US20140215782A1 - Multilayer wiring substrate, and method of manufacturing the same - Google Patents
Multilayer wiring substrate, and method of manufacturing the same Download PDFInfo
- Publication number
- US20140215782A1 US20140215782A1 US14/229,144 US201414229144A US2014215782A1 US 20140215782 A1 US20140215782 A1 US 20140215782A1 US 201414229144 A US201414229144 A US 201414229144A US 2014215782 A1 US2014215782 A1 US 2014215782A1
- Authority
- US
- United States
- Prior art keywords
- resin insulation
- connection terminals
- openings
- metal
- main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0588—Second resist used as pattern over first resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/30—Foil or other thin sheet-metal making or treating
- Y10T29/301—Method
- Y10T29/302—Clad or other composite foil or thin metal making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Definitions
- the present invention relates to a multilayer wiring substrate having a laminate structure in which a plurality of resin insulation layers made primarily of the same resin insulation material, and a plurality of conductive layers are laminated alternately in multilayer arrangement, and not having a so-called substrate core in a final product, the substrate core carrying build-up layers successively formed on opposite surfaces thereof.
- the present invention also relates to a method of manufacturing such a multilayer wiring substrate.
- IC chips semiconductor integrated circuit devices
- the number of terminals increases, and the pitch between the terminals tends to become narrower.
- a large number of terminals are densely arrayed on the bottom surface of an IC chip and flip-chip-bonded to terminals provided on a motherboard.
- the terminals of the IC chip differ greatly in pitch from those of the motherboard, difficulty is encountered in bonding the IC chip directly onto the motherboard.
- a semiconductor package configured such that the IC chip is mounted on an IC chip mounting wiring substrate is fabricated, and the semiconductor package is mounted on the motherboard.
- the IC chip mounting wiring substrate which partially constitutes such a semiconductor package is practicalized in the form of a multilayer substrate configured such that a build-up layer is formed on the front and back surfaces of a substrate core.
- the substrate core used in the multilayer wiring substrate is, for example, a resin substrate (glass epoxy substrate) formed by impregnating reinforcement fiber with resin. Through utilization of rigidity of the substrate core, resin insulation layers and conductive layers are laminated alternately on the front and back surfaces of the substrate core, thereby forming respective build-up layers.
- the substrate core serves as a reinforcement and is formed very thick as compared with the build-up layers.
- the substrate core has conductor lines (specifically, through-hole conductors, etc.) extending therethrough for electrical communication between the build-up layers formed on the front and back surfaces.
- a metal foil is disposed one side of a provisional substrate, and a plurality of conductive layers and a plurality of resin insulation layers are alternately stacked on the metal foil to thereby form a build-up layer. Subsequently, the metal foil is separated from the provisional substrate so as to obtain a structure in which the build-up layer is formed on the metal foil. The surface of the outermost layer (the surface of a resin insulation layer and the surfaces of a plurality of connection terminals) is exposed by means of removing the metal foil through etching, whereby a multilayer wiring substrate is manufactured.
- Patent Document 1 also discloses a multilayer wiring substrate in which a solder resist film is formed on the build-up layer as the outermost layer thereof. Notably, openings are formed in the solder resist film so as to expose the surfaces of IC-chip connection terminals.
- a solder resist film is formed, as the outer most layer, on the side of the wiring substrate where an IC chip is mounted, and openings are formed in the solder resist film so as to expose the top surfaces of IC-chip connection terminals.
- the solder resist film is made primarily of a hardened photocurable resin insulation material.
- the openings of the solder resist film are formed through exposure and development performed in a state in which a predetermined mask is disposed on the solder resist film. Subsequently, solder bumps are formed on the top surfaces of the IC-chip connection terminals exposed within the openings of the solder resist film, and an IC chip is mounted via the solder bumps.
- Patent Document 1 discloses a multilayer wiring substrate in which the surfaces of connection terminals (e.g., motherboard connection terminals to be connected to a motherboard) having a relatively large area are formed such that the surfaces become flush with the outermost resin insulation layer.
- connection terminals e.g., motherboard connection terminals to be connected to a motherboard
- a stress acts at the boundary between each motherboard connection terminal and the resin insulation layer. Therefore, the disclosed multilayer wiring substrate has a problem in that, as shown in FIG. 28 , cracks 103 are generated at the boundary between each motherboard connection terminal 101 and a resin insulation layer 102 in such a manner that the cracks 103 extend from the boundary through the resin insulation layer 102 .
- the multilayer wiring substrate may be manufactured such that a solder resist film is formed to cover a peripheral portion of the outer surface of each motherboard connection terminal.
- a solder resist film is formed as the outermost layer of the multilayer wiring substrate, due to a difference in coefficient of thermal expansion between the solder resist film and inner resin insulation layers, the substrate warps in accordance with the difference in coefficient of thermal expansion.
- a structure e.g., a reinforcing plate or the like
- the present invention has been conceived in view of the above problems, and an object of the invention is to provide a highly reliable multilayer wiring substrate which is free from generation of cracks in a resin insulation layer.
- a multilayer wiring substrate includes a laminate structure in which a plurality of resin insulation layers made primarily of a same resin insulation material, and a plurality of conductive layers are laminated alternately in multilayer arrangement, a plurality of first-main-surface-side connection terminals being disposed on a first main surface side of the laminate structure, a plurality of second-main-surface-side connection terminals being disposed on a second main surface side of the laminate structure, the plurality of conductive layers being formed in the plurality of resin insulation layers and interconnected by means of via conductors whose diameters increase toward the first main surface side of the laminate structure or the second main surface side of the laminate structure.
- the plurality of resin insulation layers are formed of a hardened resin insulation material that is not photocurable.
- a plurality of first openings are formed in an outermost resin insulation layer on the first main surface side of the laminate structure.
- the plurality of first-main-surface-side connection terminals include terminal outer surfaces and are disposed to correspond to the plurality of first openings, and peripheral portions of the terminal outer surfaces are covered by the outermost resin insulation layer on the first main surface side of the laminate structure.
- a plurality of second openings are formed in an outermost resin insulation layer on the second main surface side of the laminate structure.
- the plurality of second-main-surface-side connection terminals include terminal outer surfaces and are disposed to correspond to the plurality of second openings, and peripheral portions of the terminal outer surfaces are covered by the outermost resin insulation layer on the second main surface side of the laminate structure.
- Each of the plurality of second-main-surface-side connection terminals has a concave portion at a center portion of each of the terminal outer surfaces.
- the multilayer wiring substrate is formed such that a plurality of resin insulation layers made primarily of the same resin insulation material, and a plurality of conductive layers are laminated alternately, and assumes the form of a coreless wiring substrate having no substrate core.
- the plurality of resin insulation layers which constitute the laminate structure are formed of the same build-up material made primarily of a hardened resin insulation material that is not photocurable. In this case, the influence of a difference in thermal expansion coefficient in the laminate structure can be mitigated, as compared with the case where the outermost resin insulation layers are formed of a different resin insulation material. As a result, warpage of the multilayer wiring substrate can be restrained.
- the outermost resin insulation layers, in which the connection terminals are formed are formed of the same build-up material having excellent electrical insulation performance as that used to form the inner resin insulation layers, the interval between the connection terminals can be narrowed, so that the multilayer wiring substrate can be further integrated.
- the plurality of first openings are formed in the outermost resin insulation layer exposed on the first main surface side of the laminate structure, and the plurality of the first-main-surface-side connection terminals are disposed to correspond to these first openings. Peripheral portions of the terminal outer surfaces of the first-main-surface-side connection terminals are covered by the corresponding outermost resin insulation layer.
- peripheral portions of the first-main-surface-side connection terminals are buried (embedded) in the corresponding outermost resin insulation layer. Accordingly, the strength of the first-main-surface-side connection terminals can be increased sufficiently. Furthermore, the plurality of second openings are formed in the outermost resin insulation layer exposed on the second main surface side of the laminate structure, and the plurality of the second-main-surface-side connection terminals are disposed to correspond to these second openings. Peripheral portions of the terminal outer surfaces of the second-main-surface-side connection terminals are covered by the corresponding outermost resin insulation layer. That is, peripheral portions of the second-main-surface-side connection terminals are buried (embedded) in the corresponding outermost resin insulation layer.
- each of the second-main-surface-side connection terminals has a concave portion formed at the center of the terminal outer surface thereof.
- the concentration of stress at an end portion of the second-main-surface-side connection terminal is mitigated, whereby generation of cracks in the corresponding resin insulation layer can be prevented, and reliability is improved.
- the concave portion of each of the terminal outer surfaces is formed such that a deepest portion of the concave portion is located on the inner layer (interior) side in relation to the peripheral portion of each of the terminal outer surfaces. Since the second-main-surface-side connection terminals formed in this manner increase the area of contact between solder and the terminal outer surface, the strength of solder connection can be increased.
- each of the plurality of second-main-surface-side connection terminals further includes an inner surface having a peripheral edge, and the peripheral edge is rounded.
- the concentration of stress at an edge portion of the terminal inner surface is avoided. Therefore, the possibility of generation of cracks in the resin insulation layer decreases, and the multilayer wiring substrate has an improved reliability as compared with conventional ones.
- the second-main-surface-side connection terminals may be provided on the main surface to which a motherboard is connected, or provided on the opposite main surface; i.e., the main surface onto which an IC chip is mounted.
- the first-main-surface-side connection terminals include IC-chip connection terminals, to which an IC chip is to be connected, and passive-component connection terminals, to which a passive component is to be connected and which are greater in area than the IC-chip connection terminals; and the second-main-surface-side connection terminals include motherboard connection terminals, to which a motherboard is to be connected and which are greater in area than the IC-chip connection terminals and the passive-component connection terminals, are provided on the second main surface side as the second-main-surface-side connection terminals.
- an IC chip can be reliably connected to the IC-chip connection terminals whose area is small, and a passive component can be reliably connected to the passive-component connection terminals whose area is large.
- the motherboard connection terminals can be reliably connected to a motherboard.
- the first-main-surface-side connection terminals may include IC-chip connection terminals, to which an IC chip is connected; and the second-main-surface-side connection terminals may include passive-component connection terminals, to which a passive component is to be connected and which are greater in area than the IC-chip connection terminals, and motherboard connection terminals, to which a motherboard is to be connected and which are greater in area than the IC-chip connection terminals and the passive-component connection terminals.
- an IC chip can be reliably connected to the IC-chip connection terminals.
- a passive component can be reliably connected to the passive-component connection terminals, and the motherboard connection terminals can be reliably connected to a motherboard.
- the via conductors formed in the plurality of resin insulation layers may be shaped such that their diameters increase in a direction from the second main surface side to the first main surface side.
- the via conductors formed in the plurality of resin insulation layers may also be shaped such that their diameters increase in a direction from the first main surface side to the second main surface side.
- Each of the motherboard connection terminals or each of the IC-chip connection terminals and the passive-component connection terminals may comprise a copper layer covered with a plating layer comprised of a material other than copper.
- each of the motherboard connection terminals, the IC-chip connection terminals, and the passive-component connection terminals may comprise a copper layer covered with a plating layer formed of a material other than copper.
- it is preferred that each of the IC-chip connection terminals whose area is small has a structure in which only the upper surface of a copper layer which mainly forms the connection terminals is covered with a plating layer formed of a material other than copper.
- thermosetting resins such as epoxy resin, phenol resin, urethane resin, silicone resin, and polyimide resin
- thermoplastic resins such as polycarbonate resin, acrylic resin, polyacetal resin, and polypropylene resin.
- a composite material consisting of any one of these resins, and glass fiber (glass woven fabric or glass nonwoven fabric) or organic fiber, such as polyamide fiber, or a resin-resin composite material in which a three-dimensional network fluorine-containing resin base material, such as continuously porous PTFE, is impregnated with a thermosetting resin, such as epoxy resin.
- a plurality of resin insulation layers made primarily of the same resin insulation material may be a plurality of resin insulation layers which differ in additive, such as the above-mentioned organic fiber, which is mixed with, for example, thermo setting resin, if the resin insulation layers are mainly formed of the same thermo setting resin.
- a method of manufacturing a multilayer wiring substrate including a laminate structure in which a plurality of resin insulation layers made primarily of a same resin insulation material, and a plurality of conductive layers are laminated alternately in multilayer arrangement, a plurality of first-main-surface-side connection terminals being disposed on a first main surface side of the laminate structure, a plurality of second-main-surface-side connection terminals being disposed on a second main surface side of the laminate structure, the plurality of conductive layers being formed in the plurality of resin insulation layers and interconnected by means of via conductors whose diameters increase toward the first main surface side of the laminate structure or the second main surface side of the laminate structure.
- the method includes: a base-material preparation step of preparing a base material on which a metal foil is separably laminated; and an insulation-layer/conductor-portion forming step.
- the insulation-layer/conductor-portion forming step includes: a step of laminating on the metal foil a build-up material made primarily of a resin insulation material that is not photocurable, to thereby form an outermost resin insulation layer on the second main surface side of the laminate structure, a step of forming openings in the outermost resin insulation layer, and a step of forming a metal conductor portion in each of the openings and on a corresponding portion of the outermost resin insulation layer around each of the openings.
- the method further includes a build-up step including a step of laminating the plurality of resin insulation layers made primarily of the same resin insulation material, and a plurality of conductive layers alternately in multilayer arrangement, to thereby form the laminate structure, and a step of forming the first-main-surface-side connection terminals on the first main surface side of the laminate structure.
- the method also includes a base-material removing step of, after the build-up step, removing the base material to thereby expose the metal foil, and a connection-terminal forming step of removing the metal foil and at least a portion of each metal conductor portion, to thereby form a concave portion in each of the plurality of second-main-surface-side connection terminals.
- the second-main-surface-side connection terminals can be reliably formed such that a peripheral portion of the terminal outer surface of each second-main-surface-side connection terminal is covered by the corresponding outermost resin insulation layer.
- the concave portion is formed on the terminal outer surface of each second-main-surface-side connection terminal such that the deepest portion of the concave portion is located on the inner layer side in relation to the peripheral portion of the terminal outer surface.
- the multilayer wiring substrate can be manufactured relatively easily.
- the step of forming openings in the outermost resin insulating layer may be performed after the step of laminating on the metal foil a build-up material, and may include a step of performing laser drilling on the outermost resin insulation layer on the second main surface side to thereby form the openings, the openings for exposing portions of the metal foil.
- the method may further include, after the step of performing laser drilling, a step of forming a plating resist film on the outermost resin insulation layer on the second main surface, and a step of forming, at positions corresponding to the openings, additional openings in the plating resist film which are greater in area than the openings.
- the step of forming the metal conductor portion may be performed after the steps of forming a plating resist film and forming additional openings, and may further include: a step of performing electro plating so as to form the metal conductor portions in each of the openings and the additional openings; and a step of removing the plating resist film.
- the metal conductor portions which are to be used as the second-main-surface-side connection terminals, can be formed reliably.
- a method of manufacturing a multilayer wiring substrate as described above includes: a base-material preparation step of preparing a base material on which a metal foil is separably laminated; and an insulation-layer/conductor-portion forming step.
- the insulation-layer/conductor-portion forming step includes: a step of performing copper plating so as to form metal-conductor-portion lower layers, which partially constitute the metal conductor portions, on the metal foil; a step of laminating on the metal foil and the metal-conductor-portion lower layers a build-up material made primarily of a resin insulation material that is not photocurable, to thereby form an outermost resin insulation layer on the second main surface side of the laminate structure; a step of exposing the upper end surfaces of the metal-conductor-portion lower layers from the outermost resin insulation layer on the second main surface side; a step of forming a plating resist film on the outermost resin insulation layer on the second main surface; a step of forming openings at positions corresponding to the upper end surfaces of the metal-conductor-portion lower layers, the openings having area greater than an area of the upper end surfaces; a step of performing copper plating so as to form metal-conductor-portion upper layers, which partially constitute the metal conductor portions in the openings
- This aspect of the invention also includes a build-up step, a base-material removing step, and a connection-terminal forming step as described above with respect to the previous aspect of the invention.
- the metal conductor portions which are to be used as the second-main-surface-side connection terminals, can be formed reliably.
- FIG. 1 is a sectional view schematically showing the structure of a multilayer wiring substrate according to a first embodiment.
- FIG. 2 is a plan view schematically showing the structure of the multilayer wiring substrate according to the first embodiment.
- FIG. 3 is a plan view schematically showing the structure of the multilayer wiring substrate according to the first embodiment.
- FIG. 4 is an explanatory view showing a method of manufacturing the multilayer wiring substrate according to the first embodiment.
- FIG. 5 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment.
- FIG. 6 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment.
- FIG. 7 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment.
- FIG. 8 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment.
- FIG. 9 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment.
- FIG. 10 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment.
- FIG. 11 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment.
- FIG. 12 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment.
- FIG. 13 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment.
- FIG. 14 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment.
- FIG. 15 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment.
- FIG. 16 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment.
- FIG. 17 is an explanatory view showing a method of manufacturing a multilayer wiring substrate according to a second embodiment.
- FIG. 18 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the second embodiment.
- FIG. 19 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the second embodiment.
- FIG. 20 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the second embodiment.
- FIG. 21 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the second embodiment.
- FIG. 22 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the second embodiment.
- FIG. 23 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the second embodiment.
- FIG. 24 is a sectional view schematically showing the structure of a multilayer wiring substrate according to another embodiment.
- FIG. 25 is a sectional view schematically showing the structure of a multilayer wiring substrate according to another embodiment.
- FIG. 26 is a sectional view schematically showing the structure of a multilayer wiring substrate according to another embodiment.
- FIG. 27 is a sectional view schematically showing the structure of a multilayer wiring substrate according to another embodiment.
- FIG. 28 is an enlarged sectional view showing a conventional multilayer wiring substrate.
- FIG. 1 is an enlarged sectional view schematically showing the structure of the multilayer wiring substrate of the present embodiment.
- FIG. 2 is a plan view of the multilayer wiring substrate as viewed from the top surface side.
- FIG. 3 is a plan view of the multilayer wiring substrate as viewed from the bottom surface side.
- a multilayer wiring substrate 10 is a coreless wiring substrate having no substrate core and has a multilayer wiring laminate portion 30 (laminate structure) in which a plurality of resin insulation layers 20 , 21 , 22 , 23 , and 24 made primarily of the same resin insulation material, and a plurality of conductive layers 26 made of copper are laminated alternately.
- the resin insulation layers 20 to 24 are formed of a build-up material made primarily of a hardened resin insulation material that is not photocurable; specifically, a hardened thermosetting epoxy resin.
- connection terminals 41 and 42 are disposed on one side (first main surface side) of the wiring laminate portion 30 where a top surface 31 (first main surface) thereof is present.
- the plurality of connection terminals 41 and 42 disposed on the top surface 31 side of the wiring laminate portion 30 are IC-chip connection terminals 41 to which an IC chip is connected, and capacitor connection terminals 42 to which chip capacitors are connected.
- the plurality of IC-chip connection terminals 41 are arrayed in a chip mounting region 43 provided at a central portion of the multilayer wiring substrate 10 .
- the capacitor connection terminals 42 are greater in area than the IC-chip connection terminals 41 and are disposed externally of the chip mounting region 43 .
- connection terminals 45 (motherboard connection terminals serving as second-main-surface-side connection terminals) for LGA (land grid array) to which a motherboard is connected are arrayed.
- the motherboard connection terminals 45 are greater in area than the IC-chip connection terminals 41 and the capacitor connection terminals 42 on the top surface 31 side.
- Via holes 33 and filled-via conductors 34 are provided in the resin insulation layers 21 , 22 , 23 , and 24 .
- the via conductors 34 are shaped such that their diameters increase in the same direction (in FIG. 1 , in the direction from the bottom surface toward the top surface).
- the via conductors 34 electrically interconnect the conductive layers 26 , the IC-chip connection terminals 41 , the capacitor connection terminals 42 , and the motherboard connection terminals 45 .
- a plurality of openings 35 and 36 are formed in the resin insulation layer 24 (outermost resin insulation layer on the first main surface side of the laminate structure) which is exposed to the outside and serves as an outermost layer on the top surface 31 side of the wiring laminate portion 30 .
- the IC-chip connection terminals 41 and the capacitor connection terminals 42 are disposed to correspond to these openings 35 and 36 .
- the IC-chip connection terminals 41 are disposed within the openings 35 such that their terminal outer surfaces 41 a are lower in height than the outer surface of the resin insulation layer 24 . Peripheral portions of the terminal outer surfaces 41 a are covered by the outermost resin insulation layer 24 . That is, the IC-chip connection terminals 41 are greater in size than the openings 35 , and peripheral portions of the terminal outer surfaces 41 a are buried (embedded) in the resin insulation layer 24 .
- the capacitor connection terminals 42 are disposed within the openings 36 such that their terminal outer surfaces 42 a are lower in height than the surface of the resin insulation layer 24 . Peripheral portions of the terminal outer surfaces 42 a are covered by the outermost resin insulation layer 24 . That is, the capacitor connection terminals 42 are greater in size than the openings 36 , and peripheral portions of the terminal outer surfaces 42 a are buried (embedded) in the resin insulation layer 24 .
- the IC-chip connection terminals 41 and the capacitor connection terminals 42 are mainly formed by (primarily comprised of) a copper layer.
- Each of the IC-chip connection terminals 41 and the capacitor connection terminals 42 has a structure in which only portions of the upper surface of the copper layer which portions are aligned with the openings 35 and 36 are covered by plating layers 46 and 47 , respectively, the plating layers being formed of a material other than copper (specifically, a nickel-gold plating layer).
- a plurality of openings 37 are formed in the resin insulation layer 20 (outermost resin insulation layer on the second main surface side of the laminate structure) which is exposed to the outside and serves as an outermost layer on the bottom surface 32 side of the wiring laminate portion 30 .
- the motherboard connection terminals 45 are disposed to correspond to these openings 37 .
- the motherboard connection terminals 45 are disposed within the openings 37 such that their terminal outer surfaces 45 a are lower in height than the outer surface of the resin insulation layer 20 . Peripheral portions of the terminal outer surfaces 45 a are covered by the outermost resin insulation layer 20 . That is, the motherboard connection terminals 45 are greater in size than the openings 37 , and peripheral portions of the terminal outer surfaces 45 a are buried (embedded) in the resin insulation layer 20 .
- Each of the motherboard connection terminals 45 has a concave portion 45 b at a center portion of the terminal outer surface 45 a thereof (i.e., the central portion of the outer surface of each of the second-main-surface-side connection terminals has a concave shape).
- the deepest portion of the concave portion 45 b is located on an inner layer (interior) side in relation to the peripheral portion of the terminal outer surface 45 a .
- the terminal outer surfaces 45 a of the motherboard connection terminals 45 are formed such that the deepest portion of the concave portion 45 b is located on the inner layer (interior) side in relation to the inner main surface 20 a of the resin insulation layer 20 .
- the concave portion 45 b may be formed such that the peripheral edge portion of the concave portion 45 b is located outward of the inner main surface 20 a.
- Each of the motherboard connection terminals 45 is rounded along an edge 45 d (peripheral edge) of a terminal inner surface 45 c.
- the motherboard connection terminals 45 are mainly formed by (primarily comprised of) a copper layer.
- Each of the motherboard connection terminals 45 has a structure in which only portions of the upper surface of the copper layer which portions are aligned with the openings 37 are covered by a plating layer 48 formed of a material other than copper (specifically, a nickel-gold plating layer).
- a motherboard is connected to the motherboard connection terminals 45 via unillustrated solder.
- the thus-configured multilayer wiring substrate 10 is fabricated by, for example, the following procedure.
- a support substrate (a glass epoxy substrate or the like) having sufficient strength is prepared.
- the resin insulation layers 20 to 24 and the conductive layers 26 are alternately built up, thereby forming the wiring laminate portion 30 .
- a sheet-like electrically insulative resin base material made of epoxy resin and serving as a ground resin insulation layer 51 is attached onto a support substrate 50 , thereby yielding a base material 52 consisting of the support substrate 50 and the ground resin insulation layer 51 .
- a metal laminate sheet 54 is disposed on the upper surface of the ground resin insulation layer 51 of the base material 52 (base-material preparation step). Through disposition of the metal laminate sheet 54 on the ground resin insulation layer 51 , there is ensured such adhesion that, in the subsequent fabrication process, the metal laminate sheet 54 is not separated from the ground resin insulation layer 51 .
- the metal laminate sheet 54 is configured such that two copper foils 55 and 56 (a pair of metal foils) are separably in close contact with each other. Specifically, the copper foils 55 and 56 are laminated together with metal plating (e.g., chromium plating, nickel plating, titanium plating, or composite plating thereof) intervening therebetween, thereby forming the metal laminate sheet 54 .
- metal plating e.g., chromium plating, nickel plating, titanium plating, or composite plating thereof
- an insulation-layer/conductor-portion forming step is performed. Specifically, as shown in FIG. 6 , the sheet-like resin insulation layer 20 is disposed on and attached onto the base material 52 in such a manner as to cover the metal laminate sheet 54 . At this time, the resin insulation layer 20 comes into close contact with the metal laminate sheet 54 and comes into close contact with the ground resin insulation layer 51 in a region around the metal laminate sheet 54 , thereby sealing in the metal laminate sheet 54 .
- the openings 37 are formed in the resin insulation layer 20 at predetermined positions so as to partially expose the copper foil 55 , by means of performing laser beam machining by use of, for example, excimer laser, UV laser, or CO 2 laser. After that, electroless copper plating is performed so as to form a full-surface plating layer (not shown) which covers the openings 37 and the resin insulation layer 20 .
- a dry film for forming a plating resist film is laminated on the upper surface of the resin insulation layer 20 , and exposure and development are carried out for the dry film.
- a plating resist film 57 is formed on the resin insulation layer 20 , and additional openings 57 a which are greater in area than the openings 37 of the resin insulation layer 20 are formed in the plating resist film 57 at positions corresponding to the openings 37 (see FIG. 8 ).
- plating resist film 57 formed, whereby metal conductor portions 58 are formed on the copper foil 55 of the metal laminate sheet 54 .
- the plating resist film 57 is peeled off (see FIG. 9 ).
- Each of the metal conductor portions 58 is formed such that it fills the corresponding opening 37 and covers a portion of the resin insulation layer 20 around the opening 37 .
- each metal conductor portion 58 is roughened (treatment performed by use of a CZ-series etching agent available from MEC Co., Ltd.) (see FIG. 10 ). At that time, the surface of each metal conductor portion 58 is roughened, and the edge of the metal conductor portion 58 is rounded. After that, the sheet-like resin insulation layer 21 is disposed on and attached onto the upper surface of the resin insulation layer 20 having the metal conductor portions 58 formed therein (see FIG. 11 ).
- the via holes 33 are formed in the resin insulation layer 21 at predetermined positions (positions above the metal conductor portions 58 ) by means of performing laser beam machining by use of, for example, excimer laser, UV laser, or CO 2 laser.
- etchant such as a potassium permanganate solution
- a desmear step is performed for removing smears from inside the via holes 33 .
- plasma asking by use of, for example, O 2 plasma may be performed.
- electroless copper plating and copper electroplating are performed by a known process, thereby forming the via conductors 34 in the via holes 33 .
- etching is performed by a known process (e.g., semi-additive process), thereby forming the conductive layer 26 in a predetermined pattern on the resin insulation layer 21 (see FIG. 13 ).
- a wiring laminate 60 in which the metal laminate sheet 54 , the resin insulation layers 20 to 24 , and the conductive layers 26 are laminated on the base material 52 .
- a portion of the wiring laminate 60 which is located above the metal laminate sheet 54 will become the wiring laminate portion 30 of the multilayer wiring substrate 10 .
- portions of the conductive layer 26 formed between the resin insulation layers 23 and 24 exposed to the outside via the openings 35 will become the IC-chip connection terminals 41
- portions of the conductive layer 26 exposed to the outside via the openings 36 will become the capacitor connection terminals 42 .
- the wiring laminate 60 is cut by a dicing apparatus (not shown) so as to remove a surrounding portion around the wiring laminate portion 30 (cutting step).
- cutting progresses along the boundary (indicated by the arrows in FIG. 14 ) between the wiring laminate portion 30 and a surrounding portion 64 and along the extension of the boundary for further cutting of the base material 52 (the support substrate 50 and the ground resin insulation layer 51 ) located under the wiring laminate portion 30 .
- a peripheral edge portion of the metal laminate sheet 54 which has been sealed in the resin insulation layer 20 is exposed. That is, as a result of removal of the surrounding portion 64 , a bonded portion between the ground resin insulation layer 51 and the resin insulation layer 20 is lost. Consequently, the wiring laminate portion 30 and the base material 52 are connected together merely through the metal laminate sheet 54 .
- the wiring laminate portion 30 and the base material 52 are separated from each other at the interface between the copper foils 55 and 56 of the metal laminate sheet 54 , thereby removing the base material 52 from the wiring laminate portion 30 and exposing the copper foil 55 present on the bottom surface 32 of the wiring laminate portion 30 (the resin insulation layer 20 ) (base-material removing step).
- connection-terminal forming step a dry film for forming an etching resist film is laminated on the top surface 31 of the wiring laminate portion 30 , and exposure and development are performed for the dry film to thereby form an etching resist film which covers the entirety of the top surface 31 . In this state, etching is performed for the wiring laminate portion 30 so as to remove the entire copper foil 55 and remove lower portions of the metal conductor portions 58 .
- each metal conductor portion 58 is removed through etching more efficiently at a central portion thereof, as compared with a peripheral portion thereof, whereby the concave portion 45 b is formed on the terminal outer surface 45 a of each motherboard connection terminal 45 .
- the degree of formation of the concave portion 45 b of the terminal outer surface 45 a is adjusted by changing etching conditions such as the concentration and temperature of etchant, treatment time, etc.
- the present embodiment can yield the following effects.
- the plurality of resin insulation layers 20 to 24 which constitute the wiring laminate portion 30 , are formed of the same build-up material made primarily of a hardened resin insulation material that is not photocurable.
- the influence of the difference in thermal expansion coefficient in the wiring laminate portion 30 can be mitigated as compared with the case where the outermost resin insulation layers 20 and 24 are formed of a different resin insulation material.
- the outermost resin insulation layers 20 and 24 in which the connection terminals 41 , 42 , and 45 are formed, are formed of the same build-up material having excellent electrical insulation performance as that used to form the inner resin insulation layers 21 to 23 .
- the interval between the IC-chip connection terminals 41 , that between the capacitor connection terminals 42 , and that between the motherboard connection terminals 45 can be narrowed, so that the multilayer wiring substrate 10 can be further integrated.
- the plurality of openings 35 and 36 are formed in the resin insulation layer 24 , which is exposed to the outside and serves as an outermost layer on the top surface 31 side of the wiring laminate portion 30 , and the plurality of IC-chip connection terminals 41 and the plurality of capacitor connection terminals 42 are disposed to correspond to the respective openings 35 and 36 .
- Peripheral portions of the terminal outer surface 41 a and 42 a of the connection terminals 41 are 42 are covered by the outermost resin insulation layer 24 . That is, the connection terminals 41 and 42 are buried (embedded) in the outermost resin insulation layer 24 . Accordingly, the strength of the connection terminals 41 and 42 can be increased sufficiently.
- the plurality of openings 37 are formed in the resin insulation layer 20 , which is exposed to the outside and serves as an outermost layer on the bottom surface 32 side of the wiring laminate portion 30 , and the plurality of motherboard connection terminals 45 are disposed to correspond to the openings 37 .
- Peripheral portions of the terminal outer surfaces 45 a of the motherboard connection terminals 45 are covered by the outermost resin insulation layer 20 . That is, the motherboard connection terminals 45 are buried (embedded) in the outermost resin insulation layer 20 . Accordingly, the strength of the motherboard connection terminals 45 can be increased sufficiently.
- connection terminals 41 , 42 , and 45 When the connection terminals 41 , 42 , and 45 are formed in this manner, stress acting at the boundary between each of the connection terminals 41 , 42 , and 45 and the resin insulation layer 20 or 24 can be mitigated. Furthermore, since the boundary is not straight, various chemicals and the like are less likely to soak into the interior of the substrate via the boundary. As a result, the possibility of generation of cracks in the resin insulation layers 20 and 24 decreases, and the multilayer wiring substrate 10 has an improved reliability as compared with conventional ones.
- the terminal inner surface 45 c of each motherboard connection terminal 45 is rounded along the edge 45 d thereof. Since this rounding eliminates the concentration of stress at edge portions of the motherboard connection terminals 45 , the possibility of generation of cracks in the resin insulation layer 20 decreases, and the multilayer wiring substrate 10 has an improved reliability as compared with conventional ones.
- connection terminals 41 to which an IC chip is connected
- the capacitor connection terminals 42 to which chip capacitors are connected and which is larger in area than the IC-chip connection terminals 41
- an IC chip can be reliably connected to the IC-chip connection terminals 41 , which are small in area
- chip capacitors can be reliably connected to the capacitor connection terminals 42 , which are large in area.
- connection terminals 45 which are larger in area than the connection terminals 41 and 42 provided on the top surface 31 side, are present on the bottom surface 32 side of the wiring laminate portion 30 , the connection terminals 45 can be reliably connected to a motherboard.
- the inner conductive layers 26 of the wiring laminate portion 30 are laminated. Therefore, positional shift between the motherboard connection terminals 45 and the inner conductive layers 26 can be prevented. Moreover, since the motherboard connection terminals 45 are not required to be formed in a predetermined pattern after the base-material removing step, the multilayer wiring substrate 10 can be manufactured relatively easily.
- the present embodiment differs from the first embodiment in the insulation-layer/conductor-portion forming step of the method of manufacturing the multilayer wiring substrate 10 .
- the structure of the multilayer wiring substrate 10 is identical with that of the first embodiment.
- each metal conductor portion 58 which is to become a motherboard connection terminal 45 , has a lower layer having a small area and an upper layer having a large area, and the lower and upper layers are formed in different steps.
- electroless copper plating is performed so as to form a full-surface plating layer (not shown) which covers the metal laminate sheet 54 and the base material 52 .
- a dry film for forming a plating resist film is laminated on the upper surface of the metal laminate sheet 54 , and exposure and development are carried out for the dry film.
- a plating resist film 71 having openings 71 a at positions corresponding to the motherboard connection terminals 45 is formed (see FIG. 17 ).
- metal-conductor-portion lower layers 58 a which constitute portions of the metal conductor portions 58 , are formed on the metal laminate sheet 54 .
- the plating resist film 71 is then peeled off (see FIG. 18 ).
- the surfaces of the metal-conductor-portion lower layers 58 a are roughened (treatment performed by use of a CZ-series etching agent available from MEC Co., Ltd.).
- the sheet-like resin insulation layer 20 is disposed on and attached onto the metal laminate sheet 54 having the metal-conductor-portion lower layers 58 a , in such a manner to cover the metal laminate sheet 54 (see FIG. 19 ).
- the resin insulation layer 20 comes into close contact with the metal laminate sheet 54 and the metal-conductor-portion lower layers 58 a , and comes into close contact with the ground resin insulation layer 51 in a region around the metal laminate sheet 54 , thereby sealing in the metal laminate sheet 54 .
- the upper end surfaces of the metal-conductor-portion lower layers 58 a are exposed from the resin insulation layer 20 by means of performing, for example, buffing (see FIG. 20 ).
- etchant such as a potassium permanganate solution
- a desmear step is performed for removing smears on the metal-conductor-portion lower layers 58 a.
- electroless copper plating is performed so as to form a full-surface plating layer (not shown) which covers the resin insulation layer 20 and the upper end surfaces of the metal-conductor-portion lower layers 58 a .
- a dry film for forming a plating resist film is laminated on the upper surface of the resin insulation layer 20 , and exposure and development are carried out for the dry film.
- a plating resist film 74 having openings 74 a at positions corresponding to the upper end surfaces of the metal-conductor-portion lower layers 58 a , the openings 74 a being greater in area than the upper end surfaces (see FIG. 21 ).
- metal-conductor-portion upper layers 58 b which constitute portions of the metal conductor portions 58 , are formed in the openings 74 a .
- the plating resist film 74 is then peeled off (see FIG. 22 ).
- etching is performed so as to remove the full-surface plating layer (not shown).
- the plating layers 46 , 47 , and 48 are formed on the surfaces of the IC-chip connection terminals 41 , the surfaces of the capacitor connection terminals 42 , and the surfaces of the motherboard connection terminals 45 , whereby the multilayer wiring substrate 10 shown in FIG. 1 is manufactured.
- the concave portion 45 b is formed on the terminal outer surface 45 a of each motherboard connection terminal 45 such that the deepest portion is located on the inner layer (interior) side in relation to the inner main surface 20 a of the resin insulation layer 20 .
- the configuration of the concave portion 45 b is not limited thereto.
- the concave portion 45 b may be formed such that the deepest portion is located outward of the inner main surface 20 a of the resin insulation layer 20 .
- the IC-chip connection terminals 41 and the capacitor connection terminals 42 are formed such that they are covered by the outermost resin insulation layer 24 , and have the same height.
- the configuration of the connection terminals 41 and 42 are not limited thereto.
- the capacitor connection terminals 42 may be formed such that they project from the outermost resin insulation layer 24 .
- the upper and side surfaces of each capacitor connection terminal 42 are covered with the plating layer 47 .
- the IC-chip connection terminals 41 may be formed such that they project from the outermost resin insulation layer 24 .
- the upper and side surfaces of each IC-chip connection terminal 41 are covered with the plating layer 46 .
- the IC-chip connection terminals 41 and the capacitor connection terminals 42 are rendered different in height as in the multilayer wiring substrates 10 B and 10 C shown in FIGS. 25 and 26 , components (IC chips and chip capacitors) of different types can be reliably connected to the connection terminals 41 and 42 .
- connection terminals 41 and the capacitor connection terminals 42 are provided on the top surface 31 side (first main surface side) of the wiring laminate portion 30 as the first-main-surface-side connection terminals; and the motherboard connection terminals 45 are provided on the bottom surface 32 side (second main surface side) of the wiring laminate portion 30 as the second-main-surface-side connection terminals.
- the arrangement of the connection terminals is not limited thereto. Specifically, as in a multilayer wiring substrate 10 D shown in FIG.
- connection terminals two types of connection terminals; i.e., the capacitor connection terminals 42 and the motherboard connection terminals 45 , may be provided on the bottom surface 32 side of the wiring laminate portion 30 as the second-main-surface-side connection terminals.
- the capacitor connection terminals 42 and the motherboard connection terminals 45 may be provided on the bottom surface 32 side of the wiring laminate portion 30 as the second-main-surface-side connection terminals.
- the IC-chip connection terminals 41 are provided on the top surface 31 of the wiring laminate portion 30 as the first-main-surface-side connection terminals.
- the insulation-layer/conductor-portion forming step buffing is performed so as to expose the upper end surfaces of the metal-conductor-portion lower layers 58 a from the resin insulation layer 20 .
- the method of exposing the upper end surfaces of the metal-conductor-portion lower layers 58 a is not limited thereto.
- the upper end surfaces of the metal-conductor-portion lower layers 58 a may be exposed from the resin insulation layer 20 by performing surface polishing, other than buffing, or machining by use of a laser or plasma.
- the plurality of conductive layers 26 formed in the plurality of resin insulation layers 21 to 24 are connected with one another through the via conductors 34 whose diameters increase in a direction from the bottom surface 32 to the top surface 31 .
- their structures are not limited thereto.
- the via conductors 34 formed in the plurality of resin insulation layers 21 to 24 may have any shape so long as their diameters increase in the same direction; and the plurality of conductive layers 26 may be connected with one anther through via conductors whose diameters increase in a direction from the top surface 31 to the bottom surface 32 .
- each of the plating layers 46 , 47 , and 48 which cover the connection terminals 41 , 42 , and 45 , respectively, is a nickel-gold plating layer.
- the nickel-gold plating layer can be replaced with any other plating layer, such as nickel-palladium-gold plating layer, so long as the plating layer is formed of a material other than copper.
- a multilayer wiring substrate has a laminate structure in which a plurality of resin insulation layers made primarily of the same resin insulation material, and a plurality of conductive layers are laminated alternately in multilayer arrangement.
- a plurality of first-main-surface-side connection terminals are disposed on a first main surface of the laminate structure.
- a plurality of second-main-surface-side connection terminals are disposed on a second main surface of the laminate structure.
- the plurality of conductive layers are formed in the plurality of resin insulation layers and interconnected by means of via conductors whose diameters increase toward the first main surface or the second main surface.
- the plurality of resin insulation layers are formed of a hardened resin insulation material that is not photocurable.
- a plurality of first openings are formed in a resin insulation layer which is exposed to the outside and serves as an outermost layer on the first main surface side of the laminate structure.
- the first-main-surface-side connection terminals have terminal outer surfaces, and are disposed to correspond to the first openings.
- the peripheral portions of the terminal outer surfaces are covered by the outermost resin insulation layer.
- a plurality of second openings are formed in a resin insulation layer which is exposed to the outside and serves as an outermost layer on the second main surface side of the laminate structure.
- the second-main-surface-side connection terminals have terminal outer surfaces, and are disposed to correspond to the second openings.
- the peripheral portions of the terminal outer surfaces are covered by the outermost resin insulation layer.
- each of the motherboard connection terminals, the IC-chip connection terminals, and the passive-component connection terminals has a structure in which only the upper surface of a copper layer which mainly forms the connection terminals is covered with a plating layer formed of a material other than copper.
- the multilayer wiring substrate described above in (1) or (2) is characterized in that the terminal outer surface of each second-main-surface-side connection terminal is formed such that the deepest portion of the concave portion is located on the inner layer (interior) side in relation to the inner main surface of the outermost resin insulation layer.
Abstract
A plurality of openings are formed in a resin insulation layer on a top surface side of a wiring laminate portion, and a plurality of openings are formed in a resin insulation layer on a bottom surface side thereof. A plurality of connection terminals are disposed to correspond to the openings. Peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the top surface side, and peripheral portions of terminal outer surfaces of the connection terminals are covered by the resin insulation layer on the bottom surface side. Each of the second-main-surface-side connection terminals has a concave portion at the center of the terminal outer surface, and the deepest portion of the concave portion is located on the interior side in relation to the peripheral portion of the terminal outer surface.
Description
- The present application is a divisional of prior U.S. application Ser. No. 13/028,545, filed Feb. 16, 2011, and claims priority to Japanese Patent Application No. 2010-31864, which was filed on Feb. 16, 2010, the disclosures of which are incorporated by reference in their entirety.
- 1. Field of the Invention
- The present invention relates to a multilayer wiring substrate having a laminate structure in which a plurality of resin insulation layers made primarily of the same resin insulation material, and a plurality of conductive layers are laminated alternately in multilayer arrangement, and not having a so-called substrate core in a final product, the substrate core carrying build-up layers successively formed on opposite surfaces thereof. The present invention also relates to a method of manufacturing such a multilayer wiring substrate.
- 2. Description of Related Art
- In association with recent increasing tendency toward higher operation speed and higher functionality of semiconductor integrated circuit devices (IC chips) used as, for example, microprocessors of computers, the number of terminals increases, and the pitch between the terminals tends to become narrower. Generally, a large number of terminals are densely arrayed on the bottom surface of an IC chip and flip-chip-bonded to terminals provided on a motherboard. However, since the terminals of the IC chip differ greatly in pitch from those of the motherboard, difficulty is encountered in bonding the IC chip directly onto the motherboard. Thus, according to an ordinarily employed method, a semiconductor package configured such that the IC chip is mounted on an IC chip mounting wiring substrate is fabricated, and the semiconductor package is mounted on the motherboard.
- The IC chip mounting wiring substrate which partially constitutes such a semiconductor package is practicalized in the form of a multilayer substrate configured such that a build-up layer is formed on the front and back surfaces of a substrate core. The substrate core used in the multilayer wiring substrate is, for example, a resin substrate (glass epoxy substrate) formed by impregnating reinforcement fiber with resin. Through utilization of rigidity of the substrate core, resin insulation layers and conductive layers are laminated alternately on the front and back surfaces of the substrate core, thereby forming respective build-up layers. In the multilayer wiring substrate, the substrate core serves as a reinforcement and is formed very thick as compared with the build-up layers. Also, the substrate core has conductor lines (specifically, through-hole conductors, etc.) extending therethrough for electrical communication between the build-up layers formed on the front and back surfaces.
- In recent years, in association with implementation of high operation speeds of semiconductor integrated circuit devices, signal frequencies to be used have become those of a high frequency band. In this case, the conductor lines which extend through the substrate core serve as sources of high inductance, leading to the transmission loss of high-frequency signals and the occurrence of circuitry malfunction and thus hindering implementation of high operation speed. In order to solve this problem, a multilayer wiring substrate having no substrate core is proposed (refer to, for example, Patent Documents 1 and 2). The multilayer wiring substrates described in
Patent Documents 1 and 2 do not use a substrate core, which is relatively thick, thereby reducing the overall wiring length. Thus, the transmission loss of high-frequency signals is lowered, whereby a semiconductor integrated circuit device can be operated at high speed. - In the manufacturing method disclosed in Patent Document 1, a metal foil is disposed one side of a provisional substrate, and a plurality of conductive layers and a plurality of resin insulation layers are alternately stacked on the metal foil to thereby form a build-up layer. Subsequently, the metal foil is separated from the provisional substrate so as to obtain a structure in which the build-up layer is formed on the metal foil. The surface of the outermost layer (the surface of a resin insulation layer and the surfaces of a plurality of connection terminals) is exposed by means of removing the metal foil through etching, whereby a multilayer wiring substrate is manufactured.
- Patent Document 1 also discloses a multilayer wiring substrate in which a solder resist film is formed on the build-up layer as the outermost layer thereof. Notably, openings are formed in the solder resist film so as to expose the surfaces of IC-chip connection terminals. In a multilayer wiring substrate disclosed in
Patent Document 2 as well, a solder resist film is formed, as the outer most layer, on the side of the wiring substrate where an IC chip is mounted, and openings are formed in the solder resist film so as to expose the top surfaces of IC-chip connection terminals. The solder resist film is made primarily of a hardened photocurable resin insulation material. The openings of the solder resist film are formed through exposure and development performed in a state in which a predetermined mask is disposed on the solder resist film. Subsequently, solder bumps are formed on the top surfaces of the IC-chip connection terminals exposed within the openings of the solder resist film, and an IC chip is mounted via the solder bumps. -
- Patent Document 1: Japanese Patent Application Laid-open (kokai) No. 2007-158174. Patent Document 2: Japanese Patent Application Laid-open (kokai) No. 2004-111544.
- Incidentally, the above-mentioned Patent Document 1 discloses a multilayer wiring substrate in which the surfaces of connection terminals (e.g., motherboard connection terminals to be connected to a motherboard) having a relatively large area are formed such that the surfaces become flush with the outermost resin insulation layer. In this multilayer wiring substrate, in some cases, a stress acts at the boundary between each motherboard connection terminal and the resin insulation layer. Therefore, the disclosed multilayer wiring substrate has a problem in that, as shown in
FIG. 28 ,cracks 103 are generated at the boundary between eachmotherboard connection terminal 101 and aresin insulation layer 102 in such a manner that thecracks 103 extend from the boundary through theresin insulation layer 102. - In order to solve such a problem, the multilayer wiring substrate may be manufactured such that a solder resist film is formed to cover a peripheral portion of the outer surface of each motherboard connection terminal. Thus, the stress acting at the boundary between each motherboard connection terminal and the resin insulation layer can be reduced. However, when a solder resist film is formed as the outermost layer of the multilayer wiring substrate, due to a difference in coefficient of thermal expansion between the solder resist film and inner resin insulation layers, the substrate warps in accordance with the difference in coefficient of thermal expansion. In this case, since a structure (e.g., a reinforcing plate or the like) is additionally required so as to restrain the warpage, the manufacturing cost of the multilayer wiring substrate increases.
- The present invention has been conceived in view of the above problems, and an object of the invention is to provide a highly reliable multilayer wiring substrate which is free from generation of cracks in a resin insulation layer.
- According to an aspect of the invention, a multilayer wiring substrate includes a laminate structure in which a plurality of resin insulation layers made primarily of a same resin insulation material, and a plurality of conductive layers are laminated alternately in multilayer arrangement, a plurality of first-main-surface-side connection terminals being disposed on a first main surface side of the laminate structure, a plurality of second-main-surface-side connection terminals being disposed on a second main surface side of the laminate structure, the plurality of conductive layers being formed in the plurality of resin insulation layers and interconnected by means of via conductors whose diameters increase toward the first main surface side of the laminate structure or the second main surface side of the laminate structure. The plurality of resin insulation layers are formed of a hardened resin insulation material that is not photocurable. A plurality of first openings are formed in an outermost resin insulation layer on the first main surface side of the laminate structure. The plurality of first-main-surface-side connection terminals include terminal outer surfaces and are disposed to correspond to the plurality of first openings, and peripheral portions of the terminal outer surfaces are covered by the outermost resin insulation layer on the first main surface side of the laminate structure. A plurality of second openings are formed in an outermost resin insulation layer on the second main surface side of the laminate structure. The plurality of second-main-surface-side connection terminals include terminal outer surfaces and are disposed to correspond to the plurality of second openings, and peripheral portions of the terminal outer surfaces are covered by the outermost resin insulation layer on the second main surface side of the laminate structure. Each of the plurality of second-main-surface-side connection terminals has a concave portion at a center portion of each of the terminal outer surfaces.
- According to this aspect, the multilayer wiring substrate is formed such that a plurality of resin insulation layers made primarily of the same resin insulation material, and a plurality of conductive layers are laminated alternately, and assumes the form of a coreless wiring substrate having no substrate core. In this multilayer wiring substrate, the plurality of resin insulation layers which constitute the laminate structure are formed of the same build-up material made primarily of a hardened resin insulation material that is not photocurable. In this case, the influence of a difference in thermal expansion coefficient in the laminate structure can be mitigated, as compared with the case where the outermost resin insulation layers are formed of a different resin insulation material. As a result, warpage of the multilayer wiring substrate can be restrained. Furthermore, since the outermost resin insulation layers, in which the connection terminals are formed, are formed of the same build-up material having excellent electrical insulation performance as that used to form the inner resin insulation layers, the interval between the connection terminals can be narrowed, so that the multilayer wiring substrate can be further integrated. Also, the plurality of first openings are formed in the outermost resin insulation layer exposed on the first main surface side of the laminate structure, and the plurality of the first-main-surface-side connection terminals are disposed to correspond to these first openings. Peripheral portions of the terminal outer surfaces of the first-main-surface-side connection terminals are covered by the corresponding outermost resin insulation layer. That is, peripheral portions of the first-main-surface-side connection terminals are buried (embedded) in the corresponding outermost resin insulation layer. Accordingly, the strength of the first-main-surface-side connection terminals can be increased sufficiently. Furthermore, the plurality of second openings are formed in the outermost resin insulation layer exposed on the second main surface side of the laminate structure, and the plurality of the second-main-surface-side connection terminals are disposed to correspond to these second openings. Peripheral portions of the terminal outer surfaces of the second-main-surface-side connection terminals are covered by the corresponding outermost resin insulation layer. That is, peripheral portions of the second-main-surface-side connection terminals are buried (embedded) in the corresponding outermost resin insulation layer. Accordingly, the strength of the second-main-surface-side connection terminals can be increased sufficiently. When the connection terminals are formed in this manner, stress acting at the boundary between each of the connection terminals and the resin insulation layer can be mitigated. Therefore, the possibility of generation of cracks in the resin insulation layers decreases. Moreover, each of the second-main-surface-side connection terminals has a concave portion formed at the center of the terminal outer surface thereof. In particular, when a hemispherical concave portion is formed on the terminal outer surface of each second-main-surface-side connection terminal, the concentration of stress at an end portion of the second-main-surface-side connection terminal is mitigated, whereby generation of cracks in the corresponding resin insulation layer can be prevented, and reliability is improved.
- Preferably, the concave portion of each of the terminal outer surfaces is formed such that a deepest portion of the concave portion is located on the inner layer (interior) side in relation to the peripheral portion of each of the terminal outer surfaces. Since the second-main-surface-side connection terminals formed in this manner increase the area of contact between solder and the terminal outer surface, the strength of solder connection can be increased.
- Preferably, each of the plurality of second-main-surface-side connection terminals further includes an inner surface having a peripheral edge, and the peripheral edge is rounded. When this configuration is employed, the concentration of stress at an edge portion of the terminal inner surface is avoided. Therefore, the possibility of generation of cracks in the resin insulation layer decreases, and the multilayer wiring substrate has an improved reliability as compared with conventional ones. Notably, the second-main-surface-side connection terminals may be provided on the main surface to which a motherboard is connected, or provided on the opposite main surface; i.e., the main surface onto which an IC chip is mounted.
- Preferably, the first-main-surface-side connection terminals include IC-chip connection terminals, to which an IC chip is to be connected, and passive-component connection terminals, to which a passive component is to be connected and which are greater in area than the IC-chip connection terminals; and the second-main-surface-side connection terminals include motherboard connection terminals, to which a motherboard is to be connected and which are greater in area than the IC-chip connection terminals and the passive-component connection terminals, are provided on the second main surface side as the second-main-surface-side connection terminals. When this configuration is employed, on the first main surface side of the laminate structure, an IC chip can be reliably connected to the IC-chip connection terminals whose area is small, and a passive component can be reliably connected to the passive-component connection terminals whose area is large. Moreover, on the second main surface side of the laminate structure, the motherboard connection terminals can be reliably connected to a motherboard.
- Alternatively, the first-main-surface-side connection terminals may include IC-chip connection terminals, to which an IC chip is connected; and the second-main-surface-side connection terminals may include passive-component connection terminals, to which a passive component is to be connected and which are greater in area than the IC-chip connection terminals, and motherboard connection terminals, to which a motherboard is to be connected and which are greater in area than the IC-chip connection terminals and the passive-component connection terminals. When this configuration is employed, on the first main surface side of the laminate structure, an IC chip can be reliably connected to the IC-chip connection terminals. Moreover, on the second main surface side of the laminate structure, a passive component can be reliably connected to the passive-component connection terminals, and the motherboard connection terminals can be reliably connected to a motherboard.
- The via conductors formed in the plurality of resin insulation layers may be shaped such that their diameters increase in a direction from the second main surface side to the first main surface side. By contrast, the via conductors formed in the plurality of resin insulation layers may also be shaped such that their diameters increase in a direction from the first main surface side to the second main surface side. Through employment of this diametral feature, a coreless wiring substrate having no substrate core can be reliably manufactured.
