US20130153030A1 - Encapsulated flexible electronic device, and corresponding manufacturing method - Google Patents
Encapsulated flexible electronic device, and corresponding manufacturing method Download PDFInfo
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- US20130153030A1 US20130153030A1 US13/713,576 US201213713576A US2013153030A1 US 20130153030 A1 US20130153030 A1 US 20130153030A1 US 201213713576 A US201213713576 A US 201213713576A US 2013153030 A1 US2013153030 A1 US 2013153030A1
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- electronic device
- flexible electronic
- dry photoresist
- photoresist film
- cover sheet
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Images
Classifications
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- H—ELECTRICITY
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present disclosure relates to an encapsulated flexible electronic device.
- the disclosure also relates to a method for manufacturing such an encapsulated flexible electronic device.
- the disclosure refers, in particular, but not exclusively, to an encapsulated flexible electronic device, such as an encapsulated flexible photovoltaic cell or a touch screen to be used in flexible smart systems, which comprises at least two cover sheets obtained by a dry photoresist film, and the following description is made with reference to this field of application just for explanation convenience.
- the cells should be highly efficient, since only a small area may be available for capturing light; the cells should be lightweight and they may need to be flexible.
- flexible photovoltaic modules have to be protected, usually by a flexible protective packaging formed by materials which are very challenging in terms of transparency, wearability and permeability to gases.
- These materials also should have good thermal and thermo-mechanical properties, UV resistance, excellent dimensional stability, insulating properties, and good adhesion to lamination materials, and provide a durable mechanical barrier to the environment.
- the materials of bonding adhesives and protective coatings are very important for the long term reliability of the photovoltaic cells, modules, panels and complex installed systems realized by them, such a long term reliability also depending from the application and use conditions.
- Standard photovoltaic cells are typically used for outdoor applications, while flexible photovoltaic cells are typically indicated for indoor purposes, such as for clocks, indoor sensor networks, mobile phones, wireless mouse, etc..
- indoor illumination has usually a lower level than outdoor illumination.
- the average lighting varies from 300 lux to 750 lux, so that energy harvesting and parameters, such as water absorption, may not be as harsh as for outdoor applications for which the lighting should be usually well over 750 lux.
- a flexible device such as a flexible photovoltaic cell
- a foil-based system comprises a plurality of different foil subsystems with a specific functionality and standardized interfaces between these subsystems.
- a smart flexible system 1 is shown in FIG. 1 and comprises three main sub-systems: an energy subsystem 2 providing autonomous energy to all devices of the system 1 ; a sensor subsystem 3 ; and a communication subsystem 4 connected to each other.
- the system 1 may be autonomous and able to communicate by radio-frequency to an external RF reader in order to transfer, for instance, some measured data to a computer.
- the system 1 may be an indoor sensing system needing to harvest energy from light as well as to interact with the ambient to activate the sensing elements. Such a system 1 should be thus able to transmit the results to an external reader connected to a personal computer.
- the energy subsystem 2 comprises a superior flexible electronic device 5 , such as a photovoltaic foil, a battery foil 6 and a first interconnection foil 7 interposed between the photovoltaic foil 5 and the battery foil 6 .
- the photovoltaic foil 5 comprises a photovoltaic panel 8 , square holes 9 for sensors, a Single Wire Multi-Switch
- SWIM microcontroller programming and debugging
- a plurality of passive components 11 a battery charger integrated circuit 12 , a power management integrated circuit 13 and a plurality of holes 14 A for physical inter-connections with the interconnection foil 7 , in turn provided with a plurality of holes 14 B aligned with the holes 14 A of the photovoltaic foil 5 as well as with a plurality of holes 16 B of the battery foil 6 , in turn aligned with the holes 14 A and 14 B of the photovoltaic and interconnection foils, 5 and 7 .
- the battery foil 6 is in turn provided with a battery 15 .
- a second interconnection foil 17 comprising a plurality of holes 18 A is interposed, in contact with the battery foil 6 , between the energy subsystem 2 and the sensor subsystem 3 .
- the sensor subsystem 3 comprises at least a sensors foil 19 , in turn including for instance sensors 20 , a microcontroller 21 and a plurality of holes 18 B, aligned with the holes 18 A of the second interconnection foil 17 .
- the sensor subsystem 3 also comprises a third interconnection foil 23 interposed between the sensors foil 19 and the communication subsystem 4 .
- the communication subsystem 4 in turn comprises a communication foil 24 , which includes for instance an antenna 25 , RF transistors 26 and passive components 27 . Also the third interconnection foil 23 and the communication foil 24 are provided with respective pluralities of holes, 22 A and 22 B, aligned with each other and suitable for the physical connection between these foils.
- the photovoltaic foil 5 acts as an encapsulation foils and protects and passivates the photovoltaic panel 8 , allowing, in the same time, its interconnection to the other subsystems 3 and 4 .
- photovoltaic modules usually contain a plurality of layers from the light facing side to the back.
- FIG. 3 schematically shows a structure for a photovoltaic module or cell 100 , for instance for outdoor applications.
- the photovoltaic cell 100 comprises, in addition to connectors or cables CC, a stack of a back sheet layer 101 , usually made in aluminum, an encapsulation layer 102 , a metal back contact layer 103 , a semiconductor layer 104 , a transparent front contact layer 105 and a front sheet layer 106 .
- the layers which most largely influence the functioning, longevity and efficiency of photovoltaic modules are represented by the back sheet layer 101 , the encapsulation layer 102 and the front sheet layer 106 .
- the material of the front sheet layer 106 usually is glass or a transparent plastic, especially in thin-film modules.
- the encapsulation layer 102 should ensure that the structure of the photovoltaic cell is water-proof and insulated from heat.
- the back sheet layer 101 should confer protection to the photovoltaic cell 100 on the back side of the module as a whole and it may be glass, aluminum or plastic.
- the front sheet layer 106 is formed by transparent polymers and the back sheet layer 101 should be made by flexible polymer material.
- some candidate materials for flexible devices are fluoro-polymers, polyester, polyimide, and polycarbonate films, typically supplied in roll form just to make easier the roll to roll processing.
- One embodiment of the present disclosure is an encapsulated flexible electronic device able to be interconnected inside a smart system, and a related forming method, having functional and structural characteristics allowing to overcome the limits which still affect the structures and methods previously disclosed with reference to the prior art.
- One embodiment of the present disclosure uses a negative tone, transparent and permanent dry photoresist film as a patternable protective coating and cover sheet, namely both a front and a back sheet, in the manufacturing of a flexible electronic device, such as a photovoltaic cell. More in detail, the negative tone, transparent and permanent dry photoresist film is in the form of a thin foil protected by polyethylene terephthalate (PET) on both sides, having a thickness comprised between 15 ⁇ m and few hundred microns.
- PET polyethylene terephthalate
- One embodiment of the present disclosure is an encapsulated flexible electronic device that includes a flexible electronic device protected by a protective coating layer, a first cover sheet and a second cover sheet made of a patterned and developed dry photoresist film.
- the disclosure comprises the following supplemental and optional features, taken alone or in combination when needed.
- the dry photoresist film may be of the negative, transparent and permanent solvent type.
- the protective coating layer, the first cover sheet and the second cover sheet may have a modulable thickness.
- the flexible electronic device may be a flexible photovoltaic cell.
- the flexible photovoltaic cell may comprise a flexible plastic foil, a back electrode, an amorphous silicon layer and a top electrode.
- the flexible electronic device may be a touch screen.
- the protective coating layer may be able to define electrical contacts and subsequent metallization of the flexible electronic device.
- first and the second cover sheets may be respectively back and front sheets of the flexible electronic device able to fully protect it from mechanical stress.
- the thicknesses of the protective coating layer, the first cover sheet and the second cover sheet may be between 15 ⁇ m and 50 ⁇ m.
- One embodiment of the present disclosure is a method of manufacturing an encapsulated flexible electronic device comprising a flexible electronic device, the method comprising the steps of:
- the step of providing the first dry photoresist film may comprise a step of laminating the first dry photoresist film on the first surface of the flexible electronic device.
- the step of patterning the first dry photoresist film may comprise a step of exposing the first dry photoresist film covered by a photolithographic mask shaped in a negative form with respect to the encapsulated flexible electronic device to be obtained.
- the step of providing the second dry photoresist film may comprise a step of laminating the second dry photoresist film on the second surface of the flexible electronic device being opposite with respect to the first surface and the step of providing the third dry photoresist film may comprise a step of laminating the third dry photoresist film on the surface of the protective coating layer being not in contact with the flexible electronic device.
- the steps of laminating the second and third dry photoresist films may respectively comprise multiple steps of laminating dry photoresist films with different thickness.
- the steps of patterning the second and third dry photoresist films may respectively comprise a step of exposing the second and third dry photoresist films covered by a mask, being shaped in a negative form with respect to the encapsulated flexible electronic device to be obtained.
- the step of curing the first and second cover sheets may be performed at a temperature of 150-200 ° C. for 30-60 min.
- FIG. 1 schematically shows a block diagram of a smart flexible system, according to the prior art
- FIG. 2 schematically shows a three-dimensional view of a smart flexible system, according to the prior art
- FIG. 3 schematically shows a three-dimensional view of a photovoltaic cell, according to the prior art
- FIG. 4 shows a cross section of a photovoltaic cell structure, being obtained according to the disclosure
- FIGS. 5A-5F schematically show different steps of a method for manufacturing the photovoltaic cell structure of FIG. 4 , according to the present disclosure.
- FIG. 4 a cross section of an encapsulated photovoltaic cell structure 200 is shown.
- the encapsulated photovoltaic cell structure 200 comprises a flexible photovoltaic cell 201 , in turn including a flexible plastic foil 202 , a back electrode 203 , an amorphous silicon layer 204 and a top electrode 205 .
- the encapsulated photovoltaic cell structure 200 comprises a first dry resist cover sheet 206 , formed under the flexible plastic foil 202 , a dry resist coating layer 207 , formed on the top electrode 205 and a second dry resist cover sheet 208 formed on the dry resist coating layer 207 .
- the first and second dry resist cover sheets 206 and 208 are obtained by a dry photoresist film, duly patterned in a negative form with respect to the encapsulated photovoltaic cell structure 200 to be obtained and developed.
- the dry photoresist film is thus of the permanent type.
- the dry photoresist film is of the permanent and transparent type.
- the encapsulated photovoltaic cell structure 200 having the structure shown in FIG. 4 may be substituted by a flexible electronic device, thus obtaining an encapsulated flexible electronic device.
- the flexible electronic device 201 can be a touch screen.
- the flexible plastic foil 202 can be a polyimide layer.
- FIG. 5A shows a flexible photovoltaic cell 201 on which a first dry photoresist film 207 ′ is laminated, in particular on a first surface 201 A thereof.
- the first dry photoresist film 207 ′ is covered with a photolithographic mask 209 , for a subsequent exposure to UV light of the first dry photoresist film 207 ′.
- the photolithographic mask 209 is shaped in a negative form with respect to the encapsulated flexible electronic device 200 to be obtained.
- FIG. 5C shows a structure obtained after the first dry photoresist film 207 ′ has been duly patterned in a negative form with respect to the final encapsulated photovoltaic cell structure 200 to be obtained and developed, obtaining a protective coating layer 207 on the flexible photovoltaic cell 201 .
- the protective coating layer 207 is a permanent and transparent type dry photoresist film.
- FIG. 5C also shows contacts 210 opened on the protective coating layer 207 .
- FIG. 5D shows the flexible photovoltaic cell 201 , under which a second dry photoresist film 206 ′ is laminated, in particular on a second surface 201 B thereof, having the protective coating layer 207 thereon and comprising the contacts 210 duly metalized.
- a third dry photoresist film 208 ′ is also laminated on the protective coating layer 207 , in particular on a flat surface 207 A thereof being not in contact with the flexible photovoltaic cell 201 .
- FIG. 5E shows the encapsulated photovoltaic cell structure 200 comprising the flexible photovoltaic cell 201 , the protective coating layer 207 as well as first and second cover sheets 206 and 208 , which have been obtained by said second and third dry photoresist films, 206 ′ and 208 ′, respectively, which have been duly patterned in a negative form with respect to the final encapsulated photovoltaic cell structure 200 to be obtained and developed.
- the cover sheets 206 and 208 are permanent and transparent type dry photoresist films.
- the protective coating layer 207 is able to define electrical contacts and subsequent metallization of the flexible electronic device 201 .
- the first and second cover sheets 206 and 208 are respectively the back and front sheets able to fully protect the flexible photovoltaic cell 201 from mechanical stress to which the final encapsulated photovoltaic cell structure 200 is subject during the manufacturing process, particularly to the dry resist lamination process.
- the final encapsulated photovoltaic cell structure 200 comprises the flexible photovoltaic cell 201 provided with the protective coating layer 207 comprising the contacts 210 and encapsulated between the first cover sheet 206 and the second cover sheet 208 , both of them cured at a fixed temperature in the range between 150 and 200° C.
- the thickness of the protective coating layer 207 is able to be modulated.
- the protective coating layer 207 has a thickness between 15 ⁇ m and 50 ⁇ m, preferably 30 ⁇ m.
- the thickness of the first cover sheet 206 is able to be modulated.
- the first cover sheet 206 has a thickness between 15 ⁇ m and 50 ⁇ m, preferably 30 ⁇ m.
- the thickness of the second cover sheet 208 is able to be modulated.
- the second cover sheet 208 has a thickness between 15 ⁇ m and 50 ⁇ m, preferably 30 ⁇ m.
- the disclosure relates also to a method for manufacturing an encapsulated flexible electronic device, such as an encapsulated photovoltaic cell structure 200 , the method comprising the steps of:
- the method may also comprise, after the step of developing the first dry photoresist film 207 ′, a step of opening contacts 210 inside the protective coating layer 207 and metalizing the protective coating layer 207 .
- the method comprises the formation of a first dry photoresist film as a coating layer on a photovoltaic cell, the first dry photoresist film being duly patterned and developed, and the formation of further second and third dry photoresist films to realize respective cover sheets encapsulating the photovoltaic cell duly coated, the cover sheets being duly exposed and cured.
- the step of providing the first dry photoresist film 207 ′ comprises a step of laminating the first dry photoresist film 207 ′ on the first surface 201 A of the photovoltaic cell 201 .
- the patterning step may comprise exposing the first dry photoresist film 207 ′ covered by a photolithographic mask 209 , being shaped in a negative form with respect to encapsulated photovoltaic cell structure 200 to be obtained.
- the step of providing the second and third dry photoresist films 206 ′ and 208 ′ comprises a step of laminating the second dry photoresist film 206 ′ on the second surface 201 B of the photovoltaic cell 201 and the third dry photoresist film 208 ′ on the surface 207 A of the protective coating layer 207 .
- the laminating step may comprise multiple steps of laminating dry photoresist films having different thickness.
- the step of patterning the second and third dry photoresist films 206 ′ and 208 ′ may comprise exposing them covered by a mask, being shaped in a negative form with respect to encapsulated photovoltaic cell structure 200 to be obtained, so as to realize the first and second cover sheets 206 and 208 .
- the curing step may comprise curing the cover sheets 206 and 208 at 150-200 ° C. for 30-60 min.
- Another advantage relates to the possibility to roll to roll process large area flexible modules.
- the stress induced by the process flow on the encapsulated flexible electronic device so realized is very low and, in particular, the stress induced by the dry photoresist lamination can be properly modulated using multiple lamination steps of dry photoresist layers, namely a single or multilayer lamination of these dry photoresist layers with different thickness.
- the whole process is performed in air without steps needing vacuum coating.
- Another advantage relates to front and back sheets that can be laminated at the same time, using the same equipment and process flow, the front sheet having also a very good adhesion to the coating layer.
- the dry photoresist films curing thermal process is compatible with main flexible substrates, such as polyimide, polyethylene terephthalate (PET), polyethylene naphthalate (PEN) and others typically used for photovoltaic (PV) flex cells.
- main flexible substrates such as polyimide, polyethylene terephthalate (PET), polyethylene naphthalate (PEN) and others typically used for photovoltaic (PV) flex cells.
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US14/984,910 US10910510B2 (en) | 2011-12-16 | 2015-12-30 | Encapsulated flexible electronic device, and corresponding manufacturing method |
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ITMI2011A002296 | 2011-12-16 | ||
IT002296A ITMI20112296A1 (it) | 2011-12-16 | 2011-12-16 | Dispositivo elettronico flessibile incapsulato e relativo metodo di fabbricazione |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140211102A1 (en) * | 2013-01-29 | 2014-07-31 | Samsung Display Co., Ltd. | Flexible touch screen panel |
CN109313697A (zh) * | 2017-02-23 | 2019-02-05 | 深圳市汇顶科技股份有限公司 | 传感装置 |
US10418237B2 (en) * | 2016-11-23 | 2019-09-17 | United States Of America As Represented By The Secretary Of The Air Force | Amorphous boron nitride dielectric |
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CN108767036A (zh) * | 2018-06-01 | 2018-11-06 | 汉能新材料科技有限公司 | 一种太阳能电池板 |
CN110047959B (zh) * | 2019-04-26 | 2021-08-06 | 圣晖莱南京能源科技有限公司 | 柔性太阳能薄膜电池的封装结构、封装工装及封装方法 |
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CN109313697A (zh) * | 2017-02-23 | 2019-02-05 | 深圳市汇顶科技股份有限公司 | 传感装置 |
Also Published As
Publication number | Publication date |
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ITMI20112296A1 (it) | 2013-06-17 |
US10910510B2 (en) | 2021-02-02 |
US20160111588A1 (en) | 2016-04-21 |
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