US20030074591A1 - Self adjusting clocks in computer systems that adjust in response to changes in their environment - Google Patents

Self adjusting clocks in computer systems that adjust in response to changes in their environment Download PDF

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Publication number
US20030074591A1
US20030074591A1 US09/982,585 US98258501A US2003074591A1 US 20030074591 A1 US20030074591 A1 US 20030074591A1 US 98258501 A US98258501 A US 98258501A US 2003074591 A1 US2003074591 A1 US 2003074591A1
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Prior art keywords
electronic device
clock
power supply
temperature
frequency
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Abandoned
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US09/982,585
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English (en)
Inventor
Thomas McClendon
Christian Belady
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Hewlett Packard Development Co LP
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Individual
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Priority to US09/982,585 priority Critical patent/US20030074591A1/en
Assigned to HEWLETT-PACKARD COMPANY reassignment HEWLETT-PACKARD COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BELADY, CHRISTIAN L., MCCLENDON, THOMAS W.
Priority to JP2002285919A priority patent/JP2003186566A/ja
Publication of US20030074591A1 publication Critical patent/US20030074591A1/en
Assigned to HEWLETT-PACKARD DEVELOPMENT COMPANY L.P. reassignment HEWLETT-PACKARD DEVELOPMENT COMPANY L.P. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HEWLETT-PACKARD COMPANY
Priority to US11/095,826 priority patent/US7577862B2/en
Abandoned legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26Power supply means, e.g. regulation thereof
    • G06F1/32Means for saving power
    • G06F1/3203Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3234Power saving characterised by the action undertaken
    • G06F1/324Power saving characterised by the action undertaken by lowering clock frequency
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/206Cooling means comprising thermal management
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26Power supply means, e.g. regulation thereof
    • G06F1/32Means for saving power
    • G06F1/3203Power management, i.e. event-based initiation of a power-saving mode
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • This invention relates generally to the field of computer hardware and more specifically to the field of the automatic adaptation of computer hardware to its environment.
  • Modern computer systems typically comprise a number of integrated circuits and other active electronic devices. These integrated circuits are generally fabricated from a semi-conductor material such as silicon and encapsulated in an integrated circuit package for attachment to a printed circuit board. It is well known in the art of integrated circuits and computer systems that the circuits' maximum possible performance may be correlated to the temperature of the device itself. The temperature of the device is driven by the ambient temperature of the air surrounding the device, the altitude of the device, airflow across the device, and self-heating of the device itself during operation. Most integrated circuits may be operated at higher speeds in a cool environment than in a hot environment.
  • Some computer systems include temperature-sensing circuitry controlling fans within the system. When the temperature rises, these systems increase fan speed to better cool the electronic devices. As the temperature falls, these systems decrease fan speed to save power and reduce the noise of the system fans.
  • these systems can only move a limited quantity of air over their circuits and are dependant on the outside environment for their cool air. If the outside environment is too warm, it is possible that the temperature within the computer system will continue rising beyond the cooling capability of the system fans. Once the internal temperature rises above the maximum allowable temperature, the computer system may give a warning and then shut itself down to prevent computing errors or possible damage to the system. Further, reliability may be reduced when computer systems are operated at temperatures outside of their ranges.
  • An electronic device such as a computer, circuit board, or integrated circuit is built including circuitry for receiving temperature information.
  • the clock frequency of the electronic device is varied in response to the temperature of the electronic device, thus lowering speed and power consumption of the device during periods of higher than normal temperature.
  • an electronic device such as a computer, circuit board, or integrated circuit is built including circuitry for receiving power supply information.
  • the clock frequency and possibly the power supply voltage of the electronic device is varied in response to the power supply status of the electronic device, thus lowering speed and power consumption of the device during periods of lower than normal power supply current capability.
  • a computer may be designed without extra fans or power supplies, thus reducing the cost of the computer.
  • the integrated circuits detect the failure and reduce their clock speeds and possibly their power supply voltage automatically in response to power supply failures, cooling equipment failures, altitude, temperature, and other environmental factors. This allows the computer to continue to operate at a slower frequency, but without any loss of data and no need to restart any applications running on the computer. This is especially important for critical servers where an error or failure may be very costly to the user.
  • FIG. 1 is a block diagram of an example embodiment of an electronic device including a temperature-controlled clock according to the present invention.
  • FIG. 2 is a block diagram of an example embodiment of an electronic device including a power supply failure sensitive clock according to the present invention.
  • FIG. 3 is a waveform diagram of an example embodiment of a temperature-controlled clock according to the present invention.
  • FIG. 4 is a waveform diagram of an example embodiment of a power supply failure sensitive clock according to the present invention.
  • FIG. 5 is a waveform diagram of an example embodiment of a temperature-controlled clock according to the present invention.
  • FIG. 6 is a waveform diagram of an example embodiment of a power supply failure sensitive clock according to the present invention.
  • FIG. 7 is a flowchart of an example embodiment of a method for temperature controlling a clock according to the present invention.
  • FIG. 8 is a flowchart of an example embodiment of a method for temperature controlling a clock according to the present invention.
  • FIG. 9 is a flowchart of an example embodiment of a method for controlling a clock and power supply according to the present invention.
  • FIG. 10 is an example embodiment of a computer system including a self-adjusting clock according to the present invention.
  • FIG. 1 is a block diagram of an example embodiment of an electronic device 100 including a temperature-controlled clock according to the present invention.
  • An electronic device 100 such as a computer, a printed circuit board, or an integrated circuit is built including a temperature sensor 102 .
  • This temperature sensor 102 may be implemented in a variety of different ways within the scope of the present invention. If the electronic device 100 is a computer or printed circuit board, the temperature sensor 102 may be a simple thermocouple that translates temperature to a voltage value. If the electronic device 100 is a single integrated circuit, the temperature sensor 102 may be a thermal diode fabricated within the integrated circuit. The temperature sensor 102 outputs a temperature signal 104 .
  • This temperature signal 104 may be a voltage or it may comprise digital data within the scope of the present invention.
  • the temperature signal 104 is input to a clock controller 114 .
  • the clock controller 114 uses the temperature signal 104 to determine a frequency of operation.
  • the clock controller 114 outputs a clock signal 116 for use by electronic circuits 118 within the electronic device 100 .
  • a clock controller 114 may be comprise a phase-locked-loop, and the phase-locked-loop may be digital in some embodiments of the present invention.
  • this temperature rise is reflected in the temperature data 104 received by the clock controller 114 and the frequency of the clock signal 116 is reduced as the temperature rises.
  • a system configuration register 110 contains information about the configuration of the electronic device 100 such as the number of fans available and their speed.
  • System configuration data 112 is supplied to the clock controller 114 that then may respond to the configuration data 112 by changing the clock frequency, or waiting for a rise in temperature before adjusting the clock frequency.
  • a fan failure detector 106 may be used to send fan data 108 to the clock controller 114 that then may respond to the fan data 108 by changing the clock frequency, or waiting for a rise in temperature before adjusting the clock frequency.
  • Variables such as any delay before changing the clock frequency, how much the clock frequency is allowed to vary, and response times of the clock may be determined by the designer of an embodiment of the present invention, all within the scope of the present invention.
  • FIG. 2 is a block diagram of an example embodiment of an electronic device 100 including a clock controller 208 and a power supply controller 204 according to the present invention.
  • An electronic device 100 such as a computer, a printed circuit board, or an integrated circuit is built including a power supply failure detector 200 .
  • This power supply failure detector 200 may be implemented in a variety of different ways within the scope of the present invention. If the electronic device 100 is a computer or printed circuit board, the power supply failure detector 200 may be a signal from the power supply that is activated when the power supply goes into a failure mode, such as a current-limiting mode. The power supply failure detector 200 outputs a power fail signal is 202 .
  • This power fail signal 202 may be a single bit signal, or it may comprise more complex digital data within the scope of the present invention.
  • the power fail signal 202 is input to a clock controller 206 and a power supply controller 204 .
  • the clock controller 206 uses the power fail signal 202 to determine its frequency of operation.
  • the clock controller 206 outputs a clock signal 116 for use by electronic circuits 118 within the electronic device 100 .
  • the power supply controller 204 uses the power fail signal to change the power supply voltage in response to power supply failures. For example, in a system comprising multiple power supplies, where one of the supplies fails, the remaining supplies may not have enough current capability to continue supplying the system with full voltage.
  • a system configuration register 110 contains information about the configuration of the electronic device 100 such as the number of power supplies available and their status.
  • System configuration data 112 is supplied to the clock controller 206 and the power supply controller 204 that then may respond to the configuration data 112 by changing the clock frequency and power supply voltage, or waiting for a change in device temperature before adjusting the clock frequency and power supply voltage.
  • a power supply failure detector 200 may be used to send power supply data 202 to the clock controller 208 and the power supply controller 204 that then may respond to the power supply data 202 by changing the clock frequency and power supply voltage, or waiting for a change in device temperature before adjusting the clock frequency and power supply voltage.
  • Some embodiments of the present invention may allow only the clock frequency to be varied instead of both the power supply voltage and the clock frequency. Variables such as any delay before changing the clock frequency, how much the clock frequency is allowed to vary, and response times of the clock may be determined by the designer of an embodiment of the present invention, all within the scope of the present invention.
  • FIG. 3 is a waveform diagram of an example embodiment of a temperature-controlled clock according to the present invention.
  • the time axis 300 shows increasing time from left to right, including two specified times t 0 306 and t 1 308 .
  • Above the time axis 300 are drawn a clock signal 302 and a temperature 304 .
  • the temperature 304 is steady and the clock signal 302 is at a steady frequency.
  • the clock signal 302 rises and the frequency of the clock signal 302 decreases in response.
  • the clock frequency changes by a factor of two. This is for illustrative purposes only as the clock frequency may change by any factor (or continuously) within the scope of the present invention.
  • FIG. 4 is a waveform diagram of an example embodiment of a power supply failure sensitive clock according to the present invention.
  • the time axis 300 shows increasing time from left to right, including two specified times t 0 404 and t 1 406 .
  • Above the time axis 300 are drawn a clock signal 302 and a power supply voltage 402 at some voltage level above ground 400 .
  • Above the power supply voltage 402 is a line representing the maximum power supply current available 408 .
  • the maximum power supply current available 408 is steady and the clock signal 302 is at a steady frequency.
  • time t 1 406 the maximum power supply current available 408 decreases and the frequency of the clock signal 302 decreases in response.
  • the power supply voltage 402 decreases in response to the decreased supply current available 408 .
  • heat and power consumption vary with the square of the power supply voltage, a small change in supply voltage may have a large change in heat and power consumption.
  • the clock frequency changes by a factor of two. This is for illustrative purposes only as the clock frequency may change by any factor (or continuously) within the scope of the present invention.
  • FIG. 5 is a waveform diagram of an example embodiment of a temperature-controlled clock according to the present invention.
  • the time axis 300 shows increasing time from left to right, including three specified times t 0 500 , t 1 502 , and t 2 504 .
  • Above the time axis 300 are drawn a clock signal 302 and a temperature 304 .
  • the temperature 304 is steady and the clock signal 302 is at a steady frequency.
  • the temperature 304 rises and the frequency of the clock signal 302 decreases in response.
  • time t 2 504 the temperature 304 returns to its previous level and the frequency of the clock signal 302 increases back to its previous rate in response to the change in temperature 304 .
  • the clock frequency changes by a factor of two. This is for illustrative purposes only as the clock frequency may change by any factor (or continuously) within the scope of the present invention.
  • FIG. 6 is a waveform diagram of an example embodiment of a power supply failure sensitive clock according to the present invention.
  • the time axis 300 shows increasing time from left to right, including three specified times t 0 600 , t 1 602 , and t 2 604 .
  • Above the time axis 300 are drawn a clock signal 302 and a power supply voltage 402 at some voltage level above ground 400 .
  • Above the power supply voltage 402 is a line representing the maximum power supply current available 408 .
  • the maximum power supply current available 408 is steady and the clock signal 302 is at a steady frequency.
  • the maximum power supply current available 408 decreases and the frequency of the clock signal 302 decreases in response.
  • the power supply voltage 402 decreases in response to the decreased supply current available 408 .
  • the maximum power supply current available 408 returns to its previous level and the frequency of the clock signal 302 increases back to its previous rate in response to the change in maximum power supply current available 408 .
  • the power supply voltage 402 increases back to its previous level in response to the increased supply current available 408 .
  • heat and power consumption vary with the square of the power supply voltage, a small change in supply voltage may have a large change in heat and power consumption.
  • the clock frequency changes by a factor of two. This is for illustrative purposes only as the clock frequency may change by any factor (or continuously) within the scope of the present invention.
  • FIG. 7 is a flowchart of an example embodiment of a method for temperature controlling a clock according to the present invention.
  • a temperature value is read.
  • a new temperature value is read.
  • the new temperature value is compared to the old (or previous) temperature value.
  • a decision step 706 if the temperature has not changed, control is given to step 702 and a new temperature value is read and the loop is repeated until the temperature changes. If the temperature has changed control is given to a decision step 708 where the method determines if the temperature has increased or decreased.
  • the clock frequency is decreased and control is passed back to step 702 for a new temperature reading. If the temperature has decreased, in a step 712 , the clock frequency is increased and control is passed back to step 702 for a new temperature reading.
  • the sampling rate of the configuration register may be continuous or determined by other factors within the scope of the present invention.
  • FIG. 8 is a flowchart of an example embodiment of a method for temperature controlling a clock according to the present invention.
  • a system configuration register 110 is read.
  • This system configuration register 110 may contain information about the system such as the number of fans in operation, altitude of the system, number of processors, airflow requirements of the processors and other information about how the system is configured.
  • various embodiments of the present invention may include a variety of data in the system configuration register 110 within the scope of the present invention. In some embodiments of the present invention, there may not be a separate register containing this information, but the information is obtainable from other latches or registers throughout the system.
  • the method checks for fan failures.
  • This fan failure information may be contained within the system configuration register, or its equivalents, or it may be received from other mechanisms configured to detect fan failures.
  • the system configuration data and fan failure data is analyzed to determine if the system, in its current configuration has sufficient cooling capability to maintain the circuits within their specified temperature ranges. If so, control loops back to step 800 , and the process is repeated. If the system does not have sufficient cooling capability, the device temperature is checked in a step 806 . In a decision step 808 the device temperature is compared to the operating limits of the device. If the device temperature is within the operating limits, control loops back to step 806 , and the temperature is monitored within this loop until it exceeds the operating limits.
  • the clock speed is adjusted in a step 810 . After adjusting the clock speed, control is returned to step 800 and the system monitoring continues. In some embodiments of the present invention, after the determination is made that the system does not have sufficient cooling capability to operate, the clock speed is immediately adjusted to account for the cooling capability of the system without going through the step of checking device temperature against the device specifications. If the results of a fan failure are known or calculable by the system, there is no need to check device temperatures before reacting to a fan failure.
  • the sampling rate of the configuration register may be continuous or determined by other factors within the scope of the present invention.
  • FIG. 9 is a flowchart of an example embodiment of a method for controlling a clock and power supply according to the present invention.
  • a system configuration register 110 is read.
  • This system configuration register 110 may contain information about the system such as the number of power supplies in operation, the output voltage and current of each of the supplies, number of processors, voltage requirements of the processors and other information about how the system is configured.
  • various embodiments of the present invention may include a variety of data in the system configuration register 110 within the scope of the present invention. In some embodiments of the present invention, there may not be a separate register containing this information, but the information is obtainable from other latches or registers throughout the system.
  • a step 902 the method checks for power supply failures.
  • This power supply failure information may be contained within the system configuration register, or its equivalents, or it may be received from other mechanisms configured to detect power supply failures.
  • a decision step 904 the system configuration data and power supply failure data is analyzed to determine if the system, in its current configuration has sufficient voltage and current capability to maintain the circuits within their specified voltage ranges. If so, control loops back to step 900 , and the process is repeated. If the system does not have sufficient power, the temperature is checked in a step 806 . In a decision step 808 if the temperature is within the limits, control is returned to step 806 for further monitoring of the temperature.
  • the clock speed and power supply voltage are adjusted in a step 906 .
  • control is returned to step 900 and the system monitoring continues.
  • the clock speed is immediately adjusted to account for the voltage and current capability of the system without going through the step of checking device voltage against the device specifications. If the results of a power supply failure are known or calculable by the system, there is no need to check device temperatures before reacting to a power supply failure.
  • the sampling rate of the configuration register may be continuous or determined by other factors within the scope of the present invention.
  • FIG. 10 is an example embodiment of a computer system including a self-adjusting clock according to the present invention.
  • a computer chassis 1000 including at least one power supply 1008 and at least one fan 1010 is built including at least one electronic circuit containing a self-adjusting clock according to the present invention.
  • the computer receives input from the user via a mouse 1006 and a keyboard 1004 and outputs information or graphics to a display 1002 .
  • Many other uses of the present invention will be apparent to those of skill in the art, this is but one example usage of the present invention.

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US09/982,585 2001-10-17 2001-10-17 Self adjusting clocks in computer systems that adjust in response to changes in their environment Abandoned US20030074591A1 (en)

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US09/982,585 US20030074591A1 (en) 2001-10-17 2001-10-17 Self adjusting clocks in computer systems that adjust in response to changes in their environment
JP2002285919A JP2003186566A (ja) 2001-10-17 2002-09-30 環境の変化に応答して調整を行う、コンピュータ・システムにおける自己調整クロック
US11/095,826 US7577862B2 (en) 2001-10-17 2005-03-30 Self adjusting clocks in computer systems that adjust in response to changes in their environment

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