WO2005093116A3 - Remplacement d'elements de chambre dans un environnement sous vide - Google Patents

Remplacement d'elements de chambre dans un environnement sous vide Download PDF

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Publication number
WO2005093116A3
WO2005093116A3 PCT/US2005/005374 US2005005374W WO2005093116A3 WO 2005093116 A3 WO2005093116 A3 WO 2005093116A3 US 2005005374 W US2005005374 W US 2005005374W WO 2005093116 A3 WO2005093116 A3 WO 2005093116A3
Authority
WO
WIPO (PCT)
Prior art keywords
transfer
items
module
replacement
component
Prior art date
Application number
PCT/US2005/005374
Other languages
English (en)
Other versions
WO2005093116A2 (fr
Inventor
Aelan Mosden
Original Assignee
Tokyo Electron Ltd
Tokyo Electron America Inc
Aelan Mosden
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Tokyo Electron America Inc, Aelan Mosden filed Critical Tokyo Electron Ltd
Publication of WO2005093116A2 publication Critical patent/WO2005093116A2/fr
Publication of WO2005093116A3 publication Critical patent/WO2005093116A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

La présente invention concerne un appareil (100) et un procédé permettant de remplacer des pièces dans une chambre sous vide (131) sans mise à pression atmosphérique. Un système de transfert (140) est utilisé pour transférer un élément monté de manière démontable (170) à partir d'un module de traitement (130) fixé à un système de transfert et remplacer cet élément par un autre élément provenant d'un système de maintenance (110) qui est connecté à travers un ensemble isolation à un module de transfert. Ce système de maintenance peut comprendre une fourniture de pièces de remplacement et recevoir des articles consommables ou en état de service qu'il convient de remplacer. Ces articles en état de service peuvent comprendre des éléments de chambre qui ont tendance à se dégrader pendant des processus effectués dans le module de traitement. Habituellement ces articles sont attaqués ou érodés ou ils accumulent des couches, nécessitant leur extraction et un remplacement occasionnel. Des bagues de focalisation (136), des écrans de chambre, des écrans d'espace sombre, des isolateurs, des pièges à dépôt (146) et des adaptateurs peuvent être des articles nécessitant un remplacement périodique. Ces articles sont installés dans le module de traitement d'une façon qui permette leur extraction leur remplacement par un bras de transfert ou par un autre mécanisme de transfert du système de transfert ou encore par des mécanismes robotiques. Le module de traitement peut-être un module d'attaque, de dépôt ALD, de dessin, de développement, de métrologie, de traitement thermique, de nettoyage ou encore un autre module utilisé dans un processus sous vide, en particulier pour le traitement de plaquettes semiconductrices.
PCT/US2005/005374 2004-03-18 2005-02-22 Remplacement d'elements de chambre dans un environnement sous vide WO2005093116A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/803,805 2004-03-18
US10/803,805 US20050205209A1 (en) 2004-03-18 2004-03-18 Replacing chamber components in a vacuum environment

Publications (2)

Publication Number Publication Date
WO2005093116A2 WO2005093116A2 (fr) 2005-10-06
WO2005093116A3 true WO2005093116A3 (fr) 2006-03-16

Family

ID=34984939

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/005374 WO2005093116A2 (fr) 2004-03-18 2005-02-22 Remplacement d'elements de chambre dans un environnement sous vide

Country Status (2)

Country Link
US (1) US20050205209A1 (fr)
WO (1) WO2005093116A2 (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7531470B2 (en) * 2005-09-27 2009-05-12 Advantech Global, Ltd Method and apparatus for electronic device manufacture using shadow masks
US7581916B2 (en) * 2006-07-14 2009-09-01 Ulvac-Phi, Inc. Sample introduction and transfer system and method
KR100992229B1 (ko) * 2008-08-29 2010-11-05 삼성전기주식회사 롤투롤타입의 박막형성장치
JP6003011B2 (ja) * 2011-03-31 2016-10-05 東京エレクトロン株式会社 基板処理装置
KR20150060605A (ko) * 2012-10-04 2015-06-03 다이요닛산 가부시키가이샤 기상성장장치
WO2016040547A1 (fr) * 2014-09-11 2016-03-17 Massachusetts Institute Of Technology Système de traitement pour petits substrats
US10062599B2 (en) 2015-10-22 2018-08-28 Lam Research Corporation Automated replacement of consumable parts using interfacing chambers
US10124492B2 (en) * 2015-10-22 2018-11-13 Lam Research Corporation Automated replacement of consumable parts using end effectors interfacing with plasma processing system
US9881820B2 (en) 2015-10-22 2018-01-30 Lam Research Corporation Front opening ring pod
US20170115657A1 (en) * 2015-10-22 2017-04-27 Lam Research Corporation Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ
CN108369922B (zh) 2016-01-26 2023-03-21 应用材料公司 晶片边缘环升降解决方案
JP6723889B2 (ja) * 2016-09-28 2020-07-15 株式会社荏原製作所 めっき装置
US20200365381A1 (en) 2019-05-14 2020-11-19 Mattson Technology, Inc. Systems And Methods For Transportation Of Replaceable Parts In a Vacuum Processing Apparatus
US20200373190A1 (en) * 2019-05-20 2020-11-26 Applied Materials, Inc. Process kit enclosure system
US11469123B2 (en) * 2019-08-19 2022-10-11 Applied Materials, Inc. Mapping of a replacement parts storage container
JP7419154B2 (ja) 2020-05-01 2024-01-22 東京エレクトロン株式会社 部品交換システムおよび部品交換装置
JP7409976B2 (ja) * 2020-06-22 2024-01-09 東京エレクトロン株式会社 プラズマ処理システム、プラズマ処理装置及びエッジリングの交換方法
TW202203319A (zh) * 2020-06-24 2022-01-16 日商東京威力科創股份有限公司 基板處理裝置
TW202224882A (zh) * 2020-11-12 2022-07-01 日商東京威力科創股份有限公司 偵測裝置、處理系統及搬運方法
WO2022128026A1 (fr) * 2020-12-17 2022-06-23 Solayer Gmbh Procédé et dispositif pour changer des substrats d'essai dans un système de passage sous vide, procédé de traitement, et installation de passage sous vide
US20230260770A1 (en) * 2022-02-16 2023-08-17 Taiwan Semiconductor Manufacturing Company Limited Semiconductor tool for copper deposition

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0511733A1 (fr) * 1991-04-30 1992-11-04 Applied Materials, Inc. Dispositif de fermeture amovible pour chambre de traitement de semi-conducteurs
EP0824266A2 (fr) * 1996-08-05 1998-02-18 Kokusai Electric Co., Ltd. Dispositif pour le traitement de substrats
US6500742B1 (en) * 1994-11-14 2002-12-31 Applied Materials, Inc. Construction of a film on a semiconductor wafer

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5085410A (en) * 1989-12-14 1992-02-04 Jersey Nuclear-Avco Isotopes, Inc. Modular processing system
JPH081923B2 (ja) * 1991-06-24 1996-01-10 ティーディーケイ株式会社 クリーン搬送方法及び装置
US5826129A (en) * 1994-06-30 1998-10-20 Tokyo Electron Limited Substrate processing system
TW359849B (en) * 1994-12-08 1999-06-01 Tokyo Electron Ltd Sputtering apparatus having an on board service module
US6095741A (en) * 1999-03-29 2000-08-01 Lam Research Corporation Dual sided slot valve and method for implementing the same
US6267545B1 (en) * 1999-03-29 2001-07-31 Lam Research Corporation Semiconductor processing platform architecture having processing module isolation capabilities
US6958098B2 (en) * 2000-02-28 2005-10-25 Applied Materials, Inc. Semiconductor wafer support lift-pin assembly
JP5236142B2 (ja) * 2000-06-16 2013-07-17 東京エレクトロン株式会社 コントローラ間の接続状態を検出する半導体製造装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0511733A1 (fr) * 1991-04-30 1992-11-04 Applied Materials, Inc. Dispositif de fermeture amovible pour chambre de traitement de semi-conducteurs
US6500742B1 (en) * 1994-11-14 2002-12-31 Applied Materials, Inc. Construction of a film on a semiconductor wafer
EP0824266A2 (fr) * 1996-08-05 1998-02-18 Kokusai Electric Co., Ltd. Dispositif pour le traitement de substrats

Also Published As

Publication number Publication date
US20050205209A1 (en) 2005-09-22
WO2005093116A2 (fr) 2005-10-06

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