US20090081390A1 - Cylinder structure - Google Patents

Cylinder structure Download PDF

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Publication number
US20090081390A1
US20090081390A1 US11/862,191 US86219107A US2009081390A1 US 20090081390 A1 US20090081390 A1 US 20090081390A1 US 86219107 A US86219107 A US 86219107A US 2009081390 A1 US2009081390 A1 US 2009081390A1
Authority
US
United States
Prior art keywords
cylinder
flat
segment
metal
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/862,191
Other languages
English (en)
Inventor
Yung-Hui Chen
Po-An Lin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compal Electronics Inc
Original Assignee
Compal Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compal Electronics Inc filed Critical Compal Electronics Inc
Priority to US11/862,191 priority Critical patent/US20090081390A1/en
Assigned to COMPAL ELECTRONICS, INC. reassignment COMPAL ELECTRONICS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, YUNG-HUI, LIN, PO-AN
Priority to TW097108688A priority patent/TW200915957A/zh
Priority to CN200810097029.0A priority patent/CN101400230B/zh
Publication of US20090081390A1 publication Critical patent/US20090081390A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B37/00—Nuts or like thread-engaging members
    • F16B37/12—Nuts or like thread-engaging members with thread-engaging surfaces formed by inserted coil-springs, discs, or the like; Independent pieces of wound wire used as nuts; Threaded inserts for holes
    • F16B37/122—Threaded inserts, e.g. "rampa bolts"
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/184—Mounting of motherboards
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B33/00—Features common to bolt and nut
    • F16B33/004—Sealing; Insulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B43/00—Washers or equivalent devices; Other devices for supporting bolt-heads or nuts
    • F16B43/001—Washers or equivalent devices; Other devices for supporting bolt-heads or nuts for sealing or insulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]

Definitions

  • the present invention generally relates to a housing and a cylinder structure thereof, in particular, to an electronic device housing and a cylinder structure thereof.
  • An electronic device housing mainly serves two purposes. First of all, the electronic device housing provides a base for the electronic components to be fixed thereon. Secondly, the electronic device housing offers physical protection to the electronic components disposed therein and prevents the electronic components from damage caused by electrostatic discharge (ESD) and electro-magnetic interference (EMI).
  • ESD electrostatic discharge
  • EMI electro-magnetic interference
  • the housing for electronic device usually comprises cylinder structures, onto which the electronic parts can be fastened, and a metal layer, shielding the electronic components from ESD and EMI.
  • FIG. 1A is a local cross-sectional view of a conventional electronic device housing.
  • the electronic device housing 100 includes a wall 110 , a metal cylinder 120 , a plastic cylinder 130 , and a metal layer 140 .
  • the plastic cylinder 130 is formed on the wall 110 , and the plastic cylinder 130 has a first hole 132 and a plurality of burrs 134 on the top thereof, wherein the burrs 134 are resulted from inevitable defect of the molding process.
  • the metal cylinder 120 which has a second hole 122 with an internal thread 122 a , is inserted into the first hole 132 and fixed therein.
  • the metal layer 140 is a sputtered layer, which covers the exposed surface of the plastic cylinder 130 , the exposed surface of the metal cylinder 120 , and the inner surface of the wall 110 .
  • FIG. 1B is a local cross-sectional view of a circuit board installed on the electronic device housing in FIG. 1A
  • FIG. 1C is a local cross-sectional view of the electronic device housing in FIG. 1B with its burrs consumed.
  • the circuit board 50 of the electronic device has a plurality of ground pads 52 (only one is shown), a plurality of screws 54 ( only one is shown ), and a plurality of fixing hole 56 (only one is shown), through which the screws 54 are fastened in the second hole 122 of the metal cylinder 120 , and thus the circuit board 50 is fixed on the burrs 134 (shown in FIG. 1A ) on the top of the plastic cylinder 130 , wherein the ground pads 52 are in contact with the metal layer 140 .
  • the contact between the metal layer 140 and the ground pads 52 provides the metal layer 140 with the function of electromagnetic shielding.
  • the burrs 134 and a portion of the metal layer 140 thereon could be consumed by the friction between the circuit board 50 and the plastic cylinder 130 , or by the pressure exerted on the burrs 134 when installing the circuit board.
  • the damage of the contact between the ground pads 52 and the metal layer 140 produces an open 142 (shown in FIG. 1C ) on the metal layer 140 , which leads to higher resistance or open circuit therebetween, and hence diminishes the electromagnetic shielding performance of the electronic device housing 100 .
  • the present invention is directed to a cylinder structure preventing the metal layer from being open-circuited by the damage of burrs.
  • the present invention also provides an electronic device housing using the aforementioned cylinder structure and thus insures the electromagnetic shielding performance.
  • the present invention provides a cylinder structure including a plastic cylinder, a metal cylinder, and a metal layer.
  • the plastic cylinder has a first flat on the top thereof.
  • the metal cylinder has a second flat on the top thereof, and is partly inserted into the top of the plastic cylinder, wherein the second flat is higher than the first flat relative to the top of the plastic cylinder.
  • the plastic cylinder has a first hole having a first shoulder on the inner surface of the first hole, and the metal cylinder has a second shoulder supported by the first shoulder.
  • the metal cylinder has a second hole having an internal thread on the inner surface of the second hole.
  • the metal cylinder has a first segment and a second segment, and the joint between the first segment and the second segment forms the second shoulder.
  • a part of the first segment protrudes from the first flat, and the part of the first segment has the second flat, and the first segment has a plurality of concaves spread on the outer surface thereof.
  • the plastic cylinder has a burr formed on the outermost edge of the first flat.
  • the plastic cylinder has a plurality of reinforcing ribs distributed on the outer side of the plastic cylinder.
  • the present invention further provides an electronic device housing including a wall, at least one plastic cylinder, at least one metal cylinder, and a metal layer.
  • the plastic cylinder has a first flat on the top thereof, and the bottom of the plastic cylinder is attached to the wall.
  • the metal cylinder has a second flat on the top thereof, and is partly inserted into the top of the plastic cylinder, wherein the second flat is higher than the first flat relative to the top of the plastic cylinder.
  • the metal layer covers the exposed surface of the plastic cylinder, the exposed surface of the metal cylinder, and the inner surface of the wall.
  • the plastic cylinder has a first hole having a first shoulder on the inner surface of the first hole, and the metal cylinder has a second shoulder supported by the first shoulder.
  • the metal cylinder has a second hole having internal thread on the inner surface of the second hole.
  • the metal cylinder has a first segment and a second segment, and the joint between the first segment and the second segment forms the second shoulder.
  • a part of the first segment protrudes from the first flat, and the part of the first segment has the second flat, and the first segment has a plurality of concaves spread on the outer surface thereof.
  • the plastic cylinder has a burr formed on the outermost edge of the first flat.
  • the plastic cylinder has a plurality of reinforcing ribs distributed on the outer side of the plastic cylinder.
  • the wall and the plastic cylinder are integrally formed.
  • the second flat is higher than the first flat relative to the top of the plastic cylinder.
  • a circuit board installed on the cylinder structure is supported by the metal cylinder instead of the burrs or the first flat of the plastic cylinder.
  • FIG. 1A is a local cross-sectional view of a conventional electronic device housing.
  • FIG. 1B is a local cross-sectional view of a circuit board installed on the electronic device housing in FIG. 1A .
  • FIG. 1C is a local cross-sectional view of the electronic device housing in FIG. 1B with its burrs consumed.
  • FIG. 2A is a local top view of the electronic device housing according to an embodiment of the present invention.
  • FIG. 2B is a local cross-sectional view taken along line A-A in FIG. 2A .
  • FIG. 2C is a magnified view of the area circle A in FIG. 2A .
  • FIG. 3 is a local cross-sectional view of a circuit board installed on the electronic device housing in FIG. 2A .
  • FIG. 4 is a local cross-sectional view of a circuit board installed on the electronic device housing according to another embodiment of the present invention.
  • FIG. 5A is a top view of the metal cylinder in FIG. 4 .
  • FIG. 5B is a cross-sectional view taken along line B-B in FIG. 5A .
  • FIG. 2A is a local top view of the electronic device housing according to an embodiment of the present invention
  • FIG. 2B is a local cross-sectional view taken along line A-A in FIG. 2A
  • FIG. 2C is a magnified view of the circle A in FIG. 2A
  • the electronic device housing 300 includes a wall 310 and a cylinder structure 200 .
  • the cylinder structure 200 includes a plastic cylinder 210 , a metal cylinder 220 , and a metal layer 230 , wherein the plastic cylinder 210 has a first flat 212 on the top thereof.
  • the bottom of the plastic cylinder 210 is attached to the wall 300 , wherein the wall 300 and the plastic cylinder 210 may be integrally formed.
  • the metal cylinder 220 has a second flat 222 , and is partly inserted into the top of the plastic cylinder 210 and fixed therein, wherein the second flat 222 is higher than the first flat 212 relative to the top of the plastic cylinder 210 .
  • the plastic cylinder 210 has a first hole 214 , wherein the first hole 214 has a first shoulder 214 a on the inner surface thereof.
  • the metal cylinder 220 is partly inserted into the first hole 214 and has a second shoulder 224 , which is supported by the first shoulder 214 a .
  • the metal layer 230 maybe a sputtered layer, which covers the exposed portion of the inner surface of the wall 300 , the exposed surface of the plastic cylinder 210 and the exposed surface of the metal cylinder 220 .
  • the cylinder structure 200 may further include a plurality of reinforcing ribs 218 , which are distributed on the outer surface of the plastic cylinder 210 and strengthen the structure of the plastic cylinder 210 .
  • FIG. 3 is a local cross-sectional view of a circuit board installed on the cylinder structure in FIG. 2A .
  • a circuit board 50 is described, any electronic elements suitable for being installed on an electronic device housing is applicable.
  • the circuit board 50 is supported by the metal cylinder 220 instead of the plastic cylinder 210 , since the second flat 222 is higher than the first flat 212 .
  • the ground pad 52 will still be in contact with the metal cylinder 220 , hence the electromagnetic shielding performance of the metal layer 230 is ensured.
  • FIG. 4 is a local cross-sectional view of a circuit board installed on the cylinder structure according to another embodiment of the present invention.
  • the present embodiment is similar to the aforesaid embodiment, and in these two embodiments, like reference numerals refer to like elements.
  • the cylinder structure 200 ′ has a plurality of burrs 216 formed on the outermost edge of the first flat 212 ′.
  • the circuit board 50 is supported by the metal cylinder 220 , which is higher than the burrs 216 relative to the top of the plastic cylinder 210 ′, thus the circuit board 50 is not in contact with the burrs 216 , therefore prevents the circuit board 50 from damaging the burrs 216 and maintains the electromagnetic shielding performance of the metal layer 230 .
  • FIG. 5A is a top view of the metal cylinder in FIG. 4
  • FIG. 5B is a cross-sectional view taken along line B-B in FIG. 5A
  • the metal cylinder 220 may have a second hole 226 having an internal thread 226 a on the inner surface of the second hole 226
  • the circuit board 50 may be fixed on the cylinder structure 200 ′ by use of fastening the screw 54 in the second hole 226 through a fixing hole 56 on the circuit board 50 .
  • the metal cylinder 220 may have a first segment 220 a and a second segment 220 b , wherein the joint between the first segment 220 a and the second segment 220 b forms the aforesaid second shoulder 224 . Furthermore, one part of the first segment 220 a may protrude from the first flat 212 ′, and the second flat 222 is located on the top of the aforementioned part of the first segment 220 a , hence the ground pad 52 of the circuit board 50 is in contact with the first segment 220 a . Moreover, the first segment 220 a may have a plurality of concaves 228 spread on the outer surface thereof. The concaves 228 further enhance the fixation between the metal cylinder 220 and the plastic cylinder 210 ′.
  • the second flat is higher than the first flat relative to the top of the plastic cylinder.
  • a circuit board installed on the cylinder structure or the electronic device housing is not in contact with the metal layer on the burrs or on the plastic cylinder, alternatively, the circuit board is in contact with the metal layer on the metal cylinder.
  • the metal layer between the metal cylinder and the ground pads is consumed, the metal layer remains its electrical connection with the ground pads through the metal cylinder.
  • the electromagnetic shielding performance of the electronic device housing in the present invention is assured.
  • the plastic cylinder has a plurality of concaves spread on the outer surface thereof, which enhances the fixation between the plastic cylinder and metal cylinder.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)
US11/862,191 2007-09-26 2007-09-26 Cylinder structure Abandoned US20090081390A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US11/862,191 US20090081390A1 (en) 2007-09-26 2007-09-26 Cylinder structure
TW097108688A TW200915957A (en) 2007-09-26 2008-03-12 Boss structure and electronic device housing using the same
CN200810097029.0A CN101400230B (zh) 2007-09-26 2008-05-08 凸柱结构及运用此凸柱结构的电子装置外壳

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/862,191 US20090081390A1 (en) 2007-09-26 2007-09-26 Cylinder structure

Publications (1)

Publication Number Publication Date
US20090081390A1 true US20090081390A1 (en) 2009-03-26

Family

ID=40471938

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/862,191 Abandoned US20090081390A1 (en) 2007-09-26 2007-09-26 Cylinder structure

Country Status (3)

Country Link
US (1) US20090081390A1 (zh)
CN (1) CN101400230B (zh)
TW (1) TW200915957A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150056039A1 (en) * 2013-08-20 2015-02-26 Wistron Corporation Internally threaded post, assembling structure and assembling method
CN104777877A (zh) * 2014-01-10 2015-07-15 神讯电脑(昆山)有限公司 机壳的固定结构及其制作方法
US11006541B2 (en) * 2017-02-28 2021-05-11 Panasonic Intellectual Property Management Co., Ltd. Housing, electronic device, and method for manufacturing housing

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103458632B (zh) * 2012-06-01 2016-08-10 深圳富泰宏精密工业有限公司 电子装置壳体及其制作方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5519169A (en) * 1994-03-23 1996-05-21 Dell Usa, L.P. EMI grounding cap structure for use in mounting a printed circuit board on a plated housing boss
US6493233B1 (en) * 2001-08-21 2002-12-10 Intel Corporation PCB-to-chassis mounting schemes
US7227761B2 (en) * 2004-10-13 2007-06-05 Lenovo Singapore Pte, Ltd. Apparatus for resiliently mounting a circuit board within a device housing

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5024623A (en) * 1989-08-11 1991-06-18 Sanders Associates, Inc. Electrical circuit board mounting method
DE9406371U1 (de) * 1994-04-16 1994-06-09 Mannesmann Kienzle Gmbh, 78052 Villingen-Schwenningen Montageoptimierte Anordnung der Funktionselemente eines Taxameters

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5519169A (en) * 1994-03-23 1996-05-21 Dell Usa, L.P. EMI grounding cap structure for use in mounting a printed circuit board on a plated housing boss
US6493233B1 (en) * 2001-08-21 2002-12-10 Intel Corporation PCB-to-chassis mounting schemes
US7227761B2 (en) * 2004-10-13 2007-06-05 Lenovo Singapore Pte, Ltd. Apparatus for resiliently mounting a circuit board within a device housing

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150056039A1 (en) * 2013-08-20 2015-02-26 Wistron Corporation Internally threaded post, assembling structure and assembling method
CN104421308A (zh) * 2013-08-20 2015-03-18 纬创资通股份有限公司 螺柱、组装结构及组装方法
CN104777877A (zh) * 2014-01-10 2015-07-15 神讯电脑(昆山)有限公司 机壳的固定结构及其制作方法
US20150198189A1 (en) * 2014-01-10 2015-07-16 Getac Technology Corporation Fixing structure for casing and method for manufacturing the same
US9476440B2 (en) * 2014-01-10 2016-10-25 Getac Technology Corporation Fixing structure for casing and method for manufacturing the same
US11006541B2 (en) * 2017-02-28 2021-05-11 Panasonic Intellectual Property Management Co., Ltd. Housing, electronic device, and method for manufacturing housing

Also Published As

Publication number Publication date
TW200915957A (en) 2009-04-01
CN101400230A (zh) 2009-04-01
CN101400230B (zh) 2011-01-12

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Legal Events

Date Code Title Description
AS Assignment

Owner name: COMPAL ELECTRONICS, INC., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHEN, YUNG-HUI;LIN, PO-AN;REEL/FRAME:019917/0477

Effective date: 20070731

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION