluminum foil, expanded copper foil (ECF), expanded aluminum foil (EAF), vapor deposition of copper or aluminum, and carbon nanotube materials.
  • the dielectric layer may consist of a dielectric barrier between the conductor layer and the structure.
  • Exemplary materials currently used are, fluoropolymer, polyether ether ketone (PEEK), fiberglass epoxy laminate, or dielectric materials.
  • appliques which, in the past, typically, have comprised solid films coated on one surface with a pressure-sensitive adhesive (PSA).
  • PSA pressure-sensitive adhesive
  • This form allows the applique to be removed from the surface it had been adhered to relatively easily.
  • Exterior coatings like appliques do not today survive the full deployed lifetime of an aircraft, so they must occasionally be renewed. This is primarily due to effects of UV and gouging from repeated impacts. Local removal of the applique is also required in the case of damage from impact, rain, erosion, abrasion, or lightning attachment.
  • Lightning attachment will likely cause local destruction of the film in the attachment region (and at electrical connects, see, e.g., U.S. Pat. No. 7,277,266, in regions where current flows from one stackup of applique material to another).
  • Appliques are typically adhesively bonded to a surface using a PSA and applying appropriate pressure. Heating is used today to aid in removal of the PSA-bonded appliques.
  • thermoplastic layer or film adhesive, for example
  • a thermoplastic adhesive bond typically would greatly increase the amount of heat required for removal of the multilayer film or applique from the structure, and would be susceptible to large amounts of thermoplastic residue being left behind if the temperature was not accurately controlled.
  • an applique that is bonded to a surface with a PSA may be enhanced with an integral heating element, such as a magnetic susceptor layer, to improve both installation and removal.
  • some embodiments provide an applique with an intermediate heating layer having a thermally reduceable bond strength between the metal/polymer film and the underlying structure on which the film is applied.
  • the heating layer may thus enable the bond between the applique and structure to be more easily broken, at the discretion of an operator.
  • One advantage of the disclosed system and method is that it may enable the more widespread use of metal/polymer films as protection for mitigating the direct effects of lightning strikes or other environmental conditions.
  • disclosed embodiments include a lightning strike protection applique having a lightning strike protection layer with a conductor layer and a dielectric layer.
  • Embodiments of the applique also include a heating layer comprising thermoplastic or thermosetting polymer and magnetic material, and an adhesive layer.
  • appliques for exterior surface protection, aerodynamic drag resistance, or other purposes wherein the applique has an outer layer and a heating layer.
  • Embodiments of the applique also include a heating layer comprising thermoplastic or thermosetting polymer and magnetic material, and an adhesive layer.
  • Embodiments of the system include an applique having an outer layer, a heating layer of thermoplastic or thermosetting polymer and magnetic material, and an adhesive layer.
  • Embodiments of the system also include a magnetic field source for generating a variable frequency magnetic field.
  • Embodiments of the disclosed system may also include using magnetic material with a Curie point temperature within a temperature range at which the adhesive bonds in the adhesive layer will de-bond.
  • embodiments may include a magnetic field source that generates a magnetic field selected to cause the magnetic material to reach a Curie point temperature within a temperature range at which the adhesive bonds in the adhesive layer will de-bond.
  • Some embodiments of the method include providing an outer layer, providing a heating layer comprising thermoplastic or thermosetting resin and magnetic material, and providing an adhesive layer. Other systems and methods also exist.
  • FIG. 1 shows some potential application areas on an aircraft 10 in accordance with some disclosed embodiments.
  • FIG. 2 illustrates some current techniques for removal of appliques.
  • FIG. 3 illustrates a prior art system for appliques.
  • FIGS. 4A , 4 B, and 4 C illustrate embodiments of an applique in accordance with the present disclosure.
  • FIG. 5 is a cross-sectional illustration of alternative embodiments of heating layer 100 illustrating magnetic material 105 within.
  • FIG. 6 is a plot of temperature over time for the application of a varying frequency magnetic field to a magnetic material 105 .
  • FIG. 7 is a flow diagram illustrating one embodiment of a method to manufacture an applique in accordance with the present disclosure.
  • FIG. 1 shows some potential application areas on an aircraft 10 in accordance with some disclosed embodiments.
  • PSA adhesives typically reduce or lose their tack at low temperatures and reduce their shear holding ability at high temperatures; special PSA adhesives are made to function at high or low temperatures (e.g., in temperature regimes ranging from approximately ⁇ 65° F. thru approximately 180° F.).
  • Thermosetting polymer adhesives have demonstrated the capability to perform well at these extremes, but do not, on their own, provide the desired de-bonding characteristics required when the film stackups must be removed/replaced.
  • Thermoplastic adhesives are heat reactive, but the heating must be sufficiently controlled for effective adhesive application and removal.
  • FIG. 2 illustrates some current techniques for removal of appliques.
  • Current techniques include slitting the applique material using a cutting tool (not shown) which preferably cuts the applique to a specific depth to alleviate the cutting into the structural materials 58 . With the applique 52 cut into strips 54 it can be peeled off the structure 58 with considerable effort (e.g., by application of heat 60 ). Other techniques for applique removal are also possible.
  • some advantages of using a metal/polymer lightning strike protection layer for lightning protection may include enabling a post-assembly process to cover a surface (e.g., prior to painting) and to provide a mechanisms to divert lightning current away from aircraft skin fasteners.
  • Some possible design approaches include applying an applique in a full-acreage format with a conductive layer applied over entire or large sections of an aircraft (e.g., a wing box) in order to route lightning current, for example, to the leading or trailing edges or wing root.
  • a dielectric layer may be implemented to cover fasteners and any conductive features in critical sections.
  • applique conductive layer and dielectric layer applied substantially over the fasteners or other conductive features in critical sections while leaving other portions substantially uncovered.
  • Such a design may, for example, direct surface current to the leading/trailing edges and wing root.
  • Other design options also exist.
  • the applique dielectric and conductive layers can all be varied and configured to meet desired performance requirements (e.g., durability, functionality, or the like).
  • embodiments include using appliques for surface protection or for aerodynamic properties.
  • embodiments may include a surface layer with the appropriate properties (e.g., protective, aerodynamic, or the like), a heating layer, and an adhesive layer.
  • the heating layer and the adhesive layer may be integrated into a single layer.
  • Other configurations are also possible.
  • embodiments of the presently disclosed system include a heating layer which may comprise a thin thermoplastic or thermosetting polymer film loaded with non-polymeric inclusions that are susceptible to heating under a time-varying magnetic field. Insertion of this additional heating layer into a structural or semi-structural heterogeneous laminate provides an “on-demand” de-bonding site for laminate deconstruction.
  • the heating layer when the heating layer is inserted between a cured Carbon-Fiber Reinforced Plastic (CFRP) layer and a Polymeric/Metallic film stackup layer, the heating layer can be selectively heated above its softening point (e.g., by using energy absorbed from a locally-applied time-varying magnetic field) to allow for ease of applique separation from the CFRP layer.
  • CFRP Carbon-Fiber Reinforced Plastic
  • FIG. 3 illustrates a prior art system for some appliques.
  • existing appliques may comprise a lightning strike protection (LSP) layer 70 that may further comprise a metallic conductor and a polymeric dielectric.
  • LSP lightning strike protection
  • the LSP layer 70 may be adhered to a surface 90 which may comprise a CFRP laminate.
  • the applique may also comprise a pressure sensitive adhesive (PSA) layer 80 .
  • PSA pressure sensitive adhesive
  • Other configurations for existing appliques are also possible.
  • FIGS. 4A-4C illustrate embodiments of appliques in accordance with the present disclosure.
  • the embodiment shown in FIG. 4A may comprise an LSP layer 70 that may be mounted to a surface 90 , such as a CFRP surface of an aircraft.
  • Embodiments may also comprise one or more adhesive layers 85 (e.g., thermosetting film adhesive (TSA) layers, PSA layers, thermoplastic adhesive layers, or the like). While two adhesive layers 85 are shown in FIG. 4A other configurations are also possible.
  • embodiments of an applique with a single adhesive layer 85 could be implemented.
  • Embodiments of adhesive layers 85 may comprise an epoxy film, such as 250 degree° F. curing epoxy film adhesive layers, which may be applied using a vacuum-bag heat blanket repair-style process, a PSA adhesive layer, or a thermoplastic adhesive layer.
  • Other adhesive layers 85 are also possible.
  • Embodiments of the disclosed system may also comprise thermoplastic or thermosetting heating layer 100 comprising magnetic particles within.
  • heating layer 100 may be applied to an applique as an integral adhesive layer.
  • heating layer 100 may be integrated into the applique stackup using one or more adhesive layers 85 .
  • Some factors affecting whether the heating layer 100 is integral or layered with adhesive layers 85 may include economic factors, desired integration point factors (e.g., bonding of the LSP 70 layer occurring at a wing 20 assembly or during a final aircraft 10 assembly), as well as other factors.
  • some appliques for uses such as surface protection, aerodynamics, or the like may comprise a surface layer 88 that covers the desired portion(s) of the surface 90 .
  • a surface layer 88 that covers the desired portion(s) of the surface 90 .
  • an integral adhesive and heating layer 110 is shown.
  • other configurations, such as using separate adhesive layers 85 and heating layers 100 shown in FIGS. 4A-4B are also possible for these embodiments.
  • Embodiments of the heating layer 100 may comprise any suitable thermoplastic or thermosetting polymer or resin.
  • a softening point above 275° F. is desirable for in-service considerations, as well as, to allow for integration using 250 degree° F. curing epoxy adhesives.
  • Fluorinated thermoplastics such as Polyvinylidene fluoride (PVDF, Melt Point ⁇ 350° F.), Ethylene chlorotrifluoroethylene (ECTFE, Melt Point ⁇ 430° F.) or Fluorinated ethylene propylene (FEP, Melt Point ⁇ 500° F.) are all possible materials for use in heating layer 100 . Other embodiments also exist.
  • PVDF Polyvinylidene fluoride
  • ECTFE Ethylene chlorotrifluoroethylene
  • FEP Fluorinated ethylene propylene
  • Embodiments of heating layer 100 also comprise magnetic material 105 embedded in the thermoplastic or thermosetting polymer.
  • FIG. 5 is a cross-sectional illustration of alternative embodiments of heating layer 100 illustrating magnetic material 105 within.
  • magnetic material 105 may comprise a magnetic alloy (e.g., a Ni-Fe alloy such as Alloy 30, Alloy 31, Alloy 32, Alloy 34, Alloy 36, or the like).
  • a magnetic alloy e.g., a Ni-Fe alloy such as Alloy 30, Alloy 31, Alloy 32, Alloy 34, Alloy 36, or the like.
  • magnetic material 105 may be incorporated into heating layer 100 in any suitable manner.
  • magnetic material 105 may comprise chopped fibers 110 , flakes 120 , small particles 130 , or the like.
  • magnetic material 105 may comprise 1 ⁇ 8 inch long, 1 mil diameter chopped alloy wires compatible with adhesive films and with composite structure.
  • the magnetic material 105 may be mixed with adhesive at a few percent by volume. Other embodiments are also possible.
