US20020046850A1 - Shield case - Google Patents
Shield case Download PDFInfo
- Publication number
- US20020046850A1 US20020046850A1 US09/797,052 US79705201A US2002046850A1 US 20020046850 A1 US20020046850 A1 US 20020046850A1 US 79705201 A US79705201 A US 79705201A US 2002046850 A1 US2002046850 A1 US 2002046850A1
- Authority
- US
- United States
- Prior art keywords
- generating part
- heat generating
- tongue
- shield case
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/006—Casings specially adapted for signal processing applications, e.g. CATV, tuner, antennas amplifier
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S174/00—Electricity: conductors and insulators
- Y10S174/34—PCB in box or housing
Definitions
- the present invention relates to a shield case of a high frequency device such as a tuner portion consisting, for example, an input circuit, a high frequency amplification circuit and a frequency conversion circuit of a television receiver.
- a tuner portion consisting, for example, an input circuit, a high frequency amplification circuit and a frequency conversion circuit of a television receiver.
- the high frequency device of the tuner portion of a television receiver consisting of an input circuit, high frequency amplification circuit, etc. is covered with a metal case consisting, for example, of a tin plate, to effect electromagnetic wave shielding for electromagnetic wave disturbance.
- the metal case of this conventional tuner portion comprises a rectangular box-like frame body 2 surrounding a circuit board 1 on which the high frequency parts of the input circuit, the high frequency amplification circuit and the frequency conversion circuit are mounted, and upper and lower case covers 2 a and 2 b , consisting, for example, tin plates, covering the upper and lower openings of this frame body 2 .
- this frame body 2 of the metal there is provided in this frame body 2 of the metal case a partition 3 consisting of a predetermined metal plate, for example, a tin plate, and a predetermined number of contact portions 3 a are provided at predetermined positions of this partition 3 . Further, formed at positions corresponding to the contact portions 3 a of the partition 3 are thin and narrow claws 4 whose forward ends are free ends, the forward ends abutting the contact portions 3 a of the partition 3 , being electrically and mechanically connected thereto, providing predetermined high frequency characteristics (shield effect).
- a partition 3 consisting of a predetermined metal plate, for example, a tin plate, and a predetermined number of contact portions 3 a are provided at predetermined positions of this partition 3 . Further, formed at positions corresponding to the contact portions 3 a of the partition 3 are thin and narrow claws 4 whose forward ends are free ends, the forward ends abutting the contact portions 3 a of the partition 3 , being electrically and mechanically connected thereto,
- a heat sink 5 consisting of a metal plate such as an aluminum plate is mounted to the semiconductor integrated circuit IC mounted on the circuit board 1 .
- the heat sink 5 is mounted as the heat dissipating plate to the semiconductor integrated circuit IC mounted on the circuit board 1 in the metal case 2 , the heat generated from the integrated circuit IC is dissipated effectively.
- the heat sink 5 is a member which is separate from the semiconductor integrated circuit IC, and it is mounted to the integrated circuit IC, which is to be cooled at the time of assembly, by using an adhesive, an adhesive tape, a screw or the like, so that it is troublesome.
- the present invention has been made in view of the above problems. Accordingly, it is an object of the present invention to provide a shield case in which it is possible to achieve, with a single part, the electromagnetic wave shielding for electromagnetic wave disturbance and the heat dissipation for the heat generating part.
- a metal shield case which encloses a circuit board on which an electronic circuit part is mounted, shielding electromagnetic wave disturbance, wherein a tongue is provided in a part of the shield case surface by a cutout, the tongue being held in press contact with the surface of a heat generating part mounted on the circuit board.
- a tongue provided in a part of the shield case surface is held in press contact with the heat generating part of the electronic circuit accommodated in the shield case, whereby it is possible to obtain a high frequency characteristic (shield effect) and a cooling effect.
- FIG. 1 is a perspective view showing a conventional example of a shield case
- FIG. 2 is a perspective view of FIG. 1 with the upper case cover removed;
- FIG. 3 is a schematic perspective view of a main portion of a shield case according to the present invention.
- FIG. 4 is a partially omitted, partially cutaway perspective view of a shield case according to an embodiment of the present invention.
- FIG. 5 is an enlarged sectional view of a main portion of FIG. 4.
- FIG. 6 is an enlarged sectional view of the grounding portion of FIG. 4.
- the present invention is applied to the shield case of the high frequency device of a tuner portion of a television receiver consisting of an input circuit, a high frequency amplification circuit and a frequency conversion circuit.
- the shield case of this embodiment comprises a metal plate surrounding a circuit board 11 on which electronic parts of an input circuit, a high frequency amplification circuit and a frequency conversion circuit are mounted, for example, a frame body 12 consisting of a tin plate, and metal plates covering the upper and lower openings of this box-like frame body 12 , an upper case cover 12 a and a lower case cover (not shown) consisting, for example, of tin plates.
- this frame body 12 there is provided at a predetermined position a partition 13 consisting of a predetermined metal plate, for example, a tin plate, as shown in FIGS. 4 and 6, and a contact portion 13 a is provided at a predetermined position of the upper edge of this partition 13 .
- a thin and narrow claw 14 whose forward end is formed as a free end is formed in the upper case cover 12 a at a position corresponding to the contact portion 13 a of the partition 13 , and this claw 14 is bent elastically and inwardly to bring the forward end thereof into contact with the contact portion 13 a of the partition 13 , connecting electrically and mechanically, making it possible to obtain a high frequency characteristic (shield effect).
- the upper case cover 12 a and the lower case cover are in contact with the frame body 12 so as to elastically hold the same, thereby securing the high frequency characteristic (shield effect).
- a tongue 15 whose forward end is formed as a free end is formed in the upper case cover 12 a by cutout as shown in FIGS. 3, 4 and 5 , and this tongue 15 is bent inwardly and elastically, the forward end 15 a thereof being elastically in press contact with the surface of the heat generating part 10 (semiconductor integrated circuit IC).
- the heat gathered in the heat generating part 10 is transmitted through the tongue 15 and the upper case cover 12 a to the frame body 12 , that is, the shield case, to be dispersed and dissipated, so that it is possible to obtain a cooling effect for the heat generating part 10 .
- the cutout portion where the tongue 15 is formed it is greatly opened on both sides of the tongue 15 , whereby air circulation is established between the outside air and the interior, thereby achieving further heat dissipating effect in addition to the contact.
- FIGS. 4 and 5 there is provided a longitudinal cutout groove portion 15 b in the forward end portion 15 a of the tongue 15 , whereby the forward end portion 15 a is divided into a plurality of portions, and the pressurization on the surface of the heat generating part 10 is effected flexibly and reliably, and the heat transmission from the heat generating part 10 is effectively conducted, making it possible to effect the heat dissipation reliably.
- the claw 14 of the upper case cover 12 a is held in contact with the partition 13 to effect connection electrically and mechanically, and the tongue 15 is held in press contact with the heat generating part 10 (semiconductor integrated circuit IC) to effect heat transmission, whereby it is possible to obtain a cooling effect due to the high frequency characteristic (shield effect) and heat dissipation.
- the heat generating part 10 semiconductor integrated circuit IC
- the claw 14 and the tongue 15 of the upper case cover 12 a of the shield case are elastic, so that solely by fitting the upper case cover 12 a into the upper opening of the frame body 12 , the claw 14 is brought into contact with the partition 13 in the frame body 12 , and the tongue 15 can be easily pressurized and fixed to the heat generating part 10 (semiconductor integrated circuit IC) in the frame body 12 , so that the assembly is very easy and an improvement is achieved in terms of production efficiency.
- the tongue 15 as the cooling member can be fixed to the heat generating part 10 , thereby making it possible to achieve a reduction in cost.
- the cooling member for the heat generating part 10 does not stick out from the shield case, so that there is no need to change the outer dimensions of the shield case. Thus, there is no increase in the size of the product. Further, there is no need to greatly change the packing box for transportation as in the conventional case, in which a heat sink is adopted.
- the machining of the tongue 15 of the shield case can be conducted in the same manner as in the case of the existing grounding claw, so that there is no need to perform any special machining on the die for forming the case, and it is possible to form the shield case of the present invention without any extra investment.
- the configuration of the tongue held in press contact with the heat generating part is not restricted to that shown in the drawing. It can be arbitrarily changed in conformity with the configuration and size of the heat generating part.
- this tongue is not necessarily formed in the case cover. It may also be formed in an arbitrary part of the shield case, for example, the frame body, that is, in a part corresponding to an electronic part that can generate heat including the heat generating part, and brought into press contact with this part, whereby heat dissipation is effected through heat transmission as in the above-described case, thereby achieving a cooling effect.
- the shield case of the present invention can be applied to all types of broadcasting reception tuner, including a tuner for digital ground wave broadcasting reception, a tuner for digital cable broadcasting reception, a tuner for digital satellite broadcasting reception, a tuner for analog ground wave broadcasting reception, a tuner for analog cable broadcasting reception, and a tuner for analog satellite broadcasting reception, where a semiconductor integrated circuit IC for demodulation and amplification.
- the tongue provided in the shield case surface is held in press contact with the surface of the heat generating part mounted on the circuit board, whereby it is possible to obtain an effect of cooling the heat generating part without using a heat sink.
- the tongue which is a heat dissipating member, is held in a stable manner in press contact with the heat generating part without using an adhering material such as an adhesive or an adhesion seal, so that the assembly is very easy and the effectiveness in production is high.
- the cost is remarkably reduced as compared with the cooling system in which a separate member such as a heat sink is used, and it is possible to achieve a reduction in the product size, so that the product is reduced in size and can be easily packed and transported.
- the forward end portion of the tongue of the shield case surface held in press contact with the heat generating part is divided into a plurality of parts and reliably and flexibly pressurized against the heat generating part, whereby the heat transfer from the heat generating part is effected efficiently and the cooling effect is improved.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Signal Processing (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
- 1. Field of the Invention
- The present invention relates to a shield case of a high frequency device such as a tuner portion consisting, for example, an input circuit, a high frequency amplification circuit and a frequency conversion circuit of a television receiver.
- 2. Description of the Related Art
- Generally speaking, the high frequency device of the tuner portion of a television receiver consisting of an input circuit, high frequency amplification circuit, etc. is covered with a metal case consisting, for example, of a tin plate, to effect electromagnetic wave shielding for electromagnetic wave disturbance.
- As shown in FIGS. 1 and 2, the metal case of this conventional tuner portion comprises a rectangular box-
like frame body 2 surrounding a circuit board 1 on which the high frequency parts of the input circuit, the high frequency amplification circuit and the frequency conversion circuit are mounted, and upper and lower case covers 2 a and 2 b, consisting, for example, tin plates, covering the upper and lower openings of thisframe body 2. - As shown in FIG. 2, there is provided in this
frame body 2 of the metal case apartition 3 consisting of a predetermined metal plate, for example, a tin plate, and a predetermined number ofcontact portions 3 a are provided at predetermined positions of thispartition 3. Further, formed at positions corresponding to thecontact portions 3 a of thepartition 3 are thin andnarrow claws 4 whose forward ends are free ends, the forward ends abutting thecontact portions 3 a of thepartition 3, being electrically and mechanically connected thereto, providing predetermined high frequency characteristics (shield effect). - And, as a radiating part for dissipating heat, a
heat sink 5 consisting of a metal plate such as an aluminum plate is mounted to the semiconductor integrated circuit IC mounted on the circuit board 1. - In this way, in the high frequency device of the tuner portion of the television receiver, when the
heat sink 5 is mounted as the heat dissipating plate to the semiconductor integrated circuit IC mounted on the circuit board 1 in themetal case 2, the heat generated from the integrated circuit IC is dissipated effectively. However, theheat sink 5 is a member which is separate from the semiconductor integrated circuit IC, and it is mounted to the integrated circuit IC, which is to be cooled at the time of assembly, by using an adhesive, an adhesive tape, a screw or the like, so that it is troublesome. - Further, regarding the semiconductor integrated circuit IC accommodated in the
metal case 2, there is a limitation to the configuration of theheat sink 5 in the limited space in themetal case 2, so that it is difficult to achieve high efficiency in heat dissipation. Thus, when a relatively large heat sink is used, the efficiency in heat dissipation is improved. However, it sticks out from themetal case 2, so that shield effect is reduced by half. Further, during the transportation of the product, the portion sticking out is not held properly, with the result that the packing box has to be rather large. - The present invention has been made in view of the above problems. Accordingly, it is an object of the present invention to provide a shield case in which it is possible to achieve, with a single part, the electromagnetic wave shielding for electromagnetic wave disturbance and the heat dissipation for the heat generating part.
- To achieve the above object, there is provided in accordance with the present invention a metal shield case which encloses a circuit board on which an electronic circuit part is mounted, shielding electromagnetic wave disturbance, wherein a tongue is provided in a part of the shield case surface by a cutout, the tongue being held in press contact with the surface of a heat generating part mounted on the circuit board.
- In this way, in accordance with the present invention, a tongue provided in a part of the shield case surface is held in press contact with the heat generating part of the electronic circuit accommodated in the shield case, whereby it is possible to obtain a high frequency characteristic (shield effect) and a cooling effect.
- FIG. 1 is a perspective view showing a conventional example of a shield case;
- FIG. 2 is a perspective view of FIG. 1 with the upper case cover removed;
- FIG. 3 is a schematic perspective view of a main portion of a shield case according to the present invention;
- FIG. 4 is a partially omitted, partially cutaway perspective view of a shield case according to an embodiment of the present invention;
- FIG. 5 is an enlarged sectional view of a main portion of FIG. 4; and
- FIG. 6 is an enlarged sectional view of the grounding portion of FIG. 4.
- An embodiment of the shield case of the present invention will now be described with reference to FIGS. 3 through 6. In this embodiment, the present invention is applied to the shield case of the high frequency device of a tuner portion of a television receiver consisting of an input circuit, a high frequency amplification circuit and a frequency conversion circuit.
- As in the metal case shown in FIGS. 1 and 2, in the shield case of this embodiment comprises a metal plate surrounding a
circuit board 11 on which electronic parts of an input circuit, a high frequency amplification circuit and a frequency conversion circuit are mounted, for example, aframe body 12 consisting of a tin plate, and metal plates covering the upper and lower openings of this box-like frame body 12, anupper case cover 12 a and a lower case cover (not shown) consisting, for example, of tin plates. - In this
frame body 12, there is provided at a predetermined position apartition 13 consisting of a predetermined metal plate, for example, a tin plate, as shown in FIGS. 4 and 6, and acontact portion 13 a is provided at a predetermined position of the upper edge of thispartition 13. Further, a thin andnarrow claw 14 whose forward end is formed as a free end is formed in theupper case cover 12 a at a position corresponding to thecontact portion 13 a of thepartition 13, and thisclaw 14 is bent elastically and inwardly to bring the forward end thereof into contact with thecontact portion 13 a of thepartition 13, connecting electrically and mechanically, making it possible to obtain a high frequency characteristic (shield effect). - Further, due to the
elastic edge portion 12 a 1 in the outer periphery thereof, the upper case cover 12 a and the lower case cover are in contact with theframe body 12 so as to elastically hold the same, thereby securing the high frequency characteristic (shield effect). - In this way, in the region defined by the
partition 13 in theframe body 12 whose upper and lower openings are covered by theupper case cover 12 a and the lower case cover, there is arranged an electronic circuit part mounted on thecircuit board 11, and aheat generating part 10 such as a semiconductor integrated circuit IC is incorporated in this electronic circuit part, and thisheat generating part 10 must be cooled through heat dissipation. - Thus, in this embodiment, at a position directly over the
heat generating part 10, for example, the semiconductor integrated circuit IC, mounted on thecircuit board 11, atongue 15 whose forward end is formed as a free end is formed in theupper case cover 12 a by cutout as shown in FIGS. 3, 4 and 5, and thistongue 15 is bent inwardly and elastically, theforward end 15 a thereof being elastically in press contact with the surface of the heat generating part 10 (semiconductor integrated circuit IC). - In this way, by holding the
tongue 15 in press contact with the surface of theheat generating part 10 such as the semiconductor integrated circuit IC, the heat gathered in theheat generating part 10 is transmitted through thetongue 15 and theupper case cover 12 a to theframe body 12, that is, the shield case, to be dispersed and dissipated, so that it is possible to obtain a cooling effect for theheat generating part 10. Further, in the cutout portion where thetongue 15 is formed, it is greatly opened on both sides of thetongue 15, whereby air circulation is established between the outside air and the interior, thereby achieving further heat dissipating effect in addition to the contact. - In this case, as shown in FIG. 5, in the case of a structure in which a
heat transmission material 16 is applied to the surface of the heat generating part 10 (semiconductor integrated circuit IC), theforward end portion 15 a of thetongue 15 is held in press contact with the surface of theheat generating part 10 through thisheat transmission material 16, whereby it is possible to conduct heat dissipation of theheat generating part 10 more effectively. - Further, as shown in FIGS. 4 and 5, there is provided a longitudinal
cutout groove portion 15 b in theforward end portion 15 a of thetongue 15, whereby theforward end portion 15 a is divided into a plurality of portions, and the pressurization on the surface of theheat generating part 10 is effected flexibly and reliably, and the heat transmission from theheat generating part 10 is effectively conducted, making it possible to effect the heat dissipation reliably. - As described above, in the shield case of this embodiment, the
claw 14 of theupper case cover 12 a is held in contact with thepartition 13 to effect connection electrically and mechanically, and thetongue 15 is held in press contact with the heat generating part 10 (semiconductor integrated circuit IC) to effect heat transmission, whereby it is possible to obtain a cooling effect due to the high frequency characteristic (shield effect) and heat dissipation. - Further, the
claw 14 and thetongue 15 of the upper case cover 12 a of the shield case are elastic, so that solely by fitting theupper case cover 12 a into the upper opening of theframe body 12, theclaw 14 is brought into contact with thepartition 13 in theframe body 12, and thetongue 15 can be easily pressurized and fixed to the heat generating part 10 (semiconductor integrated circuit IC) in theframe body 12, so that the assembly is very easy and an improvement is achieved in terms of production efficiency. Further, without using any special gluing/fixing material such as an adhesive or an adhesive sheet, thetongue 15 as the cooling member can be fixed to theheat generating part 10, thereby making it possible to achieve a reduction in cost. - And, the cooling member for the
heat generating part 10 does not stick out from the shield case, so that there is no need to change the outer dimensions of the shield case. Thus, there is no increase in the size of the product. Further, there is no need to greatly change the packing box for transportation as in the conventional case, in which a heat sink is adopted. - Further, the machining of the
tongue 15 of the shield case can be conducted in the same manner as in the case of the existing grounding claw, so that there is no need to perform any special machining on the die for forming the case, and it is possible to form the shield case of the present invention without any extra investment. - While an embodiment of the present invention has been described above, the present invention is not restricted to this embodiment. Various modifications are possible without departing from the scope of the present invention.
- For example, the configuration of the tongue held in press contact with the heat generating part is not restricted to that shown in the drawing. It can be arbitrarily changed in conformity with the configuration and size of the heat generating part. Further, this tongue is not necessarily formed in the case cover. It may also be formed in an arbitrary part of the shield case, for example, the frame body, that is, in a part corresponding to an electronic part that can generate heat including the heat generating part, and brought into press contact with this part, whereby heat dissipation is effected through heat transmission as in the above-described case, thereby achieving a cooling effect.
- And, the shield case of the present invention can be applied to all types of broadcasting reception tuner, including a tuner for digital ground wave broadcasting reception, a tuner for digital cable broadcasting reception, a tuner for digital satellite broadcasting reception, a tuner for analog ground wave broadcasting reception, a tuner for analog cable broadcasting reception, and a tuner for analog satellite broadcasting reception, where a semiconductor integrated circuit IC for demodulation and amplification.
- As described above, in accordance with the present invention, the tongue provided in the shield case surface is held in press contact with the surface of the heat generating part mounted on the circuit board, whereby it is possible to obtain an effect of cooling the heat generating part without using a heat sink. And, the tongue, which is a heat dissipating member, is held in a stable manner in press contact with the heat generating part without using an adhering material such as an adhesive or an adhesion seal, so that the assembly is very easy and the effectiveness in production is high. Further, the cost is remarkably reduced as compared with the cooling system in which a separate member such as a heat sink is used, and it is possible to achieve a reduction in the product size, so that the product is reduced in size and can be easily packed and transported.
- Further, in the present invention, when the tongue of the shield case surface is held in press contact with the surface of the heat generating part through the intermediary of a heat transmitting material applied to the surface of the heat generating part, it is possible to achieve a still higher effect of cooling the heat generating part.
- Further, in the present invention, by providing a longitudinal cutout groove portion in the forward end portion of the tongue of the shield case surface held in press contact with the heat generating part, the forward end portion of the tongue is divided into a plurality of parts and reliably and flexibly pressurized against the heat generating part, whereby the heat transfer from the heat generating part is effected efficiently and the cooling effect is improved.
Claims (3)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000056077A JP4438164B2 (en) | 2000-03-01 | 2000-03-01 | Shield case |
JPP2000-056077 | 2000-03-01 | ||
JP2000-056077 | 2000-03-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
US20020046850A1 true US20020046850A1 (en) | 2002-04-25 |
US6388189B1 US6388189B1 (en) | 2002-05-14 |
Family
ID=18577096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/797,052 Expired - Lifetime US6388189B1 (en) | 2000-03-01 | 2001-02-28 | Shield case |
Country Status (4)
Country | Link |
---|---|
US (1) | US6388189B1 (en) |
EP (1) | EP1130954B1 (en) |
JP (1) | JP4438164B2 (en) |
DE (1) | DE60128170T2 (en) |
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US20170202100A1 (en) * | 2016-01-08 | 2017-07-13 | Pegatron Corporation | Circuit Board Assembly |
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US7903431B2 (en) * | 2007-06-14 | 2011-03-08 | Laird Technologies, Inc. | Electromagnetic interference shielding apparatus |
US20090002949A1 (en) * | 2007-06-29 | 2009-01-01 | Lucent Technologies Inc. | Heat transfer for electronic component via an electromagnetic interference (emi) shield having shield deformation |
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Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10190263A (en) * | 1996-12-27 | 1998-07-21 | Alps Electric Co Ltd | Heat radiating structure of electronic component |
US6049469A (en) * | 1997-08-20 | 2000-04-11 | Dell Usa, L.P. | Combination electromagnetic shield and heat spreader |
JPH11177262A (en) * | 1997-12-09 | 1999-07-02 | Matsushita Electric Ind Co Ltd | Electronic equipment |
JPH11204970A (en) * | 1998-01-12 | 1999-07-30 | Alps Electric Co Ltd | Electronic equipment |
JP3597368B2 (en) * | 1998-02-16 | 2004-12-08 | アルプス電気株式会社 | Electronics |
-
2000
- 2000-03-01 JP JP2000056077A patent/JP4438164B2/en not_active Expired - Fee Related
-
2001
- 2001-02-28 US US09/797,052 patent/US6388189B1/en not_active Expired - Lifetime
- 2001-03-01 DE DE60128170T patent/DE60128170T2/en not_active Expired - Lifetime
- 2001-03-01 EP EP01301877A patent/EP1130954B1/en not_active Expired - Lifetime
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US8395254B2 (en) * | 2006-03-30 | 2013-03-12 | Stats Chippac Ltd. | Integrated circuit package system with heatspreader |
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CN116406156A (en) * | 2023-06-09 | 2023-07-07 | 中国科学院微小卫星创新研究院 | Electromagnetic shielding and heat dissipation integrated satellite-borne electronic system and assembly method thereof |
Also Published As
Publication number | Publication date |
---|---|
US6388189B1 (en) | 2002-05-14 |
JP2001244689A (en) | 2001-09-07 |
JP4438164B2 (en) | 2010-03-24 |
EP1130954A3 (en) | 2003-08-13 |
EP1130954B1 (en) | 2007-05-02 |
DE60128170D1 (en) | 2007-06-14 |
EP1130954A2 (en) | 2001-09-05 |
DE60128170T2 (en) | 2008-01-10 |
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