US20120104434A1 - Light emitting device and method for manufacturing the same - Google Patents

Light emitting device and method for manufacturing the same Download PDF

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Publication number
US20120104434A1
US20120104434A1 US12/678,103 US67810309A US2012104434A1 US 20120104434 A1 US20120104434 A1 US 20120104434A1 US 67810309 A US67810309 A US 67810309A US 2012104434 A1 US2012104434 A1 US 2012104434A1
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United States
Prior art keywords
layer
conductive type
type semiconductor
semiconductor layer
light emitting
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US12/678,103
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English (en)
Inventor
Dae Sung Kang
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LG Innotek Co Ltd
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LG Innotek Co Ltd
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Assigned to LG INNOTEK CO., LTD. reassignment LG INNOTEK CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KANG, DAE SUNG
Publication of US20120104434A1 publication Critical patent/US20120104434A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
    • H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape

Definitions

  • the present disclosure relates to a light emitting device and a method for manufacturing the same.
  • LED Light Emitting Diode
  • LED includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. Light is generated by combination of electrons and holes in the active layer when power is applied to the first conductive type semiconductor layer and the second conductive type semiconductor layer.
  • LEDs are used for various machines and electrical and electronic devices such as display devices, lighting devices, mobile communication terminals, and automobiles.
  • Embodiments provide a light emitting device and a method for manufacturing the same.
  • Embodiments provide a light emitting device and a method for manufacturing the same, which has improved light extraction efficiency.
  • a light emitting device comprises: a first conductive type semiconductor layer; an active layer on the first conductive type semiconductor layer; a second conductive type semiconductor layer on the active layer; and a light extraction layer on the second conductive type semiconductor layer, the light extraction layer having a refractive index smaller than or equal to a refractive index of the second conductive type semiconductor layer.
  • a method for manufacturing a light emitting device comprises: forming a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; forming a selectively patterned mask layer on the second conductive type semiconductor layer; forming a light extraction layer on the second conductive type semiconductor layer on which the mask layer is not formed and removing the mask layer; performing a scribing process around the light extraction layer; and selectively etching the second conductive type semiconductor layer, the active layer, and the first conductive type semiconductor layer to upwardly expose a portion of the first conductive type semiconductor layer.
  • the embodiments can provide a light emitting device and a method for manufacturing the light emitting device.
  • the embodiments can provide a light emitting device and a method for manufacturing the light emitting device, which has improved light extraction efficiency.
  • FIG. 1 is a perspective view of a light emitting diode according to a first embodiment.
  • FIG. 2 is a cross-sectional view taken along line I-I′ of the light emitting diode according to the first embodiment.
  • FIG. 3 is a perspective view of a light emitting diode according to a second embodiment.
  • FIG. 4 is a cross-sectional view taken along line II-II′ of the light emitting diode according to the second embodiment.
  • FIGS. 5 through 10 are views illustrating a method for manufacturing a light emitting diode according to an embodiment.
  • a layer (or film), a region, a pattern, or a structure is referred to as being “on/under” a substrate, a layer (or film), a region, a pad, or patterns, it can be directly on the substrate, the layer (or film), the region, the pad, or the patterns, or intervening layers may also be present. Also, Further, the reference about ‘on’ and ‘under’ each layer will be made on the basis of the drawings.
  • FIG. 1 is a perspective view of a light emitting diode according to a first embodiment.
  • FIG. 2 is a cross-sectional view taken along line I-I′ of the light emitting diode according to the first embodiment.
  • a light emitting diode may include a substrate 10 , a buffer layer 20 , an undoped GaN layer 30 , a first conductive type semiconductor layer 40 , an active layer 50 , and a second conductive type semiconductor layer 60 .
  • a first electrode layer 80 may be formed on the first conductive type semiconductor layer 40
  • a second electrode layer 90 may be formed on the second conductive type semiconductor layer 60 .
  • a third conductive type impurity layer doped with a first conductive type impurity may be formed on the second conductive type semiconductor layer 60 .
  • the light emitting diode according to the first embodiment may include an opening 110 to form the first electrode layer 80 therein.
  • the opening 110 may be formed by selectively removing the second conductive type semiconductor layer 60 , the active layer 50 , and the first conductive type semiconductor layer 40 .
  • the upper side of the first conductive type semiconductor layer 40 may be exposed by the opening 110 , and then the first electrode layer 80 may be formed on the first conductive type semiconductor layer 40 .
  • the first electrode layer 80 and the second electrode layer 90 may be electrically connected to an external power source.
  • an ohmic contact layer may be formed between the second conductive type semiconductor layer 60 and the second electrode layer 90 .
  • the ohmic contact layer may be formed with a transparent electrode.
  • a light extraction layer 70 may be formed on the second conductive type semiconductor layer 60 .
  • the light extraction layer 70 may be formed on a peripheral portion of the second conductive type semiconductor layer 60 . Accordingly, the light extraction layer 70 may be disposed to surround the exposed portion of the second conductive type semiconductor layer 60 and the opening 110 .
  • the light extraction layer 70 may also be formed on all of the peripheral portions of the second conductive type semiconductor layer 60 .
  • the side surface of the light extraction layer 70 may be formed on the same vertical plane as the side surface of the second conductive type semiconductor layer 60 .
  • the light extraction layer 70 may allow light from the active layer 50 to be emitted to the outside more efficiently.
  • the light extraction layer 70 may be formed to have an inclined surface 71 in an upwardly exposed direction of the second conductive type semiconductor layer 60 .
  • the inclined surface 71 may be inclined at an angle of about 58 degrees to about 63 degrees with respect to the upper surface of the second conductive type semiconductor layer 60 .
  • the light extraction layer 70 may be formed to have a refractive index smaller than or equal to that of the second conductive type semiconductor layer 60 .
  • the second conductive type semiconductor layer 60 may be formed of GaN, and may have a refractive index of about 2.33 with respect to light having a wavelength of about 450 nm.
  • the light extraction layer 70 may be formed of Al x Ga 1-x N y (0 ⁇ x ⁇ 1), and may have a refractive index of about 2.12 to about 2.33 with respect to light having a wavelength of 450 nm.
  • the light extraction layer 70 may be formed of AlGaN.
  • the light extraction layer 70 having a refractive index smaller than or equal to that of the second conductive type semiconductor layer 60 is formed on the second conductive type semiconductor layer 60 , there is an increased possibility that light generated in the active layer 50 may be reflected by the upper surface of the second conductive type semiconductor layer 60 to be emitted to the outside without being again incident to the inside.
  • the inclined surface 71 of the light extraction layer 70 may allow the light to be emitted in the upward direction more smoothly.
  • the ohmic contact layer may be formed between the second conductive type semiconductor layer 60 and the light extraction layer 70 .
  • FIG. 3 is a perspective view of a light emitting diode according to a second embodiment.
  • FIG. 4 is a cross-sectional view taken along line II-II′ of the light emitting diode according to the second embodiment.
  • the light emitting diode according to the second embodiment may be similar to the light emitting diode described in the first embodiment.
  • the light emitting diode according to the first embodiment is formed to have the opening 110 exposing the first conductive type semiconductor layer 40 upwardly to form the first electrode layer 80
  • the light emitting diode according to the second embodiment is formed to have the opening 110 of FIG. 1 to be opened in the direction of the side surface as well.
  • portions of the second conductive type semiconductor layer 60 , the active layer 50 , the first conductive type semiconductor layer 40 , and the light extraction layer 70 may be selectively removed.
  • the light emitting diode according to the second embodiment has an advantage in that a process for electrically connecting the first electrode layer 80 to an external power source through a wire can be more easily performed.
  • FIGS. 5 through 10 are views illustrating a method for manufacturing a light emitting diode according to an embodiment.
  • a buffer layer 20 , an undoped GaN layer 30 , a first conductive type semiconductor layer 40 , an active layer 50 , and a second conductive type semiconductor layer 60 may be formed on a substrate 10 .
  • a mask layer 100 may be formed on the second conductive type semiconductor layer 60 to form a light extraction layer 70 .
  • the substrate 10 may be formed of at least one of Al 2 O 3 , Si, SiC, GaAs, ZnO, and MgO.
  • the buffer layer 20 may reduce a difference in the lattice constants between the substrate 10 and the nitride semiconductor layer stacked over the substrate, and may be formed in a stacked structure of materials such as AlInN/GaN, In x Ga 1-x N/GaN, and Al x In y Ga 1-x-y N/In x Ga 1-x N/GaN.
  • the undoped GaN layer 30 may be formed by injecting a gas including NH 3 and TMGa into a chamber.
  • the first conductive type semiconductor layer 40 may be a nitride semiconductor layer doped with a first conductive type impurity.
  • the first conductive type impurity may be an n-type impurity.
  • the first conductive type semiconductor layer 40 may be formed of a GaN layer including Si as an n-type impurity.
  • the active layer 50 may be formed in a single quantum well structure or a multi-quantum well structure.
  • the active layer 50 may be formed in a stacked structure of InGaN well layer/GaN barrier layer.
  • the second conductive type semiconductor layer 60 may be a nitride semiconductor layer doped with a second conductive type impurity.
  • the second conductive type impurity may be a p-type impurity.
  • the second conductive type semiconductor layer 60 may be formed of a GaN layer including Mg as a p-type impurity.
  • a third conductive type semiconductor layer may be a nitride semiconductor layer doped with a first conductive type impurity.
  • the first conductive type impurity may include an n-type impurity such as Si.
  • the mask layer 100 may be formed of a silicon oxide (SiO 2 ).
  • the mask layer 100 may be patterned to form the light extraction layer 70 according to an embodiment.
  • the light extraction layer 70 may be formed on the second conductive type semiconductor layer 60 after the mask layer 100 is formed.
  • the light extraction layer 70 may be formed of Al x Ga 1-x N y (0 ⁇ x ⁇ 1).
  • the Al x Ga 1-x N y may be formed by supplying NH 3 , TMGa and TMAl at a temperature of about 800 ⁇ to about 1,000 ⁇ .
  • the light extraction layer 70 may be formed of AlGaN.
  • the light extraction layer 70 may be formed to have an inclined surface 71 inclined at an angle of about 58 degrees to about 63 degrees with respect to the upper surface of the second conductive type semiconductor layer 60 during growth process.
  • the mask layer 100 may be removed as shown in FIG. 7 .
  • a scribing process may be performed around the light extraction layer 70 .
  • the scribing process is to divide a semiconductor layer into pieces to make a plurality of light emitting devices. While a cross-sectional view has been illustrated in FIG. 8 , the semiconductor layer may be divided in a shape similar to a cube as shown in FIGS. 1 and 3 .
  • the light extraction layer 70 may be disposed on the peripheral portion of the second conductive type semiconductor layer 60 .
  • the side surface of the light extraction layer 70 may be formed on the same vertical plane as the side surface of the second conductive type semiconductor layer 60 .
  • an ohmic contact layer (not shown) may be formed on the second conductive type semiconductor layer 60 , and then the mask layer 100 may be formed on the ohmic contact layer. Thereafter, the light extraction layer 70 may be formed over the ohmic contact layer.
  • the ohmic contact layer may be formed on the second conductive type semiconductor layer 60 on which the light extraction layer 70 is not formed.
  • a mask pattern (not shown) may be formed over the second conductive type semiconductor layer 60 and the light extraction layer 70 described in FIG. 8 , and then the second conductive type semiconductor layer 60 , the active layer 50 , and the first conductive type semiconductor layer 40 may be selectively etched to form the opening 110 as described in FIGS. 1 and 2 .
  • the light extraction layer 70 , the second conductive type semiconductor layer 60 , the active layer 50 , and the first conductive type semiconductor layer 40 may be selective etched along the mask pattern to form the opening as described in FIGS. 3 and 4 .
  • a first electrode layer 80 may be formed on the first conductive type semiconductor layer 40 , and then a second electrode layer 90 may be formed on the second conductive type semiconductor layer 60 .
  • a light emitting diode can be manufactured as described in FIG. 1 .
  • a process for electrically connecting the first and second electrode layers 80 and 90 to an external power source through a wire may be performed, and a process for forming a molding member on the second conductive type semiconductor layer 60 and the light extraction layer 70 may be performed.
  • the embodiments can be applied to light emitting devices used as a light source.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
US12/678,103 2008-05-08 2009-05-08 Light emitting device and method for manufacturing the same Abandoned US20120104434A1 (en)

Applications Claiming Priority (3)

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KR10-2008-0042973 2008-05-08
KR1020080042973A KR100969128B1 (ko) 2008-05-08 2008-05-08 발광 소자 및 그 제조방법
PCT/KR2009/002448 WO2009136770A2 (ko) 2008-05-08 2009-05-08 발광 소자 및 그 제조방법

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US13/721,772 Active US8791479B2 (en) 2008-05-08 2012-12-20 Light emitting device and method for manufacturing the same
US14/313,757 Active US9368684B2 (en) 2008-05-08 2014-06-24 Light emitting device and method for manufacturing the same

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EP (1) EP2276078B1 (ko)
KR (1) KR100969128B1 (ko)
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KR100969128B1 (ko) * 2008-05-08 2010-07-09 엘지이노텍 주식회사 발광 소자 및 그 제조방법
CN101853912A (zh) * 2010-04-08 2010-10-06 苏州大学 一种增强偏振出光发光二极管
CN102122686A (zh) * 2011-01-17 2011-07-13 泉州市金太阳电子科技有限公司 发光二极管的制造方法
JP6434878B2 (ja) * 2015-09-10 2018-12-05 株式会社東芝 発光装置

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CN101855737B (zh) 2012-06-20
WO2009136770A2 (ko) 2009-11-12
CN101855737A (zh) 2010-10-06
US9368684B2 (en) 2016-06-14
EP2276078A2 (en) 2011-01-19
KR20090117083A (ko) 2009-11-12
EP2276078B1 (en) 2019-01-02
WO2009136770A3 (ko) 2010-03-11
US8791479B2 (en) 2014-07-29
KR100969128B1 (ko) 2010-07-09
EP2276078A4 (en) 2014-12-17
US20140306177A1 (en) 2014-10-16
US20130193442A1 (en) 2013-08-01

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