  • Embodiments of methods to implement the disclosed system are as follows. It is known that application of a varying frequency magnetic field will cause some magnetic materials 105 to generate heat. Typically, the magnetic material 105 will heat up until it reaches a temperature determined by its Curie point. After that Curie point is reached, the heat generated by the magnetic material 105 levels off even if continued application of the varying frequency magnetic field persists. This is illustrated in FIG. 6 which is a plot of temperature over time for the application of a varying frequency magnetic field to a magnetic material 105 . By selecting a magnetic material 105 with a Curie point temperature in the range of the softening point for adhesive layer 85 , then application of a varying magnetic field will generate heat in the magnetic material 105 and consequently soften the bonding of the adhesive layer 85 .
  • An exemplary heating using a varying magnetic field to soften loaded adhesive may be carried out as follows.
  • a heating layer 100 is fabricated using a resin and Alloy 36 .
  • a spiral coil is used to create a varying magnetic field.
  • the varying field of 15 kHz, 20 mT is generated uniformly using a AC source generator and a spiral coil. Other coils or methods of generating the varying magnetic field may be also implemented.
  • the heat production in the heating layer 100 is measured over time (resulting in a plot similar to FIG. 6 ).
  • An applique of the heating layer 100 and adhesive layer 85 is constructed and when the varying magnetic field is applied, sufficient softening of the adhesive layer 85 occurs to de-bond the applique. Other methods of de-bonding through application of a varying magnetic field may also be used.
  • selective heating of a loaded heating layer 100 provides for a very rapid and control de-bonding of two substrates bonded by that layer.
  • implementation of the above described method also enables direct heating of the heating layer 100 only without overheating the polymer or substrates (e.g., surface 90 ). This is due to the fact that the heating layer 100 will stabilize at the limit temperature due to Curie point (e.g., as shown in FIG. 6 ).
  • Embodiments of the disclosed system and method have also been found to operate relatively quickly and adhesive layers 85 have been found to heat to the selected Curie temperature (150° F., 350° F., 450° F., etc.) in about 3 minutes. Implementation of the disclosed systems and methods also allows de-bonding of appliques without the need to implement finicky and time-consuming heat blankets to de-bond adhesive layers.
  • the varying magnetic field may be created using a hand-held coil, a robotically operated coil, or some other form of field generating mechanisms to heat the thermoplastic layer 100 . Then, as the adhesive layer 85 softens, the LSP layer 70 , or surface layer 88 , may be removed, repaired, or replaced by peeling or the like.
  • FIG. 7 is a flow diagram illustrating one embodiment of a method to manufacture an applique in accordance with the present disclosure.
  • a lightning strike protection (LSP) layer e.g., LSP layer 70
  • a heating layer e.g., heating layer 100
  • an adhesive layer e.g., TSA layer, PSA layer, thermoplastic layer, etc.
  • This invention provides improved mechanical properties over the entire temperature range of interest while still supporting and improving on the removability characteristics provided by the current approach.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
US13/911,778 2013-06-06 2013-06-06 Heating Layer for Film Removal Abandoned US20140363637A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US13/911,778 US20140363637A1 (en) 2013-06-06 2013-06-06 Heating Layer for Film Removal
CA2847128A CA2847128C (en) 2013-06-06 2014-03-19 Heating layer for film removal
EP14162401.5A EP2810777B1 (en) 2013-06-06 2014-03-28 Heating layer for film removal
JP2014093179A JP6545931B2 (ja) 2013-06-06 2014-04-28 薄膜除去のための加熱層
US15/716,700 US10940958B2 (en) 2013-06-06 2017-09-27 Heating layer for film removal

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Application Number Priority Date Filing Date Title
US13/911,778 US20140363637A1 (en) 2013-06-06 2013-06-06 Heating Layer for Film Removal

Related Child Applications (1)

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US15/716,700 Division US10940958B2 (en) 2013-06-06 2017-09-27 Heating layer for film removal

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US15/716,700 Active 2034-07-21 US10940958B2 (en) 2013-06-06 2017-09-27 Heating layer for film removal

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EP (1) EP2810777B1 (enExample)
JP (1) JP6545931B2 (enExample)
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Cited By (7)

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