CN101232784B - Machine body of electronic device - Google Patents
Machine body of electronic device Download PDFInfo
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- CN101232784B CN101232784B CN2007100010785A CN200710001078A CN101232784B CN 101232784 B CN101232784 B CN 101232784B CN 2007100010785 A CN2007100010785 A CN 2007100010785A CN 200710001078 A CN200710001078 A CN 200710001078A CN 101232784 B CN101232784 B CN 101232784B
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Abstract
The invention relates to an electronic device body, which comprises a first case body, a plurality of blocking tenon and mortise groups, a second case body and a plurality of sockets corresponding with the blocking tenon and mortise groups. The second case body is suitable for jointing with the first case body, and the blocking tenon and mortise groups are arranged on a first surface of the first case body; the sockets are arranged on a second surface of the second case body, wherein, the second surface faces the first surface; furthermore, every blocking tenon and mortise group comprises at least two blocking tenons and mortises; and the arranging axes of the blocking tenons and mortises are arranged with a preset distance; and at least one blocking tenon and mortise of the blocking tenon and mortise groups are suitable for being clamped with a corresponding socket so as to fix the first case body and the second case body.
Description
Technical field
The invention relates to a kind of body, and particularly relevant for a kind of body of electronic installation.
Background technology
Generally speaking, the body of electronic installation is made up of loam cake and lower cover.Thus, be equipped on electronic component in the electronic installation and can be equipped in the inner space that loam cake and lower cover constitute, and body can prevent effectively that the electronic component in the electronic installation is subjected to outside destroy, and then electronic installation can normally be operated.
Figure 1A is depicted as known a kind of body exploded view, and Figure 1B is depicted as the end view of the body of Figure 1A.Please also refer to Figure 1A and Figure 1B, known body 100 comprises upper shell 110 and lower house 120.Known technology is provided with a plurality of trips 130 in the side of upper shell 110 its inwalls.Similarly, known technology also is provided with a plurality of sockets 140 of corresponding trip 130 in the side of lower house 120 its inwalls.In known technology, each trip 130 is suitable for being inserted in pairing socket 140 (please refer to Fig. 1 C, its trip that is depicted as Figure 1A is inserted in the schematic diagram of pairing socket), so that upper shell 110 can be bonded with each other with lower house 120.
Though upper shell 110 is measure-alike with the original design of lower house 120, but because upper shell 110 and lower house 120 can be subjected to the influence of processing procedure tolerance in manufacturing process, cause the upper shell produced 110 and lower house 120 its length or width and inequality, and the part trip 130 that is arranged in upper shell 110 promptly can't be effectively and socket 140 contrapositions that are arranged in lower house.Thus, when the assembler desire is assembled in lower house 120 with upper shell 110, the a plurality of trips 130 that partly are equipped on upper shell 110 promptly can't be fully to being positioned at pairing socket 140, cause part trip 130 can't be inserted in pairing socket 140, and upper shell 110 promptly is difficult for engaging with lower house 120.
From the above, force will part (to please refer to Fig. 1 D when the trip 130 of contraposition is inserted in pairing socket 140 fully as assembler, end view after it is depicted as the upper shell of Figure 1B and lower house and is bonded with each other), because the length of upper shell 110 and lower house 120 or width and (upper shell 110 length of Fig. 1 D are slightly larger than the length of lower house 120) inequality, and assembler force with the part fully the trip 130 of contraposition be inserted in the pairing socket 140, therefore upper shell 110 is easy to generate deformation (upper shell 110 shown in Fig. 1 D has significantly deformation) with lower house 120, cause the surface elevation of body 100, and then influence the outward appearance of the assembling quality and the electronic installation of body 100.In addition, make trip 130 be inserted in pairing socket 140 with external force improperly and will cause trip 130 fractures easily or cause socket 140 to damage, and reduce the structural reliability of body 100.
Summary of the invention
The purpose of this invention is to provide a kind of body, to promote the assembling quality of body.
Another object of the present invention provides a kind of body of electronic installation, to promote its structural reliability.
For reaching above-mentioned or other purpose, the present invention proposes a kind of body of electronic installation, and it comprises first housing, a plurality of trip group, second housing, reaches a plurality of and corresponding socket of trip group.Second housing is suitable for engaging with first housing, and the first surface of first housing is located in these trip assembly, and these sockets are equipped on the second surface of second housing, and wherein second surface is towards first surface.In addition, each trip group is provided with at least two trips, and each trip set axis each other at a distance of a preset distance, and at least one trip in the trip group is suitable for being sticked in pairing socket, to fix first housing and second housing.
In one embodiment of this invention, these trip groups are near the side of first surface, and arrange along the side bearing of trend of first surface, and these sockets are near the side of second surface, and arrange along the side bearing of trend of second surface.
In one embodiment of this invention, trip has the holding section, and socket has a slot, and the holding section is inserted in slot, so that trip is sticked in socket.
In one embodiment of this invention, the trip and first housing are one-body molded.
In one embodiment of this invention, the socket and second housing are one-body molded.
In body of the present invention, the trip group that is equipped on first housing comprises at least two trips, and each trip set axis each other at a distance of preset distance.Because each trip group comprises at least two trips, and each trip set axis each other at a distance of preset distance, therefore when assembler was assembled in second housing with first housing, at least one trip in the trip group can be sticked in pairing socket, to fix first housing and second housing.In detail, the mode that sets of trip group of the present invention can be improved the not good problem of assembling quality that the assembling process of two housings is caused because of the processing procedure tolerance effectively.In other words, body of the present invention has preferable assembling quality, and body also has preferable structural reliability.
Beneficial effect of the present invention:
(1) because trip group of the present invention includes at least two trips, and each trip mutual dislocation, therefore when first housing is assembled in second housing, at least one trip in the trip group can be sticked in pairing socket, and then the assembling process that improves the first known housing and second housing is because of the not good problem of processing procedure assembling quality that tolerance causes.That is the body of the electronic installation that the embodiment of the invention provided has preferable assembling quality and preferable body outward appearance.
(2) when first housing is assembled to second housing, because at least one trip in the trip group can be sticked in pairing socket, so assembler need not to force trip is inserted in pairing socket.In other words, the trip of present embodiment is not vulnerable to the influence of improper external force and ruptures, and body promptly of the present invention has preferable structural reliability.
For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Figure 1A is depicted as the exploded view of known a kind of body.
Figure 1B is depicted as the end view of the body of Figure 1A.
The trip that Fig. 1 C is depicted as Figure 1A is inserted in the schematic diagram of pairing socket.
End view after Fig. 1 D is depicted as the upper shell of Figure 1B and lower house and is bonded with each other.
Fig. 2 A is depicted as the body exploded view of a kind of electronic installation of preferred embodiment of the present invention.
Fig. 2 B is depicted as the end view of the body of Fig. 2 A.
The trip group that Fig. 2 C is depicted as Fig. 2 A is inserted in the schematic diagram of pairing socket.
First housing that Fig. 2 D is depicted as Fig. 2 B is assembled to the schematic diagram of second housing.
Embodiment
Fig. 2 A is depicted as the exploded view of body of a kind of electronic installation of preferred embodiment of the present invention, and Fig. 2 B is depicted as the end view of the body of Fig. 2 A.Please also refer to Fig. 2 A and Fig. 2 B, the body 200 of present embodiment is the body of an electronic installation, and electronic installation for example is portable electronic devices, and in the present embodiment, electronic installation is a notebook computer.Above-mentioned body 200 comprise first housing 210, a plurality of trip group 220, second housing 230 and with a plurality of trip group 220 corresponding sockets 240.In the present embodiment, trip group 220 for example is one-body molded with first housing 210, and socket 240 for example is one-body molded with second housing 230.In the present embodiment, first housing 210 for example is the loam cake of electronic installation, and second housing 230 for example is the lower cover of electronic installation, and second housing 230 is suitable for engaging with first housing 210, to constitute an inner space.Thus, the electronic component that is equipped on electronic installation can firmly be equipped in the inner space that first housing 210 and second housing 230 constituted.
In addition, a plurality of trip groups 220 are provided on the first surface 212 of first housing 210.In the present embodiment, the equipping position of these trip groups 220 for example is the side near first surface 212, and arranges along the side bearing of trend of first surface 212.On the other hand, second housing 230 has the second surface 232 towards first surface 212, and a plurality of socket 240 is to be provided on the second surface 232 of second housing 230.In this embodiment, these and trip group 220 corresponding sockets 240 for example are the sides that is equipped on second surface 232, and arrange along the side bearing of trend of second surface 232.
What deserves to be mentioned is, for improve first housing 210 and second housing 230 in assembling process because of the processing procedure tolerance causes the not good problem of assembling quality, in the present embodiment, each trip group 220 is provided with at least two trips.For example: trip group 220 includes trip 222 and trip 224, and wherein trip 222 is arranged at first surface 212 along setting axis X 1 with X2 respectively with trip 224, and sets axis X 1 and X2 each other at a distance of a preset distance D.That is trip 222 misplaces each other with trip 224.
From the above, in the present embodiment, when being assembled to second housing 230, first housing 210 (please refer to Fig. 2 C and Fig. 2 D, the trip group that Fig. 2 C is depicted as Fig. 2 A is inserted in the schematic diagram of pairing socket, and Fig. 2 D is depicted as the schematic diagram that first housing of Fig. 2 B is assembled to second housing), can can be inserted in socket 240 with the part trip group 220 of socket 240 contrapositions, firmly to engage (trip 222 that is trip group 220 can be inserted in socket 240 simultaneously with trip 224) mutually, can't then can engage with socket 240 with the part trip group 220 ' of socket 240 contrapositions fully by the processing procedure tolerances by the structural design that trip 222 ' and trip 224 ' misplace each other with socket 240.Specifically, since trip 222 ' and trip 224 ' set axis (be trip 222 ' and the axis that sets of trip 224 ' misplaces each other) adjacent one another are, therefore as be positioned at the trip 222 ' that sets on the axis X 1 be subjected to the processing procedure tolerance influence and can't with pairing socket 240 contrapositions, be positioned at the trip 224 ' that sets on the axis X 2 promptly be not vulnerable to the processing procedure tolerance influence and can be effectively and pairing socket 240 contrapositions, firmly to be inserted in socket 240.That is at least one trip of trip group 220 can be sticked in pairing socket 240, and first housing 210 can engage with second housing 230 by the snap-fit relationship of 240 of trip group 220 and sockets.
In a preferred embodiment, trip 222 for example is respectively equipped with holding section 222a and holding section 224a (shown in Fig. 2 A) with trip 224, and socket 240 for example is provided with a slot 242, when trip group 220 is inserted in pairing socket 240, holding section 222a and 224a are inserted in the slot 242, and then make trip 222 or 224 can firmly be sticked in socket 240.
In sum, in the body of the electronic installation that preferred embodiment of the present invention provided, the trip group of first housing includes at least two trips, and each trip set axis each other at a distance of a preset distance, i.e. each trip mutual dislocation in the trip group.Therefore, when first housing was assembled in second housing, at least one trip in the trip group can be sticked in pairing socket.In other words, trip sets the design that axis misplaces each other can reduce the influence of processing procedure tolerance to assembling process effectively, and then make a plurality of trip groups that are equipped on first housing can firmly be sticked in pairing socket, promptly have preferable engagement relationship between first housing and second housing.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; anyly have the knack of this skill person; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking accompanying the claim person of defining.
Claims (5)
1. the body of an electronic installation is characterized in that, comprising:
One first housing has a first surface;
A plurality of trip groups are equipped on above-mentioned first surface, and each above-mentioned trip group is provided with at least two trips, each trip in wherein above-mentioned at least two trips set axis on the face parallel with above-mentioned first surface each other at a distance of a preset distance;
One second housing is suitable for engaging with said first shell, and above-mentioned second housing has a second surface, and above-mentioned second surface is towards above-mentioned first surface; And
A plurality of sockets are equipped on above-mentioned second surface, and above-mentioned these sockets are corresponding with above-mentioned these trip groups, and wherein at least one trip in each above-mentioned trip group is suitable for being sticked in pairing above-mentioned socket.
2. the body of electronic installation according to claim 1, it is characterized in that, wherein above-mentioned these trip groups are near the side of above-mentioned first surface, and the side bearing of trend along above-mentioned first surface is arranged, and above-mentioned these sockets are near the side of above-mentioned second surface, and arrange along the side bearing of trend of above-mentioned second surface.
3. the body of electronic installation according to claim 1 is characterized in that, wherein each above-mentioned trip has a holding section, and each above-mentioned socket has a slot, and above-mentioned holding section is inserted in above-mentioned slot, so that above-mentioned trip is sticked in above-mentioned socket.
4. the body of electronic installation according to claim 1 is characterized in that, wherein above-mentioned these trips and said first shell are one-body molded.
5. the body of electronic installation according to claim 1 is characterized in that, wherein above-mentioned these sockets and above-mentioned second housing are one-body molded.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007100010785A CN101232784B (en) | 2007-01-23 | 2007-01-23 | Machine body of electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007100010785A CN101232784B (en) | 2007-01-23 | 2007-01-23 | Machine body of electronic device |
Publications (2)
Publication Number | Publication Date |
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CN101232784A CN101232784A (en) | 2008-07-30 |
CN101232784B true CN101232784B (en) | 2010-06-09 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2007100010785A Active CN101232784B (en) | 2007-01-23 | 2007-01-23 | Machine body of electronic device |
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CN (1) | CN101232784B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5782687A (en) * | 1997-01-15 | 1998-07-21 | Sniegocki; James | Security cover for fax machine |
CN1330858A (en) * | 1998-10-01 | 2002-01-09 | 里塔尔电子系统两合公司 | Device for receiving electrical printed circuit modules, especialy subrack |
US6388189B1 (en) * | 2000-03-01 | 2002-05-14 | Sony Corporation | Shield case |
US6549426B1 (en) * | 2002-05-31 | 2003-04-15 | Delphi Tecnologies, Inc | Electronic enclosure with improved EMC performance |
CN2724367Y (en) * | 2004-08-12 | 2005-09-07 | 英业达股份有限公司 | Combined structure of case |
-
2007
- 2007-01-23 CN CN2007100010785A patent/CN101232784B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5782687A (en) * | 1997-01-15 | 1998-07-21 | Sniegocki; James | Security cover for fax machine |
CN1330858A (en) * | 1998-10-01 | 2002-01-09 | 里塔尔电子系统两合公司 | Device for receiving electrical printed circuit modules, especialy subrack |
US6388189B1 (en) * | 2000-03-01 | 2002-05-14 | Sony Corporation | Shield case |
US6549426B1 (en) * | 2002-05-31 | 2003-04-15 | Delphi Tecnologies, Inc | Electronic enclosure with improved EMC performance |
CN2724367Y (en) * | 2004-08-12 | 2005-09-07 | 英业达股份有限公司 | Combined structure of case |
Also Published As
Publication number | Publication date |
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CN101232784A (en) | 2008-07-30 |
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