US20060164817A1 - Communication module - Google Patents

Communication module Download PDF

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Publication number
US20060164817A1
US20060164817A1 US10/562,630 US56263005A US2006164817A1 US 20060164817 A1 US20060164817 A1 US 20060164817A1 US 56263005 A US56263005 A US 56263005A US 2006164817 A1 US2006164817 A1 US 2006164817A1
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United States
Prior art keywords
communication module
flexible printed
stem
printed circuit
circuit board
Prior art date
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Abandoned
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US10/562,630
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English (en)
Inventor
Kyouhiro Yoshida
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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Assigned to SUMITOMO ELECTRIC INDUSTRIES, LTD. reassignment SUMITOMO ELECTRIC INDUSTRIES, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: YOSHIDA, KYOUHIRO
Publication of US20060164817A1 publication Critical patent/US20060164817A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/062—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
    • H01S5/06226—Modulation at ultra-high frequencies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit

Definitions

  • the present invention relates to a communication module that has a package structure comprising a stem and a cap, and in particular, to a communication module that exhibits an excellent high frequency characteristic, allows a high rate communication to be performed, and that is the most suitable for optical communications.
  • FIG. 6 (A) is a front elevational view of the longitudinal cross-sectional structure of a conventional optical receiver module
  • FIG. 6 (B) is a plan view of a stem thereof as viewed from a BOARD connection side.
  • the optical receiver module 100 as shown in FIG. 6 (A) includes a photodiode (PD) 101 , the stem 102 bearing the PD 101 , and a cap 104 having, in its top portion, a light-collective lens 103 and so disposed as to cover the PD 101 .
  • the PD 101 which is mounted on a sub-mount 105 fixed on the stem 102 , receives, via the light-collective lens 103 , an incident light from an optical fiber 200 fixed above the lens 103 .
  • the stem 102 includes a plurality of holes 102 a through which respective lead pins 106 , which supply a power to the PD 101 and derive electric signals therefrom, are inserted.
  • Fixing materials 107 made of solder, low-melting glass or the like, are used to fix the respective inserted lead pins 106 , thereby maintaining hermeticity and mechanical strength.
  • wires 108 are used to provide electrical connections between the PD 101 and its associated lead pins 106 and between the sub-mount 105 and its associated lead pins 106 .
  • FIG. 7 is a side view showing a state in which the conventional optical receiver module is connected to the BOARD.
  • the optical receiver module 100 is mounted on the BOARD 110 (i.e., a subsequent-stage circuit board) on which a preamplifier 109 , which amplifies the electric signals from the PD 101 , and other electronic circuit components (not shown) are implemented.
  • Mounting the optical receiver module 100 on the BOARD 110 is achieved by bending the lead pins 106 of the optical receiver module 100 and then soldering the respective one ends of the lead pins 106 to corresponding wiring patterns 111 formed on the BOARD 110 .
  • a wire 112 is used to connect a wiring pattern 111 to the preamplifier 109 , whereby the PD 101 is connected to the preamplifier 109 through the lead pin 106 , wiring pattern 111 and wire 112 .
  • Such optical receiver modules having the structure as described above are capable of providing communications of up to 100 Mbps and hence are in widespread use.
  • communication modules that are capable of providing communications of higher rates than 100 Mbps and that are smaller in size have been desired. Achieving such a higher-rate communication requires an improvement of the high frequency characteristics of communication modules.
  • CAN type package See Patent Publication 1).
  • Patent Publication 2 also discloses a communication module wherein the lengths of lead pins have been reduced.
  • Patent Publication 1 Japanese Official Gazette of Patent Laid-Open Publication No. 2001-196766
  • Patent Publication 2 Japanese Official Gazette of Patent Laid-Open Publication No. 2001-298217
  • the high frequency characteristic can be also improved by changing, instead of the lead pin lengths, the sizes of the fixing materials, made of solder, low-melting glass or the like, that fix the respective lead pins to the stem.
  • the high frequency characteristic is dependent on the permittivity E of the fixing materials 107 and on the diameters R thereof (See FIG. 6 (B)).
  • the high frequency characteristic can be improved by increasing the ratio of the fixing materials 107 to the lead pins 106 ; that is, reducing the diameters r of the lead pins 106 , while increasing the diameters R of the fixing materials 107 .
  • the size (diameter t) of the stem 102 is specified in accordance with an optical connector to be coupled.
  • a communication module which has, instead of the structure called CAN type package, a so-called butterfly structure in which a PD, a semiconductor laser (LD) and so on are directly mounted on a circuit board on which high frequency lines, such as micro strip lines or the like, are formed.
  • This module can provide a precise impedance matching with external electronic circuit components, but it is larger in size than one having the so-called CAN type package structure comprising a stem and a cap and hence is not appropriate in a case where a smaller size of communication module is desired.
  • the present invention achieves the above-described object by employing a package structure, which comprises a stem and a cap, and further using no lead pins but using a flexible printed circuit board.
  • a communication module comprises a semiconductor member; a flexible printed circuit board on which the semiconductor member is mounted and to which the semiconductor member is electrically connected; a stem through which the flexible printed circuit board is inserted and to which the flexible printed circuit board is then fixed; and a cap so disposed as to cover the semiconductor member.
  • the communication module of the present invention having the structure described above employs, as members for supplying a power, deriving electric signals and so on, not lead pins but the flexible printed circuit board, so that the communication module is not affected by the lead pin lengths and the sizes of the fixing materials used for fixing the lead pins to the stem and hence can exhibit an improved high frequency characteristic.
  • the communication module of the present invention employs the flexible printed circuit board that allows an impedance matching with the external electronic circuit components to be precisely established, it can have not a butterfly structure but a package structure comprising a stem and a cap, so that the size of the communication module can be further reduced.
  • the communication module of the present invention is smaller in size but can provide communications of higher rates than 100 Mbps, particularly, than 1 Gbps.
  • the communication module of the present invention employs the flexible printed circuit board to connect the semiconductor member to the BOARD, so that no short circuit occurs due to an accidental mutual contact of flexible printed circuit boards, or due to an accidental contact of the flexible printed circuit board with metallic dust, a metallic seal provided along the periphery of the package, or the like.
  • the lead pins of the conventional communication modules as shown in FIGS. 6 and 7 are usually made of a highly conductive metal, such as copper, aluminum and so on, and the surfaces of such metals, except the portions thereof contacting with the fixing materials used for fixing them to the stem, are exposed.
  • the flexible printed circuit board usually has a structure in which an insulating member (i.e., a cover lay) overlie the entire surfaces of the flexible printed circuit board except particular portions thereof, for example, those where semiconductor members or the like are mounted.
  • an insulating member i.e., a cover lay
  • the communication module of the present invention can prevent any damages from occurring due to such accidental short circuits. The prevent invention will be described below in greater detail.
  • a semiconductor member included in the communication module of the present invention may be a light emitting element when the communication module is an optical transmitter module.
  • the light emitting element is, for example, a semiconductor laser (LD), a light emitting diode (LED) or the like, which may be made of AlGaAs system or InGaAsP system.
  • a semiconductor member included in the communication module may be a light receiving element.
  • the light receiving element is, for example, a photodiode (PD), an avalanche photodiode (APD) or the like, which may be made of InGaAs system, InGaAsP system, Si, Ge or the like.
  • the light receiving element is preferably made of InGaAs system, InGaAsP system or Ge.
  • the light receiving element may be made of Si or the like.
  • front-illuminated type photodiode is preferable because it is easy to implement.
  • the communication module of the present invention is an optical transmitter/receiver module, it may include the same number of light emitting elements and light receiving elements described above.
  • the communication module of the present invention when it is a communication module of multi-channel having a plurality of optical transmission media, such as optical fiber and the like, it may include a plurality of light emitting elements and light receiving elements in accordance with the number of the optical transmission media used.
  • the semiconductor member may include various electronic elements used for communications and may be an integrated circuit (IC) in which such elements are electrically connected.
  • IC integrated circuit
  • at the receiving end such an integrated circuit may be an amplifier for amplifying the output electric power of the light receiving element, which is typically a preamplifier IC or a limiting amplifier IC.
  • a driving element such as a driver IC for driving the light emitting element.
  • This flexible printed circuit board may have a typical structure in which one or more layers of wiring patterns comprising conductors, such as copper films or the like, are formed on a surface of, or the surface of and within an insulative basic material made of resin, such as polyimide, polyester or the like, and in which an insulative cover made of resin, such as polyimide, polyester or the like, is formed over the surfaces of that basic material.
  • the flexible printed circuit board may include at least one wiring pattern, and the number of such wiring patterns may be appropriately modified in accordance with the number of semiconductor members to be electrically connected to the flexible printed circuit board.
  • a single flexible printed circuit board may have a plurality of wiring patterns formed therein, which may be connected to respective different semiconductor members.
  • a single flexible printed circuit board may include different wiring patterns used for respective ones of light emitting and receiving elements.
  • a single flexible printed circuit board may include a wiring pattern used for a light emitting element and a wiring pattern used for a monitoring light receiving element that can determine the strength of a light emitted by the light emitting element.
  • a single flexible printed circuit board may include a wiring pattern used for a light receiving element and a wiring pattern used for an amplifier that amplifies an electric signal outputted by the light receiving element.
  • a plurality of semiconductor members may be mounted on a single flexible printed circuit board, so that there is no need to form a plurality of fixing holes in the stem as conventionally done. This reduction of the number of fixing holes can contribute to an improvement of the strength of the stem.
  • the flexible printed circuit board is inserted through the stem and then fixed thereto.
  • the flexible printed circuit board may be fixed to the stem with one of its ends protruding toward a side where the cap is located (which will be referred to as “cap side” hereinafter) and the other end protruding toward the opposite side (which will be referred to as “BOARD connection side” hereinafter).
  • the flexible printed circuit board may be bent in such a manner that its bent portion protrudes from the stem toward the cap side, while its two ends protrude from the stem toward the BOARD connection side.
  • a fixing material such as solder or a glass of a low melting point, may be used.
  • a fixing material may be appropriately selected which has a lower melting point than the material used to constitute the flexible printed circuit board, with the heat-resistance thereof taken into account.
  • the flexible printed circuit board is made of polyimide
  • a fixing material whose melting point is on the order of 300 to 350 degrees centigrade may be appropriately used.
  • a portion of the flexible printed circuit board protracting from the stem toward the cap side will possibly bend by itself if it is left as it is.
  • a supporting member or the like is preferably provided to the stem. If the flexible printed circuit board is intentionally bent and disposed, a supporting member is preferably disposed inside such a bent portion of the flexible printed circuit board. Provision of such a supporting member can prevent the flexible printed circuit board from bending by itself even when a semiconductor member is mounted thereon, which facilitates the positioning relative to an optical transmission medium or the like. In addition, the provision of such a supporting member can reinforce the flexible printed circuit board.
  • a material used to constitute the supporting member may be, for example, iron, such as cold-rolled steel sheet (SPC).
  • the supporting member may be formed independently of the stem and fixed thereto by use of solder or the like. Alternatively, the supporting member may be integrally formed with the stem.
  • the number of wiring patterns to be formed in a single flexible printed circuit board may be increased so as to increase the number of components to be mounted on the single flexible printed circuit board.
  • a plurality of different flexible printed circuit boards may be fixed to the stem such that different semiconductor members are mounted on the respective flexible printed circuit boards or such that the flexible printed circuit boards are used for different purposes with respect to a single semiconductor member.
  • a flexible printed circuit board used for a signal line of a semiconductor member may be differentiated from a flexible printed circuit board used for a ground line (GND line) or DC power supply line of that semiconductor member.
  • GND line ground line
  • necessary wiring patterns have been formed in such flexible printed circuit boards.
  • the wiring pattern used for the GND line or DC power supply line has been preferably formed in such a manner that its line width is large.
  • the shape of the flexible printed circuit board to be employed is not specified, yet it is preferable that the flexible printed circuit board is suitably shaped beforehand for where it is to be located, because of ease with which to dispose the flexible printed circuit board there.
  • the possible shapes of the flexible printed circuit board when in a plane may include bent-shapes; specifically, L-shapes, S-shapes and so on.
  • At least a part of wiring patterns formed in the flexible printed circuit board is preferably a transmission line that can be used for a high frequency band.
  • Such transmission lines may be a type of transmission lines selected from among, for example, coplanar lines, micro-strip lines and grounded coplanar lines. These lines can be formed by use of any known method.
  • the flexible printed circuit board is connected to a BOARD (i.e., a subsequent-stage circuit board) on which external electronic circuit components and the like are implemented.
  • a BOARD i.e., a subsequent-stage circuit board
  • connection of the flexible printed circuit board to the BOARD may be achieved by soldering, yet it also may be achieved by providing a connector, which can connect to the BOARD, to a BOARD connection side of the flexible printed circuit board and then connecting the connector to the BOARD.
  • the connector can be also fixed thereto at the same time, with the result that the workability of assembly is improved.
  • the communication module of the present invention has a package structure comprising a stem and a cap.
  • the flexible printed circuit board is fixed to the stem.
  • the cap is so disposed on the stem as to cover a semiconductor member mounted on the flexible printed circuit board that is fixed to the stem after having been inserted therethrough.
  • the stem and cap are preferably made of metallic materials, such as iron (Fe), copper (Cu), or copper-nickel alloy (Cu—Ni), or iron alloy, for example, SPC, stainless, Fe—Co—Ni or the like.
  • the package made of such metallic materials has a strong structure, exhibits an excellent long-term stability because of hermetic seal, also exhibits an excellent heat radiation, and also has a function of eliminating external electromagnetic noise.
  • the cap is preferably so constructed as to have therein a light-collective lens capable of coupling a light between a light transmission medium and the light emitting or receiving element, for the purpose of improving the workability of assembly.
  • This lens may be any one that only can transmit therethrough the wavelength of a light from the light emitting element or to the light receiving element, and that may be made of a glass, for example, BK-7 (trade name) available from Schott, or the like.
  • the communication module of the present invention may include, in addition to a light emitting element and/or a light receiving element, a monitoring light receiving element, an amplifier, a driving element and so on.
  • the amplifier and driving element may be, for example, Si-IC, GaAs-IC or the like.
  • the amplifier is preferably disposed in the vicinity of the light receiving element so that the length of a metallic wire, such as gold (Au), aluminum (Al) or the like, for connecting the amplifier to the light receiving element can be reduced, thereby enhancing the resistance to noise.
  • a metallic wire such as gold (Au), aluminum (Al) or the like
  • the communication module of the present invention has the package structure, which comprises the stem and the cap, and employs, as members for supplying a power to a semiconductor member, deriving signals therefrom and so on, not lead pins but flexible printed circuit boards, thereby providing an excellent advantage that the high frequency characteristic can be improved regardless of the lengths of the lead pins and the sizes of the fixing materials used for fixing to the stem. Accordingly, the communication module of the present invention can be used for providing communications of higher rates than 100 Mbps, particularly, than 1 Gbps. Because of employing the flexible printed circuit board, the communication module of the present invention can provide a more precise impedance matching with external electronic circuit components, and yet it is smaller in size than the conventional one because of employing the package structure as described above.
  • FIG. 1 is a schematic structure diagram illustrating an example of the communication module of the present invention having a light emitting element.
  • a communication module 1 of the present embodiment includes an LD 10 ; a flexible printed circuit board (which will be referred to as “FPC” hereinafter) 11 on which the LD 10 is mounted and to which the LD 10 is electrically connected; a stem 12 through which the FPC 11 is inserted and to which the FPC 11 is then fixed; and a cap 13 so disposed as to cover the LD 10 .
  • FPC flexible printed circuit board
  • the LD 10 is a semiconductor device that emits a light, which is incident upon an optical fiber 200 .
  • the LD 10 is made of InGaAsP system. It should be noted that in the present embodiment, an excellent LD, which has been tested in advance, is used as the LD 10 , so that deficiencies can be reduced.
  • the FPC 11 is a member on which the LD 10 is mounted and which is electrically connected to the LD 10 to supply a power thereto, derive signals therefrom and so on.
  • the FPC 11 has a structure comprising an internal layer part 11 a , which comprises a base material made of polyimide and which has, on and within the base material, wiring patterns comprising copper films, and insulative covers 11 b made of polyimide and overlying the two surfaces of the internal layer part 11 a .
  • the FPC 11 is inserted through a fixing hole 12 a formed in the stem 12 and then fixed thereto by use of a fixing material 15 with one of its ends protruding toward the cap 13 (the upper side of FIG. 1 ) and the other end protruding toward the BOARD (not shown) (the lower side of FIG. 1 ).
  • a glass of a low melting point 300 degrees centigrade
  • a part 11 c of the FPC 11 on which the LD 10 is mounted has been rust-proofed and plated, and then a solder, the melting point of which is 300 degrees centigrade, has been used to fix the LD 10 to the part 11 c .
  • a bonding wire 14 made of gold is used to connect the LD 10 to the FPC 11 .
  • the wiring pattern to which the LD 10 is connected is of micro strip lines.
  • the stem 12 has a supporting member 16 for supporting the portion of the FPC 11 protruding toward the cap 13 so as to prevent that portion from bending by itself.
  • the supporting member 16 may be anything that can support the portion of the FPC 11 protruding toward the cap 13 to prevent that portion from bending by itself.
  • the supporting member 16 is a block of SPC and is fixed to the stem 12 by use of a solder in the present embodiment, but, alternatively, may be integrally formed with the stem 12 .
  • a combination of the stem 12 and the cap 13 serves as a package for protecting the LD 10 .
  • the present embodiment employs, as this package, one which is made of stainless that exhibits an excellent mechanical-strength and an excellent heat radiation, can be hermetically sealed, and that has a function of eliminating electromagnetic noise.
  • the central axis of the package is coaxial with the optical axis of the optical fiber 200 .
  • the FPC 11 is inserted through and then fixed to the hole 12 a of the stem 12 by use of the fixing material 15 .
  • the cap 13 has a light-collective lens 13 a for allowing a light from the LD 10 to be optically coupled to the optical fiber 200 with a high degree of efficiency.
  • the light-collective lens 13 a is so disposed that its central axis is coaxial with the optical axis of the optical fiber 200 .
  • the structures of the stem 12 , cap 13 and light-collective lens 13 a are the same as those in embodiments 2 and 3 that will be described later.
  • the present embodiment provides, on the stem 12 , a monitoring PD 17 that can determine the strength of a light emitted from the LD 10 .
  • the monitoring PD 17 which is made of InGaAs system, is front-illuminated type photodiode, and is located under the LD 10 as shown in FIG. 1 .
  • the monitoring PD 17 is connected to the FPC 11 by use of a bonding wire 14 .
  • FIG. 2 (A) is a schematic structure diagram illustrating an example of the communication module of the present invention having a light receiving element
  • FIG. 2 (B) is a schematic diagram illustrating a magnified view of an FPC. Elements and members that are the same as those illustrated in FIG. 1 are designated by the same reference numbers.
  • a communication module 2 of the present embodiment includes a PD 20 ; an FPC 11 A on which the PD 20 is mounted and to which the PD 20 is electrically connected; an FPC 11 B to which the PD 20 is electrically connected; a stem 12 through which the FPCs 11 A and 11 B are inserted and to which they are then fixed; and a cap 13 so disposed as to cover the PD 20 .
  • Their structures will be described below in greater detail.
  • the PD 20 is a semiconductor device that receives a light incident from an optical fiber 200 .
  • the PD 20 which is made of InGaAs, is front-illuminated type photodiode. It should be noted that in the present embodiment, an excellent PD, which has been tested in advance, is used as the PD 20 , so that deficiencies can be reduced.
  • the present embodiment employs a plurality of FPCs each having a similar structure to the one of the FPC employed by the foregoing embodiment 1, and these FPCs 11 A and 11 B are fixed to the stem 12 by use of fixing materials 15 .
  • FIG. 2 shows two FPCs 11 A and 11 B, one of which, FPC 11 B, is fixed to the stem 12 with one of its ends protruding toward the cap 13 and the other end protruding toward the BOARD (not shown) in a similar manner to the foregoing embodiment 1.
  • the other FPC 11 A is inserted through a hole 12 a toward the cap 13 , thereafter bent back, inserted again through another hole 12 a , and then fixed to the stem 12 . That is, as shown in FIG.
  • the bent portion of the FPC 11 A protrudes toward the cap 13 , while the two ends thereof protrude toward the BOARD (not shown).
  • the FPC 11 A of the present embodiment is so constructed as to have an inner layer part 11 a , which comprises a base material 22 made of polyimide and which has, on the two surfaces of and within the base material 22 , a plurality of wiring patterns 23 , and insulative covers 11 b overlying the two surfaces of the inner layer part 11 a .
  • the PD 20 and a preamplifier IC 21 which amplifies an output from the PD 20 , are fixed to respective different ones of the wiring patterns 23 of the FPC 11 A by use of solder lid, the melting point of which is 300 degrees centigrade. It should be noted that parts 11 c of the FPC 11 A on which the PD 20 and preamplifier IC 21 are mounted have been rust-proofed and plated. Bonding wires 14 made of gold are used to provide electrical connections between the PD 20 and the FPC 11 A and between the preamplifier IC 21 and the FPC 11 A.
  • the wiring pattern to which the PD 20 is connected and the wiring pattern to which the preamplifier IC 21 is connected are of coplanar lines.
  • the preamplifier IC 21 which comprises Si-IC, is disposed in the vicinity of the PD 20 so as to reduce the length of a wire (not shown) which connects the preamplifier IC 21 to the PD 20 , thereby reducing the affection of noise.
  • the FPC 11 B is used as power supply lines for the PD 20 and preamplifier IC 21 , and has wiring patterns that are larger in line width than those of the FPC 11 A. Bonding wires made of gold are used to provide connections between the PD 20 and the FPC 11 B and between the preamplifier IC 21 and the FPC 11 B. (The bonding wire used for the latter connection is not shown.)
  • the present embodiment employs a supporting member 16 A, disposed inside the bent portion of the FPC 11 A protruding toward the cap 13 , for supporting the bent portion so as to prevent it from bending by itself.
  • the supporting member 16 A is a block of SPC and is fixed to the stem 12 by use of solder.
  • the communication module of the present invention may include a plurality of FPCs and a plurality of semiconductor members.
  • the present communication module can exhibit an improved high frequency characteristic and also can be constructed in a smaller size.
  • the communication module of the present embodiment has, as the wiring patterns formed in the FPC, transmission lines having an excellent high frequency characteristic, whereby the impedance matching with the external electronic circuit components can be readily established.
  • the PD 20 and preamplifier IC 21 both are mounted on the FPC 11 A in the present embodiment, they may be mounted on respective different FPCs. Specifically, the PD 20 may be mounted on the FPC 11 A, while the preamplifier IC 21 may be mounted on the FPC 11 B.
  • the communication module of the present invention may be a transmitter/receiver module having both a light emitting element and a light receiving element.
  • FIG. 3 is a schematic structure diagram illustrating an example of the communication module of the present invention having light emitting and receiving elements. Elements and members that are the same as those illustrated in FIGS. 1 and 2 are designated by the same reference numbers.
  • a communication module 3 of the present embodiment includes an LD 10 ; an FPC 11 C on which the LD 10 is mounted and to which the LD 10 is electrically connected; a PD 20 ; an FPC 11 D on which the PD 20 is mounted and to which the PD 20 is electrically connected; a stem 12 through which the FPCs 11 C and 11 D are inserted and to which they are then fixed; and a cap 13 so disposed as to cover the LD 10 and PD 20 .
  • Their structures will be described below in greater detail.
  • the present embodiment employs two FPCs having similar structures to the ones of the FPCs employed by the foregoing embodiment 2.
  • Each of the two FPCs is fixed to the stem 12 with one of its ends protruding toward the cap 13 and the other end protruding toward the BOARD (not shown) similarly to the foregoing embodiment 1.
  • One of the two FPCs, namely FPC 11 C, bears the LD 10 for transmission, while the other, namely FPC 11 D, bears the PD 20 for reception.
  • the present embodiment employs an optical path conversion part 30 capable of focusing and separating a light incident from the LD 10 upon an optical fiber 200 and a light outgoing from the optical fiber 200 toward the PD 20 .
  • the optical path conversion part 30 which has a WDM (wavelength division multiplex) filtering function, includes a transmission/reflection part 30 a that allows one of the incident and outgoing lights as described above to pass therethrough and reflects the other light.
  • the transmission/reflection part 30 a may be formed by using PVD or CVD methods to form a film over a surface of a substrate made of a transparent glass or the like.
  • the film comprises a multi-layered film of dielectric materials, which may alternately have a film of a low-refractive material, such as SiO 2 , MgF 2 or the like, and a film of a high-refractive material, such as Al 2 O 3 , Ti 2 O 5 or the like.
  • a plasma CVD method (P-CVD method) is used to alternately deposit films of SiO 2 and Ti 2 O 5 over a transparent glass substrate.
  • the optical path conversion part 30 is fixed to a supporting member 16 that supports the FPC 11 C. It should be noted that the incident and outgoing lights as described above have been caused to exhibit mutually different wavelengths. In the present embodiment, the former exhibits a wavelength of 1.3 ⁇ m and the latter exhibits a wavelength of 1.55 ⁇ m.
  • the LD 10 and PD 20 which are the same as those in the foregoing embodiments 1 and 2, are connected to the FPCs 11 C and 1 D, respectively, by use of bonding wires 14 made of gold.
  • Supporting members 16 that support the FPCs 11 C and 11 D are integrally formed with the stem 12 .
  • the wiring pattern to which the LD 10 is connected and that to which the PD 20 is connected are of grounded coplanar lines.
  • the package includes a monitoring PD 17 and a preamplifier IC (not shown) that amplifies an output from the PD 20 , and it may further include an IC for driving the LD 10 , and the like.
  • the communication module of the present invention may be a transmitter/receiver module. Because of employing not lead pins but FPCs, this communication module can exhibit an improved high frequency characteristic and also can be constructed in a smaller size similarly to the foregoing embodiments 1 and 2. Moreover, the communication module of the present embodiment has, as the wiring patterns formed in the FPCs, transmission lines having an excellent high frequency characteristic, whereby the impedance matching with the external electronic circuit components can be readily established.
  • the foregoing embodiments 1 through 3 were described as having a light emitting element and/or a light receiving element, but as a matter of course, they may have a structure that includes only integrated circuits (ICs). In such cases, the cap may have no light-collective lens.
  • ICs integrated circuits
  • FIG. 4 is a schematic diagram illustrating a communication module of the present invention having a connector. Elements and members that are the same as those illustrated in FIG. 1 are designated by the same reference numbers.
  • a communication module 4 of the present embodiment is the same as the communication module of the embodiment 1 in the basic structure but different in that it employs a connector 40 that is provided to a BOARD connection end of an FPC 11 and that can connect to the BOARD.
  • the connector when electronic circuit components are fixed to the BOARD by use of reflow soldering, the connector can be also fixed at the same time, whereby the workability of assembly is improved. Moreover, the connector is removable from the BOARD, and hence, if any trouble occurs in a constituent element, such as a semiconductor member or FPC, then the connector is removed, whereby the BOARD can be reused.
  • FIG. 5 is a schematic diagram illustrating a communication module of the present invention employing an FPC that is L-shaped when in a plane. Elements and members that are the same as those illustrated in FIG. 1 are designated by the same reference numbers.
  • a communication module 5 of the present embodiment is the same as the communication module of the embodiment 1 in the basic structure but different in that an FPC 50 has a bent-shape when in a plane.
  • the communication module of the present invention may employ modified shapes of FPCs.
  • the FPCs can be suitably shaped beforehand for where they are to be located.
  • the present embodiment employs the FPC that is bent in an L-shape when in a plane, but, as a matter of course, any other shapes, such as S-shapes and so on, of FPCs may be employed.
  • the communication module of the present invention is used for optical communications, and in particular, the most suitable for usages that require an excellent high frequency characteristic and a high rate communication.
  • FIG. 1 is a schematic structure diagram illustrating an example of the communication module of the present invention having a light emitting element.
  • FIG. 2 (A) is a schematic structure diagram illustrating an example of the communication module of the present invention having a light receiving element.
  • FIG. 2 (B) is a schematic diagram illustrating a magnified view of an FPC.
  • FIG. 3 is a schematic structure diagram illustrating an example of the communication module of the present invention having light emitting and receiving elements.
  • FIG. 4 is a schematic diagram illustrating a communication module of the present invention having a connector.
  • FIG. 5 is a schematic diagram illustrating a communication module of the present invention employing an FPC that has a bent-shape when in a plane.
  • FIG. 6 (A) is a front elevational view of the longitudinal cross-sectional structure of a conventional optical receiver module.
  • FIG. 6 (B) is a plan view of a stem as viewed from a BOARD connection side.
  • FIG. 7 is a side view showing a state in which the conventional optical receiver module is connected to the BOARD.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)
  • Semiconductor Lasers (AREA)
  • Led Device Packages (AREA)
US10/562,630 2003-06-26 2004-06-07 Communication module Abandoned US20060164817A1 (en)

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JP2003182998A JP4058764B2 (ja) 2003-06-26 2003-06-26 通信モジュール
JP2003-182998 2003-06-26
PCT/JP2004/007922 WO2005002011A1 (ja) 2003-06-26 2004-06-07 通信モジュール

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US9209903B2 (en) * 2013-11-29 2015-12-08 Electronics And Telecommunications Research Institute Optical transmitter module
US20150155944A1 (en) * 2013-11-29 2015-06-04 Electronics And Telecommunications Research Institute Optical transmitter module
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US10168499B2 (en) * 2014-09-24 2019-01-01 Kyocera Corporation Electronic module
CN109075874A (zh) * 2016-04-28 2018-12-21 华为技术有限公司 晶体管外形（to）封装光收发器
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CN110034076A (zh) * 2018-01-12 2019-07-19 中兴光电子技术有限公司 光电子器件及其封装结构
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US20220057256A1 (en) * 2019-05-29 2022-02-24 Mitsubishi Electric Corporation Optical module
US11703378B2 (en) * 2019-05-29 2023-07-18 Mitsubishi Electric Corporation Optical module
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