US20080113588A1 - Gemstone Polishing Device and Method of Polishing - Google Patents

Gemstone Polishing Device and Method of Polishing Download PDF

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Publication number
US20080113588A1
US20080113588A1 US11/817,426 US81742606A US2008113588A1 US 20080113588 A1 US20080113588 A1 US 20080113588A1 US 81742606 A US81742606 A US 81742606A US 2008113588 A1 US2008113588 A1 US 2008113588A1
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US
United States
Prior art keywords
polishing
tang
axis
pedestal
insert
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/817,426
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English (en)
Inventor
Moshe Kelman
Menachem Moalem
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Individual
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Individual
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Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of US20080113588A1 publication Critical patent/US20080113588A1/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/16—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs
    • B24B9/161—Dops, dop holders

Definitions

  • the present device relates to the field of gemstones polishing devices, and particularly to the devices for polishing diamonds.
  • Diamonds are polished on a rotating polishing wheel. For polishing, they are held with the help of a dop and a tang.
  • Tang is an elongated device consisting of two main parts: the rear end or butt and the front part or clamp that extends forward from the butt. Usually two screws are inserted in the rear end of the tang. Rotation of the screws in the course of the leveling process changes the spatial position of the tang.
  • the front end of the tang is usually an assembly of a number of parts such as dop and dop holder that allows for dop rotation or facet switching.
  • the assembly of the dop and dop holder is not rigid enough and when the polisher switches from one facet to the next, or slides with the tang on the table around the polishing wheel, the assembly changes its spatial position. This spatial position change has a negative effect on the facet angle of the polished diamond.
  • FIG. 1 is a schematic illustration of the tang and the polishing wheel
  • FIG. 2 is a schematic cross sectional cut of front part of the tang of FIG. 1 .
  • FIG. 3 is a schematic illustration of the tang leveling sequence with a level placed on a pedestal.
  • FIG. 4 is a schematic illustration of another embodiment of the tang
  • FIG. 1 is a schematic illustration of a device for polishing diamonds.
  • Device 100 which is a tang, includes an elongated body 102 having a rear part 104 and a front part 108 .
  • Rear part 104 houses two spaced apart screws 112 and 114 . Rotation of screws 112 and 114 changes the spatial position of tang 100 . Change of spatial position may be performed in both pitch 118 and roll 120 direction.
  • Disposed in front part 108 are a removable linear level 124 and a conventional dop 128 for holding a gemstone or a diamond 122 in course of the polishing operation. Dop 128 supports rotation of gemstone 122 from one facet to another facet as well as gemstone polishing angle adjustment.
  • Numeral 110 marks a polishing surface of a polishing wheel 116 .
  • FIGS. 2 is cross sectional cut of front part 108 of tang 100 .
  • Front part 108 further includes a fixed insert (bushing) 130 .
  • Insert 130 is held in place by a fixing screw 134 .
  • insert 130 may be a tight fit insert pressed in front part 108 of tang 100 .
  • Insert 130 is substantially longer than the thickness t of front part 108 and it has its upper end face 138 and lower end face 136 machined.
  • An assembly 142 that includes a mushroom form pedestal 140 and dop holder 144 is located in front end 108 .
  • Pedestal 140 or any other arrangement for holding level 124 , has guiding means 146 , which may be a protrusion or a recess or simply flat surface and a tubular cylindrical stem 148 .
  • Guiding means 146 which are shown as a protrusion, serve as an axis for level 124 rotation.
  • the outer surface of stem 148 mechanically interfaces with the inner surface of insert 130 and actually resides within insert 130 .
  • the inner surface of stem 148 couples with dop holder 144 .
  • Holder 144 has a section 152 having external diameter larger that the external diameter of insert 130 .
  • Surface 156 of section 152 that is in contact with surface 136 of insert 130 is machined.
  • the length of stem 148 is divided into two sections.
  • One of the sections 150 that extends from pedestal 140 has a diameter larger than the rest of stem 148 .
  • Section 150 ends by a steep edge leaning on machined end face 138 of insert 130 .
  • Screw 154 tensions and locks dop holder 144 with stem 148 and with insert 130 .
  • Screw 154 locks extension 148 to machined end face 136 of insert 130 against a spring 158 .
  • Dop holder 144 couples with stem 148 of pedestal 140 and subsequently with insert 130 along a common axis 160 .
  • Pin 164 associated with dop holder 144 engages a slot in stem 148 and prevents rotation of dop holder 144 relative to pedestal 140 .
  • Axis 160 defined by the assembly of pedestal 140 and dop holder 144 has a fixed spatial position with respect to elongated body 102 of tang 100 .
  • Stem 148 further includes two O-rings 168 and 170 .
  • O-rings 168 and 170 are hermetically closing the mechanical interface between stem 148 and insert 130 .
  • O-rings 168 and 170 sit tight within insert 130 , providing enough friction that prevents occasional rotation of assembly 142 , of pedestal 140 and dop holder 144 relatively to elongated tang body 102 during the polishing.
  • O-rings 168 and 170 prevent dirt and abrasive dust that may be present in the course of the gemstone or diamond polishing process from entering into the interface area.
  • axis 160 For polishing a diamond tang 100 is leveled by screws 112 and 114 in such a way, that axis 160 becomes orthogonal to polishing (faceting) surface 110 ( FIG. 1 .). The leveling process takes place upon completion of the first facet polishing. Once oriented in such a way axis 160 always returns to its spatial orientation upon completion of the next facet polishing, may indicate to the operator the end of the facet polishing process. Since the length of insert 130 substantially exceeds the thickness t of front part 108 it makes assembly of 142 , of pedestal 140 and dop holder 144 that lean on both ends of insert 130 sufficiently rigid. Due to the rigidity of assembly 142 axis 160 maintains its spatial orientation in course of diamond polishing with respect to tang body 102 .
  • axis 160 The axial movement of axis 160 is restricted by the tension applied by spring 158 to machined end-faces 136 and 156 and pin 164 restricts rotational movement of pedestal 140 with respect to dop holder 144 .
  • O-rings 168 and 170 prevent occasional free rotation of assembly 142 and accordingly of pedestal 140 relatively to elongated tang body 102 .
  • the extended length of insert 130 and associated with it assembly 142 provides a more stable support for axis 160 and effectively reduces or eliminates any axis 160 wondering.
  • Level 124 provides visual feedback or control of the spatial position of axis 160 in the course of the leveling process.
  • Level 124 may be positioned on surface 174 of pedestal 140 .
  • Level 124 has guiding means implemented as a circular depression coupled with guiding means (protrusion) 146 of pedestal 140 .
  • Level 124 may have guiding means implemented as a protrusion if the pedestal guiding means are implemented as a recess.
  • Guiding means 146 serve as an axis and level 124 may be rotated on them 360 degrees or at least 90 degrees. For control of the leveling accuracy of tang 100 and rigidly associated with it axis 160 level 124 as shown in FIGS.
  • 3A and 3B is oriented sequentially along two mutually orthogonal axes such as X-axis and Y-axis or vise versa.
  • level 124 readings are taken in two positions. The first position reading is taken when level 124 is oriented along X or Y axis, where for the second position reading pedestal 140 is rotated 180 degrees.
  • dop 128 is released and rotated on a predefined angle and the next diamond 122 facet polishing process may begin.
  • the leveling process may be simplified by the use of a round or bubble level, although the accuracy of the commercially available levels is not sufficient for this purpose. Due to the rigidity of assembly of pedestal 140 and dop holder 144 axis 160 returns at the end of facet polishing to its orthogonal position to the polishing disk surface 110 making all of the facet angles equal.
  • tang 190 has an elongated body 192 having front end 198 and rear end 194 .
  • Front end 198 is substantially thicker than the rest of body 192 and it has a machined surface 200 . This thickness is comparable with the length of insert 130 and is selected such as to provide the rigidity required to prevent axis 160 wondering.
  • the disclosed method of polishing diamonds 122 is characterized in that diamonds 122 to be polished are held by a tang 100 having a rigid axis 160 leveled once to be orthogonal to polishing surface 110 .
  • Axis 160 returns to its leveled spatial orientation at the completion of each facet polishing process.
  • Axis 160 maintains its spatial orientation with respect to the body 102 of tang 100 in the course of diamond polishing and when diamond 122 position is switched (rotated) between the facets to be polished.
  • the method of polishing gemstones and in particular diamonds disclosed leads to better quality of the polished diamonds and ensures higher yield of the polishing process.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
US11/817,426 2005-03-14 2006-02-28 Gemstone Polishing Device and Method of Polishing Abandoned US20080113588A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IL16742305 2005-03-14
IL167423 2005-03-14
PCT/IL2006/000264 WO2006097915A2 (en) 2005-03-14 2006-02-28 A gemstone polishing device and a method of polishing

Publications (1)

Publication Number Publication Date
US20080113588A1 true US20080113588A1 (en) 2008-05-15

Family

ID=36992118

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/817,426 Abandoned US20080113588A1 (en) 2005-03-14 2006-02-28 Gemstone Polishing Device and Method of Polishing

Country Status (6)

Country Link
US (1) US20080113588A1 (zh)
EP (1) EP1871571A2 (zh)
CN (1) CN101137462A (zh)
RU (1) RU2007138041A (zh)
WO (1) WO2006097915A2 (zh)
ZA (1) ZA200708626B (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110010954A1 (en) * 2009-07-16 2011-01-20 Frederick Rowe Grinding angle bubble level jig
JPWO2013031772A1 (ja) * 2011-08-31 2015-03-23 高知Ｆｅｌ株式会社 ダイヤモンド研磨装置
RU2548335C1 (ru) * 2013-11-06 2015-04-20 Владимир Юрьевич Карасев Способ изготовления изделий из алмазов
WO2019042850A1 (en) * 2017-09-01 2019-03-07 Octonus Finland Oy IMPROVED METHOD OF CONTROLLING POLISHING OF PRECIOUS STONES

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102309097A (zh) * 2011-08-12 2012-01-11 深圳市星光达珠宝首饰实业有限公司 湿式离心滚桶机

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US558909A (en) * 1896-04-21 Diamond-polishing tool
US1103698A (en) * 1913-06-12 1914-07-14 Edgard Soetens Mechanical dop for polishing (cutting) diamonds.
US2530421A (en) * 1942-02-21 1950-11-21 Thomas P N Burness Appliance for use in cutting and polishing diamonds and other substances
US2534384A (en) * 1942-03-31 1950-12-19 Spira Josef Hillel Apparatus for polishing or forming facets on gems, diamonds, or the like
US3559349A (en) * 1968-01-25 1971-02-02 Takahiro Imahashi Faceting machine
US5435774A (en) * 1994-02-04 1995-07-25 Naujok; Robert Apparatus for holding gemstones to be polished

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2249743B (en) * 1987-11-20 1992-09-16 Diamond Trading Co Ltd Working a multi-grain facet of a gemstone

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US558909A (en) * 1896-04-21 Diamond-polishing tool
US1103698A (en) * 1913-06-12 1914-07-14 Edgard Soetens Mechanical dop for polishing (cutting) diamonds.
US2530421A (en) * 1942-02-21 1950-11-21 Thomas P N Burness Appliance for use in cutting and polishing diamonds and other substances
US2534384A (en) * 1942-03-31 1950-12-19 Spira Josef Hillel Apparatus for polishing or forming facets on gems, diamonds, or the like
US3559349A (en) * 1968-01-25 1971-02-02 Takahiro Imahashi Faceting machine
US5435774A (en) * 1994-02-04 1995-07-25 Naujok; Robert Apparatus for holding gemstones to be polished

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110010954A1 (en) * 2009-07-16 2011-01-20 Frederick Rowe Grinding angle bubble level jig
US7987608B2 (en) * 2009-07-16 2011-08-02 Frederick Rowe Grinding angle bubble level jig
JPWO2013031772A1 (ja) * 2011-08-31 2015-03-23 高知Ｆｅｌ株式会社 ダイヤモンド研磨装置
RU2548335C1 (ru) * 2013-11-06 2015-04-20 Владимир Юрьевич Карасев Способ изготовления изделий из алмазов
WO2019042850A1 (en) * 2017-09-01 2019-03-07 Octonus Finland Oy IMPROVED METHOD OF CONTROLLING POLISHING OF PRECIOUS STONES
BE1025522B1 (nl) * 2017-09-01 2019-04-04 Octonus Finland Oy Verbeterde werkwijze voor het controleren van het slijpen van edelstenen
CN111051001A (zh) * 2017-09-01 2020-04-21 奥克托努斯芬兰有限公司 控制宝石的抛光的改进方法
US20210129286A1 (en) * 2017-09-01 2021-05-06 Octonus Finland Oy Improved method for controlling the polishing of gemstones
US11673228B2 (en) * 2017-09-01 2023-06-13 Octonus Finland Oy Method for controlling the polishing of gemstones

Also Published As

Publication number Publication date
RU2007138041A (ru) 2009-04-20
CN101137462A (zh) 2008-03-05
WO2006097915A3 (en) 2006-12-07
EP1871571A2 (en) 2008-01-02
WO2006097915A2 (en) 2006-09-21
ZA200708626B (en) 2008-10-29

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