US20090301767A1 - Printed circuit board and method of manufacturing the same - Google Patents
Printed circuit board and method of manufacturing the same Download PDFInfo
- Publication number
- US20090301767A1 US20090301767A1 US12/222,177 US22217708A US2009301767A1 US 20090301767 A1 US20090301767 A1 US 20090301767A1 US 22217708 A US22217708 A US 22217708A US 2009301767 A1 US2009301767 A1 US 2009301767A1
- Authority
- US
- United States
- Prior art keywords
- bumps
- conductive paste
- set forth
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/026—Nanotubes or nanowires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Abstract
Disclosed is a printed circuit board including bumps formed using a conductive paste including carbon nanotubes and a photosensitive binder. A method of manufacturing the printed circuit board is also provided. The printed circuit board includes bumps formed using the conductive paste having carbon nanotubes, and can realize good electrical connection with electronic parts mounted thereon. The bumps can be formed at a fine pitch, thus realizing a circuit layer having a high density.
Description
- This application claims the benefit of Korean Patent Application No. 10-2008-0053667, filed Jun. 9, 2008, entitled “A printed circuit board and a method for manufacturing the same”, which is hereby incorporated by reference in its entirety into this application.
- 1. Field of the Invention
- The present invention relates to a printed circuit board (PCB) and a method of manufacturing the same, and more particularly, to a PCB, which includes bumps formed using a conductive paste including carbon nanotubes and a photosensitive binder, and to a method of manufacturing the same.
- 2. Description of the Related Art
- Conventionally, the formation of solder bumps on a substrate includes a method of printing solder paste on a substrate or a wafer and performing a reflow process (
FIGS. 1A to 1E ), an electroless plating method, or an electroplating method. - With reference to
FIG. 1A , a solder resist 15 is formed on asubstrate 11 havingpads 13. The solder resist 15 is formed between thepads 13, and functions to prevent the downward flow ofsolder paste 19 in the subsequent course of formingbumps 23. - As shown in
FIG. 1B , aprinting mask 17 is located on thesolder resist 15. Theprinting mask 17 functions such that the solder paste is applied to a predetermined height on thepads 13 while preventing the application of the solder paste on the solder resist 15 in the subsequent course of printing the solder paste. As shown inFIG. 1C , thesolder paste 19 is printed on thepads 13 using asqueegee blade 21. Thesolder paste 19 fills recesses defined by the solder resist 15 and theprinting mask 17, as shown inFIG. 1C . - As shown in
FIG. 1D , theprinting mask 17 located on thesolder resist 15 is removed, and a reflow process is performed, thereby completing aPCB including bumps 23, as shown inFIG. 1E . - However, the method of forming the bumps of the PCB using printing is problematic in that bumps having a fine pitch of 120 μm or less are difficult to realize. Thus, the method of forming the bumps using printing cannot be applied when it is intended to form fine bumps. Even if such bumps are formed, the volume thereof becomes very small.
- Presently, the size of a PCB, which enables the formation of bumps through printing, approximates a quarter size or a half size. Hence, it is impossible to perform a panel-size bumping process.
- Therefore, the present invention has been made keeping in mind the above problems encountered in the related art, and provides a PCB having a fine pitch using a conductive paste including carbon nanotubes and a photosensitive binder, and a method of manufacturing the PCB, which enables the bumping on a panel-size substrate.
- According to the present invention, a PCB may comprise a circuit substrate having a circuit layer for transferring electrical signals; and bumps electrically connected to the circuit layer and formed of a conductive paste including carbon nanotubes and a photosensitive binder.
- According to a preferred feature of the present invention, the circuit substrate may further comprise external connection terminals exposed in the outermost circuit layer thereof, and the bumps may be formed on the external connection terminals.
- According to another preferred feature of the present invention, the bumps may have a stepped cylindrical shape.
- According to a further preferred feature of the present invention, the conductive paste may further comprise metal powder.
- According to still a further preferred feature of the present invention, the photosensitive binder may be any one selected from among acrylic resin, styrene resin, novolac epoxy resin, and polyester resin.
- In addition, according to the present invention, a method of manufacturing a PCB may comprise (A) applying a conductive paste including carbon nanotubes and a photosensitive binder on the bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and (B) patterning the conductive paste, thus forming bumps.
- According to a preferred feature of the present invention, the conductive paste may further comprise metal powder.
- According to another preferred feature of the present invention, the circuit substrate may further comprise external connection terminals exposed in the outermost circuit layer thereof, and the bump-forming area may comprise an area in which the external connection terminals are exposed.
- According to a further preferred feature of the present invention, forming the bumps may comprise (i) disposing a mask having light-blocking patterns for forming the bumps on the conductive paste; and (ii) radiating light onto the mask, thus selectively exposing the conductive paste to light, and then developing the conductive paste.
- According to still a further preferred feature of the present invention, forming the bumps may further comprise drying the bumps, after (ii) radiating light.
- According to yet another preferred feature of the present invention, the mask may be a glass mask.
- According to still another preferred feature of the present invention, developing in (ii) radiating light may be conducted using any one developer selected from among Na2CO3, KCO3, and KOH.
- The features and advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.
- Further, the terms and words used in the present specification and claims should not be interpreted as being limited to typical meanings or dictionary definitions, but should be interpreted as having meanings and concepts relevant to the technical scope of the present invention based on the rule according to which an inventor can appropriately define the concept of the term to describe the best method he or she knows for carrying out the invention.
-
FIGS. 1A to 1E are schematic views sequentially showing a conventional process of manufacturing a PCB by printing a solder paste and then performing reflow; -
FIG. 2 is a cross-sectional view illustrating a PCB having bumps formed using a conductive paste including carbon nanotubes and a photosensitive binder, according to the present invention; and -
FIGS. 3 to 6 are schematic views sequentially showing a process of manufacturing the PCB having bumps formed using the conductive paste including carbon nanotubes and a photosensitive binder, according to the present invention. - Hereinafter, a detailed description will be given of a PCB and a method of manufacturing the same according to the present invention, with reference to the appended drawings. Throughout the drawings, like reference numerals refer to like elements, and redundant descriptions are omitted. In the description, the terms “first”, “second” and so on are used to distinguish one element from another element, but are not to be construed to limit the elements.
-
FIG. 2 is a cross-sectional view showing the PCB according to the present invention. As shown inFIG. 2 , the PCB according to the present invention includes acircuit substrate 10 having a circuit layer for transferring electrical signals, andbumps 35 electrically connected to the circuit layer and formed using aconductive paste 30 including carbon nanotubes and a photosensitive binder. - The
circuit substrate 10 is used to mount electronic parts and for wiring, and is typically a PCB obtained by etching a metal layer along a circuit pattern (the portion of the metal layer other than circuit lines is removed through etching), thus forming a necessary circuit layer, and formingbumps 35 and holes for attaching and mounting electronic parts on the outermost circuit layer. Thecircuit substrate 10 may be a single-sided PCB, in which a circuit layer is formed on only one surface of an insulating substrate, a double-sided PCB, in which a circuit layer is formed on both surfaces of an insulating substrate, or a multilayered board (MLB) having multiple circuit layers. - The circuit layer is composed of circuit patterns for transferring electrical signals along a designed pattern. The circuit pattern is a conductive line formed on the insulating substrate using highly conductive metal, such as copper or nickel. In particular, the circuit layer, which is disposed on the outermost surface of the
circuit substrate 10, is referred to as an outermost circuit layer. The outermost circuit layer is provided withexternal connection terminals 15 to connect the substrate to electronic parts. Theexternal connection terminal 15 may further include a nickel layer or a gold layer as a surface treatment layer in addition to the metal for the circuit layer. Furthermore, in order to prevent the corrosion and etching of the outermost circuit layer, the portion of the outermost circuit layer other than theexternal connection terminals 15 is covered with thesolder resist layer 13 and is thus protected. - The
bumps 35 are a conductive member formed on theexternal connection terminals 15 to electrically interconnect the layers of the MLB or to electrically physically connect the electronic parts and the PCB. In the present invention, the bumps for connecting the electronic parts and the PCB are depicted and described. - As shown in
FIG. 2 , thebumps 35 of the PCB according to the present invention may be formed in a stepped cylindrical shape, using aconductive paste 30 including carbon nanotubes and a photosensitive binder. In addition, theconductive paste 30 used in the present invention may further include metal powder, a curing agent, and a thixotrophic agent. Specific components of theconductive paste 30 used in the present invention are shown in Table 1 below. The components of Table 1 are illustrative, and the present invention is not limited thereto. -
TABLE 1 Components of Conductive Paste Amount Components (wt %) Note Carbon Nanotubes 50~90 Use of SWNT or MWNT (CNT) Metal Powder 10~30 Ag, Cu, Sn, Bi, Sn/Ag, Sn/Bi, Ag/Cu/Sn, (size: 1 μm or less) Mixing of Sn and other metal at a ratio of 7:3 Photosensitive 5~20 Photosensitive Resin Binder (epoxy) Binder Additive 0.5~5.0 Curing Agent, Thixotrophic Agent Solvent 5~10 — - Compared to other material (e.g., copper), carbon nanotubes exhibit superior electrical properties. For example, Table 2 below shows the properties of carbon nanotubes and other material.
-
TABLE 2 Properties of Carbon Nanotubes and Comparative Material Physical Properties Carbon Nanotubes Comparative Material Density 1.33~1.40 g/cm3 2.7 g/cm3 Current Density 1 × 109 A/cm2 1 × 106 A/cm2 (copper cable) Thermal 6000 W/mK 400 W/mK (copper) Conductivity Resistivity 1 × 10−10 Ωcm 1 × 10−10 Ωcm (copper) - As is apparent from the table, the carbon nanotubes have electrical properties superior to those of metal material, such as aluminum or copper, which have good properties in terms of electrical conductivity and resistivity. Thus, the PCB according to the present invention has the
bumps 35 formed using a composition including carbon nanotubes, and thereby exhibits better electrical connection with electronic parts mounted thereon, compared to conventionalPCBs having bumps 35 formed of other material. - In the present invention, the photosensitive binder may be any one selected from among acrylic resin, styrene resin, novolac epoxy resin, and polyester resin.
- In this way, because the PCB according to the present invention has the bumps formed using the conductive paste including carbon nanotubes, it can realize good electrical connection with electronic parts mounted thereon.
- Below, the method of manufacturing the PCB according to the present invention is described.
FIGS. 3 to 6 sequentially show the process of manufacturing the PCB according to the present invention. - As shown in
FIG. 3 , thecircuit substrate 10 having the circuit layer for transferring electrical signals is provided. Thecircuit substrate 10 may be a single-sided PCB, a double-sided PCB in which a circuit layer is formed on both surfaces of an insulating substrate, or an MLB having multiple circuit layers, and includesexternal connection terminals 15 exposed in the outermost circuit layer. - The
external connection terminals 15 may be uniformly distributed over the entire area of the outermost circuit layer of thecircuit substrate 10. Specifically, as shown inFIG. 3 , the external connection terminals are mainly formed on a predetermined area of the outermost layer, that is, the area on which electronic parts are mounted. For convenience, the area on which theexternal connection terminals 15 are mainly present is referred to as a bump-formingarea 17. In an exemplary embodiment, thecircuit substrate 10 has a bump-formingarea 17 in which twelveexternal connection terminals 15 are exposed in the center of the outermost circuit layer. - Next, as shown in
FIG. 4 , theconductive paste 30, including carbon nanotubes and a photosensitive binder, is applied on the bump-formingarea 17. The specific components of theconductive paste 30 are mentioned as above. In the present invention, using a metal mask having openings corresponding to the bump-formingarea 17, the conductive paste is applied through printing. However, the process of applying the conductive paste is not limited thereto, and it is noted that the conductive paste may be applied over the entire area of the outermost layer of the circuit substrate. - The photosensitive binder included in the
conductive paste 30 may be a negative type or a positive type. In an exemplary embodiment, useful is a positive type photosensitive binder, that is, a photosensitive binder by which a portion not irradiated with light is cured, as will be described later. - After the application of the
conductive paste 30 is completed, theconductive paste 30 is patterned through exposure and development, thus forming thebumps 35. The patterning of theconductive paste 30 through exposure and development enables more accurate control than when using a printing process, and is thus applied to a panel-size substrate. - As shown in
FIG. 5 , aglass mask 50 having light-blockingpatterns 55 at positions at which thebumps 35 are to be formed is disposed on theconductive paste 30, and UV light is radiated via theglass mask 50, thus curing the portions of theconductive paste 30 corresponding to thebumps 35. As mentioned above, because theconductive paste 30 includes a positive type photosensitive binder, the portions of the outermost circuit layer onto which light is not radiated, namely bumps 35, are cured. - In the present invention, the use of the
glass mask 50 is mentioned, but the present invention is not limited thereto. Alternatively, another kind of mask, such as an art work film, may be used. However, in order to form thebumps 35 at a fine pitch, it is preferred that theglass mask 50 be used. - Next, as shown in
FIG. 6 , theconductive paste 30 which is not cured is removed through development. As such, the development is conducted using a developer, which is any one selected from among Na2CO3, KCO3, and KOH. Thereafter, a drying process is conducted, thus completing thebumps 35 having a stepped cylindrical shape as shown inFIG. 2 . The drying process is typically performed at 160˜180° C. for 30˜90 min. - In the method of manufacturing the PCB according to the present invention, because the
conductive paste 30 including carbon nanotubes and a photosensitive binder is used, a bumping process can be conducted even on a panel-size substrate, and thebumps 35 having a fine pitch can be formed. - As described hereinbefore, the present invention provides a PCB and a method of manufacturing the same. The PCB according to the present invention includes bumps formed using a conductive paste having carbon nanotubes, and thus can realize good electrical connection with electronic parts mounted thereon. Further, the bumps are formed at a fine pitch, thus forming a circuit layer having a high density.
- In the method of manufacturing the PCB according to the present invention, because the conductive paste including carbon nanotubes and a photosensitive binder is used, a bumping process can be realized even on a panel-size substrate, and bumps having a fine pitch can be formed.
- Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible within the technical scope of the invention.
Claims (12)
1. A printed circuit board, comprising:
a circuit substrate having a circuit layer for transferring electrical signals; and
bumps electrically connected to the circuit layer and formed of a conductive paste including carbon nanotubes and a photosensitive binder.
2. The printed circuit board as set forth in claim 1 , wherein the circuit substrate further comprises external connection terminals exposed in an outermost circuit layer thereof, and the bumps are formed on the external connection terminals.
3. The printed circuit board as set forth in claim 1 , wherein the bumps have a stepped cylindrical shape.
4. The printed circuit board as set forth in claim 1 , wherein the conductive paste further comprises metal powder.
5. The printed circuit board as set forth in claim 1 , wherein the photosensitive binder is any one selected from among acrylic resin, styrene resin, novolac epoxy resin, and polyester resin.
6. A method of manufacturing a printed circuit board, comprising:
applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and
patterning the conductive paste, thus forming bumps.
7. The method as set forth in claim 6 , wherein the conductive paste further comprises metal powder.
8. The method as set forth in claim 6 , wherein the circuit substrate further comprises external connection terminals exposed in an outermost circuit layer thereof, and the bump-forming area comprises an area in which the external connection terminals are exposed.
9. The method as set forth in claim 6 , wherein the forming the bumps comprises:
disposing a mask having light-blocking patterns for forming the bumps on the conductive paste; and
radiating light onto the mask, thus selectively exposing the conductive paste to light, and then developing the conductive paste.
10. The method as set forth in claim 9 , wherein the forming the bumps further comprises drying the bumps, after the radiating light.
11. The method as set forth in claim 9 , wherein the mask is a glass mask.
12. The method as set forth in claim 9 , wherein the developing in the radiating light is conducted using any one developer selected from among Na2CO3, KCO3, and KOH.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/403,380 US8592135B2 (en) | 2008-06-09 | 2012-02-23 | Method of manufacturing printed circuit board |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080053667A KR100986000B1 (en) | 2008-06-09 | 2008-06-09 | A printed circuit board and a method for manufacturing the same |
KR10-2008-0053667 | 2008-06-09 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/403,380 Division US8592135B2 (en) | 2008-06-09 | 2012-02-23 | Method of manufacturing printed circuit board |
Publications (1)
Publication Number | Publication Date |
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US20090301767A1 true US20090301767A1 (en) | 2009-12-10 |
Family
ID=41399250
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/222,177 Abandoned US20090301767A1 (en) | 2008-06-09 | 2008-08-04 | Printed circuit board and method of manufacturing the same |
US13/403,380 Expired - Fee Related US8592135B2 (en) | 2008-06-09 | 2012-02-23 | Method of manufacturing printed circuit board |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/403,380 Expired - Fee Related US8592135B2 (en) | 2008-06-09 | 2012-02-23 | Method of manufacturing printed circuit board |
Country Status (2)
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US (2) | US20090301767A1 (en) |
KR (1) | KR100986000B1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090308650A1 (en) * | 2008-06-13 | 2009-12-17 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
US20120120609A1 (en) * | 2010-11-12 | 2012-05-17 | Unimicron Technology Corporation | Package structure having a semiconductor component embedded therein and method of fabricating the same |
US20120168206A1 (en) * | 2011-01-04 | 2012-07-05 | Napra Co., Ltd. | Substrate for electronic device and electronic device |
US20170088726A1 (en) * | 2010-02-05 | 2017-03-30 | Cam Holding Corporation | Photosensitive ink compositions and transparent conductors and method of using the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US20010011774A1 (en) * | 1997-05-19 | 2001-08-09 | Fujitsu Limited | Mounting method of semiconductor device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001196714A (en) * | 2000-01-17 | 2001-07-19 | Jsr Corp | Circuit board and manufacturing method therefor |
EP1265466A3 (en) * | 2001-06-05 | 2004-07-21 | Dai Nippon Printing Co., Ltd. | Method for fabrication wiring board provided with passive element and wiring board provided with passive element |
JP2003101231A (en) * | 2001-09-25 | 2003-04-04 | Nippon Zeon Co Ltd | Method of manufacturing multilayer circuit board |
CN100341629C (en) | 2002-05-21 | 2007-10-10 | 艾考斯公司 | Method for patterning carbon nanotube coating and carbon nanotube wiring |
JP2006120665A (en) | 2004-10-19 | 2006-05-11 | Sumitomo Metal Mining Co Ltd | Conductive resin paste composition containing silver and carbon nano tube, and semiconductor device using the same |
TWI388042B (en) * | 2004-11-04 | 2013-03-01 | Taiwan Semiconductor Mfg | Integrated circuit nanotube-based substrate |
US7514116B2 (en) * | 2005-12-30 | 2009-04-07 | Intel Corporation | Horizontal Carbon Nanotubes by Vertical Growth and Rolling |
-
2008
- 2008-06-09 KR KR1020080053667A patent/KR100986000B1/en not_active IP Right Cessation
- 2008-08-04 US US12/222,177 patent/US20090301767A1/en not_active Abandoned
-
2012
- 2012-02-23 US US13/403,380 patent/US8592135B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010011774A1 (en) * | 1997-05-19 | 2001-08-09 | Fujitsu Limited | Mounting method of semiconductor device |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090308650A1 (en) * | 2008-06-13 | 2009-12-17 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
US20170088726A1 (en) * | 2010-02-05 | 2017-03-30 | Cam Holding Corporation | Photosensitive ink compositions and transparent conductors and method of using the same |
US10550276B2 (en) * | 2010-02-05 | 2020-02-04 | Cambrios Film Solutions Corporation | Photosensitive ink compositions and transparent conductors and method of using the same |
US20120120609A1 (en) * | 2010-11-12 | 2012-05-17 | Unimicron Technology Corporation | Package structure having a semiconductor component embedded therein and method of fabricating the same |
US9093459B2 (en) * | 2010-11-12 | 2015-07-28 | Unimicron Technology Corporation | Package structure having a semiconductor component embedded therein and method of fabricating the same |
US20120168206A1 (en) * | 2011-01-04 | 2012-07-05 | Napra Co., Ltd. | Substrate for electronic device and electronic device |
CN102593100A (en) * | 2011-01-04 | 2012-07-18 | 纳普拉有限公司 | Substrate for electronic device and electronic device |
US9704793B2 (en) * | 2011-01-04 | 2017-07-11 | Napra Co., Ltd. | Substrate for electronic device and electronic device |
Also Published As
Publication number | Publication date |
---|---|
KR100986000B1 (en) | 2010-10-06 |
KR20090127605A (en) | 2009-12-14 |
US20120148960A1 (en) | 2012-06-14 |
US8592135B2 (en) | 2013-11-26 |
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