US20040213913A1 - Cleaning unit, slit coating apparatus having the same and method of coating substrate - Google Patents
Cleaning unit, slit coating apparatus having the same and method of coating substrate Download PDFInfo
- Publication number
- US20040213913A1 US20040213913A1 US10/789,330 US78933004A US2004213913A1 US 20040213913 A1 US20040213913 A1 US 20040213913A1 US 78933004 A US78933004 A US 78933004A US 2004213913 A1 US2004213913 A1 US 2004213913A1
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- US
- United States
- Prior art keywords
- slit
- cleaning
- face
- coater
- cleaning unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0254—Coating heads with slot-shaped outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
- B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
- B05B15/55—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids
- B05B15/555—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter using cleaning fluids discharged by cleaning nozzles
Definitions
- the slit nozzle is effectively cleared, so that the substrate is uniformly coated with the photosensitive layer, and the photosensitive layer is not scratched.
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Coating Apparatus (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Liquid Crystal (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
Description
- This application relies for priority upon Korean Patent Application No. 2003-25695 filed on Apr. 23, 2003, the contents of which are herein incorporated by reference in its entirety.
- 1. Field of the Invention
- The present invention relates to a cleaning unit, a slit coating apparatus having the cleaning unit, and a method of coating a substrate, more particularly to a cleaning unit enhancing efficiency of coating process, a slit coating apparatus having the cleaning unit, and a method of coating a substrate.
- 2. Description of the Related Art
- In general, a photosensitive material is used for patterning a thin film that performs a special function. The photosensitive material chemically reacts on light. When the photosensitive material is not coated uniformly, deterioration occurs in next processes.
- When the photosensitive material is coated thicker than a predetermined thickness on a thin film, the thin film is under-etched. When the photosensitive material is coated thinner than the predetermined thickness, the thin film is over-etched.
- A spin coating method is widely used as a method of uniformly coating the substrate with the photosensitive material. According to the spin coating method, the photosensitive material is dropped on a substrate, while the substrate is rotated rapidly. Therefore, the photosensitive material is spread on the substrate. However, the spin coating method is not preferable in order that the substrate of a liquid crystal display panel is coated with the photosensitive material, because the substrate of the liquid crystal display device is heavy and large. When the substrate of the liquid crystal display device is heavy and large, rotating the substrate is hard, and the substrate is damaged (or broken) easily.
- Therefore, a slit coating method is introduced recently so as to coat the substrate of the liquid crystal display device with the photosensitive material. According to the slit coating method, the photosensitive material is provided to the substrate via a slit.
- A slit coater for coating the substrate includes the slit. A length of the slit is substantially equal to a width of the substrate that is coated with the photosensitive layer. A width of the slit is substantially equal to a thickness of the photosensitive layer with which the substrate is coated. The slit coater discharges the photosensitive material via the slit having definite width. Therefore, the slit coater coats the substrate with the photosensitive material, while moving in a longitudinal direction of the substrate. Therefore, the substrate is coated with the photosensitive material by uniform thickness.
- However, when the slit coater repeats coating operation, dregs are attached on the slit nozzle of the spin coater, so that a uniformity of a photosensitive layer formed on the substrate is deteriorated. As a result, a display quality of the liquid crystal display device is deteriorated.
- Accordingly, there is provided a cleaning unit for enhancing efficiency of cleaning.
- It is a feature of the present invention to provide a slit coating apparatus having the cleaning unit.
- In one aspect of the present invention, there is provided a method of coating a substrate.
- According to the cleaning unit of this invention, the cleaning unit for cleaning a slit coater for coating materials on a substrate includes a body and a cleaning member. The body includes an upper face. The upper face subsides to form a receiving recession for receiving a slit nozzle of the slit coater. The receiving recession includes a sidewall and a bottom face. The sidewall includes a first injection hole. A cleaning material is sprayed via the injection hole. The cleaning member eliminates dregs of the material attached on the slit nozzle of the slit coater. The cleaning member is attached on the bottom face of the receiving recession.
- According to the slit coating apparatus of the present invention, the slit coating apparatus includes a supporting member, a slit coater and a cleaning unit. The supporting member supports a substrate. The slit coater coats the substrate with predetermined material. The slit coater includes a slit nozzle having a slit for discharging the material. The cleaning unit cleans the slit coater. The cleaning unit includes a body and a cleaning member. The body includes an upper face. The upper face subsides to form a receiving recession for receiving a slit nozzle of the slit coater. The receiving recession includes a sidewall and a bottom face. The sidewall includes a first injection hole. A cleaning material is sprayed via the injection hole. The cleaning member eliminates dregs of the material attached on the slit nozzle of the slit coater. The cleaning member is attached on the bottom face of the receiving recession.
- According to the method of coating a substrate, a cleaning material is sprayed to a slit nozzle of a slit coater so as to saturate dregs attached on the slit nozzle with the cleaning material. The slit nozzle is scrubbed according to a longitudinal direction of the slit nozzle so as to eliminate the dregs. Then, the substrate is coated with the slit coater.
- According to the cleaning unit, the slit coating apparatus having the cleaning unit, and the method of coating a substrate of the present invention, the slit coater is cleaned before or after the slit coater forms the photosensitive layer on the substrate with the photosensitive material. The cleaning unit includes the first injection hole through which the cleaning material is sprayed, and the cleaning member for rubbing the substrate so as to eliminate the dregs.
- Therefore, the slit nozzle is effectively cleared, so that the substrate is uniformly coated with the photosensitive layer, and the photosensitive layer is not scratched.
- The above and other features and advantages of the present invention will become more apparent by describing in detail the preferred embodiments thereof with reference to the accompanying drawings, in which:
- FIG. 1 is a perspective view showing a cleaning unit according to a first exemplary embodiment of the present invention;
- FIG. 2 is a cross-sectional view showing the cleaning unit of FIG. 1;
- FIG. 3 is a perspective view showing a slit coating apparatus according to a second embodiment of the present invention; and
- FIG. 4 is a flow chart showing a method of coating according to a third embodiment of the present invention.
- Hereinafter, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
- FIG. 1 is a perspective view showing a cleaning unit according to a first exemplary embodiment of the present invention, FIG. 2 is a cross-sectional view showing the cleaning unit of FIG. 1.
- Referring to FIGS. 1 and 2, a
cleaning unit 100 includes acleaning unit body 110. Thecleaning unit body 110 has anupper face 101. Thecleaning body 110 of thecleaning unit 100 is hexahedron-shaped. Theupper face 101 subsides to form a receivingrecession 120. - The receiving
recession 120 includes sidewalls and abottom face 123. The sidewalls include a firstinclined face 121 and a secondinclined face 122. The firstinclined face 121 and the secondinclined face 122 forms an angle that is larger than 90° with respect to theupper face 101 respectively. Thebottom face 123 of the receivingrecession 120 is parallel with theupper face 101 of thecleaning unit body 110. - The first
inclined face 121 includes a plurality of first injection holes 140 and a plurality of second injection holes 150. The secondinclined face 122 includes a plurality of the first injection holes 140 and a plurality of the second injection holes 150. - A cleaning material is sprayed via the
first injection hole 140, and gas such as air and nitrogen gas is sprayed via thesecond injection hole 150. - The body includes a
first pipe 141 and asecond pipe 151. Thefirst pipe 141 is connected with thefirst injection hole 140. The cleaning material is transferred to thefirst injection hole 140 through thefirst pipe 141 to be sprayed through thefirst injection hole 140. Thesecond pipe 151 is connected with thesecond injection hole 150. The gas is transferred to thesecond injection hole 150 through thesecond pipe 151 to be sprayed through thesecond injection hole 150. - The
first pipe 141 may be plural or singular. When thefirst pipe 141 is singular, thefirst pipe 141 is connected with all of the first injection holes 140. When thefirst pipe 141 is plural, thefirst pipes 141 are connected with the first injection holes 140 respectively. When thefirst pipe 141 is plural, a speed of current of the cleaning material is enhanced. - The
second pipe 151 may be plural or singular. When thesecond pipe 151 is singular, thesecond pipe 151 is connected with all of the second injection holes 150. When thesecond pipe 151 is plural, thesecond pipes 151 are connected with the second injection holes 150 respectively. - In FIGS. 1 and 2, both of the first
inclined face 121 and on the secondinclined face 122 have the first injection holes 140 through which the cleaning material is sprayed and the second injection holes 150 through which the gas is sprayed separately. - However, both of the cleaning material and the gas may be sprayed via the first injection holes140. Namely, the cleaning material is sprayed via the first injection holes 140 so as to eliminate the dregs attached on a
slit nozzle 220 of aslit coater 200. Then, the gas for drying theslit nozzle 220 is sprayed via the first injection holes 140. - A cleaning
member 130 is detachably attached on thebottom face 123 of the receivingrecession 120. The cleaningmember 130 may includes material that has elasticity such as rubber or Teflon. - The
slit coater 200 coats a substrate (not shown) with photosensitive material. Theslit coater 200 includes acoater body 210 and aslit nozzle 220 elongated from thecoater body 210. Thecoater body 210 includes ahole 211. The photosensitive material is injected into thecoater body 210 via thehole 211 to be stored in a storage hollow 212 formed in thecleaning unit body 110. - The
slit nozzle 220 includes a thirdinclined face 221, a fourthinclined face 222 and aconnection face 223. The thirdinclined face 221 is substantially parallel with the firstinclined face 121 of the receivingrecession 120. The fourthinclined face 222 is substantially parallel with the secondinclined face 122 of the receivingrecession 120. Theconnection face 223 connects the thirdinclined face 221 and the fourthinclined face 222. Theconnection face 223 includes aslit 223 a. - The
cleaning unit 100 cleans theslit nozzle 220, after (or before) theslit nozzle 220 coats the substrate (not shown) with the photosensitive material. - The receiving
recession 120 receives theslit nozzle 220. A contour of the receivingrecession 120 corresponds to a contour of theslit nozzle 220. When the receivingrecession 120 receives theslit nozzle 220, theconnection face 223 of theslit nozzle 220 makes contact with the cleaningmember 130 attached on thebottom face 123 of the receivingrecession 120. - Then the cleaning material is sprayed toward the third
inclined face 221 and the fourth inclined face of theslit nozzle 220 via thefirst injection hole 140, so that the dregs of the photosensitive material, which are attached on the thirdinclined face 221 and the fourth inclined face of theslit nozzle 220, are eliminated. Further the cleaning material saturates the dregs attached on theslit 223 a. - Then the
cleaning unit body 110 of thecleaning unit 100 moves in a first direction D1, so that the dregs attached on theslit 223 a are eliminated. The dregs attached on theslit 223 a are saturated enough. Therefore, the dregs attached on theslit 223 a are easily eliminated. - The cleaning
member 130 includes elastic material to protect theconnection face 223 of theslit nozzle 220. - The cleaning
member 130 may be abraded by repeated cleaning operation. The cleaningmember 130 is detachably attached on thebottom face 123 of the receivingrecession 120. Therefore, the cleaning member may be replaced easily and promptly, when the cleaningmember 130 is abraded. When the cleaningmember 130 is detachably attached on thebottom face 123, an efficiency of replacing operation is enhanced. - When the
cleaning unit body 110 of thecleaning unit 100 arrives at a distal end of theslit nozzle 220 in the first direction D1, thecleaning unit body 110 of thecleaning unit 100 moves in a second direction D2 opposite to the first direction D1. - The gas is sprayed via the
second injection hole 150 so as to dry theslit nozzle 220 of theslit coater 220, while thecleaning unit body 110 of thecleaning unit 100 moves in the second direction D2. Further, the dregs may be detached from theslit nozzle 220 by the sprayed gas. Thecleaning unit body 110 of thecleaning unit 100 may move in the second direction D2, on condition that theconnection face 223 makes contact with the cleaningmember 130. - Hereinbefore, the
cleaning unit body 110 of thecleaning unit 100 moves in the first direction D1 or in the second direction D2, while theslit coater 200 is fixed. However, theslit coater 200 may move in the first direction D1 or in the second direction D2, while thecleaning unit body 110 of thecleaning unit 100 is fixed. - When the dregs are attached on the
slit 223 a of theslit nozzle 220, the dregs may scratch the photosensitive layer with which the substrate is coated, and the substrate layer may be coated non-uniformly with the photosensitive. - Therefore, when the
slit nozzle 220 is cleared, defects formed during the process of coating are reduced. - FIG. 3 is a perspective view showing a slit coating apparatus according to a second embodiment of the present invention. In FIG. 3, the same reference numbers will be used to refer to the same or like parts as those shown in FIG. 1.
- Referring to FIGS. 1, 2 and3, a
slit coating apparatus 700 according to a second embodiment of the present invention includes a supportingmember 400. The supportingmember 400 supports asubstrate 300 so as to coat thesubstrate 300 with aphotosensitive layer 310. The supportingmember 300 makes contact with a second face of thesubstrate 300. The second face of thesubstrate 300 faces a first face of thesubstrate 300. The first face of thesubstrate 300 is coated with thephotosensitive layer 310. - The
slit coating apparatus 700 also includes aslit coater 200 for coating thephotosensitive layer 310 on the first face of thesubstrate 300. Thesilt coater 200 includes acoater body 210 and aslit nozzle 220. - A photosensitive
material supplying unit 600 supplies theslit coater 211 with the photosensitive material via ahole 211. A storage hollow 212 is formed in thecoater body 210. - The
slit nozzle 220 is elongated from thecoater body 210. Theslit nozzle 220 includes theslit 223 a. - The
slit nozzle 220 includes the thirdinclined face 221, the fourthinclined face 222 and theconnection face 223. Theconnection face 223 connects the thirdinclined face 221 and the fourthinclined face 222. The thirdinclined face 221 is inclined toward the fourthinclined face 222. The fourthinclined face 222 inclined toward the thirdinclined face 221. - The
slit coater 200 is connected with a transferringunit 500. The transferringunit 500 transfers theslit coater 200 disposed over thesubstrate 300 in a third direction D3. Theslit coater 200 coats thesubstrate 300 with the photosensitive material while the transferringunit 500 transfers theslit coater 200 in the third direction D3. The photosensitive material is discharged through theslit 223 having predetermined width corresponding to the thickness of thephotosensitive layer 310. Therefore thephotosensitive layer 310 is uniformly coated on thesubstrate 310. - When the
slit coater 200 coats thesubstrate 310 with the photosensitive material repeatedly, a residue of the photosensitive material is attached on theslit nozzle 220 and cured to form dregs. - The
cleaning unit 100 scrubs theslit nozzle 220 to eliminate the dregs, while theslit coater 200 is fixed and thecleaning unit 100 moves in the first direction D1 and in the second direction D2. Therefore, thephotosensitive layer 310 having uniform thickness is formed on thesubstrate 300. - FIG. 4 is a flow chart showing a method of coating according to a third embodiment of the present invention.
- Referring to FIGS. 3 and 4, the receiving
recession 120 of thecleaning unit 100 receives theslit nozzle 220. The cleaning material is sprayed via thefirst injection hole 140 of the receivingrecession 120 toward theslit nozzle 220, while thecleaning unit 100 moves in the first direction D1. Then the dregs of the photosensitive material are saturated with the cleaning material (step S10). - The
connection face 223 of theslit nozzle 220 makes contact with the cleaningmember 130. Therefore, when thecleaning unit 100 moves in the first direction D1, the cleaningmember 130 scrubs theconnection face 223 to eliminate the dregs (step S20). - The gas is sprayed via the
second injection hole 150 toward theslit nozzle 220, while thecleaning unit 100 moves in the second direction D2 so as to dry the slit nozzle 220 (step S30). When theslit nozzle 220 is dried, the process of cleaning theslit nozzle 220 is finished. - Then the
substrate 300 is prepared on the supportingmember 400 of theslit coating apparatus 700. Theslit coater 200 moves from thecleaning unit 100 toward the supportingmember 400, so that theslit coater 200 is disposed over an edge portion “A” of thesubstrate 300. Theslit coater 200 discharges the photosensitive material through theslit 223 a, while theslit coater 200 moves in the third direction D3. Therefore, thephotosensitive layer 310 having uniform thickness is formed on the substrate 300 (step S40). - According to the cleaning unit, the slit coating apparatus having the cleaning unit, and the method of coating a substrate of the present invention, the slit coater is cleaned before or after the slit coater coats the substrate with the photosensitive material. The cleaning unit includes the first injection hole through which the cleaning material is sprayed, and the cleaning member for rubbing the connection face of the slit nozzle so as to eliminate the dregs.
- Therefore, the slit nozzle is effectively cleared, so that the photosensitive layer having uniform thickness is formed on the substrate, and the photosensitive layer is not scratched.
- While the exemplary embodiments of the present invention and its advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by appended claims.
Claims (21)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020030025695A KR100926308B1 (en) | 2003-04-23 | 2003-04-23 | Cleaning unit, coating apparatus having the same and coating method using the same |
KR2003-25695 | 2003-04-23 |
Publications (2)
Publication Number | Publication Date |
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US20040213913A1 true US20040213913A1 (en) | 2004-10-28 |
US7473318B2 US7473318B2 (en) | 2009-01-06 |
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US10/789,330 Active 2025-03-07 US7473318B2 (en) | 2003-04-23 | 2004-02-26 | Cleaning unit, slit coating apparatus having the same and method of coating substrate |
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US (1) | US7473318B2 (en) |
JP (1) | JP4708726B2 (en) |
KR (1) | KR100926308B1 (en) |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3933186A (en) * | 1973-12-03 | 1976-01-20 | The Dow Chemical Company | Protective housing for a liquid sample container |
US5273192A (en) * | 1991-06-27 | 1993-12-28 | Sony Corporation | Resist layer application apparatus |
US5374312A (en) * | 1991-01-23 | 1994-12-20 | Tokyo Electron Limited | Liquid coating system |
US5772764A (en) * | 1995-10-13 | 1998-06-30 | Tokyo Electron Limited | Coating apparatus |
US6019843A (en) * | 1997-02-28 | 2000-02-01 | Samsung Electronics Co., Ltd. | Apparatus for coating a semiconductor wafer with a photoresist |
US6210481B1 (en) * | 1998-05-19 | 2001-04-03 | Tokyo Electron Limited | Apparatus and method of cleaning nozzle and apparatus of processing substrate |
US20010003966A1 (en) * | 1999-12-16 | 2001-06-21 | Tokyo Electron Limited | Film forming apparatus |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2888262B2 (en) * | 1991-01-29 | 1999-05-10 | 東京エレクトロン株式会社 | Treatment liquid application method |
JP2816510B2 (en) * | 1991-01-23 | 1998-10-27 | 東京エレクトロン株式会社 | Liquid supply nozzle |
JPH0780385A (en) * | 1993-09-10 | 1995-03-28 | Hirata Corp | Coating head cleaning device and cleaning method of coating head |
JP3306838B2 (en) * | 1993-12-14 | 2002-07-24 | 東レ株式会社 | CLEANING METHOD FOR CURTAIN FLOW COATER AND METHOD FOR PRODUCING COATING FILM FOR COLOR FILTER |
JP3757992B2 (en) * | 1996-01-18 | 2006-03-22 | 東レ株式会社 | Coating apparatus and coating method, and color filter manufacturing method and manufacturing apparatus |
JP3679904B2 (en) | 1997-08-29 | 2005-08-03 | 大日本スクリーン製造株式会社 | NOZZLE CLEANING DEVICE AND COATING DEVICE HAVING THE NOZZLE CLEANING DEVICE |
JPH11239750A (en) * | 1998-02-25 | 1999-09-07 | Toray Ind Inc | Method and apparatus for applying coating liquid on uneven substrate, method and apparatus for producing plasma display |
JPH11300261A (en) * | 1998-04-22 | 1999-11-02 | Toray Ind Inc | Apparatus for cleaning die for coating, method for coating using the same, and apparatus of and method for preparing color filter |
JP2002166209A (en) * | 1999-12-16 | 2002-06-11 | Tokyo Electron Ltd | Film forming device |
JP4334758B2 (en) * | 1999-12-17 | 2009-09-30 | 東京エレクトロン株式会社 | Film forming device |
KR100615170B1 (en) * | 2002-06-22 | 2006-08-25 | 삼성에스디아이 주식회사 | Cleaning apparatus for coating die |
KR100926308B1 (en) * | 2003-04-23 | 2009-11-12 | 삼성전자주식회사 | Cleaning unit, coating apparatus having the same and coating method using the same |
-
2003
- 2003-04-23 KR KR1020030025695A patent/KR100926308B1/en active IP Right Grant
-
2004
- 2004-02-26 US US10/789,330 patent/US7473318B2/en active Active
- 2004-04-23 JP JP2004127602A patent/JP4708726B2/en not_active Expired - Lifetime
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3933186A (en) * | 1973-12-03 | 1976-01-20 | The Dow Chemical Company | Protective housing for a liquid sample container |
US5374312A (en) * | 1991-01-23 | 1994-12-20 | Tokyo Electron Limited | Liquid coating system |
US5273192A (en) * | 1991-06-27 | 1993-12-28 | Sony Corporation | Resist layer application apparatus |
US5772764A (en) * | 1995-10-13 | 1998-06-30 | Tokyo Electron Limited | Coating apparatus |
US6019843A (en) * | 1997-02-28 | 2000-02-01 | Samsung Electronics Co., Ltd. | Apparatus for coating a semiconductor wafer with a photoresist |
US6210481B1 (en) * | 1998-05-19 | 2001-04-03 | Tokyo Electron Limited | Apparatus and method of cleaning nozzle and apparatus of processing substrate |
US20010003966A1 (en) * | 1999-12-16 | 2001-06-21 | Tokyo Electron Limited | Film forming apparatus |
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US20060147618A1 (en) * | 2004-12-31 | 2006-07-06 | Lg Philips Lcd Co., Ltd. | Slit coater with a service unit for a nozzle and a coating method using the same |
US20090114253A1 (en) * | 2006-05-15 | 2009-05-07 | Kazuhisa Matsumoto | Method of Substrate Processing, Substrate Processing System, and Storage Medium |
US8439051B2 (en) * | 2006-05-15 | 2013-05-14 | Tokyo Electron Limited | Method of substrate processing, substrate processing system, and storage medium |
US20080079880A1 (en) * | 2006-10-02 | 2008-04-03 | Nano Loa, Inc. | Method of manufacturing liquid crystal display device |
CN102641798A (en) * | 2011-02-21 | 2012-08-22 | 三星Sdi株式会社 | Slot nozzle system |
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US8871307B2 (en) * | 2011-12-06 | 2014-10-28 | Canon Kabushiki Kaisha | Method for manufacturing cylindrical member |
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US10960426B2 (en) | 2012-05-22 | 2021-03-30 | Screen Semiconductor Solutions Co., Ltd. | Development processing device |
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Also Published As
Publication number | Publication date |
---|---|
KR20040091927A (en) | 2004-11-03 |
US7473318B2 (en) | 2009-01-06 |
KR100926308B1 (en) | 2009-11-12 |
JP4708726B2 (en) | 2011-06-22 |
JP2004322091A (en) | 2004-11-18 |
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