US20100067194A1 - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
US20100067194A1
US20100067194A1 US12211957 US21195708A US2010067194A1 US 20100067194 A1 US20100067194 A1 US 20100067194A1 US 12211957 US12211957 US 12211957 US 21195708 A US21195708 A US 21195708A US 2010067194 A1 US2010067194 A1 US 2010067194A1
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Prior art keywords
heat
vapor
chamber
dissipating
dissipation
Prior art date
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Granted
Application number
US12211957
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US7684187B1 (en )
Inventor
George Anthony Meyer, IV
Chien-Hung Sun
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Celsia Technologies Taiwan Inc
Original Assignee
Celsia Technologies Taiwan Inc
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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat dissipation device includes a vapor chamber, a heat dissipating fins assembly, a cover and a fan. The vapor chamber is configured to a bent shape. The heat dissipating fins assembly is adhered to a partial surface of the vapor chamber. The cover is connected to the vapor camber. A flow passage is defined between the vapor chamber and the cover. The heat dissipating fins assembly is positioned in the flow passage. The cover defines an opening communicating to the flow passage. The fan is arranged facing to the opening of the cover and other partial surface of the vapor chamber. Therefore, the heat dissipating efficiency can be greatly improved.

Description

    BACKGROUND
  • [0001]
    The present invention relates to a heat dissipation device, and particularly to a heat dissipation device with a bent vapor chamber.
  • [0002]
    With enhancement of the calculating capability of the central processing unit (CPU), the heat generates from the CPU is becoming greater than before. A conventional heat dissipation device composed of heat dissipating fins and a fan could not meet the heat dissipating requirement of the CPU. A vapor chamber with higher heat conducting efficiency is developed. The vapor chamber is combined with the heat dissipating fins to effectively resolve the heat dissipating problems. The vapor chamber could contact the heat generating electronic element in a large area directly, and these advantages could draw more development on the merit.
  • [0003]
    A conventional heat dissipaton device includes a vapor chamber, a heat dissipating fins assembly and a fan. The vapor chamber is configured to a flat shape, and the vapor chamber is adhered to a surface of a heat generating element. The vapor chamber is also adhered to a surface of the heat dissipating fins assembly. The fan is attached to the heat dissipating fins assembly to dissipate heat from both the heat dissipating fins assembly and the vapor chamber. Therefore, heat from the heat generating element can be removed rapidly.
  • [0004]
    However, the conventional heat dissipation device has following disadvantage in practice use: when the fan dissipating heat from the heat dissipating fins assembly and the vapor chamber, the airflow can not be centralized effectively causing insufficient heat dissipation. Thus, the heat dissipating efficiency could be affected. Additionally, the vapor chamber is made in flat shape, however the outer surface thereof is adhered to the heat generating element completely, and further the heat conducting area is limited to the outer surface of the heat generating element. Thus, the heat dissipating efficiency can not be further improved efficiently. If the vapor chamber is broaden to enlarge the outer surface thereof, the other electronic elements on the circuit board may be intervened accordingly to cause the heat dissipation device not be appropriately installed and not be used therefore.
  • BRIEF SUMMARY
  • [0005]
    The present invention relates to a heat dissipation device, the heat dissipation device includes a cover covering on a heat dissipating fins assembly and a fan. The airflow from the fan can be centralized to dissipate heat from the heat dissipating fins assembly and a vapor chamber directly to enhance the efficiency of the heat dissipation.
  • [0006]
    The present invention relates to a heat dissipation device, the heat dissipation device includes a bent vapor chamber to enhance a heat conducting area thereof to enhance the efficiency of the heat dissipation.
  • [0007]
    The present invention relates to a heat dissipation device, the heat dissipation device includes a bent vapor chamber on opposite sides thereof to avoid interference with the other electronic elements of the mainboard to achieve a better applicability of installation.
  • [0008]
    The present invention relates to a heat dissipation device, the heat dissipation device includes a vapor chamber, a heat dissipating fins assembly, a cover and a fan. The vapor chamber is configured to a bent shape. The heat dissipating fins assembly is adhered to a partial surface of the vapor chamber. The cover is connected to the vapor camber. A flow passage is defined between the vapor chamber and the cover. The heat dissipating fins assembly is positioned in the flow passage. The cover defines an opening communicating to the flow passage. The fan is arranged facing to the opening of the cover and other partial surface of the vapor chamber.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • [0009]
    These and other features and advantages of the various embodiments disclosed herein will be better understood with respect to the following description and drawings, in which like numbers refer to like parts throughout, and in which:
  • [0010]
    FIG. 1 is an isometric and exploded view of an exemplary embodiment of the present invention;
  • [0011]
    FIG. 2 is an isometric and assembled view of the exemplary embodiment of the present invention;
  • [0012]
    FIG. 3 is a sectional view from 3-3 of FIG. 2;
  • [0013]
    FIG. 4 is a sectional view from 4-4 of FIG. 3; and
  • [0014]
    FIG. 5 is a practical application view of the exemplary embodiment of the present invention;
  • DETAILED DESCRIPTION
  • [0015]
    Referring to FIG. 1 and FIG. 4, a heat dissipation device of an exemplary of the present invention includes a vapor chamber 10, a heat dissipating fins assembly 20, a cover 30 and a fan 40.
  • [0016]
    The vapor chamber 10 is made in a strip structure and is configured to a bent shape. The vapor chamber 10 includes a heat absorbing portion 11 and two heat emitting portion 12 deformedly extending from opposite sides of the absorbing portion 11. The absorbing portion 11 protrudes from the surface of the emitting portions 12. The absorbing portion 11 is adhered to a surface of a heat generating element 62 (as shown in FIG. 5). A large heat dissipating area is configured at the heat dissipating portion 12 and heat absorbing portion 11. The heat generating element 62 is a CPU, a semiconductor packing part, a wafer or other electronic elements with high heat generation.
  • [0017]
    The heat dissipating fins assembly 20 is adhered to a partial surface of the vapor chamber 10, preferrably, the heat dissipating fins 20 is adhered to the surface of the emitting portions 12 tightly. The heat dissipating fins assembly 20 is configured with a plurality of heat dissipating fins 21 aligned in regular space. The heat disspating fins 21 are made from aluminum extrusion. The cover 30 is attached to the vapor chamber 10. A flow passage 32 is defined between the cover 30 and the vapor chamber 10. The heat dissipating fins assembly 20 is positioned in the flow passage 32. An opening 33 is defined in the cover 30 in communication with the flow passage 32, and a receiving space 31 is defined within the cover 30 communicating with the opening 33. A plurality of through holes 34 communicating with the opening 33 is defined in the surface of the cover 30. The holes 34 are defined adjacent to the opening 33. A hook 35 is formed at each lateral side of the cover 30. The two hooks 35 are buckled to the two opposite sides of the heat emitting portion 12 of the vapor chamber 10.
  • [0018]
    The fan 40 is assembled within the receiving space 31, and facing to the opening 33 and a top surface of the vapor chamber 10. The fan 40 includes a bracket 41. A plurality of screw holes 42 is defined in the bracket 41 corresponding to the through holes 34. A screw 50 can be fastened through each screw hole 42 and the corresponding through hole 34. The fan 40 can be an axial fan or a centrifugal fan.
  • [0019]
    Referring to FIG. 1 and FIG. 2, when assembling the heat dissipation device, the heat dissipating fins assembly 20 is first attached to an outer surface of the emitting portion 12 of the vapor chamber 10. The heat dissipating fins assembly 20 can be fixed to the emitting portion 12 by welding. The fan 40 is then mounted in the receiving space 31 of the cover 30 by fastening the screws 50 to the screw holes 42 of the bracket 41 and the corresponding through holes 34 of the cover 30. Finally, the hooks 35 are buckled to the opposite sides of the heat emitting portion 12 of the vapor chamber 10 to assembling the cover 30 to the vapor chamber 10. The cover 30 can be fixed to the vapor chamber 10 by welding
  • [0020]
    Referring also to FIG. 5, the heat dissipation device of the exemplary embodiment of the invention is used in an electronic product 60. The electronic product 60 includes a mainboard 61, a heat generating element 62 and a plurality of electronic elements 63. First, after the heat absorbing portion 11 is adhered to the surface of the heat generating element 62, heat from the heat generating element is conducted to the heat dissipating fins assembly 20 via the vapor chamber 10. Heat from the dissipating fins assembly 20 and the vapor chamber 10 can be dissipated by the fan 40 directly, thereby the heat can be rapidly brought away through the flow passage 32. The heat dissipating efficiently is therefore improved.
  • [0021]
    The heat emitting portions 12 extending from the heat absorbing portion 11 can enhance the conducting area of the vapor camber 10 to improve the heat dissipating efficiently.
  • [0022]
    The heat emitting portions 12 are higher than the heat absorbing portion 11. The heat emitting portions 12 can not only enhance the heat conducting area but also avoid interference with the electronic elements 63 of the mainboard 61. The heat dissipation device can be used in anyone of the heat generating elements 62 on the mainboard 61, regardless of the positions of electronic elements 63 around the heat generating element 62 which can lead to an incapable of the installation. Therefore, the heat dissipation device of the exemplary of the present invention has a better applicability of installation.
  • [0023]
    The heat dissipation device of the exemplary of the present invention may be used in the electronic product 60 with a thin thickness, such as notebook computers, personal digital assitants (PDAs), and so on.
  • [0024]
    The above description is given by way of example, and not limitation. Given the above disclosure, one skilled in the art could devise variations that are within the scope and spirit of the invention disclosed herein, including configurations ways of the recessed portions and materials and/or designs of the attaching structures. Further, the various features of the embodiments disclosed herein can be used alone, or in varying combinations with each other and are not intended to be limited to the specific combination described herein. Thus, the scope of the claims is not to be limited by the illustrated embodiments.

Claims (11)

  1. 1. A heat dissipation device, comprising
    a vapor chamber, configured to a bent shape;
    a heat dissipating fins assembly, adhered to a partial surface of the vapor chamber;
    a cover, connected to the vapor camber, a flow passage defined between the vapor chamber and the cover, the heat dissipating fins assembly positioned in the flow passage, and the cover defining an opening communicating to the flow passage; and
    a fan, arranged facing to the opening of the cover and a top surface of the vapor chamber,
    wherein a hook is formed at each lateral side of the cover, and the two hooks are buckled to the two opposite sides of the vapor chamber.
  2. 2. The heat dissipation device as claimed in claim 1, wherein the vapor chamber is made in a strip shape.
  3. 3. The heat dissipation device as claimed in claim 1, wherein the vapor chamber comprises a heat absorbing portion and two heat emitting portions deformedly extending from opposite sides of the heat absorbing portion.
  4. 4. (canceled)
  5. 5. The heat dissipation device as claimed in claim 3, wherein the heat emitting portion is adhered to the heat dissipating fins assembly.
  6. 6. (canceled)
  7. 7. The heat dissipation device as claimed in claim 1, wherein the heat disspating fins are made by aluminum extrusion.
  8. 8. The heat dissipation device as claimed in claim 1, wherein a receiving space is defined in the cover communicating with the flow passage, and the fan is received in the receiving space.
  9. 9. (canceled)
  10. 10. The heat dissipation device as claimed in claim 1, wherein the fan comprises a bracket, a plurality of screw holes is defined in the bracket, a plurality of through holes is defined in the cover corresponding to the screw holes, and a screw is fastened through each screw hole and the corresponding through hole.
  11. 11. The heat dissipation device as claimed in claim 1, wherein the fan is an axial fan.
US12211957 2008-09-17 2008-09-17 Heat dissipation device Active US7684187B1 (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2384108A3 (en) * 2010-04-27 2011-12-14 Giga-Byte Technology Co., Ltd. Dust-disposal heat-dissipation device with double cooling fans
DE202012000325U1 (en) 2012-01-13 2012-03-05 Osram Ag LED module with improved cooling
US20130319641A1 (en) * 2012-06-01 2013-12-05 Asustek Computer Inc. Heat dissipating module
WO2015167419A1 (en) * 2014-04-28 2015-11-05 Hewlett-Packard Development Company, L.P. A heat-dissipating device including a vapor chamber and a radial fin assembly
US20160091264A1 (en) * 2014-09-28 2016-03-31 Sungrow Power Supply Co., Ltd. Inverter heat-dissipation device and inverter
US20170153676A1 (en) * 2015-11-27 2017-06-01 Inventec (Pudong) Technology Corporation Heat dissipation component

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090223651A1 (en) * 2008-03-06 2009-09-10 Meyer Iv George Anthony Panel heat-dissipating device
CN101754657B (en) * 2008-12-10 2013-04-24 富准精密工业(深圳)有限公司 Radiating device
CN102236397B (en) * 2010-04-30 2015-04-01 技嘉科技股份有限公司 Double-fan heat dissipation device with dust extraction function as well as control circuit and fin group thereof
US8331091B2 (en) * 2010-09-01 2012-12-11 Hamilton Sundstrand Corporation Electronics package with radial heat sink and integrated blower
KR20120073619A (en) * 2010-12-27 2012-07-05 삼성전자주식회사 Cooling apparatus and display device having the same
CN104202949B (en) * 2014-08-28 2017-07-28 北京京东方茶谷电子有限公司 A heat dissipation device and a portable device
CN105744798A (en) * 2014-12-08 2016-07-06 鸿富锦精密工业(武汉)有限公司 Heat radiation device
CN105744799A (en) * 2014-12-12 2016-07-06 鸿富锦精密工业(武汉)有限公司 Heat dissipation apparatus and heat dissipation system

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US5924481A (en) * 1995-06-22 1999-07-20 Calsonic Corporation Cooling device for electronic component
US6109341A (en) * 1998-04-30 2000-08-29 Sanyo Denki Co., Ltd. Electronic component cooling apparatus including elongated heat sink
US6834712B2 (en) * 2001-11-27 2004-12-28 Thermotek, Inc. Stacked low profile cooling system and method for making same
US6840311B2 (en) * 2003-02-25 2005-01-11 Delphi Technologies, Inc. Compact thermosiphon for dissipating heat generated by electronic components
US6913070B2 (en) * 2003-09-03 2005-07-05 Chin Wen Wang Planar heat pipe structure
US7051791B2 (en) * 2003-09-16 2006-05-30 Sony Corporation Cooling apparatus and electronic equipment
US7150312B2 (en) * 2001-11-27 2006-12-19 Thermotek, Inc. Stacked low profile cooling system and method for making same
US7277285B2 (en) * 2004-04-07 2007-10-02 Delta Electronics, Inc. Heat dissipation module
US7342785B2 (en) * 2005-04-22 2008-03-11 Foxconn Technology Co., Ltd. Cooling device incorporating boiling chamber
US7382616B2 (en) * 2005-01-21 2008-06-03 Nvidia Corporation Cooling system for computer hardware
US20080266800A1 (en) * 2007-04-30 2008-10-30 Lankston Robert J Heat sink with surface-formed vapor chamber base
US7497249B2 (en) * 2007-03-30 2009-03-03 Delphi Technologies, Inc. Thermosiphon for laptop computer
US7529090B2 (en) * 2007-08-29 2009-05-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US7583502B2 (en) * 2006-06-13 2009-09-01 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC)

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5924481A (en) * 1995-06-22 1999-07-20 Calsonic Corporation Cooling device for electronic component
US6109341A (en) * 1998-04-30 2000-08-29 Sanyo Denki Co., Ltd. Electronic component cooling apparatus including elongated heat sink
US7150312B2 (en) * 2001-11-27 2006-12-19 Thermotek, Inc. Stacked low profile cooling system and method for making same
US6834712B2 (en) * 2001-11-27 2004-12-28 Thermotek, Inc. Stacked low profile cooling system and method for making same
US6840311B2 (en) * 2003-02-25 2005-01-11 Delphi Technologies, Inc. Compact thermosiphon for dissipating heat generated by electronic components
US6913070B2 (en) * 2003-09-03 2005-07-05 Chin Wen Wang Planar heat pipe structure
US7051791B2 (en) * 2003-09-16 2006-05-30 Sony Corporation Cooling apparatus and electronic equipment
US7458415B2 (en) * 2003-09-16 2008-12-02 Sony Corporation Cooling apparatus and electronic equipment
US7277285B2 (en) * 2004-04-07 2007-10-02 Delta Electronics, Inc. Heat dissipation module
US7382616B2 (en) * 2005-01-21 2008-06-03 Nvidia Corporation Cooling system for computer hardware
US7342785B2 (en) * 2005-04-22 2008-03-11 Foxconn Technology Co., Ltd. Cooling device incorporating boiling chamber
US7583502B2 (en) * 2006-06-13 2009-09-01 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC)
US7497249B2 (en) * 2007-03-30 2009-03-03 Delphi Technologies, Inc. Thermosiphon for laptop computer
US20080266800A1 (en) * 2007-04-30 2008-10-30 Lankston Robert J Heat sink with surface-formed vapor chamber base
US7529090B2 (en) * 2007-08-29 2009-05-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2384108A3 (en) * 2010-04-27 2011-12-14 Giga-Byte Technology Co., Ltd. Dust-disposal heat-dissipation device with double cooling fans
DE202012000325U1 (en) 2012-01-13 2012-03-05 Osram Ag LED module with improved cooling
US20130319641A1 (en) * 2012-06-01 2013-12-05 Asustek Computer Inc. Heat dissipating module
US9383787B2 (en) * 2012-06-01 2016-07-05 Asustek Computer Inc. Heat dissipating module
WO2015167419A1 (en) * 2014-04-28 2015-11-05 Hewlett-Packard Development Company, L.P. A heat-dissipating device including a vapor chamber and a radial fin assembly
US20160091264A1 (en) * 2014-09-28 2016-03-31 Sungrow Power Supply Co., Ltd. Inverter heat-dissipation device and inverter
US20170153676A1 (en) * 2015-11-27 2017-06-01 Inventec (Pudong) Technology Corporation Heat dissipation component
US9720466B2 (en) * 2015-11-27 2017-08-01 Inventec (Pudong) Technology Corporation Heat dissipation component

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Owner name: CELSIA TECHNOLOGIES TAIWAN, INC.,TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MEYER IV, GEORGE ANTHONY;SUN, CHIEN-HUNG;REEL/FRAME:021541/0783

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