- Each of the motherboard connection terminals or each of the IC-chip connection terminals and the passive-component connection terminals may comprise a copper layer covered with a plating layer comprised of a material other than copper. Alternatively, each of the motherboard connection terminals, the IC-chip connection terminals, and the passive-component connection terminals may comprise a copper layer covered with a plating layer formed of a material other than copper. In particular, it is preferred that each of the IC-chip connection terminals whose area is small has a structure in which only the upper surface of a copper layer which mainly forms the connection terminals is covered with a plating layer formed of a material other than copper. When this configuration is employed, a solder bump formed on the upper surface of each connection terminal can be prevented from bulging laterally. Therefore, solder bumps can be formed on the upper surfaces of the connection terminals at a fine pitch.
- Preferred examples of the material used to form the resin insulation layers include thermosetting resins, such as epoxy resin, phenol resin, urethane resin, silicone resin, and polyimide resin; and thermoplastic resins, such as polycarbonate resin, acrylic resin, polyacetal resin, and polypropylene resin. Additionally, there may be used a composite material consisting of any one of these resins, and glass fiber (glass woven fabric or glass nonwoven fabric) or organic fiber, such as polyamide fiber, or a resin-resin composite material in which a three-dimensional network fluorine-containing resin base material, such as continuously porous PTFE, is impregnated with a thermosetting resin, such as epoxy resin.
- Notably, in the present invention, “a plurality of resin insulation layers made primarily of the same resin insulation material” may be a plurality of resin insulation layers which differ in additive, such as the above-mentioned organic fiber, which is mixed with, for example, thermo setting resin, if the resin insulation layers are mainly formed of the same thermo setting resin.
- According to another aspect of the invention, a method of manufacturing a multilayer wiring substrate including a laminate structure in which a plurality of resin insulation layers made primarily of a same resin insulation material, and a plurality of conductive layers are laminated alternately in multilayer arrangement, a plurality of first-main-surface-side connection terminals being disposed on a first main surface side of the laminate structure, a plurality of second-main-surface-side connection terminals being disposed on a second main surface side of the laminate structure, the plurality of conductive layers being formed in the plurality of resin insulation layers and interconnected by means of via conductors whose diameters increase toward the first main surface side of the laminate structure or the second main surface side of the laminate structure. The method includes: a base-material preparation step of preparing a base material on which a metal foil is separably laminated; and an insulation-layer/conductor-portion forming step. The insulation-layer/conductor-portion forming step includes: a step of laminating on the metal foil a build-up material made primarily of a resin insulation material that is not photocurable, to thereby form an outermost resin insulation layer on the second main surface side of the laminate structure, a step of forming openings in the outermost resin insulation layer, and a step of forming a metal conductor portion in each of the openings and on a corresponding portion of the outermost resin insulation layer around each of the openings. The method further includes a build-up step including a step of laminating the plurality of resin insulation layers made primarily of the same resin insulation material, and a plurality of conductive layers alternately in multilayer arrangement, to thereby form the laminate structure, and a step of forming the first-main-surface-side connection terminals on the first main surface side of the laminate structure. The method also includes a base-material removing step of, after the build-up step, removing the base material to thereby expose the metal foil, and a connection-terminal forming step of removing the metal foil and at least a portion of each metal conductor portion, to thereby form a concave portion in each of the plurality of second-main-surface-side connection terminals.
- According to the aspect mentioned above, the second-main-surface-side connection terminals can be reliably formed such that a peripheral portion of the terminal outer surface of each second-main-surface-side connection terminal is covered by the corresponding outermost resin insulation layer. Moreover, the concave portion is formed on the terminal outer surface of each second-main-surface-side connection terminal such that the deepest portion of the concave portion is located on the inner layer side in relation to the peripheral portion of the terminal outer surface. When the second-main-surface-side connection terminals are formed in this manner, the stress acting at the boundary between each second-main-surface-side connection terminal and the corresponding resin insulation layer can be mitigated, whereby the possibility of generation of cracks in the resin insulation layer decreases. Furthermore, since the area of contact between solder and the terminal outer surface increases, the strength of solder connection can be increased. Moreover, in the manufacturing method of the present invention, since the second-main-surface-side connection terminals are not required to be formed in a predetermined pattern after the build-up step, the multilayer wiring substrate can be manufactured relatively easily.
- The step of forming openings in the outermost resin insulating layer may be performed after the step of laminating on the metal foil a build-up material, and may include a step of performing laser drilling on the outermost resin insulation layer on the second main surface side to thereby form the openings, the openings for exposing portions of the metal foil. The method may further include, after the step of performing laser drilling, a step of forming a plating resist film on the outermost resin insulation layer on the second main surface, and a step of forming, at positions corresponding to the openings, additional openings in the plating resist film which are greater in area than the openings. The step of forming the metal conductor portion may be performed after the steps of forming a plating resist film and forming additional openings, and may further include: a step of performing electro plating so as to form the metal conductor portions in each of the openings and the additional openings; and a step of removing the plating resist film. In this case, the metal conductor portions, which are to be used as the second-main-surface-side connection terminals, can be formed reliably.
- According to another aspect of the invention, a method of manufacturing a multilayer wiring substrate as described above includes: a base-material preparation step of preparing a base material on which a metal foil is separably laminated; and an insulation-layer/conductor-portion forming step. The insulation-layer/conductor-portion forming step includes: a step of performing copper plating so as to form metal-conductor-portion lower layers, which partially constitute the metal conductor portions, on the metal foil; a step of laminating on the metal foil and the metal-conductor-portion lower layers a build-up material made primarily of a resin insulation material that is not photocurable, to thereby form an outermost resin insulation layer on the second main surface side of the laminate structure; a step of exposing the upper end surfaces of the metal-conductor-portion lower layers from the outermost resin insulation layer on the second main surface side; a step of forming a plating resist film on the outermost resin insulation layer on the second main surface; a step of forming openings at positions corresponding to the upper end surfaces of the metal-conductor-portion lower layers, the openings having area greater than an area of the upper end surfaces; a step of performing copper plating so as to form metal-conductor-portion upper layers, which partially constitute the metal conductor portions in the openings; and a step of removing the plating resist film. This aspect of the invention also includes a build-up step, a base-material removing step, and a connection-terminal forming step as described above with respect to the previous aspect of the invention. In this case as well, the metal conductor portions, which are to be used as the second-main-surface-side connection terminals, can be formed reliably.
- Other features and advantages of the invention will be set forth in, or apparent from, the detailed description of exemplary embodiments of the invention found below.
-
FIG. 1 is a sectional view schematically showing the structure of a multilayer wiring substrate according to a first embodiment. -
FIG. 2 is a plan view schematically showing the structure of the multilayer wiring substrate according to the first embodiment. -
FIG. 3 is a plan view schematically showing the structure of the multilayer wiring substrate according to the first embodiment. -
FIG. 4 is an explanatory view showing a method of manufacturing the multilayer wiring substrate according to the first embodiment. -
FIG. 5 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment. -
FIG. 6 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment. -
FIG. 7 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment. -
FIG. 8 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment. -
FIG. 9 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment. -
FIG. 10 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment. -
FIG. 11 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment. -
FIG. 12 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment. -
FIG. 13 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment. -
FIG. 14 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment. -
FIG. 15 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment. -
FIG. 16 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the first embodiment. -
FIG. 17 is an explanatory view showing a method of manufacturing a multilayer wiring substrate according to a second embodiment. -
FIG. 18 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the second embodiment. -
FIG. 19 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the second embodiment. -
FIG. 20 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the second embodiment. -
FIG. 21 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the second embodiment. -
FIG. 22 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the second embodiment. -
FIG. 23 is an explanatory view showing the method of manufacturing the multilayer wiring substrate according to the second embodiment. -
FIG. 24 is a sectional view schematically showing the structure of a multilayer wiring substrate according to another embodiment. -
FIG. 25 is a sectional view schematically showing the structure of a multilayer wiring substrate according to another embodiment. -
FIG. 26 is a sectional view schematically showing the structure of a multilayer wiring substrate according to another embodiment. -
FIG. 27 is a sectional view schematically showing the structure of a multilayer wiring substrate according to another embodiment. -
FIG. 28 is an enlarged sectional view showing a conventional multilayer wiring substrate. - A multilayer wiring substrate according to a first embodiment of the present invention will next be described in detail with reference to the drawings.
FIG. 1 is an enlarged sectional view schematically showing the structure of the multilayer wiring substrate of the present embodiment.FIG. 2 is a plan view of the multilayer wiring substrate as viewed from the top surface side.FIG. 3 is a plan view of the multilayer wiring substrate as viewed from the bottom surface side. - As shown in
FIG. 1 , amultilayer wiring substrate 10 is a coreless wiring substrate having no substrate core and has a multilayer wiring laminate portion 30 (laminate structure) in which a plurality of resin insulation layers 20, 21, 22, 23, and 24 made primarily of the same resin insulation material, and a plurality ofconductive layers 26 made of copper are laminated alternately. The resin insulation layers 20 to 24 are formed of a build-up material made primarily of a hardened resin insulation material that is not photocurable; specifically, a hardened thermosetting epoxy resin. In themultilayer wiring substrate 10, a plurality ofconnection terminals 41 and 42 (first-main-surface-side connection terminals) are disposed on one side (first main surface side) of thewiring laminate portion 30 where a top surface 31 (first main surface) thereof is present. - As shown in
FIGS. 1 and 2 , in themultilayer wiring substrate 10 of the present embodiment, the plurality ofconnection terminals top surface 31 side of thewiring laminate portion 30 are IC-chip connection terminals 41 to which an IC chip is connected, andcapacitor connection terminals 42 to which chip capacitors are connected. On thetop surface 31 side of thewiring laminate portion 30, the plurality of IC-chip connection terminals 41 are arrayed in achip mounting region 43 provided at a central portion of themultilayer wiring substrate 10. Thecapacitor connection terminals 42 are greater in area than the IC-chip connection terminals 41 and are disposed externally of thechip mounting region 43. - Meanwhile, as shown in
FIGS. 1 and 3 , on the other side (second main surface side) of thewiring laminate portion 30 where a bottom surface 32 (second main surface) thereof is present, a plurality of connection terminals 45 (motherboard connection terminals serving as second-main-surface-side connection terminals) for LGA (land grid array) to which a motherboard is connected are arrayed. Themotherboard connection terminals 45 are greater in area than the IC-chip connection terminals 41 and thecapacitor connection terminals 42 on thetop surface 31 side. - Via
holes 33 and filled-viaconductors 34 are provided in the resin insulation layers 21, 22, 23, and 24. The viaconductors 34 are shaped such that their diameters increase in the same direction (inFIG. 1 , in the direction from the bottom surface toward the top surface). The viaconductors 34 electrically interconnect theconductive layers 26, the IC-chip connection terminals 41, thecapacitor connection terminals 42, and themotherboard connection terminals 45. - A plurality of
openings 35 and 36 (first openings) are formed in the resin insulation layer 24 (outermost resin insulation layer on the first main surface side of the laminate structure) which is exposed to the outside and serves as an outermost layer on thetop surface 31 side of thewiring laminate portion 30. The IC-chip connection terminals 41 and thecapacitor connection terminals 42 are disposed to correspond to theseopenings - Specifically, the IC-
chip connection terminals 41 are disposed within theopenings 35 such that their terminalouter surfaces 41 a are lower in height than the outer surface of theresin insulation layer 24. Peripheral portions of the terminalouter surfaces 41 a are covered by the outermostresin insulation layer 24. That is, the IC-chip connection terminals 41 are greater in size than theopenings 35, and peripheral portions of the terminalouter surfaces 41 a are buried (embedded) in theresin insulation layer 24. - Furthermore, the
capacitor connection terminals 42 are disposed within theopenings 36 such that their terminalouter surfaces 42 a are lower in height than the surface of theresin insulation layer 24. Peripheral portions of the terminalouter surfaces 42 a are covered by the outermostresin insulation layer 24. That is, thecapacitor connection terminals 42 are greater in size than theopenings 36, and peripheral portions of the terminalouter surfaces 42 a are buried (embedded) in theresin insulation layer 24. - The IC-
chip connection terminals 41 and thecapacitor connection terminals 42 are mainly formed by (primarily comprised of) a copper layer. Each of the IC-chip connection terminals 41 and thecapacitor connection terminals 42 has a structure in which only portions of the upper surface of the copper layer which portions are aligned with theopenings layers - A plurality of openings 37 (second openings) are formed in the resin insulation layer 20 (outermost resin insulation layer on the second main surface side of the laminate structure) which is exposed to the outside and serves as an outermost layer on the
bottom surface 32 side of thewiring laminate portion 30. Themotherboard connection terminals 45 are disposed to correspond to theseopenings 37. - Specifically, the
motherboard connection terminals 45 are disposed within theopenings 37 such that their terminalouter surfaces 45 a are lower in height than the outer surface of theresin insulation layer 20. Peripheral portions of the terminalouter surfaces 45 a are covered by the outermostresin insulation layer 20. That is, themotherboard connection terminals 45 are greater in size than theopenings 37, and peripheral portions of the terminalouter surfaces 45 a are buried (embedded) in theresin insulation layer 20. - Each of the
motherboard connection terminals 45 has aconcave portion 45 b at a center portion of the terminalouter surface 45 a thereof (i.e., the central portion of the outer surface of each of the second-main-surface-side connection terminals has a concave shape). The deepest portion of theconcave portion 45 b is located on an inner layer (interior) side in relation to the peripheral portion of the terminalouter surface 45 a. In the present embodiment, the terminalouter surfaces 45 a of themotherboard connection terminals 45 are formed such that the deepest portion of theconcave portion 45 b is located on the inner layer (interior) side in relation to the innermain surface 20 a of theresin insulation layer 20. Notably, although a peripheral edge portion of theconcave portion 45 b is located at substantially the same position as the innermain surface 20 a in the present embodiment, theconcave portion 45 b may be formed such that the peripheral edge portion of theconcave portion 45 b is located outward of the innermain surface 20 a. - Each of the
motherboard connection terminals 45 is rounded along anedge 45 d (peripheral edge) of a terminalinner surface 45 c. - The
motherboard connection terminals 45 are mainly formed by (primarily comprised of) a copper layer. Each of themotherboard connection terminals 45 has a structure in which only portions of the upper surface of the copper layer which portions are aligned with theopenings 37 are covered by aplating layer 48 formed of a material other than copper (specifically, a nickel-gold plating layer). A motherboard is connected to themotherboard connection terminals 45 via unillustrated solder. - The thus-configured
multilayer wiring substrate 10 is fabricated by, for example, the following procedure. - First, in a build-up step, a support substrate (a glass epoxy substrate or the like) having sufficient strength is prepared. On the support substrate, the resin insulation layers 20 to 24 and the
conductive layers 26 are alternately built up, thereby forming thewiring laminate portion 30. - More specifically, as shown in
FIG. 4 , a sheet-like electrically insulative resin base material made of epoxy resin and serving as a groundresin insulation layer 51 is attached onto asupport substrate 50, thereby yielding abase material 52 consisting of thesupport substrate 50 and the groundresin insulation layer 51. - Then, as shown in
FIG. 5 , ametal laminate sheet 54 is disposed on the upper surface of the groundresin insulation layer 51 of the base material 52 (base-material preparation step). Through disposition of themetal laminate sheet 54 on the groundresin insulation layer 51, there is ensured such adhesion that, in the subsequent fabrication process, themetal laminate sheet 54 is not separated from the groundresin insulation layer 51. Themetal laminate sheet 54 is configured such that two copper foils 55 and 56 (a pair of metal foils) are separably in close contact with each other. Specifically, the copper foils 55 and 56 are laminated together with metal plating (e.g., chromium plating, nickel plating, titanium plating, or composite plating thereof) intervening therebetween, thereby forming themetal laminate sheet 54. - After the base-material preparation step, an insulation-layer/conductor-portion forming step is performed. Specifically, as shown in
FIG. 6 , the sheet-likeresin insulation layer 20 is disposed on and attached onto thebase material 52 in such a manner as to cover themetal laminate sheet 54. At this time, theresin insulation layer 20 comes into close contact with themetal laminate sheet 54 and comes into close contact with the groundresin insulation layer 51 in a region around themetal laminate sheet 54, thereby sealing in themetal laminate sheet 54. - Then, as shown in
FIG. 7 , theopenings 37 are formed in theresin insulation layer 20 at predetermined positions so as to partially expose thecopper foil 55, by means of performing laser beam machining by use of, for example, excimer laser, UV laser, or CO2 laser. After that, electroless copper plating is performed so as to form a full-surface plating layer (not shown) which covers theopenings 37 and theresin insulation layer 20. - Subsequently, a dry film for forming a plating resist film is laminated on the upper surface of the
resin insulation layer 20, and exposure and development are carried out for the dry film. As a result, a plating resistfilm 57 is formed on theresin insulation layer 20, andadditional openings 57 a which are greater in area than theopenings 37 of theresin insulation layer 20 are formed in the plating resistfilm 57 at positions corresponding to the openings 37 (seeFIG. 8 ). - Furthermore, copper electroplating is selectively performed with the plating resist
film 57 formed, wherebymetal conductor portions 58 are formed on thecopper foil 55 of themetal laminate sheet 54. Subsequently, the plating resistfilm 57 is peeled off (seeFIG. 9 ). Each of themetal conductor portions 58 is formed such that it fills thecorresponding opening 37 and covers a portion of theresin insulation layer 20 around theopening 37. - After the insulation-layer/conductor-portion forming step, in order to enhance adhesion between each
metal conductor portion 58 and theresin insulation layer 21, the surface of eachmetal conductor portion 58 is roughened (treatment performed by use of a CZ-series etching agent available from MEC Co., Ltd.) (seeFIG. 10 ). At that time, the surface of eachmetal conductor portion 58 is roughened, and the edge of themetal conductor portion 58 is rounded. After that, the sheet-likeresin insulation layer 21 is disposed on and attached onto the upper surface of theresin insulation layer 20 having themetal conductor portions 58 formed therein (seeFIG. 11 ). - Then, as shown in
FIG. 12 , the via holes 33 are formed in theresin insulation layer 21 at predetermined positions (positions above the metal conductor portions 58) by means of performing laser beam machining by use of, for example, excimer laser, UV laser, or CO2 laser. Next, by use of etchant, such as a potassium permanganate solution, a desmear step is performed for removing smears from inside the via holes 33. In the desmear step, in place of treatment by use of etchant, plasma asking by use of, for example, O2 plasma may be performed. - After the desmear step, electroless copper plating and copper electroplating are performed by a known process, thereby forming the via
conductors 34 in the via holes 33. Further, etching is performed by a known process (e.g., semi-additive process), thereby forming theconductive layer 26 in a predetermined pattern on the resin insulation layer 21 (seeFIG. 13 ). - Also, other resin insulation layers 22 to 24 and the corresponding
conductive layers 26 are formed and laminated on theresin insulation layer 21 by processes similar to those used to form theresin insulation layer 21 and the associatedconductive layer 26. Subsequently, laser drilling is performed on the outermostresin insulation layer 24, thereby forming the plurality ofopenings 35 and 36 (seeFIG. 14 ). Next, there is performed a desmear step of removing smears from inside theopenings - By the above-described build-up step, there is formed a
wiring laminate 60 in which themetal laminate sheet 54, the resin insulation layers 20 to 24, and theconductive layers 26 are laminated on thebase material 52. Notably, as shown inFIG. 14 , a portion of thewiring laminate 60 which is located above themetal laminate sheet 54 will become thewiring laminate portion 30 of themultilayer wiring substrate 10. Furthermore, in thewiring laminate 60, portions of theconductive layer 26 formed between the resin insulation layers 23 and 24 exposed to the outside via theopenings 35 will become the IC-chip connection terminals 41, and portions of theconductive layer 26 exposed to the outside via theopenings 36 will become thecapacitor connection terminals 42. - After the build-up step, the
wiring laminate 60 is cut by a dicing apparatus (not shown) so as to remove a surrounding portion around the wiring laminate portion 30 (cutting step). At this time, as shown inFIG. 14 , cutting progresses along the boundary (indicated by the arrows inFIG. 14 ) between thewiring laminate portion 30 and a surroundingportion 64 and along the extension of the boundary for further cutting of the base material 52 (thesupport substrate 50 and the ground resin insulation layer 51) located under thewiring laminate portion 30. As a result of this cutting, a peripheral edge portion of themetal laminate sheet 54 which has been sealed in theresin insulation layer 20 is exposed. That is, as a result of removal of the surroundingportion 64, a bonded portion between the groundresin insulation layer 51 and theresin insulation layer 20 is lost. Consequently, thewiring laminate portion 30 and thebase material 52 are connected together merely through themetal laminate sheet 54. - As shown in
FIG. 15 , thewiring laminate portion 30 and thebase material 52 are separated from each other at the interface between the copper foils 55 and 56 of themetal laminate sheet 54, thereby removing thebase material 52 from thewiring laminate portion 30 and exposing thecopper foil 55 present on thebottom surface 32 of the wiring laminate portion 30 (the resin insulation layer 20) (base-material removing step). - Subsequently, on the
bottom surface 32 side of thewiring laminate portion 30, thecopper foil 55 is removed, and themetal conductor portions 58 are partially removed, whereby themotherboard connection terminals 45 having theconcave portions 45 b are formed (connection-terminal forming step). Specifically, a dry film for forming an etching resist film is laminated on thetop surface 31 of thewiring laminate portion 30, and exposure and development are performed for the dry film to thereby form an etching resist film which covers the entirety of thetop surface 31. In this state, etching is performed for thewiring laminate portion 30 so as to remove theentire copper foil 55 and remove lower portions of themetal conductor portions 58. As a result, theopenings 37 are formed in theresin insulation layer 24, and themetal conductor portions 58 remaining in theopenings 37 become the motherboard connection terminals 45 (seeFIG. 16 ). Furthermore, at that time, within eachopening 37, eachmetal conductor portion 58 is removed through etching more efficiently at a central portion thereof, as compared with a peripheral portion thereof, whereby theconcave portion 45 b is formed on the terminalouter surface 45 a of eachmotherboard connection terminal 45. Notably, the degree of formation of theconcave portion 45 b of the terminalouter surface 45 a is adjusted by changing etching conditions such as the concentration and temperature of etchant, treatment time, etc. - Subsequently, electroless nickel plating and electroless gold plating are sequentially performed on the surfaces of the IC-
chip connection terminals 41, the surfaces of thecapacitor connection terminals 42, and the surfaces of themotherboard connection terminals 45, thereby forming the nickel-gold plating layers 46, 47, and 48 (plating step). By going through the above-mentioned steps, themultilayer wiring substrate 10 ofFIG. 1 is manufactured. - Therefore, the present embodiment can yield the following effects.
- (1) In the
multilayer wiring substrate 10 of the present embodiment, the plurality of resin insulation layers 20 to 24, which constitute thewiring laminate portion 30, are formed of the same build-up material made primarily of a hardened resin insulation material that is not photocurable. In this case, the influence of the difference in thermal expansion coefficient in thewiring laminate portion 30 can be mitigated as compared with the case where the outermost resin insulation layers 20 and 24 are formed of a different resin insulation material. As a result, warpage of themultilayer wiring substrate 10 can be restrained. Moreover, the outermost resin insulation layers 20 and 24, in which theconnection terminals chip connection terminals 41, that between thecapacitor connection terminals 42, and that between themotherboard connection terminals 45 can be narrowed, so that themultilayer wiring substrate 10 can be further integrated. - (2) In the
multilayer wiring substrate 10 of the present embodiment, the plurality ofopenings resin insulation layer 24, which is exposed to the outside and serves as an outermost layer on thetop surface 31 side of thewiring laminate portion 30, and the plurality of IC-chip connection terminals 41 and the plurality ofcapacitor connection terminals 42 are disposed to correspond to therespective openings outer surface connection terminals 41 are 42 are covered by the outermostresin insulation layer 24. That is, theconnection terminals resin insulation layer 24. Accordingly, the strength of theconnection terminals openings 37 are formed in theresin insulation layer 20, which is exposed to the outside and serves as an outermost layer on thebottom surface 32 side of thewiring laminate portion 30, and the plurality ofmotherboard connection terminals 45 are disposed to correspond to theopenings 37. Peripheral portions of the terminalouter surfaces 45 a of themotherboard connection terminals 45 are covered by the outermostresin insulation layer 20. That is, themotherboard connection terminals 45 are buried (embedded) in the outermostresin insulation layer 20. Accordingly, the strength of themotherboard connection terminals 45 can be increased sufficiently. When theconnection terminals connection terminals resin insulation layer multilayer wiring substrate 10 has an improved reliability as compared with conventional ones. - (3) In the
multilayer wiring substrate 10 of the present embodiment, each of the plurality of themotherboard connection terminals 45 has theconcave portion 45 b at the center of the terminalouter surface 45 a thereof, and the deepest portion of theconcave portion 45 b is located on the inner layer (interior) side in relation to the peripheral portion of the terminalouter surface 45 a. Since themotherboard connection terminals 45 formed in this manner increase the area of contact between solder and the terminalouter surface 45 a, the strength of solder connection can be increased. - (4) In the
multilayer wiring substrate 10 of the present embodiment, the terminalinner surface 45 c of eachmotherboard connection terminal 45 is rounded along theedge 45 d thereof. Since this rounding eliminates the concentration of stress at edge portions of themotherboard connection terminals 45, the possibility of generation of cracks in theresin insulation layer 20 decreases, and themultilayer wiring substrate 10 has an improved reliability as compared with conventional ones. - (5) In the
multilayer wiring substrate 10 of the present embodiment, on thetop surface 31 side of thewiring laminate portion 30, two types of connection terminals; i.e., the IC-chip connection terminals 41, to which an IC chip is connected, and thecapacitor connection terminals 42, to which chip capacitors are connected and which is larger in area than the IC-chip connection terminals 41, are present as the plurality of first-main-surface-side connection terminals. In this case, an IC chip can be reliably connected to the IC-chip connection terminals 41, which are small in area, and chip capacitors can be reliably connected to thecapacitor connection terminals 42, which are large in area. Moreover, since themotherboard connection terminals 45, which are larger in area than theconnection terminals top surface 31 side, are present on thebottom surface 32 side of thewiring laminate portion 30, theconnection terminals 45 can be reliably connected to a motherboard. - (6) In the present embodiment, after the
metal conductor portions 58, which are to become themotherboard connection terminals 45, are formed in a predetermined pattern, the innerconductive layers 26 of thewiring laminate portion 30 are laminated. Therefore, positional shift between themotherboard connection terminals 45 and the innerconductive layers 26 can be prevented. Moreover, since themotherboard connection terminals 45 are not required to be formed in a predetermined pattern after the base-material removing step, themultilayer wiring substrate 10 can be manufactured relatively easily. - Next, a second embodiment of the present invention will be described with reference to the drawings. The present embodiment differs from the first embodiment in the insulation-layer/conductor-portion forming step of the method of manufacturing the
multilayer wiring substrate 10. Notably, the structure of themultilayer wiring substrate 10 is identical with that of the first embodiment. - A method of manufacturing the
multilayer wiring substrate 10 of the present embodiment will now be described. - In the insulation-layer/conductor-portion forming step of the present embodiment, each
metal conductor portion 58, which is to become amotherboard connection terminal 45, has a lower layer having a small area and an upper layer having a large area, and the lower and upper layers are formed in different steps. - Specifically, as in the first embodiment, after the base-material preparation step (see
FIG. 5 ), electroless copper plating is performed so as to form a full-surface plating layer (not shown) which covers themetal laminate sheet 54 and thebase material 52. - Subsequently, a dry film for forming a plating resist film is laminated on the upper surface of the
metal laminate sheet 54, and exposure and development are carried out for the dry film. As a result, a plating resistfilm 71 havingopenings 71 a at positions corresponding to themotherboard connection terminals 45 is formed (seeFIG. 17 ). - Subsequently, copper electroplating is selectively performed with the plating resist
film 71 formed, whereby metal-conductor-portionlower layers 58 a, which constitute portions of themetal conductor portions 58, are formed on themetal laminate sheet 54. The plating resistfilm 71 is then peeled off (seeFIG. 18 ). Furthermore, in order to enhance adhesion between theresin insulation layer 20 and the metal-conductor-portionlower layers 58 a, the surfaces of the metal-conductor-portionlower layers 58 a are roughened (treatment performed by use of a CZ-series etching agent available from MEC Co., Ltd.). - After that, the sheet-like
resin insulation layer 20 is disposed on and attached onto themetal laminate sheet 54 having the metal-conductor-portionlower layers 58 a, in such a manner to cover the metal laminate sheet 54 (seeFIG. 19 ). Theresin insulation layer 20 comes into close contact with themetal laminate sheet 54 and the metal-conductor-portionlower layers 58 a, and comes into close contact with the groundresin insulation layer 51 in a region around themetal laminate sheet 54, thereby sealing in themetal laminate sheet 54. - Subsequently, the upper end surfaces of the metal-conductor-portion
lower layers 58 a are exposed from theresin insulation layer 20 by means of performing, for example, buffing (seeFIG. 20 ). After that, by use of etchant, such as a potassium permanganate solution, a desmear step is performed for removing smears on the metal-conductor-portionlower layers 58 a. - After the desmear step, electroless copper plating is performed so as to form a full-surface plating layer (not shown) which covers the
resin insulation layer 20 and the upper end surfaces of the metal-conductor-portionlower layers 58 a. Subsequently, a dry film for forming a plating resist film is laminated on the upper surface of theresin insulation layer 20, and exposure and development are carried out for the dry film. As a result, there is formed a plating resistfilm 74 havingopenings 74 a at positions corresponding to the upper end surfaces of the metal-conductor-portionlower layers 58 a, theopenings 74 a being greater in area than the upper end surfaces (seeFIG. 21 ). - Subsequently, copper electroplating is selectively performed with the plating resist
film 74 formed, whereby metal-conductor-portionupper layers 58 b, which constitute portions of themetal conductor portions 58, are formed in theopenings 74 a. The plating resistfilm 74 is then peeled off (seeFIG. 22 ). After that, etching is performed so as to remove the full-surface plating layer (not shown). Through the above-described steps, themetal conductor portions 58 composed of the metal-conductor-portionlower layers 58 a and metal-conductor-portionupper layers 58 b are formed. - After the insulation-layer/conductor-portion forming step, surface roughening treatment is performed so as to roughen the surface of each
metal conductor portion 58, and round the edge of each metal conductor portion 58 (the upper end surface of the metal-conductor-portionupper layer 58 b). Subsequently, as in the case of the first embodiment, the build-up step is performed, and the cutting step is then performed. As a result, there is obtained thewiring laminate portion 30, in which the plurality of resin insulation layers 20 to 24 and the plurality ofconductive layers 26 are marinated in multilayer arrangement (seeFIG. 23 ). - After the cutting step, on the
bottom surface 32 side of thewiring laminate portion 30, thecopper foil 55 is removed, and themetal conductor portions 58 are partially removed, whereby themotherboard connection terminals 45 having theconcave portions 45 b are formed (connection-terminal forming step). Notably, at that time, the metal-conductor-portionlower layers 58 a are completely removed, and the metal-conductor-portionupper layers 58 b are partially removed. As a result, each of theconcave portions 45 b is formed such that the deepest portion is located on the inner layer (interior) side in relation to the innermain surface 20 a of theresin insulation layer 20, and the remaining portion of the metal-conductor-portionupper layer 58 b serves as themotherboard connection terminal 45. After that, in the plating step, the plating layers 46, 47, and 48 are formed on the surfaces of the IC-chip connection terminals 41, the surfaces of thecapacitor connection terminals 42, and the surfaces of themotherboard connection terminals 45, whereby themultilayer wiring substrate 10 shown inFIG. 1 is manufactured. - Even in the case where the
multilayer wiring substrate 10 is manufactured as in the present embodiment, effects similar to those attained by the first embodiment can be attained. - Notably, the embodiments of the present invention may be modified as follows.
- In the
multilayer wiring substrate 10 according to embodiments, theconcave portion 45 b is formed on the terminalouter surface 45 a of eachmotherboard connection terminal 45 such that the deepest portion is located on the inner layer (interior) side in relation to the innermain surface 20 a of theresin insulation layer 20. However, the configuration of theconcave portion 45 b is not limited thereto. As in amultilayer wiring substrate 10A shown inFIG. 24 , theconcave portion 45 b may be formed such that the deepest portion is located outward of the innermain surface 20 a of theresin insulation layer 20. - In the
multilayer wiring substrate 10 according to embodiments, the IC-chip connection terminals 41 and the capacitor connection terminals 42 (first-main-surface-side connection terminals) are formed such that they are covered by the outermostresin insulation layer 24, and have the same height. However, the configuration of theconnection terminals multilayer wiring substrate 10B shown inFIG. 25 , thecapacitor connection terminals 42 may be formed such that they project from the outermostresin insulation layer 24. Notably, in themultilayer wiring substrate 10B, the upper and side surfaces of eachcapacitor connection terminal 42 are covered with theplating layer 47. Furthermore, as in a multilayer wiring substrate 10C shown inFIG. 26 , the IC-chip connection terminals 41 may be formed such that they project from the outermostresin insulation layer 24. In this multilayer wiring substrate 10C, the upper and side surfaces of each IC-chip connection terminal 41 are covered with theplating layer 46. In the case where the IC-chip connection terminals 41 and thecapacitor connection terminals 42 are rendered different in height as in themultilayer wiring substrates 10B and 10C shown inFIGS. 25 and 26 , components (IC chips and chip capacitors) of different types can be reliably connected to theconnection terminals - In the
multilayer wiring substrates chip connection terminals 41 and thecapacitor connection terminals 42, are provided on thetop surface 31 side (first main surface side) of thewiring laminate portion 30 as the first-main-surface-side connection terminals; and themotherboard connection terminals 45 are provided on thebottom surface 32 side (second main surface side) of thewiring laminate portion 30 as the second-main-surface-side connection terminals. However, the arrangement of the connection terminals is not limited thereto. Specifically, as in amultilayer wiring substrate 10D shown inFIG. 27 , two types of connection terminals; i.e., thecapacitor connection terminals 42 and themotherboard connection terminals 45, may be provided on thebottom surface 32 side of thewiring laminate portion 30 as the second-main-surface-side connection terminals. Notably, in thismultilayer wiring substrate 10D, only the IC-chip connection terminals 41 are provided on thetop surface 31 of thewiring laminate portion 30 as the first-main-surface-side connection terminals. - In the above-described second embodiment, in the insulation-layer/conductor-portion forming step, buffing is performed so as to expose the upper end surfaces of the metal-conductor-portion
lower layers 58 a from theresin insulation layer 20. However, the method of exposing the upper end surfaces of the metal-conductor-portionlower layers 58 a is not limited thereto. The upper end surfaces of the metal-conductor-portionlower layers 58 a may be exposed from theresin insulation layer 20 by performing surface polishing, other than buffing, or machining by use of a laser or plasma. - In the above-described embodiments, the plurality of
conductive layers 26 formed in the plurality of resin insulation layers 21 to 24 are connected with one another through the viaconductors 34 whose diameters increase in a direction from thebottom surface 32 to thetop surface 31. However, their structures are not limited thereto. The viaconductors 34 formed in the plurality of resin insulation layers 21 to 24 may have any shape so long as their diameters increase in the same direction; and the plurality ofconductive layers 26 may be connected with one anther through via conductors whose diameters increase in a direction from thetop surface 31 to thebottom surface 32. - In the above-described embodiment, each of the plating layers 46, 47, and 48, which cover the
connection terminals - Next, a technical idea that the embodiments described above implement is enumerated below.
- (1) A multilayer wiring substrate has a laminate structure in which a plurality of resin insulation layers made primarily of the same resin insulation material, and a plurality of conductive layers are laminated alternately in multilayer arrangement. A plurality of first-main-surface-side connection terminals are disposed on a first main surface of the laminate structure. A plurality of second-main-surface-side connection terminals are disposed on a second main surface of the laminate structure. The plurality of conductive layers are formed in the plurality of resin insulation layers and interconnected by means of via conductors whose diameters increase toward the first main surface or the second main surface. The plurality of resin insulation layers are formed of a hardened resin insulation material that is not photocurable. A plurality of first openings are formed in a resin insulation layer which is exposed to the outside and serves as an outermost layer on the first main surface side of the laminate structure. The first-main-surface-side connection terminals have terminal outer surfaces, and are disposed to correspond to the first openings. The peripheral portions of the terminal outer surfaces are covered by the outermost resin insulation layer. A plurality of second openings are formed in a resin insulation layer which is exposed to the outside and serves as an outermost layer on the second main surface side of the laminate structure. The second-main-surface-side connection terminals have terminal outer surfaces, and are disposed to correspond to the second openings. The peripheral portions of the terminal outer surfaces are covered by the outermost resin insulation layer. Each of the second-main-surface-side connection terminals has a concave portion at the center of the terminal outer surface, and the deepest portion of the concave portion is located on the inner layer (interior) side in relation to a peripheral portion of the terminal outer surface. At least motherboard connection terminals, which are the second-main-surface-side connection terminals, or IC-chip connection terminals and the passive-component connection terminals, which are the first-main-surface-side connection terminals, have a structure in which only the upper surface of a copper layer which mainly forms the connection terminals is covered with a plating layer formed of a material other than copper.
- (2) The multilayer wiring substrate described above in (1) is characterized in that each of the motherboard connection terminals, the IC-chip connection terminals, and the passive-component connection terminals has a structure in which only the upper surface of a copper layer which mainly forms the connection terminals is covered with a plating layer formed of a material other than copper.
- (3) The multilayer wiring substrate described above in (1) or (2) is characterized in that the terminal outer surface of each second-main-surface-side connection terminal is formed such that the deepest portion of the concave portion is located on the inner layer (interior) side in relation to the inner main surface of the outermost resin insulation layer.
-
-
- 10, 10A to 10D: multilayer wiring substrate
- 20 to 24: resin insulation layer
- 26: conductive layer
- 30: wiring laminate portion (laminate structure)
- 31: top surface (first main surface)
- 32: bottom surface (second main surface)
- 34: via conductor
- 35, 36: opening (first opening)
- 37: opening (second opening)
- 41: IC-chip connection terminal
- 41 a: terminal outer surface
- 42: capacitor connection terminal (passive-component connection terminal)
- 42 a: terminal outer surface
- 45: motherboard connection terminal
- 45 a: terminal outer surface
- 45 b: concave portion
- 45 c: terminal inner surface
- 45 d: edge
- 52: base material
- 55: copper foil (metal foil)
- 57, 74: plating resist film
- 57 a, 74 a: opening
- 58: metal conductor portion
- 58 a: metal-conductor-portion lower layer
- 58 b: metal-conductor-portion upper layer
Claims (3)
1. A method of manufacturing a multilayer wiring substrate comprising a laminate structure in which a plurality of resin insulation layers made primarily of a same resin insulation material, and a plurality of conductive layers are laminated alternately in multilayer arrangement, a plurality of first-main-surface-side connection terminals being disposed on a first main surface side of the laminate structure, a plurality of second-main-surface-side connection terminals being disposed on a second main surface side of the laminate structure, the plurality of conductive layers being formed in the plurality of resin insulation layers and interconnected by means of via conductors whose diameters increase toward the first main surface side of the laminate structure or the second main surface side of the laminate structure, the method comprising:
a base-material preparation step of preparing a base material on which a metal foil is separably laminated;
an insulation-layer/conductor-portion forming step including
a step of laminating on the metal foil a build-up material made primarily of a resin insulation material that is not photocurable, to thereby form an outermost resin insulation layer on the second main surface side of the laminate structure,
a step of forming openings in the outermost resin insulation layer, and
a step of forming a metal conductor portion in each of the openings and on a corresponding portion of the outermost resin insulation layer around the each of the openings;
a build-up step including
a step of laminating the plurality of resin insulation layers made primarily of the same resin insulation material, and the plurality of conductive layers alternately in multilayer arrangement, to thereby form the laminate structure, and
a step of forming the first-main-surface-side connection terminals on the first main surface side of the laminate structure;
a base-material removing step of, after the build-up step, removing the base material to thereby expose the metal foil; and
a connection-terminal forming step of removing the metal foil and at least a portion of each metal conductor portion, to thereby form a concave portion in each of the plurality of second-main-surface-side connection terminals.
2. The method of manufacturing a multilayer wiring substrate according to claim 1 ,
wherein the step of forming openings in the outermost resin insulating layer is performed after the step of laminating on the metal foil a build-up material, and includes a step of performing laser drilling on the outermost resin insulation layer to thereby form the openings, the openings exposing portions of the metal foil;
the method further comprising, after the step of performing laser drilling,
a step of forming a plating resist film on the outermost resin insulation layer, and
a step of forming, at positions corresponding to the openings, additional openings in the plating resist film which are greater in area than the openings;
wherein the step of forming the metal conductor portion is performed after the steps of forming a plating resist film and forming additional openings, and further includes
a step of performing electro plating so as to form the metal conductor portion in each of the openings and the additional openings, and
a step of removing the plating resist film.
3. A method of manufacturing a multilayer wiring substrate comprising a laminate structure in which a plurality of resin insulation layers made primarily of a same resin insulation material, and a plurality of conductive layers are laminated alternately in multilayer arrangement, a plurality of first-main-surface-side connection terminals being disposed on a first main surface side of the laminate structure, a plurality of second-main-surface-side connection terminals being disposed on a second main surface side of the laminate structure, the plurality of conductive layers being formed in the plurality of resin insulation layers and interconnected by means of via conductors whose diameters increase toward the first main surface side of the laminate structure or the second main surface side of the laminate structure, the method comprising:
a base-material preparation step of preparing a base material on which a metal foil is separably laminated;
an insulation-layer/conductor-portion forming step including
a step of performing copper plating so as to form metal-conductor-portion lower layers, which partially constitute the metal conductor portions, on the metal foil;
a step of laminating on the metal foil and the metal-conductor-portion lower layers a build-up material made primarily of a resin insulation material that is not photocurable, to thereby form an outermost resin insulation layer on the second main surface side of the laminate structure;
a step of exposing upper end surfaces of the metal-conductor-portion lower layers from the outermost resin insulation layer;
a step of forming a plating resist film on the outermost resin insulation layer,
a step of forming openings at positions corresponding to the upper end surfaces of the metal-conductor-portion lower layers, the openings having an area greater than an area of the upper end surfaces;
a step of performing copper plating so as to form metal-conductor-portion upper layers, which partially constitute the metal conductor portions in the openings; and
a step of removing the plating resist film;
a build-up step including
a step of laminating the plurality of resin insulation layers made primarily of the same resin insulation material, and a plurality of conductive layers alternately in the multilayer arrangement, to thereby form the laminate structure, and
a step of forming the first-main-surface-side connection terminals on the first main surface side of the laminate structure;
a base-material removing step of, after the build-up step, removing the base material to thereby expose the metal foil; and
a connection-terminal forming step of removing the metal foil and at least a portion of each metal conductor portion, to thereby form a concave portion in each of the plurality of second-main-surface-side connection terminals.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/229,144 US20140215782A1 (en) | 2010-02-16 | 2014-03-28 | Multilayer wiring substrate, and method of manufacturing the same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010031864A JP5566720B2 (en) | 2010-02-16 | 2010-02-16 | Multilayer wiring board and manufacturing method thereof |
JP2010-31864 | 2010-02-16 | ||
US13/028,545 US8772643B2 (en) | 2010-02-16 | 2011-02-16 | Multilayer wiring substrate, and method of manufacturing the same |
US14/229,144 US20140215782A1 (en) | 2010-02-16 | 2014-03-28 | Multilayer wiring substrate, and method of manufacturing the same |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/028,545 Division US8772643B2 (en) | 2010-02-16 | 2011-02-16 | Multilayer wiring substrate, and method of manufacturing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
US20140215782A1 true US20140215782A1 (en) | 2014-08-07 |
Family
ID=44368848
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/028,545 Expired - Fee Related US8772643B2 (en) | 2010-02-16 | 2011-02-16 | Multilayer wiring substrate, and method of manufacturing the same |
US14/229,144 Abandoned US20140215782A1 (en) | 2010-02-16 | 2014-03-28 | Multilayer wiring substrate, and method of manufacturing the same |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/028,545 Expired - Fee Related US8772643B2 (en) | 2010-02-16 | 2011-02-16 | Multilayer wiring substrate, and method of manufacturing the same |
Country Status (5)
Country | Link |
---|---|
US (2) | US8772643B2 (en) |
JP (1) | JP5566720B2 (en) |
KR (1) | KR101329896B1 (en) |
CN (1) | CN102164451B (en) |
TW (1) | TWI451825B (en) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8581388B2 (en) * | 2009-12-28 | 2013-11-12 | Ngk Spark Plug Co., Ltd | Multilayered wiring substrate |
TWI628990B (en) * | 2011-10-11 | 2018-07-01 | 日商日立化成股份有限公司 | Structure body having conductor circuit and manufacturing method thereof |
JP5964658B2 (en) * | 2012-05-29 | 2016-08-03 | 京セラ株式会社 | Thin film wiring board |
JP6266907B2 (en) * | 2013-07-03 | 2018-01-24 | 新光電気工業株式会社 | Wiring board and method of manufacturing wiring board |
JP6223909B2 (en) * | 2013-07-11 | 2017-11-01 | 新光電気工業株式会社 | Wiring board and manufacturing method thereof |
US9275967B2 (en) * | 2014-01-06 | 2016-03-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Protrusion bump pads for bond-on-trace processing |
US9508637B2 (en) | 2014-01-06 | 2016-11-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Protrusion bump pads for bond-on-trace processing |
US9418928B2 (en) | 2014-01-06 | 2016-08-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Protrusion bump pads for bond-on-trace processing |
JP6123915B2 (en) * | 2014-02-07 | 2017-05-10 | 株式会社村田製作所 | Resin multilayer board |
JP6298722B2 (en) * | 2014-06-10 | 2018-03-20 | 新光電気工業株式会社 | WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING METHOD |
JP6324876B2 (en) | 2014-07-16 | 2018-05-16 | 新光電気工業株式会社 | WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING METHOD |
JP2017045820A (en) * | 2015-08-26 | 2017-03-02 | 京セラ株式会社 | Aggregate substrate |
US10685922B2 (en) | 2017-05-09 | 2020-06-16 | Unimicron Technology Corp. | Package structure with structure reinforcing element and manufacturing method thereof |
US10950535B2 (en) | 2017-05-09 | 2021-03-16 | Unimicron Technology Corp. | Package structure and method of manufacturing the same |
TWI685284B (en) * | 2018-12-11 | 2020-02-11 | 欣興電子股份有限公司 | Package structure and manufacturing method thereof |
US10714448B2 (en) * | 2017-05-09 | 2020-07-14 | Unimicron Technology Corp. | Chip module with porous bonding layer and stacked structure with porous bonding layer |
US10178755B2 (en) | 2017-05-09 | 2019-01-08 | Unimicron Technology Corp. | Circuit board stacked structure and method for forming the same |
US11404310B2 (en) * | 2018-05-01 | 2022-08-02 | Hutchinson Technology Incorporated | Gold plating on metal layer for backside connection access |
JP6701261B2 (en) * | 2018-05-08 | 2020-05-27 | 矢崎総業株式会社 | Case, electric junction box and wire harness |
JP7289620B2 (en) * | 2018-09-18 | 2023-06-12 | 新光電気工業株式会社 | Wiring substrates, laminated wiring substrates, semiconductor devices |
JP7198154B2 (en) * | 2019-05-22 | 2022-12-28 | 新光電気工業株式会社 | Wiring board and method for manufacturing wiring board |
TWI720847B (en) * | 2020-03-17 | 2021-03-01 | 欣興電子股份有限公司 | Chip package structure and manufacturing method thereof |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6674017B1 (en) * | 1998-12-24 | 2004-01-06 | Ngk Spark Plug Co., Ltd. | Multilayer-wiring substrate and method for fabricating same |
JP4899265B2 (en) | 2000-11-16 | 2012-03-21 | 凸版印刷株式会社 | MULTILAYER WIRING BOARD, MANUFACTURING METHOD THEREOF, AND LASER DRILL DEVICE |
CN1330225C (en) * | 2001-03-14 | 2007-08-01 | Ibiden股份有限公司 | Multilayer printed circuit board |
JP2002290022A (en) * | 2001-03-27 | 2002-10-04 | Kyocera Corp | Wiring board, its manufacturing method, and electronic device |
EP1915041A1 (en) * | 2001-09-28 | 2008-04-23 | Ibiden Co., Ltd. | Printed wiring board and printed wiring board manufacturing method |
JP2003133711A (en) * | 2001-10-23 | 2003-05-09 | Matsushita Electric Ind Co Ltd | Printed-wiring board and manufacturing method thereof, and packaging method of electronic component |
US8076782B2 (en) * | 2002-04-01 | 2011-12-13 | Ibiden Co., Ltd. | Substrate for mounting IC chip |
JP2004111544A (en) | 2002-09-17 | 2004-04-08 | Ngk Spark Plug Co Ltd | Multilayer wiring board |
JP3983146B2 (en) | 2002-09-17 | 2007-09-26 | Necエレクトロニクス株式会社 | Manufacturing method of multilayer wiring board |
JP3811680B2 (en) | 2003-01-29 | 2006-08-23 | 富士通株式会社 | Wiring board manufacturing method |
US7070207B2 (en) * | 2003-04-22 | 2006-07-04 | Ibiden Co., Ltd. | Substrate for mounting IC chip, multilayerd printed circuit board, and device for optical communication |
JPWO2005052666A1 (en) * | 2003-11-27 | 2008-03-06 | イビデン株式会社 | IC chip mounting substrate, motherboard substrate, optical communication device, IC chip mounting substrate manufacturing method, and motherboard substrate manufacturing method |
JP4108643B2 (en) * | 2004-05-12 | 2008-06-25 | 日本電気株式会社 | Wiring board and semiconductor package using the same |
JP2006086219A (en) * | 2004-09-14 | 2006-03-30 | Nitto Denko Corp | Wiring circuit board |
CN1873935B (en) * | 2005-05-31 | 2010-06-16 | 新光电气工业株式会社 | Method of fabricating wiring board and method of fabricating semiconductor device |
JP2007109902A (en) * | 2005-10-14 | 2007-04-26 | Ibiden Co Ltd | Method for manufacturing multilayer printed wiring board, and photosensitive dry film used for same |
JP4334005B2 (en) | 2005-12-07 | 2009-09-16 | 新光電気工業株式会社 | Wiring board manufacturing method and electronic component mounting structure manufacturing method |
JP5324051B2 (en) * | 2007-03-29 | 2013-10-23 | 新光電気工業株式会社 | Wiring substrate manufacturing method, semiconductor device manufacturing method, and wiring substrate |
JP4881211B2 (en) * | 2007-04-13 | 2012-02-22 | 新光電気工業株式会社 | Wiring substrate manufacturing method, semiconductor device manufacturing method, and wiring substrate |
JP5172404B2 (en) * | 2008-03-13 | 2013-03-27 | 日本特殊陶業株式会社 | Multilayer wiring board manufacturing method and multilayer wiring board intermediate product |
US8263878B2 (en) * | 2008-03-25 | 2012-09-11 | Ibiden Co., Ltd. | Printed wiring board |
JP5179920B2 (en) | 2008-03-28 | 2013-04-10 | 日本特殊陶業株式会社 | Multilayer wiring board |
TWI475932B (en) * | 2008-09-29 | 2015-03-01 | Ngk Spark Plug Co | Wiring substrate with reinforcement |
JP5289996B2 (en) * | 2009-02-16 | 2013-09-11 | 日本特殊陶業株式会社 | Reinforced wiring board |
JP5350830B2 (en) * | 2009-02-16 | 2013-11-27 | 日本特殊陶業株式会社 | Multilayer wiring board and manufacturing method thereof |
US8581388B2 (en) * | 2009-12-28 | 2013-11-12 | Ngk Spark Plug Co., Ltd | Multilayered wiring substrate |
JP2011138868A (en) * | 2009-12-28 | 2011-07-14 | Ngk Spark Plug Co Ltd | Multilayer wiring substrate |
JP2011138869A (en) * | 2009-12-28 | 2011-07-14 | Ngk Spark Plug Co Ltd | Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate |
JP5436259B2 (en) * | 2010-02-16 | 2014-03-05 | 日本特殊陶業株式会社 | Multilayer wiring board manufacturing method and multilayer wiring board |
JP5623308B2 (en) * | 2010-02-26 | 2014-11-12 | 日本特殊陶業株式会社 | Multilayer wiring board and manufacturing method thereof |
JP5638269B2 (en) * | 2010-03-26 | 2014-12-10 | 日本特殊陶業株式会社 | Multilayer wiring board |
-
2010
- 2010-02-16 JP JP2010031864A patent/JP5566720B2/en not_active Expired - Fee Related
-
2011
- 2011-02-10 KR KR1020110011913A patent/KR101329896B1/en not_active IP Right Cessation
- 2011-02-15 TW TW100104842A patent/TWI451825B/en not_active IP Right Cessation
- 2011-02-16 US US13/028,545 patent/US8772643B2/en not_active Expired - Fee Related
- 2011-02-16 CN CN201110040311.7A patent/CN102164451B/en not_active Expired - Fee Related
-
2014
- 2014-03-28 US US14/229,144 patent/US20140215782A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
KR101329896B1 (en) | 2013-11-15 |
US8772643B2 (en) | 2014-07-08 |
JP5566720B2 (en) | 2014-08-06 |
TWI451825B (en) | 2014-09-01 |
CN102164451A (en) | 2011-08-24 |
KR20110095146A (en) | 2011-08-24 |
TW201206293A (en) | 2012-02-01 |
CN102164451B (en) | 2014-07-30 |
US20110198114A1 (en) | 2011-08-18 |
JP2011171397A (en) | 2011-09-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8772643B2 (en) | Multilayer wiring substrate, and method of manufacturing the same | |
US8707554B2 (en) | Method of manufacturing multilayer wiring substrate | |
US8859077B2 (en) | Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate | |
US8847082B2 (en) | Multilayer wiring substrate | |
US8093503B2 (en) | Multilayer wiring board | |
US8389871B2 (en) | Multilayered wiring board and method of manufacturing the same | |
US20110155438A1 (en) | Multilayer Wiring Substrate | |
US8580066B2 (en) | Method for manufacturing multilayer wiring substrate | |
JP5504149B2 (en) | Multilayer wiring board | |
US8153909B2 (en) | Multilayer wiring board and method of manufacturing the same | |
US8535546B2 (en) | Method of manufacturing multilayer wiring substrate | |
US20120097319A1 (en) | Method of manufacturing multilayer wiring substrate | |
US8450622B2 (en) | Multilayer wiring substrate and method of manufacturing the same | |
US8658905B2 (en) | Multilayer wiring substrate | |
JP5269757B2 (en) | Multilayer wiring board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: NGK SPARK PLUG CO., LTD., JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MAEDA, SHINNOSUKE;SUZUKI, TETSUO;HIRANO, SATOSHI;REEL/FRAME:032553/0939 Effective date: 20110209 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |