US20050205209A1 - Replacing chamber components in a vacuum environment - Google Patents

Replacing chamber components in a vacuum environment Download PDF

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Publication number
US20050205209A1
US20050205209A1 US10/803,805 US80380504A US2005205209A1 US 20050205209 A1 US20050205209 A1 US 20050205209A1 US 80380504 A US80380504 A US 80380504A US 2005205209 A1 US2005205209 A1 US 2005205209A1
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United States
Prior art keywords
transfer
maintenance
processing module
processing
maintenance item
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US10/803,805
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English (en)
Inventor
Aelan Mosden
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to US10/803,805 priority Critical patent/US20050205209A1/en
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MOSDEN, AELAN
Priority to PCT/US2005/005374 priority patent/WO2005093116A2/fr
Publication of US20050205209A1 publication Critical patent/US20050205209A1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching

Definitions

  • the invention relates to a system and method for replacing chamber components, and more particularly to a system and method for replacing chamber components in a vacuum environment.
  • Hurwitt proposes replacing a fixture or such other device that accumulates an undesired coating in a deposition module of a cluster tool by providing a service module having replacement devices therein and using a transfer arm in the transfer module of the tool to exchange the coated device in the deposition module with one of the replacement devices within the vacuum environment of the cluster tool.
  • the example shown by Hurwitt envisions some releaseable mounting mechanism, such as a pin and slot structure, which requires some manipulation with actions by the transfer arm to remove the part being replaced and to install the replacement.
  • the invention provides an apparatus and method for replacing parts in a vacuum chamber of a substrate processing system without venting the vacuum.
  • processing systems are those of the types used for processing substrates such as semiconductor wafers.
  • These processing systems typically include one or more processing modules, for example, deposition, etch, cleaning, heat treating or other processing modules, and a transfer system having transfer ports at a number of locations that communicate with the processing modules, with loadlocks and other loading devices, and to other systems.
  • the transfer system transfers substrates among and through the ports and the modules and systems connected to them.
  • the transfer system of the processing system is used to transfer parts or components of the processing system to and from the processing module for service or replacement.
  • the parts are moved without excessive motions or special actions being performed by the transfer arm and without the kind of manipulation of mounting structure and fastening elements that can cause particle generation that can contaminate the chamber.
  • the parts to be replaced are configured to be picked up by the normal motions of a transfer arm that are used in the handling of wafers to be processed, and actuators necessary to release and present the parts in a condition to be picked up by the transfer arm are provided in the process module.
  • a generic transfer module and transfer mechanism such as a standard fork type end effector, can be used.
  • a modified end effector can be used, or a transfer arm or transfer module with minimal modification.
  • a separate transfer arm may be used for maintenance items that require a different end effector than is on the wafer transfer arm or the transfer arm that is configured to transfer wafers and other maintenance items.
  • more than one transfer arm can be used to increase throughput.
  • a lift pin system is provided to raise an upwardly facing focus ring or peripheral deposition shield from around the perimeter of a wafer on a wafer support in an etching module or a deposition module.
  • actuators lower and release a deposition shield in a deposition module from the sputtering cathode assembly. In both cases, the part is moved into a position where it can be engaged at a peripheral edge configured for pick up by a wafer transfer arm.
  • the part release features are provided without requiring mechanical or structural modification of the tool beyond the modules that are being provided.
  • the parts being replaced are typically those that are consumed or coated during the operation of the processing module such that they may need service or replacement. Those parts that routinely must be replaced particularly benefit from the invention.
  • a maintenance system or maintenance module may be connected to the processing system to supply replacement parts or receive parts that are to be replaced, with the transfer system being used to move the parts between the maintenance system and the processing module.
  • maintenance items may include chamber components that have a tendency to degrade as processes are performed in the processing module. Typically, such items are etched or eroded away or accumulate coatings, requiring their occasional removal and replacement. Focus rings, chamber shields, dark space shields, insulators, deposition baffles and adaptors are some of the items requiring periodic replacement.
  • the items that are to be replaced by the invention are mounted in the process module on structure that permits their removal and replacement by a transfer arm or other transfer mechanism of the transfer system. Port sizes on the processing module and maintenance module are large enough to allow the maintenance items to be passed through them.
  • the invention is particularly advantageous for use in replacing annular focus rings and perimeter shields that surround upwardly facing wafer supports in etching systems, where these annular members tend to be eroded by the etching process, requiring periodic replacement.
  • these annular maintenance items can be removably mounted on or around a wafer holder, being held in position only by gravity, where they can be picked up by a wafer transfer arm adapted for that purpose.
  • Lift pins or other delivery or release mechanisms may be provided to facilitate the removable mounting of the maintenance items by a transfer arm. Shields in deposition chambers, where they tend to accumulate deposits of coating material, can also be easily replaced in this manner.
  • a processing system is provided with a transfer system capable of transferring a maintenance item to and from a processing module without exposing the processing module to an outside environment.
  • the transfer system may also be capable of transferring a substrate to and from the processing module, or may be separate from a transfer module of the processing system provided for transferring substrates.
  • An isolation assembly can be coupled between the processing module and the transfer system that is configured for the maintenance item to pass through.
  • a maintenance system may be coupled to the transfer system structure to store maintenance items to be transferred to, or after being transferred from, the processing module.
  • the transfer system may have a transfer arm, and an end effector, and a drive system to move the transfer arm and the end effector so as to pick up a removably mounted maintenance item and transfer it to and from a transfer plate or other support in the transfer system, a substrate holder or item mounting structure in the processing module, or a storage assembly in the maintenance system.
  • a processing system controller that controls the processing module and transfer system may be configured to control the maintenance system and transfer system related thereto.
  • the processing modules that have maintenance items that can be replaced using the invention include etching and deposition modules, ALD modules, patterning and developing modules, metrology and thermal processing modules, cleaning and other modules used in vacuum processing systems, particularly for processing of semiconductor wafers.
  • the replacement process includes removing the maintenance item that is to be replaced from its mounting structure in the processing module with the transfer arm or with other mechanisms provided for that purpose. Then the removed item is transferred from the processing module to the transfer system.
  • FIG. 1 illustrates an exemplary block diagram of a processing system according to an embodiment of the invention.
  • FIG. 1A illustrates one embodiment of a processing system of FIG. 1 in the form of an etch module showing the positioning of a focus ring for replacement by a transfer arm.
  • FIG. 1B illustrates another embodiment of a processing system of FIG. 1 in the form of a sputter deposition module showing the positioning of a deposition shield for replacement by the transfer arm.
  • FIG. 2 illustrates an exemplary block diagram of a transfer system and a processing module according to an embodiment of the invention.
  • FIG. 3 illustrates an exemplary block diagram of a transfer system and a maintenance system according to an embodiment of the invention.
  • FIG. 4A illustrates an exemplary block diagram of a processing system according to an embodiment of the invention.
  • FIG. 4B illustrates an exemplary block diagram of a transfer system, an exchange system, and a processing system according to an embodiment of the invention.
  • FIG. 5A illustrates an exemplary block diagram of a processing system according to an embodiment of the invention.
  • FIG. 5B illustrates an exemplary block diagram of a transfer system, an exchange system, and a maintenance system according to an embodiment of the invention.
  • FIG. 6A illustrates an exemplary block diagram of a processing system according to an embodiment of the invention.
  • FIG. 6B illustrates an exemplary block diagram of a transfer system, a processing module, an exchange system, and a maintenance system according to an embodiment of the invention.
  • FIG. 7A illustrates an exemplary block diagram of a processing system according to an embodiment of the invention.
  • FIG. 7B illustrates an exemplary block diagram of a processing module and a maintenance system according to an embodiment of the invention.
  • FIG. 8 illustrates a flow diagram of a method of operating a processing system in accordance with an embodiment of the invention.
  • FIG. 9 illustrates a flow diagram for another method of operating a processing system in accordance with an embodiment of the invention.
  • maintenance items include consumable chamber components such as sputtering targets and other electrodes as well as members within a processing chamber such as clips, latches, shields, focus rings and structures having surfaces that can be eroded by etching or damaged by plasmas, heat, chemical reactions or other causes.
  • Such maintenance items can also include chamber components that are susceptible to accumulations of deposits, such as shields, structural clamps and structural members, sensors, electrodes, clamps and latches, columnators, and other components exposed to deposition material, reactive gases, plasmas or other processing elements.
  • FIG. 1 illustrates an exemplary block diagram of a processing system according to an embodiment of the invention.
  • a processing system 100 for processing a substrate is shown.
  • the processing system 100 includes a transfer system 140 , a processing module 130 coupled to the transfer system 140 , and a maintenance system 110 coupled to the transfer system 140 .
  • the transfer system 140 is coupled to the maintenance system 110 in order to transfer maintenance items into and out of the maintenance system 110 .
  • the transfer system 140 is coupled to the processing module 130 in order to transfer maintenance items into and out of the processing module 130 .
  • the processing module 130 can exchange substrates with the transfer system 140 .
  • the transfer system 140 permits the transfer of substrates and/or maintenance items to and from processing module 130 .
  • the processing module 130 can be the processing module of an etch system, an ALD system, a deposition system, a coating system, a patterning system, a developing system, a metrology system, a thermal processing system, a cleaning system, and combinations thereof.
  • Processing system 100 also comprises an isolation assembly 10 that can be utilized to couple the transfer system 140 to the processing module 130 and to isolate the transfer system 140 from the processing module 130 .
  • the isolation assembly 10 can comprise at least one of a thermal insulation assembly to provide thermal isolation, and a gate valve assembly to provide vacuum isolation.
  • the isolation assembly has an opening between the processing module 130 and the transfer system 140 that is large enough to allow maintenance items to pass through.
  • the isolation assembly 10 can be used to transfer maintenance items into and out of the processing module 130 either when the processing module 130 is coupled to the transfer system 140 or when the processing module 130 is not coupled to the transfer system 140 .
  • the isolation assembly 10 can be used to transfer substrates into and out of the processing module 130 both when the processing module 130 is coupled to the transfer system 140 and when the processing module 130 is not coupled to the transfer system 140 .
  • gate valve assembly 10 can comprise two gate valves 10 A and 10 B, one attached to the processing module 130 , and one attached to the transfer system 140 , respectively. Alternately, a different number of gate valves can be used.
  • the isolation assembly 10 can be the same gate or other port assembly that is used to transfer substrates to and from the processing module 110 for processing, or it may be a separate isolation assembly dedicated to the transfer of maintenance items.
  • Processing system 100 also comprises an isolation assembly 11 that can be utilized to couple the transfer system 140 to the maintenance system 110 and to isolate the transfer system 140 from the maintenance system 110 .
  • the isolation assembly 11 can comprise at least one of a thermal insulation assembly to provide thermal isolation, and a gate valve assembly to provide vacuum isolation.
  • the isolation assembly opening is large enough to allow maintenance items to pass through.
  • the isolation assembly 11 can be used to transfer maintenance items into and out of the maintenance system 110 both when the maintenance system 110 is coupled to the transfer system 140 and when the maintenance system 110 is not coupled to the transfer system 140 .
  • gate valve assembly 11 can comprise two gate valves 11 A and 11 B, one gate valve 11 B is attached to the maintenance system 110 , and one gate valve 11 A is attached to the transfer system 140 .
  • a different number of gate valves can be used.
  • the gate valve openings can be large enough to allow substrates and/or maintenance items to pass through.
  • the maintenance system 110 can comprise a storage subsystem (not shown) that can be used to store maintenance items such as consumable parts or chamber components that might need to be replaced, serviced or reconditioned.
  • Maintenance system 110 can be removably coupled to transfer system 140 .
  • the maintenance system 110 can be fixedly coupled to the transfer system 140 .
  • the gate valve(s) between the transfer system 140 and the maintenance system 110 can be opened; a maintenance item can be transferred between the transfer system and the maintenance system; the gate valve(s) between the transfer system 140 and the maintenance system 110 can be closed; and since the maintenance system and transfer system remain in a vacuum (evacuated) state, an isolated state can be preserved in the processing system.
  • the gate valve(s) between the transfer system 140 and the processing module 130 can be opened; a maintenance item and/or substrate can be transferred between the transfer system and the processing module; the gate valve(s) between the transfer system 140 and the processing module 130 can be closed; and since the maintenance system and transfer system remain in a vacuum (evacuated) state an isolated state can be preserved in the processing system.
  • the gate valve 11 B can be coupled to the maintenance system 110 and can be used to load maintenance items such as consumable parts.
  • the gate valve(s) between the transfer system 140 and the maintenance system 110 can be closed; the maintenance system can be decoupled from the transfer system; the gate valve 11 B can be opened; a maintenance item can be transferred into or out of the maintenance system; the gate valve 11 B can be can be closed; the maintenance system can be evacuated; the maintenance item can be stored in the maintenance system, and an isolated state can be preserved in the processing system.
  • the maintenance system 110 can comprise an additional opening (not shown) that can be used to load maintenance items such as consumable parts, either through a loadlock or otherwise from outside the vacuum environment or by docking with a cassette or transfer module.
  • the maintenance system 110 can merely be vented and opened into a controlled atmospheric pressure environment to exchange used parts with fresh ones.
  • the maintenance system 110 can be removably coupled to transfer system 140 .
  • maintenance system 110 can be fixedly coupled to the transfer system 140 .
  • the gate valve(s) between the transfer system 140 and the maintenance system 110 can be closed; the additional opening (not shown) can be opened; a maintenance item can be positioned in the maintenance system; the additional opening (not shown) can be closed; the maintenance system can be evacuated; the gate valve(s) between the transfer system 140 and the maintenance system 110 can be opened; the maintenance item can be stored in the maintenance system and/or moved from the maintenance system to the transfer system, and an isolated state can be preserved in the processing system.
  • one maintenance system can be used for both new parts and used parts. Alternately, one maintenance system can be used for new parts and another maintenance system can be used for used parts.
  • maintenance system 110 can comprise a cleaning sub-system (not shown) that can clean a maintenance item and/or measuring subsystem for measuring a maintenance item.
  • a controller 160 can be coupled to the processing module 130 , the maintenance system 110 , and the transfer system 140 .
  • controller 160 can be used to control the processing module 130 , the maintenance system 110 , the transfer system 140 , and gate valve assemblies ( 10 and 11 ).
  • the controller 160 can be coupled to a controller (not shown) in the processing module 130 , a controller (not shown) in the maintenance system 110 , and a controller (not shown) in the transfer system 140 .
  • the controller 160 can be coupled to a control element (not shown) in a multi-element manufacturing system (not shown).
  • FIG. 1A illustrates an embodiment of the system 100 of FIG. 1 wherein the processing module 130 is an etch module 130 A having a vacuum processing chamber 131 with a plasma source 133 in the upper section 132 thereof with an upwardly facing wafer support 134 at the bottom.
  • the plasma source energizes a plasma in the chamber 131 for etching a wafer 135 on the wafer support 134 .
  • a focus ring 136 is provided on the wafer support 134 to shape the electric fields so as to prevent an edge effect around the edge of the wafer 135 that undermines the etch uniformity. In the etching process, the focus ring 136 undergoes some etching, which necessitates its occasional replacement, making it a maintenance item in the context of the present invention.
  • the focus ring 136 has a wafer shaped edge 137 that allows it to be easily handled by the wafer transfer arm 194 of a transfer mechanism 198 within a transfer module or transfer system 130 .
  • a set of lift pins 138 is provided in the wafer support 134 to lift the focus ring 136 , on command from the controller 160 , to present the focus ring 136 in position to be easily picked up and replaced by motion of the transfer arm 194 .
  • the processing module 130 is a physical vapor deposition module 130 B having a vacuum processing chamber 141 with a sputtering target 142 and a plasma source 143 in the upper section 132 thereof with an upwardly facing wafer support 134 at the bottom.
  • the plasma source 142 energizes a high density plasma in the chamber 141 while a DC power source (not shown) energizes the sputtering target 142 for producing coating material for coating wafer 135 on the wafer support 134 .
  • a deposition shield 146 is provided at the plasma source 143 to protect a dielectric window 145 from deposition.
  • the deposition shield 146 In the deposition process, the deposition shield 146 accumulates deposition material, which necessitates its occasional replacement, making it a maintenance item in the context of the present invention.
  • the deposition shield 146 has a wafer shaped edge 147 that allows it to be easily handled by the transfer arm 194 of a transfer mechanism 198 within a transfer module or transfer system 130 .
  • a set of lowering rods 148 is provided in the wafer support 134 to lower the deposition shield 146 , on command from the controller 160 , to present the deposition shield 146 in position to be easily picked up and replaced by motion of the transfer arm 194 .
  • the lowering rods are configured to release the shield 146 by making a partial rotation.
  • FIG. 2 illustrates an exemplary block diagram of a transfer system and a processing module according to an embodiment of the invention.
  • a processing module 130 is shown coupled to a transfer system 140 .
  • a number of processing modules 130 can be coupled to a transfer system 140 .
  • a number of transfer systems 140 can be coupled to a processing module 130 .
  • the transfer system 140 includes a transfer assembly 180 , and transfer plate 184 .
  • the transfer assembly 180 can be used to move the transfer plate 184 in at least one direction in the transfer system 140 .
  • the transfer plate 184 can be moved from one chamber to another, from one system to another, or from one position to another.
  • the transfer system 140 can also comprise an exchange system 190 for transferring substrates and/or maintenance items.
  • Exchange system 190 can comprise a drive system 192 , a transfer arm 194 , and an end effector 196 .
  • the drive system 192 is used to move the transfer arm 194 and end effector horizontally, vertically, and rotationally in order to transfer substrates and/or maintenance items between the transfer system 140 and the processing module 130 .
  • Several transfer arms 194 and end effectors 196 are shown in FIG. 2 to illustrate some of the various positions for the transfer arm 194 and end effector 196 .
  • one transfer arm 194 and one end effector 196 are used.
  • two transfer arms 194 and two end effectors 196 can be used to increase throughput.
  • one end effector can be used to transfer maintenance items and one end effector can be used to transfer substrates.
  • the exchange system 190 can be used to transfer a maintenance item 170 A between the transfer plate 184 in the transfer system and the substrate holder 134 in the processing module.
  • the maintenance item 170 A can be a ring, a shield, an insulator, an adapter, a plate or some other component that is removably mounted on or near the substrate holder.
  • the exchange system 190 can also be used to transfer a substrate 170 B between the transfer plate 184 in the transfer system and the substrate holder 134 in the processing module.
  • substrate 170 B can be at least one of a production substrate, a dummy substrate, a test substrate, and a test device.
  • the exchange system 190 can be used to transfer a maintenance item 170 C between the transfer plate 184 in the transfer system and the upper assembly 132 in the processing module.
  • maintenance item 170 C can be a shield, an insulator, an adapter, an electrode, an antenna, or some other component of the processing chamber remote from the substrate holder.
  • Maintenance items that can be most easily replaced without breaking the vacuum of the system are those that are secured in place in simple ways, particularly those that are merely set in place and do not require complex fasteners or complicated securing structure. Such simply secured items can thus be removed and replaced with a transfer arm or otherwise robotically through the isolation assemblies. Other items can be redesigned to facilitate their easy removal and replacement with transfer arms.
  • FIG. 3 illustrates an exemplary block diagram of a transfer system and a maintenance system according to an embodiment of the invention.
  • a maintenance system 110 is shown coupled to a transfer system 140 .
  • a number of maintenance systems 110 can be coupled to a transfer system 140 .
  • a number of transfer systems 140 can be coupled to a maintenance system 110 .
  • Transfer system 140 can comprise a transfer assembly 180 and transfer plate 184 .
  • the transfer assembly 180 can be used to move the transfer plate in at least one direction in the transfer system.
  • the transfer plate can be moved from one chamber to another, from one system to another, or from one position to another.
  • the transfer system 140 can also comprise an exchange system 190 for transferring substrates and/or maintenance items.
  • the exchange system 190 can comprise a drive system 192 , a transfer arm 194 , and an end effector 196 .
  • the drive system 192 is used to move the transfer arm 194 and end effector horizontally, vertically, and rotationally in order to transfer substrates and/or maintenance items between the transfer system 140 and the maintenance system 110 .
  • Two transfer arms 194 and end effectors 196 are shown in FIG. 3 to illustrate some of the various positions for the transfer arm 194 and end effector 196 .
  • one transfer arm 194 and one end effector 196 are used.
  • two transfer arms 194 and two end effectors 196 can be used to increase throughput.
  • one end effector can be used to transfer a new maintenance item and one end effector can be used to transfer a used maintenance item.
  • the exchange system 190 can be used to transfer a maintenance item 170 A between the transfer plate 184 in the transfer system and the storage assembly 112 in the maintenance system.
  • maintenance item 170 A can be at least one of a ring, a shield, an insulator, an adapter, and a plate.
  • Exchange system 190 can also be used to transfer a substrate 170 B between the transfer plate 184 in the transfer system and the storage assembly 112 in the maintenance system.
  • substrate 170 B can be at least one of a production substrate, a dummy substrate, a test substrate, and a test device.
  • FIG. 4A illustrates an exemplary block diagram of a processing system according to an embodiment of the invention.
  • a processing system 400 for processing a substrate is shown.
  • Processing system 400 can comprise a transfer system 440 , an exchange system 490 coupled to the transfer system 440 , and a processing module 430 coupled to the exchange system 490 .
  • An exchange system 490 can be coupled to the processing module 430 in order to transfer maintenance items into and out of the processing module 430 .
  • an exchange system 490 can be coupled to the processing module 430 in order to transfer substrates into and out of the processing module 430 .
  • the exchange system 490 can permit the transfer of substrates and/or maintenance items between the transfer system 440 and the processing module 430 , and the processing module 430 can be associated with an etch system, ALD system, deposition system, coating system, patterning system, developing system, metrology system, thermal processing system, cleaning system, and combinations thereof.
  • the processing system 400 also comprises an isolation assembly 413 that can be utilized to couple the transfer system 440 to the exchange system 490 and to isolate the transfer system 440 from the exchange system 490 .
  • the isolation assembly 413 can comprise at least one of a thermal insulation assembly to provide thermal isolation, and a gate valve assembly to provide vacuum isolation.
  • the isolation assembly opening is large enough to allow maintenance items to pass through.
  • Isolation assembly 413 can be used to transfer maintenance items into and out of the exchange system 490 when the exchange system 490 is coupled to the transfer system 440 and when the exchange system 490 is not coupled to the transfer system 440 .
  • the isolation assembly 413 can be used to transfer substrates into and out of the exchange system 490 when the exchange system 490 is coupled to the transfer system 440 .
  • the gate valve assembly 413 can comprise two gate valves ( 413 A and 413 B), one ( 413 B) attached to the exchange system 490 , and one ( 413 A) attached to the transfer system 440 . Alternately, a different number of gate valves can be used.
  • the processing system 400 also comprises an isolation assembly 414 that can be utilized to couple the processing module 430 to the exchange system 490 and to isolate the processing module 430 from the exchange system 490 .
  • the isolation assembly 414 can comprise at least one of a thermal insulation assembly to provide thermal isolation, and a gate valve assembly to provide vacuum isolation.
  • the isolation assembly opening is large enough to allow maintenance items to pass through.
  • the isolation assembly 414 can be used to transfer maintenance items and/or substrates between the processing module 430 and the exchange system 490 when the exchange system 490 is coupled to the processing module 430 .
  • the exchange system 490 can be used to transfer maintenance items and/or substrates between the transfer system 440 and the processing system 430 when the exchange system 490 is coupled to the transfer system 440 and the processing system 430 .
  • the gate valve assembly 414 can comprise two gate valves ( 414 A and 414 B), one ( 414 A) attached to the exchange system 490 , and one ( 414 B) attached to the processing system 430 . Alternately, a different number of gate valves can be used.
  • the exchange system 490 is used to transfer maintenance items such as consumable parts.
  • the exchange system 490 can comprise a storage means (not shown) that can be used to store maintenance items such as consumable parts.
  • the exchange system 490 can be removably coupled to the transfer system 440 .
  • the exchange system 490 can be fixedly coupled to the transfer system 440 .
  • the gate valve(s) between the transfer system 440 and the exchange system 490 can be opened; a maintenance item can be transferred between the transfer system and the exchange system; the gate valve(s) between the transfer system 440 and the exchange system 490 can be closed; and since the exchange system and transfer system remain in a vacuum (evacuated) state, an isolated state can be preserved in the processing system.
  • the gate valve(s) between the exchange system 490 and the processing module 430 can be opened; a maintenance item and/or substrate can be transferred between the transfer system and the processing module; the gate valve(s) between the exchange system 490 and the processing module 430 can be closed; and since the exchange system and transfer system remain in a vacuum (evacuated) state, an isolated state can be preserved in the processing system.
  • the exchange system 490 can comprise means for cleaning a maintenance item and/or measuring a maintenance item.
  • a controller 460 can be coupled to the processing module 430 , the exchange system 490 , and the transfer system 440 .
  • the controller 460 can be used to control the processing module 430 , the exchange system 490 , and the transfer system 440 .
  • the controller 460 can be coupled to a controller (not shown) in the processing module 430 , a controller (not shown) in the exchange system 490 , and a controller (not shown) in the transfer system 440 .
  • the controller 460 can be coupled to a control element (not shown) in a multi-element manufacturing system (not shown).
  • FIG. 4B illustrates an exemplary block diagram of a transfer system, an exchange system, and a processing system according to an embodiment of the invention.
  • an exchange system 490 is shown coupled to a processing module 430 and to a transfer system 440 .
  • a number of processing modules 430 can be coupled to an exchange system 490 .
  • a number of transfer systems 440 can be coupled to an exchange system 490 .
  • the transfer system 440 can comprise a transfer assembly 480 and transfer plate 484 .
  • the transfer assembly 480 can be used to move transfer plate in at least one direction in the transfer system. For example, the transfer plate can be moved from one chamber to another, from one system to another, or from one position to another.
  • the transfer plate 484 can be used to hold a substrate and/or maintenance item.
  • Transfer system 440 can be coupled to an exchange system 490 for transferring substrates and/or maintenance items.
  • the exchange system 490 can comprise a drive system 492 , a transfer arm 494 , and an end effector 496 .
  • the drive system 492 is used to move the transfer arm 494 and end effector horizontally, vertically, and rotationally in order to transfer substrates and/or maintenance items between the transfer system 440 and the processing module 430 .
  • Several transfer arms 494 and end effectors 496 are shown in FIG. 4B to illustrate some of the various positions for the transfer arm 494 and end effector 496 . In one embodiment, one transfer arm 494 and one end effector 496 are used. Alternately, two transfer arms 494 and two end effectors 496 can be used to increase throughput.
  • the exchange system 490 can be used to transfer a maintenance item 470 A between the transfer plate 484 in the transfer system and the substrate holder 434 in the processing module.
  • maintenance item 470 A can be at least one of a ring, a shield, an insulator, an adapter, and a plate.
  • the exchange system 490 can also be used to transfer a substrate 470 B between the transfer plate 484 in the transfer system and the substrate holder 434 in the processing module.
  • substrate 470 B can be at least one of a production substrate, a dummy substrate, a test substrate, and a test device.
  • the exchange system 490 can be used to transfer a maintenance item 470 C between the transfer plate 484 in the transfer system and the upper assembly 432 in the processing module.
  • maintenance item 470 C can be at least one of a ring, a shield, an insulator, an adapter, and a plate.
  • FIG. 5A illustrates an exemplary block diagram of a processing system according to an embodiment of the invention.
  • a processing system 500 for processing a substrate is shown.
  • the processing system 500 can comprise a transfer system 540 , an exchange system 590 coupled to the transfer system 540 , and a maintenance system 510 coupled to the exchange system 590 .
  • the maintenance system 510 can be used for storing and/or transporting substrates and/or maintenance items.
  • the maintenance system 510 can comprise means for cleaning and/or measuring a maintenance item.
  • An exchange system 590 can be coupled to the maintenance system 510 in order to transfer substrates and/or maintenance items into and out of the maintenance system 510 .
  • the processing system 500 also comprises an isolation assembly 515 that can be utilized to couple the transfer system 540 to the exchange system 590 and to isolate the transfer system 540 from the exchange system 590 .
  • the isolation assembly 515 can comprise at least one of a thermal insulation assembly to provide thermal isolation, and a gate valve assembly to provide vacuum isolation.
  • the isolation assembly opening is large enough to allow maintenance items to pass through.
  • Isolation assembly 515 can be used to transfer maintenance items into and out of the exchange system 590 when the exchange system 590 is coupled to the transfer system 540 and when the exchange system 590 is not coupled to the transfer system 540 .
  • the isolation assembly 515 can be used to transfer substrates into and out of the exchange system 590 when the exchange system 590 is coupled to the transfer system 540 .
  • gate valve assembly 515 can comprise two gate valves ( 515 A and 515 B), one ( 515 B) attached to the exchange system 590 , and one ( 515 A) attached to the transfer system 540 . Alternately, a different number of gate valves can be used.
  • the processing system 500 also comprises an isolation assembly 516 that can be utilized to couple the maintenance system 510 to the exchange system 590 and to isolate the maintenance system 510 from the exchange system 590 .
  • the isolation assembly 516 can comprise at least one of a thermal insulation assembly to provide thermal isolation, and a gate valve assembly to provide vacuum isolation.
  • the isolation assembly opening is large enough to allow maintenance items to pass through.
  • Isolation assembly 516 can be used to transfer maintenance items and/or substrates between the maintenance system 510 and the exchange system 590 when the exchange system 590 is coupled to the maintenance system 510 .
  • the exchange system 590 can be used to transfer maintenance items and/or substrates between the transfer system 540 and the maintenance system 510 when the exchange system 590 is coupled to the transfer system 540 and the maintenance system 510 .
  • gate valve assembly 516 can comprise two gate valves ( 516 A and 516 B), one ( 516 A) attached to the exchange system 590 , and one ( 516 B) attached to the maintenance system 510 . Alternately, a different number of gate valves can be used.
  • the exchange system 590 is used to transfer maintenance items such as consumable parts.
  • the exchange system 590 can comprise a storage means (not shown) that can be used to store maintenance items such as consumable parts.
  • the exchange system 590 can be removably coupled to the transfer system 540 .
  • the exchange system 590 can be fixedly coupled to the transfer system 540 .
  • the gate valve(s) between the transfer system 540 and the exchange system 590 can be opened; a maintenance item can be transferred between the transfer system and the exchange system; the gate valve(s) between the transfer system 540 and the exchange system 590 can be closed; and since the exchange system and transfer system remain in a vacuum (evacuated) state, an isolated state can be preserved in the processing system.
  • the gate valve(s) between the exchange system 590 and the maintenance system 510 can be opened; a maintenance item and/or substrate can be transferred between the exchange system and the maintenance system; the gate valve(s) between the exchange system 590 and the maintenance system 510 can be closed; and since the exchange system and maintenance system remain in a vacuum (evacuated) state, an isolated state can be preserved in the processing system.
  • a controller 560 can be coupled to the maintenance system 510 , the exchange system 590 , and the transfer system 540 .
  • the controller 560 can be used to control the maintenance system 510 , the exchange system 590 , and the transfer system 540 .
  • the controller 560 can be coupled to a controller (not shown) in the maintenance system 510 , a controller (not shown) in the exchange system 590 , and a controller (not shown) in the transfer system 540 .
  • the controller 560 can be coupled to a control element (not shown) in a multi-element manufacturing system (not shown).
  • FIG. 5B illustrates an exemplary block diagram of a transfer system, an exchange system, and a maintenance system according to an embodiment of the invention.
  • an exchange system 590 is shown coupled to a maintenance system 510 and to a transfer system 540 .
  • a number of exchange systems 590 can be coupled to a transfer system 540 .
  • a number of exchange systems 590 can be coupled to a maintenance system 510 .
  • a number of maintenance systems 510 can be coupled to an exchange system 590 .
  • the transfer system 540 can comprise a transfer assembly 580 and transfer plate 584 .
  • the transfer assembly 580 can be used to move the transfer plate in at least one direction in the transfer system.
  • the transfer plate can be moved from one chamber to another, from one system to another, or from one position to another.
  • the transfer plate 584 can be used to hold a substrate and/or maintenance item.
  • the transfer system 540 can be coupled to an exchange system 590 for transferring substrates and/or maintenance items.
  • the exchange system 590 can comprise a drive system 592 , a transfer arm 594 , and an end effector 596 .
  • the drive system 592 is used to move the transfer arm 594 and end effector horizontally, vertically, and rotationally in order to transfer substrates and/or maintenance items between the transfer system 540 and the maintenance system 510 .
  • Two transfer arms 594 and end effectors 596 are shown in FIG. 5B to illustrate some of the various positions for the transfer arm 594 and end effector 596 . In one embodiment, one transfer arm 594 and one end effector 596 are used. Alternately, two transfer arms 594 and two end effectors 596 can be used to increase throughput.
  • the exchange system 590 can be used to transfer a maintenance item 570 A between the transfer plate 584 in the transfer system and the storage assembly 512 in the maintenance system.
  • maintenance item 570 A can be at least one of a ring, a shield, an insulator, an adapter, and a plate.
  • the exchange system 590 can also be used to transfer a substrate 570 B between the transfer plate 584 in the transfer system and the storage assembly 512 in the maintenance system.
  • substrate 570 B can be at least one of a production substrate, a dummy substrate, a test substrate, and a test device.
  • FIG. 6A illustrates an exemplary block diagram of a processing system according to an embodiment of the invention.
  • a processing system 600 for processing a substrate is shown.
  • the processing system 600 can comprise a transfer system 640 , a processing module 630 coupled to the transfer system 640 , an exchange system 690 coupled to the processing module 630 , and a maintenance system 610 coupled to the exchange system 690 .
  • a maintenance system 610 can be used for storing and/or transporting substrates and/or maintenance items.
  • the maintenance system 610 can be coupled to additional systems that can include processing modules, transfer systems, and exchange systems.
  • the maintenance system 610 can comprise means for measuring and/or cleaning a maintenance item.
  • the exchange system 690 can be coupled to the processing module 630 and the maintenance system 610 in order to transfer substrates and/or maintenance items between the maintenance system 610 and the processing module 630 .
  • the exchange system 690 can be coupled to additional systems that can include processing modules, transfer systems, and maintenance systems.
  • the transfer system 640 can permit the transfer of substrates between the transfer system 640 and the processing module 630 .
  • the transfer system 640 can permit the transfer of maintenance items between the transfer system 640 and the processing module 630 .
  • the transfer system 640 can be coupled to additional systems that can include processing modules, exchange systems, and maintenance systems.
  • the processing system 600 can comprise at least one of an etch system, a deposition system, coating system, patterning system, developing system, metrology system, thermal processing system, and lithography system.
  • the processing system 600 can be coupled to additional systems that can include transfer systems, exchange systems, and maintenance systems.
  • Processing system 600 also comprises an isolation assembly 617 that can be utilized to couple the transfer system 640 to the processing module 630 and to isolate the transfer system 640 from the processing module 630 .
  • the isolation assembly 617 can comprise at least one of a thermal insulation assembly to provide thermal isolation, and a gate valve assembly to provide vacuum isolation.
  • the isolation assembly opening is large enough to allow maintenance items and/or substrates to pass through.
  • Isolation assembly 617 can be used to transfer substrates into and out of processing module 630 when processing module 630 is coupled to transfer system 640 .
  • isolation assembly 617 can be used to transfer maintenance items into and out of the processing module 630 when the processing module 630 is coupled to the transfer system 640 and when the processing module 630 is not coupled to the transfer system 640 .
  • gate valve assembly 617 can comprise two gate valves ( 617 A and 617 B), one ( 617 B) attached to the processing module 630 , and one ( 617 A) attached to the transfer system 640 . Alternately, a different number of gate valves can be used.
  • Processing system 600 also comprises an isolation assembly 618 that can be utilized to couple the processing module 630 to the exchange system 690 and to isolate the processing module 630 from the exchange system 690 .
  • the isolation assembly 618 can comprise at least one of a thermal insulation assembly to provide thermal isolation, and a gate valve assembly to provide vacuum isolation.
  • the isolation assembly opening is large enough to allow maintenance items to pass through.
  • the isolation assembly 618 can be used to transfer maintenance items between the processing module 630 and the exchange system 690 when the exchange system 690 is coupled to the processing module 630 .
  • the gate valve assembly 618 can comprise two gate valves ( 618 A and 618 B), one ( 618 A) attached to the exchange system 690 , and one ( 618 B) attached to the maintenance system 610 . Alternately, a different number of gate valves can be used.
  • the processing system 600 also comprises an isolation assembly 619 that can be utilized to couple the maintenance system 610 to the exchange system 690 and to isolate the maintenance system 610 from the exchange system 690 .
  • the isolation assembly 619 can comprise at least one of a thermal insulation assembly to provide thermal isolation, and a gate valve assembly to provide vacuum isolation.
  • the isolation assembly opening is large enough to allow maintenance items to pass through.
  • the isolation assembly 619 can be used to transfer maintenance items between the maintenance system 610 and the exchange system 690 when the exchange system 690 is coupled to the maintenance system 610 .
  • the exchange system 690 can be used to transfer maintenance items between the processing module 630 and the maintenance system 610 when the exchange system 690 is coupled to the processing module 630 and the maintenance system 610 .
  • gate valve assembly 619 can comprise two gate valves ( 619 A and 619 B), one ( 619 A) attached to the exchange system 690 , and one ( 619 B) attached to the maintenance system 610 . Alternately, a different number of gate valves can be used.
  • the exchange system 690 is used to transfer maintenance items such as consumable parts.
  • the exchange system 690 can comprise a storage means (not shown) that can be used to store maintenance items such as consumable parts.
  • the exchange system 690 can be removably coupled to the processing module 630 .
  • the exchange system 690 can be fixedly coupled to the processing module 630 .
  • the exchange system 690 can be removably coupled to the maintenance system 610 .
  • the exchange system 690 can be fixedly coupled to the maintenance system 610 .
  • the gate valve(s) between the processing module 630 and the exchange system 690 can be opened; a maintenance item can be transferred between the processing module and the exchange system; the gate valve(s) between the processing module 630 and the exchange system 690 can be closed; and since the exchange system and processing module remain in a vacuum (evacuated) state, an isolated state can be preserved in the processing system.
  • the gate valve(s) between the exchange system 690 and the maintenance system 610 can be opened; a maintenance item and/or substrate can be transferred between the exchange system and the maintenance system; the gate valve(s) between the exchange system 690 and the maintenance system 610 can be closed; and since the exchange system and maintenance system remain in a vacuum (evacuated) state, an isolated state can be preserved in the processing system.
  • a controller 660 can be coupled to the maintenance system 610 , the processing module 630 , the exchange system 690 , and the transfer system 640 .
  • the controller 660 can be used to control the maintenance system 610 , the processing module 630 , the exchange system 690 , and the transfer system 640 .
  • the controller 660 can be coupled to a controller (not shown) in the processing module 630 , a controller (not shown) in the exchange system 690 , and a controller (not shown) in the transfer system 640 .
  • the controller 660 can be coupled to a control element (not shown) in a multi-element manufacturing system (not shown).
  • FIG. 6B illustrates an exemplary block diagram of a transfer system, a processing module, an exchange system, and a maintenance system according to an embodiment of the invention.
  • a processing module 630 is shown coupled to an exchange system 690 and to a transfer system 640 .
  • a maintenance system 610 is coupled to the exchange system 690 .
  • the exchange system 690 is coupled between the maintenance system 610 and the processing module 630 , and can be used for transferring substrates and/or maintenance items between the maintenance system 610 and the processing module 630 .
  • the exchange system 690 can comprise a drive system 692 , a transfer arm 694 , and an end effector 696 .
  • the drive system 692 is used to move the transfer arm 694 and end effector horizontally, vertically, and rotationally in order to transfer substrates and/or maintenance items between the transfer system 640 and the maintenance system 610 .
  • Several transfer arms 694 and end effectors 696 are shown in FIG. 6B to illustrate some of the various positions for the transfer arm 694 and end effector 696 . In one embodiment, one transfer arm 694 and one end effector 696 are used. Alternately, two transfer arms 694 and two end effectors 696 can be used to increase throughput.
  • the exchange system 690 can be used to transfer a maintenance item 670 A between the storage assembly 612 in the maintenance system and the substrate holder 634 in the processing module.
  • maintenance item 670 A can be at least one of a ring, a shield, an insulator, an adapter, and a plate.
  • the exchange system 690 can also be used to transfer a substrate 670 B between the storage assembly 612 in the maintenance system and the substrate holder 634 in the processing module.
  • substrate 670 B can be at least one of a production substrate, a dummy substrate, a test substrate, and a test device.
  • the exchange system 690 can be used to transfer a maintenance item 670 C between the storage assembly 612 in the maintenance system and the upper assembly 632 in the processing module 630 .
  • maintenance item 670 C can be at least one of a ring, a shield, an insulator, an adapter, and a plate.
  • FIG. 7A illustrates an exemplary block diagram of a processing system according to an embodiment of the invention.
  • a processing system 700 for processing a substrate is shown.
  • the processing system 700 can comprise a transfer system 740 , a processing module 730 coupled to the transfer system 740 , and a maintenance system 795 coupled to the processing module 730 .
  • a maintenance system 795 can be used for storing and/or transporting substrates and/or maintenance items.
  • the maintenance system 795 can be coupled to additional systems that can include processing modules, transfer systems, and exchange systems.
  • the maintenance system 795 can comprise means for measuring and/or cleaning a maintenance item.
  • the transfer system 740 can permit the transfer of substrates between the transfer system 740 and the processing module 730 .
  • the transfer system 740 can permit the transfer of maintenance items between the transfer system 740 and the processing module 730 .
  • the transfer system 740 can be coupled to additional systems that can include processing modules, exchange systems, and maintenance systems.
  • the processing system 700 can comprise at least one of an etch system, a deposition system, coating system, patterning system, developing system, metrology system, thermal processing system, and lithography system.
  • the processing system 700 can be coupled to additional systems that can include transfer systems, exchange systems, and maintenance systems.
  • Processing system 700 also comprises an isolation assembly 721 that can be utilized to couple the transfer system 740 to the processing module 730 and to isolate the transfer system 740 from the processing module 730 .
  • the isolation assembly 721 can comprise at least one of a thermal insulation assembly to provide thermal isolation, and a gate valve assembly to provide vacuum isolation.
  • the isolation assembly opening is large enough to allow substrates to pass through.
  • the isolation assembly 721 can be used to transfer substrates into and out of processing module 730 when the processing module 630 is coupled to the transfer system 640 .
  • the isolation assembly 721 can be used to transfer maintenance items into and out of the processing module 730 when the processing module 730 is coupled to the transfer system 740 and when the processing module 730 is not coupled to the transfer system 740 .
  • gate valve assembly 617 can comprise two gate valves ( 721 A and 721 B), one ( 721 B) attached to the processing module 730 , and one ( 721 A) attached to the transfer system 740 . Alternately, a different number of gate valves can be used.
  • Processing system 700 also comprises an isolation assembly 722 that can be utilized to couple the maintenance system 795 to the processing module 730 and to isolate the maintenance system 795 from the processing module 730 .
  • the isolation assembly 722 can comprise at least one of a thermal insulation assembly to provide thermal isolation, and a gate valve assembly to provide vacuum isolation.
  • the isolation assembly opening is large enough to allow maintenance items to pass through.
  • the isolation assembly 722 can be used to transfer maintenance items between the maintenance system 795 and the processing module 730 when the processing module 730 is coupled to the maintenance system 795 .
  • gate valve assembly 722 can comprise two gate valves ( 722 A and 722 B), one ( 722 A) attached to the processing module 730 , and one ( 722 B) attached to the maintenance system 795 . Alternately, a different number of gate valves can be used.
  • maintenance system 795 is used to transfer maintenance items such as consumable parts.
  • maintenance system 795 can comprise a storage means (not shown) that can be used to store maintenance items such as consumable parts.
  • the maintenance system 795 can be removably coupled to the processing module 730 . In an alternate embodiment, the maintenance system 795 can be fixedly coupled to the processing module 730 .
  • the gate valve(s) between the processing module 730 and the maintenance system 795 can be opened; a maintenance item can be transferred between the processing module and the maintenance system; the gate valve(s) between the processing module 630 and the maintenance system 795 can be closed; and since the maintenance system and processing module remain in a vacuum (evacuated) state, an isolated state can be preserved in the processing system.
  • gate valve 722 B can be coupled to the maintenance system 795 and can be used to load maintenance items such as consumable parts.
  • the gate valve(s) between the processing module 730 and the maintenance system 795 can be closed; the maintenance system can be decoupled from the processing module; gate valve 722 B can be opened; a maintenance item can be transferred into or out of the maintenance system; gate valve 722 B can be can be closed; the maintenance system can be evacuated; the maintenance item can be stored in the maintenance system, and an isolated state can be preserved in the processing system.
  • the maintenance system can be coupled to the processing module and a maintenance item can be transferred between the processing module and the maintenance system.
  • maintenance system 795 can comprise an additional opening (not shown) that can be used to load maintenance items such as consumable parts.
  • the maintenance system 795 can be removably coupled to the processing module 730 .
  • the maintenance system 110 can be fixedly coupled to the processing module 730 .
  • the gate valve(s) between the processing module 730 and the maintenance system 795 can be closed; the additional opening (not shown) can be opened; a maintenance item can be positioned in the maintenance system; the additional opening (not shown) can be closed; the maintenance system can be evacuated; the gate valve(s) between the processing module 730 and the maintenance system 795 can be opened; the maintenance item can be stored in the maintenance system and/or moved from the maintenance system to the processing module, and an isolated state can be preserved in the processing system.
  • one maintenance system can be used for new and used parts. Alternately, one maintenance system can be used for new parts and another maintenance system can be used for used parts.
  • a controller 760 can be coupled to the maintenance system 795 , the processing module 730 , and the transfer system 740 .
  • controller 760 can be used to control the maintenance system 795 , the processing module 730 , and the transfer system 740 .
  • controller 760 can be coupled to a controller in the processing module 730 , a controller in the maintenance system 795 , and a controller in the transfer system 740 .
  • controller 760 can be coupled to a control element (not shown) in a multi-element manufacturing system (not shown).
  • FIG. 7B illustrates an exemplary block diagram of a processing module and a maintenance system according to an embodiment of the invention.
  • a processing module 730 is shown coupled to a maintenance system 795 .
  • the maintenance system 795 comprises an exchange system 790 that can be used for transferring substrates and/or maintenance items between the maintenance system 795 and the processing module 730 .
  • the exchange system 790 can comprise a drive system 792 , a transfer arm 794 , and an end effector 796 .
  • the drive system 792 is used to move the transfer arm 794 and end effector horizontally, vertically, and rotationally in order to transfer substrates and/or maintenance items between the transfer system 740 and the maintenance system 710 .
  • Several transfer arms 794 and end effectors 796 are shown in FIG. 7B to illustrate some of the various positions for the transfer arm 794 and end effector 796 . In one embodiment, one transfer arm 794 and one end effector 796 are used. Alternately, two transfer arms 794 and two end effectors 796 can be used to increase throughput.
  • the exchange system 790 can be used to transfer a maintenance item 770 A between the storage assembly 712 in the maintenance system and the substrate holder 734 in the maintenance system.
  • maintenance item 770 A can be at least one of a ring, a shield, an insulator, an adapter, and a plate.
  • the exchange system 790 can also be used to transfer a substrate 770 B between the storage assembly 712 in the maintenance system and the substrate holder 734 in the maintenance system.
  • substrate 770 B can be at least one of a production substrate, a dummy substrate, a test substrate, and a test device.
  • the exchange system 790 can be used to transfer a maintenance item 770 C between the storage assembly 712 in the maintenance system and the upper assembly 732 in the processing module 730 .
  • maintenance item 770 C can be at least one of a ring, a shield, an insulator, an adapter, and a plate.
  • FIG. 8 illustrates a flow diagram of a method of operating a processing system in accordance with an embodiment of the invention.
  • Procedure 800 starts in 810 .
  • an exchange system removes a first removably mounted maintenance item or a substrate out of a processing module in a processing system.
  • the exchange system can be a part of a transfer system and can transfer the first removably mounted maintenance item or a substrate to a transfer plate in the transfer system.
  • a transfer system can comprise a first transfer plate for transferring maintenance items and a second transfer plate for transferring substrates.
  • the transfer system can comprise a transfer plate configured for transferring maintenance items and/or substrates.
  • the exchange system can be a part of a transfer system and can transfer the first removably mounted maintenance item or a substrate to a holding plate in the transfer system.
  • a transfer system can comprise a first holding plate for holding maintenance items and a second holding plate for holding substrates.
  • the transfer system can comprise a holding plate configured for holding maintenance items and/or substrates.
  • the exchange system can be coupled to a transfer system and a processing system and can transfer the first removably mounted maintenance item or a substrate to a transfer plate in the transfer system.
  • a transfer system can comprise a first transfer plate for transferring maintenance items and a second transfer plate for transferring substrates.
  • the transfer system can comprise a transfer plate configured for transferring maintenance items and/or substrates.
  • the exchange system can be coupled to a transfer system and a processing system and can transfer the first removably mounted maintenance item or a substrate to a holding plate in the exchange system.
  • an exchange system can comprise a first holding plate for holding maintenance items and a second transfer plate for holding substrates.
  • the exchange system can comprise a holding plate configured for holding maintenance items and/or substrates.
  • the exchange system can be coupled to a maintenance system and a processing system and can transfer the first removably mounted maintenance item or a substrate to a storage assembly in the transfer system.
  • a maintenance system can comprise a first storage assembly for holding maintenance items and a second storage assembly for holding substrates.
  • the maintenance system can comprise a storage assembly configured for holding maintenance items and/or substrates.
  • the exchange system can be coupled to a maintenance system and a processing system and can transfer the first removably mounted maintenance item or a substrate to a holding plate in the exchange system.
  • an exchange system can comprise a first holding plate for holding maintenance items and a second transfer plate for holding substrates.
  • the exchange system can comprise a holding plate configured for holding maintenance items and/or substrates.
  • the exchange system can be part of a maintenance system that is coupled to a processing system and can transfer the first removably mounted maintenance item or a substrate to a storage assembly in the maintenance system.
  • a maintenance system can comprise a first storage assembly for holding maintenance items and a second storage assembly for holding substrates.
  • the maintenance system can comprise a storage assembly configured for holding maintenance items and/or substrates.
  • the exchange system can be part of a maintenance system that is coupled to a processing system and can transfer the first removably mounted maintenance item or a substrate to a holding plate in the maintenance system.
  • a maintenance system can comprise a first holding plate for holding maintenance items and a second transfer plate for holding substrates.
  • the maintenance system can comprise a holding plate configured for holding maintenance items and/or substrates.
  • the exchange system can transfer a second removably mounted maintenance item or a wafer into the processing module.
  • the exchange system can be a part of a transfer system and can transfer the second removably mounted maintenance item or a substrate from a transfer plate in the transfer system.
  • a transfer system can comprise a first transfer plate for transferring maintenance items and a second transfer plate for transferring substrates.
  • the transfer system can comprise a transfer plate configured for transferring maintenance items and/or substrates.
  • the exchange system can be a part of a transfer system and can transfer the second removably mounted maintenance item or a substrate from a holding plate in the transfer system.
  • a transfer system can comprise a first holding plate for holding maintenance items and a second holding plate for holding substrates.
  • the transfer system can comprise a holding plate configured for holding maintenance items and/or substrates.
  • the exchange system can be coupled to a transfer system and a processing system and can transfer the second removably mounted maintenance item or a substrate from a transfer plate in the transfer system.
  • a transfer system can comprise a first transfer plate for transferring maintenance items and a second transfer plate for transferring substrates.
  • the transfer system can comprise a transfer plate configured for transferring maintenance items and/or substrates.
  • the exchange system can be coupled to a transfer system and a processing system and can transfer the second removably mounted maintenance item or a substrate from a holding plate in the exchange system.
  • an exchange system can comprise a first holding plate for holding maintenance items and a second transfer plate for holding substrates.
  • the exchange system can comprise a holding plate configured for holding maintenance items and/or substrates.
  • the exchange system can be coupled to a maintenance system and a processing system and can transfer the second removably mounted maintenance item or a substrate from a storage assembly in the transfer system.
  • a maintenance system can comprise a first storage assembly for holding maintenance items and a second storage assembly for holding substrates.
  • the maintenance system can comprise a storage assembly configured for holding maintenance items and/or substrates.
  • the exchange system can be coupled to a maintenance system and a processing system and can transfer the second removably mounted maintenance item or a substrate from a holding plate in the exchange system.
  • an exchange system can comprise a first holding plate for holding maintenance items and a second transfer plate for holding substrates.
  • the exchange system can comprise a holding plate configured for holding maintenance items and/or substrates.
  • the exchange system can be part of a maintenance system that is coupled to a processing system and can transfer the second removably mounted maintenance item or a substrate from a storage assembly in the maintenance system.
  • a maintenance system can comprise a first storage assembly for holding maintenance items and a second storage assembly for holding substrates.
  • the maintenance system can comprise a storage assembly configured for holding maintenance items and/or substrates.
  • the exchange system can be part of a maintenance system that is coupled to a processing system and can transfer the second removably mounted maintenance item or a substrate from a holding plate in the maintenance system.
  • a maintenance system can comprise a first holding plate for holding maintenance items and a second transfer plate for holding substrates.
  • the maintenance system can comprise a holding plate configured for holding maintenance items and/or substrates.
  • Procedure 800 ends in 840 .
  • the exchange system can comprise two transfer means; the first transfer means can be used to transfer the first removably mounted maintenance item or substrate; and the second transfer means can be used to transfer the second removably mounted maintenance item or substrate.
  • FIG. 9 illustrates a flow diagram for another method of operating a processing system in accordance with an embodiment of the invention.
  • Procedure 900 starts in 910 .
  • a processing module is coupled to a first position in a transfer system using a first isolation assembly.
  • the processing module can comprise a first maintenance item, and the first maintenance item can be removably mounted in the process module.
  • the processing module can be an etching module and can comprise a maintenance item for an etching module, and the maintenance item can be removably mounted in the etching module.
  • the first maintenance item can be detached from the processing module.
  • a maintenance item can be lifted off a substrate holder or can be decoupled from an upper assembly.
  • the first maintenance item can be transferred from the processing module to the transfer system.
  • the transfer system can comprise a first exchange system for transferring the first maintenance item between the transfer system and the processing module through the first isolation assembly without exposing the processing module to an outside environment.
  • a maintenance system can be coupled to a second position in the transfer system using a second isolation assembly.
  • the maintenance system can comprise a second maintenance item, and the second maintenance item can be removably mounted in the process module.
  • the second maintenance item can be transferred from the maintenance system to the transfer system.
  • the transfer system can comprise a second exchange system for transferring the maintenance item between the maintenance system and the transfer system through the second isolation assembly without exposing the system to an outside environment.
  • the second maintenance item can be transferred from the transfer system to the processing module.
  • the first exchange system can comprise means for transferring the second maintenance item between the transfer system and the processing module through the first isolation assembly without exposing the system to an outside environment.
  • Procedure 900 ends in 950 .
  • additional substrates can be processed.
  • a transfer plate and a transfer assembly in a transfer system can be used to move a maintenance item and/or a substrate from one position to another position in the transfer system.
  • processing system components can be configured differently.
  • a stacked arrangement or a side-by-side arrangement can be used.
  • a maintenance system, an exchange system, and/or a transfer system can comprise at least one of a thermal control system, a pressure control system, a gas supply system, an end effector exchange system, a clamping system, a lifting system, an aligning system, a monitoring system.

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  • Condensed Matter Physics & Semiconductors (AREA)
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US10/803,805 2004-03-18 2004-03-18 Replacing chamber components in a vacuum environment Abandoned US20050205209A1 (en)

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US10/803,805 US20050205209A1 (en) 2004-03-18 2004-03-18 Replacing chamber components in a vacuum environment
PCT/US2005/005374 WO2005093116A2 (fr) 2004-03-18 2005-02-22 Remplacement d'elements de chambre dans un environnement sous vide

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Cited By (21)

* Cited by examiner, † Cited by third party
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