US20120055655A1 - Heat sink, liquid cooling unit, and electronic apparatus - Google Patents

Heat sink, liquid cooling unit, and electronic apparatus Download PDF

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Publication number
US20120055655A1
US20120055655A1 US13/198,899 US201113198899A US2012055655A1 US 20120055655 A1 US20120055655 A1 US 20120055655A1 US 201113198899 A US201113198899 A US 201113198899A US 2012055655 A1 US2012055655 A1 US 2012055655A1
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US
United States
Prior art keywords
heat sink
heat
sink part
electronic module
discharger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/198,899
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English (en)
Inventor
Michimasa Aoki
Masumi Suzuki
Yosuke Tsunoda
Masaru Sugie
Shinichirou Kouno
Hiroshi Muto
Kenji Katsumata
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Fujitsu Ltd
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Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Assigned to FUJITSU LIMITED reassignment FUJITSU LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AOKI, MICHIMASA, KATSUMATA, KENJI, KOUNO, SHINICHIROU, SUGIE, MASARU, SUZUKI, MASUMI, TSUNODA, YOSUKE, MUTO, HIROSHI
Publication of US20120055655A1 publication Critical patent/US20120055655A1/en
Abandoned legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops

Definitions

  • the present invention relates to a heat sink for absorbing heat which is generated by an electronic module and a liquid cooling unit and an electronic apparatus which are provided with a heat sink.
  • LSI large scale integrated circuit
  • Japanese Laid-Open Patent Publication No. 2005-229033 is known.
  • the space where the liquid cooling unit can be provided is sometimes limited.
  • the area of the heat sink of the liquid cooling unit becomes smaller, the liquid cooling unit falls in cooling efficiency. Therefore, when the area of the part where the heat sink can be provided is limited, it is not possible to sufficiently raise the cooling efficiency of the liquid cooling unit.
  • a heat sink for absorbing heat which is generated by an electronic module by a coolant which flows through its internal portion comprising a first heat sink part which is contiguous with the electronic module, a second heat sink part which is contiguous with the electronic module, and a heat discharger which is arranged spaced from the first heat sink part and second heat sink part at an opposite side from the electronic module and which is arranged in a flow path between the first heat sink part and second heat sink part.
  • a liquid cooling unit which is provided with the above heat sink.
  • an electronic apparatus which is provided with the above heat sink.
  • FIG. 1 is a perspective view which illustrates an example of a notebook PC of a first embodiment.
  • FIG. 2 is a perspective view which illustrates an example of the structure of an internal portion of a housing body of the first embodiment.
  • FIG. 3 is a plan view which illustrates an example of a liquid cooling unit according to the first embodiment.
  • FIG. 4 is a perspective view which illustrates an example of a heat sink according to the first embodiment.
  • FIG. 5 is a perspective cross-sectional view which illustrates an example of a heat sink according to the first embodiment.
  • FIG. 6 is a perspective view which illustrates a modification of a heat sink according to the first embodiment.
  • FIG. 7A is a perspective view which illustrates an example of a heat sink according to a second embodiment, while FIG. 7B is a cross-sectional view taken along the line A-A in FIG. 7A .
  • FIG. 8A is a perspective view which illustrates an example of a heat sink according to a third embodiment, while FIG. 8B is a cross-sectional view seen from the arrow direction in FIG. 8A .
  • FIG. 9 is a perspective view which illustrates an example of a heat sink according to a fourth embodiment.
  • the cooling efficiency can be improved to more than that of the related art.
  • FIG. 1 is a perspective view which illustrates an example of the notebook PC 10 according to the first embodiment.
  • the notebook PC 10 is provided with a housing body 20 and a display use housing 30 .
  • the display use housing 30 is coupled with the housing body 20 so that opening/closing is possible.
  • the housing body 20 is provided with a base 22 and a cover 24 .
  • the cover 24 can be detached from the base 22 . Further, on the surface of the cover 24 , a keyboard 26 , a pointing device 28 , and other input devices are disposed.
  • the display use housing 30 is provided with a liquid crystal panel module 32 .
  • the liquid crystal panel module 32 displays text, graphics, etc.
  • FIG. 2 is a perspective view which illustrates an example of the structure of the internal portion of the housing body 20 of the first embodiment.
  • the housing body 20 of the first embodiment is provided with a printed circuit board unit 40 , a DVD (digital versatile disk) drive device 46 , a hard disk drive device 48 , a card unit 50 , and a liquid cooling unit 100 .
  • DVD digital versatile disk
  • the printed circuit board unit 40 is provided with a printed circuit board 42 and an electronic module 44 .
  • the electronic module 44 is mounted on, the surface of the printed circuit board 42 .
  • the electronic module 44 is for example an LSI circuit.
  • On the LSI circuit or other electronic module 44 for example, a CPU (central processing unit) chip is mounted.
  • the CPU chip executes predetermined processing based on an operating system and application programs. When the CPU chip executes the processing, the LSI circuit or other electronic module 44 generates heat.
  • a liquid cooling unit 100 is attached to the printed circuit board unit 40 .
  • the detailed configuration of the liquid cooling unit 100 will be explained later.
  • the DVD drive device 46 reads data from a DVD or other recording medium and writes data to the DVD or other recording medium.
  • the hard disk drive device 48 stores for example the operating system and application software explained above.
  • the card unit 50 is mounted on the printed circuit board 42 .
  • a memory card or LAN (local area network) card is inserted into the card unit 50 .
  • FIG. 3 is a plan view which illustrates an example of the liquid cooling unit 100 according to the first embodiment.
  • the liquid cooling unit 100 of the first embodiment is provided with a heat exchanger 110 , fan unit 120 , tank 130 , pump 140 , and heat sink 150 .
  • Members configuring the liquid cooling unit 100 are connected by a plurality of hoses 102 and a plurality of joints 104 to form a circulation route.
  • the coolant use is made of, for example, a propylene glycol-based antifreeze.
  • the heat exchanger 110 takes the heat from the coolant which flows into the heat exchanger 110 .
  • the heat exchanger 110 is disposed in the vicinity of an exhaust port 52 (see FIG. 2 ) formed at the side surface of the housing body 20 .
  • the fan unit 120 is disposed in the vicinity of the heat exchanger 110 .
  • the fan unit 120 generates an air flow from the heat exchanger 100 toward the exhaust port 52 . For this reason, the heat taken from the coolant by the liquid cooling unit 100 is discharged through the exhaust port 52 to the outside of the notebook PC 10 .
  • the fan unit 120 is provided with a fan housing 122 and a fan 126 .
  • a fan housing 122 On the bottom plate and top plate of the fan housing 122 , an air intake opening 124 is formed.
  • the air intake opening 124 connects the internal space of the fan housing 122 and the outside space of the fan housing 122 .
  • the tank 130 is disposed downstream of the heat exchanger 110 .
  • the tank 130 stores the coolant stripped of heat by the heat exchanger 110 .
  • the pump 140 is disposed downstream of the tank 130 .
  • the pump 140 discharges the coolant stored in the tank 130 to generate the flow of the coolant which flows over the circulation route.
  • the pump 140 is for example a piezoelectric pump.
  • the heat sink 150 is disposed downstream of the pump 140 . As illustrated in FIG. 2 , the heat sink 150 is disposed above the electronic module 144 which generates heat. The heat sink 150 absorbs the heat generated by the electronic module 44 . The detailed configuration of the heat sink 150 will be explained later.
  • the heat exchanger 110 explained above is located downstream of the heat sink 150 .
  • a circulation route as explained above is formed.
  • FIG. 4 is a perspective view which illustrates one example of the heat sink 150 according to the first embodiment.
  • the arrows in FIG. 4 illustrate the flow of the coolant which flows through the heat sink 150 .
  • FIG. 5 is a perspective cross-sectional view which illustrates one example of the heat sink 150 according to the first embodiment.
  • the heat sink 150 of the first embodiment is provided with a first heat sink part 152 , a second heat sink part 154 , and a heat discharger 156 .
  • the second heat sink part 154 is arranged aligned with the first heat sink part 152 .
  • the first heat sink part 152 and the second heat sink part 154 are both contiguous with the same surface of the electronic module 44 .
  • the first heat sink part 152 , the second heat sink part 154 , and the electronic module 44 may also have heat conductive grease interposed between them.
  • flow pipes 170 and 172 are provided at the two ends of the first heat sink part 152 . Further, at the two ends of the second heat sink part 154 , flow pipes 174 and 176 are provided at the two ends of the second heat sink part 154 . Further, the flow pipes 172 and 174 are connected by the heat discharger 156 .
  • the structure of the interior part of the heat sink 150 will be explained.
  • the first heat sink part 152 and the second heat sink part 154 are partitioned by a partition plate 155 . Further, the first heat sink part 152 , the second heat sink part 154 , and the heat discharger 156 are provided, inside them, with fins 158 .
  • the first heat sink part 152 , the second heat sink part 154 , and the heat discharger 156 are each provided with nine fins 158 along the direction of flow of coolant.
  • the fins 158 are, for example, formed by aluminum or another metal material with a high heat conductivity. For this reason, the heat which the electronic module 44 generates is conveyed to both the housings and fins 158 which form the first heat sink part 152 and the second heat sink part 154 and the heat is absorbed by the coolant.
  • the heat discharger 156 is arranged spaced from the first heat sink part 152 and the second heat sink part 154 , at the opposite side from the electronic module 44 . Further, the heat discharger 156 is arranged in the flow path between the first heat sink part 152 and the second heat sink part 154 . For this reason, as illustrated by the arrows in FIG. 4 , the coolant, which flows in from the joint 104 to the heat sink 150 , passes through the flow pipe 170 , the first heat sink part 152 , the flow pipe 172 , the heat discharger 156 , the flow pipe 174 , the second heat sink part 154 , and the flow pipe 176 and flows out from the heat sink 150 .
  • the coolant which flows into the heat sink 150 , passes through the flow pipe 170 and flows through the first heat sink part 152 .
  • Part of the heat which is generated by the electronic module 44 is conducted to the housing of the first heat sink part 152 and the fins 158 and is absorbed by the coolant which flows through the first heat sink part 152 . Therefore, the temperature of the coolant which flows through the first heat sink part 152 rises.
  • the coolant, which flows through the first heat sink part 152 and rises in temperature passes through the flow pipe 172 and flows through the heat discharger 156 .
  • the heat discharger 156 is arranged spaced from the first heat sink part 152 and second heat sink part 154 , so the temperature of the coolant which flows through the heat discharger 156 falls.
  • the coolant, which flows through the heat discharger 156 and falls in temperature, passes through the flow pipe 174 and flows through the second heat sink part 154 .
  • Part of the heat which is generated by the electronic module 44 is conducted to the housing of the second heat sink part 154 and the fins 158 and is absorbed by the coolant which flows through the second heat sink part 154 .
  • the coolant which flows through the second heat sink part 154 passes through the flow pipe 176 and flows out to the outside of the heat sink 150 .
  • the heat sink 150 of the first embodiment since the coolant which was lowered in temperature by flowing through the heat discharger 156 flows through the second heat sink part 154 , the cooling efficiency of the heat sink 150 can be improved. Further, the heat discharger 156 of the first embodiment is arranged spaced from the first heat sink 152 and second heat sink 154 at an opposite side from the electronic module 44 , so even when the area of the part where the heat sink 150 can be provided is limited when viewed from a plane, the cooling efficiency of the heat sink 150 can be improved.
  • an air flow is formed by the fan unit 120 . Due to the air flow through the inside of the housing body 20 , the coolant, which flows through the heat discharger 156 , is cooled more efficiently, so the heat sink 150 is preferably arranged in the vicinity of the fan unit 120 .
  • the heat discharger 156 is preferably arranged at a slant with respect to the first heat sink 152 and the second heat sink 154 which are arranged aligned with each other.
  • FIG. 6 is a perspective view which illustrates an example where the heat sink 150 is provided with two heat dischargers 156 .
  • the two heat dischargers 156 are arranged spaced from the first heat sink part 152 and the second heat sink part 154 at an opposite side from the electronic module 44 .
  • the heat sink 150 is provided with two heat dischargers 156 , the cooling efficiency of the coolant which flows through the heat discharger 156 is improved compared with the case where the heat sink 150 is provided with one heat discharger 156 .
  • FIG. 7A is a perspective view which illustrates an example of the heat sink 150 of the second embodiment
  • FIG. 7B is a cross-sectional view taken along a line A-A in FIG. 7A .
  • the heat discharger 156 of the second embodiment is shaped as a parallel hexagon. Further, as illustrated in FIG. 7B , the normal of the surface with the largest area in the surfaces of the heat discharger 156 is slanted with respect to the normal of the surface with the largest area in the surfaces of the first heat sink part 152 . That is, the surface with the largest area in the surfaces of the heat discharger 156 is slanted with respect to the surface with the largest area in the surfaces of the first heat sink part 152 .
  • the heat discharger 156 is provided so that the surface with the largest area in the surfaces of the heat discharger 156 is slanted with respect to the surface with the largest area in the surfaces of the first heat sink part 152 . Therefore, compared with the case, like in the first embodiment which was explained with reference to FIG. 4 , where the surface with the largest area in the surfaces of the heat discharger 156 is parallel with respect to the surface with the largest area in the surfaces of the first heat sink part 152 , in the second embodiment, it is possible to increase the surface area of the heat discharger 156 . As a result, the cooling efficiency of the coolant which flows through the heat discharger 156 is improved.
  • the heat discharger 156 so that the surface with the largest area in the surfaces of the heat discharger 156 is slanted with respect to the surface with the largest area in the surfaces of the first heat sink part 152 , the flow of air through the inside of the housing body 20 touches the surface of the heat discharger 156 more efficiently than the first embodiment. Therefore, the cooling efficiency of the coolant which flows through the heat discharger 156 is improved.
  • FIG. 8A is a plan view which illustrates an example of the heat sink 150 according to the third embodiment
  • FIG. 8B is a front view seen from the arrow B direction of FIG. 8A .
  • the heat sink 150 of the third embodiment is provided with fins 160 between the first heat sink part 152 and the heat discharger 156 or between the second heat sink part 154 and the heat discharger 156 .
  • five fins 160 are provided along the direction of flow of the coolant inside of the heat discharger 156 .
  • the heat generated by the electronic module 44 is conducted to both the housings and fins 160 forming the first heat sink part 152 and the second heat sink part 154 .
  • heat is discharged from the fins 160 as well. Therefore, according to the third embodiment, the cooling efficiency of the heat sink 150 can be further improved.
  • FIG. 9 is a perspective view which illustrates an example of the heat sink 150 according to the fourth embodiment.
  • the arrows in FIG. 9 illustrates the flow of the coolant through the heat sink 150
  • the heat sink 150 of the fourth embodiment is provided with a first heat sink part 152 , a second heat sink part 154 , a third heat sink part 162 , a heat discharger 156 , and an additional heat discharger 164 .
  • the first heat sink part 152 , the second heat sink part 154 , and the third heat sink part 162 are arranged adjoining each other while aligned, but respectively independent flow paths are formed inside them.
  • the contiguous parts of the above members are not internally communicated.
  • the first heat sink part 152 , the second heat sink part 154 , and the third heat sink part 162 are all contiguous with the electronic module 44 .
  • flow pipes 180 and 182 are provided at the two ends of the first heat sink part 152 . Further, at the two ends of the second heat sink part 154 , flow pipes 184 and 188 are provided. Further, at the two ends of the third heat sink part 162 , flow pipes 186 and 188 are provided. Further, the flow pipes 182 and 184 are connected by the heat discharger 156 . Further, the flow pipes 182 and 186 are connected by the additional heat discharger 164 .
  • the structure of the interior part of the third heat sink part 162 is similar to the structure of the interior part of the first heat sink part 152 explained in the above first embodiment. Further, the structure of the interior part of the additional heat discharger 164 is similar to the structure of the interior part of the heat discharger 156 explained in the above first embodiment.
  • the heat discharger 156 is arranged spaced from the first heat sink part 152 and the second heat sink part 154 at the opposite side from the electronic module 44 .
  • the additional heat discharger 164 is arranged spaced from the first heat sink part 152 and third heat sink part 162 at the opposite side from the electronic module 44 .
  • the heat discharger 156 is arranged in the flow path between the first heat sink part 152 and the second heat sink part 154 .
  • the additional heat discharger 164 is arranged in the flow path between the first heat sink part 152 and the third heat sink part 162 .
  • the coolant which flows into the heat sink 150 passes through the flow pipe 180 , the first heat sink part 152 , the flow pipe 182 , the heat discharger 156 , the flow pipe 184 , the second heat sink part 154 , and the flow pipe 188 and flows out from the heat sink 150 and, at the same time, the coolant passes through the flow pipe 180 , the first heat sink part 152 , the flow pipe 182 , the additional heat discharger 164 , the flow pipe 186 , the third heat sink part 162 , and the flow pipe 188 and flows out from the heat sink 150 .
  • the coolant which flows through the first heat sink part 152 is cooled by flowing into both the heat discharger 156 and the additional heat discharger 164 , so the cooling efficiency of the heat sink 150 can be further improved.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
US13/198,899 2010-09-02 2011-08-05 Heat sink, liquid cooling unit, and electronic apparatus Abandoned US20120055655A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010196526A JP5533458B2 (ja) 2010-09-02 2010-09-02 受熱器、液冷ユニット及び電子機器
JP2010-196526 2010-09-02

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JP (1) JP5533458B2 (zh)
CN (1) CN102438428A (zh)
TW (1) TW201223430A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170185115A1 (en) * 2015-12-24 2017-06-29 NEC Platforms, Ltd, Cooling device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019115478A (ja) * 2017-12-27 2019-07-18 株式会社日立製作所 超音波プローブ

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6005772A (en) * 1997-05-20 1999-12-21 Denso Corporation Cooling apparatus for high-temperature medium by boiling and condensing refrigerant
US6863119B2 (en) * 2000-09-14 2005-03-08 Denso Corporation Cooling device boiling and condensing refrigerant
US6900990B2 (en) * 2002-08-27 2005-05-31 Kabushiki Kaisha Toshiba Electronic apparatus provided with liquid cooling type cooling unit cooling heat generating component
US7365978B2 (en) * 2004-12-11 2008-04-29 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipating device
US20080156460A1 (en) * 2006-12-27 2008-07-03 Foxconn Technology Co., Ltd. Thermal module
US20090009968A1 (en) * 2006-02-28 2009-01-08 Takeshi Hongo Cooling device and electronic apparatus
US7688587B2 (en) * 2004-09-30 2010-03-30 Kabushiki Kaisha Toshiba Cooling device for cooling a heat-generating component, and electronic apparatus having the cooling device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04242963A (ja) * 1990-06-30 1992-08-31 Toshiba Corp 冷却装置
JP2005064410A (ja) * 2003-08-20 2005-03-10 Denso Corp 発熱体の冷却器
JP2005229033A (ja) * 2004-02-16 2005-08-25 Hitachi Ltd 液冷システムおよびそれを備えた電子機器
JP3151098U (ja) * 2009-03-02 2009-06-11 奇▲こう▼科技股▲ふん▼有限公司 放熱モジュール

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6005772A (en) * 1997-05-20 1999-12-21 Denso Corporation Cooling apparatus for high-temperature medium by boiling and condensing refrigerant
US6863119B2 (en) * 2000-09-14 2005-03-08 Denso Corporation Cooling device boiling and condensing refrigerant
US6900990B2 (en) * 2002-08-27 2005-05-31 Kabushiki Kaisha Toshiba Electronic apparatus provided with liquid cooling type cooling unit cooling heat generating component
US7688587B2 (en) * 2004-09-30 2010-03-30 Kabushiki Kaisha Toshiba Cooling device for cooling a heat-generating component, and electronic apparatus having the cooling device
US7365978B2 (en) * 2004-12-11 2008-04-29 Fu Zhun Precision Industry (Shenzhen) Co., Ltd. Heat dissipating device
US20090009968A1 (en) * 2006-02-28 2009-01-08 Takeshi Hongo Cooling device and electronic apparatus
US20080156460A1 (en) * 2006-12-27 2008-07-03 Foxconn Technology Co., Ltd. Thermal module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170185115A1 (en) * 2015-12-24 2017-06-29 NEC Platforms, Ltd, Cooling device
US11106255B2 (en) * 2015-12-24 2021-08-31 Nec Platforms, Ltd. Cooling device

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CN102438428A (zh) 2012-05-02
JP5533458B2 (ja) 2014-06-25
JP2012054446A (ja) 2012-03-15
TW201223430A (en) 2012-06-01

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