US20070169853A1 - Magnetic sputter targets manufactured using directional solidification - Google Patents

Magnetic sputter targets manufactured using directional solidification Download PDF

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Publication number
US20070169853A1
US20070169853A1 US11/336,980 US33698006A US2007169853A1 US 20070169853 A1 US20070169853 A1 US 20070169853A1 US 33698006 A US33698006 A US 33698006A US 2007169853 A1 US2007169853 A1 US 2007169853A1
Authority
US
United States
Prior art keywords
metal alloy
target
sputter target
dendrites
sputter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/336,980
Other languages
English (en)
Inventor
Bernd Kunkel
David Long
Abdelouahab Ziani
Anirban Das
Jun Hui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heraeus Inc
Original Assignee
Heraeus Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Inc filed Critical Heraeus Inc
Priority to US11/336,980 priority Critical patent/US20070169853A1/en
Assigned to HERAEUS, INC. reassignment HERAEUS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUI, JUN, DAS, ANIRBAN, LONG, DAVID, ZIANI, ABDELOUAHAB, KUNKEL, BERND
Priority to CZ20060199A priority patent/CZ2006199A3/cs
Priority to TW095111293A priority patent/TW200728485A/zh
Priority to EP06251839A priority patent/EP1811050A3/en
Priority to SG200602206-5A priority patent/SG134200A1/en
Priority to CNA2006100754606A priority patent/CN101008075A/zh
Priority to JP2006137075A priority patent/JP2007197811A/ja
Priority to KR1020060045574A priority patent/KR20070077427A/ko
Publication of US20070169853A1 publication Critical patent/US20070169853A1/en
Abandoned legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D27/00—Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting
    • B22D27/04—Influencing the temperature of the metal, e.g. by heating or cooling the mould
    • B22D27/045—Directionally solidified castings
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/007—Alloys based on nickel or cobalt with a light metal (alkali metal Li, Na, K, Rb, Cs; earth alkali metal Be, Mg, Ca, Sr, Ba, Al Ga, Ge, Ti) or B, Si, Zr, Hf, Sc, Y, lanthanides, actinides, as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/07—Alloys based on nickel or cobalt based on cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
US11/336,980 2006-01-23 2006-01-23 Magnetic sputter targets manufactured using directional solidification Abandoned US20070169853A1 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
US11/336,980 US20070169853A1 (en) 2006-01-23 2006-01-23 Magnetic sputter targets manufactured using directional solidification
CZ20060199A CZ2006199A3 (cs) 2006-01-23 2006-03-24 Magnetické rozprasovací elektrody zhotovené za pouzití rízeného tuhnutí
TW095111293A TW200728485A (en) 2006-01-23 2006-03-30 Magentic sputter targets manufactured using directional solidification
EP06251839A EP1811050A3 (en) 2006-01-23 2006-03-31 Magnetic sputter targets manufactured using directional solidification
SG200602206-5A SG134200A1 (en) 2006-01-23 2006-04-03 Magnetic sputter targets manufactured using directional solidification
CNA2006100754606A CN101008075A (zh) 2006-01-23 2006-04-21 用定向凝固法制造的磁性溅射靶
JP2006137075A JP2007197811A (ja) 2006-01-23 2006-05-16 スパッタ・ターゲット
KR1020060045574A KR20070077427A (ko) 2006-01-23 2006-05-22 방향성 응고를 이용하여 제조된 자기 스퍼터 타겟

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/336,980 US20070169853A1 (en) 2006-01-23 2006-01-23 Magnetic sputter targets manufactured using directional solidification

Publications (1)

Publication Number Publication Date
US20070169853A1 true US20070169853A1 (en) 2007-07-26

Family

ID=37909762

Family Applications (1)

Application Number Title Priority Date Filing Date
US11/336,980 Abandoned US20070169853A1 (en) 2006-01-23 2006-01-23 Magnetic sputter targets manufactured using directional solidification

Country Status (8)

Country Link
US (1) US20070169853A1 (ko)
EP (1) EP1811050A3 (ko)
JP (1) JP2007197811A (ko)
KR (1) KR20070077427A (ko)
CN (1) CN101008075A (ko)
CZ (1) CZ2006199A3 (ko)
SG (1) SG134200A1 (ko)
TW (1) TW200728485A (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080083616A1 (en) * 2006-10-10 2008-04-10 Hitachi Metals, Ltd. Co-Fe-Zr BASED ALLOY SPUTTERING TARGET MATERIAL AND PROCESS FOR PRODUCTION THEREOF
CN103261469A (zh) * 2010-12-17 2013-08-21 吉坤日矿日石金属株式会社 强磁性材料溅射靶
WO2016183502A1 (en) * 2015-05-14 2016-11-17 Materion Corporation Sputtering target

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5397755B2 (ja) * 2008-06-17 2014-01-22 日立金属株式会社 軟磁性膜形成用Ｆｅ−Ｃｏ系合金スパッタリングターゲット材
KR20140029456A (ko) * 2011-04-29 2014-03-10 프랙스에어 에스.티. 테크놀로지, 인코포레이티드 원통형 스퍼터 타깃 조립체를 형성하는 방법
CN102383100A (zh) * 2011-11-22 2012-03-21 宁波江丰电子材料有限公司 防止反溅射物质剥落的靶材及膜层的形成方法
CN103114264B (zh) * 2012-12-28 2015-04-08 中国神华能源股份有限公司 一种溅射用铜铟合金靶材的制备方法
JP7086514B2 (ja) * 2015-12-28 2022-06-20 Ｊｘ金属株式会社 コバルト製又はコバルト基合金製スパッタリングターゲット及びその製造方法
CN117904581B (zh) * 2024-03-15 2024-06-14 中南大学 一种高强韧纳米多层金属复合材料及其梯度界面设计方法

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4062399A (en) * 1975-12-22 1977-12-13 Howmet Turbine Components Corporation Apparatus for producing directionally solidified castings
US4180119A (en) * 1978-09-18 1979-12-25 Howmet Turbine Components Corporation Mold for directionally solidified single crystal castings and method for preparing same
US5590389A (en) * 1994-12-23 1996-12-31 Johnson Matthey Electronics, Inc. Sputtering target with ultra-fine, oriented grains and method of making same
US5841669A (en) * 1996-01-26 1998-11-24 Howmet Research Corporation Solidification control including pattern recognition
US6257311B1 (en) * 1999-04-28 2001-07-10 Howmet Research Corporation Horizontal directional solidification
US6263951B1 (en) * 1999-04-28 2001-07-24 Howmet Research Corporation Horizontal rotating directional solidification
US6276432B1 (en) * 1999-06-10 2001-08-21 Howmet Research Corporation Directional solidification method and apparatus
US6514358B1 (en) * 2000-04-05 2003-02-04 Heraeus, Inc. Stretching of magnetic materials to increase pass-through-flux (PTF)
US20040011439A1 (en) * 1998-06-23 2004-01-22 Howmet Research Corporation Directionally solidified casting with improved transverse stress rupture strength
US20040188249A1 (en) * 2001-04-11 2004-09-30 Heraeus, Inc. Mechanically alloyed precious metal magnetic sputtering targets fabricated using rapidly solidified alloy powders and elemental Pt metal
US6896030B2 (en) * 2003-07-30 2005-05-24 Howmet Corporation Directional solidification method and apparatus
US20050155677A1 (en) * 2004-01-08 2005-07-21 Wickersham Charles E.Jr. Tantalum and other metals with (110) orientation

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63238268A (ja) * 1987-03-27 1988-10-04 Hitachi Ltd スパツタリング用タ−ゲツトの製造法
JPH02200775A (ja) * 1989-01-31 1990-08-09 Daido Steel Co Ltd スパッタリング用ターゲットおよびその製造方法
DE19710903A1 (de) * 1997-03-15 1998-09-17 Leybold Materials Gmbh Sputtertarget zur Herstellung von Phase-Change Schichten (optischen Speicherschichten)
US6878250B1 (en) * 1999-12-16 2005-04-12 Honeywell International Inc. Sputtering targets formed from cast materials
US7381282B2 (en) * 2004-04-07 2008-06-03 Hitachi Metals, Ltd. Co alloy target and its production method, soft magnetic film for perpendicular magnetic recording and perpendicular magnetic recording medium
US20070051623A1 (en) * 2005-09-07 2007-03-08 Howmet Corporation Method of making sputtering target and target

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4062399A (en) * 1975-12-22 1977-12-13 Howmet Turbine Components Corporation Apparatus for producing directionally solidified castings
US4180119A (en) * 1978-09-18 1979-12-25 Howmet Turbine Components Corporation Mold for directionally solidified single crystal castings and method for preparing same
US5590389A (en) * 1994-12-23 1996-12-31 Johnson Matthey Electronics, Inc. Sputtering target with ultra-fine, oriented grains and method of making same
US5841669A (en) * 1996-01-26 1998-11-24 Howmet Research Corporation Solidification control including pattern recognition
US20040011439A1 (en) * 1998-06-23 2004-01-22 Howmet Research Corporation Directionally solidified casting with improved transverse stress rupture strength
US6263951B1 (en) * 1999-04-28 2001-07-24 Howmet Research Corporation Horizontal rotating directional solidification
US6257311B1 (en) * 1999-04-28 2001-07-10 Howmet Research Corporation Horizontal directional solidification
US6276432B1 (en) * 1999-06-10 2001-08-21 Howmet Research Corporation Directional solidification method and apparatus
US6510889B2 (en) * 1999-06-10 2003-01-28 Howmet Research Corporation Directional solidification method and apparatus
US6514358B1 (en) * 2000-04-05 2003-02-04 Heraeus, Inc. Stretching of magnetic materials to increase pass-through-flux (PTF)
US20040188249A1 (en) * 2001-04-11 2004-09-30 Heraeus, Inc. Mechanically alloyed precious metal magnetic sputtering targets fabricated using rapidly solidified alloy powders and elemental Pt metal
US6896030B2 (en) * 2003-07-30 2005-05-24 Howmet Corporation Directional solidification method and apparatus
US20050155677A1 (en) * 2004-01-08 2005-07-21 Wickersham Charles E.Jr. Tantalum and other metals with (110) orientation

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080083616A1 (en) * 2006-10-10 2008-04-10 Hitachi Metals, Ltd. Co-Fe-Zr BASED ALLOY SPUTTERING TARGET MATERIAL AND PROCESS FOR PRODUCTION THEREOF
CN103261469A (zh) * 2010-12-17 2013-08-21 吉坤日矿日石金属株式会社 强磁性材料溅射靶
WO2016183502A1 (en) * 2015-05-14 2016-11-17 Materion Corporation Sputtering target
US20160336155A1 (en) * 2015-05-14 2016-11-17 Materion Corporation Cobalt, iron, boron, and/or nickel alloy-containing articles and methods for making same
US10199203B2 (en) 2015-05-14 2019-02-05 Materion Corporation Cobalt, iron, boron, and/or nickel alloy-containing articles and methods for making same
RU2717767C2 (ru) * 2015-05-14 2020-03-25 Материон Корпорейшн Распыляемая мишень
US11101118B2 (en) 2015-05-14 2021-08-24 Materion Corporation Cobalt, iron, boron, and/or nickel alloy-containing articles and methods for making same

Also Published As

Publication number Publication date
KR20070077427A (ko) 2007-07-26
SG134200A1 (en) 2007-08-29
EP1811050A2 (en) 2007-07-25
EP1811050A3 (en) 2009-02-18
CZ2006199A3 (cs) 2007-08-01
TW200728485A (en) 2007-08-01
CN101008075A (zh) 2007-08-01
JP2007197811A (ja) 2007-08-09

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Legal Events

Date Code Title Description
AS Assignment

Owner name: HERAEUS, INC., ARIZONA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KUNKEL, BERND;LONG, DAVID;ZIANI, ABDELOUAHAB;AND OTHERS;REEL/FRAME:017486/0217;SIGNING DATES FROM 20051220 TO 20051230

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION