US20050242400A1 - Electrostatic discharge protection circuit - Google Patents

Electrostatic discharge protection circuit Download PDF

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US20050242400A1
US20050242400A1 US10/904,080 US90408004A US2005242400A1 US 20050242400 A1 US20050242400 A1 US 20050242400A1 US 90408004 A US90408004 A US 90408004A US 2005242400 A1 US2005242400 A1 US 2005242400A1
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Prior art keywords
electrostatic discharge
discharge protection
circuit
protection circuit
protection unit
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US10/904,080
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English (en)
Inventor
Bob Cheng
Tony Ho
Bouryi Sze
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Via Technologies Inc
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Via Technologies Inc
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Assigned to VIA TECHNOLOGIES INC. reassignment VIA TECHNOLOGIES INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHENG, BOB, HO, TONY, SZE, BOURYI
Publication of US20050242400A1 publication Critical patent/US20050242400A1/en
Priority to US11/937,487 priority Critical patent/US7804671B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0259—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using bipolar transistors as protective elements

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  • the present invention relates to an electrostatic discharge (ESD) protection circuit, and more particularly, to an ESD protection circuit capable of executing any one of five existing integrated circuit test modes, a PS (Positive to VSS) test mode, an NS (Negative to VSS) test mode, a PD (Positive to VDD) test mode, an ND (Negative to VDD) test mode, and a DS (VDD to VSS) test mode.
  • CMOS complementary metal oxide semiconductors
  • an NMOS manufactured according to a two-micrometer conventional IC manufacturing process can have an ESD protection capability to endure an ESD voltage having a voltage level as high as three thousand volts, but another IC manufactured according to a one-micrometer lightly-doped drain process is capable of enduring an ESD voltage having a voltage level of only two thousand volts.
  • electrostatic charges in an environment where an IC is located are constant and irrelevant with the size of the IC, an IC of a smaller size is easier to be damaged by ESD charges than a larger-sized IC. Therefore, as ICs become smaller, ESD protection circuits used to protect ICs from damage induced by ESD charges are becoming one of the most important types of electronic circuits.
  • an ESD can be defined according to four models: a human-body model (HBM), a charged-device model (CDM), a machine model (MM), and a field-induced model (FIM).
  • HBM human-body model
  • CDM charged-device model
  • MM machine model
  • FIM field-induced model
  • a human's movement induces electrostatic charges.
  • the induced electrostatic charges exceed a threshold value and the human, on whom the electrostatic charges are accumulated, contacts an IC chip, the electrostatic charges will flow to ground through a pin and an inner circuit of the IC chip.
  • Such an electrostatic discharging process induces a transient discharging current having a few amps, which is large enough to burn out the IC chip in a short period (hundreds of nanoseconds).
  • FIG. 1 is an equivalent circuit diagram illustrating an HBM model 10 and an ESD protection circuit 15 for preventing an IC chip 16 from damage induced by ESD charges generated by a human being according to the prior art.
  • the ESD protection circuit 15 comprises an equivalent resistor 17 and an equivalent capacitor 19 .
  • the equivalent capacitor 19 is assumed to be one C ESD in capacitance. Initially, the ESD charges induced from the movement of the human will accumulate on an equivalent capacitor (100 pF) 12 .
  • FIG. 2 is a schematic diagram illustrating how the PS ESD test mode evaluates the ESD protection capability of the IC chip 16 according to the prior art.
  • the IC chip 16 comprises a V SS pin 24 electrically connected to ground, a pin 22 , ready to be test, electrically connected to a positive test voltage 20 , and a plurality of floated pins including a V DD pin 26 .
  • the positive test voltage 20 is applied to the pin 22 with a first predetermined positive voltage a couple of times, usually three times, to test if the pin 22 is still robust despite the shock of the positive test voltage 20 .
  • the positive test voltage 20 is equivalent to ESD charges. If the pin 22 is still functioning normally, the positive test voltage 20 is raised to a second predetermined positive voltage and again applied to the pin 22 three times. The positive test voltage 20 is raised again and applied to the pin 22 until the pin 22 is damaged by the positive test voltage 20 of a predetermined positive voltage, which is called an ESD failure threshold.
  • a plurality of methods such as an absolute leakage current method, relative I-V drift method, and a function detection method, are used to determine if the pin 22 of the IC chip 16 is damaged due to ESD charges.
  • ESD test modes there are five ESD test modes used to evaluate the ESD protection capability of the IC chip 16 .
  • the five test modes have five corresponding ESD failure thresholds different from each other.
  • the ESD failure threshold of the pin 22 of the IC chip 16 calculated above corresponds only to the PS ESD test mode, one of the five ESD test modes.
  • the ESD failure threshold of the pin 22 is usually different from that of any other pins even if they are evaluated according to an identical ESD test mode.
  • the IC chip 16 cannot function normally unless all the pins can survive ESD charges. Therefore, a smallest ESD failure threshold in an ESD failure threshold group consisting of a plurality of ESD failure thresholds calculated according to the five ESD test modes governs, and is a genuine ESD failure threshold of the IC chip 16 .
  • the ESD protection circuit 15 that protects the IC chip 16 from damage induced by ESD charges having levels higher than the genuine ESD failure threshold has to have the capability to survive ESD charges provided by the five above-mentioned ESD test modes.
  • FIG. 3 is a schematic diagram of the IC chip 16 according to the prior art. Each pin of the IC chip 16 has to be evaluated according to the five ESD test modes, as described previously, and the pin 22 acting as an input pad as well as an output pad is described here as an example.
  • the IC chip 16 comprises an inner circuit 30 and five ESD protection circuits 32 , 34 , 36 , 38 and 40 for protecting the inner circuit 30 from ESD charges provided by the five ESD test modes respectively.
  • the ESD protection circuits 32 to 40 are dedicated to protect the inner circuit 30 from ESD charges, and therefore do nothing if the IC chip does not suffer any ESD charges.
  • the operation of the IC chip 16 under ESD charges in accordance with the ND ESD test mode is described briefly as follows: Current induced by the ESD charges flows from the V DD pin 26 , through the ESD protection circuits 36 and 32 , along the V SS pin 24 , through the ESD protection circuit 34 and the input pad 22 , and eventually to a negative test voltage 42 . According to such a scenario, the IC chip 16 is free from the impact induced by the negative test voltage 42 , the ESD charges in equivalence.
  • CMOS ICs such as diffusion or poly resistors, p-n junction diodes, MOS components, bipolar junction transistors, and silicon-controlled rectifier (SCR) components, are implemented to form ESD protection circuits. These components have distinct characteristics and ESD protection capability.
  • a forward-biased diode has a working voltage (about 0.8 to 1.2 volts) far smaller than that (about ⁇ 13 to ⁇ 15 volts) of a reverse-biased diode, and heat generated by the forward-biased diode is accordingly far smaller than that of the reverse-biased diode if ESD currents flowing through these two diodes are equal.
  • the forward-biased diode has an ESD protection capability far superior to that of the reverse-biased diode if their sizes are equal.
  • a diode that an ESD protection circuit comprises is usually forward-biased.
  • an ESD protection circuit having a diode installed has to comprise an additional component such as a resistor.
  • an SCR component of small size still has satisfactory ESD protection capability.
  • an SCR component has an ESD protection capability per unit area is superior to that of any of the diffusion or poly resistors, the p-n junction diodes, the MOS components, and the bipolar junction transistors.
  • the above-mentioned MOS ICs can be composed to form a variety of ESD protection circuits.
  • FIG. 4 and FIG. 5 are two circuit diagrams of two ESD protection circuits 50 and 60 electrically connected between the pin 22 and the inner circuit 30 for protecting the inner circuit 30 from damage induced by ESD charges.
  • Both of the ESD protection circuits 50 and 60 are composed of at least two of the above-mentioned MOS ICs.
  • the ESD protection circuit 50 comprises a resistor 52 and two cascaded diodes 54 and 56 .
  • the ESD protection circuit 60 comprises two cascaded resistors 62 and 64 , an SCR component 66 , and a field-oxide device 68 .
  • the ESD protection circuit 50 has an ESD capability superior to that of the ESD protection circuit 40 .
  • an ESD capability of an ESD protection circuit relates to the MOS ICs that the ESD protection circuit comprises.
  • any improvement of these MOS ICs also has the benefit of promoting the ESD protection capability of the ESD protection circuit.
  • the ESD protection capability of a CMOS component can be improved in three aspects including manufacturing process, the component itself and circuit design.
  • the ESD-implant process executes an ion implanting process one more time on a drain of a CMOS, so that currents flowing through the drain are evenly distributed and the CMOS has a better ESD protection capability.
  • the silicided-diffusion blocking process has a capability to control a ballasting resistor between the drain and gate of the MOS component, so as to increase the operation speed of the CMOS component.
  • LVTSCR low-voltage triggering SCR
  • the LVTSCR comprises a P+diffusion layer, an N-well layer, a P-substrate layer, and an N+ diffusion layer. Having a high junction breakdown threshold, about 30 to 50 volts, the LVTSCR has to have an additional clamp circuit installed. When turned on due to an ESD voltage induced by ESD charges, the LVTSCR generates a clamping voltage, which has a capability to protect an inner circuit protected by the LVTSCR by clamping the ESD voltage down to a low voltage level.
  • a gate-coupled technique applied to NMOS components As far as the third aspect of the circuit design is concerned, a gate-coupled technique applied to NMOS components, a gate-grounded technique, and a substrate-triggered technique are three popular techniques.
  • a large-sized component usually has a finger-typed layout. However, these fingers connected in parallel are usually not conducted to release an ESD current simultaneously. This is the reason why an ESD protection capability of a component is not proportional to a size of the component.
  • the substrate-triggered technique is capable of improving the ESD protection capability of a component by uniformly conducting all of the fingers according to a capacitance effect.
  • the gate-grounded technique is capable of releasing ESD current effectively by electrically connecting a drain and a gate of a MOS component to a pin and to ground respectively and conducting a parasitic bipolar junction diode (BJT) of the MOS component.
  • BJT bipolar junction diode
  • the gate-coupled technique offers a great contribution to conduct the parasitic BJT by controlling a voltage level of the gate with a capacitance coupling method.
  • five ESD test modes have to be used to evaluate an ESD protection capability, and a single MOS is capable of achieving at least two ESD test modes, so an ESD protection circuit has to comprise at least three MOS components.
  • an ESD protection circuit of the prior art has at least the following disadvantages:
  • the present invention provides an ESD protection circuit to solve the above-mentioned problems.
  • the ESD protection circuit includes a substrate, a first P-well, a second P-well, and a third P-well, all of which are installed on the substrate.
  • the first P-well includes a first P+ region and a first N+ region, both of the first P+ and the first N+ regions connected to ground.
  • the second P-well includes a second P+ region and a second N+ region, both of the second P+ and the second N+ regions connected to a voltage source.
  • the third P-well includes a third N+ region, a third P+ region and a fourth N+ region, all of the third N+ region, the third P+ region and the fourth N+ region for inputting/outputting signals.
  • the substrate is an N-substrate
  • the ESD protection circuit further includes polysilicon disposed on all the regions.
  • the ESD protection circuit of the present invention is capable of achieving all of the five EDS test modes, an additional clamp circuit is omitted. Moreover, the poly-silicon disposed on all the regions strengthens the ESD protection capability of the ESD protection circuit.
  • FIG. 1 is an equivalent circuit diagram of an HBM model and an ESD protection circuit according to the prior art.
  • FIG. 2 is a schematic diagram illustrating how a PS ESD test mode evaluates the ESD protection capability of an IC chip shown in FIG. 1a ccording to the prior art.
  • FIG. 3 is a schematic diagram of the IC chip shown in FIG. 2 according to the prior art.
  • FIG. 4 and FIG. 5 are two circuit diagrams of two ESD protection circuits, each of which is composed of at least two MOS ICs, according to the prior art.
  • FIG. 6 is a cross-sectional diagram of an ESD protection circuit of the preferred embodiment according to the present invention.
  • FIG. 7 is a cross-sectional diagram of an ESD protection circuit of a second embodiment according to the present invention.
  • FIG. 8 is a cross-sectional diagram of an ESD protection circuit of a third embodiment according to the present invention.
  • FIG. 9 is a layout diagram of the ESD protection circuit shown in FIG. 6 according to the present invention.
  • FIG. 10 is a layout diagram of a two-staged ESD protection circuit of a fourth embodiment applied to a broadband circuit according to the present invention.
  • FIG. 11 is a layout diagram of a four-staged ESD protection circuit of a fifth embodiment applied to a broadband circuit according to the present invention.
  • FIG. 12 is a layout diagram of a four-staged ESD protection circuit of a sixth embodiment applied to an ultra-broad band circuit according to the present invention.
  • FIG. 13 is a layout diagram of a dual-route ESD protection circuit of a seventh embodiment applied to an ultra-broad band circuit according to the present invention.
  • FIG. 14 and FIG. 15 are two enlarged diagrams of a first P+ region of the ESD protection circuit shown in FIG. 6 according to the present invention.
  • FIG. 6 is a cross-sectional diagram of an ESD protection circuit 100 of the preferred embodiment according to the present invention.
  • the ESD protection circuit 100 comprises an N-substrate 102 , a first P-well 104 , a second P-well 106 , and a third P-well 108 , all of the P-wells being installed on the N-substrate 102 .
  • the first P-well 104 comprises a first P+ region 110 and a first N+ region 112 , both of which are used for connecting to GND pads of an integrated circuit chip.
  • the second P-well 106 comprises a second P+ region 114 and a second N+ region 116 , both of which are used for connecting to VDD pads of the integrated circuit chip.
  • the third P-well 108 comprises a third N+ region 118 , a third P+ region 120 and a fourth N+ region 122 , all of which are used for connecting to I/O pads of the integrated circuit chip.
  • the left-hand part of the ESD protection circuit 100 consisting of five layers of N-P-N-P-N, that is, the first N+ region 112 , the first P+ region 104 , the N-substrate 102 , the third P+ region 108 , and the third N+ region 118 , can be regarded as equivalent to three serially connected bipolar transistors B 1 , B 2 and B 3 , or two silicon-controlled rectifier (SCR) components SCR 1 (bipolar transistors B 1 -B 2 ) and SCR 2 (bipolar transistors B 2 -B 3 ).
  • the ESD 100 therefore has an operation mechanism similar to that of the prior art SCR component.
  • the operation of the ESD protection circuit 100 is described as follows: When a positive ESD voltage having a voltage level higher than a predetermined voltage level is generated (PS ESD test mode), a junction breakdown occurs between the N-substrate 102 and the first P-well 104 , and an ESD current corresponding to the positive ESD voltage flows through the first P+ region 110 of the first P-well 104 to the GND pads of the integrated circuit chip, so as to protect inner circuits of the integrated circuit chip from damage induced by the ESD current. In equivalence, the SCR 1 is operating during PS ESD test mode.
  • the right-hand part of the ESD protection circuit 100 consisting of the second N+ region 116 , the second P+ region 106 , the N-substrate 102 , the third P+ region 108 , and the fourth N+ region 122 is capable of releasing ESD currents corresponding to ESD voltages of both PD and ND ESD test modes. Further redundant descriptions are omitted.
  • the ESD protection circuit 100 having an equivalent bipolar transistor B 7 composed of the first P-well 104 , the N-substrate 102 and the second P-well 106 is capable of releasing an ESD current flowing from V DD to GND during DS ESD test mode.
  • a V T implant layer that a MOS process usually adopts is installed between the first P-well 104 and the third P-well 108 and between the third P-well 108 and the second P-well 106 of the N-substrate 102 .
  • a pseudo MOS structure formed between the first N+ region 112 of the first P-well 104 and the third N+ region 118 of the third P-well 108 (another pseudo MOS structure is formed between the fourth N+ region 122 of the third P-well 108 and the second N+ region 116 of the second P-well 106 ) conducts a slight current induced from an inner coupling capacitor, and the ESD voltage having the high voltage level reduces a voltage barrier of the third N+ region 118 of the third P-well 108 (and the fourth N+ region 122 as well) and enables the pseudo MOS structure to conduct more currents, a slightly-conducted pseudo MOS having the benefit of reducing the drive voltage V T of the ESD protection circuit 100 .
  • the ESD protection circuit 100 shown in FIG. 6 is fabricated according to a general semiconductor fabrication process. Of course, an advanced semiconductor fabrication process can be applied here to fabricate an ESD protection circuit of the present invention.
  • FIG. 7 is a cross-sectional diagram of a triple-welled ESD protection circuit 200 of a second embodiment according to the present invention.
  • a reverse-biased voltage between a P-substrate 202 and a deep N-well 252 has a capability to reduce a latent leakage current of the ESD protection circuit 200 .
  • FIG. 8 is an equivalent circuit of an ESD protection circuit 300 of a third embodiment according to the present invention.
  • the ESD protection circuit 300 is fabricated according to the concept of a distributed amplifier. Different from the ESD protection circuit 15 having the single equivalent capacitor 19 and the single equivalent resistor 17 (single-staged), the ESD protection circuit 300 comprises four serially connected ESD protection units 302 . Each of the ESD protection units 302 comprises an equivalent capacitor 306 and a coplanar wave-guide (CPW) 304 , which can be replaced with a transmission line 304 .
  • the CPW 304 can be made of a plurality of metal layers according to a semiconductor fabrication process and acts as a guiding structure of the ESD protection unit 302 .
  • Each of the equivalent capacitor 306 of the ESD protection unit 302 is assumed to be 0.25 C ESD in capacitance.
  • the ESD protection circuit 300 has a total capacitance value, which is equal to a sum of four capacitance values of the four equivalent capacitors 306 , as large as that of the ESD protection circuit 15 , so both the area and the capability to release an electrostatic current of the ESD protection circuit 300 are the same as those of the ESD protection circuit 15 .
  • the ESD protection circuit 300 since the ESD protection circuit 300 has a capacitance value one quarter as large as that of the ESD protection circuit 15 , the load effect imposed on the circuit by the ESD protection circuit is accordingly far less than that by the ESD protection circuit 15 .
  • the ESD protection circuit 300 also has a current-releasing capability superior to that of the ESD protection circuit 15 .
  • the ESD protection circuit 300 further comprises a matching impedance of 50 ohms.
  • the CPW 304 of the ESD protection circuit 300 can be regarded as an equivalent inductor 304 for matching with the matching impedance according to an inductance compensation effect, while the equivalent capacitor 306 can be used to protect a broadband circuit from the damage induced by ESD charges.
  • the ESD protection circuit 300 which is formed according to the concept of a distributed amplifier, can be further applied to protect a variety of radio circuits, such as a narrowband radio circuit, a broadband radio circuit and even an ultra-broad band radio circuit, whose bandwidths are diversified, by including a moderate number of ESD protection units. Since an ESD protection circuit formed according to the concept of a distributed amplifier has a corner frequency ⁇ c relating to the number of ESD protection units of the ESD protection circuit, i.e.
  • an ESD protection circuit of the present invention can be used to protect a circuit operating on a specified corner frequency by including a specified number of ESD protection units according to the specified corner frequency.
  • the ESD protection circuit can include only one ESD protection unit.
  • an ESD protection circuit having four ESD protection units according to the present invention is robust enough to protect a radio circuit having a bandwidth of 10 GHz.
  • FIG. 9 is a layout diagram of the ESD protection circuit 100 (any one of the ESD protection units 306 of the ESD protection circuit 300 shown in FIG. 8 ) according to the present invention.
  • the layout comprises a central region.
  • the third P-well 108 is installed in a central region, the first P-well 104 is installed above the central region, and the third P-well 106 is installed below the central region.
  • any one of the four N+ regions i.e. the first, second, third, and fourth N+ regions 12 , 116 , 118 , and 122 , is designed to have an area smaller than that of any one of the first, second, and third P+ regions 110 , 114 and 120 .
  • the octagonal ESD protection circuit 100 has a parasitic capacitance 83% of that of the rectangular ESD protection circuit of the prior art.
  • the ESD protection circuit 100 having smoother corners further has an additional capability to reduce unnecessary microwave effects.
  • the ESD protection circuit 100 shown in FIG. 9 is dedicated to a narrowband radio circuit.
  • the ESD protection circuit 300 comprises only one ESD protection unit 302 and is robust enough to meet all demands required by a narrowband radio circuit.
  • an ESD protection circuit of the present invention can comprise more than two cascaded ESD protection units and be applied to a broadband, and even an ultra-broad band radio circuit.
  • FIG. 10 and FIG. 11 are layout diagram of a two-staged ESD protection circuit 400 (comprising two cascaded ESD protection units 302 ) applied to a broadband radio circuit of a fourth embodiment according to the present invention.
  • FIG. 10 is a layout diagram of a two-staged ESD protection circuit 400 (comprising two cascaded ESD protection units 302 ) applied to a broadband radio circuit of a fourth embodiment according to the present invention.
  • FIG. 10 is a layout diagram of a two-staged ESD protection circuit 400 (comprising two cascaded ESD protection units 302 ) applied to
  • the ESD protection circuit 400 comprises a first stage ESD protection unit 402 electrically connected to a pin of an integrated circuit chip, and a second stage ESD protection unit 404 electrically connected to an inner circuit (for example, the broadband radio circuit) of the integrated circuit chip.
  • the ESD protection circuit 500 comprises a first stage ESD protection unit 502 electrically connected to a pin of an integrated circuit chip, a fourth stage ESD protection unit 508 electrically connected to an inner circuit of an integrated circuit chip, a second stage ESD protection unit 504 electrically connected to the first stage ESD protection unit 502 , and a third stage ESD protection unit 506 electrically connected to the fourth stage ESD protection unit 506 .
  • the four ESD protection units of the ESD protection circuit 500 shown in FIG. 11 have a layout in the shape of an open rectangle.
  • the four ESD protection units can have a linear layout and be disposed along an edge of an integrated circuit chip. Since each of the pins of an integrated circuit chip needs a dedicated ESD protection circuit, and two neighboring pins have a limited distance between them, in order not to occupy too much space of the border having only a finite length, the four ESD protection units 502 , 504 , 506 and 508 are strongly recommended to have the open rectangle layout shown in FIG. 11 .
  • an ESD protection circuit of the present invention can comprise three cascaded ESD protection units (not shown in Figures).
  • an ESD protection unit directly contacting a pin of an integrated circuit chip such as the first stage ESD protection unit 502 shown in FIG. 11 , has to have a layout of a larger area, so as to protect the ESD protection circuit 500 from damage.
  • an ESD protection unit directly contacting the inner circuit such as the fourth stage ESD protection unit 508 shown in FIG. 11 , also has to have a layout of a larger area. As shown in FIG.
  • either of the first and the fourth ESD protection units 502 and 508 (on which a label “LARGE” is marked) has an area larger than that of either of the second and the third ESD protection units 504 and 506 (on which a label “MEDIUM” is marked)
  • FIG. 12 is a layout diagram of a five-staged ESD protection circuit 600 applied to an ultra-broad band of a sixth embodiment according to the present invention.
  • a first stage ESD protection unit 602 of the ESD protection circuit 600 is electrically connected to three inner circuits via three fourth stage ESD protection units 604 , 606 and 608 respectively.
  • the ESD protection circuit 600 having such a layout shown in FIG. 12 is recommended to be applied to a pin disposed on a corner of an integrated circuit chip.
  • FIG. 13 is a layout diagram of a dual-route ESD protection circuit 700 applied to an ultra-broad band radio circuit of a seventh embodiment according to the present invention.
  • the first stage ESD protection unit 502 of the ESD protection circuit 500 shown in FIG. 11 is electrically connected to the fourth ESD protection circuit 508 through a single route consisting of the second and third ESD protection units 504 and 506 .
  • a first stage ESD protection unit 702 of the ESD protection circuit 700 can be electrically connected to a fifth ESD protection circuit 714 through a first route consisting of second, third and fourth ESD protection units 704 , 706 and 708 or through a second route consisting second, third and the fourth ESD protection units 710 , 712 and 708 .
  • the ESD protection circuit 700 having such a layout shown in FIG. 13 is recommended to be applied to a pin disposed on an edge of an integrated circuit chip.
  • the ESD protection circuit 600 can further comprise a plurality of ESD protection units having adjustable layouts according to the position that these ESD protection units are installed in an integrated circuit chip. For example, either of the ESD protection units 612 and 708 has a layout of medium area, while either of the ESD protection units 610 and 706 has a layout of small area.
  • FIG. 14 and FIG. 15 are two enlarged schematic diagrams of the first P+ region 110 of the ESD protection circuit 100 of the preferred embodiment according to the present invention.
  • Poly-silicon 190 in the shape of a rectangle, a tee, or a cross is disposed on the first P+ region 110 for transforming the flat first P+ region 110 into a lumpy P+ region 110 , which has a capability to uniform the current distribution in the first P+ region 110 .
  • Any one of the rectangle-, tee- and cross-shaped poly-silicon is symmetrical and is disposed on the first P+ region 110 .
  • the poly-silicon can be disposed on any or all regions in addition to the first P+ region 110 , and can have an asymmetrical shape.
  • an ESD protection circuit usually comprises a ballasting resistance having to occupy a large area to protect itself from damage induced by excessive ESD voltage.
  • the ballasting resistance has a value changed in accordance with a distance between poly-silicon 190 .
  • the poly-silicon 190 has a capability to block and make uniform an ESD current I ESD .
  • the poly-silicon 190 further has a capability to increase an area of a region where the first P-well 104 generates ions, so as to improve the ESD efficiency.
  • the present invention can provide an ESD protection circuit comprising three P-wells, one of which comprises a first P+ region and a first N+ region, another of which comprises a second P+ region and a second N+ region, and another of which comprises a third N+ region, a third P+ region and a fourth N+ region.
  • the ESD protection circuit has at least the following advantages:

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060262471A1 (en) * 2005-03-30 2006-11-23 Benjamin Van Camp Semiconductor device based on a SCR
US20070131965A1 (en) * 2005-12-08 2007-06-14 Electronics And Telecommunications Research Institute Triple-well low-voltage-triggered ESD protection device
US20070132029A1 (en) * 2005-12-14 2007-06-14 Agni Mitra ESD protection for passive integrated devices
US20080128817A1 (en) * 2004-12-14 2008-06-05 Kwi Dong Kim Electrostatic discharge protection circuit using triple welled silicon controlled rectifier
US20100230719A1 (en) * 2009-03-11 2010-09-16 Nec Electronics Corporation Esd protection element
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TWI479952B (zh) * 2013-12-10 2015-04-01 Yi Jing Technology Co Ltd 離子產生裝置之靜電消散能力自我檢測方法
CN111968970A (zh) * 2020-08-28 2020-11-20 电子科技大学 一种esd保护器件
WO2023284062A1 (zh) * 2021-07-16 2023-01-19 长鑫存储技术有限公司 静电保护器件
WO2023284063A1 (zh) * 2021-07-16 2023-01-19 长鑫存储技术有限公司 静电保护器件
CN116646353A (zh) * 2023-07-26 2023-08-25 深圳中安辰鸿技术有限公司 一种二极管esd保护器件、集成电路及电子设备

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CN102157546A (zh) * 2011-03-21 2011-08-17 中颖电子股份有限公司 一种电源过压保护结构及其制备方法
TWI479952B (zh) * 2013-12-10 2015-04-01 Yi Jing Technology Co Ltd 離子產生裝置之靜電消散能力自我檢測方法
CN111968970A (zh) * 2020-08-28 2020-11-20 电子科技大学 一种esd保护器件
WO2023284062A1 (zh) * 2021-07-16 2023-01-19 长鑫存储技术有限公司 静电保护器件
WO2023284063A1 (zh) * 2021-07-16 2023-01-19 长鑫存储技术有限公司 静电保护器件
CN116646353A (zh) * 2023-07-26 2023-08-25 深圳中安辰鸿技术有限公司 一种二极管esd保护器件、集成电路及电子设备

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TW200536097A (en) 2005-11-01

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