JP6545931B2 - 薄膜除去のための加熱層 - Google Patents
薄膜除去のための加熱層 Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
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- H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Manufacturing & Machinery (AREA)
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Description
導体層及び誘電層を含む保護層、高分子材及び磁気材料を含む加熱層、並びに接着層を含むアップリケ。
接着層が、加熱層の底面に位置し、取付面にアップリケを付着させるように構成されている、条項1に記載のアップリケ。
保護層に隣接する加熱層の表面上に位置する第2の接着層をさらに含む、条項1に記載のアップリケ。
磁気材料が合金である、条項1に記載のアップリケ。
合金がニッケル−鉄合金である、条項4に記載のアップリケ。
磁気材料が、接着層中の接着剤の結合が結合解除する温度範囲内にキュリー点温度を有する磁気材料を含む、条項1に記載のアップリケ。
磁気材料が粒子材料をさらに含む、条項1に記載のアップリケ。
粒子材料が繊維ワイヤのセグメントをさらに含む、条項7に記載のアップリケ。
粒子材料が材料フレークをさらに含む、条項7に記載のアップリケ。
接着層が熱硬化性フィルム接着剤をさらに含む、条項1に記載のアップリケ。
接着層が感圧接着剤をさらに含む、条項1に記載のアップリケ。
接着層が熱可塑性フィルム接着剤をさらに含む、条項1に記載のアップリケ。
アップリケの取付け又は除去のためのシステムであって、表面層、高分子材と磁気材料とを含む加熱層、及び接着層を含むアップリケ、並びに可変周波数磁界を生成するための磁界源を含むシステム。
磁気材料が、接着層中の接着剤の結合が結合解除する温度範囲内にキュリー点温度を有する磁気材料を含む、条項13に記載のシステム。
磁界源が、接着層中の接着剤の結合が結合解除する温度範囲内に含まれるキュリー点温度に磁気材料が到達するように選択された磁界を生成する磁界源を含んでいる、条項14に記載のシステム。
磁界源が、15〜300KHzの範囲の磁界を生成するコイルを含む、条項14に記載のシステム。
表面層が、導体層及び誘電層をさらに含む落雷保護層を含む、条項13に記載のシステム。
表面層が表面保護層を含む、条項13に記載のシステム。
表面層が空力効果層を含む、条項13に記載のシステム。
アップリケ製造方法であって、表面層を、樹脂及び磁気材料を含む加熱層に連結することと、接着層を加熱層に連結することとを含む方法。
接着層が、加熱層の底面に連結され、取付面にアップリケを付着させるように構成されている、条項20に記載の方法。
第2の接着層を、表面層に隣接する加熱層の表面上に連結させることをさらに含む、条項20に記載のアップリケ。
磁気材料に合金を含めることをさらに含む、条項20に記載の方法。
磁気材料に含まれる合金がニッケル−鉄合金である、条項23に記載の方法。
接着層中の接着剤の結合が結合解除する温度範囲内にキュリー点温度を有する磁気材料を、加熱層に含めることをさらに含む、条項20に記載の方法。
磁気材料に粒子材料を含めることをさらに含む、条項20に記載の方法。
含まれる粒子材料が短繊維ワイヤを含む、条項26に記載の方法。
含まれる粒子材料がフレーク状材料を含む、条項26に記載の方法。
40 尾翼
52 アップリケ
54 ストリップ
58 構造体
60 熱
70 落雷保護(LSP)層
80 感圧接着剤(PSA)層
85 接着層
88 表面層
90 表面/取付面
100 加熱層
105 磁気材料
110 接着兼加熱層/短繊維セグメント
120 材料フレーク
130 小粒子
Claims (9)
- 導体層及び誘電層を含む保護層(70)、
高分子材及び磁性材料(105)を含む加熱層(100)、
接着層(85)、並びに
空力効果層を含む表面層(88)
を備えるアップリケであって、
前記磁気材料(105)は、前記接着層(85)中の接着剤の結合が結合解除する温度範囲内にキュリー点温度を有し、
前記加熱層(100)は、当該加熱層(100)を加熱させる周波数を有し、経時的に変化する磁界の存在により、加熱され易いものである、アップリケ。 - 前記接着層(85)は、前記加熱層(100)の底面上に位置し、前記アップリケを取付面(90)に付着させるように構成されている、請求項1に記載のアップリケ。
- 前記保護層(70)に隣接する前記加熱層(100)の表面上に位置する第2の接着層(85)をさらに備える請求項1又は2に記載のアップリケ。
- 前記磁性材料(105)はニッケル−鉄合金を含む合金である、請求項1から3のいずれか一項に記載のアップリケ。
- 前記磁性材料(105)は、繊維ワイヤセグメント(110)又は材料フレーク(120)を含む粒子材料をさらに含んでいる、請求項1から4のいずれか一項に記載のアップリケ。
- 前記接着層(85)は、熱硬化性フィルム接着剤、感圧接着剤、及び熱可塑性フィルム接着剤のうちの一つをさらに含んでいる、請求項1から5のいずれか一項に記載のアップリケ。
- 前記接着層(85)中の前記接着剤の結合が結合解除する温度範囲内のキュリー点温度に前記磁性材料(105)が到達するように選択された磁界を生成する磁界源に反応する、請求項1から6のいずれか一項に記載のアップリケ。
- 前記磁界源は、15〜300KHzの範囲の磁界を生成するコイルを含んでいる、請求項7に記載のアップリケ。
- 前記保護層は、少なくとも航空機の一部を落雷から保護するように適合されている、請求項1から8のいずれか一項に記載のアップリケ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/911,778 US20140363637A1 (en) | 2013-06-06 | 2013-06-06 | Heating Layer for Film Removal |
US13/911,778 | 2013-06-06 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015013466A JP2015013466A (ja) | 2015-01-22 |
JP2015013466A5 JP2015013466A5 (ja) | 2017-06-15 |
JP6545931B2 true JP6545931B2 (ja) | 2019-07-17 |
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JP2014093179A Active JP6545931B2 (ja) | 2013-06-06 | 2014-04-28 | 薄膜除去のための加熱層 |
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EP (1) | EP2810777B1 (ja) |
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US11027856B2 (en) * | 2015-11-30 | 2021-06-08 | Cytec Industries Inc. | Surfacing materials for composite structures |
US10105877B2 (en) | 2016-07-08 | 2018-10-23 | The Boeing Company | Multilayer riblet applique and methods of producing the same |
US10541065B2 (en) * | 2017-12-21 | 2020-01-21 | The Boeing Company | Multilayer stack with enhanced conductivity and stability |
US10264436B1 (en) * | 2018-05-29 | 2019-04-16 | Link Labs, Inc. | BLE networking systems and methods providing central and peripheral role reversal with independent peripheral network connectivity |
JP6968759B2 (ja) * | 2018-06-29 | 2021-11-17 | 三菱重工業株式会社 | 航空機用内装部材およびその製造方法、並びにその交換方法 |
US11279468B2 (en) | 2019-01-22 | 2022-03-22 | The Boeing Company | Systems and methods for aircraft structure surface covers |
US11987021B2 (en) | 2021-09-01 | 2024-05-21 | The Boeing Company | Multilayer riblet appliques |
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- 2013-06-06 US US13/911,778 patent/US20140363637A1/en not_active Abandoned
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2014
- 2014-03-19 CA CA2847128A patent/CA2847128C/en active Active
- 2014-03-28 EP EP14162401.5A patent/EP2810777B1/en active Active
- 2014-04-28 JP JP2014093179A patent/JP6545931B2/ja active Active
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2017
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CA2847128A1 (en) | 2014-12-06 |
JP2015013466A (ja) | 2015-01-22 |
EP2810777A1 (en) | 2014-12-10 |
US20140363637A1 (en) | 2014-12-11 |
US10940958B2 (en) | 2021-03-09 |
CA2847128C (en) | 2017-05-30 |
US20180016028A1 (en) | 2018-01-18 |
EP2810777B1 (en) | 2019-08-07 |
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