US20050139477A1 - Method for storage of a metal ion supply source in a plating equipment - Google Patents

Method for storage of a metal ion supply source in a plating equipment Download PDF

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Publication number
US20050139477A1
US20050139477A1 US10/502,557 US50255705A US2005139477A1 US 20050139477 A1 US20050139477 A1 US 20050139477A1 US 50255705 A US50255705 A US 50255705A US 2005139477 A1 US2005139477 A1 US 2005139477A1
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US
United States
Prior art keywords
plating
solution
tank
replacement
reservoir
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/502,557
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English (en)
Inventor
Yoshihisa Muranushi
Tadashi Saitoh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Assigned to ATOTECH DEUTSCHLAND GMBH reassignment ATOTECH DEUTSCHLAND GMBH ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MURANUSHI, YOSHIHISA, SAITOH, TADASHI
Publication of US20050139477A1 publication Critical patent/US20050139477A1/en
Assigned to BARCLAYS BANK PLC, AS COLLATERAL AGENT reassignment BARCLAYS BANK PLC, AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ATOTECH DEUTSCHLAND GMBH, ATOTECH USA INC
Assigned to ATOTECH DEUTSCHLAND GMBH, ATOTECH USA, LLC reassignment ATOTECH DEUTSCHLAND GMBH RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Abandoned legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating

Definitions

  • the present invention relates to effective storage of a copper supply source, for example, in a copper plating equipment.
  • a brightener which is an additive designed to promote a plating reaction and to provide glossiness to plating, for example, 4,5-dithiaoctane-1,8-disulfonic acid [(SCH 2 CH 2 CH 2 SO 3 H) 2 ], continues to be decomposed where a copper anode exists even after the electrical plating operation has ceased (For example, J. Electroanal. Chem., 338 (1992), 166-177).
  • a copper dissolver (dissolving tank) is to be annexed to plating equipment in order to supply copper ions where an insoluble anode is used in copper plating.
  • This copper dissolving unit is designed to allow copper ions to be dissolved from an inserted copper ball in proportion to the amount of copper deposition on the substrate, which is a cathode reaction.
  • copper ions are usually supplied from a copper ball housed in a copper dissolver.
  • a brightener is decomposed because of the existence of a copper ball even while the plating equipment is deactivated, as discussed in the literature reference mentioned above (J. Electroanal. Chem.). Therefore, when the plating equipment is activated again, the solution contained in the copper dissolver enters the plating reactor (reaction tank), making it impossible to carry out plating under the same conditions that existed prior to inactivating the plating equipment.
  • the above-described problem is resolved by providing a reservoir designed to store a solution that does not deteriorate a metal ion supply source as a “solution for replacement” and by replacing at least part of the plating solution for said “solution for replacement” during the period when the plating operation is interrupted.
  • a tank having a metal ion supply source is provided with said reservoir, upon completion of the plating operation, the entire plating solution is discharged from the tank containing a metal ion supply source, the replacement solution is transferred from the reservoir into the emptied tank having the metal ion supply source, and when the plating operation is restarted, the replacement solution is returned into the reservoir and the plating solution is thereafter returned into the tank containing the metal ion supply source.
  • the plating tank is provided with the reservoir and a plating solution storage tank, upon completion of the plating operation, the plating solution is transferred from the plating tank into the plating solution storage tank, and then the replacement solution is transferred from the reservoir into the emptied plating tank and, when the plating operation is restarted, the replacement solution is returned into to the reservoir and the plating solution is thereafter returned into the plating tank.
  • said replacement solution is a plating solution containing no brightener that undergoes a decomposition reaction while the plating operation is being interrupted.
  • 3-(benzothiazoryl-2-thio) propylsulfonic acid and its sodium salt, 3-mercaptopropane-1-sulfonic acid and its sodium salt, ethylenedithiodipropylsulfonic acid and its sodium salt, bis-(p-sulfophenyl)-disulfide and its disodium salt, etc. may be used as said brightener.
  • Specific examples of the replacement solution suitable for plating with copper include a solution containing copper sulphate and sulfuric acid, a solution containing copper sulphate, sulfuric acid and chlorine, and a sulfuric acid solution.
  • FIG. 1 shows an embodiment in which this invention is applied to plating equipment having an insoluble anode.
  • a copper dissolver 4 which is annexed to a plating tank (not shown in the figure) which is the main unit of the plating equipment, is provided with copper balls 5 .
  • the copper dissolver 4 and the plating tank, which is not shown in the figure, are mutually connected via pipes 2 , 3 and each of them is filled with a copper plating solution.
  • the composition of the copper plating solution comprises, for example, copper ions at a concentration of 35 g/liter, sulfuric acid at a concentration of 180 g/liter, iron ions at a concentration of 12 g/liter and chlorine ions at a concentration of 50 mg/liter.
  • the copper plating solution also contains additives, such as brightener, leveler, etc. This copper plating solution is referred to hereinbelow as a “real plating solution” in order to distinguish the copper plating solution from the replacement plating solution.
  • the replacement plating solution is stored in the reservoir 7 for the replacement solution.
  • the replacement plating solution is a solution (“base plating solution”) that does not contain additives, such as a brightener.
  • the replacement plating solution may contain additives, provided that they are substances that undergo no dissolution under the effect of copper balls and cause no deterioration of the copper surface.
  • a base plating solution containing no additives it is expected to be able to reduce absorption of the additives onto the copper surface and to suppress emission from the copper surface into the plating solution during plating restarting. Furthermore, it is also possible to use a plating solution containing neither brightener nor iron ions, or to use a sulfuric acid solution with a concentration similar to that of the sulfuric acid in the real plating solution, so no copper sulphate be contained.
  • valves 15 , 16 in the pipes 2 , 3 are opened and the real plating solution circulates between the plating tank and the copper dissolver 4 .
  • the pump 6 In this process, the pump 6 must be inactivated so that the replacement plating solution within the reservoir 7 is not supplied to the copper dissolver 4 .
  • the valves 15 , 16 in the pipes 2 , 3 are closed, and the real plating solution within the copper dissolver 4 is discharged to the plating tank or another tank via the pipe 1 so that only the copper balls are left in the copper dissolver 4 .
  • the pump 6 is thereafter operated to introduce the replacement plating solution into the copper dissolver 4 from which the real plating solution has been discharged.
  • the replacement plating solution is thus introduced in order to prevent any deterioration to the copper ball surface, such as dying out or oxidization, and to preserve the pre-existing properties until restarting the plating operation.
  • the replacement plating solution in the copper dissolver 4 is discharged into the reservoir 7 and only the copper balls are left in the copper dissolver; then the valves 15 , 16 are opened to introduce the real plating solution from the plating tank via the pipe 3 , and plating operation is started.
  • FIG. 2 shows an embodiment in which this invention is applied to plating equipment having a soluble anode.
  • the shown structure basically comprises a plating tank 10 equipped with a cathode (substrate) 11 and a soluble anode (phosphorous copper anode) 12 , a reservoir 14 for replacement plating solution and a plating solution storage tank (not shown in the figure).
  • the plating tank 10 and the reservoir 14 for replacement plating solution are mutually connected via a pipe equipped with a pump 13 , and the plating tank 10 and the storage tank can be connected to each other via a pipe 15 .
  • the pump 13 is also structured in such a way to enable reversed rotation.
  • composition of the copper plating solution contained in the plating tank 10 is the same plating solution as that shown in Example 1 above, except that it does not contain iron ions, and the content of additives is also the same.
  • a printed circuit board or semiconductor wafer can be used as a substrate of the cathode 11 ; however, it is not limited to them.
  • the pump 13 When the plating equipment is to be operated, the pump 13 is stopped so that the base replacement plating solution in the reservoir 14 is not transferred to the plating tank 10 .
  • the real copper plating solution in the plating tank 10 is discharged into the storage tank via the pipe 15 so that the plating tank 10 is emptied.
  • the pump 13 is then operated and the base replacement plating solution is introduced into the emptied plating tank 10 , from which the real plating solution has been discharged.
  • the base replacement plating solution Through the introduction of the base replacement plating solution, it become possible to prevent the deterioration of surface conditions, including drying out of the black film formed on the anode surface, thereby preserving the properties until restarting the plating operation.
  • the base replacement plating solution within the plating tank 10 is discharged into the reservoir 14 to empty the plating tank 10 , then the real plating solution is then introduced from the storage tank via the pipe 1 .
  • objects to be plated are not limited to printed circuit boards or semiconductor wafers.
  • FIG. 1 [ FIG. 1 ]
  • This figure outlines the major components when this invention is applied to plating equipment having a soluble anode.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
US10/502,557 2002-02-21 2003-02-17 Method for storage of a metal ion supply source in a plating equipment Abandoned US20050139477A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-044679 2002-02-21
JP2002044679A JP3725083B2 (ja) 2002-02-21 2002-02-21 メッキ設備における金属イオン供給源の有効保存を可能とする方法
PCT/EP2003/001588 WO2003071010A1 (en) 2002-02-21 2003-02-17 Method for storage of a metal ion supply source in a plating equipment

Publications (1)

Publication Number Publication Date
US20050139477A1 true US20050139477A1 (en) 2005-06-30

Family

ID=27750561

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Application Number Title Priority Date Filing Date
US10/502,557 Abandoned US20050139477A1 (en) 2002-02-21 2003-02-17 Method for storage of a metal ion supply source in a plating equipment

Country Status (11)

Country Link
US (1) US20050139477A1 (zh)
EP (1) EP1476590B1 (zh)
JP (1) JP3725083B2 (zh)
KR (1) KR100858503B1 (zh)
CN (1) CN1636086B (zh)
AT (1) ATE369446T1 (zh)
CA (1) CA2473054A1 (zh)
DE (1) DE60315422T2 (zh)
MY (1) MY132672A (zh)
TW (1) TWI263703B (zh)
WO (1) WO2003071010A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11352710B2 (en) * 2019-09-30 2022-06-07 Abdurrahman Ildeniz Leak free brush electroplating system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4469546A (en) * 1981-12-16 1984-09-04 Cooper Tire & Rubber Company Transfer ring for a tire building machine
US5976341A (en) * 1993-12-24 1999-11-02 Schumacher; Rolf Process and apparatus for electrolytic deposition of metal layers
US6200436B1 (en) * 1999-04-27 2001-03-13 Advanced Micro Devices, Inc. Recycling consistent plating system for electroplating
US6575111B2 (en) * 2001-05-01 2003-06-10 Drillmar, Inc. Method for tendering
USRE40218E1 (en) * 1998-04-21 2008-04-08 Uziel Landau Electro-chemical deposition system and method of electroplating on substrates

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
JPH0559598A (ja) * 1991-08-30 1993-03-09 Kawasaki Steel Corp Ｚｎ−Ｎｉ電気めつきにおける金属イオンの供給方法及び装置
WO1999060188A2 (de) * 1998-05-16 1999-11-25 Blasberg Oberflächentechnik GmbH Verfahren zur galvanischen verkupferung von substraten
JP3523555B2 (ja) * 2000-02-28 2004-04-26 古河電気工業株式会社 メッキ装置
TW501277B (en) * 2000-03-29 2002-09-01 Sanyo Electric Co Plating device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4469546A (en) * 1981-12-16 1984-09-04 Cooper Tire & Rubber Company Transfer ring for a tire building machine
US5976341A (en) * 1993-12-24 1999-11-02 Schumacher; Rolf Process and apparatus for electrolytic deposition of metal layers
USRE40218E1 (en) * 1998-04-21 2008-04-08 Uziel Landau Electro-chemical deposition system and method of electroplating on substrates
US6200436B1 (en) * 1999-04-27 2001-03-13 Advanced Micro Devices, Inc. Recycling consistent plating system for electroplating
US6575111B2 (en) * 2001-05-01 2003-06-10 Drillmar, Inc. Method for tendering

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11352710B2 (en) * 2019-09-30 2022-06-07 Abdurrahman Ildeniz Leak free brush electroplating system

Also Published As

Publication number Publication date
KR100858503B1 (ko) 2008-09-12
DE60315422D1 (de) 2007-09-20
MY132672A (en) 2007-10-31
TWI263703B (en) 2006-10-11
WO2003071010A1 (en) 2003-08-28
DE60315422T2 (de) 2008-04-30
EP1476590B1 (en) 2007-08-08
JP3725083B2 (ja) 2005-12-07
JP2003253497A (ja) 2003-09-10
KR20040083096A (ko) 2004-09-30
TW200303937A (en) 2003-09-16
CN1636086A (zh) 2005-07-06
CA2473054A1 (en) 2003-08-28
CN1636086B (zh) 2010-04-28
ATE369446T1 (de) 2007-08-15
EP1476590A1 (en) 2004-11-17

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Effective date: 20040824

STCB Information on status: application discontinuation

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Owner name: BARCLAYS BANK PLC, AS COLLATERAL AGENT, NEW YORK

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Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BARCLAYS BANK PLC, AS COLLATERAL AGENT;REEL/FRAME:055653/0714

Effective date: 20210318

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Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:BARCLAYS BANK PLC, AS COLLATERAL AGENT;REEL/FRAME:055653/0714

Effective date: 20210318