US20100038239A1 - Device for fabricating flexible film - Google Patents

Device for fabricating flexible film Download PDF

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Publication number
US20100038239A1
US20100038239A1 US12/518,969 US51896907A US2010038239A1 US 20100038239 A1 US20100038239 A1 US 20100038239A1 US 51896907 A US51896907 A US 51896907A US 2010038239 A1 US2010038239 A1 US 2010038239A1
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United States
Prior art keywords
unit
flexible film
insulation film
plating
roller
Prior art date
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Abandoned
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US12/518,969
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English (en)
Inventor
Min Keun Seo
Woon Soo Kim
Jun Ha Lee
Myung Ho Park
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LG Electronics Inc
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LG Electronics Inc
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Publication date
Application filed by LG Electronics Inc filed Critical LG Electronics Inc
Assigned to LG ELECTRONICS INC. reassignment LG ELECTRONICS INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIM, WOON SOO, LEE, JUN HA, PARK, MYUNG HO, SEO, MIN KEUN
Publication of US20100038239A1 publication Critical patent/US20100038239A1/en
Abandoned legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0635—In radial cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0664—Isolating rolls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/227—Drying of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Definitions

  • the present invention relates to a device for fabricating a flexible film, and more particularly, to a device for fabricating a flexible film, which includes an assistant power unit and a squeezing unit and can thus smoothly transfer a flexible film and prevent the deterioration of the quality of a flexible film.
  • Conductive metal plated polyimide substrates are one of the most important materials of flexible printed circuit boards (FPCBs).
  • FPCBs flexible printed circuit boards
  • Examples of conductive metal plated polyimide substrates include flexible copper clad laminate (FCCL) films.
  • Polyester films, polyimide films, liquid crystal polymer films, or fluorine resin films may be used as insulation films of FCCL films.
  • Polyimide films have been most widely used in the manufacture of FCCL films because of their excellent heat resistance, dimensional stability, and solderability properties.
  • Conductive metal films of FCCL films may include a highly conductive metal such as gold or copper. Copper has been more widely used than gold as the material of conductive metal films of flexible films because of its high cost effectiveness.
  • FCCL films may include an insulation film and a metal film formed on the insulation film, and may be classified into a triple-layered FCCL film including an insulation film, an adhesive layer and a metal film and a double-layered FCCL film including a polyimide film and a metal film. Double-layered FCCL films have recently become increasingly popular because they provide excellent folding endurance properties and do not include an adhesive layer and are thus easy to apply to the realization of micro patterns.
  • FCCL films may be fabricated using a lamination method, a casting method, or a plating method.
  • the plating method has been widely used to fabricate FCCL films because the plating method can be applied to the fabrication of FCCL films regardless of the types of insulation films and adhesives.
  • the plating method enables the thickness of a metal film to be freely adjusted.
  • FCCL films obtained by the plating method generally have poorer properties (e.g., weak peel strength) than flexible films obtained by the lamination method or the casting method. Therefore, it is necessary to develop a device and method for fabricating a FCCL which can enhance the properties of FCCL films.
  • the present invention provides a device for fabricating a flexible film which includes an assistant power unit and a squeezing unit and can thus fabricate a flexible film with excellent physical properties such as high peel strength.
  • a device for fabricating a flexible film including a serving unit providing an insulation film; a main processing unit including at least one of a dust removing unit, an etching unit, a neutralizing unit, a coupling unit, a catalyst bonding unit, a plating unit, and a drying unit; an assistant power unit controlling a tension of the insulation film; a top transporter disposed at an upper part of the main processing unit; and a bottom transporter disposed at a lower part of the main processing unit, wherein the top transporter includes a squeezing unit pressing a material on the insulation film.
  • the device can improve the quality of a flexible film by pressing the flexible film using the squeezing unit.
  • FIG. 1 illustrates a front view of a device for fabricating a flexible film according to an embodiment of the present invention
  • FIG. 2 illustrates a plan view of the device
  • FIG. 3 illustrates a perspective view of a top transporter of the device
  • FIG. 4 illustrates a cross-sectional view of the top transporter
  • FIG. 5 illustrates an assistant power unit of the device
  • FIG. 6 illustrates a cross-sectional view of the assistant power unit
  • FIG. 7 illustrates a sensor unit of the assistant power unit.
  • FIGS. 1 and 2 illustrate a front view and a plan view, respectively, of a device 1 for fabricating a flexible film according to an embodiment of the present invention.
  • the device 1 includes a serving unit 2 which provides a flexible film A.
  • the device 1 may also include at least one of a dust removal unit 3 , an etching unit 4 , a neutralizing unit 5 , a coupling unit 6 , a catalyst bonding unit 7 , a plating unit, and a drying unit 10 .
  • the plating unit includes first and second plating units 8 and 9 .
  • a supplier 2 - 1 of the serving unit 2 provides the flexible film A by unrolling a flexible film roll.
  • the supplier 2 - 1 includes a flexible film roll mounting unit which is disposed near an inlet of the device 1 and a plurality of transfer rollers which are disposed near an outlet of the device 1 .
  • the supplier 2 - 1 provides the flexible film A to the dust removal unit 3 .
  • the dust removal unit 3 removes impurities (e.g., pollutants, grease, and fingerprints) from the surface of the flexible film A and can thus prevent the peel strength of the flexible film A from decreasing due to the impurities.
  • impurities e.g., pollutants, grease, and fingerprints
  • the dust removal unit 3 includes a plurality of dust removers 3 - 1 which remove impurities from the surface of the flexible film A and a plurality of washers 3 - 2 which wash the flexible film A with water.
  • the dust removers 3 - 1 and the washers 3 - 2 may be alternately arranged in the dust removal unit, thereby completely removing impurities from the surface of the flexible film A and keeping the surface of the flexible film A clean.
  • the dust removers 3 - 1 and the washers 3 - 2 may be formed in one body with a frame with a supporting leg and a caster at each corner.
  • the dust remover 3 - 1 includes a first transfer roller which is disposed at a lower center of a liquid container 21 of the dust removal unit 3 .
  • the liquid container 21 of the dust removal unit 3 contains a dust removal solution.
  • the first transfer roller is installed in the liquid container 21 of the dust removal unit 3 so that the flexible film A can sufficiently soak in the dust removal solution in the liquid container 21 of the dust removal unit 3 .
  • second and third transfer rollers may also be respectively provided at an inlet and an outlet of the liquid container 21 of the dust removal unit 3 .
  • the flexible film A may be introduced into the liquid container 21 of the dust removal unit 3 by the second transfer roller at, and may thus completely soak in the dust removal solution. Then, the flexible film A may be ejected from the liquid container 21 of the dust removal unit 3 through the first transfer roller by the third transfer roller.
  • Each of the washers 3 - 2 includes a washing room which is divided into a plurality of smaller rooms by barrier walls that are formed on a supporting board.
  • the supporting board is installed in a frame of a corresponding washer 3 - 2 .
  • a washing roller is installed in the washing room so that it can completely soak in water in the washing room.
  • a dehydration roller is installed above the barrier walls.
  • the flexible film may be washed by the washing roller and dehydrated by the dehydration roller. The washing and the dehydration of the flexible film A may be repeatedly performed.
  • the dust removal unit 3 may perform a dust removal operation at a temperature of 20-40° C. for one to five minutes. If the dust removal operation is performed at a temperature lower than 20° C., the dust removal solution may not be properly activated, thus failing to fully obtain the benefits of the dust removal operation. On the contrary, if the dust removal operation is performed at a temperature higher than 40° C., it may be difficult to control the time taken to perform the dust removal operation.
  • the etching unit 4 transforms the surface of the flexible film A using an etching solution.
  • the etching unit 4 includes a first etching unit 4 - 1 and a second etching unit 4 - 2 .
  • Liquid containers 21 of the first etching unit 4 - 1 and the second etching unit 4 - 2 may be filled with an etching solution such as chromium (e.g., chronic anhydride), sulfuric acid, or an alkali solution (e.g., potassium hydroxide (KOH) or a mixed solution of ethylene glycol and KOH). More specifically, the etching unit 4 may use chromium as a first etching solution and an alkali solution as a second etching solution.
  • the etching unit 4 may perform an etching operation at a temperature of 45-80° C. for up to thirty minutes by immersing the flexible film A in an etching solution. If the etching operation is performed at a temperature lower than 45° C., the etching solution may not be properly activated, thus failing to fully obtain the benefits of the etching operation and resulting in damage to the flexible film due to a long reaction time. On the contrary, if the etching operation is performed at a temperature higher than 80° C., the etching operation may proceed too rapidly, thus deteriorating the surface uniformity of the flexible film A.
  • the adhesion between the flexible film A and a metal film to be formed on the flexible film A through plating can be maximized, and thus, the peel strength of the flexible film A can be enhanced.
  • the flexible film A is a polyimide film
  • an imide ring on the surface of the polyimide film may be opened by the etching operation performed by the etching unit 4 .
  • the opened imide ring may be transformed into an amide radical (—CONH) or a carboxyl radical (—COOH), thereby enhancing the reactivity of the flexible film A.
  • the neutralizing unit 5 performs a neutralization operation on the surface of the flexible film A whose surface has been transformed by the etching unit 4 . If the etching solution used by the etching unit 4 is an alkali solution, a neutralization solution used by the neutralizing unit 5 may be an acid neutralization solution. On the other hand, if the etching solution used by the etching unit 4 is an acid solution, the neutralization solution used by the neutralizing unit 5 may be an alkali neutralization solution. The neutralizing unit 5 may perform the neutralization operation at a temperature of 10-40° C.
  • the neutralizing unit 5 removes K + ions or Cr 3+ ions, which result from the etching operation and may thus remain on the surface of the flexible film A, by substituting the K + ions or Cr 3+ ions with H + ions. If K + ions or Cr 3+ ions, which are the byproduct of the etching operation, remain on the surface of the flexible film A, they may compete with coupling ions for polarizing the flexible film A, and may thus interfere with the reaction of an amide radical or a carboxyl radical.
  • the neutralizing unit 5 may perform the neutralization operation at a temperature of 10-40° C.
  • the coupling unit 6 polarizes the surface of the flexible film A by performing a coupling operation using a coupling solution. More specifically, the coupling unit 6 polarizes the surface of the flexible film A by applying a coupling ion to the opened imide ring of the flexible film A. In this manner, it is possible to smoothly perform a subsequent plating operation and enhance the peel strength of the flexible film A.
  • the coupling solution may include a silane coupling agent or an amine coupling agent.
  • An alkali-based coupling agent containing sodium oxide and monomethylamine or an acid-based coupling agent containing ethylenediamine and hydrochloric acid may be used as the amine coupling agent.
  • the conditions regarding the coupling operation may vary according to the properties of the coupling solution.
  • the coupling unit 6 may perform the coupling operation by immersing the flexible film A in a silane coupling agent at a temperature of 30-45° C. for fifteen minutes.
  • a rinsing operation may be performed on the flexible film A by rinsing the flexible film A with an acid solution at room temperature so that coupling ions yet to be coupled onto the surface of the flexible film A can be removed. If the rinsing operation is performed for a long time or the acidity of the acid solution is too high, coupling ions already coupled onto the surface of the flexible film A may also be removed. Thus, the duration of the rinsing operation must be appropriately controlled so that only coupling ions yet to be coupled onto the surface of the flexible film A can be removed.
  • the catalyst bonding unit 7 performs a catalyst bonding operation on the surface of the flexible film A using a catalyst material such as palladium by immersing the flexible film A in a catalyst solution.
  • a catalyst material such as palladium by immersing the flexible film A in a catalyst solution.
  • a solution obtained by diluting a mixed solution of palladium chloride (PdCl 2 ) and stannous chloride (SnCl 2 ) with hydrochloric acid at a predetermined volume ratio may be used as the catalyst solution.
  • the duration of the catalyst bonding operation must be appropriately adjusted by appropriately varying the number of transfer rollers in the catalyst bonding unit 7 .
  • the first and second plating units 8 and 9 perform a plating operation on the flexible film A so that the flexible film A can be plated with a metal film.
  • the first plating unit 8 forms a first metal film on the flexible film A
  • the second plating unit 9 forms a second metal film on the first metal film.
  • the first plating unit 8 forms the first metal film on the flexible film using an electroless plating method.
  • the electroless plating method is a type of plating method that involves extracting metal ions in a plating solution through a chemical reaction of a reducing agent. Examples of the electroless plating method include a replacement plating method and a chemical reduction plating method.
  • the chemical reduction plating method is used.
  • the present invention is not restricted to this.
  • the replacement plating method instead of the chemical reduction plating method, may be used.
  • the chemical reduction plating method involves plating a metal film by chemically extracting metal ions from a metal salt solution using a reducing agent.
  • the first metal film may be formed to a desired thickness using the chemical reduction plating method, thereby enhancing the adhesiveness of the first metal film.
  • the first metal film may be formed to a uniform thickness by uniformly immersing the polyimide film in an electroless plating solution.
  • the first plating unit 8 forms the first metal film by performing a first plating operation using as a first plating solution either a copper sulphate plating aqueous solution obtained by mixing an electroless plating solution containing an ethylenediamine tetraacetic acid (EDTA) aqueous solution, a caustic soda solution, a formalin aqueous solution, and a copper sulphate aqueous solution or a nickel sulphate plating aqueous solution obtained by mixing sodium hypophosphite, sodium citrate, ammonia, and a nickel sulphate aqueous solution.
  • the first plating solution may contain a polish and an additive which enable the reuse and long-term preservation of the first plating solution even after several times of use.
  • the first metal film may be formed on the flexible film A simply by immersing the flexible film A in the first plating solution at a temperature 38-60° C. for twenty five to thirty minutes using an electroless plating method without the need to apply a current.
  • the thickness of the first metal film may be determined according to the duration of the first plating operation.
  • the first plating operation is preformed at a temperature lower than 38° C., the first plating solution may not be properly activated. Thus, no first metal film may be formed on the flexible film A or the flexible film A may be plated only partially with the first metal film. On the other hand, if the first plating operation is performed at a temperature higher than 60° C., the first plating operation may proceed too rapidly, thus deteriorating the surface uniformity of the first metal film and the adhesiveness between the first metal film and the flexible film A.
  • the flexible film A may be immersed in the first plating solution at a temperature of 45-80° C. for a predefined amount of time.
  • the first metal film may be formed on the flexible film A to a thickness of 0.2 ⁇ m or less.
  • the first plating operation may be performed so that the flexible film A can be uniformly plated with the first metal film. If the first metal film is too thin, the resistance of the first metal film may become too high, thus deteriorating the performance of a second plating operation that involves the use of an electroplating method. If the thickness of the first metal film is greater than 0.2 ⁇ m, the time taken to perform the first plating operation may increase, thus deteriorating the peel strength of the first metal film due to minor components of the electroless plating solution. Therefore, the first metal film may be formed to a thickness of about 0.1 ⁇ m.
  • the second plating unit 9 forms a second metal film on the first metal film by performing a second plating operation.
  • the second plating operation involves immersing the flexible film A on which the first metal film is formed in a second plating solution and applying a current to the flexible film A.
  • the second plating unit 9 may form the second metal film using an electroplating method.
  • the second plating unit 9 may use as the second plating solution a solution obtained by diluting an aqueous solution of copper sulphate (CuSO 4 —H 2 O), sulfuric acid (H 2 SO 4 ), and hydrochloric acid (HCl) with distilled water or ion-exchanged water.
  • the second plating solution may contain a polish and an additive.
  • the second plating unit 9 may form the second metal film by immersing the flexible film A in the second plating solution and applying a current of 2-4 A/dm 2 to the flexible film A at a temperature of about 40-45° C. for about thirty minutes.
  • the concentration of the second plating solution may be uniformly maintained by stirring the second plating solution.
  • the conditions regarding the second plating operation may vary according to a desired thickness of the second metal film.
  • the drying unit 10 dries the flexible film A on which the second metal film is formed.
  • the drying unit 10 includes a drier 10 - 1 which dries the flexible film A and includes a plurality of drying rooms therein.
  • the drier 10 - 1 may be rectangular.
  • a plurality of heating devices are disposed at the bottom of the frame of the drier 10 - 1 , and the frame of the drier 10 - 1 is divided into a plurality of drying rooms by a plurality of barrier walls.
  • a transfer roller is disposed on the ceilings of the drying rooms, respectively, and above the barrier walls, respectively, so that the flexible film A can be dried while passing through the drying unit 10 in zigzags. Once the flexible film A is completely dried out, the flexible film A is ejected from the drying unit 10 .
  • the coiling unit 11 coils the flexible film A around a cylindrical roll.
  • the coiling unit 1 may include a plurality of transfer rollers which are disposed at an inlet of the coiling unit 11 and maintain the flexible film A to be stable.
  • the coiling unit 11 may also include the cylindrical roll which is disposed at an outlet of the coiling unit 11 and may thus coil the flexible film A around the cylindrical roll.
  • a plurality of top transporters 100 , a plurality of bottom transporters 23 and a plurality of squeezing units 110 which can be used in the etching unit 4 , the neutralizing unit 5 , the coupling unit 6 , the catalyst bonding unit 7 , the first plating unit 8 , and the second plating unit 9 will hereinafter be described with reference to FIGS. 3 and 4 .
  • a device frame 20 has a supporting leg and a caster at each corner of the device frame 20 .
  • a supporting frame 30 with an I-shaped cross section is formed in the device frame 20 , thereby fixing a plurality of top transporters 100 .
  • a top transporter 100 and a bottom transporter 23 are alternately arranged in an empty space of the supporting frame 30 , the liquid containers 21 of the dust removal unit 3 and the first and second etching units 4 - 1 and 4 - 2 and liquid containers 21 of the neutralizing unit 5 , the coupling unit 6 , the catalyst bonding unit 7 , and the first and second plating units 8 and 9 , respectively.
  • the liquid containers 21 of the dust removal unit 3 , the first and second etching units 4 - 1 and 4 - 2 , the neutralizing unit 5 , the coupling unit 6 , the catalyst bonding unit 7 , and the first and second plating units 8 and 9 may be formed in the device frame 20 .
  • a plurality of squeezing units 110 are installed at inlets of the respective top transporters 100 .
  • Each of the top transporters 100 which are installed in the empty space of the supporting frame 30 , includes a center transporter 101 which is also installed in the empty space of the supporting frame 30 , and a drawing roller 102 and a discharge roller 103 which are both disposed near the bottom of the center transporter 101 . Since the drawing roller 102 and the discharge roller 103 are in the vicinity of the bottom of the center transporter 101 , the flexible film A may be ejected, passing through the space between the drawing roller 102 and the bottom of the center transporter 101 and between the discharge roller 103 and the bottom of the center transporter 101 .
  • a plurality of cradles 111 are disposed on the supporting frame 30 , and the upper portions of a plurality of levers 112 are respectively connected to the cradles 111 by a plurality of spindles 113 .
  • a plurality of squeezing rollers 114 are installed between the lower portions of the levers 112 .
  • a plurality of coil springs 115 are respectively connected between the levers 112 and the cradles 111 by a plurality of pairs of spindles 116 and 117 .
  • the surfaces of the squeezing rollers 114 are placed in contact with the drawing rollers 102 , and thus, the flexible film A provided by the bottom transporter 23 can pass through the spaces between the squeezing rollers 114 and the drawing rollers 102 .
  • the squeezing rollers 114 may be formed of rubber or foaming resin, and thus, a solution can be sufficiently pressed on and uniformly applied onto the surface of the flexible film A.
  • FIGS. 5 through 7 illustrate an assistant power unit 200 .
  • a roller 203 is disposed in an assistant power unit supporter 201 and is supported by a supporter 202 .
  • the assistant power unit supporter 201 is connected to the supporting frame 30 .
  • a plurality of grooves 205 are formed as straight lines on a circumferential surface 204 of the roller 203 and are evenly spaced.
  • a motor 210 is connected to a motor supporter 206 and is disposed on one side of an upper part of the assistant power unit supporter 201 .
  • a moving pulley 211 is disposed at the rotation axis of the motor 210
  • a coupling pulley 212 is disposed at the rotation axis of the roller 203 .
  • the moving pulley 211 and the coupling pulley 212 are connected by a timing belt 213 .
  • a tension controlling roller 225 is installed at an inlet of the roller 203 so that the tension controlling roller 225 can be driven by a tension controlling unit 220 .
  • the tension controlling unit 220 which is disposed at the inlet of the roller 203 , is fixed by a pair of fixing elements 221 which are respectively disposed on both sides of the assistant power unit supporter 201 .
  • the tension controlling unit 220 includes the tension controlling roller 225 which is installed between a pair of supporting elements 223 .
  • a pair of coil springs 224 is installed between the fixing elements 221 and the respective supporting elements 223 .
  • the coil springs 224 enable the tension controlling roller 225 to move back and forth due to the tension of the flexible film A when the flexible film A passes through the tension controlling roller 225 and also enable the tension controlling roller 225 to control the tension of the flexible film A.
  • a sensor unit 230 is disposed between the assistant power unit supporter 201 and the tension controlling unit 220 .
  • the sensor unit 230 controls the operation of the motor 210 according to tension applied to the tension controlling roller 225 by the flexible film A and may thus control the rotation speed of the roller 203 .
  • the sensor unit 230 includes a dog 232 which is attached to a supporting element 223 at which the tension controlling unit 220 is disposed.
  • a sensor fixing unit 231 is fixed to the assistant power unit supporter 201 to which the dog 232 is attached, and includes a plurality of sensors: a first sensor S 1 , a second sensor S 2 , and a third sensor S 3 .
  • the first, second and third sensors S 1 , S 2 and S 3 sense the movement of the dog 232 and thus control the operation of the motor 210 .
  • the motor 210 may be maintained at a normal speed. If the movement of the dog 232 is detected by the second sensor S 2 , the rotation speed of the motor 210 may be reduced so that the tension of the flexible film A can be alleviated. If the movement of the dog 232 is detected by the third sensor S 3 , the rotation speed of the motor 210 may be further reduced so that the tension of the flexible film A can be further alleviated, and that damage to the flexible film A can be prevented.
  • the dust removal unit 3 , the first and second etching units 4 - 1 and 4 - 2 of the etching unit 4 , the neutralizing unit 5 , the coupling unit 6 , the catalyst bonding unit 7 , the first plating unit 8 , the second plating unit 9 and the drying unit 10 are arranged in the device frame 20 .
  • the supporting frame 30 may be laid over the device frame 20 , and a plurality of top transporters 100 may be installed in an empty space of the supporting frame 30 .
  • a plurality of assistant power units 200 may be disposed over the top transporters 100 and may be connected to the supporting frame 30 .
  • the dust removal unit 3 , the etching unit 4 , the neutralizing unit 5 , the coupling unit 6 , the catalyst bonding unit 7 , the first plating unit 8 , the second plating unit 9 and the drying unit 10 may be maintained on a level with one another.
  • the flexible film A By maintaining the flexible film A to be flat while passing the flexible film A through the device 1 , it is possible to prevent the flexible film A from being deflected or distorted.
  • the flexible film A is arranged in the device 1 , sequentially passing through the dust removal unit 3 , the first and second etching units 4 - 1 and 4 - 2 of the etching unit 4 , the neutralizing unit 5 , the coupling unit 6 , the catalyst bonding unit 7 , the first plating unit 8 , the second plating unit 9 , the drier 10 - 1 of the drying unit 10 , and a coiler 11 - 1 of the coiling unit 11 .
  • the flexible film A is arranged in the device 1 , alternately passing through a plurality of top transporters 100 and a plurality of bottom transporters 23 which are included in the first etching unit 4 - 1 , the second etching unit 4 - 2 , the neutralizing unit 5 , the coupling unit 6 , the catalyst bonding unit 7 , the first plating unit 8 , the second plating unit 9 , and the drier of the drying unit 10 , respectively.
  • a top transporter 100 inserts the flexible film A which is provided by a bottom transporter 23 between a drawing roller 102 and a squeezing roller 114 so that the flexible film A can pass through the space between a center transporter 101 and a discharge roller 103 . After passing through the discharge roller 103 , the flexible film A passes through a next bottom transporter 23 .
  • the flexible film A may be supplied from an inlet of a top transporter 100 and may thus be arranged at an outlet of the top transporter 100 by passing through a tension controlling roller 225 and a roller 203 of an assistant power unit 200 .
  • a driving motor of the supplier 2 - 1 of the serving unit 2 begins to operate and supplies the flexible film A.
  • a driving motor of the coiler 11 - 1 of the coiling unit 11 begins to operate and coils the flexible film around a coiling roll.
  • the flexible film A may be inserted into a dust remover 3 - 1 of the dust removal unit 3 by passing through the supplier 2 - 1 of the serving unit 2 . Then, the flexible film A is drawn into the liquid container 21 of the dust removal unit 3 which is filled with a dust removal solution (e.g., an alkali rinse or shampoo). Thereafter, the flexible film A is raised by a transfer roller, which is immersed in the dust removal solution in the liquid container 21 of the dust removal unit 3 , thus removing impurities from the surface of the flexible film A.
  • a dust removal solution e.g., an alkali rinse or shampoo
  • the dust removal solution remained on the surface of the flexible film A is removed by lifting the flexible film A from the dust removal solution. Thereafter, the flexible film A is drawn into a washer 3 - 2 of the dust removal unit 3 through a transfer roller. Then, the flexible film A may be immersed in wash water and then taken out of the wash water repeatedly by a washing roller, which is contained in the wash water, and a dehydration roller, which is disposed above barrier walls that divides the washer 3 - 2 into first, second and third washing rooms. In this manner, the flexible film A can be washed.
  • the flexible film A is transferred to the etching unit 4 .
  • the etching unit 4 includes the first etching unit 4 - 1 and the second etching unit 4 - 2 .
  • a plurality of squeezing unit 110 may be arranged in the first etching unit 4 - 1 and the second etching unit 4 - 2 , respectively, as illustrated in FIGS. 3 and 4 .
  • the flexible film A is drawn into a first top transporter 100 at a first end of the first etching unit 4 - 1 and then is inserted between a first squeezing roller 114 and a first drawing roller 102 so that wash water remained on the surface of the flexible film A can be removed. Thereafter, the flexible film A is transferred to a first bottom transporter 23 of the first etching unit 4 - 1 , passing through the space between a center transporter 101 and a discharge roller 103 .
  • the flexible film A passes through a second top transporter 100 again.
  • An etching solution may be pressed and thus uniformly applied onto the surface of the flexible film A by passing the flexible film A through the space between a second squeezing roller 114 and a second drawing roller 102 . It is possible to further uniformly apply the etching solution onto the flexible film A by passing the flexible film A through the top transporters 100 .
  • the liquid container 21 of the first etching unit 4 - 1 may be filled with a chromium etching solution, and the liquid container 21 of the second etching unit 4 - 2 may be filled with an alkali etching solution. In this manner, an etching operation may be performed twice.
  • the first etching unit 4 - 1 may perform a first etching operation on the flexible film A by repeatedly moving the flexible film vertically with the aid of a plurality of bottom transporters 23 which are immersed in a chromium etching solution.
  • the chromium etching solution may be uniformly applied onto the flexible film A by passing the flexible film through the top transporters 100 of the first etching unit 4 - 1 and pressing the chromium etching solution on the flexible film A.
  • Each of the top transporters 100 of the first etching unit 4 - 1 includes a squeezing unit 110 .
  • a first assistant power unit 200 having the structure illustrated in FIGS. 5 and 7 , and thus, the flexible film A may be drawn into the second etching unit 4 - 2 .
  • the flexible film A is transferred to the second etching unit 4 - 2 , sequentially passing through a tension controlling roller 225 and a roller 203 of the first assistant power unit 200 .
  • the flexible film A may be transferred by the roller 203 which is rotated at a uniform speed by the motor 210 .
  • the roller 203 includes the grooves 205 which are evenly spaced on the circumferential surface 204 of the roller 203 .
  • the flexible film A When the flexible film A is placed in contact with the roller 203 , air yet to be discharged from the flexible film A is injected into the grooves 205 .
  • the flexible film A may be placed in firm contact with the circumferential surface 204 of the roller 203 , instead of being detached from the roller 203 , while being transferred. Therefore, it is possible to safely transfer the flexible film A without deflecting or distorting the flexible film A.
  • the flexible film A Since the flexible film A is placed in firm contact with the circumferential surface of the roller 203 while being transferred, the flexible film A can be prevented from being deformed, and can be smoothly transferred with the aid of the tension controlling roller 225 which rotates at a uniform speed.
  • the sensor unit 230 is disposed between the assistant power unit supporter 201 and the tension controlling unit 220 . If the movement of the dog 232 is detected by the first sensor S 1 , the motor 210 may be maintained at a normal speed. If the movement of the dog 232 is detected by the second sensor S 2 , the rotation speed of the motor 210 may be reduced so that the tension of the flexible film A can be alleviated. If the movement of the dog 232 is detected by the third sensor S 3 , the rotation speed of the motor 210 may be further reduced so that the tension of the flexible film A can be further alleviated, and that damage to the flexible film A can be prevented.
  • the second etching unit 4 - 2 When the flexible film A is drawn into the second etching unit 4 - 2 through the first assistant power unit 200 , the second etching unit 4 - 2 performs a second etching operation on the flexible film A by alternately passing the flexible film A through a plurality of top transporters 100 and a plurality of bottom transporters 23 which are immersed in an alkali etching solution contained in the liquid container 21 of the second etching unit 4 - 2 .
  • the etching unit 4 may complete an entire etching operation, including the first and second etching operations, by alternately passing the flexible film A through the top transporters 100 and the bottom transporters 23 of the first etching unit 4 - 1 and the top transporters 100 and the bottom transporters 23 of the second etching unit 4 - 2 . Thereafter, the flexible film A etched by the etching unit 4 is drawn into the neutralizing unit 5 .
  • the neutralizing unit 5 transmits the flexible film A therethough by alternately passing the flexible film A a plurality of top transporters 100 and a plurality of bottom transporters 23 which are all disposed in the liquid container 21 of the neutralizing unit 5 .
  • Each of the top transporters 100 of the neutralizing unit 5 includes a squeezing unit 110 .
  • the flexible film A is immersed in an acid or alkali neutralization solution so that the flexible film A can be neutralized. Then, the neutralization solution is uniformly removed from the flexible film A by the squeezing units 110 of the top transporters 100 of the neutralizing unit 5 . By performing these processes repeatedly, the neutralization of the flexible film A can be completed. Thereafter, power is applied to the flexible film A by a second assistant power unit 200 , and thus, the flexible film A neutralized by the neutralizing unit 5 is drawn into the coupling unit 6 .
  • the coupling unit 6 polarizes the flexible film A by sequentially passing the flexible film A through a plurality of bottom transporters 23 which are immersed in a silane or amine coupling solution contained in a liquid container of the coupling unit 6 .
  • the coupling solution may be pressed on the flexible film A by a plurality of squeezing units 110 of a plurality of top transporters 100 of the coupling unit 6 so that the coupling solution can be uniformly applied onto the flexible film A.
  • the top transporters 100 of the coupling unit 6 operate in the same manner as the top transporters 100 of the etching unit 4 , and thus, a detailed description of the operation of the top transporters 100 of the coupling unit 6 will be skipped. Thereafter, the flexible film A polarized by the coupling unit 6 is drawn into the catalyst bonding unit 7 .
  • the catalyst bonding unit 7 bonds a catalyst such as palladium to the flexible film A by sequentially passing the flexible film A through a plurality of bottom transporters 23 which are immersed in a catalyst solution contained in the liquid container 21 of the catalyst bonding unit 7 .
  • the catalyst solution may be uniformly applied onto the flexible film A by sequentially passing the flexible film A through a plurality of top transporters 100 , each including a squeezing unit 110 .
  • the top transporters 100 of the catalyst bonding unit 7 operate in the same manner as the top transporters 100 of the etching unit 4 , and thus, a detailed description of the operation of the top transporters 100 of the catalyst bonding unit 7 will be skipped.
  • a third assistant power unit 200 operates in the same manner as the first assistant power unit 200 , and thus, a detailed description of the operation of the third assistant power unit 200 will be skipped.
  • the flexible film A to which a catalyst is bonded by the catalyst bonding unit 7 is drawn into the first plating unit 8 , and a first metal film is formed on the flexible film A by the first plating unit 8 .
  • the first plating unit 8 plates the flexible film A with the first metal film by sequentially passing the flexible film A through a plurality of bottom transporters 23 which are immersed in a catalyst solution in the container 21 of the first plating unit 8 .
  • the first metal film may be pressed and thus uniformly formed on the flexible film A by sequentially passing the flexible film through a plurality of top transporters 100 , each including a squeezing unit 110 .
  • the top transporters 100 of the first plating unit 8 operate in the same manner as the top transporters 100 of the etching unit 4 , and thus, a detailed description of the operation of the top transporters 100 of the first plating unit 8 will be skipped.
  • the flexible film A on which the first metal film is uniformly formed is drawn into the second plating unit 9 .
  • the second plating unit 9 plates the flexible film A with a second metal film by sequentially passing the flexible film A through a plurality of bottom transporters 23 which are immersed in a catalyst solution contained in the liquid container 21 of the second plating unit 9 .
  • the second metal film may be pressed and thus uniformly formed on the flexible film A by sequentially passing through a plurality of top transporters 100 , each including a squeezing unit 110 .
  • the top transporters 100 of the second plating unit 9 operate in the same manner as the top transporters 100 of the etching unit 4 , and thus, a detailed description of the operation of the top transporters 100 of the second plating unit 9 will be skipped.
  • the flexible film A plated by the first and second plating unit 8 and 9 is drawn into the drier 10 - 1 of the drying unit 10 by being powered by a fourth assistant power unit 200 .
  • the fourth assistant power unit 200 operates in the same manner as the first assistant power unit 200 , and thus, a detailed description of the operation of the fourth assistant power unit 200 will be skipped.
  • the drier 10 - 1 of the drying unit 10 dries the flexible film A by passing the flexible film therethrough in zigzags with the aid of a plurality of transfer rollers which are disposed on the ceiling or the bottom of the drier 10 - 1 .
  • the flexible film A may be dried by heat generated by the heating devices in the drier 10 - 1 .
  • the flexible film A dried by the drier 10 - 1 is drawn into the coiler 11 - 1 of the coiling unit 11 by being powered by a fifth assistant power unit 200 .
  • the fifth assistant power unit 200 operates in the same manner as the first assistant power unit 200 , and thus, a detailed description of the operation of the fifth assistant power unit 200 will be skipped.
  • the coiler 11 - 1 of the coiling unit 11 may straighten the flexible film A by passing through a plurality of transfer rollers disposed at an inlet of the coiling unit 11 - 1 . Then, the flexible film A straightened by the coiler 11 - 1 may pass through a deflector roller and an induction roller and then be coiled around a coiling roll which is driven by a driving motor.
  • the device 1 may fabricate a flexible film A with the aid of the dust removal unit 3 , the etching unit 4 , the neutralizing unit 5 , the coupling unit 6 , the catalyst bonding unit 7 , the first plating unit 8 , the second plating unit 9 , and the drying unit 10 .

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
US12/518,969 2006-12-15 2007-12-12 Device for fabricating flexible film Abandoned US20100038239A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020060128758A KR100842043B1 (ko) 2006-12-15 2006-12-15 유-무기 하이브리드 전도성 초극박 필름 제조시스템
KR10-2006-0128758 2006-12-15
PCT/KR2007/006476 WO2008072897A1 (en) 2006-12-15 2007-12-12 Device for fabricating flexible film

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KR (1) KR100842043B1 (ko)
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Cited By (2)

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US20110221605A1 (en) * 2010-03-12 2011-09-15 Niemann Susan H Mat activated indicator
CN104271814A (zh) * 2012-05-10 2015-01-07 印可得株式会社 连续电镀装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101106461B1 (ko) * 2010-10-15 2012-01-20 대원화성 주식회사 피연마체 파지용 폴리우레탄 필름의 수세장치

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US3685907A (en) * 1969-06-25 1972-08-22 Masamichi Sato Electrophotographic process

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Publication number Priority date Publication date Assignee Title
JPH0621620A (ja) * 1991-10-17 1994-01-28 Mitsubishi Heavy Ind Ltd フレキシブルプリント基板の製造方法
KR100626827B1 (ko) 2005-07-07 2006-11-23 디엠아이텍 주식회사 전도성 금속 도금 폴리이미드필름 제조시스템
KR100730637B1 (ko) 2005-12-13 2007-06-21 디엠아이텍 주식회사 무전해방식을 이용한 필름 금속도금장치시스템

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Publication number Priority date Publication date Assignee Title
US3685907A (en) * 1969-06-25 1972-08-22 Masamichi Sato Electrophotographic process

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110221605A1 (en) * 2010-03-12 2011-09-15 Niemann Susan H Mat activated indicator
CN104271814A (zh) * 2012-05-10 2015-01-07 印可得株式会社 连续电镀装置

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KR100842043B1 (ko) 2008-06-30
KR20080056059A (ko) 2008-06-20

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