US20120312509A1 - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- US20120312509A1 US20120312509A1 US13/189,589 US201113189589A US2012312509A1 US 20120312509 A1 US20120312509 A1 US 20120312509A1 US 201113189589 A US201113189589 A US 201113189589A US 2012312509 A1 US2012312509 A1 US 2012312509A1
- Authority
- US
- United States
- Prior art keywords
- base
- heat dissipation
- dissipation device
- section
- fin set
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present disclosure relates to heat dissipation devices, and more particularly to a heat dissipation device incorporating heat pipes.
- Electronic components such as central processing units (CPUs) and integrated circuit (IC) packages, comprise numerous circuits operating at high speed and generating substantial heat. Under most circumstances, it is necessary to cool the electronic components in order to maintain safe operating conditions and assure that the electronic components function properly and reliably.
- a finned metal heat dissipation device is attached to an outer surface of the electronic component to remove the heat therefrom. The heat absorbed by the heat dissipation device is then dissipated to ambient air.
- FIG. 1 is an assembled, isometric view of a heat dissipation device in accordance with an exemplary embodiment of the disclosure.
- FIG. 2 is an exploded view of the heat dissipation device of FIG. 1 .
- FIG. 3 is an inverted, exploded view of the heat dissipation device of FIG. 1 .
- FIG. 4 is a front plan view of the heat dissipation device of FIG. 1 .
- a heat dissipation device in accordance with an exemplary embodiment of the disclosure is used for dissipating heat generated by an electronic component (not shown) mounted on a printed circuit board (not shown).
- the heat dissipation device comprises a first base 10 for thermally contacting the electronic component, a second base 20 disposed on the first base 10 , a fin set 30 disposed on the second base 20 , and a plurality of heat pipes 40 thermally connecting the first base 10 and the second base 20 with the fin set 30 .
- the first base 10 is made of metal with good heat conductivity, such as aluminum, copper, or alloys thereof.
- the first base 10 has a rectangular profile.
- Two elongated first receiving grooves 12 are defined in a top face of the first base 10 .
- the two first receiving grooves 12 are spaced from and parallel to each other.
- Two first recessed portions 14 are defined in the top face of the first base 10 .
- the two first recessed portions 14 are located at two opposite lateral sides of the first base 10 .
- the two first recessed portions 14 are correspondingly located adjacent to ends of the two first receiving grooves 12 .
- the first receiving grooves 12 extend along a lengthwise direction of the first base 10 .
- the second base 20 is made of metal with good heat conductivity, such as aluminum, copper, or alloys thereof.
- the second base 20 has a rectangular profile.
- Two cutouts 22 are defined at two opposite lateral sides of the second base 20 , respectively.
- the cutouts 22 are located corresponding to the recessed portions 14 of the first base 10 .
- the cutouts 22 correspondingly face the recessed portions 14 .
- a bottom face of the second base 20 thermally contacts the top face of the first base 10 .
- An area of the second base 20 is larger than that of the first base 10 .
- a width of the second base 20 is equal to a length of the first base 10 .
- the fin set 30 comprises a plurality of parallel fins 32 .
- a passage (not labeled) is defined between every two adjacent fins 32 to allow airflow therethrough.
- Each of the fins 32 comprises an upright sheet body, and a pair of flanges bent horizontally from a top of the sheet body and engaging the sheet body of an adjacent fin 32 .
- a bottom face of the fin set 30 thermally contacts a top face of the second base 20 .
- Two elongated second receiving grooves 34 are defined in the bottom face of the fin set 30 .
- the two second receiving grooves 34 are spaced from and parallel to each other.
- Two second recessed portions 36 are defined in the bottom face of the fin set 30 .
- the two second recessed portions 36 are located at two opposite lateral sides of the fin set 30 .
- the two second recessed portions 36 are correspondingly located adjacent to ends of the two second receiving grooves 34 .
- the two second recessed portions 36 are correspondingly communicated with the two cutouts 22 of the second base 20 and the two first recessed portions 14 of the first base 10 .
- Each second recessed portion 36 cooperates with a corresponding cutout 22 and a corresponding first recessed portion 14 to form a receiving space.
- Each of the heat pipes 40 comprises an evaporating section 44 , a condensing section 46 spaced from the evaporating section 44 , and a connecting section 42 interconnecting the evaporating section 44 and the condensing section 46 .
- Each heat pipe 40 is U-shaped.
- the evaporating section 44 is parallel to the condensing section 46 of each heat pipe 40 .
- Both the evaporating section 44 and the condensing section 46 of each heat pipe 40 have a semicircular transverse cross section.
- the evaporating section 44 of each heat pipe 40 is received in a corresponding first receiving groove 12 of the first base 10 .
- the evaporating sections 44 of the heat pipes 40 are sandwiched between the first base 10 and the second base 20 . Top faces of the evaporating sections 44 of the heat pipes 40 are coplanar with the top face of the first base 10 .
- the condensing section 46 of each heat pipe 40 is received in a corresponding second receiving groove 34 of the fin set 30 .
- the condensing sections 46 of the heat pipes 40 are sandwiched between the second base 20 and the fin set 30 .
- Bottom faces of the condensing sections 46 of the heat pipes 40 are coplanar with the bottom face of the fin set 30 .
- the condensing sections 46 of the heat pipes 40 are spaced from the top face of the first base 10 .
- the connecting section 42 of each heat pipe 40 is accommodated in a corresponding receiving space.
- heat absorbed by the first base 10 is transferred to the second base 20 , then distributed to the fin set 30 , and finally dissipated into the ambient.
- a thermal conductive capability between the first base 10 and the fin set 30 is enhanced via the heat pipes 40 , whereby heat accumulated in the first base 10 is more quickly conducted and the heat dissipation efficiency of the heat dissipation device is thus greatly improved.
- the electronic component mounted on the printed circuit board there are typically other electronic components mounted on the printed circuit board nearby.
- the area of the first base 10 is limited to a certain extent, and is therefore able to avoiding interfering with certain other electronic components in certain applications.
- the area of the second base 20 overlapping on the first base 10 can be suitably configured for a particular application, and the size of the fin set 30 placed on the second base 20 can be suitably configured for the particular application, with no need to consider reconfiguring the other electronic components mounted on the printed circuit board.
- the first base 10 can be combined with the second base 20 to form a single unitary (integrated) piece, i.e, a base module 100 (see FIG. 4 ).
- a base module 100 see FIG. 4 .
- the evaporating sections 44 of the heat pipes 40 are inserted into the base module 100 .
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110153871.3 | 2011-06-09 | ||
CN2011101538713A CN102819302A (zh) | 2011-06-09 | 2011-06-09 | 散热装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20120312509A1 true US20120312509A1 (en) | 2012-12-13 |
Family
ID=47292145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/189,589 Abandoned US20120312509A1 (en) | 2011-06-09 | 2011-07-25 | Heat dissipation device |
Country Status (2)
Country | Link |
---|---|
US (1) | US20120312509A1 (zh) |
CN (1) | CN102819302A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104850197A (zh) * | 2015-04-28 | 2015-08-19 | 天津商业大学 | 带有复合底板的重力热管式芯片散热器 |
US20180066894A1 (en) * | 2016-09-02 | 2018-03-08 | Acer Incorporated | Lattice Boiler Evaporator |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108398993B (zh) * | 2018-04-28 | 2023-12-05 | 中科寒武纪科技股份有限公司 | 散热装置 |
CN219181929U (zh) * | 2022-11-11 | 2023-06-13 | 蔚来汽车科技(安徽)有限公司 | 车载热管散热控制器和车辆 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070215321A1 (en) * | 2006-03-16 | 2007-09-20 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20080121371A1 (en) * | 2006-11-29 | 2008-05-29 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20080257527A1 (en) * | 2007-04-18 | 2008-10-23 | Foxconn Technology Co., Ltd. | Heat sink assembly having a fin also functioning as a supporting bracket |
US20090107653A1 (en) * | 2007-10-29 | 2009-04-30 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipes |
US20090159252A1 (en) * | 2007-12-20 | 2009-06-25 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink having bumps for positioning heat pipes therein |
US20090236077A1 (en) * | 2008-03-24 | 2009-09-24 | Hong Fu Jin Precision Industry (Shenzhen) Co.,Ltd. | Heat dissipation device |
US7643293B2 (en) * | 2007-12-18 | 2010-01-05 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device and a method for manufacturing the same |
US20100073876A1 (en) * | 2008-09-22 | 2010-03-25 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20100096107A1 (en) * | 2008-10-20 | 2010-04-22 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7448437B2 (en) * | 2005-06-24 | 2008-11-11 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Heat dissipating device with heat reservoir |
CN100499977C (zh) * | 2006-01-18 | 2009-06-10 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN101765351B (zh) * | 2008-12-22 | 2012-12-26 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN101932221B (zh) * | 2009-06-23 | 2014-08-20 | 富准精密工业(深圳)有限公司 | 散热装置 |
-
2011
- 2011-06-09 CN CN2011101538713A patent/CN102819302A/zh active Pending
- 2011-07-25 US US13/189,589 patent/US20120312509A1/en not_active Abandoned
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070215321A1 (en) * | 2006-03-16 | 2007-09-20 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20080121371A1 (en) * | 2006-11-29 | 2008-05-29 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20080257527A1 (en) * | 2007-04-18 | 2008-10-23 | Foxconn Technology Co., Ltd. | Heat sink assembly having a fin also functioning as a supporting bracket |
US20090107653A1 (en) * | 2007-10-29 | 2009-04-30 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with heat pipes |
US7643293B2 (en) * | 2007-12-18 | 2010-01-05 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation device and a method for manufacturing the same |
US20090159252A1 (en) * | 2007-12-20 | 2009-06-25 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink having bumps for positioning heat pipes therein |
US20090236077A1 (en) * | 2008-03-24 | 2009-09-24 | Hong Fu Jin Precision Industry (Shenzhen) Co.,Ltd. | Heat dissipation device |
US20100073876A1 (en) * | 2008-09-22 | 2010-03-25 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20100096107A1 (en) * | 2008-10-20 | 2010-04-22 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104850197A (zh) * | 2015-04-28 | 2015-08-19 | 天津商业大学 | 带有复合底板的重力热管式芯片散热器 |
US20180066894A1 (en) * | 2016-09-02 | 2018-03-08 | Acer Incorporated | Lattice Boiler Evaporator |
US10563926B2 (en) * | 2016-09-02 | 2020-02-18 | Acer Incorporated | Lattice boiler evaporator |
US11402157B2 (en) | 2016-09-02 | 2022-08-02 | Acer Incorporated | Lattice boiler evaporator |
Also Published As
Publication number | Publication date |
---|---|
CN102819302A (zh) | 2012-12-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YUAN, YUAN;LI, MIN;FU, MENG;REEL/FRAME:026638/0801 Effective date: 20110615 Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YUAN, YUAN;LI, MIN;FU, MENG;REEL/FRAME:026638/0801 Effective date: 20110615 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |