US10135418B2 - Common mode filter - Google Patents

Common mode filter Download PDF

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Publication number
US10135418B2
US10135418B2 US15/439,633 US201715439633A US10135418B2 US 10135418 B2 US10135418 B2 US 10135418B2 US 201715439633 A US201715439633 A US 201715439633A US 10135418 B2 US10135418 B2 US 10135418B2
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coil
electrode layers
filter
coil electrode
common mode
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Expired - Fee Related
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US15/439,633
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US20170310294A1 (en
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Won Chul SIM
Young Ghyu Ahn
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/42—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns
    • H03H7/425—Balance-balance networks
    • H03H7/427—Common-mode filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F19/00—Fixed transformers or mutual inductances of the signal type
    • H01F19/04—Transformers or mutual inductances suitable for handling frequencies considerably beyond the audio range
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/24—Frequency- independent attenuators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/0026—Multilayer LC-filter
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F2017/0093—Common mode choke coil
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details
    • H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets

Definitions

  • the present disclosure relates to a common mode filter.
  • USB 2.0, USB 3.0, and high definition multimedia interfaces have come into widespread use as high-speed signal transmission interfaces, and such interfaces have been used in a range of digital devices, such as personal computers and digital high-definition television sets.
  • Such high-speed interfaces employ a differential signal system therein, transmitting differential signals, for example, differential mode signals, using a pair of signal lines, in a manner different from a single-end transmission system having been commonly used for a long period of time.
  • differential signals for example, differential mode signals
  • signal distortion due to high-frequency noise has often been caused.
  • CMF common mode filter
  • common mode filters In order to remove common mode noise affecting communications sensitivity in future mobile devices, common mode filters will be required to have ultra-wideband attenuation characteristics in a relatively wide communications frequency band as compared to a current communications frequency band.
  • a common mode filter having a shunt electrode structure has been used to secure such ultra-wideband attenuation characteristics, but increasing a frequency domain of an existing shunt structure has limitations.
  • An aspect of the present disclosure is to provide a common mode filter having ultra-wideband attenuation characteristics.
  • As aspect of the present disclosure is to provide a common mode filter having excellent attenuation characteristics in a lower frequency domain while having ultra-wideband attenuation characteristics.
  • a common mode filter includes a body portion including a plurality of external electrodes disposed externally on the body portion, a first filter portion disposed within the body portion and including a plurality of coil electrode layers, and a second filter portion disposed within the body portion and including a plurality of coil electrode layers. An area of the plurality of coil electrode layers of the first filter portion and an area of the plurality of coil electrode layers of the second filter portion are different from each other.
  • a common mode filter includes a body portion and first to fourth external electrodes disposed externally on the body portion.
  • the body portion includes a first filter portion including a first coil and a second coil, a second filter portion including a third coil and a fourth coil, a first conductive via connecting the first and fourth coils to each other, and a second conductive via connecting the second and third coils to each other, and a resonant frequency of the first filter portion and a resonant frequency of the second filter portion are different from each other.
  • FIG. 1 is a schematic transparent perspective view of a common mode filter according to a first exemplary embodiment in the present disclosure
  • FIG. 2 is a schematic cross-sectional view taken along line I-I′ of FIG. 1 ;
  • FIGS. 3A to 3D are a schematic plan view of coil electrode layers in the common mode filter according to the first exemplary embodiment in the present disclosure
  • FIG. 4 is a schematic equivalent circuit diagram of the common mode filter according to the first exemplary embodiment in the present disclosure
  • FIG. 5 is a schematic cross-sectional view of a common mode filter according to a second exemplary embodiment in the present disclosure
  • FIG. 6 is a schematic plan view of a shunt electrode layer in the common mode filter according to the second exemplary embodiment in the present disclosure
  • FIG. 7 is a schematic equivalent circuit diagram of the common mode filter according to the second exemplary embodiment in the present disclosure.
  • FIG. 8 is a graph illustrating transmission characteristics and attenuation characteristics of a common mode filter in a case in which a shunt electrode layer is not provided (represented by a broken line) and a case in which a shunt electrode layer is provided between sixth and seventh coil electrode layers of a second filter portion (represented by a solid line);
  • FIG. 9 is a schematic cross-sectional view of a common mode filter according to a third exemplary embodiment in the present disclosure.
  • FIG. 10 is a schematic plan view of a shunt electrode layer in the common mode filter according to the third exemplary embodiment in the present disclosure.
  • FIG. 11 is a schematic equivalent circuit diagram of the common mode filter according to the third exemplary embodiment in the present disclosure.
  • FIG. 12 is a schematic cross-sectional view of a common mode filter according to a fourth exemplary embodiment in the present disclosure.
  • FIG. 13 is a schematic plan view of a shunt electrode layer in the common mode filter according to the fourth exemplary embodiment in the present disclosure.
  • FIG. 14 is a schematic equivalent circuit diagram of the common mode filter according to the fourth exemplary embodiment in the present disclosure.
  • first, second, third, etc. may be used herein to describe various members, components, regions, layers and/or sections, these members, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section discussed below could be termed a second member, component, region, layer or section without departing from the teachings of the embodiments.
  • spatially relative terms such as “above,” “upper,” “below,” and “lower” and the like, may be used herein for ease of description to describe one element's relationship to another element(s) as shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “above,” or “upper” other elements would then be oriented “below,” or “lower” the other elements or features. Thus, the term “above” can encompass both the above and below orientations depending on a particular direction of the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may be interpreted accordingly.
  • embodiments of the present disclosure will be described with reference to schematic views illustrating embodiments of the present disclosure.
  • modifications of the shape shown may be estimated.
  • embodiments of the present disclosure should not be construed as being limited to the particular shapes of regions shown herein, for example, to include a change in shape results in manufacturing.
  • the following embodiments may also be constituted by one or a combination thereof.
  • FIG. 1 is a schematic transparent perspective view of a common mode filter according to a first exemplary embodiment
  • FIG. 2 is a schematic cross-sectional view taken along line I-I′ of FIG. 1 .
  • the common mode filter 100 may include a body portion 101 , first and second filter portions 140 and 150 disposed within the body portion 101 , and external electrodes 161 , 162 , 163 and 164 disposed on external surfaces of the body portion 101 .
  • the common mode filter 100 may include ground electrodes 165 disposed on external surfaces of the body portion 101 .
  • the external electrodes 161 , 162 , 163 and 164 may be disposed on side surfaces of the body portion 101 in a width direction, and the ground electrodes 165 may be disposed on end surfaces of the body portion 101 in a length direction.
  • the body portion 101 may include a substrate 110 , a filter layer 120 , and a cover layer 130 .
  • the substrate 110 , the filter layer 120 , and the cover layer 130 may be formed of a magnetic ceramic material.
  • the filter layer 120 may include the first filter portion 140 and the second filter portion 150 .
  • the filter layer 120 may serve to remove signal noise.
  • the filter portion 140 may include a plurality of coil electrode layers.
  • first filter portion 140 includes first to fourth coil electrode layers 141 , 142 , 143 and 144 will be described by way of example.
  • the second filter portion 150 may include a plurality of coil electrode layers.
  • the second filter portion 150 includes fifth to eighth coil electrode layers 151 , 152 , 153 and 154 will be described by way of example.
  • the first to eighth coil electrode layers 141 to 144 and 151 to 154 may be formed by winding a conductive wire formed of a conductive material around an insulating layer at least one or more times to thus have a helical form, or may be formed using a conductive paste, a photoresist method, and the like.
  • coils may be wound in a single direction, in such a manner that directions of magnetic flux generated in coils are opposite to each other, to decouple a magnetic flux of the first filter portion 140 from a magnetic flux of the second filter portion 150 .
  • An area of the plurality of coil electrode layers 141 to 144 disposed in the first filter portion 140 may be different from an area of the plurality of coil electrode layers 151 to 154 disposed in the second filter portion 150 .
  • the area of the coil electrode layers 141 to 144 of the first filter portion 140 may be greater than the area of the coil electrode layers 151 to 154 of the second filter portion 150 .
  • the area of the coil electrode layers may indicate an area inward of an outermost wire in the coil electrode layers.
  • levels of inductance and parasitic capacitance of respective coil electrode layers 141 to 144 of the first filter portion 140 may be different from levels of inductance and parasitic capacitance of respective coil electrode layers 151 to 154 of the second filter portion 150 , thereby allowing resonant frequencies of the first and second filter portions 140 and 150 to be different from each other.
  • the resonant frequencies are defined by the following equation.
  • a notch pole may be formed in a region of 1 GHz in the first filter portion 140 , and 0.7 GHz to 1.5 GHz of attenuation characteristics may be provided, on the basis of ⁇ 25 dB of attenuation.
  • a notch pole is formed in a region of 2 GHz, and 1.5 GHz to 2.5 GHz of attenuation characteristics may be provided, on the basis of ⁇ 25 dB of attenuation.
  • the first filter portion 140 may have an inductance greater than that of the second filter portion 150 , and thus, may have increased attenuation as compared to that of the second filter portion 150 .
  • FIGS. 3A to 3D are a schematic plan view of coil electrode layers in the common mode filter 100 according to the first exemplary embodiment. Referring to FIGS. 1 and 3 , a structure in which the first to eighth coil electrode layers 141 to 144 and 151 to 154 are connected to one another will be described below.
  • First connection electrodes 171 may be disposed in central portions of the coil electrode layers to connect upper and lower coil electrode layers to each other via conductive vias penetrating through a dielectric 102 , respectively.
  • Second connection electrodes 172 may connect upper and lower coil electrode layers among the coil electrode layers disposed in the first and second filter portions 140 and 150 , to each other, via conductive vias penetrating through the dielectric 102 .
  • first coil electrode layer 141 and the third coil electrode layer 143 may be connected to each other via the first connection electrode 171 to thus form a first coil
  • second coil electrode layer 142 and the fourth coil electrode layer 144 may be connected to each other via the first connection electrode 171 to thus form a second coil.
  • the fifth coil electrode layer 151 and the seventh coil electrode layer 153 may be connected to each other via the first connection electrode 171 to thus form a third coil
  • the sixth coil electrode layer 152 and the eighth coil electrode layer 154 may be connected to each other via the first connection electrode 171 to thus form a fourth coil.
  • a first external electrode 161 may be connected to the first coil electrode layer 141 , and the first coil electrode layer 141 may be connected to the third coil electrode layer 143 via the first connection electrode 171 .
  • the third coil electrode layer 143 disposed in the first filter portion 140 may be connected to the eighth coil electrode layer 154 disposed in the second filter portion 150 via the second connection electrode 172 , and the eighth coil electrode layer 154 may be connected to the sixth coil electrode layer 152 .
  • the sixth coil electrode layer 152 may be connected to a second external electrode 162 .
  • a third external electrode 163 may be connected to the second coil electrode layer 142 , and the second coil electrode layer 142 may be connected to the fourth coil electrode layer 144 via the first connection electrode 171 .
  • the fourth coil electrode layer 144 disposed in the first filter portion 140 may be connected to the seventh coil electrode layer 153 disposed in the second filter portion 150 via the second connection electrode 172 , and the seventh coil electrode layer 153 may be connected to the fifth coil electrode layer 151 .
  • the fifth coil electrode layer 151 may be connected to a fourth external electrode 164 .
  • the first coil and the fourth coil may be connected to each other via a conductive via, and the second coil and the third coil may be connected to each other via a conductive via.
  • the conductive via connecting the first coil and the fourth coil to each other may be defined as a first conductive via, and the conductive via connecting the second coil and the third coil to each other may be defined as a second conductive via.
  • the first filter portion 140 and the second filter portion 150 may be connected to each other in series.
  • the serial connection between the first filter portion 140 and the second filter portion 150 may indicate that the first, third, eighth, and sixth coil electrode layers 141 , 143 , 154 and 152 are sequentially connected to one another in series, and the second, fourth, seventh and fifth coil electrode layers 142 , 144 , 153 and 151 are sequentially connected to one another in series.
  • FIG. 5 is a schematic cross-sectional view of a common mode filter 200 according to a second exemplary embodiment
  • FIG. 6 is a schematic plan view of a shunt electrode layer 260 in the common mode filter 200 according to the second exemplary embodiment
  • FIG. 7 is a schematic equivalent circuit diagram of the common mode filter 200 according to the second exemplary embodiment.
  • a structure of the common mode filter 200 according to the second exemplary embodiment will be described with reference to FIGS. 4 and 6 .
  • a description of constituent elements identical to those of the common mode filter 100 of the first exemplary embodiment will be omitted.
  • a shunt electrode layer 260 may be disposed between at least portions of the plurality of coil electrode layers 251 , 252 , 253 and 254 .
  • the shunt electrode layer 260 may be located between sixth and seventh coil electrode layers 252 and 253 corresponding to a central portion of the plurality of coil electrode layers 251 , 252 , 253 and 254 .
  • the shunt electrode layer 260 may be disposed between the fifth and sixth coil electrode layers 251 and 252 or between the seventh and eighth coil electrode layers 253 and 254 .
  • the shunt electrode layer 260 may include a shunt portion 260 a and a lead-out portion 260 b .
  • the lead-out portion 260 b may be connected to a ground electrode 265 disposed on an external surface of a body portion 201 , to allow the shunt electrode layer 260 to be grounded.
  • the common mode filter 200 may include at least two shunt electrode layers 260 .
  • one shunt electrode layer 260 may be connected to one ground electrode 265 .
  • the ground electrode 265 may also be provided as the same number as the number of shunt electrode layers 260 .
  • a plurality of shunt electrode layers 260 may also be connected to one ground electrode 265 .
  • the shunt electrode layers 260 may be disposed between fifth and sixth coil electrode layers 251 and 252 and between seventh and eighth coil electrode layers 253 and 254 .
  • the shunt electrode layers 260 may be disposed between the fifth and sixth coil electrode layers 251 and 252 and between the sixth and seventh coil electrode layers 252 and 253 , or may be disposed between the sixth and seventh coil electrode layers 252 and 253 and between the seventh and eighth coil electrode layers 253 and 254 .
  • the shunt electrode layers 260 may be disposed in respective gaps between the fifth to eighth coil electrode layers 251 to 254 .
  • the shunt electrode layer 260 may have a flat plate shape corresponding to that of a coil adjacent thereto.
  • the common mode filter 200 according to the second exemplary embodiment includes the shunt electrode layer 260 disposed between at least portions of the plurality of coil electrode layers included in the second filter portion 250 , it can be seen that a capacitor C 5 is provided in the second filter portion 250 , as illustrated in FIG. 7 .
  • the capacitor C 5 may be referred to as a shunt capacitor.
  • the common mode filter 200 according to the second exemplary embodiment includes the shunt electrode layer 260 disposed between at least portions of the plurality of coil electrode layers included in the second filter portion 250 will be described below.
  • FIG. 8 is a graph illustrating transmission characteristics and attenuation characteristics of a common mode filter in a case in which a shunt electrode layer is not provided (represented by a broken line) and a case in which a shunt electrode layer is provided between sixth and seventh coil electrode layers of a second filter portion (represented by a solid line).
  • a notch pole may be formed in a region of 1 GHz in the first filter portion 140 , and 0.7 GHz to 1.5 GHz of attenuation characteristics may be provided, on the basis of ⁇ 25 dB of attenuation.
  • a notch pole is formed in a region of 2 GHz, and 1.5 GHz to 2.5 GHz of attenuation characteristics may be provided, on the basis of ⁇ 25 dB of attenuation.
  • the common mode filter 200 according to the second exemplary embodiment includes the shunt electrode layer 260 disposed between at least portions of the plurality of coil electrode layers included in the second filter portion 250 , it can be seen that when attenuation characteristics are measured, one pole is added in a measurement graph to thus represent a total of two poles, and thus, attenuation characteristics are improved in a relatively wide frequency domain.
  • a notch pole may be formed in a region of 1 GHz in the first filter portion 240 in the same manner as the common mode filter 100 of the first exemplary embodiment, and 0.7 GHz to 1.5 GHz of attenuation characteristics may be provided, on the basis of ⁇ 25 dB of attenuation.
  • another notch pole is formed in a region of 3.8 GHz, and 1.5 GHz to 7.0 GHz of attenuation characteristics may be obtained, on the basis of ⁇ 25 dB of attenuation.
  • the second common mode filter 200 may be appreciated that attenuation characteristics may be sufficiently satisfied in an ultra-wideband communications frequency band of 0.7 GHz to 7.0 GHz required in the future.
  • FIG. 9 is a schematic cross-sectional view of a common mode filter 300 according to a third exemplary embodiment
  • FIG. 10 is a schematic plan view of a shunt electrode layer 360 in the common mode filter 300 according to the third exemplary embodiment
  • FIG. 11 is a schematic equivalent circuit diagram of the common mode filter 300 according to the third exemplary embodiment.
  • a structure of the common mode filter 300 according to the third exemplary embodiment will be described with reference to FIGS. 8 and 10 .
  • a description of constituent elements identical to those of the common mode filters 100 and 200 of the first and second exemplary embodiments will be omitted.
  • the shunt electrode layer 360 may have a coil shape in a manner different from the case of the common mode filter 200 according to the second exemplary embodiment.
  • the shunt electrode layer 360 and coil electrode layers 352 and 353 adjacent thereto may have regions corresponding to each other in a vertical direction.
  • the shunt electrode layer 360 may also be disposed between the fifth and sixth coil electrode layers 351 and 352 or between the seventh and eighth coil electrode layers 353 and 354 .
  • the shunt electrode layer 360 and the coil electrode layers adjacent thereto may also have regions corresponding to each other in a vertical direction.
  • the shunt electrode layer 360 may include a shunt portion 360 a and a lead-out portion 360 b .
  • the lead-out portion 360 b may be connected to a ground electrode 365 disposed on an external surface of a body portion 301 , to allow the shunt electrode layer 360 to be grounded.
  • the shunt portion 360 a may have a coil shape.
  • a frequency band having attenuation characteristics may be controlled by adjusting a level of inductance of the second filter portion 350 .
  • FIG. 12 is a schematic cross-sectional view of a common mode filter 400 according to a fourth exemplary embodiment
  • FIG. 13 is a schematic plan view of shunt electrode layers 460 and 460 ′ in the common mode filter 400 according to the fourth exemplary embodiment
  • FIG. 14 is a schematic equivalent circuit diagram of the common mode filter 400 according to the fourth exemplary embodiment.
  • the shunt electrode layer 460 may be disposed between at least portions of a plurality of coil electrode layers 441 , 442 , 443 and 444 of the first filter portion 440 , and the shunt electrode layer 460 ′ may also be disposed between at least portions of a plurality of coil electrode layers 451 , 452 , 453 and 454 of the second filter portion 450 .
  • the shunt electrode layer 460 of the first filter portion 440 may be located between second and third coil electrode layers 442 and 443 corresponding to a central portion of the plurality of coil electrode layers 441 , 442 , 443 and 444 .
  • the shunt electrode layer 460 ′ of the first filter portion 440 may also be disposed between the first and second coil electrode layers 441 and 442 or between the third and fourth coil electrode layers 443 and 444 .
  • the shunt electrode layer 460 ′ of the second filter portion 450 may be located between sixth and seventh coil electrode layers 452 and 453 corresponding to a central portion of the plurality of coil electrode layers 451 , 452 , 453 and 454 .
  • the shunt electrode layer 460 ′ of the second filter portion 450 may be disposed between the fifth and sixth coil electrode layers 451 and 452 or between the seventh and eighth coil electrode layers 453 and 454 .
  • the shunt electrode layer 460 of the first filter portion 440 may include a shunt portion 460 a and a lead-out portion 460 b .
  • the lead-out portion 460 b may be connected to a ground electrode 465 disposed on an external surface of a body portion 401 , to allow the shunt electrode layer 460 to be grounded.
  • the shunt electrode layer 460 ′ of the second filter portion 450 may include a shunt portion 460 a ′ and a lead-out portion 460 b ′.
  • the lead-out portion 460 b ′ may be connected to a ground electrode 465 disposed on an external surface of the body portion 401 , to allow the shunt electrode layer 460 to be grounded.
  • capacitors C 5 and C 6 are provided in the first and second filter portions 440 and 450 , respectively, as illustrated in FIG. 14 .
  • the capacitors C 5 and C 6 may be referred to as shunt caps.
  • the shunt electrode layers 460 and 460 ′ of the first and second filter portions 440 and 450 may have a flat plate shape corresponding to those of coils adjacent thereto.
  • the shunt electrode layers 460 and 460 ′ of the first and second filter portions 440 and 450 may have a coil shape corresponding to those of coils adjacent thereto.
  • a common mode filter includes first and second filter portions of which areas of coil filter layers are different from each other, ultra-wideband attenuation characteristics may be obtained.
  • a common mode filter according to an exemplary embodiment may have ultra-wideband attenuation characteristics, simultaneously with having excellent attenuation characteristics in a low frequency domain.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Filters And Equalizers (AREA)
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